ams AS5601-ASOT 12-bit programmable contactless encoder Datasheet

AS5601
12-bit Programmable Contactless
Encoder
General Description
The AS5601 is an easy-to-program magnetic rotary position
sensor with incremental quadrature (A/B) and 12-bit digital
outputs. Additionally, the PUSH output indicates fast airgap
changes between the AS5601 and magnet which can be used
to implement a contactless pushbutton function in which the
knob can be pressed to move the magnet toward the AS5601.
This AS5601 is designed for contactless encoder applications,
and its robust design rejects the influence of any homogenous
external stray magnetic fields.
Based on planar Hall sensor technology, this device measures
the orthogonal component of the flux density (Bz) from an
external magnet.
The industry-standard I²C interface supports user
programming of non-volatile parameters in the AS5601 without
requiring a dedicated programmer.
The AS5601 also provides a smart low-power mode which
automatically reduces power consumption
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5601, 12-bit Programmable
Contactless Encoder are listed below:
Figure 1:
Added Value of using AS5601
Benefits
Features
Highest reliability and durability
Contactless angle measurement insensitive to dust and dirt
Simple programming
Simple user-programmable zero position and device
configuration
Flexible choice of the number of A/B pulses
per revolution
Quadrature output configurable from 8 up to 2048 positions
Contactless pushbutton functionality
Pushbutton output by detecting sudden airgap changes
Low power consumption
Automatic entry into low-power mode
Easy setup
Automatic magnet detection
Small form factor
SOIC-8 package
Robust environmental tolerance
Wide temperature range: -40°C to +125°C
ams Datasheet
[v1-02] 2014-Oct-29
Page 1
Document Feedback
A S 5 6 0 1 − General Description
Applications
The AS5601 is ideally suited for:
• Encoder replacement
• Contactless rotary knobs with push buttons
• Other angular position measurement solutions
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
AS5601 Block Diagram
VDD3V3
SDA
Register Setting
I²C
Low-Dropout
(LDO) Regulator
(internal load only)
VDD5V
Hall Sensors
One-Time
Programmable
(OTP) Memory
SCL
Analog
Front-End
AFE
12-bit A/D
ATAN
(CORDIC)
Automatic
Gain Control
(AGC)
A
B
A/B Quadrature
Output Encoder
Dynamic
Magnitude
Monitoring
Magnetic Core
PUSH
AS5601
GND
Page 2
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Pin Assignments
Pin Assignments
Figure 3:
SOIC-8 Pin-out
1
8
A
VDD3V3
2
7
SCL
PUSH
3
6
SDA
GND
4
5
B
AS5601
VDD5V
Pin Description
Figure 4:
Pin Description
Pin Number
Name
1
VDD5V
Supply
Positive voltage supply in 5V mode
2
VDD3V3
Supply
Positive voltage supply in 3.3V mode (requires
an external 1-μF decoupling capacitor in 5V
mode)
3
PUSH
Digital output
Contactless pushbutton function output
4
GND
Supply
Ground
5
B
Digital output
Quadrature incremental signal B
6
SDA
Digital input/output
I²C Data
7
SCL
Digital input
I²C Clock
8
A
Digital output
Quadrature incremental signal A
ams Datasheet
[v1-02] 2014-Oct-29
Type
Description
Page 3
Document Feedback
A S 5 6 0 1 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum
Ratings“ may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these
or any other conditions beyond those indicated under
“Operating Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD5V
DC supply voltage at
VDD5V pin
-0.3
6.1
V
5.0V operation mode
VDD3V3
DC supply voltage at
VDD3V3 pin
-0.3
4.0
V
3.3V operation mode
VAIO
Voltage at all digital or
analog pins
-0.3
VDD + 0.3
V
ISCR
Input current (latch-up
immunity)
-100
100
mA
Norm: JESD78
Continuous Power Dissipation (TA = +70°C)
PT
Continuous power
dissipation
50
mW
Electrostatic Discharge
ESDHBM
Electrostatic discharge
HBM (human body model)
±1
kV
Norm: MIL 883 E method 3015.7
Temperature Ranges and Storage Conditions
TSTRG
Storage temperature range
TBODY
Package body temperature
RHNC
Relative humidity
(non-condensing)
MSL
Moisture sensitive level
Page 4
Document Feedback
-55
+125
5
3
°C
+260
°C
85
%
Norm: ICP/JEDEC J-STD-020
The reflow peak soldering
temperature (body
temperature) is specified
according to IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices.” The
lead finish for Pb-free leaded
packages is “Matte Tin” (100%
Sn)
Norm: ICP/JEDEC J-STD-033
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Operating Conditions
Figure 6:
System Electrical Characteristics and Temperature Range
Symbol
Parameter
VDD5V
Positive supply voltage in
5.0V mode
VDD3V3
Positive supply voltage in
3.3V mode
Conditions
Min
Typ
Max
Units
4.5
5.0
5.5
V
3.3V operation mode
3.0
3.3
3.6
V
During OTP burn procedure(2)
3.3
3.4
3.5
V
5.0V operation mode
During OTP burn procedure(2)
IDD
Supply current in NOM (1)
PM = 00 Always on
6.5
mA
lDD_LPM1
Supply current in LPM1 (1)
PM = 01
Polling time = 5 ms
3.4
mA
lDD_ LPM2
Supply current in LPM2 (1)
PM = 10
Polling time = 20 ms
1.8
mA
lDD_ LPM3
Supply current in LPM3 (1)
PM = 11
Polling time = 100 ms
1.5
mA
Supply current per bit for
burn procedure
Initial peak, 1 μs
100
mA
IDD_BURN
Steady burning, <30 μs
40
mA
TA
Operating temperature
-40
+125
°C
TP
Programming
temperature
20
30
°C
Note(s) and/or Footnote(s):
1. For typical magnetic field (60 mT) excluding current delivered to the external load and tolerance on polling times.
2. For OTP burn procedure the supply line source resistance should not exceed 1Ohm.
ams Datasheet
[v1-02] 2014-Oct-29
Page 5
Document Feedback
A S 5 6 0 1 − Electrical Characteristics
Digital Inputs and Outputs
Figure 7:
Digital Inputs and Outputs
Symbol
Parameter
V_IH
High-level input
voltage
V_IL
Low-level input
voltage
V_OH
High-level output
voltage
V_OL
Low-level output
voltage
I_O
Output current
for A, B, and PUSH
C_L
I_LKG
Conditions
Min
Typ
Max
0.7 × VDD
Units
V
0.3 × VDD
VDD - 0.5
V
V
0.4
V
2
mA
Capacitive load
for A, B, and PUSH
50
pF
Leakage current
±1
μA
-2
Timing Characteristics
Figure 8:
Timing Conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Units
T_DETWD
Watchdog
detection time
WD = 1
57
60
63
seconds
T_PU
Power-up time
10
ms
F_S
Sampling rate
150
μs
T_SETTL1
Settling time
SF = 00
2.2
ms
T_SETTL2
Settling time
SF = 01
1.1
ms
T_SETTL3
Settling time
SF = 10
0.55
ms
T_SETTL4
Settling time
SF = 11
0.286
ms
Page 6
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Electrical Characteristics
Magnetic Characteristics
Figure 9:
Magnetic Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Bz
Orthogonal magnetic field
strength, regular output
noise ON_SLOW and
ON_FAST
Required orthogonal component
of the magnetic field strength
measured at the die's surface
along a circle of 1 mm
30
60
90
mT
Bz_ERROR
Minimum required
orthogonal magnetic field
strength, magnet
detection level
8
mT
System Characteristics
Figure 10:
System Characteristics
Symbol
RES
RES_AB
Parameter
Conditions
Min
Core Resolution
Typ
Max
12
A/B output resolution
8
Units
bit
2048
positions
Maximum rotation
speed for
incremental output
Continuous Rotation ≥ 360deg (1), (2)
456
rpm
System INL
Deviation from best line fit; 360°
maximum angle, no magnet
displacement, no
zero-programming performed
±1
degree
ON_SLOW
RMS output noise
(1 sigma)
Orthogonal component for the
magnetic field within the specified
range Bz, after 2.2 ms; SF = 00
0.015
degree
ON_FAST
RMS output noise
(1 sigma)
Orthogonal component for the
magnetic field within the specified
range Bz, after 286 μs; SF = 11
0.043
degree
VMAX_AB
INL_BL
Note(s) and/or Footnote(s):
1. An infinite fast change <180deg results in angle output with maximum configured update frequency.
2. An infinite fast change >= 180deg results in angle output to the shortest next absolute position with maximum configured update
frequency. e.g. A change from 0 to 270deg will be indicated as angle output from 0 to -90deg.
ams Datasheet
[v1-02] 2014-Oct-29
Page 7
Document Feedback
A S 5 6 0 1 − Detailed Description
Detailed Description
The AS5601 is a Hall-based rotary magnetic position encoder
that converts the magnetic field component perpendicular to
the surface of the chip into voltages which are used to produce
incremental A/B outputs and absolute position indication in
registers that can be read over an industry-standard I²C bus.
The analog signals from the Hall sensors are first amplified and
filtered before being converted by the analog-to-digital
converter (ADC) into binary data. The output of the ADC is
processed by the hardwired CORDIC block (Coordinate Rotation
Digital Computer) to compute the angle and magnitude of the
magnetic field vector. The intensity of the magnetic field is used
by the automatic gain control (AGC) to adjust the amplification
level to compensate for temperature and magnetic field
variations.
The angle value provided by the CORDIC algorithm is used by
the internal logic to generate the incremental quadrature
signals A and B. The magnitude and AGC value is dynamically
monitored and generates the PUSH output for fast changes of
the airgap between the magnet and the AS5601. Very slow
changes are suppressed to provide a robust and reliable
pushbutton output that tolerates temperature variation and
magnet degradation.
The AS5601 is programmed through an industry-standard I²C
interface to write an on-chip one-time programmable (OTP)
memory. This interface can be used to program a zero angle
and to configure the chip.
Power Management
The AS5601 is powered from a 5.0V supply using the on-chip
LDO regulator, or it can be powered directly from a 3.3V supply.
The internal LDO is not intended to power other external ICs
and needs a 1μF capacitor to ground, as shown in Figure 11.
In 3.3V operation, the VDD5V and VDD3V3 pins must be tied
together.
Page 8
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Detailed Description
Figure 11:
5.0V and 3.3V Power Supply Options
5.0V Operation
4.5 - 5.5V VDD5V
3.3V Operation
VDD3V3
LDO
1µF
100nF
GND
3.0 – 3.6V*
VDD5V
VDD3V3
LDO
10µF**
100nF
GND
AS5601
AS5601
* 3.3-3.5V for OTP programming
** Required for OTP programming only
ams Datasheet
[v1-02] 2014-Oct-29
Page 9
Document Feedback
A S 5 6 0 1 − Detailed Description
I²C Interface
The AS5601 supports the 2-wire Fast-mode Plus I²C-slave
protocol in device mode, in compliance with the NXP
Semiconductors (formerly Philips Semiconductors)
specification UM10204. A device that sends data onto the bus
is a transmitter and a device receiving data is a receiver. The
device that controls the message is called a master. The devices
that are controlled by the master are called slaves. A master
device generates the serial clock (SCL), controls the bus access,
and generates the START and STOP conditions that control the
bus. The AS5601 always operates as a slave on the I²C bus.
Connections to the bus are made through the open-drain I/O
lines SDA and the input SCL. Clock stretching is not included.
The host MCU (master) initiates data transfers. The 7-bit slave
address of the AS5601 is 0x36 (0110110 in binary).
• Supported Modes
• Random/Sequential read
• Byte/Page write
• Automatic increment (ANGLE register)
• Standard-mode
• Fast-mode
• Fast–mode Plus
The SDA signal is the bidirectional data line. The SCL signal is
the clock generated by the I²C bus master to synchronize
sampling data from SDA. The maximum SCL frequency is 1 MHz.
Data is sampled on the rising edge of SCL.
I²C Interface Operation
Figure 12:
I²C Electrical Specifications
SDA
tbuf
tLOW
tR
tHD.STA
tF
SCL
tSU.DAT
tHD.STA
Stop
Page 10
Document Feedback
Start
tHD.DAT
tSU.STA
tSU.STO
tHIGH
Repeated
Start
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Detailed Description
I²C Electrical Specification
Figure 13:
I²C Electrical Specifications
Symbol
Parameter
Conditions
Min
Max
Units
VIL
Logic low input voltage
-0.3
0.3 x VDD
V
VIH
Logic high input voltage
0.7 x VDD
VDD + 0.3
V
VHYS
Hysteresis of Schmitt
trigger inputs
VDD > 2.5V
VOL
Logic low output voltage
(open-drain or
open-collector) at 3 mA
sink current
VDD > 2.5V
IOL
Logic low output current
VOL = 0.4V
tOF
Output fall time from
VIHmax to VILmax
tSP
Pulse width of spikes that
must be suppressed by
the input filter
II
Input current at each I/O
Pin
CB
CI/O
0.05 x VDD
V
0.4
V
20
mA
120 (1)
ns
50 (2)
ns
+10 (3)
μA
Total capacitive load for
each bus line
550
pF
I/O capacitance (SDA,
SCL) (4)
10
pF
10
Input voltage
between 0.1 x VDD
and 0.9 x VDD
-10
Note(s) and/or Footnote(s):
1. In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used this has to be
considered for bus timing.
2. Input filters on the SDA and SCL inputs suppress noise spikes of less than 50 ns.
3. I/O pins of Fast-mode and Fast-mode Plus devices must not load or drive the SDA and SCL lines if VDD is switched OFF.
4. Special-purpose devices such as multiplexers and switches may exceed this capacitance because they connect multiple paths
together.
ams Datasheet
[v1-02] 2014-Oct-29
Page 11
Document Feedback
A S 5 6 0 1 − Detailed Description
I²C Timing
Figure 14:
I²C Timing
Symbol
Parameter
Conditions
Min
Max
Units
1.0
MHz
fSCLK
SCL clock frequency
tBUF
Bus free time (time
between the STOP and
START conditions)
0.5
μs
tHD;STA
Hold time; (Repeated)
START condition (1)
0.26
μs
tLOW
Low phase of SCL clock
0.5
μs
tHIGH
High phase of SCL clock
0.26
μs
tSU;STA
Setup time for a
Repeated START
condition
0.26
μs
tHD;DAT
Data hold time (2)
tSU;DAT
Data setup time (3)
tR
Rise time of SDA and SCL
signals
tF
Fall time of SDA and SCL
signals
tSU;STO
Setup time for STOP
condition
0.45
50
10
0.26
μs
ns
120
ns
120 (4)
ns
μs
Note(s) and/or Footnote(s):
1. After this time, the first clock is generated.
2. A device must internally provide a minimum hold time of 120 ns (Fast-mode Plus) for the SDA signal (referred to the VIH min of SCL)
to bridge the undefined region of the falling edge of SCL.
3. A Fast-mode device can be used in a standard-mode system, but the requirement t SU;DAT = 250 ns must be met. This is automatic if
the device does not stretch the low phase of SCL. If such a device does stretch the low phase of SCL, it must drive the next data bit
on SDA (t Rmax + tSU;DAT = 1000 + 250 = 1250 ns ) before SCL is released.
4. In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, this has to be
considered for bus timing.
Page 12
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Detailed Description
I²C Modes
Invalid Addresses
There are two addresses used to access an AS5601 register. The
first is the slave address used to select the AS5601. All I²C bus
transactions include a slave address. The slave address of the
AS5601 is 0x36 (0110110 in binary). The second address is a
word address sent in the first byte transferred in a write
transaction. The word address selects a register on the AS5601.
The word address is loaded into the address pointer on the
AS5601. During subsequent read transactions and subsequent
bytes in the write transaction, the address pointer provides the
address of the selected register. The address pointer is
incremented after each byte is transferred, except for certain
read transactions to special registers.
If the user sets the address pointer to an invalid word address,
the address byte is not acknowledged (the A bit is high).
Nevertheless, a read or write cycle is possible. The address
pointer is increased after each byte.
Reading
When reading from an invalid address, the AS5601 returns all
zeros in the data bytes. The address pointer is incremented after
each byte. Sequential reads over the whole address range are
possible including address overflow.
Automatic increment of the address pointer for ANGLE, RAW
ANGLE, and MAGNITUDE registers:
These are special registers which suppress the automatic
increment of the address pointer on reads, so a re-read of these
registers requires no I²C write command to reload the address
pointer. This special treatment of the pointer is effective only if
the address pointer is set to the higher byte of the register,
which holds the least significant bits.
Writing
A write to an invalid address is not acknowledged by the
AS5601, although the address pointer is incremented. When the
address pointer points to a valid address again, a successful
write accessed is acknowledged. Page write over the whole
address range is possible including address overflow.
