LCD and Camera EMI Filter Array with ESD Protection CM1426 Features Product Description • The CM1426 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in a Chip Scale Package with 0.50mm pad pitch. The CM1426 has component values of 8.5pF-100Ω-8.5pF per channel. The CM1426 has a cut-off frequency of 230MHz and can be used in applications where the data rates are as high as 92Mbps. The parts include avalanche-type ESD diodes on every pin that provide a very high level of protection for sensitive electronic components against possible ESD strikes. The ESD protection diodes safely dissipate ESD strikes of ±8kV, well beyond the maximum requirement of the IEC610004-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. • • • • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection 0.5mm pitch, 10-bump, 1.96mm x 1.33mm footprint Chip Scale Package (CM1426-04) 0.5mm pitch, 15-bump, 2.96mm x 1.33mm footprint Chip Scale Package (CM1426-06) 0.5mm pitch, 20-bump, 3.96mm x 1.33mm footprint Chip Scale Package (CM1426-08) Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±15kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz OptiGuard coated for improved reliability at assembly RoHS-compliant, lead-free packaging Applications • • • • • • LCD and camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1426 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1426 incorporates Optiguard which results in improved reliability at assembly. The CM1426 is available in a space-saving, low-profile Chip Scale Package. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1426/D CM1426 Block Diagram Electrical Schematic 1 of 4, 6 or 8 EMI/RFI + ESD Channels Rev. 2 | Page 2 of 17 | www.onsemi.com CM1426 PIN DESCRIPTIONS PIN(s) NAME A1 FILTER1 A2 DESCRIPTION PIN(s) NAME DESCRIPTION Filter + ESD Channel 1 C1 FILTER1 Filter + ESD Channel 1 FILTER2 Filter + ESD Channel 2 C2 FILTER2 Filter + ESD Channel 2 A3 FILTER3 Filter + ESD Channel 3 C3 FILTER3 Filter + ESD Channel 3 A4 FILTER4 Filter + ESD Channel 4 C4 FILTER4 Filter + ESD Channel 4 A5 FILTER5 Filter + ESD Channel 5 C5 FILTER5 Filter + ESD Channel 5 A6 FILTER6 Filter + ESD Channel 6 C6 FILTER6 Filter + ESD Channel 6 A7 FILTER7 Filter + ESD Channel 7 C7 FILTER7 Filter + ESD Channel 7 A8 FILTER8 Filter + ESD Channel 8 C8 FILTER8 Filter + ESD Channel 8 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION 1 Bumps Package Ordering Part Number Part Marking 10 CSP CM1426-04CP N264 15 CSP CM1426-06CP N266 20 CSP CM1426-08CP N268 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Rev. 2 | Page 3 of 17 | www.onsemi.com CM1426 STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL PARAMETER CONDITIONS Resistance MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 13.6 17 20.4 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 6.8 8.5 10.2 pF VDIODE Standoff Voltage IDIODE=10µA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 0.1 1 µA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD RDYN fC In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 15 8 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V kV kV 2.3 0.9 Ω Ω 230 MHz R=100Ω, C=17pF Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 4 of 17 | www.onsemi.com CM1426 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 2 | Page 5 of 17 | www.onsemi.com CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 2 | Page 6 of 17 | www.onsemi.com CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) Rev. 2 | Page 7 of 17 | www.onsemi.com CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4) Rev. 2 | Page 8 of 17 | www.onsemi.com CM1426 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Rev. 2 | Page 9 of 17 | www.onsemi.com CM1426 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 10 of 17 | www.onsemi.com 260°C CM1426 Mechanical Details CSP Mechanical Specifications CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1426-04 Mechanical Specifications Package dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Dim Inches Min Nom Max A1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Min Nom Max Package Dimensions for CM1426-04 Chip Scale Package 0.0110 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 17 | www.onsemi.com CM1426 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1426-04 1.96 x 1.33 x 0.644 2.08 x 1.45 x 0.71 8mm 178mm (7") 3500 4mm 4mm Figure 12. Tape and Reel Mechanical Data Rev. 2 | Page 12 of 17 | www.onsemi.com CM1426 Mechanical Details (cont’d) CM1426-06 Mechanical Specifications The package dimensions for the CM1426-06 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Dim Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Min Nom Max Package Dimensions for CM1426-06 Chip Scale Package 0.0110 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 13 of 17 | www.onsemi.com CM1426 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1426-06 2.96 x 1.33 x 0.644 3.10 x 1.45 x 0.74 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Figure 13. Tape and Reel Mechanical Data Rev. 2 | Page 14 of 17 | www.onsemi.com CM1426 Mechanical Details (cont’d) CM1426-08 Mechanical Specifications The package dimensions for the CM1426-08 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Dim Inches Min Nom Max A1 3.915 3.960 4.005 0.1541 0.1559 0.1577 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Min Nom Max Package Dimensions for CM1426-08 Chip Scale Package 0.0110 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 15 of 17 | www.onsemi.com CM1426 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1426-08 3.96 x 1.33 x 0.644 4.11 x 1.57 x 0.76 8mm 178mm (7") 3500 4mm 4mm Figure 14. Tape and Reel Mechanical Data Rev. 2 | Page 16 of 17 | www.onsemi.com CM1426 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email [email protected] N. American Technical Support: Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 2 | Page 17 of 17 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative