NJSEMI BUK553-60B Powermos transistor logic level fet Datasheet

^Emi-L-onaucioi U-^
, One.
TELEPHONE: (973) 376-2922
(212)227-6005
FAX: (973) 376-8960
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
BUK553-60A/B
PowerMOS transistor
Logic level FET
GENERAL DESCRIPTION
N-channel enhancement mode
logic level field-effect power
transistor in a plastic envelope.
The device is intended for use in
Switched Mode Power Supplies
(SMPS), motor control, welding,
DC/DC and AC/DC converters, and
in automotive and general purpose
switching applications.
PINNING - T0220AB
PIN
SYMBOL
VDS
ID
™DS(ON)
PARAMETER
MAX.
MAX.
UNIT
BUK553
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance;
Ves = 5 V
-60A
60
21
75
175
0.085
-60B
60
20
75
175
0.10
V
A
W
'C
Q
PIN CONFIGURATION
SYMBOL
DESCRIPTION
1
gate
2
drain
3
source
tab
QUICK REFERENCE DATA
drain
1 23
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
CONDITIONS
SYMBOL
PARAMETER
VDS
VDGR
±VGs
+VQSM
Drain-source voltage
RGS = 20 kQ
Drain-gate voltage
Gate-source voltage
Non-repetitive gate-source voltage tp<50ns
ID
ID
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Tmb = 25 'C
Tmb = 100-C
T mb = 25 'C
Total power dissipation
Storage temperature
Junction Temperature
Tmb = 25 'C
I DM
"tot
MIN.
MAX.
UNIT
60
60
15
20
V
V
V
V
-60A
21
15
84
-60B
20
14
80
A
A
A
75
175
175
-55
W
*C
•c
*•
THERMAL RESISTANCES
SYMBOL
"th j-mb
R|hj-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
MIN.
-
TYP.
60
MAX.
UNIT
2.0
K/W
K/W
«/
TELEPHONE: (973) 376-2922
(212) 227-6005
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
FAX:
973/467-8519
BUK553-60A/B
PowerMOS transistor
Logic level FET
STATIC CHARACTERISTICS
Tmb = 25 °C unless otherwise specified
SYMBOL
V(BR)DSS
VGS(TO)
I
IDSS
1
IDSS
IGSS
F>DS(ON)
PARAMETER
CONDITIONS
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance
VGS = 0 V; ID = 0.25 mA
VDS = VGS; ID = 1 mA
VDS = 60 V; VGS = 0 V; Jj = 25 °C
VDS = 60V;V G S = O V ; T ^ = 1 2 5 ° C
VGS = ±15V;V D S = OV
VGS = 5 V;
BUK553-60A
ID = 10 A
BUK553-60B
MIN.
MAX.
-
UNIT
60
TYP.
.
1.0
-
1.5
1
0.1
10
0.075
0.08
2.0
10
1.0
100
0.085
0.10
V
HA
mA
nA
£1
ft
MIN.
TYP.
MAX.
UNIT
7
10
-
S
825
350
160
PF
-
700
240
130
PE
PF
20
95
80
65
30
120
110
85
ns
ns
ns
ns
V
DYNAMIC CHARACTERISTICS
Tmb = 25 °C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
9.S
Forward transcend uctance
VDS = 25V;I D = 1QA
VGS = 0 V; VDS = 25 V; f = 1 MHz
crss
Input capacitance
Output capacitance
Feedback capacitance
^d on
tr
tdoff
t,
Turn-on
Turn-on
Turn-off
Turn-off
VDD = 30 V; ID = 3 A;
Ves = 5 V; RGS = 50 Q;
Rgen = 50 ft
Ld
Internal drain inductance
Ld
Internal drain inductance
Ls
Internal source inductance
Cjss
C0SS
delay time
rise time
delay time
fall time
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
Quality Semi-Conductors
-
nH
3.5
4.5
-
7.5
-
nH
nH
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