Supported bus protocol
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever
SCL is high. Changes in the data line while SCL is high are
interpreted as START or STOP conditions.
ams Datasheet
[v1-02] 2014-Oct-29
Page 13
Document Feedback
A S 5 6 0 1 − Detailed Description
Accordingly, the following bus conditions have been defined:
Bus Not Busy
Both SDA and SCL remain high.
Start Data Transfer
A change in the state of SDA from high to low while SCL is high
defines the START condition.
Stop Data Transfer
A change in the state of SDA from low to high while SCL is high
defines the STOP condition.
Data Valid
The state of the data line represents valid data when, after a
START condition, SDA is stable for the duration of the high
phase of SCL. The data on SDA must only be changed during
the low phase of SCL. There is one clock period per bit of data.
Each I²C bus transaction is initiated with a START condition and
terminated with a STOP condition. The number of data bytes
transferred between START and STOP conditions is not limited,
and is determined by the I²C bus master. The information is
transferred byte-wise and each receiver acknowledges with a
ninth bit.
Acknowledge
Each I²C slave device, when addressed, is obliged to generate
an acknowledge after the reception of each byte. The I²C bus
master device must generate an extra clock period for this
acknowledge bit.
A slave that acknowledges must pull down SDA during the
acknowledge clock period in such a way that SDA is stable low
during the high phase of the acknowledge clock period. Of
course, setup and hold times must be taken into account. A
master must signal an end of a read transaction by not
generating an acknowledge bit on the last byte that has been
clocked out of the slave. In this case, the slave must leave SDA
high to enable the master to generate the STOP condition.
Page 14
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Detailed Description
Figure 15:
Data Read
Slave Address
Repeated if more Bytes are transferred
MSB
SDA
SCL
1
Start
Condition
LSB
2
...
6
7
R/W
8
ACK
9
ACK
1
...
7
8
9
Stop Condition or
Repeated Start Condition
Depending on the state of the R/W bit, two types of data transfer
are possible:
Data transfer from a master transmitter to a slave receiver
The first byte transmitted by the master is the slave address,
followed by R/W = 0. Next follows a number of data bytes. The
slave returns an acknowledge bit after each received byte. If the
slave does not understand the command or data it sends a not
acknowledge (NACK). Data is transferred with the most
significant bit (MSB) first.
Data transfer from a slave transmitter to a master receiver
The master transmits the first byte (the slave address). The slave
then returns an acknowledge bit, followed by the slave
transmitting a number of data bytes. The master returns an
acknowledge bit after all received bytes other than the last byte.
At the end of the last received byte, a NACK is returned. The
master generates all of the SCL clock periods and the START and
STOP conditions. A transfer is ended with a STOP condition or
with a repeated START condition. Because a repeated START
condition is also the beginning of the next serial transfer, the
bus is not released. Data is transferred with the most significant
bit (MSB) first.
ams Datasheet
[v1-02] 2014-Oct-29
Page 15
Document Feedback
A S 5 6 0 1 − Detailed Description
AS5601 Slave Modes
Slave Receiver Mode (Write Mode)
Serial data and clock are received through SDA and SCL. Each
byte is followed by an acknowledge bit or by a NACK depending
on whether the address pointer selects a valid address. START
and STOP conditions are recognized as the beginning and end
of a bus transaction. The slave address byte is in the first byte
received after the START condition. The 7-bit AS5601 address is
0x36 (0110110 in binary).
The 7-bit slave address is followed by the direction bit (R/W),
which, for a write, is 0 (low). After receiving and decoding the
slave address byte, the slave device drives an acknowledge on
SDA. After the AS5601 acknowledges the slave address and
write bit, the master transmits a register address (word address)
to the AS5601. This is loaded into the address pointer on the
AS5601. If the address is a valid readable address, the AS5601
answers by sending an acknowledge (A bit low). If the address
pointer selects an invalid address, a NACK is sent (A bit high).
The master may then transmit zero or more bytes of data. If the
address pointer selects an invalid address, the received data are
not stored. The address pointer will increment after each byte
transferred whether or not the address is valid. If the address
pointer reaches a valid position again, the AS5601 answers with
an acknowledge and stores the data. The master generates a
STOP condition to terminate the write transaction.
S
<Slave address>
<RW>
Figure 16:
Data Write (Slave Receiver Mode)
0110110
0
<Word address (n)>
A
S – Start
A – Acknowledge (ACK)
P – Stop
Page 16
Document Feedback
XXXXXXXX
<Data(n)>
A
<Data(n+1)>
XXXXXXXX
A
XXXXXXXX
<Data(n+X)>
A
XXXXXXXX
A
P
Data transferred: X+1 Bytes + Acknowledge
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Detailed Description
Slave Transmitter Mode (Read Mode)
The first byte is received and handled as in the slave receiver
mode. However, in this mode, the direction bit indicates that
the AS5601 will drive data on SDA. START and STOP conditions
are recognized as the beginning and end of a bus transaction.
The slave address byte is the first byte received after the master
generates a START condition. The slave address byte contains
the 7-bit AS5601 address. The 7-bit slave address is followed by
the direction bit (R/W), which, for a read, is 1 (high). After
receiving and decoding the slave address byte, the slave device
drives an acknowledge on the SDA line. The AS5601 then begins
to transmit data starting with the register address pointed to
by the address pointer. If the address pointer is not written
before the initiation of a read transaction, the first address that
is read is the last one stored in the address pointer. The AS5601
must receive a not acknowledge (NACK) to end a read
transaction.
S
<Slave address>
<RW>
Figure 17:
Data Read (Slave Transmitter Mode)
0110110
1
<Data(n)>
A
XXXXXXXX
S – Start
A – Acknowledge (ACK)
NA – Not Acknowledge (NACK)
P – Stop
ams Datasheet
[v1-02] 2014-Oct-29
<Data(n+1)>
A
<Data(n+2)>
XXXXXXXX
A
XXXXXXXX
<Data(n+X)>
A
XXXXXXXX NA P
Data transferred: X+1 Bytes + Acknowledge
Note: Last data byte is followed by NACK
Page 17
Document Feedback
A S 5 6 0 1 − Detailed Description
0110110
0
<Word Address (n)>
A
XXXXXXXX
S – Start
Sr – Repeated Start
A – Acknowledge (ACK)
NA – Not Acknowledge (NACK)
P – Stop
A Sr
<Slave Address>
<RW>
S
<Slave address>
<RW>
Figure 18:
Data Read with Address Pointer Reload (Slave Transmitter Mode)
0110110
1
<Data(n+1)>
<Data(n)>
A
XXXXXXXX
A
XXXXXXXX
<Data(n+X)>
A
XXXXXXXX NA P
Data transferred: X+1 Bytes + Acknowledge
Note: Last data byte is followed by NACK
SDA and SCL Input Filters
Input filters for SDA and SCL inputs are included to suppress
noise spikes of less than 50 ns.
Page 18
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Register Description
The following registers are accessible over the serial I²C
interface. The 7-bit device address of the AS5601 is 0x36
(0110110 in binary). To permanently program a configuration,
a non-volatile memory (OTP) is provided.
Figure 19:
Register Map
Address
Name
R/W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Configuration Registers (1), (2)
0x00
ZMCO
R
ZPOS
R/W/P
ZMCO(1:0)
0x01
ZPOS(11:8)
0x02
ZPOS(7:0)
0x07
WD
CONF
FTH(2:0)
SF(1:0)
R/W/P
0x08
HYST(1:0)
0x09
ABN
R/W/P
0x0A
PUSHTHR
R/W/P
PM(1:0)
ABN(3:0)
PUSHTHR(7:0)
Output Registers
0x0C
R
RAW ANGLE(11:8)
RAW ANGLE
0x0D
R
0x0E
RAW ANGLE(7:0)
R
ANGLE(11:8)
ANGLE
0x0F
R
ANGLE(7:0)
Status Registers
0x0B
STATUS
R
0x1A
AGC
R
0x1B
MD
ML
MH
AGC(7:0)
R
MAGNITUDE (11:8)
MAGNITUDE
0x1C
R
MAGNITUDE(7:0)
Burn Command
0xFF
BURN
W
Burn_Angle = 0x80; Burn_Setting = 0x40
Note(s) and/or Footnote(s):
1. To change a configuration, read out the register, modify only the desired bits and write the new configuration. Blank fields may
contain factory settings.
2. During power-up, configuration registers are reset to the permanently programmed value. Not programmed bits are zero.
ams Datasheet
[v1-02] 2014-Oct-29
Page 19
Document Feedback
A S 5 6 0 1 − Register Description
ZPOS Registers
These registers are used to configure the zero position (ZPOS).
This register is used to align the electric grid of the incremental
output with the mechanical grid of an encoder switch.
CONF Register
The CONF register supports customizing the AS5601. Figure 20
shows the mapping of the CONF register.
PUSHTHR Register
This register is used to set-up the contactless pushbutton
function. This register must be adjusted according to the airgap
and magnet configuration. The swing of the pushbutton
function can be found by subtracting the AGC value of the
pressed button from the AGC value of the released button. The
threshold value for the contactless pushbutton should be half
of the swing.
Figure 20:
CONF and ABN mapping
Name
Bit Position
Description
CONF Mapping
PM(1:0)
1:0
Power Mode
00 = NOM, 01 = LPM1, 10 = LPM2, 11 = LPM3
HYST(1:0)
3:2
Hysteresis
00 = OFF, 01 = 1 LSB, 10 = 2 LSBs, 11 = 3 LSBs
SF(1:0)
9:8
Slow Filter
00 = 16x (1); 01 = 8x; 10 = 4x; 11 = 2x
FTH(2:0)
12:10
Fast Filter Threshold
000 = slow filter only, 001 = 6 LSBs, 010 = 7 LSBs, 011 = 9 LSBs,100 = 18
LSBs, 101 = 21 LSBs, 110 = 24 LSBs, 111 = 10 LSBs
WD
13
Watchdog Timer
0 = OFF, 1 = ON (automatic entry into LPM3 low-power mode enabled)
ABN Mapping
ABN(3:0)
3:0
Output Positions and Update Rate
0000 : 8 (61 Hz)
0001 : 16 (122 Hz)
0010 : 32 (244 Hz)
0011 : 64 (488 Hz)
0100 : 128 (976 Hz)
0101 : 256 (1.9 kHz)
0110 : 512 (3.9 kHz)
0111 : 1024 (7.8 kHz)
others : 2048 (15.6 kHz))
Note(s) and/or Footnote(s):
1. Forced in Low Power Mode (LPM)
Page 20
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
ANGLE/RAW ANGLE Register
The RAW ANGLE register contains the unmodified angle. The
zero adjusted and filtered output value is available in the ANGLE
register.
STATUS Register
The STATUS register provides bits that indicate the current state
of the AS5601.
Figure 21:
STATUS Register
Name
State When Bit is High
MH
AGC minimum gain overflow, magnet too strong
ML
AGC maximum gain overflow, magnet too weak
MD
Magnet was detected
AGC Register
The AS5601 uses automatic gain control (AGC) in a closed loop
to compensate for variations of the magnetic field strength due
to changes of temperature, airgap between IC and magnet, and
magnet degradation. The AGC register indicates the gain. For
the most robust performance, the gain value should be in the
center of its range. The airgap of the physical system can be
adjusted to achieve this value.
MAGNITUDE Register
The MAGNITUDE register indicates the magnitude value of the
internal CORDIC output.
Non-Volatile Memory (OTP)
The non-volatile memory is used to permanently program the
configuration. To program the non-volatile memory, the I²C
interface is used. The programming can be either performed in
the 5V supply mode or in the 3.3V operation mode but using a
minimum supply voltage of 3.3V and a 10 μF capacitor at the
VDD3V3 pin to ground. This 10 μF capacitor is needed only
during the programming of the device. Two different
commands are used to permanently program the device:
ams Datasheet
[v1-02] 2014-Oct-29
Page 21
Document Feedback
A S 5 6 0 1 − Register Description
Burn_Angle Command (ZPOS)
The host microcontroller can perform a permanent
programming of ZPOS with a BURN_ANGLE command. To
perform a BURN_ANGLE command, write the value 0x80 into
register 0xFF. The BURN_ANGLE command can be executed up
to 3 times. ZMCO shows how many times ZPOS have been
permanently written.
This command may only be executed if the presence of the
magnet is detected (MD = 1).
Burn_Setting Command (CONF)
The host microcontroller can perform a permanent writing of
CONFIG with a BURN_SETTING command. To perform a
BURN_SETTING command, write the value 0x40 into register
0xFF.
The BURN_ SETTING command can be performed only one time.
Zero Position and Resolution Programming
A fundamental feature is to program the zero position (ZPOS)
of the magnetic position encoder. This is required to adjust the
A/B outputs to the mechanical pattern (grid) of a contactless
encoder by setting the count transitions (transition of A and or
B) between two adjacent mechanical positions. An example of
a 3-bit contactless encoder is shown in Figure 22.
The electrical positions represent the positions where an A or
B transition occurs. The zero position can be placed in
correspondence of one of the electrical positions (yellow).
A BURN_ANGLE command can be executed up to 3 times to
permanently program the zero position. It can only be executed
if the presence of the magnet is detected (MD = 1).
Page 22
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Figure 22:
Zero Position Setting of 3-bit Encoder
Mechanical
position 1
Mechanical
position 8
Electrical
position 1
Electrical
position 2
Electrical
position 8
Mechanical
position 2
Electrical
position 3
Mechanical
position 7
Mechanical
position 3
Electrical
position 7
Electrical
position 4
Electrical
position 6
Mechanical
position 6
Electrical
position 5
Mechanical
position 4
Mechanical
position 5
ams Datasheet
[v1-02] 2014-Oct-29
Page 23
Document Feedback
A S 5 6 0 1 − Register Description
The configuration procedure for a rotary encoder is shown
below in Figure 23.
Figure 23:
Zero Position and Resolution Programming Procedure
Use the correct hardware configuration as shown in Figure 33
Step 1
Power up the AS5601.
Step 2
Configure the desired number of positions using ABN(3:0).
Step 3
The mechanical configuration snapped into the grid.
Read out the actual RAW ANGLE.
Calculate the compensation value to adjust the mechanical grid and the encoder angle.
Refer to Figure 22 and Figure 24. Write the compensation value into ZPOS.
Wait at least 1ms.
Step 4
Write the required setting into the configuration register CONF and PUSHTHR.
Wait at least 1 ms.
Proceed with Step 5 to permanently program the configuration.
Step 5
Perform a BURN_ANGLE command to permanently program the zero position.
Wait at least 1 ms.
Step 6
Perform a Burn_Setting command to permanently program the configuration.
Wait at least 1 ms.
Step 7
Verify the BURN commands:
Write the commands 0x01, 0x11 and 0x10 sequentially into the register 0xFF to load the
actual OTP content.
Read and verify the permanently programmed registers to verify that the
BURN_SETTINGS and BURN_ANGLE command was successful.
Step 8
Read and verify the permanently programmed registers again after a new power-up cycle.
Note(s) and/or Footnote(s):
1. After each register command, the new setting is effective at the output at least 1 ms later.
2. It is highly recommended to perform a functional test after this procedure.
3. At least 1 ms after each register command the new setting is effective at the output.
4. The BURN_ANGLE command can be executed up to 3 times and only if the presence of the magnet is detected (MD = 1).
Page 24
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Quadrature Encoder Output
With the setting ABN(3:0) it is possible to configure the number
of positions of the quadrature output. An example for a
configuration with 8 positions is shown below.
Figure 24:
Example Quadrature Output for 8 Positions
N/4-1
N/4
1
2
Period
A
B
Position
ams Datasheet
[v1-02] 2014-Oct-29
N-3 N-2 N-1 N
0
1
2
3
4
5
6
7
8
Page 25
Document Feedback
A S 5 6 0 1 − Register Description
Pushbutton Detection
The AS5601 implements a pushbutton detection function
through a dynamic and relative measurement of the orthogonal
magnetic field strength. This pushbutton detection function
drives the PUSH output pin high when the AS5601 detects a
fast increase of the magnetic field (decrease of the airgap
between the magnet and the AS5601). After a fast decrease of
the magnetic field, the PUSH output is driven low.
