Altera EP1AGX50DF780C6N Section i. arria gx device data sheet Datasheet

Section I. Arria GX Device Data Sheet
This section provides designers with the data sheet specifications for Arria® GX
devices. They contain feature definitions of the transceivers, internal architecture,
configuration, and JTAG boundary-scan testing information, DC operating
conditions, AC timing parameters, a reference to power consumption, and ordering
information for Arria GX devices.
This section includes the following chapters:
■
Chapter 1, Arria GX Device Family Overview
■
Chapter 2, Arria GX Architecture
■
Chapter 3, Configuration and Testing
■
Chapter 4, DC and Switching Characteristics
■
Chapter 5, Reference and Ordering Information
Revision History
Refer to each chapter for its own specific revision history. For information about when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the full handbook.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
I–2
Section I: Arria GX Device Data Sheet
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
1. Arria GX Device Family Overview
AGX51001-2.0
Introduction
The Arria® GX family of devices combines 3.125 Gbps serial transceivers with reliable
packaging technology and a proven logic array. Arria GX devices include 4 to 12
high-speed transceiver channels, each incorporating clock data recovery (CDR)
technology and embedded SERDES circuitry designed to support PCI-Express,
Gigabit Ethernet, SDI, SerialLite II, XAUI, and Serial RapidIO protocols, along with
the ability to develop proprietary, serial-based IP using its Basic mode. The
transceivers build upon the success of the Stratix ® II GX family. The Arria GX FPGA
technology offers a 1.2-V logic array with the right level of performance and
dependability needed to support these mainstream protocols.
Features
The key features of Arria GX devices include:
■
© December 2009
Transceiver block features
■
High-speed serial transceiver channels with CDR support up to 3.125 Gbps.
■
Devices available with 4, 8, or 12 high-speed full-duplex serial transceiver
channels
■
Support for the following CDR-based bus standards—PCI Express, Gigabit
Ethernet, SDI, SerialLite II, XAUI, and Serial RapidIO, along with the ability to
develop proprietary, serial-based IP using its Basic mode
■
Individual transmitter and receiver channel power-down capability for
reduced power consumption during non-operation
■
1.2- and 1.5-V pseudo current mode logic (PCML) support on transmitter
output buffers
■
Receiver indicator for loss of signal (available only in PCI Express [PIPE]
mode)
■
Hot socketing feature for hot plug-in or hot swap and power sequencing
support without the use of external devices
■
Dedicated circuitry that is compliant with PIPE, XAUI, Gigabit Ethernet, Serial
Digital Interface (SDI), and Serial RapidIO
■
8B/10B encoder/decoder performs 8-bit to 10-bit encoding and 10-bit to 8-bit
decoding
■
Phase compensation FIFO buffer performs clock domain translation between
the transceiver block and the logic array
■
Channel aligner compliant with XAUI
Altera Corporation
Arria GX Device Handbook, Volume 1
1–2
Chapter 1: Arria GX Device Family Overview
Features
■
Main device features:
■
TriMatrix memory consisting of three RAM block sizes to implement true
dual-port memory and first-in first-out (FIFO) buffers with performance up to
380 MHz
■
Up to 16 global clock networks with up to 32 regional clock networks per
device
■
High-speed DSP blocks provide dedicated implementation of multipliers,
multiply-accumulate functions, and finite impulse response (FIR) filters
■
Up to four enhanced phase-locked loops (PLLs) per device provide spread
spectrum, programmable bandwidth, clock switch-over, and advanced
multiplication and phase shifting
■
Support for numerous single-ended and differential I/O standards
■
High-speed source-synchronous differential I/O support on up to 47 channels
■
Support for source-synchronous bus standards, including SPI-4 Phase 2
(POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
■
Support for high-speed external memory including DDR and DDR2 SDRAM,
and SDR SDRAM
■
Support for multiple intellectual property megafunctions from Altera®
MegaCore® functions and Altera Megafunction Partners Program (AMPPSM )
■
Support for remote configuration updates
Table 1–1 lists Arria GX device features for FineLine BGA (FBGA) with flip chip
packages.
Table 1–1. Arria GX Device Features (Part 1 of 2)
EP1AGX20C
EP1AGX35C/D
EP1AGX50C/D
C
C
EP1AGX60C/D/E
EP1AGX90E
Feature
C
Package
484-pin,
780-pin
(Flip chip)
D
D
484-pin
780-pin
484-pin
780-pin,
(Flip chip)
(Flip chip)
(Flip chip)
1152-pin
C
484-pin
D
E
780-pin
1152-pin
(Flip chip) (Flip chip) (Flip chip)
E
1152-pin
(Flip chip)
(Flip chip)
ALMs
8,632
13,408
20,064
24,040
36,088
Equivalent
logic
elements
(LEs)
21,580
33,520
50,160
60,100
90,220
Transceiver
channels
4
Transceiver
data rate
Sourcesynchronous
receive
channels
600 Mbps
to 3.125
Gbps
31
Arria GX Device Handbook, Volume 1
4
8
600 Mbps to 3.125
Gbps
31
31
4
8
600 Mbps to 3.125
Gbps
31
31, 42
4
8
12
600 Mbps to 3.125 Gbps
31
31
© December 2009
12
600 Mbps
to 3.125
Gbps
42
Altera Corporation
47
Chapter 1: Arria GX Device Family Overview
Features
1–3
Table 1–1. Arria GX Device Features (Part 2 of 2)
EP1AGX20C
EP1AGX35C/D
EP1AGX50C/D
EP1AGX60C/D/E
EP1AGX90E
C
C
D
C
D
C
D
E
E
Sourcesynchronous
transmit
channels
29
29
29
29
29, 42
29
29
42
45
M512 RAM
blocks
(32 × 18 bits)
166
197
313
326
478
M4K RAM
blocks
(128 × 36
bits)
118
140
242
252
400
1
1
2
2
4
Total RAM
bits
1,229,184
1,348,416
2,475,072
2,528,640
4,477,824
Embedded
multipliers
(18 × 18)
40
56
104
128
176
DSP blocks
10
14
26
32
44
PLLs
4
4
Feature
M-RAM
blocks
(4096 × 144
bits)
Maximum
user I/O pins
230, 341
230
341
4
4, 8
4
229
350, 514
229
350
8
8
514
538
Arria GX devices are available in space-saving FBGA packages (refer to Table 1–2). All
Arria GX devices support vertical migration within the same package. With vertical
migration support, designers can migrate to devices whose dedicated pins,
configuration pins, and power pins are the same for a given package across device
densities. For I/O pin migration across densities, the designer must cross-reference
the available I/O pins with the device pin-outs for all planned densities of a given
package type to identify which I/O pins are migratable.
Table 1–2. Arria GX Package Options (Pin Counts and Transceiver Channels) (Part 1 of 2)
Source-Synchronous Channels
Maximum User I/O Pin Count
Transceiver
Channels
Receive
Transmit
484-Pin FBGA
(23 mm)
780-Pin FBGA
(29 mm)
1152-Pin
FBGA
(35 mm)
EP1AGX20C
4
31
29
230
341
—
EP1AGX35C
4
31
29
230
—
—
EP1AGX50C
4
31
29
229
—
—
EP1AGX60C
4
31
29
229
—
—
EP1AGX35D
8
31
29
—
341
—
EP1AGX50D
8
31, 42
29, 42
—
350
514
Device
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
1–4
Chapter 1: Arria GX Device Family Overview
Document Revision History
Table 1–2. Arria GX Package Options (Pin Counts and Transceiver Channels) (Part 2 of 2)
Source-Synchronous Channels
Maximum User I/O Pin Count
Transceiver
Channels
Receive
Transmit
484-Pin FBGA
(23 mm)
780-Pin FBGA
(29 mm)
1152-Pin
FBGA
(35 mm)
EP1AGX60D
8
31
29
—
350
—
EP1AGX60E
12
42
42
—
—
514
EP1AGX90E
12
47
45
—
—
538
Device
Table 1–3 lists the Arria GX device package sizes.
Table 1–3. Arria GX FBGA Package Sizes
Dimension
484 Pins
780 Pins
1152 Pins
Pitch (mm)
1.00
1.00
1.00
Area (mm2 )
529
841
1225
23 × 23
29 × 29
35 × 35
Length × width
(mm × mm)
Document Revision History
Table 1–4 lists the revision history for this chapter.
Table 1–4. Document Revision History
Date and Document Version
December 2009, v2.0
Changes Made
■
Document template update.
■
Minor text edits.
Summary of Changes
—
May 2008, v1.2
Included support for SDI,
SerialLite II, and XAUI.
—
June 2007, v1.1
Included GIGE information.
—
May 2007, v1.0
Initial Release
—
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
2. Arria GX Architecture
AGX51002-2.0
Transceivers
Arria® GX devices incorporate up to 12 high-speed serial transceiver channels that
build on the success of the Stratix ® II GX device family. Arria GX transceivers are
structured into full-duplex (transmitter and receiver) four-channel groups called
transceiver blocks located on the right side of the device. You can configure the
transceiver blocks to support the following serial connectivity protocols
(functional modes):
■
PCI Express (PIPE)
■
Gigabit Ethernet (GIGE)
■
XAUI
■
Basic (600 Mbps to 3.125 Gbps)
■
SDI (HD, 3G)
■
Serial RapidIO (1.25 Gbps, 2.5 Gbps, 3.125 Gbps)
Transceivers within each block are independent and have their own set of dividers.
Therefore, each transceiver can operate at different frequencies. Each block can select
from two reference clocks to provide two clock domains that each transceiver can
select from.
Table 2–1 lists the number of transceiver channels for each member of the Arria GX
family.
Table 2–1. Arria GX Transceiver Channels
© December 2009
Device
Number of Transceiver Channels
EP1AGX20C
4
EP1AGX35C
4
EP1AGX35D
8
EP1AGX50C
4
EP1AGX50D
8
EP1AGX60C
4
EP1AGX60D
8
EP1AGX60E
12
EP1AGX90E
12
Altera Corporation
Arria GX Device Handbook, Volume 1
2–2
Chapter 2: Arria GX Architecture
Transceivers
Figure 2–1 shows a high-level diagram of the transceiver block architecture divided
into four channels.
Figure 2–1. Transceiver Block
Transceiver Block
RX1
Channel 1
TX1
RX0
Channel 0
Arria GX
Logic Array
TX0
Supporting Blocks
(PLLs, State Machines,
Programming)
REFCLK_1
REFCLK_0
RX2
Channel 2
TX2
RX3
Channel 3
TX3
Each transceiver block has:
■
Four transceiver channels with dedicated physical coding sublayer (PCS) and
physical media attachment (PMA) circuitry
■
One transmitter PLL that takes in a reference clock and generates high-speed serial
clock depending on the functional mode
■
Four receiver PLLs and clock recovery unit (CRU) to recover clock and data from
the received serial data stream
■
State machines and other logic to implement special features required to support
each protocol
Figure 2–2 shows functional blocks that make up a transceiver channel.
Figure 2–2. Arria GX Transceiver Channel Block Diagram
PMA Analog Section
PCS Digital Section
n
Deserializer
(1)
Rate
Matcher
Clock
Recovery
Unit
Reference
Clock
Receiver
PLL
Reference
Clock
Transmitter
PLL
FPGA Fabric
Word
Aligner
XAUI
Lane
Deskew
8B/10B
Decoder
Byte
Deserializer
Phase
Compensation
FIFO Buffer
m
(2)
n
Serializer
(1)
8B/10B
Encoder
Byte
Serializer
Phase
Compensation
FIFO Buffer
m
(2)
Notes to Figure 2–2:
(1) “n” represents the number of bits in each word that must be serialized by the transmitter portion of the PMA.
n = 8 or 10.
(2) “m” represents the number of bits in the word that passes between the FPGA logic and the PCS portion of the transceiver. m = 8, 10, 16, or 20.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–3
Each transceiver channel is full-duplex and consists of a transmitter channel and a
receiver channel.
The transmitter channel contains the following sub-blocks:
■
Transmitter phase compensation first-in first-out (FIFO) buffer
■
Byte serializer (optional)
■
8B/10B encoder (optional)
■
Serializer (parallel-to-serial converter)
■
Transmitter differential output buffer
The receiver channel contains the following:
■
Receiver differential input buffer
■
Receiver lock detector and run length checker
■
CRU
■
Deserializer
■
Pattern detector
■
Word aligner
■
Lane deskew
■
Rate matcher (optional)
■
8B/10B decoder (optional)
■
Byte deserializer (optional)
■
Receiver phase compensation FIFO buffer
You can configure the transceiver channels to the desired functional modes using the
ALT2GXB MegaCore instance in the Quartus® II MegaWizard ™ Plug-in Manager for
the Arria GX device family. Depending on the selected functional mode, the
Quartus II software automatically configures the transceiver channels to employ a
subset of the sub-blocks listed above.
Transmitter Path
This section describes the data path through the Arria GX transmitter. The sub-blocks
are described in order from the PLD-transmitter parallel interface to the serial
transmitter buffer.
Clock Multiplier Unit
Each transceiver block has a clock multiplier unit (CMU) that takes in a reference
clock and synthesizes two clocks: a high-speed serial clock to serialize the data and a
low-speed parallel clock to clock the transmitter digital logic (PCS).
The CMU is further divided into three sub-blocks:
© December 2009
■
One transmitter PLL
■
One central clock divider block
■
Four local clock divider blocks (one per channel)
Altera Corporation
Arria GX Device Handbook, Volume 1
2–4
Chapter 2: Arria GX Architecture
Transceivers
Figure 2–3 shows the block diagram of the clock multiplier unit.
Figure 2–3. Clock Multiplier Unit
CMU Block
Transmitter High-Speed Serial
and Low-Speed Parallel Clocks
Transmitter Channels [3:2]
Local
Clock
TX Clock
Divider Block
Gen Block
Reference Clock
from REFCLKs,
Global Clock (1),
Inter-Transceiver
Lines
Central Clock
Divider
Block
Transmitter
PLL
Transmitter High-Speed Serial
and Low-Speed Parallel Clocks
Local
Clock
TX Clock
Divider Block
Gen Block
Transmitter Channels [1:0]
The transmitter PLL multiplies the input reference clock to generate the high-speed
serial clock required to support the intended protocol. It implements a half-rate
voltage controlled oscillator (VCO) that generates a clock at half the frequency of the
serial data rate for which it is configured.
Figure 2–4 shows the block diagram of the transmitter PLL.
Figure 2–4. Transmitter PLL
Transmitter PLL
/M
To
Inter-Transceiver Lines
Dedicated
REFCLK0
Dedicated
REFCLK1
/2
Phase
Frequency
INCLK Detector
/2
(1)
up
down
Charge
Pump + Loop
Filter
Voltage
Controlled
Oscillator
/L(1)
High Speed
Serial Clock
Inter-Transceiver Lines[2:0]
Global Clock (2)
Notes to Figure 2–4:
(1) You only need to select the protocol and the available input reference clock frequency in the ALTGXB MegaWizard Plug-In Manager. Based on your
selections, the MegaWizard Plug-In Manager automatically selects the necessary /M and /L dividers (clock multiplication factors).
(2) The global clock line must be driven from an input pin only.
The reference clock input to the transmitter PLL can be derived from:
■
One of two available dedicated reference clock input pins (REFCLK0 or REFCLK1)
of the associated transceiver block
■
PLD global clock network (must be driven directly from an input clock pin and
cannot be driven by user logic or enhanced PLL)
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
■
1
2–5
Inter-transceiver block lines driven by reference clock input pins of other
transceiver blocks
Altera® recommends using the dedicated reference clock input pins (REFCLK0 or
REFCLK1) to provide reference clock for the transmitter PLL.
Table 2–2 lists the adjustable parameters in the transmitter PLL.
Table 2–2. Transmitter PLL Specifications
Parameter
Specifications
Input reference frequency range
Data rate support
50 MHz to 622.08 MHz
600 Mbps to 3.125 Gbps
Bandwidth
Low, medium, or high
The transmitter PLL output feeds the central clock divider block and the local clock
divider blocks. These clock divider blocks divide the high-speed serial clock to
generate the low-speed parallel clock for the transceiver PCS logic and
PLD-transceiver interface clock.
Transmitter Phase Compensation FIFO Buffer
A transmitter phase compensation FIFO is located at each transmitter channel’s logic
array interface. It compensates for the phase difference between the transmitter PCS
clock and the local PLD clock. The transmitter phase compensation FIFO is used in all
supported functional modes. The transmitter phase compensation FIFO buffer is eight
words deep in PCI Express (PIPE) mode and four words deep in all other modes.
f
For more information about architecture and clocking, refer to the Arria GX Transceiver
Architecture chapter.
Byte Serializer
The byte serializer takes in two-byte wide data from the transmitter phase
compensation FIFO buffer and serializes it into a one-byte wide data at twice the
speed. The transmit data path after the byte serializer is 8 or 10 bits. This allows
clocking the PLD-transceiver interface at half the speed when compared with the
transmitter PCS logic. The byte serializer is bypassed in GIGE mode. After
serialization, the byte serializer transmits the least significant byte (LSByte) first and
the most significant byte (MSByte) last.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–6
Chapter 2: Arria GX Architecture
Transceivers
Figure 2–5 shows byte serializer input and output. datain[15:0] is the input to the
byte serializer from the transmitter phase compensation FIFO; dataout[7:0] is the
output of the byte serializer.
Figure 2–5. Byte Serializer Operation (Note 1)
D1
datain[15:0]
D2
{8'h00,8'h01}
{8'h02,8'h03}
D1LSByte
dataout[7:0]
xxxxxxxxxx
D3
8'h01
xxxxxxxxxx
xxxx
D1MSByte
8'h00
D2LSByte
D2MSByte
8'h03
8'h02
Note to Figure 2–5:
(1) datain may be 16 or 20 bits. dataout may be 8 or 10 bits.
8B/10B Encoder
The 8B/10B encoder block is used in all supported functional modes. The 8B/10B
encoder block takes in 8-bit data from the byte serializer or the transmitter phase
compensation FIFO buffer. It generates a 10-bit code group with proper running
disparity from the 8-bit character and a 1-bit control identifier (tx_ctrlenable).
When tx_ctrlenable is low, the 8-bit character is encoded as data code group
(Dx.y). When tx_ctrlenable is high, the 8-bit character is encoded as a control
code group (Kx.y). The 10-bit code group is fed to the serializer. The 8B/10B encoder
conforms to the IEEE 802.3 1998 edition standard.
f
For additional information regarding 8B/10B encoding rules, refer to the Specifications
and Additional Information chapter.
Figure 2–6 shows the 8B/10B conversion format.
Figure 2–6. 8B/10B Encoder
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
Ctrl
8B-10B Conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB
LSB
During reset (tx_digitalreset), the running disparity and data registers are
cleared and the 8B/10B encoder continously outputs a K28.5 pattern from the
RD-column. After out of reset, the 8B/10B encoder starts with a negative disparity
(RD-) and transmits three K28.5 code groups for synchronizing before it starts
encoding the input data or control character.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–7
Transmit State Machine
The transmit state machine operates in either PCI Express (PIPE) mode, XAUI mode,
or GIGE mode, depending on the protocol used.
GIGE Mode
In GIGE mode, the transmit state machine converts all idle ordered sets (/K28.5/,
/Dx.y/) to either /I1/ or /I2/ ordered sets. The /I1/ set consists of a negative-ending
disparity /K28.5/ (denoted by /K28.5/-), followed by a neutral /D5.6/. The /I2/ set
consists of a positive-ending disparity /K28.5/ (denoted by /K28.5/+) and a
negative-ending disparity /D16.2/ (denoted by /D16.2/-). The transmit state
machines do not convert any of the ordered sets to match /C1/ or /C2/, which are
the configuration ordered sets. (/C1/ and /C2/ are defined by [/K28.5/, /D21.5/]
and [/K28.5/, /D2.2/], respectively). Both the /I1/ and /I2/ ordered sets guarantee a
negative-ending disparity after each ordered set.
XAUI Mode
The transmit state machine translates the XAUI XGMII code group to the XAUI PCS
code group. Table 2–3 lists the code conversion.
Table 2–3. On-Chip Termination Support by I/O Banks
XGMII TXC
XGMII TXD
PCS Code-Group
Description
0
00 through FF
Dxx.y
Normal data
1
07
K28.0 or K28.3 or K28.5
Idle in ||I||
1
07
K28.5
Idle in ||T||
1
9C
K28.4
Sequence
1
FB
K27.7
Start
1
FD
K29.7
Terminate
1
FE
K30.7
Error
1
Refer to IEEE 802.3 reserved code
groups
Refer to IEEE 802.3 reserved code
groups
Reserved code groups
1
Other value
K30.7
Invalid XGMII character
The XAUI PCS idle code groups, /K28.0/ (/R/) and /K28.5/ (/K/), are automatically
randomized based on a PRBS7 pattern with an ×7 + ×6 + 1 polynomial. The /K28.3/
(/A/) code group is automatically generated between 16 and 31 idle code groups. The
idle randomization on the /A/, /K/, and /R/ code groups is automatically done by
the transmit state machine.
Serializer (Parallel-to-Serial Converter)
The serializer block clocks in 8- or 10-bit encoded data from the 8B/10B encoder using
the low-speed parallel clock and clocks out serial data using the high-speed serial
clock from the central or local clock divider blocks. The serializer feeds the data LSB to
MSB to the transmitter output buffer.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–8
Chapter 2: Arria GX Architecture
Transceivers
Figure 2–7 shows the serializer block diagram.
Figure 2–7. Serializer
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
10
From 8B/10B
Encoder
To Transmitter
Output Buffer
Low-speed parallel clock
CMU
Central /
Local Clock
High-speed serial clock
Divider
Transmitter Buffer
The Arria GX transceiver buffers support the 1.2- and 1.5-V PCML I/O standard at
rates up to 3.125 Gbps. The common mode voltage (VCM ) of the output driver may be
set to 600 or 700 mV.
f
For more information about the Arria GX transceiver buffers, refer to the Arria GX
Transceiver Architecture chapter.
The output buffer, as shown in Figure 2–8, is directly driven by the high-speed data
serializer and consists of a programmable output driver, a programmable
pre-emphasis circuit, and OCT circuitry.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–9
Figure 2–8. Output Buffer
Serializer
Output Buffer
Programmable
Pre-Emphasis
Output
Pins
Programmable
Output
Driver
Programmable Output Driver
The programmable output driver can be set to drive out differentially from 400 to
1200 mV. The differential output voltage (VOD ) can be statically set by using the
ALTGXB megafunction.
You can configure the output driver with 100- OCT or external OCT.
Differential signaling conventions are shown in Figure 2–9. The differential amplitude
represents the value of the voltage between the true and complement signals.
Peak-to-peak differential voltage is defined as 2 (VHIGH – VLOW ) = 2 single-ended
voltage swing. The common mode voltage is the average of V HIGH and VLOW.
Figure 2–9. Differential Signaling
Single-Ended Waveform
Vhigh
True
+VOD
Complement
Vlow
Differential Waveform
+400
+VOD
0-V Differential
VOD (Differential)
= Vhigh − Vlow
© December 2009
Altera Corporation
2 * VOD
-VOD
−400
Arria GX Device Handbook, Volume 1
2–10
Chapter 2: Arria GX Architecture
Transceivers
Programmable Pre-Emphasis
The programmable pre-emphasis module controls the output driver to boost high
frequency components and compensate for losses in the transmission medium, as
shown in Figure 2–10. Pre-emphasis is set statically using the ALTGXB megafunction.
Figure 2–10. Pre-Emphasis Signaling
VMAX
Pre-Emphasis % = (
VMIN
VMAX
− 1) × 100
VMIN
Pre-emphasis percentage is defined as (VMAX /VMIN – 1) × 100, where VM AX is the
differential emphasized voltage (peak-to-peak) and VMIN is the differential
steady-state voltage (peak-to-peak).
PCI Express (PIPE) Receiver Detect
The Arria GX transmitter buffer has a built-in receiver detection circuit for use in PCI
Express (PIPE) mode. This circuit provides the ability to detect if there is a receiver
downstream by sending out a pulse on the channel and monitoring the reflection.
This mode requires a tri-stated transmitter buffer (in electrical idle mode).
PCI Express (PIPE) Electric Idles (or Individual Transmitter Tri-State)
The Arria GX transmitter buffer supports PCI Express (PIPE) electrical idles. This
feature is only active in PCI Express (PIPE) mode. The tx_forceelecidle port puts
the transmitter buffer in electrical idle mode. This port is available in all PCI Express
(PIPE) power-down modes and has specific usage in each mode.
Receiver Path
This section describes the data path through the Arria GX receiver. The sub-blocks are
described in order from the receiver buffer to the PLD-receiver parallel interface.
Receiver Buffer
The Arria GX receiver input buffer supports the 1.2-V and 1.5-V PCML I/O standards
at rates up to 3.125 Gbps. The common mode voltage of the receiver input buffer is
programmable between 0.85 V and 1.2 V. You must select the 0.85 V common mode
voltage for AC- and DC-coupled PCML links and 1.2 V common mode voltage for
DC-coupled LVDS links.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–11
The receiver has 100- on-chip differential termination (R D OCT) for different
protocols, as shown in Figure 2–11. You can disable the receiver’s internal termination
if external terminations and biasing are provided. The receiver and transmitter
differential termination method can be set independently of each other.
Figure 2–11. Receiver Input Buffer
100-Ω
Termination
Input
Pins
Programmable
Equalizer
Differential
Input
Buffer
If a design uses external termination, the receiver must be externally terminated and
biased to 0.85 V or 1.2 V. Figure 2–12 shows an example of an external termination and
biasing circuit.
Figure 2–12. External Termination and Biasing Circuit
Receiver External Termination
and Biasing
Arria GX Device
VDD
50-W
Termination
Resistance
R1
C1
Receiver
R1/R2 = 1K
VDD ´ {R2/(R1 + R 2)} = 0.85/1.2 V
RXIP
R2
RXIN
Receiver External Termination
and Biasing
Transmission
Line
Programmable Equalizer
The Arria GX receivers provide a programmable receiver equalization feature to
compensate for the effects of channel attenuation for high-speed signaling. PCB traces
carrying these high-speed signals have low-pass filter characteristics. Impedance
mismatch boundaries can also cause signal degradation. Equalization in the receiver
diminishes the lossy attenuation effects of the PCB at high frequencies.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–12
Chapter 2: Arria GX Architecture
Transceivers
The receiver equalization circuit is comprised of a programmable amplifier. Each
stage is a peaking equalizer with a different center frequency and programmable gain.
This allows varying amounts of gain to be applied, depending on the overall
frequency response of the channel loss. Channel loss is defined as the summation of
all losses through the PCB traces, vias, connectors, and cables present in the physical
link. The Quartus II software allows five equalization settings for Arria GX devices.
Receiver PLL and Clock Recovery Unit (CRU)
Each transceiver block has four receiver PLLs and CRU units, each of which is
dedicated to a receiver channel. The receiver PLL is fed by an input reference clock.
The receiver PLL, in conjunction with the CRU, generates two clocks: a high-speed
serial recovered clock that clocks the deserializer and a low-speed parallel recovered
clock that clocks the receiver's digital logic.
Figure 2–13 shows a block diagram of the receiver PLL and CRU circuits.
Figure 2–13. Receiver PLL and Clock Recovery Unit
/M
Dedicated
REFCLK0
rx_pll_locked
/2
PFD
Dedicated
/2
REFCLK1
Inter-Transceiver Lines [2:0]
rx_cruclk
up
dn
up
dn
CP+ LF
VCO
/L
Global Clock (2)
rx_locktorefclk
rx_locktodata
rx_freqlocked
Clock Recovery Unit (CRU) Control
High-speed serial recovered clk
Low-speed parallel recovered clk
rx_datain
Notes to Figure 2–13:
(1) You only need to select the protocol and the available input reference clock frequency in the ALTGXB MegaWizard Plug-In Manager. Based on your
selections, the ALTGXB MegaWizard Plug-In Manager automatically selects the necessary /M and /L dividers.
(2) The global clock line must be driven from an input pin only.
The reference clock input to the receiver PLL can be derived from:
■
One of the two available dedicated reference clock input pins (REFCLK0 or
REFCLK1) of the associated transceiver block
■
PLD global clock network (must be driven directly from an input clock pin and
cannot be driven by user logic or enhanced PLL)
■
Inter-transceiver block lines driven by reference clock input pins of other
transceiver blocks
All the parameters listed are programmable in the Quartus II software. The receiver
PLL has the following features:
■
Operates from 600 Mbps to 3.125 Gbps.
■
Uses a reference clock between 50 MHz and 622.08 MHz.
■
Programmable bandwidth settings: low, medium, and high.
■
Programmable rx_locktorefclk (forces the receiver PLL to lock to reference
clock) and rx_locktodata (forces the receiver PLL to lock to data).
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–13
■
The voltage-controlled oscillator (VCO) operates at half rate.
■
Programmable frequency multiplication W of 1, 4, 5, 8, 10, 16, 20, and 25. Not all
settings are supported for any particular frequency.
■
Two lock indication signals are provided. They are found in PFD mode
(lock-to-reference clock), and PD (lock-to-data).
The CRU controls whether the receiver PLL locks to the input reference clock
(lock-to-reference mode) or the incoming serial data (lock-to data mode). You can set
the CRU to switch between lock-to-data and lock-to-reference modes automatically or
manually. In automatic lock mode, the phase detector and dedicated parts per million
(PPM) detector within each receiver channel control the switch between lock-to-data
and lock-to-reference modes based on some pre-set conditions. In manual lock mode,
you can control the switch manually using the rx_locktorefclk and
rx_locktodata signals.
f
For more information, refer to the “Clock Recovery Unit” section in the Arria GX
Transceiver Protocol Support and Additional Features chapter.
Table 2–4 lists the behavior of the CRU block with respect to the rx_locktorefclk
and rx_locktodata signals.
Table 2–4. CRU Manual Lock Signals
rx_locktorefclk
rx_locktodata
CRU Mode
1
0
Lock-to-reference clock
x
1
Lock-to-data
0
0
Automatic
If the rx_locktorefclk and rx_locktodata ports are not used, the default
setting is automatic lock mode.
Deserializer
The deserializer block clocks in serial input data from the receiver buffer using the
high-speed serial recovered clock and deserializes into 8- or 10-bit parallel data using
the low-speed parallel recovered clock. The serial data is assumed to be received with
LSB first, followed by MSB. It feeds the deserialized 8- or 10-bit data to the word
aligner, as shown in Figure 2–14.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–14
Chapter 2: Arria GX Architecture
Transceivers
Figure 2–14. Deserializer (Note 1)
Received Data
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
10
To Word
Aligner
Clock
High-speed serial recovered clock
Recovery
Unit
Low -speed parallel recovered clock
Note to Figure 2–14:
(1) This is a 10-bit deserializer. The deserializer can also convert 8 bits of data.
Word Aligner
The deserializer block creates 8- or 10-bit parallel data. The deserializer ignores
protocol symbol boundaries when converting this data. Therefore, the boundaries of
the transferred words are arbitrary. The word aligner aligns the incoming data based
on specific byte or word boundaries. The word alignment module is clocked by the
local receiver recovered clock during normal operation. All the data and programmed
patterns are defined as “big-endian” (most significant word followed by least
significant word). Most-significant-bit-first protocols should reverse the bit order of
word align patterns programmed.
This module detects word boundaries for 8B/10B-based protocols. This module is
also used to align to specific programmable patterns in PRBS7/23 test mode.
Pattern Detection
The programmable pattern detection logic can be programmed to align word
boundaries using a single 7- or 10-bit pattern. The pattern detector can either do an
exact match, or match the exact pattern and the complement of a given pattern. Once
the programmed pattern is found, the data stream is aligned to have the pattern on
the LSB portion of the data output bus.
XAUI, GIGE, PCI Express (PIPE), and Serial RapidIO standards have embedded state
machines for symbol boundary synchronization. These standards use K28.5 as their
10-bit programmed comma pattern. Each of these standards uses different algorithms
before signaling symbol boundary acquisition to the FPGA.
Pattern detection logic searches from the LSB to the MSB. If multiple patterns are
found within the search window, the pattern in the lower portion of the data stream
(corresponding to the pattern received earlier) is aligned and the rest of the matching
patterns are ignored.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–15
Once a pattern is detected and the data bus is aligned, the word boundary is locked.
The two detection status signals (rx_syncstatus and rx_patterndetect)
indicate that an alignment is complete.
Figure 2–15 is a block diagram of the word aligner.
Figure 2–15. Word Aligner
datain
bitslip
Word
Aligner
enapatternalign
dataout
syncstatus
patterndetect
clock
Control and Status Signals
The rx_enapatternalign signal is the FPGA control signal that enables word
alignment in non-automatic modes. The rx_enapatternalign signal is not used in
automatic modes (PCI Express [PIPE], XAUI, GIGE, and Serial RapidIO).
In manual alignment mode, after the rx_enapatternalign signal is activated, the
rx_syncstatus signal goes high for one parallel clock cycle to indicate that the
alignment pattern has been detected and the word boundary has been locked. If
rx_enapatternalign is deactivated, the rx_syncstatus signal acts as a
re-synchronization signal to signify that the alignment pattern has been detected but
not locked on a different word boundary.
When using the synchronization state machine, the rx_syncstatus signal indicates
the link status. If the rx_syncstatus signal is high, link synchronization is
achieved. If the rx_syncstatus signal is low, link synchronization has not yet been
achieved, or there were enough code group errors to lose synchronization.
f
For more information about manual alignment modes, refer to the Arria GX Device
Handbook.
The rx_patterndetect signal pulses high during a new alignment and whenever
the alignment pattern occurs on the current word boundary.
Programmable Run Length Violation
The word aligner supports a programmable run length violation counter. Whenever
the number of the continuous ‘0’ (or ‘1’) exceeds a user programmable value, the
rx_rlv signal goes high for a minimum pulse width of two recovered clock cycles.
The maximum run values supported are 128 UI for 8-bit serialization or 160 UI for
10-bit serialization.
Running Disparity Check
The running disparity error rx_disperr and running disparity value
rx_runningdisp are sent along with aligned data from the 8B/10B decoder to the
FPGA. You can ignore or act on the reported running disparity value and running
disparity error signals.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–16
Chapter 2: Arria GX Architecture
Transceivers
Bit-Slip Mode
The word aligner can operate in either pattern detection mode or in bit-slip mode.
The bit-slip mode provides the option to manually shift the word boundary through
the FPGA. This feature is useful for:
■
Longer synchronization patterns than the pattern detector can accommodate
■
Scrambled data stream
■
Input stream consisting of over-sampled data
The word aligner outputs a word boundary as it is received from the analog receiver
after reset. You can examine the word and search its boundary in the FPGA. To do so,
assert the rx_bitslip signal. The rx_bitslip signal should be toggled and held
constant for at least two FPGA clock cycles.
For every rising edge of the rx_bitslip signal, the current word boundary is
slipped by one bit. Every time a bit is slipped, the bit received earliest is lost. If bit
slipping shifts a complete round of bus width, the word boundary is back to the
original boundary.
The rx_syncstatus signal is not available in bit-slipping mode.
Channel Aligner
The channel aligner is available only in XAUI mode and aligns the signals of all four
channels within a transceiver. The channel aligner follows the IEEE 802.3ae, clause 48
specification for channel bonding.
The channel aligner is a 16-word FIFO buffer with a state machine controlling the
channel bonding process. The state machine looks for an /A/ (/K28.3/) in each
channel and aligns all the /A/ code groups in the transceiver. When four columns of
/A/ (denoted by //A//) are detected, the rx_channelaligned signal goes high,
signifying that all the channels in the transceiver have been aligned. The reception of
four consecutive misaligned /A/ code groups restarts the channel alignment
sequence and sends the rx_channelaligned signal low.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–17
Figure 2–16 shows misaligned channels before the channel aligner and the aligned
channels after the channel aligner.
Figure 2–16. Before and After the Channel Aligner
Lane 3
Before
K
K
A
K
R
R
K
K
R
K
R
K
K
R
A
K
R
R
K
K
R
K
K
R
A
K
R
R
K
K
R
K
R
Lane 2
Lane 1
K
Lane 0
After
R
K
K
R
A
K
R
R
K
K
R
K
Lane 3
K
K
R
A
K
R
R
K
K
R
K
R
Lane 2
K
K
R
A
K
R
R
K
K
R
K
R
Lane 1
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
R
R
Rate Matcher
In asynchronous systems, the upstream transmitter and local receiver can be clocked
with independent reference clock sources. Frequency differences in the order of a few
hundred PPM can potentially corrupt the data at the receiver.
The rate matcher compensates for small clock frequency differences between the
upstream transmitter and the local receiver clocks by inserting or removing skip
characters from the inter packet gap (IPG) or idle streams. It inserts a skip character if
the local receiver is running a faster clock than the upstream transmitter. It deletes a
skip character if the local receiver is running a slower clock than the upstream
transmitter. The Quartus II software automatically configures the appropriate skip
character as specified in the IEEE 802.3 for GIGE mode and PCI-Express Base
Specification for PCI Express (PIPE) mode. The rate matcher is bypassed in Serial
RapidIO and must be implemented in the PLD logic array or external circuits
depending on your system design.
Table 2–5 lists the maximum frequency difference that the rate matcher can tolerate in
XAUI, PCI Express (PIPE), GIGE, and Basic functional modes.
Table 2–5. Rate Matcher PPM Tolerance
© December 2009
Altera Corporation
Function Mode
PPM
XAUI
± 100
PCI Express (PIPE)
± 300
GIGE
± 100
Basic
± 300
Arria GX Device Handbook, Volume 1
2–18
Chapter 2: Arria GX Architecture
Transceivers
XAUI Mode
In XAUI mode, the rate matcher adheres to clause 48 of the IEEE 802.3ae specification
for clock rate compensation. The rate matcher performs clock compensation on
columns of /R/ (/K28.0/), denoted by //R//. An //R// is added or deleted
automatically based on the number of words in the FIFO buffer.
PCI Express (PIPE) Mode Rate Matcher
In PCI Express (PIPE) mode, the rate matcher can compensate up to ± 300 PPM
(600 PPM total) frequency difference between the upstream transmitter and the
receiver. The rate matcher logic looks for skip ordered sets (SOS), which contains a
/K28.5/ comma followed by three /K28.0/ skip characters. The rate matcher logic
deletes or inserts /K28.0/ skip characters as necessary from/to the rate matcher FIFO.
The rate matcher in PCI Express (PIPE) mode has a FIFO buffer overflow and
underflow protection. In the event of a FIFO buffer overflow, the rate matcher deletes
any data after detecting the overflow condition to prevent FIFO pointer corruption
until the rate matcher is not full. In an underflow condition, the rate matcher inserts
9'h1FE (/K30.7/) until the FIFO buffer is not empty. These measures ensure that the
FIFO buffer can gracefully exit the overflow and underflow condition without
requiring a FIFO reset. The rate matcher FIFO overflow and underflow condition is
indicated on the pipestatus port.
You can bypass the rate matcher in PCI Express (PIPE) mode if you have a
synchronous system where the upstream transmitter and local receiver derive their
reference clocks from the same source.
GIGE Mode Rate Matcher
In GIGE mode, the rate matcher can compensate up to ± 100 PPM (200 PPM total)
frequency difference between the upstream transmitter and the receiver. The rate
matcher logic inserts or deletes /I2/ idle ordered sets to/from the rate matcher FIFO
during the inter-frame or inter-packet gap (IFG or IPG). /I2/ is selected as the rate
matching ordered set because it maintains the running disparity, unlike /I1/ that
alters the running disparity. Because the /I2/ ordered-set contains two 10-bit code
groups (/K28.5/, /D16.2/), 20 bits are inserted or deleted at a time for rate matching.
1
The rate matcher logic has the capability to insert or delete /C1/ or /C2/
configuration ordered sets when ‘GIGE Enhanced’ mode is chosen as the sub-protocol
in the MegaWizard Plug-In Manager.
If the frequency PPM difference between the upstream transmitter and the local
receiver is high, or if the packet size is too large, the rate matcher FIFO buffer can face
an overflow or underflow situation.
Basic Mode
In basic mode, you can program the skip and control pattern for rate matching. There
is no restriction on the deletion of a skip character in a cluster. The rate matcher
deletes the skip characters as long as they are available. For insertion, the rate matcher
inserts skip characters such that the number of skip characters at the output of rate
matcher does not exceed five.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–19
8B/10B Decoder
The 8B/10B decoder is used in all supported functional modes. The 8B/10B decoder
takes in 10-bit data from the rate matcher and decodes it into 8-bit data + 1-bit control
identifier, thereby restoring the original transmitted data at the receiver. The 8B/10B
decoder indicates whether the received 10-bit character is a data or control code
through the rx_ctrldetect port. If the received 10-bit code group is a control
character (Kx.y), the rx_ctrldetect signal is driven high and if it is a data
character (Dx.y), the rx_ctrldetect signal is driven low.
Figure 2–17 shows a 10-bit code group decoded to an 8-bit data and a 1-bit control
indicator.
Figure 2–17. 10-Bit to 8-Bit Conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB Received Last
LSB Received First
8B/10B Conversion
ctrl
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
Parallel Data
If the received 10-bit code is not a part of valid Dx.y or Kx.y code groups, the 8B/10B
decoder block asserts an error flag on the rx_errdetect port. If the received 10-bit
code is detected with incorrect running disparity, the 8B/10B decoder block asserts an
error flag on the rx_disperr and rx_errdetect ports. The error flag signals
(rx_errdetect and rx_disperr) have the same data path delay from the 8B/10B
decoder to the PLD-transceiver interface as the bad code group.
Receiver State Machine
The receiver state machine operates in Basic, GIGE, PCI Express (PIPE), and XAUI
modes. In GIGE mode, the receiver state machine replaces invalid code groups with
K30.7. In XAUI mode, the receiver state machine translates the XAUI PCS code group
to the XAUI XGMII code group.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–20
Chapter 2: Arria GX Architecture
Transceivers
Byte Deserializer
Byte deserializer takes in one-byte wide data from the 8B/10B decoder and
deserializes it into a two-byte wide data at half the speed. This allows clocking the
PLD-receiver interface at half the speed as compared to the receiver PCS logic. The
byte deserializer is bypassed in GIGE mode.
The byte ordering at the receiver output might be different than what was
transmitted. This is a non-deterministic swap, because it depends on PLL lock times
and link delay. If required, you must implement byte ordering logic in the PLD to
correct this situation.
f
For more information about byte serializer, refer to the Arria GX Transceiver
Architecture chapter.
Receiver Phase Compensation FIFO Buffer
A receiver phase compensation FIFO buffer is located at each receiver channel’s logic
array interface. It compensates for the phase difference between the receiver PCS
clock and the local PLD receiver clock. The receiver phase compensation FIFO is used
in all supported functional modes. The receiver phase compensation FIFO buffer is
eight words deep in PCI Express (PIPE) mode and four words deep in all other
modes.
f
For more information about architecture and clocking, refer to the Arria GX Transceiver
Architecture chapter.
Loopback Modes
Arria GX transceivers support the following loopback configurations for diagnostic
purposes:
■
Serial loopback
■
Reverse serial loopback
■
Reverse serial loopback (pre-CDR)
■
PCI Express (PIPE) reverse parallel loopback (available only in [PIPE] mode)
Serial Loopback
Figure 2–18 shows the transceiver data path in serial loopback.
Figure 2–18. Transceiver Data Path in Serial Loopback
Transmitter PCS
TX Phase
Compensation
FIFO
Byte
Serializer
Transmitter PMA
8B/10B
Encoder
Serializer
PLD
Logic
Array
Serial Loopback
Receiver PCS
RX Phase
Compensation
FIFO
Arria GX Device Handbook, Volume 1
Byte
DeSerializer
8B/10B
Decoder
Rate
Match
FIFO
Word
Aligner
Receiver PMA
DeSerializer
Clock
Recovery
Unit
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–21
In GIGE and Serial RapidIO modes, you can dynamically put each transceiver
channel individually in serial loopback by controlling the rx_seriallpbken port. A
high on the rx_seriallpbken port puts the transceiver into serial loopback and a
low takes the transceiver out of serial loopback.
As seen in Figure 2–18, the serial data output from the transmitter serializer is looped
back to the receiver CRU in serial loopback. The transmitter data path from the PLD
interface to the serializer in serial loopback is the same as in non-loopback mode. The
receiver data path from the clock recovery unit to the PLD interface in serial loopback
is the same as in non-loopback mode. Because the entire transceiver data path is
available in serial loopback, this option is often used to diagnose the data path as a
probable cause of link errors.
1
When serial loopback is enabled, the transmitter output buffer is still active and
drives the serial data out on the tx_dataout port.
Reverse Serial Loopback
Reverse serial loopback mode uses the analog portion of the transceiver. An external
source (pattern generator or transceiver) generates the source data. The high-speed
serial source data arrives at the high-speed differential receiver input buffer, passes
through the CRU unit and the retimed serial data is looped back, and is transmitted
though the high-speed differential transmitter output buffer.
Figure 2–19 shows the data path in reverse serial loopback mode.
Figure 2–19. Arria GX Block in Reverse Serial Loopback Mode
Transmitter Digital Logic
BIST
PRBS
Generator
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
Analog Receiver and
Transmitter Logic
Byte
Serializer
8B/10B
20 Encoder
Serializer
FPGA
Logic
Array
Reverse
Serial
Loopback
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
BIST
PRBS
Verify
Byte
Deserializer
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–22
Chapter 2: Arria GX Architecture
Transceivers
Reverse Serial Pre-CDR Loopback
Reverse serial pre-CDR loopback mode uses the analog portion of the transceiver. An
external source (pattern generator or transceiver) generates the source data. The
high-speed serial source data arrives at the high-speed differential receiver input
buffer, loops back before the CRU unit, and is transmitted though the high-speed
differential transmitter output buffer. It is for test or verification use only to verify the
signal being received after the gain and equalization improvements of the input
buffer. The signal at the output is not exactly what is received because the signal goes
through the output buffer and the VO D is changed to the VOD setting level.
Pre-emphasis settings have no effect.
Figure 2–20 shows the Arria GX block in reverse serial pre-CDR loopback mode.
Figure 2–20. Arria GX Block in Reverse Serial Pre-CDR Loopback Mode
Transmitter Digital Logic
Analog Receiver and
Transmitter Logic
BIST
PRBS
Generator
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
Byte
Serializer
8B/10B
20 Encoder
Serializer
FPGA
Logic
Array
BIST
Incremental
Verify
Reverse
Serial
Pre-CDR
Loopback
BIST
PRBS
Verify
Byte
Deserializer
RX Phase
Compensation
FIFO
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
PCI Express (PIPE) Reverse Parallel Loopback
Figure 2–21 shows the data path for PCI Express (PIPE) reverse parallel loopback. The
reverse parallel loopback configuration is compliant with the PCI Express (PIPE)
specification and is available only on PCI Express (PIPE) mode.
Figure 2–21. PCI Express (PIPE) Reverse Parallel Loopback
Transmitter PCS
TX Phase
Compensation
FIFO
Byte
Serializer
Transmitter PMA
8B/10B
Encoder
PIPE
Interface
Serializer
PIPE Reverse
Parallel Loopback
Receiver PCS
RX Phase
Compensation
FIFO
Arria GX Device Handbook, Volume 1
Byte
DeSerializer
8B/10B
Decoder
Rate
Match
FIFO
Word
Aligner
Receiver PMA
DeSerializer
Clock
Recovery
Unit
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–23
You can dynamically put the PCI Express (PIPE) mode transceiver in reverse parallel
loopback by controlling the tx_detectrxloopback port instantiated in the
MegaWizard Plug-In Manager. A high on the tx_detectrxloopback port in P0
power state puts the transceiver in reverse parallel loopback. A high on the
tx_detectrxloopback port in any other power state does not put the transceiver
in reverse parallel loopback.
As seen in Figure 2–21, the serial data received on the rx_datain port in reverse
parallel loopback goes through the CRU, deserializer, word aligner, and the rate
matcher blocks. The parallel data at the output of the receiver rate matcher block is
looped back to the input of the transmitter serializer block. The serializer converts the
parallel data to serial data and feeds it to the transmitter output buffer that drives the
data out on the tx_dataout port. The data at the output of the rate matcher also
goes through the 8B/10B decoder, byte deserializer, and receiver phase compensation
FIFO before being fed to the PLD on the rx_dataout port.
Reset and Powerdown
Arria GX transceivers offer a power saving advantage with their ability to shut off
functions that are not needed.
The following three reset signals are available per transceiver channel and can be used
to individually reset the digital and analog portions within each channel:
■
tx_digitalreset
■
rx_analogreset
■
rx_digitalreset
The following two powerdown signals are available per transceiver block and can be
used to shut down an entire transceiver block that is not being used:
© December 2009
■
gxb_powerdown
■
gxb_enable
Altera Corporation
Arria GX Device Handbook, Volume 1
2–24
Chapter 2: Arria GX Architecture
Transceivers
Table 2–6 lists the reset signals available in Arria GX devices and the transceiver
circuitry affected by each signal.
Reset Signal
Transmitter Phase Compensation FIFO Module/ Byte Serializer
Transmitter 8B/10B Encoder
Transmitter Serializer
Transmitter Analog Circuits
Transmitter PLL
Transmitter XAUI State Machine
BIST Generators
Receiver Deserializer
Receiver Word Aligner
Receiver Deskew FIFO Module
Receiver Rate Matcher
Receiver 8B/10B Decoder
Receiver Phase Comp FIFO Module/ Byte Deserializer
Receiver PLL / CRU
Receiver XAUI State Machine
BIST Verifiers
Receiver Analog Circuits
Table 2–6. Reset Signal Map to Arria GX Blocks
rx_digitalreset
—
—
—
—
—
—
—
—
v
—
v
v
v
—
v
v
—
rx_analogreset
—
—
—
—
—
—
—
v
—
—
—
—
—
v
—
—
v
tx_digitalreset
v
v
—
—
—
v
v
—
—
—
—
—
—
—
—
—
—
gxb_powerdown
v
v
v
v
v
v
v
v
v
—
v
v
v
v
v
v
v
gxb_enable
v
v
v
v
v
v
v
v
v
—
v
v
v
v
v
v
v
Calibration Block
Arria GX devices use the calibration block to calibrate OCT for the PLLs, and their
associated output buffers, and the terminating resistors on the transceivers. The
calibration block counters the effects of process, voltage, and temperature (PVT). The
calibration block references a derived voltage across an external reference resistor to
calibrate the OCT resistors on Arria GX devices. You can power down the calibration
block. However, powering down the calibration block during operations can yield
transmit and receive data errors.
Transceiver Clocking
This section describes the clock distribution in an Arria GX transceiver channel and
the PLD clock resource utilization by the transceiver blocks.
Transceiver Channel Clock Distribution
Each transceiver block has one transmitter PLL and four receiver PLLs.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–25
The transmitter PLL multiplies the input reference clock to generate a high-speed
serial clock at a frequency that is half the data rate of the configured functional mode.
This high-speed serial clock (or its divide-by-two version if the functional mode uses
byte serializer) is fed to the CMU clock divider block. Depending on the configured
functional mode, the CMU clock divider block divides the high-speed serial clock to
generate the low-speed parallel clock that clocks the transceiver PCS logic in the
associated channel. The low-speed parallel clock is also forwarded to the PLD logic
array on the tx_clkout or coreclkout ports.
The receiver PLL in each channel is also fed by an input reference clock. The receiver
PLL along with the clock recovery unit generates a high-speed serial recovered clock
and a low-speed parallel recovered clock. The low-speed parallel recovered clock
feeds the receiver PCS logic until the rate matcher. The CMU low-speed parallel clock
clocks the rest of the logic from the rate matcher until the receiver phase
compensation FIFO. In modes that do not use a rate matcher, the receiver PCS logic is
clocked by the recovered clock until the receiver phase compensation FIFO.
The input reference clock to the transmitter and receiver PLLs can be derived from:
■
One of two available dedicated reference clock input pins (REFCLK0 or REFCLK1)
of the associated transceiver block
■
PLD clock network (must be driven directly from an input clock pin and cannot be
driven by user logic or enhanced PLL)
■
Inter-transceiver block lines driven by reference clock input pins of other
transceiver blocks
Figure 2–22 shows the input reference clock sources for the transmitter and receiver
PLL.
Figure 2–22. Input Reference Clock Sources
Inter-Transceiver Lines [2]
Transceiver Block 2
Inter-Transceiver Lines [1]
Transceiver Block 1
Transceiver Block 0
Inter-Transceiver Lines [0]
Dedicated
REFCLK0
/2
Dedicated
REFCLK1
/2
Transmitter
PLL
Inter-Transceiver Lines [2:0]
Global Clock (1)
Four
Receiver
PLLs
Global Clock (1)
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–26
Chapter 2: Arria GX Architecture
Transceivers
f
For more information about transceiver clocking in all supported functional modes,
refer to the Arria GX Transceiver Architecture chapter.
PLD Clock Utilization by Transceiver Blocks
Arria GX devices have up to 16 global clock (GCLK) lines and 16 regional clock
(RCLK) lines that are used to route the transceiver clocks. The following transceiver
clocks use the available global and regional clock resources:
■
pll_inclk (if driven from an FPGA input pin)
■
rx_cruclk (if driven from an FPGA input pin)
■
tx_clkout/coreclkout (CMU low-speed parallel clock forwarded to the PLD)
■
Recovered clock from each channel (rx_clkout) in non-rate matcher mode
■
Calibration clock (cal_blk_clk)
■
Fixed clock (fixedclk used for receiver detect circuitry in PCI Express [PIPE]
mode only)
Figure 2–23 and Figure 2–24 show the available GCLK and RCLK resources in Arria
GX devices.
Figure 2–23. Global Clock Resources in Arria GX Devices
CLK[15..12]
11 5
7
Arria GX
Transceiver
Block
GCLK[15..12]
CLK[3..0]
1
2
GCLK[11..8]
GCLK[3..0]
GCLK[4..7]
Arria GX
Transceiver
Block
8
12 6
CLK[7..4]
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Transceivers
2–27
Figure 2–24. Regional Clock Resources in Arria GX Devices
CLK[15..12]
11 5
7
CLK[3..0]
RCLK
[31..28]
RCLK
[27..24]
RCLK
[3..0]
RCLK
[23..20]
RCLK
[7..4]
RCLK
[19..16]
Arria GX
Transceiver
Block
1
2
RCLK
[11..8]
8
Arria GX
Transceiver
Block
RCLK
[15..12]
12 6
CLK[7..4]
For the RCLK or GCLK network to route into the transceiver, a local route input
output (LRIO) channel is required. Each LRIO clock region has up to eight clock paths
and each transceiver block has a maximum of eight clock paths for connecting with
LRIO clocks. These resources are limited and determine the number of clocks that can
be used between the PLD and transceiver blocks. Table 2–7 and Table 2–8 list the
number of LRIO resources available for Arria GX devices with different numbers of
transceiver blocks.
Table 2–7. Available Clocking Connections for Transceivers in EP1AGX35D, EP1AGX50D, and EP1AGX60D
Clock Resource
Source
Transceiver
Global Clock
Regional Clock
Bank13
8 Clock I/O
Bank14
8 Clock I/O
Region0 8 LRIO clock
v
RCLK 20-27
v
—
Region1 8 LRIO clock
v
RCLK 12-19
—
v
Table 2–8. Available Clocking Connections for Transceivers in EP1AGX60E and EP1AGX90E
Clock Resource
Source
Transceiver
Global Clock
Regional Clock
Bank13
8 Clock I/O
Bank14
8 Clock I/O
Bank15
8 Clock I/O
Region0 8 LRIO clock
v
RCLK 20-27
v
—
—
Region1 8 LRIO clock
v
RCLK 20-27
v
v
—
Region2 8 LRIO clock
v
RCLK 12-19
—
v
v
Region3 8 LRIO clock
v
RCLK 12-19
—
—
v
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–28
Chapter 2: Arria GX Architecture
Logic Array Blocks
Logic Array Blocks
Each logic array block (LAB) consists of eight adaptive logic modules (ALMs), carry
chains, shared arithmetic chains, LAB control signals, local interconnects, and register
chain connection lines. The local interconnect transfers signals between ALMs in the
same LAB. Register chain connections transfer the output of an ALM register to the
adjacent ALM register in a LAB. The Quartus II Compiler places associated logic in a
LAB or adjacent LABs, allowing the use of local, shared arithmetic chain, and register
chain connections for performance and area efficiency. Table 2–9 lists Arria GX device
resources. Figure 2–25 shows the Arria GX LAB structure.
Table 2–9. Arria GX Device Resources
M512 RAM
Columns/Blocks
M4K RAM
Columns/Blocks
M-RAM Blocks
DSP Block
Columns/Blocks
EP1AGX20
166
118
1
10
EP1AGX35
197
140
1
14
EP1AGX50
313
242
2
26
EP1AGX60
326
252
2
32
EP1AGX90
478
400
4
44
Device
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Logic Array Blocks
2–29
Figure 2–25. Arria GX LAB Structure
Row Interconnects of
Variable Speed & Length
ALMs
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
LAB
Local Interconnect is Driven
from Either Side by Columns & LABs,
& from Above by Rows
Column Interconnects of
Variable Speed & Length
LAB Interconnects
The LAB local interconnect can drive all eight ALMs in the same LAB. It is driven by
column and row interconnects and ALM outputs in the same LAB. Neighboring
LABs, M512 RAM blocks, M4K RAM blocks, M-RAM blocks, or digital signal
processing (DSP) blocks from the left and right can also drive the local interconnect of
a LAB through the direct link connection. The direct link connection feature
minimizes the use of row and column interconnects, providing higher performance
and flexibility. Each ALM can drive 24 ALMs through fast local and direct link
interconnects.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–30
Chapter 2: Arria GX Architecture
Logic Array Blocks
Figure 2–26 shows the direct link connection.
Figure 2–26. Direct Link Connection
Direct link interconnect from
left LAB, TriMatrixTM memory
block, DSP block, or
input/output element (IOE)
Direct link interconnect from
right LAB, TriMatrix memory
block, DSP block, or IOE output
ALMs
Direct link
interconnect
to right
Direct link
interconnect
to left
Local
Interconnect
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its ALMs. The control
signals include three clocks, three clock enables, two asynchronous clears,
synchronous clear, asynchronous preset or load, and synchronous load control
signals, providing a maximum of 11 control signals at a time. Although synchronous
load and clear signals are generally used when implementing counters, they can also
be used with other functions.
Each LAB can use three clocks and three clock enable signals. However, there can only
be up to two unique clocks per LAB, as shown in the LAB control signal generation
circuit in Figure 2–27. Each LAB’s clock and clock enable signals are linked. For
example, any ALM in a particular LAB using the labclk1 signal also uses
labclkena1. If the LAB uses both the rising and falling edges of a clock, it also uses
two LAB-wide clock signals. De-asserting the clock enable signal turns off the
corresponding LAB-wide clock. Each LAB can use two asynchronous clear signals
and an asynchronous load/preset signal. The asynchronous load acts as a preset
when the asynchronous load data input is tied high. When the asynchronous
load/preset signal is used, the labclkena0 signal is no longer available.
The LAB row clocks [5..0] and LAB local interconnect generate the LAB-wide
control signals. The MultiTrack interconnects have inherently low skew. This low
skew allows the MultiTrack interconnects to distribute clock and control signals in
addition to data.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–31
Figure 2–27 shows the LAB control signal generation circuit.
Figure 2–27. LAB-Wide Control Signals
There are two unique
clock signals per LAB.
6
Dedicated Row LAB Clocks
6
6
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
labclk0
labclk1
labclkena0
or asyncload
or labpreset
labclk2
labclkena1
labclkena2
labclr1
syncload
labclr0
synclr
Adaptive Logic Modules
The basic building block of logic in the Arria GX architecture is the ALM. The ALM
provides advanced features with efficient logic utilization. Each ALM contains a
variety of look-up table (LUT)-based resources that can be divided between two
adaptive LUTs (ALUTs). With up to eight inputs to the two ALUTs, one ALM can
implement various combinations of two functions. This adaptability allows the ALM
to be completely backward-compatible with four-input LUT architectures. One ALM
can also implement any function of up to six inputs and certain seven-input functions.
In addition to the adaptive LUT-based resources, each ALM contains two
programmable registers, two dedicated full adders, a carry chain, a shared arithmetic
chain, and a register chain. Through these dedicated resources, the ALM can
efficiently implement various arithmetic functions and shift registers. Each ALM
drives all types of interconnects: local, row, column, carry chain, shared arithmetic
chain, register chain, and direct link interconnects. Figure 2–28 shows a high-level
block diagram of the Arria GX ALM while Figure 2–29 shows a detailed view of all
the connections in the ALM.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–32
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
Figure 2–28. High-Level Block Diagram of the Arria GX ALM
carry_in
shared_arith_in
reg_chain_in
To general or
local routing
dataf0
adder0
datae0
D
dataa
datab
datac
Q
To general or
local routing
reg0
Combinational
Logic
datad
adder1
D
Q
datae1
To general or
local routing
reg1
dataf1
To general or
local routing
carry_out
shared_arith_out
Arria GX Device Handbook, Volume 1
reg_chain_out
© December 2009
Altera Corporation
© December 2009
Altera Corporation
datac
dataa
datab
Local
Interconnect
Local
Interconnect
Local
datae1
dataf1
Local
Interconnect
Local
Interconnect
Local
Interconnect
datad
datae0
Local
Interconnect
Interconnect
dataf0
Local
Interconnect
3-Input
LUT
3-Input
LUT
4-Input
LUT
3-Input
LUT
3-Input
LUT
4-Input
LUT
shared_arith_out
shared_arith_in
carry_out
carry_in
VCC
sclr
syncload
reg_chain_out
reg_chain_in
clk[2..0]
aclr[1..0]
ENA
CLRN
PRN/ALD
D
Q
ADATA
ENA
CLRN
PRN/ALD
D
Q
ADATA
asyncload
ena[2..0]
Local
Interconnect
Row, column &
direct link routing
Row, column &
direct link routing
Local
Interconnect
Row, column &
direct link routing
Row, column &
direct link routing
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–33
Figure 2–29. Arria GX ALM Details
Arria GX Device Handbook, Volume 1
2–34
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
One ALM contains two programmable registers. Each register has data, clock, clock
enable, synchronous and asynchronous clear, asynchronous load data, and
synchronous and asynchronous load/preset inputs.
Global signals, general-purpose I/O pins, or any internal logic can drive the register's
clock and clear control signals. Either general-purpose I/O pins or internal logic can
drive the clock enable, preset, asynchronous load, and asynchronous load data. The
asynchronous load data input comes from the datae or dataf input of the ALM,
which are the same inputs that can be used for register packing. For combinational
functions, the register is bypassed and the output of the LUT drives directly to the
outputs of the ALM.
Each ALM has two sets of outputs that drive the local, row, and column routing
resources. The LUT, adder, or register output can drive these output drivers
independently (refer to Figure 2–29). For each set of output drivers, two ALM outputs
can drive column, row, or direct link routing connections. One of these ALM outputs
can also drive local interconnect resources. This allows the LUT or adder to drive one
output while the register drives another output. This feature, called register packing,
improves device utilization because the device can use the register and combinational
logic for unrelated functions. Another special packing mode allows the register
output to feed back into the LUT of the same ALM so that the register is packed with
its own fan-out LUT. This feature provides another mechanism for improved fitting.
The ALM can also drive out registered and unregistered versions of the LUT or adder
output.
ALM Operating Modes
The Arria GX ALM can operate in one of the following modes:
■
Normal mode
■
Extended LUT mode
■
Arithmetic mode
■
Shared arithmetic mode
Each mode uses ALM resources differently. Each mode has 11 available inputs to the
ALM (refer to Figure 2–28)the eight data inputs from the LAB local interconnect;
carry-in from the previous ALM or LAB; the shared arithmetic chain connection from
the previous ALM or LAB; and the register chain connectionare directed to different
destinations to implement the desired logic function. LAB-wide signals provide clock,
asynchronous clear, asynchronous preset/load, synchronous clear, synchronous load,
and clock enable control for the register. These LAB-wide signals are available in all
ALM modes. For more information about LAB-wide control signals, refer to “LAB
Control Signals” on page 2–30.
The Quartus II software and supported third-party synthesis tools, in conjunction
with parameterized functions such as library of parameterized modules (LPM)
functions, automatically choose the appropriate mode for common functions such as
counters, adders, subtractors, and arithmetic functions. If required, you can also
create special-purpose functions that specify which ALM operating mode to use for
optimal performance.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–35
Normal Mode
Normal mode is suitable for general logic applications and combinational functions.
In this mode, up to eight data inputs from the LAB local interconnect are inputs to the
combinational logic. Normal mode allows two functions to be implemented in one
Arria GX ALM, or an ALM to implement a single function of up to six inputs. The
ALM can support certain combinations of completely independent functions and
various combinations of functions which have common inputs. Figure 2–30 shows the
supported LUT combinations in normal mode.
Figure 2–30. ALM in Normal Mode
(Note 1)
dataf0
datae0
datac
dataa
4-Input
LUT
combout0
datab
datad
datae1
dataf1
4-Input
LUT
combout1
dataf0
datae0
datac
dataa
datab
5-Input
LUT
combout0
datad
datae1
dataf1
3-Input
LUT
dataf0
datae0
datac
dataa
datab
datad
datae1
dataf1
5-Input
LUT
4-Input
LUT
dataf0
datae0
datac
dataa
datab
5-Input
LUT
combout0
5-Input
LUT
combout1
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
combout0
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
combout0
6-Input
LUT
combout1
datad
datae1
dataf1
combout1
combout0
combout1
datae1
dataf1
Note to Figure 2–30:
(1) Combinations of functions with less inputs than those shown are also supported. For example, combinations of functions with the following
number of inputs are supported: 4 and 3, 3 and 3, 3 and 2, 5 and 2, and so on.
Normal mode provides complete backward compatibility with four-input LUT
architectures. Two independent functions of four inputs or less can be implemented in
one Arria GX ALM. In addition, a five-input function and an independent three-input
function can be implemented without sharing inputs.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–36
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
To pack two five-input functions into one ALM, the functions must have at least two
common inputs. The common inputs are dataa and datab. The combination of a
four-input function with a five-input function requires one common input
(either dataa or datab).
To implement two six-input functions in one ALM, four inputs must be shared and
the combinational function must be the same. For example, a 4 × 2 crossbar switch
(two 4-to-1 multiplexers with common inputs and unique select lines) can be
implemented in one ALM, as shown in Figure 2–31. The shared inputs are dataa,
datab, datac, and datad, while the unique select lines are datae0 and dataf0 for
function0, and datae1 and dataf1 for function1. This crossbar switch
consumes four LUTs in a four-input LUT-based architecture.
Figure 2–31. 4 × 2 Crossbar Switch Example
4 ´ 2 Crossbar Switch
sel0[1..0]
inputa
inputb
out0
inputc
inputd
Implementation in 1 ALM
dataf0
datae0
dataa
datab
datac
datad
Six-Input
LUT
(Function0)
combout0
Six-Input
LUT
(Function1)
combout1
out1
sel1[1..0]
datae1
dataf1
In a sparsely used device, functions that can be placed into one ALM can be
implemented in separate ALMs. The Quartus II Compiler spreads a design out to
achieve the best possible performance. As a device begins to fill up, the Quartus II
software automatically uses the full potential of the Arria GX ALM. The Quartus II
Compiler automatically searches for functions of common inputs or completely
independent functions to be placed into one ALM and to make efficient use of the
device resources. In addition, you can manually control resource usage by setting
location assignments. Any six-input function can be implemented utilizing inputs
dataa, datab, datac, datad, and either datae0 and dataf0 or datae1 and
dataf1. If datae0 and dataf0 are used, the output is driven to register0,
and/or register0 is bypassed and the data drives out to the interconnect using the
top set of output drivers (refer to Figure 2–32). If datae1 and dataf1 are used, the
output drives to register1 and/or bypasses register1 and drives to the
interconnect using the bottom set of output drivers. The Quartus II Compiler
automatically selects the inputs to the LUT. Asynchronous load data for the register
comes from the datae or dataf input of the ALM. ALMs in normal mode support
register packing.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–37
Figure 2–32. Six-Input Function in Normal Mode Note (1), (2)
dataf0
datae0
dataa
datab
datac
datad
To general or
local routing
6-Input
LUT
D
Q
To general or
local routing
reg0
datae1
dataf1
(2)
D
These inputs are available for register packing.
Q
To general or
local routing
reg1
Notes to Figure 2–32:
(1) If datae1 and dataf1 are used as inputs to the six-input function, datae0 and dataf0 are available for register
packing.
(2) The dataf1 input is available for register packing only if the six-input function is un-registered.
Extended LUT Mode
Extended LUT mode is used to implement a specific set of seven-input functions. The
set must be a 2-to-1 multiplexer fed by two arbitrary five-input functions sharing four
inputs. Figure 2–33 shows the template of supported seven-input functions utilizing
extended LUT mode. In this mode, if the seven-input function is unregistered, the
unused eighth input is available for register packing. Functions that fit into the
template shown in Figure 2–33 occur naturally in designs. These functions often
appear in designs as “if-else” statements in Verilog HDL or VHDL code.
Figure 2–33. Template for Supported Seven-Input Functions in Extended LUT Mode
datae0
datac
dataa
datab
datad
dataf0
5-Input
LUT
To general or
local routing
combout0
D
5-Input
LUT
Q
To general or
local routing
reg0
datae1
dataf1
(1)
This input is available
for register packing.
