BD90571EFJ-C Datasheet Secondary power supply series for automotive 2.69 to 5.5V, 1.2V Output, 2.25MHz Synchronous Step-Down Converter BD90571EFJ-C ●General Description The BD90571EFJ-C is a synchronous rectification type step-down DC/DC converter with a 2.25MHz fixed frequency that operates in with an input voltage range of 2.69V-5.5V. It has an integrated feedback resistor that supplies a fixed output voltage of 1.2V and a phase compensation constant. Applications can be created with a minimum of three external components. Moreover, the integrated Pch and Nch output MOSFET can supply a maximum output current of 1A. ●Key Specifications ■ Input voltage range ■ Output voltage ■ Output voltage accuracy ■ Operating frequency ■ Maximum output current ■ Circuit current at standby ■ Operational temperature range ●Features ■ Thanks to the integrated output feedback resistor and phase compensation, applications can be created with a minimum of external components ■ Excellent load response through current mode control ■ Integrated Pch and Nch output MOSFET ■ Integrated overcurrent protection with auto-reset ■ Integrated output overvoltage detection/ short-circuit detection ■ Integrated TSD and UVLO ■ Light load mode/PWM fixation operation selection terminal ●Package HTSOP-J8 2.69V～5.5[V] 1.2 [V] (Typ.) ±2.0[%](-40～+125°C) 2.25 [MHz] (Typ.) 1.0 [A] (Max.) 0[μA](Typ., 25°C) -40～+125[°C] 4.90 ㎜×6.00 ㎜×1.00 ㎜ ●Applications ■ Automotive equipment ■ Car audio and navigation ■ TV ■ Other electronic equipment 100 ●Typical application circuit 90 Light Load MODE 80 10μF 1μF 47μF EFFICIENCY [%] 1.5μH 70 60 PWM MODE 50 40 30 20 VIN=5.0V Figure 1 CIRCUIT 10 0 Figure 1. Typical application circuit (VIN=5V, VOUT=1.2V, IOUT=1A) 0.01 0.10 LOAD CURRENT [A] 1.00 Figure 2. Efficiency(VIN=5V) ○Product structure：Silicon monolithic integrated circuit ○This product is not designed to be radiation resistant. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Pin Configuration [TOP VIEW] ●Pin Description （TOP VIEW） PVIN 1 8 SW VIN 2 7 PGND EN 3 6 FB GND 4 5 MODE Pin Symbol Function 1 PVIN 2 VIN Power supply pin 3 EN Enable pin 4 GND 5 MODE 6 FB 7 PGND 8 SW Power supply pin for output FET GND pin Light load mode/Fixed PWM mode select pin Output feedback pin Figure 3. Pin arrangement diagram GND pin for output FET SW pin ●Block diagram EN VIN VREF SOFT START UVLO PVIN PWM Comp ERROR Amp. R OCP SLOPE OSC SW Driver Logic S OVP PGND UVLO /TSD SCP 1024cycle OSC FB GND MODE Figure 4. Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Block operation descriptions ■ Standby The circuit enters the state of standby when the terminal EN is set to 0.7V or less. All the circuits, such as internal reference voltage VREF, oscillators OSC, and drivers are turned off during standby, and current consumption of the power supply becomes 0μA(25℃, Typ.). Via the FB terminal, the output capacitor is discharged at a resistance of 1kΩ. ■ Start operation The circuit starts operating when terminal EN is set to 2.1V or more. A soft start circuit (SOFT START) is integrated to prevent inrush current to the capacitor when starting. The output voltage reaches a set voltage with 1ms(Typ.) while following the startup of the soft start circuit. There is a delay of about 200μsec up to the beginning of soft start after the terminal EN is turned on and the internal logic operation is started. In order to prevent a defective start, the short-circuit protection is not active during startup. ■ Error amplifier and phase compensation The voltage of the output feedback terminal (FB) is compared with an internal reference voltage, the voltage corresponding to the difference is generated, and send to the PWM comparator which determines the duty ratio of the output. The feedback resistor which determines the output voltage, resistance for compensations, and the capacitor are integrated into the BD90571EFJ-C. ■ Oscillator The 2.25MHz(Typ.) internally fixed clock is generated and send to the slope generation circuit (SLOPE) and to the driver. ■ Light load mode and PWM fixation mode BD90571EFJ-C operates in the light load mode when the terminal MODE is set to 0.7V or less. When the output load current is small, the switching operation automatically becomes intermittent in the light load mode. The efficiency at light load improves compared to the PWM fixation mode because the switching loss is suppressed by operating intermittently. The intermittently operating load current level changes depending on the input voltage, inductor value, etc. If the terminal MODE is set to 2.1V or more the chip operates in PWM fixation mode. In the PWM fixation mode, the efficiency at a light load decreases compared with the light load mode. However, because of the fixed frequency switching through the entire load range, noise is more easily countered. VOUT(10mV/div) VOUT(10mV/div) SW SW Figure 5. Switching operation at light load mode ■ Figure 6. Switching operation at PWM mode Overcurrent detection When in the output stage the current flowing to the Pch FET is 1.0A(Min.) or more, the Pch FET is turned off and the power supply to the output is intercepted. The overcurrent detection is operated every cycle, limits the switching duty, and returns at the next clock cycle. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ■ Output short-circuit detection The output short-circuit detection circuit (SCP) detects a short-circuit of the output when output voltage falls below 70% of a set value during 1024 cycles of the frequency. In this case, the Pch FET and Nch FET of the output are turned off, and the power supply is intercepted. The count is reset when the output voltage returns to 70% or more before 1024 cycles, and the output voltage returns to the set value. Ths SCP automatically resets when after 1024 cycles of the frequency after detecting the short-circuit, and switching is restarted. Resetting triggers the soft start operation because the internal soft start circuit is initialized when the short-circuit detection is activated. The short-circuit detection circuit is not active while soft start is starting. In case the short-circuit continues after resetting, the cycle of starting with a soft start, turning off the output after 1024 cycles, and returning after 1024 cycles is repeated. ■ Output overvoltage detection When the output overvoltage detection circuit (OVP) detects that the output voltage is exceeding 120% of a set value, the Pch FET and Nch FET of the output are turned off and the power supply is intercepted. Switching is restarted if after the power supply interception the output decreases and the overvoltage situation is released. The overvoltage detection voltage and the release voltage have a hysteresis of about 100mV. ■ UVLO The UVLO circuit is activated and shuts down the circuit when the input voltage (VIN) decreases to 2.6V or less. When the UVLO is activated, the control circuit of the error amplifier, the oscillator, the driver and, the output is turned off. Via the FB terminal, the output capacitor is discharged at a resistance of 1kohm. Afterwards, UVLO is released when the input voltage VIN rises to 2.69V or more, and the output is restored. The output voltage starts with soft start when UVLO is reset. ■ Thermal shutdown(TSD) Thermal shutdown (TSD) is activated when the IC junction part temperature exceeds 175 ℃(Typ.). When the TSD is activated the control circuit of the error amplifier, the oscillator, the driver, and the output is turned off. There is hysteresis in the detection temperature of TSD, which is reset when the junction temperature decreases to 150℃(Typ.) or less. The output voltage starts with soft start when TSD is reset. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Absolute maximum rating Parameter Symbol Rating Unit VIN -0.3～7 *1 V PVIN -0.3～7 *1 V EN voltage EN -0.3～7 V SW voltage SW -1.0～PVIN *1 V FB voltage FB -0.3～7 V MODE -0.3～7 V Pd 3.75 *2 W Operating temperature range Topr -40～+125 ℃ Storage temperature range Tstg -55～+150 ℃ Tj +150 ℃ VIN voltage PVIN voltage MODE voltage Power dissipation Junction temperature *1 Pd should not be exceeded. *2 33.3mW/°C reduction when Ta≧25°C if mounted on 4 layers glass epoxy board of 70mm×70mm×1.6mm ●Recommended operating range (Ta=-40~+125°C) Parameter Symbol Operating Range Unit VVIN 2.69～5.5 V VPVIN 2.69～5.5 V VEN 0～5.5(*1) V MODE voltage VMODE 0～5.5 V Output current ISW 0～1 A VIN voltage PVIN voltage EN voltage *1 The circuit goes into test mode when the terminal EN is set at 6V or higher. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Electrical characteristics (unless otherwise specified: Ta=-40~+125°C, VIN=PVIN=5V, EN=3.3V) Parameter Symbol Guaranteed Limit Min. Typ. Max. Unit Conditions Standby circuit current IST - 0 1 μA EN=0V, Ta=25℃ Circuit current ICC - 650 1300 μA FB=1.3V, Ta=25℃ UVLO detection voltage VUVLO1 2.30 2.45 2.60 V Sweep down UVLO release voltage VUVLO2 2.40 2.55 2.69 V Sweep up EN threshold voltage VEN 0.7 1.4 2.1 V EN inflow current IEN 0.8 1.4 2 μA FOSC 1.8 2.25 2.7 MHz Output voltage VFB 1.176 1.20 1.224 V Io=0mA FB pull-down resistance RFB 0.4 1 2 MΩ FB=1.2V Soft start time TSS 0.4 1 2 ms Pch FET ON resistance PRON - 85 - mΩ Nch FET ON resistance NRON - 70 - mΩ Overcurrent detection current IOCP - 2.5 - A VOVP 1.3 1.45 1.6 V VSCP 0.7 0.85 1.0 V MODE threshold voltage VMODE 0.9 1.6 2.3 V MODE inflow current IMODE 3.5 7 14 μA Operating frequency Output overvoltage detection voltage Output short-circuit detection voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/19 EN=3.3V MODE=3.3V TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Typical Performance Curve 100 2.0 90 STANDBY CIRCUIT CURRENT [uA] Light Load MODE 80 EFFICIENCY [%] 70 60 PWM MODE 50 40 30 20 VIN=3.3V Figure 1. CIRCUIT 10 0 1.5 1.0 0.5 0.0 0.01 0.10 LOAD CURRENT [A] 1.00 -40 Figure 7. Efficiency (VIN=3.3V) 0 20 40 60 80 TEMPERATURE [℃] 100 120 Figure 8. Standby circuit current 0.9 1.23 1.22 OUTPUT VOLTAGE [V] 0.8 CIRCUIT CURRENT [mA] -20 0.7 0.6 0.5 1.21 1.20 1.19 1.18 1.17 0.4 -40 -20 0 20 40 60 80 TEMPERATURE [℃] 100 -40 120 Figure 9. Circuit Current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 0 20 40 60 80 TEMPERATURE [℃] 100 120 Figure 10. Output voltage vs. temperature 7/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C 0.0 2.1 1.9 EN THRESHOLD VOLTAGE [V] ⊿OUTPUT VOLTAGE [%] -0.1 -0.2 -0.3 VIN=5V, MODE=3.3V Figure 1 Circuit Rohm evaluation board -0.4 1.7 1.5 1.3 1.1 0.9 0.7 -0.5 0.0 0.5 LOAD CURRENT [A] -40 1.0 -20 Figure 11. Load regulation 0 20 40 60 80 TEMPERATURE [℃] 100 120 Figure 12. EN threshold voltage 2.7 2.6 ON 2.5 FREQUENCY [MHz] UVLO THRESHOLD VOLTAGE [V] 2.6 OFF 2.4 2.4 2.2 2.0 2.3 1.8 -40 -20 0 20 40 60 80 TEMPERATURE [℃] 100 120 -40 Figure 13. UVLO detect/release voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 0 20 40 60 80 TEMPERATURE [℃] Figure 14. 8/19 100 120 Frequency vs. temperature TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C 90 2.6 80 ON RESISTANCE [mΩ] FREQUENCY [MHz] 70 2.4 2.2 2.0 Pch 60 50 Nch 40 30 20 10 1.8 0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE VIN[V] 5.5 -40 Figure 15. Frequency vs. input voltage 0 20 40 60 80 TEMPERATURE [℃] 100 120 Figure 16. FET ON resistance 4.0 1.6 OVP 1.5 THRESHOLD VOLTAGE [V] OCP THRESHOLD CURRENT [A] -20 3.0 2.0 1.4 1.3 1.2 1.1 1.0 SCP 0.9 0.8 1.0 0.7 -40 -20 0 20 40 60 80 TEMPERATURE [℃] 100 120 -40 Figure 17. Over current detect vs. temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 0 20 40 60 80 TEMPERATURE [℃] 100 120 Figure 18. Output over/short detect voltage 9/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C The characteristics below are reference data which are measured with the typical application circuit as shown in Figure 1 Also, these characteristics are influenced by the external components and board layout. EN SW VOUT Figure 19. Loop response (VIN=5V, IOUT=1A) Figure 20. Start-up waveform (VIN=5V, MODE=3.3V) VOUT(50mV/div) VOUT(50mV/div) IOUT(0.5A/div) IOUT(0.5A/div) Figure 21. Load response (VIN=5V, MODE=0V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 22. Load response (VIN=5V, MODE=3.3V) 10/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Timing chart ■ Start-up Figure 23. Start-up ■ OCP Figure 24. OCP ■ SCP Figure 25. SCP www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Selection of external components ■ Selection of inductor The inductor value greatly influences the output ripple current. The larger the coil is, the more the ripple current drops as shown in the equation below. （PVIN-VOUT）×VOUT ΔIL = L×PVIN×f ΔIL [A] An inductor with a low value will cause the ripple current to increase and also cause an increase of the ripple element of the output voltage. The optimal output ripple current setting is between 10% ~ 30% of the maximum output current. PVIN IL VOUT L ΔIL = 0.2×IOUTmax. [A] Co （PVIN-VOUT）×VOUT [H] ΔIL×PVIN×f （ΔIL: Output ripple current, f: switching frequency） L= Figure 26. .Ripple current Supplying the coil with a current exceeding the coil’s rated current will cause magnetic saturation of the coil and will decrease the efficiency of the coil. Please allow for a sufficient margin in selecting the inductor to ensure that the peak current does not exceed the inductor’s rated current. Please select a coil with a small resistance element (DCR, ACR) to reduce the coil loss, and to improve efficiency. ■ Selection of input capacitor The input capacitor serves to lower the impedance of the power supply connected to the input pin (VIN, PVIN). An increase of the impedance of this power supply can cause input voltage instability and may negatively impact oscillation and ripple rejection characteristics. Therefore, it is necessary to place an input capacitor in close proximity to the VIN, PVIN, GND and PGND pins. We recommend selecting a ceramic capacitor with a value of 10uF or more that influenced by changes in temperature as little as possible and that has a sufficiently large permissible ripple current. The ripple current RMS can be calculated using the following equation. IRMS = IOUT × VOUT（VIN - VOUT） [A] VIN Note that depending on the capacitor, the capacitance may be greatly influenced by the applied voltage. Please select a capacitor with good DC bias characteristics and with a high voltage. ■ Selection of output capacitor We recommend selecting a ceramic capacitor. The ripple element of the output voltage is determined by the ESR of the output capacitor. Please take the permissible voltage of the actual application into consideration when selecting the output capacitor. The ripple element of the output voltage can be calculated by using the equation below. Selecting a low-ESR capacitor can reduce the ripple element of the output voltage. Note that depending on the capacitor, the capacitance may be greatly influenced by the applied voltage. Please select a acapacitor with god DC bias characteristics and with a high voltage. ΔVPP = ΔIL × RESR + ΔIL Co × Vo VIN × 1 f [V] f: Switching frequency The startup time needs to be within the soft start time. Therefore, please take the following equation into consideration when selecting the output capacitor . TSS × (ILimit – IOUT) Tss: Soft start time (typ. 1ms) Co ≦ VOUT ILimit: Overcurrent detection value (min. 1A) Non-optimal capacitance values may cause startup problems. Especially in cases of extremely large capacitance values, the possibility exists that the inrush current at startup will activate the overcurrent protection, thus not starting the output. Therefore, verification and conformation with the actual application is recommended. ■ Selection of Schottky diode Depending on the application the efficiency may be improved by placing a Schottky diode between the SW pin and PGND pin thereby creating a current path when the synchronous switching (Nch FET) is off. When selecting the Schottky diode ensure that the maximum reverse voltage is higher than the input voltage and that the rated current is higher than the maximum inductor current (the sum of the maximum output current and inductor ripple current). www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Notes on the substrate layout The substrate layout greatly influences the stable operation of the IC. Depending on the substrate layout the IC might not show its original characteristics or might not function properly. Please note the following points when creating the substrate layout. The input capacitors C1 and C2 should be placed as close as possible to the VIN, PVIN, GND and PGND pins. The output voltage feedback line should be separated from lines with a lot of noise such as the SW line. The GND signal should be separated from the input capacitor and the GND and PGND of the output capacitor and brought together at one point. The output capacitors C3 and C4 should be placed in close proximity to inductor L1. The inductor L1 should be placed as close as possible to the SW pin. The pattern area of the SW node should be as small as possible. The MODE pin should be pulled down via R1 by GND and pulled up via R2 by VIN. It is also possible to directly supple the MODE pin with voltage. The feedback frequency characteristics (phase margin) can be measured by inserting a resistor at the location of R3 and using FRA. However, this should be shorted during normal operation. L1 VIN 1 PVIN C2 C1 EN VOUT SW 8 2 VIN PGND 7 3 EN FB 6 C3 C4 R3 4 GND VIN MODE 5 R1 R2 Figure 27. Reference circuit VIN GND VOUT C4 C3 R3 C2 L1 C1 IC R2 R1 EN <TOP VIEW> <BOTTOM VIEW> Figure 28. Reference layout pattern www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Heat dissipation The maximum allowable junction temperature Tj of BD90571EFJ-C is 150°C. In case Tj exceeds 150℃, the temperature protection circuit is activated and the circuit shuts down. Therefore, it is necessary to design the system requirements and the board layout so that the junction temperature does not exceed 150℃ in the power-supply voltage, the output load and the operating temperature range. The maximum junction temperature can be calculated using the ambient temperature Ta, the thermal resistance θja of the package and heat dissipation P of the IC. Tj = Ta + θja × P [°C] The thermal resistance θja of the package changes depending on the number of layers and the copper foil area of the board. The heat dissipation PTOTAL of the IC can be calculated by the equation below. PTOTAL = PICC + PRON + PSW [W] PICC = VIN × ICC ・・・ Heat dissipation in control circuit PRON = Ron × Io2 ・・・ Heat dissipation in output FET PSW = Tr × Io × VIN × F ・・・ Heat dissipation in switching ICC: circuit current Ron: ON resistance of the output FET F: frequency All values are specified in the electrical characteristics. Tr is the rise time and fall time at switching. In the standard case is 5nsec and in the max case is 10nsec. Also, these characteristics are influenced by the external components and board layout. ●Heat reduction characteristic 4 ④3.75W IC mounted on ROHM standard board ・Board size：70mm×70mm×1.6mm ・The board and the back exposure heat radiation board part of package are connected with solder. Power Dissipation : Pd （W) 3.5 3 ① IC unit, θja=249.5℃/W ② 2 layers board (Copper foil：15mm×15mm), θja =113.6℃/W ③ 2 layers board (Copper foil：70mm×70mm), θja =59.2℃/W ④ 4 layers board (Copper foil：70mm×70mm), θja =33.3℃/W 2.5 ③2.11W 2 1.5 ②1.1W 1 ①0.5W 0.5 0 0 25 50 75 100 125 150 Ambient Temperature: Ta(℃) Figure 29. Heat reduction characteristic www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●I/O equivalence circuit 3PIN (EN) 5PIN (MODE) 6PIN (FB) 8PIN (SW) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Operational Notes 1. Absolute maximum ratings Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters may result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. Thermal protection circuit (TSD) If the junction temperature (Tj) exceeds 175℃(Typ.) the thermal protection circuit (TSD) is activated and the output is put in the OFF status. The releasing temperature has hysteresis of about 25°C(typ.). The thermal protection circuit only functions to block thermal overloads from reaching the IC. Its purpose is not to protect the circuit or to guarantee the operations of the IC. Therefore, the IC should not be continuously operated after this circuit has been activated, nor should the IC be used in applications where the activation of this circuit is a prerequisite. 3. Overcurrent protection circuit This IC incorporates an integrated overcurrent protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. The protection circuit is effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuit. 4. High temperature, no load behavior In a situation where there is a high temperature and no load, it might be that the leak current of the output transistor causes output voltage to rise (up to maximum VIN). It case it is expected that in the application conditions the output load drops below 1mA, please place a 1kohm resistor at the output in order to prevent an no-load situation. 5. Power dissipation, ASO Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip and lead to a decrease of the reliability. Therefore, allow for sufficient margins to ensure use within the power dissipation rating. Also, please ensure in the design that the absolute maximum rating of the output transistor and the ASO are not exceeded when operating the IC. 6. Operation in strong electromagnetic fields Use caution when operating in the presence of strong electromagnetic fields, as this may cause the IC to malfunction. 