Figure 25:
Pushbutton Detection Function Specifications
Symbol
Parameter
PUSHTHR
Magnetic field threshold
tpu_slope
Push slope time
tpu_dur
tpu_relax
Min
Max
Unit
0
255
LSB
500
ms
Push duration time NOM,
LPM1
PM = 0X
10
10000
ms
Push duration time LPM2
PM = 10
40
10000
ms
Push duration time LPM3
PM = 11
150
10000
ms
Time gap between two
consecutive pushes in
NOM, LPM1
PM = 0X
40
ms
Time gap between two
consecutive pushes in
LPM2
PM = 10
40
ms
Time gap between two
consecutive pushes in
LPM3
PM = 11
150
ms
tpu_min_pulse
Minimum duration of the
PUSH pulse
tpu_recovery
Recovery time after a very
long pushbutton event
BTH_VAR
Push amplitude variation
Page 26
Document Feedback
Conditions
40
-20
50
ms
5000
ms
+20
%
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Figure 26:
Pushbutton Detection Function
Measured magnetic
field
Present measured
magnetic field
(button pressed)
Push detection treshold
(long time averaged)
PUSHTHR
Present measured
magnetic field
(button released)
tpu_slope
tpu_dur
tpu_slope
tpu_relax
time
PUSH
time
The AS5601 continuously measures the magnetic field
intensity. The programmable threshold (PUSHTHR) is applied to
a long time average of the magnetic field. A crossing of the
current magnetic field and the threshold within a specified time
(tpu_slope) drives the PUSH output high.
Slow changes of the magnetic field, due for example to
temperature variations, magnet drift mechanical tolerances,
etc. do not generate any pushbutton detection events. The
push detection threshold follows the drifts over the time as
shown in Figure 27.
ams Datasheet
[v1-02] 2014-Oct-29
Page 27
Document Feedback
A S 5 6 0 1 − Register Description
Figure 27:
Magnetic Field Threshold Over Time
Long time averaged
magnetic field
Push detection
treshold
PUSHTHR
Long time averaged
magnetic field
time
Step Response and Filter Settings
The AS5601 has a digital post-processing programmable filter
which can be set in fast or slow modes. The fast filter mode can
be enabled by setting a fast filter threshold in the FTH bits of
the CONF register.
If the fast filter is OFF, the step output response is controlled by
the slow linear filter as shown in Figure 29. The step response
of the slow filter is programmable with the SF bits in the CONF
register. Figure 28 shows the tradeoff between delay and noise
for the different SF bit settings.
Figure 28:
Step Response Delay vs. Noise Band
Page 28
Document Feedback
SF
Step response
delay (ms)
Max. RMS output noise
(1 sigma) (degree)
00
2.2
0.015
01
1.1
0.021
10
0.55
0.030
11
0.286
0.043
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Figure 29:
Step Response (fast filter OFF)
Noise
Input
Output
response
Sampling
Frequency
Settling Time
according slow filter setting
For a fast step response and low noise after settling, the fast
filter can be enabled. The fast filter works only if the input
variation is greater than the fast filter threshold, otherwise the
output response is determined only by the slow filter. The fast
filter threshold is programmed with the FTH bits in the CONF
register. As shown in Figure 31, the fast filter (corresponds with
SF=11) kicks in and takes care of a fast settling. The larger noise
band of the fast filter is reduced again after the slow filter
(depicted is setting SF=00) has taken over. The different noise
bands are shown in Figure 28.
Figure 30:
Fast Filter Threshold
Fast Filter Threshold (LSB)
FTH
Slow-to-fast filter
000
ams Datasheet
[v1-02] 2014-Oct-29
Fast-to-slow filter
Slow filter only
001
6
1
010
7
1
011
9
1
100
18
2
101
21
2
110
24
2
111
10
4
Page 29
Document Feedback
A S 5 6 0 1 − Register Description
Figure 31:
Step Response (fast filter on)
Noise
Fast Filter
Noise
slow filter
Input
Output
response
Threshold
Sampling
Frequency
Fast filter step response
Settling Time
according slow filter setting
Hysteresis
To suppress spurious toggling of the output when the magnet
is not moving, a 1 to 3 LSB hysteresis of the 12-bit resolution
can be enabled with the HYST bits in the CONF register.
Magnet Detection
As a safety and diagnostic feature, the AS5601 indicates the
absence of the magnet. If the measured magnet field strength
goes below the minimum specified level (Bz_ERROR),
quadrature output is not updated and the MD bit in the STATUS
register is 0.
Page 30
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Register Description
Low Power Modes
A digital state machine automatically manages the low power
modes to reduce the average current consumption. Three
low-power modes are available and can be enabled with the
PM bits in the CONF register.
In a low-power mode, the fast filter is automatically disabled,
because there is no need for a fast settling time if the output
refresh is as fast as the polling cycles.
Watchdog Timer
The watchdog timer allows saving power by switching into
LMP3 if the angle stays within the watchdog threshold of 4 LSB
for at least one minute, as shown in Figure 32. The watchdog
function can be enabled by setting the WD bit in the CONF
register.
Figure 32:
Watchdog Timer Function
Output Value
1 minute
Watchdog
threshold
4 LSB
NOM,LPM1,
LPM2
ams Datasheet
[v1-02] 2014-Oct-29
LPM3
NOM,LPM1,
LPM2
Page 31
Document Feedback
A S 5 6 0 1 − Application Information
Application Information
Schematic
All required external components are shown below for the
reference application diagram. To improve EMC and for remote
applications, consider additional protection circuitry.
Figure 33:
Application Diagram for Angle Readout and Programming
5V Operation
3.3V Operation
4.5-5.5V
3-3.6V*
RPU
2 VDD3V3
C1
2 VDD3V3
PUSH
SDA 6
3 PUSH
C1
4 GND
4 GND
GND
SCL 7
To MCU
SDA 6
C**
B
B5
A
AS5601
To MCU
C2
RPU
A8
1 VDD5V
SCL 7
AS5601
3 PUSH
RPU
A
A8
1 VDD5V
PUSH
RPU
B
B5
GND
* Supply voltage for permanent programming is 3.3–3.5V
** 10µF Capacitor required during permanent programming
Figure 34:
Recommended External Components
Component
Symbol
Value
Units
VDD5V buffer capacitor
C1
100
nF
20%
LDO regulator capacitor
C2
1
μF
20%; < 100 mΩ; Low
ESR ceramic capacitor
RPU
4.7
kΩ
refer to UM10204 for
pull-up sizing
Optional pull-up for I²C bus
Notes
To be fulfilled over temperature and lifetime
Page 32
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Application Information
Magnet Requirements
The AS5601 requires a minimum magnetic field component Bz
perpendicular to the sensitive area on the chip. The center of
the sensitive area is in the center of the package.