Note to Figure 2–33:
(1) If the seven-input function is unregistered, the unused eighth input is available for register packing. The second register, reg1, is not available.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–38
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
Arithmetic Mode
Arithmetic mode is ideal for implementing adders, counters, accumulators, wide
parity functions, and comparators. An ALM in arithmetic mode uses two sets of 2
four-input LUTs along with two dedicated full adders. The dedicated adders allow
the LUTs to be available to perform pre-adder logic; therefore, each adder can add the
output of two four-input functions. The four LUTs share the dataa and datab
inputs. As shown in Figure 2–34, the carry-in signal feeds to adder0, and the
carry-out from adder0 feeds to carry-in of adder1. The carry-out from adder1
drives to adder0 of the next ALM in the LAB. ALMs in arithmetic mode can drive
out registered and/or unregistered versions of the adder outputs.
Figure 2–34. ALM in Arithmetic Mode
carry_in
adder0
datae0
4-Input
LUT
To general or
local routing
D
dataf0
datac
datab
dataa
Q
To general or
local routing
reg0
4-Input
LUT
adder1
datad
datae1
4-Input
LUT
To general or
local routing
D
4-Input
LUT
Q
To general or
local routing
reg1
dataf1
carry_out
While operating in arithmetic mode, the ALM can support simultaneous use of the
adder’s carry output along with combinational logic outputs. In this operation, adder
output is ignored. This usage of the adder with the combinational logic output
provides resource savings of up to 50% for functions that can use this ability. An
example of such functionality is a conditional operation, such as the one shown in
Figure 2–35. The equation for this example is:
Equation 2–1.
R = (X < Y) ? Y : X
To implement this function, the adder is used to subtract ‘Y’ from ‘X.’ If ‘X’ is less than
‘Y,’ the carry_out signal is ‘1.’ The carry_out signal is fed to an adder where it
drives out to the LAB local interconnect. It then feeds to the LAB-wide syncload
signal. When asserted, syncload selects the syncdata input. In this case, the data
‘Y’ drives the syncdata inputs to the registers. If ‘X’ is greater than or equal to ‘Y,’ the
syncload signal is deasserted and ‘X’ drives the data port of the registers.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–39
Figure 2–35. Conditional Operation Example
Adder output
is not used.
ALM 1
X[0]
Comb &
Adder
Logic
Y[0]
X[0]
D
R[0]
To general or
local routing
R[1]
To general or
local routing
R[2]
To general or
local routing
Q
reg0
syncdata
syncload
X[1]
Comb &
Adder
Logic
Y[1]
X[1]
D
Q
reg1
syncload
Carry Chain
ALM 2
X[2]
Y[2]
Comb &
Adder
Logic
X[2]
D
Q
reg0
syncload
Comb &
Adder
Logic
carry_out
To local routing &
then to LAB-wide
syncload
Arithmetic mode also offers clock enable, counter enable, synchronous up/down
control, add/subtract control, synchronous clear, and synchronous load. The LAB
local interconnect data inputs generate the clock enable, counter enable, synchronous
up/down and add/subtract control signals. These control signals can be used for the
inputs that are shared between the four LUTs in the ALM. The synchronous clear and
synchronous load options are LAB-wide signals that affect all registers in the LAB.
The Quartus II software automatically places any registers that are not used by the
counter into other LABs.
Carry Chain
Carry chain provides a fast carry function between the dedicated adders in arithmetic
or shared arithmetic mode. Carry chains can begin in either the first ALM or the fifth
ALM in a LAB. The final carry-out signal is routed to an ALM, where it is fed to local,
row, or column interconnects.
The Quartus II Compiler automatically creates carry chain logic during compilation,
or you can create it manually during design entry. Parameterized functions such as
LPM functions automatically take advantage of carry chains for the appropriate
functions. The Quartus II Compiler creates carry chains longer than 16 (8 ALMs in
arithmetic or shared arithmetic mode) by linking LABs together automatically. For
enhanced fitting, a long carry chain runs vertically allowing fast horizontal
connections to TriMatrix memory and DSP blocks. A carry chain can continue as far as
a full column. To avoid routing congestion in one small area of the device when a high
fan-in arithmetic function is implemented, the LAB can support carry chains that only
use either the top half or bottom half of the LAB before connecting to the next LAB.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–40
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
The other half of the ALMs in the LAB is available for implementing narrower fan-in
functions in normal mode. Carry chains that use the top four ALMs in the first LAB
carries into the top half of the ALMs in the next LAB within the column. Carry chains
that use the bottom four ALMs in the first LAB carries into the bottom half of the
ALMs in the next LAB within the column. Every other column of the LABs are
top-half bypassable, while the other LAB columns are bottom-half bypassable. For
more information about carry chain interconnect, refer to “MultiTrack Interconnect”
on page 2–44.
Shared Arithmetic Mode
In shared arithmetic mode, the ALM can implement a three-input add. In this mode,
the ALM is configured with four 4-input LUTs. Each LUT either computes the sum of
three inputs or the carry of three inputs. The output of the carry computation is fed to
the next adder (either to adder1 in the same ALM or to adder0 of the next ALM in
the LAB) using a dedicated connection called the shared arithmetic chain. This shared
arithmetic chain can significantly improve the performance of an adder tree by
reducing the number of summation stages required to implement an adder tree.
Figure 2–36 shows the ALM in shared arithmetic mode.
Figure 2–36. ALM in Shared Arithmetic Mode
shared_arith_in
carry_in
4-Input
LUT
To general or
local routing
D
datae0
datac
datab
dataa
datad
datae1
Q
To general or
local routing
reg0
4-Input
LUT
4-Input
LUT
To general or
local routing
D
4-Input
LUT
Q
To general or
local routing
reg1
carry_out
shared_arith_out
Note to Figure 2–36:
(1) Inputs dataf0 and dataf1 are available for register packing in shared arithmetic mode.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
2–41
Adder trees are used in many different applications. For example, the summation of
partial products in a logic-based multiplier can be implemented in a tree structure.
Another example is a correlator function that can use a large adder tree to sum filtered
data samples in a given time frame to recover or to de-spread data which was
transmitted utilizing spread spectrum technology. An example of a three-bit add
operation utilizing the shared arithmetic mode is shown in Figure 2–37. The partial
sum (S[2..0]) and the partial carry (C[2..0]) is obtained using LUTs, while the
result (R[2..0]) is computed using dedicated adders.
Figure 2–37. Example of a 3-Bit Add Utilizing Shared Arithmetic Mode
shared_arith_in = '0'
carry_in = '0'
3-Bit Add Example
ALM Implementation
ALM 1
1st stage add is
implemented in LUTs.
X2 X1 X0
Y2 Y1 Y0
+ Z2 Z1 Z0
2nd stage add is
implemented in adders.
S2 S1 S0
+ C2 C1 C0
R3 R2 R1 R0
Binary Add
Decimal
Equivalents
1 1 0
1 0 1
+ 0 1 0
6
5
+ 2
0 0 1
+ 1 1 0
1
+ 2x6
1 1 0 1
13
3-Input
LUT
S0
R0
X0
Y0
Z0
3-Input
LUT
C0
X1
Y1
Z1
3-Input
LUT
S1
R1
3-Input
LUT
C1
3-Input
LUT
S2
ALM 2
R2
X2
Y2
Z2
3-Input
LUT
C2
3-Input
LUT
'0'
R3
3-Input
LUT
Shared Arithmetic Chain
In addition to dedicated carry chain routing, the shared arithmetic chain available in
shared arithmetic mode allows the ALM to implement a three-input add, which
significantly reduces the resources necessary to implement large adder trees or
correlator functions. Shared arithmetic chains can begin in either the first or fifth ALM
in a LAB. The Quartus II Compiler automatically links LABs to create shared
arithmetic chains longer than 16 (eight ALMs in arithmetic or shared arithmetic
mode). For enhanced fitting, a long shared arithmetic chain runs vertically allowing
fast horizontal connections to TriMatrix memory and DSP blocks. A shared arithmetic
chain can continue as far as a full column. Similar to carry chains, shared arithmetic
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–42
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
chains are also top- or bottom-half bypassable. This capability allows the shared
arithmetic chain to cascade through half of the ALMs in a LAB while leaving the other
half available for narrower fan-in functionality. Every other LAB column is top-half
bypassable, while the other LAB columns are bottom-half bypassable. For more
information about shared arithmetic chain interconnect, refer to “MultiTrack
Interconnect” on page 2–44.
Register Chain
In addition to the general routing outputs, the ALMs in a LAB have register chain
outputs. Register chain routing allows registers in the same LAB to be cascaded
together. The register chain interconnect allows a LAB to use LUTs for a single
combinational function and the registers to be used for an unrelated shift register
implementation. These resources speed up connections between ALMs while saving
local interconnect resources (refer to Figure 2–38). The Quartus II Compiler
automatically takes advantage of these resources to improve utilization and
performance. For more information about register chain interconnect, refer to
“MultiTrack Interconnect” on page 2–44.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Adaptive Logic Modules
Figure 2–38. Register Chain within a LAB
2–43
(Note 1)
From Previous ALM
Within The LAB
reg_chain_in
To general or
local routing
adder0
D
Q
To general or
local routing
reg0
Combinational
Logic
adder1
D
Q
To general or
local routing
reg1
To general or
local routing
To general or
local routing
adder0
D
Q
To general or
local routing
reg0
Combinational
Logic
adder1
D
Q
To general or
local routing
reg1
To general or
local routing
reg_chain_out
To Next ALM
within the LAB
Note to Figure 2–38:
(1) The combinational or adder logic can be used to implement an unrelated, unregistered function.
Clear and Preset Logic Control
LAB-wide signals control the logic for the register ’s clear and load/preset signals. The
ALM directly supports an asynchronous clear and preset function. The register preset
is achieved through the asynchronous load of a logic high. The direct asynchronous
preset does not require a NOT gate push-back technique. Arria GX devices support
simultaneous asynchronous load/preset and clear signals. An asynchronous clear
signal takes precedence if both signals are asserted simultaneously. Each LAB
supports up to two clears and one load/preset signal.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–44
Chapter 2: Arria GX Architecture
MultiTrack Interconnect
In addition to the clear and load/preset ports, Arria GX devices provide a
device-wide reset pin (DEV_CLRn) that resets all registers in the device. An option set
before compilation in the Quartus II software controls this pin. This device-wide reset
overrides all other control signals.
MultiTrack Interconnect
In Arria GX architecture, the MultiTrack interconnect structure with DirectDrive
technology provides connections between ALMs, TriMatrix memory, DSP blocks, and
device I/O pins. The MultiTrack interconnect consists of continuous,
performance-optimized routing lines of different lengths and speeds used for interand intra-design block connectivity. The Quartus II Compiler automatically places
critical design paths on faster interconnects to improve design performance.
DirectDrive technology is a deterministic routing technology that ensures identical
routing resource usage for any function regardless of placement in the device. The
MultiTrack interconnect and DirectDrive technology simplify the integration stage of
block-based designing by eliminating the re-optimization cycles that typically follow
design changes and additions.
The MultiTrack interconnect consists of row and column interconnects that span fixed
distances. A routing structure with fixed length resources for all devices allows
predictable and repeatable performance when migrating through different device
densities. Dedicated row interconnects route signals to and from LABs, DSP blocks,
and TriMatrix memory in the same row.
These row resources include:
■
Direct link interconnects between LABs and adjacent blocks
■
R4 interconnects traversing four blocks to the right or left
■
R24 row interconnects for high-speed access across the length of the device
The direct link interconnect allows a LAB, DSP block, or TriMatrix memory block to
drive into the local interconnect of its left and right neighbors and then back into
itself, providing fast communication between adjacent LABs and/or blocks without
using row interconnect resources.
The R4 interconnects span four LABs, three LABs and one M512 RAM block, two
LABs and one M4K RAM block, or two LABs and one DSP block to the right or left of
a source LAB. These resources are used for fast row connections in a four-LAB region.
Every LAB has its own set of R4 interconnects to drive either left or right. Figure 2–39
shows R4 interconnect connections from a LAB.
R4 interconnects can drive and be driven by DSP blocks and RAM blocks and row
IOEs. For LAB interfacing, a primary LAB or LAB neighbor can drive a given R4
interconnect. For R4 interconnects that drive to the right, the primary LAB and right
neighbor can drive onto the interconnect. For R4 interconnects that drive to the left,
the primary LAB and its left neighbor can drive onto the interconnect. R4
interconnects can drive other R4 interconnects to extend the range of LABs they can
drive. R4 interconnects can also drive C4 and C16 interconnects for connections from
one row to another. Additionally, R4 interconnects can drive R24 interconnects.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
MultiTrack Interconnect
2–45
Figure 2–39. R4 Interconnect Connections
(Note 1), (2), (3)
Adjacent LAB can
Drive onto Another
LAB's R4 Interconnect
C4 and C16
Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 2–39:
(1) C4 and C16 interconnects can drive R4 interconnects.
(2) This pattern is repeated for every LAB in the LAB row.
(3) The LABs in Figure 2–39 show the 16 possible logical outputs per LAB.
R24 row interconnects span 24 LABs and provide the fastest resource for long row
connections between LABs, TriMatrix memory, DSP blocks, and row IOEs. The R24
row interconnects can cross M-RAM blocks. R24 row interconnects drive to other row
or column interconnects at every fourth LAB and do not drive directly to LAB local
interconnects. R24 row interconnects drive LAB local interconnects via R4 and C4
interconnects. R24 interconnects can drive R24, R4, C16, and C4 interconnects. The
column interconnect operates similarly to the row interconnect and vertically routes
signals to and from LABs, TriMatrix memory, DSP blocks, and IOEs. Each column of
LABs is served by a dedicated column interconnect.
These column resources include:
■
Shared arithmetic chain interconnects in a LAB
■
Carry chain interconnects in a LAB and from LAB to LAB
■
Register chain interconnects in a LAB
■
C4 interconnects traversing a distance of four blocks in up and down direction
■
C16 column interconnects for high-speed vertical routing through the device
Arria GX devices include an enhanced interconnect structure in LABs for routing
shared arithmetic chains and carry chains for efficient arithmetic functions. The
register chain connection allows the register output of one ALM to connect directly to
the register input of the next ALM in the LAB for fast shift registers. These
ALM-to-ALM connections bypass the local interconnect. The Quartus II Compiler
automatically takes advantage of these resources to improve utilization and
performance. Figure 2–40 shows shared arithmetic chain, carry chain, and register
chain interconnects.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–46
Chapter 2: Arria GX Architecture
MultiTrack Interconnect
Figure 2–40. Shared Arithmetic Chain, Carry Chain and Register Chain Interconnects
Local Interconnect
Routing Among ALMs
in the LAB
Carry Chain & Shared
Arithmetic Chain
Routing to Adjacent ALM
ALM 1
Register Chain
Routing to Adjacent
ALM's Register Input
ALM 2
Local
Interconnect
ALM 3
ALM 4
ALM 5
ALM 6
ALM 7
ALM 8
C4 interconnects span four LABs, M512, or M4K blocks up or down from a source
LAB. Every LAB has its own set of C4 interconnects to drive either up or down.
Figure 2–41 shows the C4 interconnect connections from a LAB in a column. C4
interconnects can drive and be driven by all types of architecture blocks, including
DSP blocks, TriMatrix memory blocks, and column and row IOEs. For LAB
interconnection, a primary LAB or its LAB neighbor can drive a given C4
interconnect. C4 interconnects can drive each other to extend their range as well as
drive row interconnects for column-to-column connections.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
MultiTrack Interconnect
Figure 2–41. C4 Interconnect Connections
2–47
(Note 1)
C4 Interconnect
Drives Local and R4
Interconnects
up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 2–41:
(1) Each C4 interconnect can drive either up or down four rows.
C16 column interconnects span a length of 16 LABs and provide the fastest resource
for long column connections between LABs, TriMatrix memory blocks, DSP blocks,
and IOEs. C16 interconnects can cross M-RAM blocks and also drive to row and
column interconnects at every fourth LAB. C16 interconnects drive LAB local
interconnects via C4 and R4 interconnects and do not drive LAB local interconnects
directly. All embedded blocks communicate with the logic array similar to
LAB-to-LAB interfaces. Each block (that is, TriMatrix memory and DSP blocks)
connects to row and column interconnects and has local interconnect regions driven
by row and column interconnects. These blocks also have direct link interconnects for
fast connections to and from a neighboring LAB. All blocks are fed by the row LAB
clocks, labclk[5..0].
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–48
Chapter 2: Arria GX Architecture
TriMatrix Memory
Table 2–10 lists the routing scheme for Arria GX device.
Table 2–10. Arria GX Device Routing Scheme
Shared Arithmetic Chain
Carry Chain
Register Chain
Local Interconnect
Direct Link Interconnect
R4 Interconnect
R24 Interconnect
C4 Interconnect
C16 Interconnect
ALM
M512 RAM Block
M4K RAM Block
M-RAM Block
DSP Blocks
Column IOE
Row IOE
Destination
Shared arithmetic chain
—
—
—
—
—
—
—
—
—
v
—
—
—
—
—
—
Carry chain
—
—
—
—
—
—
—
—
—
v
—
—
—
—
—
—
Register chain
—
—
—
—
—
—
—
—
—
v
—
—
—
—
—
—
Local interconnect
—
—
—
—
—
—
—
—
—
v
v
v
v
v
v
v
Direct link interconnect
—
—
—
v
—
—
—
—
—
—
—
—
—
—
—
—
R4 interconnect
—
—
—
v
—
v
v
v
v
—
—
—
—
—
—
—
R24 interconnect
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
C4 interconnect
—
—
—
v
—
v
—
v
—
—
—
—
—
—
—
—
C16 interconnect
—
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
ALM
v
v
v
v
v
v
—
v
—
—
—
—
—
—
—
—
M512 RAM block
—
—
—
v
v
v
—
v
—
—
—
—
—
—
—
—
M4K RAM block
—
—
—
v
v
v
—
v
—
—
—
—
—
—
—
—
M-RAM block
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
DSP blocks
—
—
—
—
v
v
—
v
—
—
—
—
—
—
—
—
Column IOE
—
—
—
—
v
—
—
v
v
—
—
—
—
—
—
—
Row IOE
—
—
—
—
v
v
v
v
—
—
—
—
—
—
—
—
Source
TriMatrix Memory
TriMatrix memory consists of three types of RAM blocks: M512, M4K, and M-RAM.
Although these memory blocks are different, they can all implement various types of
memory with or without parity, including true dual-port, simple dual-port, and
single-port RAM, ROM, and FIFO buffers. Table 2–11 lists the size and features of the
different RAM blocks.
Table 2–11. TriMatrix Memory Features (Part 1 of 2)
M512 RAM Block
(32 × 18 Bits)
M4K RAM Block
(128 × 36 Bits)
M-RAM Block
(4K × 144 Bits)
Maximum performance
345 MHz
380 MHz
290 MHz
True dual-port memory
—
v
v
Simple dual-port memory
v
v
v
Single-port memory
v
v
v
Shift register
v
v
—
Memory Feature
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
TriMatrix Memory
2–49
Table 2–11. TriMatrix Memory Features (Part 2 of 2)
Memory Feature
M512 RAM Block
(32 × 18 Bits)
M4K RAM Block
(128 × 36 Bits)
M-RAM Block
(4K × 144 Bits)
ROM
v
v
—
FIFO buffer
v
v
v
Pack mode
—
v
v
Byte enable
v
v
v
Address clock enable
—
v
v
Parity bits
v
v
v
Mixed clock mode
v
v
v
Memory initialization file (.mif)
v
v
—
Simple dual-port memory mixed width support
v
v
v
True dual-port memory mixed width support
—
v
v
Power-up conditions
Outputs cleared
Outputs cleared
Outputs unknown
Register clears
Output registers
Output registers
Output registers
Unknown output/old
data
Unknown output/old
data
Unknown output
Mixed-port read-during-write
4K × 1
Configurations
512 × 1
2K × 2
256 × 2
1K × 4
128 × 4
512 × 8
64 × 8
512 × 9
64 × 9
256 × 16
32 × 16
256 × 18
32 × 18
128 × 32
128 × 36
64K × 8
64K × 9
32K × 16
32K × 18
16K × 32
16K × 36
8K × 64
8K × 72
4K × 128
4K × 144
TriMatrix memory provides three different memory sizes for efficient application
support. The Quartus II software automatically partitions the user-defined memory
into the embedded memory blocks using the most efficient size combinations. You can
also manually assign the memory to a specific block size or a mixture of block sizes.
M512 RAM Block
The M512 RAM block is a simple dual-port memory block and is useful for
implementing small FIFO buffers, DSP, and clock domain transfer applications. Each
block contains 576 RAM bits (including parity bits). M512 RAM blocks can be
configured in the following modes:
© December 2009
■
Simple dual-port RAM
■
Single-port RAM
■
FIFO
■
ROM
■
Shift register
Altera Corporation
Arria GX Device Handbook, Volume 1
2–50
Chapter 2: Arria GX Architecture
TriMatrix Memory
When configured as RAM or ROM, you can use an initialization file to pre-load the
memory contents.
M512 RAM blocks can have different clocks on its inputs and outputs. The wren,
datain, and write address registers are all clocked together from one of the two
clocks feeding the block. The read address, rden, and output registers can be clocked
by either of the two clocks driving the block, allowing the RAM block to operate in
read and write or input and output clock modes. Only the output register can be
bypassed. The six labclk signals or local interconnect can drive the inclock,
outclock, wren, rden, and outclr signals. Because of the advanced interconnect
between the LAB and M512 RAM blocks, ALMs can also control the wren and rden
signals and the RAM clock, clock enable, and asynchronous clear signals. Figure 2–42
shows the M512 RAM block control signal generation logic.
Figure 2–42. M512 RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
outclocken
inclocken
Local
Interconnect
inclock
outclock
wren
rden
outclr
The RAM blocks in Arria GX devices have local interconnects to allow ALMs and
interconnects to drive into RAM blocks. The M512 RAM block local interconnect is
driven by the R4, C4, and direct link interconnects from adjacent LABs. The M512
RAM blocks can communicate with LABs on either the left or right side through these
row interconnects or with LAB columns on the left or right side with the column
interconnects. The M512 RAM block has up to 16 direct link input connections from
the left adjacent LABs and another 16 from the right adjacent LAB. M512 RAM
outputs can also connect to left and right LABs through direct link interconnect. The
M512 RAM block has equal opportunity for access and performance to and from
LABs on either its left or right side. Figure 2–43 shows the M512 RAM block to logic
array interface.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
TriMatrix Memory
2–51
Figure 2–43. M512 RAM Block LAB Row Interface
C4 Interconnect
R4 Interconnect
16
Direct link
interconnect
to adjacent LAB
Direct link
interconnect
to adjacent LAB
36
dataout
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
datain
control
signals
byte
enable
clocks
address
6
M4K RAM Block Local
Interconnect Region
LAB Row Clocks
M4K RAM Blocks
The M4K RAM block includes support for true dual-port RAM. The M4K RAM block
is used to implement buffers for a wide variety of applications such as storing
processor code, implementing lookup schemes, and implementing larger memory
applications. Each block contains 4,608 RAM bits (including parity bits). M4K RAM
blocks can be configured in the following modes:
■
True dual-port RAM
■
Simple dual-port RAM
■
Single-port RAM
■
FIFO
■
ROM
■
Shift register
When configured as RAM or ROM, you can use an initialization file to pre-load the
memory contents.
M4K RAM blocks allow for different clocks on their inputs and outputs. Either of the
two clocks feeding the block can clock M4K RAM block registers (renwe, address,
byte enable, datain, and output registers). Only the output register can be
bypassed. The six labclk signals or local interconnects can drive the control signals
for the A and B ports of the M4K RAM block. ALMs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and clocken_b
signals, as shown in Figure 2–44.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–52
Chapter 2: Arria GX Architecture
TriMatrix Memory
Figure 2–44. M4K RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_b
clock_b
Local
Interconnect
clock_a
clocken_a
renwe_b
renwe_a
aclr_b
aclr_a
The R4, C4, and direct link interconnects from adjacent LABs drive the M4K RAM
block local interconnect. The M4K RAM blocks can communicate with LABs on either
the left or right side through these row resources or with LAB columns on either the
right or left with the column resources. Up to 16 direct link input connections to the
M4K RAM block are possible from the left adjacent LABs and another 16 are possible
from the right adjacent LAB. M4K RAM block outputs can also connect to left and
right LABs through direct link interconnect. Figure 2–45 shows the M4K RAM block
to logic array interface.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
TriMatrix Memory
2–53
Figure 2–45. M4K RAM Block LAB Row Interface
C4 Interconnect
R4 Interconnect
16
Direct link
interconnect
to adjacent LAB
Direct link
interconnect
to adjacent LAB
36
dataout
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
datain
control
signals
byte
enable
clocks
address
6
M4K RAM Block Local
Interconnect Region
LAB Row Clocks
M-RAM Block
The largest TriMatrix memory block, the M-RAM block, is useful for applications
where a large volume of data must be stored on-chip. Each block contains 589,824
RAM bits (including parity bits). The M-RAM block can be configured in the
following modes:
■
True dual-port RAM
■
Simple dual-port RAM
■
Single-port RAM
■
FIFO
You cannot use an initialization file to initialize the contents of a M-RAM block. All
M-RAM block contents power up to an undefined value. Only synchronous operation
is supported in the M-RAM block, so all inputs are registered. Output registers can be
bypassed.
Similar to all RAM blocks, M-RAM blocks can have different clocks on their inputs
and outputs. Either of the two clocks feeding the block can clock M-RAM block
registers (renwe, address, byte enable, datain, and output registers). You can
bypass the output register. The six labclk signals or local interconnect can drive the
control signals for the A and B ports of the M-RAM block. ALMs can also control the
clock_a, clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals, as shown in Figure 2–46.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–54
Chapter 2: Arria GX Architecture
TriMatrix Memory
Figure 2–46. M-RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_a
Local
Interconnect
clock_a
renwe_a
aclr_a
clock_b
aclr_b
renwe_b
Local
Interconnect
clocken_b
The R4, R24, C4, and direct link interconnects from adjacent LABs on either the right
or left side drive the M-RAM block local interconnect. Up to 16 direct link input
connections to the M-RAM block are possible from the left adjacent LABs and another
16 are possible from the right adjacent LAB. M-RAM block outputs can also connect to
left and right LABs through direct link interconnect. Figure 2–47 shows an example
floorplan for the EP1AGX90 device and the location of the M-RAM interfaces.
Figure 2–48 and Figure 2–49 show the interface between the M-RAM block and the
logic array.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
TriMatrix Memory
2–55
Figure 2–47. EP1AGX90 Device with M-RAM Interface Locations
(Note 1)
M-RAM blocks interface to
LABs on right and left sides for
easy access to horizontal I/O pins
M4K
Blocks
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M512
Blocks
DSP
Blocks
LABs
DSP
Blocks
Note to Figure 2–47:
(1) The device shown is an EP1AGX90 device. The number and position of M-RAM blocks vary in other devices.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–56
Chapter 2: Arria GX Architecture
TriMatrix Memory
Figure 2–48. M-RAM Block LAB Row Interface (Note 1)
Row Unit Interface Allows LAB
Rows to Drive Port A Datain,
Dataout, Address and Control
Signals to and from M-RAM Block
Row Unit Interface Allows LAB
Rows to Drive Port B Datain,
Dataout, Address and Control
Signals to and from M-RAM Block
L0
R0
L1
R1
M-RAM Block
L2
Port A
Port B R2
L3
R3
L4
R4
L5
R5
LAB Interface
Blocks
LABs in Row
M-RAM Boundary
LABs in Row
M-RAM Boundary
Note to Figure 2–48:
(1) Only R24 and C16 interconnects cross the M-RAM block boundaries.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
TriMatrix Memory
2–57
Figure 2–49. M-RAM Row Unit Interface to Interconnect
C4 Interconnect
R4 and R24 Interconnects
M-RAM Block
LAB
Up to 16
dataout_a[ ]
16
Up to 28
Direct Link
Interconnects
datain_a[ ]
addressa[ ]
addr_ena_a
renwe_a
byteenaA[ ]
clocken_a
clock_a
aclr_a
Row Interface Block
M-RAM Block to
LAB Row Interface
Block Interconnect Region
Table 2–12 lists the input and output data signal connections along with the address
and control signal input connections to the row unit interfaces (L0 to L5 and R0 to R5).
Table 2–12. M-RAM Row Interface Unit Signals (Part 1 of 2)
Unit Interface Block
L0
Input Signals
datain_a[14..0]
Output Signals
dataout_a[11..0]
byteena_a[1..0]
L1
datain_a[29..15]
dataout_a[23..12]
byteena_a[3..2]
datain_a[35..30]
dataout_a[35..24]
addressa[4..0]
addr_ena_a
L2
clock_a
clocken_a
renwe_a
aclr_a
L3
addressa[15..5]
dataout_a[47..36]
datain_a[41..36]
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–58
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
Table 2–12. M-RAM Row Interface Unit Signals (Part 2 of 2)
Unit Interface Block
L4
Input Signals
datain_a[56..42]
Output Signals
dataout_a[59..48]
byteena_a[5..4]
L5
datain_a[71..57]
dataout_a[71..60]
byteena_a[7..6]
R0
datain_b[14..0]
dataout_b[11..0]
byteena_b[1..0]
R1
datain_b[29..15]
dataout_b[23..12]
byteena_b[3..2]
datain_b[35..30]
dataout_b[35..24]
addressb[4..0]
addr_ena_b
R2
clock_b
clocken_b
renwe_b
aclr_b
R3
addressb[15..5]
dataout_b[47..36]
datain_b[41..36]
R4
datain_b[56..42]
dataout_b[59..48]
byteena_b[5..4]
R5
datain_b[71..57]
dataout_b[71..60]
byteena_b[7..6]
f
For more information about TriMatrix memory, refer to the TriMatrix Embedded
Memory Blocks in Arria GX Devices chapter.
Digital Signal Processing Block
The most commonly used DSP functions are finite impulse response (FIR) filters,
complex FIR filters, infinite impulse response (IIR) filters, fast Fourier transform (FFT)
functions, direct cosine transform (DCT) functions, and correlators. All of these use
the multiplier as the fundamental building block. Additionally, some applications
need specialized operations such as multiply-add and multiply-accumulate
operations. Arria GX devices provide DSP blocks to meet the arithmetic requirements
of these functions.
Each Arria GX device has two to four columns of DSP blocks to efficiently implement
DSP functions faster than ALM-based implementations. Each DSP block can be
configured to support up to:
■
Eight 9 × 9-bit multipliers
■
Four 18 × 18-bit multipliers
■
One 36 × 36-bit multiplier
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
2–59
As indicated, the Arria GX DSP block can support one 36 × 36-bit multiplier in a
single DSP block and is true for any combination of signed, unsigned, or mixed sign
multiplications.
Figure 2–50 shows one of the columns with surrounding LAB rows.
Figure 2–50. DSP Blocks Arranged in Columns
DSP Block
Column
4 LAB
Rows
DSP Block
Table 2–13 lists the number of DSP blocks in each Arria GX device. DSP block
multipliers can optionally feed an adder/subtractor or accumulator in the block
depending on the configuration, which makes routing to ALMs easier, saves ALM
routing resources, and increases performance because all connections and blocks are
in the DSP block.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–60
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
Table 2–13. DSP Blocks in Arria GX Devices (Note 1)
DSP Blocks
Total 9 × 9
Multipliers
Total 18 × 18
Multipliers
Total 36 × 36
Multipliers
EP1AGX20
10
80
40
10
EP1AGX35
14
112
56
14
EP1AGX50
26
208
104
26
EP1AGX60
32
256
128
32
EP1AGX90
44
352
176
44
Device
Note to Table 2–13:
(1) This list only shows functions that can fit into a single DSP block. Multiple DSP blocks can support larger
multiplication functions.
Additionally, DSP block input registers can efficiently implement shift registers for
FIR filter applications. DSP blocks support Q1.15 format rounding and saturation.
Figure 2–51 shows a top-level diagram of the DSP block configured for 18 × 18-bit
multiplier mode.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
2–61
Figure 2–51. DSP Block Diagram for 18 × 18-Bit Configuration
Optional Serial Shift Register
Inputs from Previous
DSP Block
Multiplier Stage
D
ENA
CLRN
D
Optional Stage Configurable
as Accumulator or Dynamic
Adder/Subtractor
Q
Q
D
Output Selection
Multiplexer
Q
ENA
CLRN
ENA
CLRN
Adder/
Subtractor/
Accumulator
1
D
Q
ENA
CLRN
D
Q
D
Q
ENA
CLRN
ENA
CLRN
Summation
D
Q
ENA
CLRN
D
Q
D
Q
Summation Stage
for Adding Four
Multipliers Together
ENA
CLRN
Optional Output
Register Stage
ENA
CLRN
Adder/
Subtractor/
Accumulator
2
D
Optional Serial
Shift Register
Outputs to
Next DSP Block
in the Column
Q
ENA
CLRN
D
Q
ENA
CLRN
© December 2009
Altera Corporation
D
Q
ENA
CLRN
Optional Pipeline
Register Stage
Optional Input Register
Stage with Parallel Input or
Shift Register Configuration
to MultiTrack
Interconnect
Arria GX Device Handbook, Volume 1
2–62
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
Modes of Operation
The adder, subtractor, and accumulate functions of a DSP block have four modes of
operation:
■
Simple multiplier
■
Multiply-accumulator
■
Two-multipliers adder
■
Four-multipliers adder
Table 2–14 shows the different number of multipliers possible in each DSP block
mode according to size. These modes allow the DSP blocks to implement numerous
applications for DSP including FFTs, complex FIR, FIR, 2D FIR filters, equalizers, IIR,
correlators, matrix multiplication, and many other functions. DSP blocks also support
mixed modes and mixed multiplier sizes in the same block. For example, half of one
DSP block can implement one 18 × 18-bit multiplier in multiply-accumulator mode,
while the other half of the DSP block implements four 9 × 9-bit multipliers in simple
multiplier mode.
Table 2–14. Multiplier Size and Configurations per DSP Block
DSP Block Mode
Multiplier
9×9
Eight multipliers with eight
product outputs
Multiply-accumulator
—
18 × 18
Four multipliers with four
product outputs
36 × 36
One multiplier with one
product output
Two 52-bit
multiply-accumulate blocks
—
Two-multipliers adder
Four two-multiplier adder (two
9 × 9 complex multiply)
Two two-multiplier adder (one
18 × 18 complex multiply)
—
Four-multipliers adder
Two four-multiplier adder
One four-multiplier adder
—
DSP Block Interface
The Arria GX device DSP block input registers can generate a shift register that can
cascade down in the same DSP block column. Dedicated connections between DSP
blocks provide fast connections between shift register inputs to cascade shift register
chains. You can cascade registers within multiple DSP blocks for 9 × 9- or 18 × 18-bit
FIR filters larger than four taps, with additional adder stages implemented in ALMs.
If the DSP block is configured as 36 × 36 bits, the adder, subtractor, or accumulator
stages are implemented in ALMs. Each DSP block can route the shift register chain
out of the block to cascade multiple columns of DSP blocks.
The DSP block is divided into four block units that interface with four LAB rows on
the left and right. Each block unit can be considered one complete 18 × 18-bit
multiplier with 36 inputs and 36 outputs. A local interconnect region is associated
with each DSP block. Like an LAB, this interconnect region can be fed with 16 direct
link interconnects from the LAB to the left or right of the DSP block in the same row.
R4 and C4 routing resources can access the DSP block’s local interconnect region.
The outputs also work similarly to LAB outputs. Eighteen outputs from the DSP block
can drive to the left LAB through direct link interconnects and 18 can drive to the
right LAB though direct link interconnects. All 36 outputs can drive to R4 and C4
routing interconnects. Outputs can drive right- or left-column routing.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
2–63
Figure 2–52 and Figure 2–53 show the DSP block interfaces to LAB rows.
Figure 2–52. DSP Block Interconnect Interface
DSP Block
R4, C4 & Direct
Link Interconnects
OA[17..0]
OB[17..0]
R4, C4 & Direct
Link Interconnects
A1[17..0]
B1[17..0]
OC[17..0]
OD[17..0]
A2[17..0]
B2[17..0]
OE[17..0]
OF[17..0]
A3[17..0]
B3[17..0]
OG[17..0]
OH[17..0]
A4[17..0]
B4[17..0]
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–64
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
Figure 2–53. DSP Block Interface to Interconnect
Direct Link Interconnect
from Adjacent LAB
C4 Interconnect
R4 Interconnect
Direct Link Outputs
to Adjacent LABs
Direct Link Interconnect
from Adjacent LAB
36
DSP Block
Row Structure
36
LAB
LAB
18
16
16
12
Control
36
A[17..0]
B[17..0]
OA[17..0]
OB[17..0]
36
Row Interface
Block
DSP Block to
LAB Row Interface
Block Interconnect Region
36 Inputs per Row
36 Outputs per Row
A bus of 44 control signals feeds the entire DSP block. These signals include clocks,
asynchronous clears, clock enables, signed and unsigned control signals, addition and
subtraction control signals, rounding and saturation control signals, and accumulator
synchronous loads. The clock signals are routed from LAB row clocks and are
generated from specific LAB rows at the DSP block interface. The LAB row source for
control signals, data inputs, and outputs is shown in Table 2–15.
f
For more information about DSP blocks, refer to the DSP Blocks in Arria GX Devices
chapter.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Digital Signal Processing Block
2–65
Table 2–15. DSP Block Signal Sources and Destinations
LAB Row at Interface
Control Signals Generated
Data Inputs
Data Outputs
A1[17..0]
OA[17..0]
B1[17..0]
OB[17..0]
A2[17..0]
OC[17..0]
B2[17..0]
OD[17..0]
A3[17..0]
OE[17..0]
B3[17..0]
OF[17..0]
A4[17..0]
OG[17..0]
B4[17..0]
OH[17..0]
clock0
aclr0
ena0
mult01_saturate
0
addnsub1_round/
accum_round
addnsub1
signa
sourcea
sourceb
clock1
aclr1
ena1
accum_saturate
1
mult01_round
accum_sload
sourcea
sourceb
mode0
clock2
aclr2
ena2
mult23_saturate
2
addnsub3_round/
accum_round
addnsub3
sign_b
sourcea
sourceb
clock3
aclr3
ena3
accum_saturate
3
mult23_round
accum_sload
sourcea
sourceb
mode1
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–66
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
PLLs and Clock Networks
Arria GX devices provide a hierarchical clock structure and multiple PLLs with
advanced features. The large number of clocking resources in combination with the
clock synthesis precision provided by enhanced and fast PLLs provides a complete
clock management solution.
Global and Hierarchical Clocking
Arria GX devices provide 16 dedicated global clock networks and 32 regional clock
networks (eight per device quadrant). These clocks are organized into a hierarchical
clock structure that allows for up to 24 clocks per device region with low skew and
delay. This hierarchical clocking scheme provides up to 48 unique clock domains in
Arria GX devices.
There are 12 dedicated clock pins (CLK[15..12] and CLK[7..0]) to drive either the
global or regional clock networks. Four clock pins drive each side of the device except
the right side, as shown in Figure 2–54 and Figure 2–55. Internal logic and enhanced
and fast PLL outputs can also drive the global and regional clock networks. Each
global and regional clock has a clock control block, which controls the selection of the
clock source and dynamically enables or disables the clock to reduce power
consumption. Table 2–16 lists the global and regional clock features.
Table 2–16. Global and Regional Clock Features
Feature
Global Clocks
Regional Clocks
Number per device
16
32
Number available per
quadrant
16
8
Sources
Clock pins, PLL outputs, core routings,
inter-transceiver clocks
Clock pins, PLL outputs, core routings,
inter-transceiver clocks
Dynamic clock source
selection
v
—
Dynamic enable/disable
v
v
Global Clock Network
These clocks drive throughout the entire device, feeding all device quadrants. GCLK
networks can be used as clock sources for all resources in the device IOEs, ALMs, DSP
blocks, and all memory blocks. These resources can also be used for control signals,
such as clock enables and synchronous or asynchronous clears fed from the external
pin. The global clock networks can also be driven by internal logic for internally
generated global clocks and asynchronous clears, clock enables, or other control
signals with large fanout. Figure 2–54 shows the 12 dedicated CLK pins driving global
clock networks.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–67
Figure 2–54. Global Clocking
CLK[15..12]
Global Clock [15..0]
CLK[3..0]
Global Clock [15..0]
CLK[7..4]
Regional Clock Network
There are eight RCLK networks (RCLK[7..0]) in each quadrant of the Arria GX
device that are driven by the dedicated CLK[15..12]and CLK[7..0] input pins, by
PLL outputs, or by internal logic. The regional clock networks provide the lowest
clock delay and skew for logic contained in a single quadrant. The CLK pins
symmetrically drive the RCLK networks in a particular quadrant, as shown in
Figure 2–55.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–68
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
Figure 2–55. Regional Clocks
CLK[15..12]
11 5
7
CLK[3..0]
RCLK
[31..28]
RCLK
[27..24]
RCLK
[3..0]
RCLK
[23..20]
RCLK
[7..4]
RCLK
[19..16]
Arria GX
Transceiver
Block
1
2
8
RCLK
[11..8]
Arria GX
Transceiver
Block
RCLK
[15..12]
12 6
CLK[7..4]
Dual-Regional Clock Network
A single source (CLK pin or PLL output) can generate a dual-RCLK by driving two
RCLK network lines in adjacent quadrants (one from each quadrant), which allows
logic that spans multiple quadrants to use the same low skew clock. The routing of
this clock signal on an entire side has approximately the same speed but slightly
higher clock skew when compared with a clock signal that drives a single quadrant.
Internal logic-array routing can also drive a dual-regional clock. Clock pins and
enhanced PLL outputs on the top and bottom can drive horizontal dual-regional
clocks. Clock pins and fast PLL outputs on the left and right can drive vertical
dual-regional clocks, as shown in Figure 2–56. Corner PLLs cannot drive
dual-regional clocks.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–69
Figure 2–56. Dual-Regional Clocks
Clock Pins or PLL Clock Outputs
Can Drive Dual-Regional Network
CLK[15..12]
Clock Pins or PLL Clock
Outputs Can Drive
Dual-Regional Network
CLK[3..0]
CLK[15..12]
CLK[3..0]
PLLs
PLLs
CLK[7..4]
CLK[7..4]
Combined Resources
Within each quadrant, there are 24 distinct dedicated clocking resources consisting of
16 global clock lines and eight regional clock lines. Multiplexers are used with these
clocks to form buses to drive LAB row clocks, column IOE clocks, or row IOE clocks.
Another multiplexer is used at the LAB level to select three of the six row clocks to
feed the ALM registers in the LAB (refer to Figure 2–57).
Figure 2–57. Hierarchical Clock Networks Per Quadrant
Clocks Available
to a Quadrant
or Half-Quadrant
Column I/O Cell
IO_CLK[7..0]
Global Clock Network [15..0]
Clock [23..0]
Lab Row Clock [5..0]
Regional Clock Network [7..0]
Row I/O Cell
IO_CLK[7..0]
You can use the Quartus II software to control whether a clock input pin drives either
a GCLK, RCLK, or dual-RCLK network. The Quartus II software automatically selects
the clocking resources if not specified.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–70
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
Clock Control Block
Each GCLK, RCLK, and PLL external clock output has its own clock control block.
The control block has two functions:
■
Clock source selection (dynamic selection for global clocks)
■
Clock power-down (dynamic clock enable or disable)
Figure 2–58 through Figure 2–60 show the clock control block for the global clock,
regional clock, and PLL external clock output, respectively.
Figure 2–58. Global Clock Control Blocks
CLKp
Pins
PLL Counter
Outputs
CLKSELECT[1..0]
(1)
2
2
CLKn
Pin
2
Internal
Logic
Static Clock Select (2)
This multiplexer supports
User-Controllable
Dynamic Switching
Enable/
Disable
Internal
Logic
GCLK
Notes to Figure 2–58:
(1) These clock select signals can be dynamically controlled through internal logic when the device is operating in user mode.
(2) These clock select signals can only be set through a configuration file (SRAM Object File [.sof] or Programmer Object File [.pof]) and cannot be
dynamically controlled during user mode operation.
Figure 2–59. Regional Clock Control Blocks
CLKp
Pin
PLL Counter
Outputs
CLKn
Pin (2)
2
Internal
Logic
Static Clock Select (1)
Enable/
Disable
Internal
Logic
RCLK
Notes to Figure 2–59:
(1) These clock select signals can only be set through a configuration file (.sof or .pof) and cannot be dynamically controlled during user mode
operation.
(2) Only the CLKn pins on the top and bottom of the device feed to regional clock select.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–71
Figure 2–60. External PLL Output Clock Control Blocks
PLL Counter
Outputs (c[5..0])
6
Static Clock Select (1)
Enable/
Disable
Internal
Logic
IOE (2)
Internal
Logic
Static Clock
Select (1)
PLL_OUT
Pin
Notes to Figure 2–60:
(1) These clock select signals can only be set through a configuration file (.sof or .pof) and cannot be dynamically controlled during user mode
operation.
(2) The clock control block feeds to a multiplexer within the PLL_OUT pin’s IOE. The PLL_OUT pin is a dual-purpose pin. Therefore, this multiplexer
selects either an internal signal or the output of the clock control block.
For the global clock control block, clock source selection can be controlled either
statically or dynamically. You have the option of statically selecting the clock source
by using the Quartus II software to set specific configuration bits in the configuration
file (.sof or .pof) or controlling the selection dynamically by using internal logic to
drive the multiplexer select inputs. When selecting statically, the clock source can be
set to any of the inputs to the select multiplexer. When selecting the clock source
dynamically, you can either select between two PLL outputs (such as the C0 or C1
outputs from one PLL), between two PLLs (such as the C0/C1 clock output of one
PLL or the C0/C1 c1ock output of the other PLL), between two clock pins (such as
CLK0 or CLK1), or between a combination of clock pins or PLL outputs.
For the regional and PLL_OUT clock control block, clock source selection can only be
controlled statically using configuration bits. Any of the inputs to the clock select
multiplexer can be set as the clock source.
Arria GX clock networks can be disabled (powered down) by both static and dynamic
approaches. When a clock net is powered down, all logic fed by the clock net is in an
off-state thereby reducing the overall power consumption of the device. GCLK and
RCLK networks can be powered down statically through a setting in the
configuration file (.sof or .pof). Clock networks that are not used are automatically
powered down through configuration bit settings in the configuration file generated
by the Quartus II software. The dynamic clock enable or disable feature allows the
internal logic to control power up/down synchronously on GCLK and RCLK nets and
PLL_OUT pins. This function is independent of the PLL and is applied directly on the
clock network or PLL_OUT pin, as shown in Figure 2–58 through Figure 2–60.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–72
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
Enhanced and Fast PLLs
Arria GX devices provide robust clock management and synthesis using up to four
enhanced PLLs and four fast PLLs. These PLLs increase performance and provide
advanced clock interfacing and clock frequency synthesis. With features such as clock
switchover, spread spectrum clocking, reconfigurable bandwidth, phase control, and
reconfigurable phase shifting, the Arria GX device’s enhanced PLLs provide you with
complete control of your clocks and system timing. The fast PLLs provide general
purpose clocking with multiplication and phase shifting as well as high-speed
outputs for high-speed differential I/O support. Enhanced and fast PLLs work
together with the Arria GX high-speed I/O and advanced clock architecture to
provide significant improvements in system performance and bandwidth.
The Quartus II software enables the PLLs and their features without requiring any
external devices. Table 2–17 lists the PLLs available for each Arria GX device and their
type.
Table 2–17. Arria GX Device PLL Availability (Note 1), (2)
Fast PLLs
Enhanced PLLs
Device
1
2
3 (3)
4 (3)
7
8
9 (3)
10 (3)
5
6
11
12
EP1AGX20
v
v
—
—
—
—
—
—
v
v
—
—
EP1AGX35
v
v
—
—
—
—
—
—
v
v
—
—
EP1AGX50 (4)
v
v
—
—
v
v
—
—
v
v
v
v
EP1AGX60 (5)
v
v
—
—
v
v
—
—
v
v
v
v
EP1AGX90
v
v
—
—
v
v
—
—
v
v
v
v
Notes to Table 2–17:
(1) The global or regional clocks in a fast PLL's transceiver block can drive the fast PLL input. A pin or other PLL must drive the global or regional
source. The source cannot be driven by internally generated logic before driving the fast PLL.
(2) EP1AGX20C, EP1AGX35C/D, EP1AGX50C and EP1AGX60C/D devices only have two fast PLLs (PLLs 1 and 2), but the connectivity from these
two PLLs to the global and regional clock networks remains the same as shown in this table.
(3) PLLs 3, 4, 9, and 10 are not available in Arria GX devices.
(4) 4 or 8 PLLs are available depending on C or D device and the package option.
(5) 4or 8 PLLs are available depending on C, D, or E device option.
Table 2–18 lists the enhanced PLL and fast PLL features in Arria GX devices.
Table 2–18. Arria GX PLL Features (Part 1 of 2)
Feature
Enhanced PLL
Fast PLL
m/(n × post-scale counter) (1)
m/(n × post-scale counter) (2)
Down to 125-ps increments (3), (4)
Down to 125-ps increments (3), (4)
Clock switchover
v
v (5)
PLL reconfiguration
v
v
Reconfigurable bandwidth
v
v
Spread spectrum clocking
v
—
Programmable duty cycle
v
v
Clock multiplication and division
Phase shift
Number of internal clock outputs
6
4
Number of external clock outputs
Three differential/six single-ended
(6)
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–73
Table 2–18. Arria GX PLL Features (Part 2 of 2)
Feature
Number of feedback clock inputs
Enhanced PLL
Fast PLL
One single-ended or differential (7), (8)
—
Notes to Table 2–18:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
For enhanced PLLs, m, n range from 1 to 256 and post-scale counters range from 1 to 512 with 50% duty cycle.
For fast PLLs, m, and post-scale counters range from 1 to 32. The n counter ranges from 1 to 4.
The smallest phase shift is determined by the voltage controlled oscillator (VCO ) period divided by 8.
For degree increments, Arria GX devices can shift all output frequencies in increments of at least 45. Smaller degree increments are possible
depending on the frequency and divide parameters.
Arria GX fast PLLs only support manual clock switchover.
Fast PLLs can drive to any I/O pin as an external clock. For high-speed differential I/O pins, the device uses a data channel to generate
txclkout.
If the feedback input is used, you lose one (or two, if fBIN is differential) external clock output pin.
Every Arria GX device has at least two enhanced PLLs with one single-ended or differential external feedback input per PLL.
Figure 2–61 shows a top-level diagram of the Arria GX device and PLL floorplan.
Figure 2–61. PLL Locations
CLK[15..12]
FPLL7CLK
7
CLK[3..0]
1
2
11
5
12
6
PLLs
FPLL8CLK
8
CLK[7..4]
Figure 2–62 and Figure 2–63 shows global and regional clocking from the fast PLL
outputs and side clock pins. The connections to the global and regional clocks from
the fast PLL outputs, internal drivers, and CLK pins on the left side of the device are
shown in Table 2–19.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–74
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
Figure 2–62. Global and Regional Clock Connections from Center Clock Pins and Fast PLL Outputs (Note 1)
C0
CLK0
CLK1
Fast
PLL 1
C1
C2
C3
Logic Array
Signal Input
To Clock
Network
C0
CLK2
CLK3
Fast
PLL 2
C1
C2
C3
RCLK0
RCLK2
RCLK1
RCLK4
RCLK3
RCLK6
RCLK5
RCLK7
GCLK0
GCLK1
GCLK2
GCLK3
Note to Figure 2–62:
(1) The global or regional clocks in a fast PLL's quadrant can drive the fast PLL input. A dedicated clock input pin or other PLL must drive the global
or regional source. The source cannot be driven by internally generated logic before driving the fast PLL.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–75
Figure 2–63. Global and Regional Clock Connections from Corner Clock Pins and Fast PLL Outputs
RCLK1
(Note 1)
RCLK3
RCLK0
RCLK2
RCLK4
RCLK6
C0
Fast
PLL 7
C1
C2
C3
C0
Fast
PLL 8
C1
C2
C3
RCLK5
GCLK0
RCLK7
GCLK2
GCLK1
GCLK3
Note to Figure 2–63:
(1) The GCLK or RCLK in a fast PLL's quadrant can drive the fast PLL input. A dedicated clock input pin or other PLL must drive the global or regional
source. The source cannot be driven by internally generated logic before driving the fast PLL.
RCLK7
RCLK6
RCLK5
RCLK4
RCLK3
RCLK2
RCLK1
RCLK0
CLK3
CLK2
CLK1
Left Side Global & Regional
Clock Network Connectivity
CLK0
Table 2–19. Global and Regional Clock Connections from Left Side Clock Pins and Fast PLL Outputs (Part 1 of 2)
Clock Pins
CLK0p
v
v
—
—
v
—
—
—
v
—
—
—
CLK1p
v
v
—
—
—
v
—
—
—
v
—
—
CLK2p
—
—
v
v
—
—
v
—
—
—
v
—
CLK3p
—
—
v
v
—
—
—
v
—
—
—
v
GCLKDRV0
v
v
—
—
—
—
—
—
—
—
—
—
GCLKDRV1
v
v
—
—
—
—
—
—
—
—
—
—
GCLKDRV2
—
—
v
v
—
—
—
—
—
—
—
—
GCLKDRV3
—
—
v
v
—
—
—
—
—
—
—
—
RCLKDRV0
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV1
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV2
—
—
—
—
—
—
v
—
—
—
v
—
RCLKDRV3
—
—
—
—
—
—
—
v
—
—
—
v
RCLKDRV4
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV5
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV6
—
—
—
—
—
—
v
—
—
—
v
—
Drivers from Internal Logic
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–76
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
RCLK7
RCLK6
RCLK5
RCLK4
RCLK3
RCLK2
RCLK1
RCLK0
CLK3
CLK2
CLK1
Left Side Global & Regional
Clock Network Connectivity
CLK0
Table 2–19. Global and Regional Clock Connections from Left Side Clock Pins and Fast PLL Outputs (Part 2 of 2)
—
—
—
—
—
—
—
v
—
—
—
v
c0
v
v
—
—
v
—
v
—
v
—
v
—
c1
v
v
—
—
—
v
—
v
v
—
v
c2
—
—
v
v
v
—
v
—
v
—
v
—
c3
—
—
v
v
—
v
—
v
—
v
—
v
c0
v
v
—
—
—
v
—
v
—
v
—
v
c1
v
v
—
—
v
—
v
—
v
—
v
—
c2
—
—
v
v
—
v
—
v
—
v
—
v
c3
—
—
v
v
v
—
v
—
v
—
v
—
c0
—
—
v
v
—
v
—
v
—
—
—
—
c1
—
—
v
v
v
—
v
—
—
—
—
—
c2
v
v
—
—
—
v
—
v
—
—
—
—
c3
v
v
—
—
v
—
v
—
—
—
—
—
c0
—
—
v
v
—
—
—
—
v
—
v
—
c1
—
—
v
v
—
—
—
—
—
v
—
v
c2
v
v
—
—
—
—
—
—
v
—
v
—
c3
v
v
—
—
—
—
—
—
—
v
—
v
RCLKDRV7
PLL 1 Outputs
PLL 2 Outputs
PLL 7 Outputs
PLL 8 Outputs
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–77
Figure 2–64 shows the global and regional clocking from enhanced PLL outputs and
top and bottom CLK pins.
Figure 2–64. Global and Regional Clock Connections from Top and Bottom Clock Pins and Enhanced PLL Outputs (Note 1)
CLK15
CLK13
CLK12
CLK14
PLL5_FB
PLL11_FB
PLL 11
PLL 5
c0 c1 c2 c3 c4 c5
c0 c1 c2 c3 c4 c5
PLL5_OUT[2..0]p
PLL5_OUT[2..0]n
RCLK31
RCLK30
RCLK29
RCLK28
PLL11_OUT[2..0]p
PLL11_OUT[2..0]n
RCLK27
RCLK26
RCLK25
RCLK24
Regional
Clocks
G15
G14
G13
G12
Global
Clocks
Regional
Clocks
G4
G5
G6
G7
RCLK8
RCLK9
RCLK10
RCLK11
RCLK12
RCLK13
RCLK14
RCLK15
PLL6_OUT[2..0]p
PLL6_OUT[2..0]n
PLL12_OUT[2..0]p
PLL12_OUT[2..0]n
c0 c1 c2 c3 c4 c5
c0 c1 c2 c3 c4 c5
PLL 12
PLL 6
PLL12_FB
PLL6_FB
CLK4
CLK6
CLK5
CLK7
Note to Figure 2–64:
(1) If the design uses the feedback input, you might lose one (or two if FBIN is differential) external clock output pin.
The connections to the global and regional clocks from the top clock pins and
enhanced PLL outputs are shown in Table 2–20. The connections to the clocks from
the bottom clock pins are shown in Table 2–21.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–78
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
RCLK31
RCLK30
RCLK29
RCLK28
RCLK27
RCLK26
RCLK25
RCLK24
CLK15
CLK14
CLK13
DLLCLK
Top Side Global and
Regional Clock Network
Connectivity
CLK12
Table 2–20. Global and Regional Clock Connections from Top Clock Pins and Enhanced PLL Outputs
Clock pins
CLK12p
v
v
v
—
—
v
—
—
—
v
—
—
—
CLK13p
v
v
v
—
—
—
v
—
—
—
v
—
—
CLK14p
v
—
—
v
v
—
—
v
—
—
—
v
—
CLK15p
v
—
—
v
v
—
—
—
v
—
—
—
v
CLK12n
—
v
—
—
—
v
—
—
—
v
—
—
—
CLK13n
—
—
v
—
—
—
v
—
—
—
v
—
—
CLK14n
—
—
—
v
—
—
—
v
—
—
—
v
—
CLK15n
—
—
—
—
v
—
—
—
v
—
—
—
v
GCLKDRV0
—
v
—
—
—
—
—
—
—
—
—
—
—
GCLKDRV1
—
—
v
—
—
—
—
—
—
—
—
—
—
GCLKDRV2
—
—
—
v
—
—
—
—
—
—
—
—
—
GCLKDRV3
—
—
—
—
v
—
—
—
—
—
—
—
—
RCLKDRV0
—
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV1
—
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV2
—
—
—
—
—
—
—
v
—
—
—
v
—
Drivers from internal logic
RCLKDRV3
—
—
—
—
—
—
—
—
v
—
—
—
v
RCLKDRV4
—
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV5
—
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV6
—
—
—
—
—
—
—
v
—
—
—
v
—
RCLKDRV7
—
—
—
—
—
—
—
—
v
—
—
—
v
c0
v
v
v
—
—
v
—
—
—
v
—
—
—
c1
v
v
v
—
—
—
v
—
—
—
v
—
—
c2
v
—
—
v
v
—
—
v
—
—
—
v
—
c3
v
—
—
v
v
—
—
—
v
—
—
—
v
c4
v
—
—
—
—
v
—
v
—
v
—
v
—
c5
v
—
—
—
—
—
v
—
v
—
v
—
v
c0
—
v
v
—
—
v
—
—
—
v
—
—
—
c1
—
v
v
—
—
—
v
—
—
—
v
—
—
c2
—
—
—
v
v
—
—
v
—
—
—
v
—
Enhanced PLL5 outputs
Enhanced PLL 11 outputs
c3
—
—
—
v
v
—
—
—
v
—
—
—
v
c4
—
—
—
—
—
v
—
v
—
v
—
v
—
c5
—
—
—
—
—
—
v
—
v
—
v
—
v
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
2–79
RCLK15
RCLK14
RCLK13
RCLK12
RCLK11
RCLK10
RCLK9
RCLK8
CLK7
CLK6
CLK5
CLK4
Bottom Side Global and
Regional Clock Network
Connectivity
DLLCLK
Table 2–21. Global and Regional Clock Connections from Bottom Clock Pins and Enhanced PLL Outputs
Clock pins
CLK4p
v
v
v
—
—
v
—
—
—
v
—
—
—
CLK5p
v
v
v
—
—
—
v
—
—
—
v
—
—
CLK6p
v
—
—
v
v
—
—
v
—
—
—
v
—
CLK7p
v
—
—
v
v
—
—
—
v
—
—
—
v
CLK4n
—
v
—
—
—
v
—
—
—
v
—
—
—
CLK5n
—
—
v
—
—
—
v
—
—
—
v
—
—
CLK6n
—
—
—
v
—
—
—
v
—
—
—
v
—
CLK7n
—
—
—
—
v
—
—
—
v
—
—
—
v
GCLKDRV0
—
v
—
—
—
—
—
—
—
—
—
—
—
GCLKDRV1
—
—
v
—
—
—
—
—
—
—
—
—
—
GCLKDRV2
—
—
—
v
—
—
—
—
—
—
—
—
—
GCLKDRV3
—
—
—
—
v
—
—
—
—
—
—
—
—
RCLKDRV0
—
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV1
—
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV2
—
—
—
—
—
—
—
v
—
—
—
v
—
RCLKDRV3
—
—
—
—
—
—
—
—
v
—
—
—
v
RCLKDRV4
—
—
—
—
—
v
—
—
—
v
—
—
—
RCLKDRV5
—
—
—
—
—
—
v
—
—
—
v
—
—
RCLKDRV6
—
—
—
—
—
—
—
v
—
—
—
v
—
RCLKDRV7
—
—
—
—
—
—
—
—
v
—
—
—
v
c0
v
v
v
—
—
v
—
—
—
v
—
—
—
c1
v
v
v
—
—
—
v
—
—
—
v
—
—
c2
v
—
—
v
v
—
—
v
—
—
c3
v
—
—
v
v
—
—
—
v
—
—
—
v
c4
v
—
—
—
—
v
—
v
—
v
—
v
—
c5
v
—
—
—
—
—
v
—
v
—
v
—
v
c0
—
v
v
—
—
v
—
—
—
v
—
—
—
c1
—
v
v
—
—
—
v
—
—
—
v
—
—
c2
—
—
—
v
v
—
—
v
—
—
—
v
—
c3
—
—
—
v
v
—
—
—
v
—
—
—
v
c4
—
—
—
—
—
v
—
v
—
v
—
v
—
c5
—
—
—
—
—
—
v
—
v
—
v
—
v
Drivers from internal logic
Enhanced PLL 6 outputs
v
Enhanced PLL 12 outputs
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–80
Chapter 2: Arria GX Architecture
PLLs and Clock Networks
Enhanced PLLs
Arria GX devices contain up to four enhanced PLLs with advanced clock
management features. These features include support for external clock feedback
mode, spread-spectrum clocking, and counter cascading. Figure 2–65 shows a
diagram of the enhanced PLL.
Figure 2–65. Arria GX Enhanced PLL
(Note 1)
From Adjacent PLL
VCO Phase Selection
Selectable at Each
PLL Output Port
Clock
Switchover
Circuitry
Post-Scale
Counters
Spread
Spectrum
Phase Frequency
Detector
/c0
INCLK[3..0]
/c1
4
/n
PFD
Charge
Pump
Loop
Filter
8
VCO
Global or
Regional
Clock
4
Global
Clocks
8
Regional
Clocks
/c2
6
/c3
6
/m
I/O Buffers (3)
/c4
(2)
/c5
FBIN
Shaded Portions of the
PLL are Reconfigurable
to I/O or general
routing
Lock Detect
& Filter
VCO Phase Selection
Affecting All Outputs
Notes to Figure 2–65:
(1)
(2)
(3)
(4)
Each clock source can come from any of the four clock pins that are physically located on the same side of the device as the PLL.
If the feedback input is used, you will lose one (or two, if FBIN is differential) external clock output pin.
Each enhanced PLL has three differential external clock outputs or six single-ended external clock outputs.
The global or regional clock input can be driven by an output from another PLL, a pin-driven dedicated global or regional clock, or through a clock
control block provided the clock control block is fed by an output from another PLL or a pin-driven dedicated global or regional clock. An internally
generated global signal cannot drive the PLL.
Fast PLLs
Arria GX devices contain up to four fast PLLs with high-speed serial interfacing
ability. Fast PLLs offer high-speed outputs to manage the high-speed differential I/O
interfaces. Figure 2–66 shows a diagram of the fast PLL.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–81
Figure 2–66. Arria GX Device Fast PLL
Clock
Switchover
Circuitry (4)
Global or
regional clock (1)
Phase
Frequency
Detector
Post-Scale
Counters
diffioclk0 (2)
load_en0 (3)
÷c0
÷n
4
Clock
Input
VCO Phase Selection
Selectable at each PLL
Output Port
PFD
Charge
Pump
Loop
Filter
VCO
÷k
8
load_en1 (3)
÷c1
diffioclk1 (2)
4
Global clocks
÷c2
4
Global or
regional clock (1)
8
Regional clocks
÷c3
÷m
8
to DPA block
Shaded Portions of the
PLL are Reconfigurable
Notes to Figure 2–66:
(1) The global or regional clock input can be driven by an output from another PLL, a pin-driven dedicated global or regional clock, or through a clock
control block provided the clock control block is fed by an output from another PLL or a pin-driven dedicated global or regional clock. An internally
generated global signal cannot drive the PLL.
(2) In high-speed differential I/O support mode, this high-speed PLL clock feeds the serializer/deserializer (SERDES) circuitry. Arria GX devices only
support one rate of data transfer per fast PLL in high-speed differential I/O support mode.
(3) This signal is a differential I/O SERDES control signal.
(4) Arria GX fast PLLs only support manual clock switchover.
f
For more information about enhanced and fast PLLs, refer to the PLLs in Arria GX
Devices chapter. For more information about high-speed differential I/O support,
refer to “High-Speed Differential I/O with DPA Support” on page 2–99.
I/O Structure
Arria GX IOEs provide many features, including:
© December 2009
■
Dedicated differential and single-ended I/O buffers
■
3.3-V, 64-bit, 66-MHz PCI compliance
■
3.3-V, 64-bit, 133-MHz PCI-X 1.0 compliance
■
JTAG boundary-scan test (BST) support
■
On-chip driver series termination
■
OCT for differential standards
■
Programmable pull-up during configuration
■
Output drive strength control
■
Tri-state buffers
■
Bus-hold circuitry
■
Programmable pull-up resistors
■
Programmable input and output delays
■
Open-drain outputs
■
DQ and DQS I/O pins
■
DDR registers
Altera Corporation
Arria GX Device Handbook, Volume 1
2–82
Chapter 2: Arria GX Architecture
I/O Structure
The IOE in Arria GX devices contains a bidirectional I/O buffer, six registers, and a
latch for a complete embedded bidirectional single data rate or DDR transfer.
Figure 2–67 shows the Arria GX IOE structure. The IOE contains two input registers
(plus a latch), two output registers, and two output enable registers. The design can
use both input registers and the latch to capture DDR input and both output registers
to drive DDR outputs. Additionally, the design can use the output enable (OE)
register for fast clock-to-output enable timing. The negative edge-clocked OE register
is used for DDR SDRAM interfacing. The Quartus II software automatically
duplicates a single OE register that controls multiple output or bidirectional pins.
Figure 2–67. Arria GX IOE Structure
Logic Array
OE Register
OE
D
Q
OE Register
D
Q
Output Register
Output A
D
Q
CLK
Output Register
Output B
D
Q
Input Register
D
Q
Input A
Input B
Input Register
D
Q
Input Latch
D
Q
ENA
The IOEs are located in I/O blocks around the periphery of the Arria GX device.
There are up to four IOEs per row I/O block and four IOEs per column I/O block.
Row I/O blocks drive row, column, or direct link interconnects. Column I/O blocks
drive column interconnects.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–83
Figure 2–68 shows how a row I/O block connects to the logic array.
Figure 2–68. Row I/O Block Connection to the Interconnect
R4 & R24
Interconnects
C4 Interconnect
I/O Block Local
Interconnect
32 Data & Control
Signals from
Logic Array (1)
32
LAB
Horizontal
I/O Block
io_dataina[3..0]
io_datainb[3..0]
Direct Link
Interconnect
to Adjacent LAB
Direct Link
Interconnect
to Adjacent LAB
io_clk[7:0]
LAB Local
Interconnect
Horizontal I/O
Block Contains
up to Four IOEs
Note to Figure 2–68:
(1) The 32 data and control signals consist of eight data out lines: four lines each for DDR applications io_dataouta[3..0] and
io_dataoutb[3..0], four output enables io_oe[3..0], four input clock enables io_ce_in[3..0], four output clock enables
io_ce_out[3..0], four clocks io_clk[3..0], four asynchronous clear and preset signals io_aclr/apreset[3..0], and four
synchronous clear and preset signals io_sclr/spreset[3..0].
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–84
Chapter 2: Arria GX Architecture
I/O Structure
Figure 2–69 shows how a column I/O block connects to the logic array.
Figure 2–69. Column I/O Block Connection to the Interconnect
32 Data &
Control Signals
from Logic Array (1)
Vertical I/O
Block Contains
up to Four IOEs
Vertical I/O Block
32
IO_dataina[3..0]
IO_datainb[3..0]
io_clk[7..0]
I/O Block
Local Interconnect
R4 & R24
Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
C4 & C16
Interconnects
Note to Figure 2–69:
(1) The 32 data and control signals consist of eight data out lines: four lines each for DDR applications io_dataouta[3..0] and
io_dataoutb[3..0], four output enables io_oe[3..0], four input clock enables io_ce_in[3..0], four output clock enables
io_ce_out[3..0], four clocks io_clk[3..0], four asynchronous clear and preset signals io_aclr/apreset[3..0], and four
synchronous clear and preset signals io_sclr/spreset[3..0] .