7. Connection to the power supply connector A reverse connection to the power supply connector may cause damages to the IC. In order to prevent against reverse connection damages please externally place a diode between the power supply and the power supply pin of the IC. 8. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 9. Short to power supply, short to ground, inter-pin shorts Please avoid shorts between the output pin and the power supply (VIN, PVIN), shorts between the output pin and ground (GND, PGND) and shorts between the output pins. 10. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 11. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 12. Wiring of VIN and GND For the wiring of VIN, PVIN, GND and PGND please create a layout with as wide as possible wires and a minimum distance in between the wires. In case of both small signal lines and high current lines, use single-point grounding to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal. Also place a capacitor at the grounding point for stabilization. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C 13. Capacitor between PVIN and PGND The capacitor between PVIN and PGND absorbs the steep changes in voltage and current caused by the PWM drive and thereby suppress fluctuations in the PVIN voltage. However, this effect is diminished due to wiring impedance the further the capacitor is removed from the IC. 14. Input pins This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. Relations between each potential may form as shown in the example below, where a resistor and transistor are connected to a pin: With the resistor, when GND＞ Pin A, and with the transistor (NPN), when GND＞Pin B: The P-N junction operates as a parasitic diode. With the transistor (NPN), when GND＞ Pin B: The P-N junction operates as a parasitic transistor by interacting with the N layers of elements in proximity to the parasitic diode described above. Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (P substrate) GND. Transistor (NPN) B Resistor (Pin A) (Pin B) C (Pin B) E B P P+ N P N P+ N P+ N Parasitic element GND E P N N C GND P+ Parasitic element or transistor N P sub (Pin A) Parasitic element or transistor GND Parasitic element Figure 30. Example of IC structure 15. Application current and constants The application circuit as shown in Figure 1. and the constants are examples to show the standard operation and application of this IC. In case of creating a design for mass production with different external components please contact ROHM for detailed information. 16. In some applications, the PVIN pin and SW pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, while the external capacitor is charged, the PVIN shorts to the GND. To prevent this we recommend reverse polarity diodes in series or placing a bypass diode between the SW pin and PVIN pin. Bypass diode Reverse polarity diode PVIN Pin Figure 31. Measure for reverse Note concerning this document The Japanese version of this document is the official specification. This translation should be seen as a reference to aid reading the official specification. In case of any discrapencies between the two versions, the offical version always takes precedence. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Ordering Information B D 9 0 5 7 1 E F J - Package EFJ: HTSOP-J8 CE2 Packaging and forming specification CE2: Embossed tape and reel ●Physical Dimension Tape and Reel Information HTSOP-J8 <Tape and Reel information> +6° 4° −4° (2.4) 3.9±0.1 6.0±0.2 8 7 6 5 1 1.05±0.2 (3.2) 0.65±0.15 4.9±0.1 (MAX 5.25 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 2 3 4 1PIN MARK +0.05 0.17 -0.03 1.0MAX 0.545 S 0.08±0.08 0.85±0.05 1.27 +0.05 0.42 -0.04 0.08 M 0.08 S 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram HTSOP-J8 (TOP VIEW) D90571 Lot. No. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet BD90571EFJ-C ●Revision History Rev. Date 001 2012/07/31 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Notes New release 19/19 TSZ02201-0T1T0AL00030-1-2 31.JUL.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.