Along the circumference of the Hall element circle the magnetic
field Bz should be sine-shaped. The magnetic field gradient of
Bz along the radius of the circle should be in the linear range
of the magnet to eliminate displacement error by the
differential measurement principle.
0.5mm - 3mm typ.
Figure 35:
Magnetic Field Bz and Typical Airgap
The typical airgap is between 0.5 mm and 3 mm, and it depends
on the selected magnet. A larger and stronger magnet allows a
larger airgap. Using the AGC value as a guide, the optimal airgap
can be found by adjusting the distance between the magnet
and the AS5601 so that the AGC value is in the center of its
range. The maximum allowed displacement of the rotational
axis of the reference magnet from the center of the package is
0.25 mm when using a magnet with a diameter of 6mm.
ams Datasheet
[v1-02] 2014-Oct-29
Page 33
Document Feedback
A S 5 6 0 1 − Application Information
Mechanical Data
The internal Hall elements are located in the center of the
package on a circle with a radius of 1 mm.
Figure 36:
Hall Element Positions
Note(s) and/or Footnote(s):
1. All dimensions in mm.
2. Die thickness 356μm nom.
Page 34
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Package Drawings & Markings
Package Drawings & Markings
Figure 37:
SOIC8 Package Outline Drawing
RoHS
Symbol
Min
Nom
Max
A
-
-
1.75
A1
0.10
-
0.25
A2
1.25
-
-
b
0.31
-
0.51
c
0.17
-
0.25
D
-
4.90 BSC
-
E
-
6.00 BSC
-
E1
-
3.90 BSC
-
e
-
1.27 BSC
-
L
0.40
-
1.27
L1
-
1.04 REF
-
L2
-
0.25 BSC
-
R
0.07
-
-
R1
0.07
-
-
h
0.25
-
0.50
Q
0º
-
8º
Q1
5º
-
15º
Q2
0º
-
-
aaa
-
0.10
-
bbb
-
0.20
-
ccc
-
0.10
-
ddd
-
0.25
-
eee
-
0.10
-
fff
-
0.15
-
ggg
-
0.15
-
Green
Note(s) and/or Footnote(s):
1. Dimensions & tolerancing confirm to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
ams Datasheet
[v1-02] 2014-Oct-29
Page 35
Document Feedback
A S 5 6 0 1 − Package Drawings & Mark ings
Figure 38:
Package Marking
AS5601
YYWWRZZ
@
Figure 39:
Packaging Code
YY
WW
R
ZZ
@
Last two digits of
the current year
Manufacturing week
Plant identifier
Free choice/traceability code
Sublot identifier
Page 36
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Ordering & Contact Information
Ordering & Contact Information
Figure 40:
Ordering Information
Ordering Code
Package
Marking
Delivery Form
Delivery Quantity
AS5601-ASOT
SOIC-8
AS5601
13” Tape & Reel in dry pack
2500 pcs
AS5601-ASOM
SOIC-8
AS5601
7” Tape & Reel in dry pack
500 pcs
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-02] 2014-Oct-29
Page 37
Document Feedback
A S 5 6 0 1 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
Page 38
Document Feedback
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-02] 2014-Oct-29
Page 39
Document Feedback
A S 5 6 0 1 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 40
Document Feedback
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Revision Information
Revision Information
Changes from 1-01 (2014-Oct-13) to current revision 1-02 (2014-Oct-29)
Page
Updated Figure 5
4
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-02] 2014-Oct-29
Page 41
Document Feedback
A S 5 6 0 1 − Content Guide
Content Guide
Page 42
Document Feedback
1
1
2
2
General Description
Key Benefits & Features
Applications
Block Diagram
3
3
Pin Assignments
Pin Description
4
Absolute Maximum Ratings
5
5
6
6
7
7
Electrical Characteristics
Operating Conditions
Digital Inputs and Outputs
Timing Characteristics
Magnetic Characteristics
System Characteristics
8
8
10
10
11
12
13
13
13
13
13
14
14
14
14
14
16
16
17
18
Detailed Description
Power Management
I²C Interface
I²C Interface Operation
I²C Electrical Specification
I²C Timing
I²C Modes
Invalid Addresses
Reading
Writing
Supported bus protocol
Bus Not Busy
Start Data Transfer
Stop Data Transfer
Data Valid
Acknowledge
AS5601 Slave Modes
Slave Receiver Mode (Write Mode)
Slave Transmitter Mode (Read Mode)
SDA and SCL Input Filters
19
20
20
20
21
21
21
21
21
22
22
22
25
26
28
30
30
Register Description
ZPOS Registers
CONF Register
PUSHTHR Register
ANGLE/RAW ANGLE Register
STATUS Register
AGC Register
MAGNITUDE Register
Non-Volatile Memory (OTP)
Burn_Angle Command (ZPOS)
Burn_Setting Command (CONF)
Zero Position and Resolution Programming
Quadrature Encoder Output
Pushbutton Detection
Step Response and Filter Settings
Hysteresis
Magnet Detection
ams Datasheet
[v1-02] 2014-Oct-29
A S 5 6 0 1 − Content Guide
ams Datasheet
[v1-02] 2014-Oct-29
31
31
Low Power Modes
Watchdog Timer
32
32
33
34
Application Information
Schematic
Magnet Requirements
Mechanical Data
35
37
38
39
40
41
Package Drawings & Markings
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 43
Document Feedback