There are 32 control and data signals that feed each row or column I/O block. These
control and data signals are driven from the logic array. The row or column IOE
clocks, io_clk[7..0], provide a dedicated routing resource for low-skew,
high-speed clocks. I/O clocks are generated from global or regional clocks (refer to
“PLLs and Clock Networks” on page 2–66).
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–85
Figure 2–70 shows the signal paths through the I/O block.
Figure 2–70. Signal Path Through the I/O Block
Row or Column
io_clk[7..0]
To Logic
Array
To Other
IOEs
io_dataina
io_datainb
oe
ce_in
io_oe
ce_out
io_ce_in
Control
Signal
Selection
io_ce_out
IOE
aclr/apreset
sclr/spreset
io_aclr
From Logic
Array
clk_in
io_sclr
clk_out
io_clk
io_dataouta
io_dataoutb
Each IOE contains its own control signal selection for the following control signals:
oe, ce_in, ce_out, aclr/apreset, sclr/spreset, clk_in, and clk_out.
Figure 2–71 shows the control signal selection.
Figure 2–71. Control Signal Selection per IOE (Note 1)
Dedicated I/O
Clock [7..0]
Local
Interconnect
io_oe
Local
Interconnect
io_sclr
Local
Interconnect
io_aclr
Local
Interconnect
io_ce_out
Local
Interconnect
io_ce_in
Local
Interconnect
io_clk
ce_out
clk_out
clk_in
ce_in
sclr/spreset
aclr/apreset
oe
Notes to Figure 2–71:
(1) Control signals ce_in, ce_out, aclr/apreset, sclr/spreset, and oe can be global signals even though their control selection
multiplexers are not directly fed by the ioe_clk[7..0] signals. The ioe_clk signals can drive the I/O local interconnect, which then drives
the control selection multiplexers.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–86
Chapter 2: Arria GX Architecture
I/O Structure
In normal bidirectional operation, you can use the input register for input data
requiring fast setup times. The input register can have its own clock input and clock
enable separate from the OE and output registers. The output register can be used for
data requiring fast clock-to-output performance. You can use the OE register for fast
clock-to-output enable timing. The OE and output register share the same clock
source and the same clock enable source from the local interconnect in the associated
LAB, dedicated I/O clocks, and the column and row interconnects. Figure 2–72 shows
the IOE in bidirectional configuration.
Figure 2–72. Arria GX IOE in Bidirectional I/O Configuration (Note 1)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
oe
OE Register
D
Q
clkout
ce_out
ENA
CLRN/PRN
OE Register
tCO Delay
VCCIO
PCI Clamp (2)
VCCIO
Programmable
Pull-Up
Resistor
aclr/apreset
Chip-Wide Reset
Output Register
D
sclr/spreset
Q
Output
Pin Delay
On-Chip
Termination
Drive Strength Control
ENA
Open-Drain Output
CLRN/PRN
Input Pin to
Logic Array Delay
Input Register
clkin
ce_in
D
Input Pin to
Input Register Delay
Bus-Hold
Circuit
Q
ENA
CLRN/PRN
Notes to Figure 2–72:
(1) All input signals to the IOE can be inverted at the IOE.
(2) The optional PCI clamp is only available on column I/O pins.
The Arria GX device IOE includes programmable delays that can be activated to
ensure input IOE register-to-logic array register transfers, input pin-to-logic array
register transfers, or output IOE register-to-pin transfers.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–87
A path in which a pin directly drives a register can require the delay to ensure zero
hold time, whereas a path in which a pin drives a register through combinational logic
may not require the delay. Programmable delays exist for decreasing
input-pin-to-logic-array and IOE input register delays. The Quartus II Compiler can
program these delays to automatically minimize setup time while providing a zero
hold time. Programmable delays can increase the register-to-pin delays for output
and/or output enable registers. Programmable delays are no longer required to
ensure zero hold times for logic array register-to-IOE register transfers. The Quartus II
Compiler can create zero hold time for these transfers. Table 2–22 shows the
programmable delays for Arria GX devices.
Table 2–22. Arria GX Devices Programmable Delay Chain
Programmable Delays
Quartus II Logic Option
Input pin to logic array delay
Input delay from pin to internal cells
Input pin to input register delay
Input delay from pin to input register
Output pin delay
Delay from output register to output pin
Output enable register t CO delay
Delay to output enable pin
IOE registers in Arria GX devices share the same source for clear or preset. You can
program preset or clear for each individual IOE. You can also program the registers to
power up high or low after configuration is complete. If programmed to power up
low, an asynchronous clear can control the registers. If programmed to power up
high, an asynchronous preset can control the registers. This feature prevents the
inadvertent activation of another device’s active-low input upon power-up. If one
register in an IOE uses a preset or clear signal, all registers in the IOE must use that
same signal if they require preset or clear. Additionally, a synchronous reset signal is
available for the IOE registers.
Double Data Rate I/O Pins
Arria GX devices have six registers in the IOE, which support DDR interfacing by
clocking data on both positive and negative clock edges. The IOEs in Arria GX devices
support DDR inputs, DDR outputs, and bidirectional DDR modes. When using the
IOE for DDR inputs, the two input registers clock double rate input data on
alternating edges. An input latch is also used in the IOE for DDR input acquisition.
The latch holds the data that is present during the clock high times, allowing both bits
of data to be synchronous with the same clock edge (either rising or falling).
Figure 2–73 shows an IOE configured for DDR input. Figure 2–74 shows the DDR
input timing diagram.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–88
Chapter 2: Arria GX Architecture
I/O Structure
Figure 2–73. Arria GX IOE in DDR Input I/O Configuration
(Note 1)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
VCCIO
To DQS Logic
Block (3)
DQS Local
Bus (2)
PCI Clamp (4)
VCCIO
Programmable
Pull-Up
Resistor
On-Chip
Termination
Input Pin to
Input RegisterDelay
sclr/spreset
Input Register
D
Q
clkin
ENA
CLRN/PRN
ce_in
Bus-Hold
Circuit
aclr/apreset
Chip-Wide Reset
Latch
Input Register
D
Q
D
Q
ENA
CLRN/PRN
ENA
CLRN/PRN
Notes to Figure 2–73:
(1)
(2)
(3)
(4)
All input signals to the IOE can be inverted at the IOE.
This signal connection is only allowed on dedicated DQ function pins.
This signal is for dedicated DQS function pins only.
The optional PCI clamp is only available on column I/O pins.
Figure 2–74. Input Timing Diagram in DDR Mode
Data at
input pin
B0
A0
B1
A1
B2
A2
B3
A3
B4
CLK
A0
A1
A2
A3
B0
B1
B2
B3
Input To
Logic Array
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–89
When using the IOE for DDR outputs, the two output registers are configured to clock
two data paths from ALMs on rising clock edges. These output registers are
multiplexed by the clock to drive the output pin at a ×2 rate. One output register
clocks the first bit out on the clock high time, while the other output register clocks the
second bit out on the clock low time. Figure 2–75 shows the IOE configured for DDR
output. Figure 2–76 shows the DDR output timing diagram.
Figure 2–75. Arria GX IOE in DDR Output I/O Configuration Notes (1), (2)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
oe
OE Register
D
Q
clkout
ENA
CLRN/PRN
OE Register
tCO Delay
ce_out
aclr/apreset
VCCIO
PCI Clamp (3)
Chip-Wide Reset
OE Register
D
VCCIO
Q
sclr/spreset
ENA
CLRN/PRN
Used for
DDR, DDR2
SDRAM
Programmable
Pull-Up
Resistor
Output Register
D
Q
ENA
CLRN/PRN
Output Register
D
Output
Pin Delay
On-Chip
Termination
clk
Drive Strength
Control
Open-Drain Output
Q
ENA
CLRN/PRN
Bus-Hold
Circuit
Notes to Figure 2–75:
(1) All input signals to the IOE can be inverted at the IOE.
(2) The tri-state buffer is active low. The DDIO megafunction represents the tri-state buffer as active-high with an inverter at the OE register data port.
(3) The optional PCI clamp is only available on column I/O pins.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–90
Chapter 2: Arria GX Architecture
I/O Structure
Figure 2–76. Output Timing Diagram in DDR Mode
CLK
A1
A2
A3
A4
B1
B2
B3
B4
From Internal
Registers
DDR output
B1
A1
B2
A2
B3
A3
B4
A4
The Arria GX IOE operates in bidirectional DDR mode by combining the DDR input
and DDR output configurations. The negative-edge-clocked OE register holds the OE
signal inactive until the falling edge of the clock to meet DDR SDRAM timing
requirements.
External RAM Interfacing
In addition to the six I/O registers in each IOE, Arria GX devices also have dedicated
phase-shift circuitry for interfacing with external memory interfaces, including DDR,
DDR2 SDRAM, and SDR SDRAM. In every Arria GX device, the I/O banks at the top
(Banks 3 and 4) and bottom (Banks 7 and 8) of the device support DQ and DQS signals
with DQ bus modes of ×4, ×8/×9, ×16/×18, or ×32/×36. Table 2–23 shows the number
of DQ and DQS buses that are supported per device.
Table 2–23. DQS and DQ Bus Mode Support (Note 1)
Device
EP1AGX20
EP1AGX35
EP1AGX50/60
EP1AGX90
Number of
×4 Groups
Number of
×8/×9 Groups
Number of
×16/×18 Groups
Number of
×32/×36 Groups
484-pin FineLine BGA
2
0
0
0
484-pin FineLine BGA
2
0
0
0
780-pin FineLine BGA
18
8
4
0
484-pin FineLine BGA
2
0
0
0
780-pin FineLine BGA
18
8
4
0
1,152-pin FineLine
BGA
36
18
8
4
1,152-pin FineLine
BGA
36
18
8
4
Package
Note to Table 2–23:
(1) Numbers are preliminary until devices are available.
A compensated delay element on each DQS pin automatically aligns input DQS
synchronization signals with the data window of their corresponding DQ data
signals. The DQS signals drive a local DQS bus in the top and bottom I/O banks. This
DQS bus is an additional resource to the I/O clocks and is used to clock DQ input
registers with the DQS signal.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–91
The Arria GX device has two phase-shifting reference circuits, one on the top and one
on the bottom of the device. The circuit on the top controls the compensated delay
elements for all DQS pins on the top. The circuit on the bottom controls the
compensated delay elements for all DQS pins on the bottom.
Each phase-shifting reference circuit is driven by a system reference clock, which must
have the same frequency as the DQS signal. Clock pins CLK[15..12]p feed phase
circuitry on the top of the device and clock pins CLK[7..4]p feed phase circuitry on
the bottom of the device. In addition, PLL clock outputs can also feed the
phase-shifting reference circuits. Figure 2–77 shows the phase-shift reference circuit
control of each DQS delay shift on the top of the device. This same circuit is
duplicated on the bottom of the device.
Figure 2–77. DQS Phase-Shift Circuitry (Note 1), (2)
From PLL 5 (4)
DQS
Pin
DQS
Pin
Dt
Dt
to IOE
to IOE
CLK[15..12]p (3)
DQS
Phase-Shift
Circuitry
DQS
Pin
DQS
Pin
Dt
Dt
to IOE
to IOE
Notes to Figure 2–77:
(1) There are up to 18 pairs of DQS pins available on the top or bottom of the Arria GX device. There are up to 10 pairs on the right side and 8 pairs
on the left side of the DQS phase-shift circuitry.
(2) The “t” module represents the DQS logic block.
(3) Clock pins CLK[15..12]p feed phase-shift circuitry on the top of the device and clock pins CLK[7..4]p feed the phase circuitry on the
bottom of the device. You can also use a PLL clock output as a reference clock to phase shift circuitry.
(4) You can only use PLL 5 to feed the DQS phase-shift circuitry on the top of the device and PLL 6 to feed the DQS phase-shift circuitry on the bottom
of the device.
These dedicated circuits combined with enhanced PLL clocking and phase-shift
ability provide a complete hardware solution for interfacing to high-speed memory.
f
For more information about external memory interfaces, refer to the External Memory
Interfaces in Arria GX Devices chapter.
Programmable Drive Strength
The output buffer for each Arria GX device I/O pin has a programmable drive
strength control for certain I/O standards. The LVTTL, LVCMOS, SSTL, and HSTL
standards have several levels of drive strength that you can control. The default
setting used in the Quartus II software is the maximum current strength setting that is
used to achieve maximum I/O performance. For all I/O standards, the minimum
setting is the lowest drive strength that guarantees the IOH/IOL of the standard. Using
minimum settings provides signal slew rate control to reduce system noise and signal
overshoot.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–92
Chapter 2: Arria GX Architecture
I/O Structure
Table 2–24 shows the possible settings for I/O standards with drive strength control.
Table 2–24. Programmable Drive Strength (Note 1)
I OH / IOL Current Strength
Setting (mA) for Column
I/O Pins
IOH / IOL Current Strength
Setting (mA) for Row I/O
Pins
3.3-V LVTTL
24, 20, 16, 12, 8, 4
12, 8, 4
3.3-V LVCMOS
24, 20, 16, 12, 8, 4
8, 4
2.5-V LVTTL/LVCMOS
16, 12, 8, 4
12, 8, 4
1.8-V LVTTL/LVCMOS
12, 10, 8, 6, 4, 2
8, 6, 4, 2
1.5-V LVCMOS
8, 6, 4, 2
4, 2
SSTL-2 Class I
12, 8
12, 8
I/O Standard
SSTL-2 Class II
24, 20, 16
16
SSTL-18 Class I
12, 10, 8, 6, 4
10, 8, 6, 4
SSTL-18 Class II
20, 18, 16, 8
—
HSTL-18 Class I
12, 10, 8, 6, 4
12, 10, 8, 6, 4
HSTL-18 Class II
20, 18, 16
—
HSTL-15 Class I
12, 10, 8, 6, 4
8, 6, 4
HSTL-15 Class II
20, 18, 16
—
Note to Table 2–24:
(1) The Quartus II software default current setting is the maximum setting for each I/O standard.
Open-Drain Output
Arria GX devices provide an optional open-drain (equivalent to an open collector)
output for each I/O pin. This open-drain output enables the device to provide
system-level control signals (for example, interrupt and write enable signals) that can
be asserted by any of several devices.
Bus Hold
Each Arria GX device I/O pin provides an optional bus-hold feature. Bus-hold
circuitry can hold the signal on an I/O pin at its last-driven state. Because the
bus-hold feature holds the last-driven state of the pin until the next input signal is
present, an external pull-up or pull-down resistor is not needed to hold a signal level
when the bus is tri-stated.
Bus-hold circuitry also pulls undriven pins away from the input threshold voltage
where noise can cause unintended high-frequency switching. You can select this
feature individually for each I/O pin. The bus-hold output drives no higher than
VCCIO to prevent overdriving signals. If the bus-hold feature is enabled, the
programmable pull-up option cannot be used. Disable the bus-hold feature when the
I/O pin has been configured for differential signals.
Bus-hold circuitry uses a resistor with a nominal resistance (RBH) of approximately
7 k to pull the signal level to the last-driven state. This information is provided for
each VCCIO voltage level. Bus-hold circuitry is active only after configuration. When
going into user mode, the bus-hold circuit captures the value on the pin present at the
end of configuration.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
f
2–93
For the specific sustaining current driven through this resistor and overdrive current
used to identify the next-driven input level, refer to the DC & Switching Characteristics
chapter.
Programmable Pull-Up Resistor
Each Arria GX device I/O pin provides an optional programmable pull-up resistor
during user mode. If you enable this feature for an I/O pin, the pull-up resistor
(typically 25 k) holds the output to the VCCIO level of the output pin’s bank.
Advanced I/O Standard Support
Arria GX device IOEs support the following I/O standards:
© December 2009
■
3.3-V LVTTL/LVCMOS
■
2.5-V LVTTL/LVCMOS
■
1.8-V LVTTL/LVCMOS
■
1.5-V LVCMOS
■
3.3-V PCI
■
3.3-V PCI-X mode 1
■
LVDS
■
LVPECL (on input and output clocks only)
■
Differential 1.5-V HSTL class I and II
■
Differential 1.8-V HSTL class I and II
■
Differential SSTL-18 class I and II
■
Differential SSTL-2 class I and II
■
1.2-V HSTL class I and II
■
1.5-V HSTL class I and II
■
1.8-V HSTL class I and II
■
SSTL-2 class I and II
■
SSTL-18 class I and II
Altera Corporation
Arria GX Device Handbook, Volume 1
2–94
Chapter 2: Arria GX Architecture
I/O Structure
Table 2–25 describes the I/O standards supported by Arria GX devices.
Table 2–25. Arria GX Devices Supported I/O Standards
I/O Standard
Type
Input Reference
Voltage
(VREF ) (V)
Output Supply
Voltage
(VCCIO ) (V)
Board
Termination
Voltage (VTT ) (V)
LVTTL
Single-ended
—
3.3
—
LVCMOS
Single-ended
—
3.3
—
2.5 V
Single-ended
—
2.5
—
1.8 V
Single-ended
—
1.8
—
1.5-V LVCMOS
Single-ended
—
1.5
—
3.3-V PCI
Single-ended
—
3.3
—
3.3-V PCI-X mode 1
Single-ended
—
3.3
—
LVDS
Differential
—
2.5 (3)
—
LVPECL (1)
Differential
—
3.3
—
HyperTransport technology
Differential
—
2.5 (3)
—
Differential 1.5-V HSTL class I and II (2) Differential
0.75
1.5
0.75
Differential 1.8-V HSTL class I and II (2) Differential
0.90
1.8
0.90
Differential SSTL-18 class I and II (2)
Differential
0.90
1.8
0.90
Differential SSTL-2 class I and II (2)
Differential
1.25
2.5
1.25
1.2-V HSTL (4)
Voltage-referenced
0.6
1.2
0.6
1.5-V HSTL class I and II
Voltage-referenced
0.75
1.5
0.75
1.8-V HSTL class I and II
Voltage-referenced
0.9
1.8
0.9
SSTL-18 class I and II
Voltage-referenced
0.90
1.8
0.90
SSTL-2 class I and II
Voltage-referenced
1.25
2.5
1.25
Notes to Table 2–25:
(1) This I/O standard is only available on input and output column clock pins.
(2) This I/O standard is only available on input clock pins and DQS pins in I/O banks 3, 4, 7, and 8, and output clock pins in I/O banks 9, 10, 11,
and 12.
(3) VCCIO is 3.3 V when using this I/O standard in input and output column clock pins (in I/O banks 3, 4, 7, 8, 9, 10, 11, and 12).
(4) 1.2-V HSTL is only supported in I/O banks 4, 7, and 8.
f
For more information about the I/O standards supported by Arria GX I/O banks,
refer to the Selectable I/O Standards in Arria GX Devices chapter.
Arria GX devices contain six I/O banks and four enhanced PLL external clock output
banks, as shown in Figure 2–78. The two I/O banks on the left of the device contain
circuitry to support source-synchronous, high-speed differential I/O for LVDS inputs
and outputs. These banks support all Arria GX I/O standards except PCI or PCI-X
I/O pins, and SSTL-18 class II and HSTL outputs. The top and bottom I/O banks
support all single-ended I/O standards. Additionally, enhanced PLL external clock
output banks allow clock output capabilities such as differential support for SSTL and
HSTL.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–95
Figure 2–78. Arria GX I/O Banks
DQS ×8
PLL7
DQS ×8
(Note 1), (2)
DQS ×8
DQS ×8
VREF0B3 VREF1B3 VREF2B3 VREF3B3 VREF4B3
Bank 11
Bank 2
VREF3B1 VREF4B1
PLL2
DQS ×8
DQS ×8
DQS ×8
DQS ×8
Bank 4
Bank 9
This I/O bank supports LVDS
and LVPECL standards for input clock
operation. Differential HSTL and
differential SSTL standards are
supported for both input and output
operations. (3)
Bank 1
Bank 8
VREF4B8 VREF3B8 VREF2B8 VREF1B8 VREF0B8
DQS ×8
DQS ×8
DQS ×8
DQS ×8
Bank 12
Bank 10
PLL12
PLL6
Transmitter: Bank 13
Receiver: Bank 13
REFCLK: Bank 13
Transmitter: Bank 14
Receiver: Bank 14
REFCLK: Bank 14
I/O banks 7, 8, 10 and 12 support all single-ended I/O
standards for both input and output operations. All differential
I/O standards are supported for both input and output operations
at I/O banks 10 and 12.
This I/O bank supports LVDS
This I/O bank supports LVDS
and LVPECL standards for input clock operation.
and LVPECL standards for input clock
Differential HSTL and differential
operation. Differential HSTL and differential
SSTL standards are supported
SSTL standards are supported
for both input and output operations. (3)
for both input and output operations. (3)
VREF0B1 VREF1B1
VREF2B1
DQS ×8
VREF0B4 VREF1B4 VREF2B4 VREF3B4 VREF4B4
I/O banks 1 & 2 support LVTTL, LVCMOS,
2.5 V, 1.8 V, 1.5 V, SSTL-2, SSTL-18 class I,
LVDS, pseudo-differential SSTL-2 and pseudo-differential
SSTL-18 class I standards for both input and output
operations. HSTL, SSTL-18 class II,
pseudo-differential HSTL and pseudo-differential
SSTL-18 class II standards are only supported for
input operations. (4)
PLL1
PLL8
PLL5
This I/O bank supports LVDS
and LVPECL standards
for input clock operations. Differential HSTL
and differential SSTL standards
are supported for both input
and output operations. (3)
I/O Banks 3, 4, 9, and 11 support all single-ended
I/O standards for both input and output operations.
All differential I/O standards are supported for both
input and output operations at I/O banks 9 and 11.
VREF0B2 VREF1B2
VREF2B2
VREF3B2 VREF4B2
Bank 3
PLL11
Transmitter: Bank 15
Receiver: Bank 15
REFCLK: Bank 15
Bank 7
VREF4B7 VREF3B7 VREF2B7 VREF1B7 VREF0B7
DQS ×8
DQS ×8
DQS ×8
DQS ×8
DQS ×8
Notes to Figure 2–78:
(1) Figure 2–78 is a top view of the silicon die that corresponds to a reverse view for flip chip packages. It is a graphical representation only.
(2) Depending on the size of the device, different device members have different numbers of VREF groups. For the exact locations, refer to the pin list
and the Quartus II software.
(3) Banks 9 through 12 are enhanced PLL external clock output banks.
(4) Horizontal I/O banks feature SERDES and DPA circuitry for high-speed differential I/O standards. For more information about differential I/O
standards, refer to the High-Speed Differential I/O Interfaces in Arria GX Devices chapter.
Each I/O bank has its own VCCIO pins. A single device can support
1.5-, 1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different VCCIO level
independently. Each bank also has dedicated VREF pins to support the
voltage-referenced standards (such as SSTL-2).
Each I/O bank can support multiple standards with the same VCCIO for input and
output pins. Each bank can support one VREF voltage level. For example, when VCCIO is
3.3 V, a bank can support LVTTL, LVCMOS, and 3.3-V PCI for inputs and outputs.
On-Chip Termination
Arria GX devices provide differential (for the LVDS technology I/O standard) and
on-chip series termination to reduce reflections and maintain signal integrity. There is
no calibration support for these on-chip termination resistors. On-chip termination
simplifies board design by minimizing the number of external termination resistors
required. Termination can be placed inside the package, eliminating small stubs that
can still lead to reflections.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–96
Chapter 2: Arria GX Architecture
I/O Structure
Arria GX devices provide two types of termination:
■
On-chip differential termination (R D OCT)
■
On-chip series termination (RS OCT)
Table 2–26 lists the Arria GX OCT support per I/O bank.
Table 2–26. On-Chip Termination Support by I/O Banks
On-Chip Termination Support
Series termination
Differential termination (1)
I/O Standard Support
Top and Bottom Banks
(3, 4, 7, 8)
Left Bank (1, 2)
3.3-V LVTTL
v
v
3.3-V LVCMOS
v
v
2.5-V LVTTL
v
v
2.5-V LVCMOS
v
v
1.8-V LVTTL
v
v
1.8-V LVCMOS
v
v
1.5-V LVTTL
v
v
1.5-V LVCMOS
v
v
SSTL-2 class I and II
v
v
SSTL-18 class I
v
v
SSTL-18 class II
v
—
1.8-V HSTL class I
v
v
1.8-V HSTL class II
v
—
1.5-V HSTL class I
v
v
1.2-V HSTL
v
—
LVDS
—
v
HyperTransport
technology
—
v
Note to Table 2–26:
(1) Clock pins CLK1 and CLK3, and pins FPLL[7..8]CLK do not support differential on-chip termination. Clock pins CLK0 and
CLK2, do support differential on-chip termination. Clock pins in the top and bottom banks (CLK[4..7, 12..15]) do not
support differential on-chip termination.
On-Chip Differential Termination (RD OCT)
Arria GX devices support internal differential termination with a nominal resistance
value of 100  for LVDS input receiver buffers. LVPECL input signals (supported on
clock pins only) require an external termination resistor. RD OCT is supported across
the full range of supported differential data rates as shown in the High-Speed I/O
Specifications section of the DC & Switching Characteristics chapter.
f
For more information about RD OCT, refer to the High-Speed Differential I/O Interfaces
with DPA in Arria GX Devices chapter.
f
For more information about tolerance specifications for R D OCT, refer to the DC &
Switching Characteristics chapter.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
I/O Structure
2–97
On-Chip Series Termination (R S OCT)
Arria GX devices support driver impedance matching to provide the I/O driver with
controlled output impedance that closely matches the impedance of the transmission
line. As a result, reflections can be significantly reduced. Arria GX devices support
RS OCT for single-ended I/O standards with typical R S values of 25 and 50 Once
matching impedance is selected, current drive strength is no longer selectable.
Table 2–26 shows the list of output standards that support RS OCT.
f
For more information about RS OCT supported by Arria GX devices, refer to the
Selectable I/O Standards in Arria GX Devices chapter.
f
For more information about tolerance specifications for OCT without calibration, refer
to the DC & Switching Characteristics chapter.
MultiVolt I/O Interface
The Arria GX architecture supports the MultiVolt I/O interface feature that allows
Arria GX devices in all packages to interface with systems of different supply
voltages. Arria GX VCCINT pins must always be connected to a 1.2-V power supply.
With a 1.2-V VCCINT level, input pins are 1.2-, 1.5-, 1.8-, 2.5-, and 3.3-V tolerant. The
VCCIO pins can be connected to either a 1.2-, 1.5-, 1.8-, 2.5-, or 3.3-V power supply,
depending on the output requirements. The output levels are compatible with
systems of the same voltage as the power supply (for example, when VCCIO pins are
connected to a 1.5-V power supply, the output levels are compatible with 1.5-V
systems). Arria GX VCCPD power pins must be connected to a 3.3-V power supply.
These power pins are used to supply the pre-driver power to the output buffers,
which increases the performance of the output pins. The VCCPD pins also power
configuration input pins and JTAG input pins.
Table 2–27 lists Arria GX MultiVolt I/O support.
Table 2–27. Arria GX MultiVolt I/O Support
(Note 1)
Input Signal (V)
VCCIO (V)
Output Signal (V)
1.2
1.5
1.8
2.5
3.3
1.2
1.5
1.8
2.5
3.3
5.0
1.2
(4)
v (2)
v (2)
v (2)
v (2)
v (4)
—
—
—
—
—
1.5
(4)
v
v
v (2)
v (2)
v (3)
v
—
—
—
—
1.8
(4)
v
v
v (2)
v (2)
v (3)
v (3)
v
—
—
—
2.5
(4)
—
—
v
v
v (3)
v (3)
v (3)
v
—
—
3.3
(4)
—
—
v
v
v (3)
v (3)
v (3)
v (3)
v
v
Notes to Table 2–27:
(1) To drive inputs higher than VC C IO but less than 4.0 V, disable the PCI clamping diode and select the Allow LVTTL and LVCMOS input levels to
overdrive input buffer option in the Quartus II software.
(2) The pin current may be slightly higher than the default value. You must verify that the driving device’s VO L maximum and VO H minimum voltages do
not violate the applicable Arria GX V I L maximum and V I H minimum voltage specifications.
(3) Although VCC I O specifies the voltage necessary for the Arria GX device to drive out, a receiving device powered at a different level can still interface
with the Arria GX device if it has inputs that tolerate the VC C I O value.
(4) Arria GX devices support 1.2-V HSTL. They do not support 1.2-V LVTTL and 1.2-V LVCMOS.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–98
Chapter 2: Arria GX Architecture
I/O Structure
The TDO and nCEO pins are powered by VCCIO of the bank that they reside. TDO is in
I/O bank 4 and nCEO is in I/O Bank 7. Ideally, the VCC supplies for the I/O buffers of
any two connected pins are at the same voltage level. This may not always be possible
depending on the VCCIO level of TDO and nCEO pins on master devices and the
configuration voltage level chosen by VCCSEL on slave devices. Master and slave
devices can be in any position in the chain. The master device indicates that it is
driving out TDO or nCEO to a slave device. For multi-device passive configuration
schemes, the nCEO pin of the master device drives the nCE pin of the slave device. The
VCCSEL pin on the slave device selects which input buffer is used for nCE. When
VCCSEL is logic high, it selects the 1.8-V/1.5-V buffer powered by VCCIO. When VCCSEL is
logic low, it selects the 3.3-V/2.5-V input buffer powered by VCCPD . The ideal case is to
have the VCC IO of the nCEO bank in a master device match the VCCSEL settings for the
nCE input buffer of the slave device it is connected to, but that may not be possible
depending on the application.
Table 2–28 contains board design recommendations to ensure that nCEO can
successfully drive nCE for all power supply combinations.
Table 2–28. Board Design Recommendations for nCEO and nCE Input Buffer Power
nCE Input Buffer Power
in I/O Bank 3
VCCSEL high
Arria GX nCEO VCCIO Voltage Level in I/O Bank 7
VC C I O = 3.3 V
VC C I O = 2.5 V
VC C I O = 1.8 V
VC C I O = 1.5 V
VC C I O = 1.2 V
v (1), (2)
v (3), (4)
v (5)
v
v
v (1), (2)
v (3), (4)
v
v
v
v (4)
v (6)
(VCC I O Bank 3 = 1.5 V)
VCCSEL high
(VCC I O Bank 3 = 1.8 V)
VCCSEL low (nCE
powered by
VC C P D = 3.3 V)
Level shifter
required
Level shifter
required
Level shifter
required
Notes to Table 2–28:
(1)
(2)
(3)
(4)
(5)
(6)
Input buffer is 3.3-V tolerant.
The nCEO output buffer meets VO H (MIN) = 2.4 V.
Input buffer is 2.5-V tolerant.
The nCEO output buffer meets VO H (MIN) = 2.0 V.
Input buffer is 1.8-V tolerant.
An external 250- pull-up resistor is not required, but recommended if signal levels on the board are not optimal.
For JTAG chains, the TDO pin of the first device drives the TDI pin of the second
device in the chain. The VCCSEL input on JTAG input I/O cells (TCK, TMS, TDI, and
TRST) is internally hardwired to GND selecting the 3.3-V/2.5-V input buffer powered
by VCCPD. The ideal case is to have the VCCIO of the TDO bank from the first device to
match the VCCSEL settings for TDI on the second device, but that may not be possible
depending on the application. Table 2–29 contains board design recommendations to
ensure proper JTAG chain operation.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
2–99
Table 2–29. Supported TDO/TDI Voltage Combinations
Device
Arria GX
TDI Input
Buffer Power
Arria GX TDO VC C I O Voltage Level in I/O Bank 4
VC C I O = 3.3 V
VC C I O = 2.5 V
VC C I O = 1.8 V
VC C I O = 1.5 V
VC C I O = 1.2 V
Always VC C P D
(3.3 V)
v (1)
v (2)
v (3)
Level shifter
required
Level shifter
required
VCC = 3.3 V
v (1)
v (2)
v (3)
Level shifter
required
Level shifter
required
VCC = 2.5 V
v (1), (4)
v (2)
v (3)
Level shifter
required
Level shifter
required
VCC = 1.8 V
v (1), (4)
v (2), (5)
v
Level shifter
required
Level shifter
required
VCC = 1.5 V
v (1), (4)
v (2), (5)
v (6)
v
v
Non-Arria GX
Notes to Table 2–29:
(1)
(2)
(3)
(4)
(5)
(6)
The TDO output buffer meets VOH (MIN) = 2.4 V.
The TDO output buffer meets VOH (MIN) = 2.0 V.
An external 250- pull-up resistor is not required, but recommended if signal levels on the board are not optimal.
Input buffer must be 3.3-V tolerant.
Input buffer must be 2.5-V tolerant.
Input buffer must be 1.8-V tolerant.
High-Speed Differential I/O with DPA Support
Arria GX devices contain dedicated circuitry for supporting differential standards at
speeds up to 840 Mbps. LVDS differential I/O standards are supported in the Arria
GX device. In addition, the LVPECL I/O standard is supported on input and output
clock pins on the top and bottom I/O banks.
The high-speed differential I/O circuitry supports the following high-speed I/O
interconnect standards and applications:
■
SPI-4 Phase 2 (POS-PHY Level 4)
■
SFI-4
■
Parallel RapidIO standard
There are two dedicated high-speed PLLs (PLL1 and PLL2) in the EP1AGX20 and
EP1AGX35 devices and up to four dedicated high-speed PLLs (PLL1, PLL2, PLL7,
and PLL8) in the EP1AGX50, EP1AGX60, and EP1AGX90 devices to multiply
reference clocks and drive high-speed differential SERDES channels in I/O banks 1
and 2.
Table 2–30 through Table 2–34 list the number of channels that each fast PLL can clock
in each of the Arria GX devices. In Table 2–30 through Table 2–34 the first row for each
transmitter or receiver provides the maximum number of channels that each fast PLL
can drive in its adjacent I/O bank (I/O Bank 1 or I/O Bank 2). The second row shows
the maximum number of channels that each fast PLL can drive in both I/O banks
(I/O Bank 1 and I/O Bank 2). For example, in the 780-pin FineLine BGA EP1AGX20
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–100
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
device, PLL 1 can drive a maximum of 16 transmitter channels in I/O Bank 2 or a
maximum of 29 transmitter channels in I/O Banks 1 and 2. The Quartus II software
can also merge receiver and transmitter PLLs when a receiver is driving a transmitter.
In this case, one fast PLL can drive both the maximum numbers of receiver and
transmitter channels.
1
For more information, refer to the “Differential Pin Placement Guidelines” section in
the High-Speed Differential I/O Interfaces with DPA in Arria GX Devices chapter.
Table 2–30. EP1AGX20 Device Differential Channels
(Note 1)
Center Fast PLLs
Package
Transmitter/Receiver
Total Channels
Transmitter
29
Receiver
31
Transmitter
29
Receiver
31
484-pin FineLine BGA
780-pin FineLine GBA
PLL1
PLL2
16
13
13
16
17
14
14
17
16
13
13
16
17
14
14
17
Note to Table 2–30:
(1) The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used as data channels.
Table 2–31. EP1AGX35 Device Differential Channels (Note 1)
Center Fast PLLs
Package
Transmitter/Receiver
Transmitter
484-pin FineLine BGA
780-pin FineLine BGA
Total Channels
29
Receiver
31
Transmitter
29
Receiver
31
PLL1
PLL2
16
13
13
16
17
14
14
17
16
13
13
16
17
14
14
17
Note to Table 2–31:
(1) The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used as data channels.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
2–101
Table 2–32. EP1AGX50 Device Differential Channels (Note 1)
Transmitter/
Receiver
Package
Transmitter
484-pin
FineLine BGA
Receiver
Transmitter
780-pin
FineLine BGA
Receiver
Transmitter
1,152-pin
FineLine BGA
Receiver
Center Fast PLLs
Corner Fast PLLs
Total Channels
29
31
29
31
42
42
PLL1
PLL2
PLL7
PLL8
16
13
—
—
13
16
—
—
17
14
—
—
14
17
—
—
16
13
—
—
13
16
—
—
17
14
—
—
14
17
—
—
21
21
21
21
21
21
—
—
21
21
21
21
21
21
—
—
Note to Table 2–32:
(1) The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used as data channels.
Table 2–33. EP1AGX60 Device Differential Channels
Transmitter/
Receiver
Package
Transmitter
484-pin
FineLine BGA
Receiver
Transmitter
780-pin
FineLine BGA
Receiver
Transmitter
1,152-pin
FineLine BGA
Receiver
(Note 1)
Center Fast PLLs
Corner Fast PLLs
Total Channels
PLL1
29
31
29
31
42
42
PLL2
PLL7
PLL8
16
13
—
—
13
16
—
—
17
14
—
—
14
17
—
—
16
13
—
—
13
16
—
—
17
14
—
—
14
17
—
—
21
21
21
21
21
21
—
—
21
21
21
21
21
21
—
—
Note to Table 2–33:
(1) The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used as data channels.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–102
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
Table 2–34. EP1AGX90 Device Differential Channels
(Note 1)
Center Fast PLLs
Package
Transmitter/Receiver
Total Channels
Transmitter
45
Receiver
47
1,152-pin FineLine
BGA
Corner Fast
PLLs
PLL1
PLL2
PLL7
23
22
23
22
23
—
23
24
23
24
23
—
Note to Table 2–34:
(1) The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used as data channels.
Dedicated Circuitry with DPA Support
Arria GX devices support source-synchronous interfacing with LVDS signaling at up
to 840 Mbps. Arria GX devices can transmit or receive serial channels along with a
low-speed or high-speed clock.
The receiving device PLL multiplies the clock by an integer factor W = 1 through 32.
The SERDES factor J determines the parallel data width to deserialize from receivers
or to serialize for transmitters. The SERDES factor J can be set to 4, 5, 6, 7, 8, 9, or 10
and does not have to equal the PLL clock-multiplication W value. A design using the
dynamic phase aligner also supports all of these J factor values. For a J factor of 1, the
Arria GX device bypasses the SERDES block. For a J factor of 2, the Arria GX device
bypasses the SERDES block, and the DDR input and output registers are used in the
IOE. Figure 2–79 shows the block diagram of the Arria GX transmitter channel.
Figure 2–79. Arria GX Transmitter Channel
Data from R4, R24, C4, or
direct link interconnect
+
–
10
Local
Interconnect
Up to 840 Mbps
10
Dedicated
Transmitter
Interface
diffioclk
refclk
Fast
PLL
load_en
Regional or
global clock
Each Arria GX receiver channel features a DPA block for phase detection and
selection, a SERDES, a synchronizer, and a data realigner circuit. You can bypass the
dynamic phase aligner without affecting the basic source-synchronous operation of
the channel. In addition, you can dynamically switch between using the DPA block or
bypassing the block via a control signal from the logic array.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
2–103
Figure 2–80 shows the block diagram of the Arria GX receiver channel.
Figure 2–80. GX Receiver Channel
Data to R4, R24, C4, or
direct link interconnect
Up to 840 Mbps
+
–
D
Q
Data Realignment
Circuitry
10
data
retimed_data
DPA
Synchronizer
Dedicated
Receiver
Interface
DPA_clk
Eight Phase Clocks
8
diffioclk
refclk
Fast
PLL
load_en
Regional or
global clock
An external pin or global or regional clock can drive the fast PLLs, which can output
up to three clocks: two multiplied high-speed clocks to drive the SERDES block
and/or external pin, and a low-speed clock to drive the logic array. In addition, eight
phase-shifted clocks from the VCO can feed to the DPA circuitry.
f
For more information about fast PLL, refer to the PLLs in Arria GX Devices chapter.
The eight phase-shifted clocks from the fast PLL feed to the DPA block. The DPA
block selects the closest phase to the center of the serial data eye to sample the
incoming data. This allows the source-synchronous circuitry to capture incoming data
correctly regardless of channel-to-channel or clock-to-channel skew. The DPA block
locks to a phase closest to the serial data phase. The phase-aligned DPA clock is used
to write the data into the synchronizer.
The synchronizer sits between the DPA block and the data realignment and SERDES
circuitry. Because every channel using the DPA block can have a different phase
selected to sample the data, the synchronizer is needed to synchronize the data to the
high-speed clock domain of the data realignment and the SERDES circuitry.
For high-speed source-synchronous interfaces such as POS-PHY 4 and the Parallel
RapidIO standard, the source synchronous clock rate is not a byte- or SERDES-rate
multiple of the data rate. Byte alignment is necessary for these protocols because the
source synchronous clock does not provide a byte or word boundary as the clock is
one half the data rate, not one eighth. The Arria GX device’s high-speed differential
I/O circuitry provides dedicated data realignment circuitry for user-controlled byte
boundary shifting. This simplifies designs while saving ALM resources. You can use
an ALM-based state machine to signal the shift of receiver byte boundaries until a
specified pattern is detected to indicate byte alignment.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–104
Chapter 2: Arria GX Architecture
High-Speed Differential I/O with DPA Support
Fast PLL and Channel Layout
The receiver and transmitter channels are interleaved as such that each I/O bank on
the left side of the device has one receiver channel and one transmitter channel per
LAB row. Figure 2–81 shows the fast PLL and channel layout in the EP1AGX20C,
EP1AGX35C/D, EP1AGX50C/D and EP1AGX60C/D devices. Figure 2–82 shows the
fast PLL and channel layout in EP1AGX60E and EP1AGX90E devices.
Figure 2–81. Fast PLL and Channel Layout in EP1AGX20C, EP1AGX35C/D, EP1AGX50C/D, EP1AGX60C/D Devices (Note 1)
4
LVDS
Clock
DPA
Clock
Quadrant
Quadrant
Quadrant
Quadrant
4
2
Fast
PLL 1
Fast
PLL 2
2
4
LVDS
Clock
DPA
Clock
Note to Figure 2–81:
(1) For the number of channels each device supports, refer to Table 2–30.
Figure 2–82. Fast PLL and Channel Layout in EP1AGX60E and EP1AGX90E Devices (Note 1)
Fast
PLL 7
2
4
LVDS
Clock
DPA
Clock
Quadrant
Quadrant
DPA
Clock
Quadrant
Quadrant
4
2
Fast
PLL 1
Fast
PLL 2
2
4
LVDS
Clock
2
Fast
PLL 8
Note to Figure 2–82:
(1) For the number of channels each device supports, refer to Table 2–30 through Table 2–34.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 2: Arria GX Architecture
Document Revision History
2–105
Document Revision History
Table 2–35 shows the revision history for this chapter.
Table 2–35. Document Revision History
Date and Document Version
December 2009, v2.0
May 2008, v1.3
Changes Made
■
Document template update.
■
Minor text edits.
Summary of Changes
—
Added “Reverse Serial Pre-CDR Loopback”
and “Calibration Block” sub-sections to
“Transmitter Path” section.
—
August 2007, v1.2
Added “Referenced Documents” section.
—
June 2007, v1.1
Added GIGE information.
—
May 2007 v1.0
Initial release.
—
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
2–106
Arria GX Device Handbook, Volume 1
Chapter 2: Arria GX Architecture
Document Revision History
© December 2009
Altera Corporation
3. Configuration and Testing
AGX51003-2.0
Introduction
All Arria® GX devices provide JTAG boundary-scan test (BST) circuitry that complies
with the IEEE Std. 1149.1. You can perform JTAG boundary-scan testing either before
or after, but not during configuration. Arria GX devices can also use the JTAG port for
configuration with the Quartus® II software or hardware using either jam files (.jam)
or jam byte-code files (.jbc).
This chapter contains the following sections:
■
“IEEE Std. 1149.1 JTAG Boundary-Scan Support”
■
“SignalTap II Embedded Logic Analyzer” on page 3–3
■
“Configuration” on page 3–3
■
“Automated Single Event Upset (SEU) Detection” on page 3–8
IEEE Std. 1149.1 JTAG Boundary-Scan Support
Arria GX devices support I/O element (IOE) standard setting reconfiguration through
the JTAG BST chain. The JTAG chain can update the I/O standard for all input and
output pins any time before or during user-mode through the CONFIG_IO
instruction. You can use this capability for JTAG testing before configuration when
some of the Arria GX pins drive or receive from other devices on the board using
voltage-referenced standards. Because the Arria GX device may not be configured
before JTAG testing, the I/O pins may not be configured for appropriate electrical
standards for chip-to-chip communication. Programming these I/O standards via
JTAG allows you to fully test the I/O connections to other devices.
A device operating in JTAG mode uses four required pins, TDI, TDO, TMS, and TCK,
and one optional pin, TRST. The TCK pin has an internal weak pull-down resistor,
while the TDI, TMS, and TRST pins have weak internal pull-up resistors. The JTAG
input pins are powered by the 3.3-V VCCPD pins. The TDO output pin is powered by the
VCCIO power supply in I/O bank 4.
Arria GX devices also use the JTAG port to monitor the logic operation of the device
with the SignalTap ® II embedded logic analyzer. Arria GX devices support the JTAG
instructions shown in Table 3–1.
1
© December 2009
Arria GX, Cyclone® II, Cyclone, Stratix® , Stratix II, Stratix GX , and Stratix II GX
devices must be within the first 17 devices in a JTAG chain. All of these devices have
the same JTAG controller. If any of the Stratix, Arria GX, Cyclone, and Cyclone II
devices are in the 18th or further position, they will fail configuration. This does not
affect the functionality of the SignalTap ® II embedded logic analyzer.
Altera Corporation
Arria GX Device Handbook, Volume 1
3–2
Chapter 3: Configuration and Testing
IEEE Std. 1149.1 JTAG Boundary-Scan Support
Table 3–1. Arria GX JTAG Instructions
JTAG Instruction
Instruction Code
Description
SAMPLE/PRELOAD
00 0000 0101
Allows a snapshot of signals at the device pins to be captured
and examined during normal device operation and permits an
initial data pattern to be output at the device pins. Also used by
the SignalTap II embedded logic analyzer.
EXTEST (1)
00 0000 1111
Allows external circuitry and board-level interconnects to be
tested by forcing a test pattern at the output pins and capturing
test results at the input pins.
BYPASS
11 1111 1111
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through
selected devices to adjacent devices during normal device
operation.
USERCODE
00 0000 0111
Selects the 32-bit USERCODE register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted
out of TDO.
IDCODE
00 0000 0110
Selects the IDCODE register and places it between TDI and TDO ,
allowing IDCODE to be serially shifted out of TDO.
HIGHZ (1)
00 0000 1011
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through
selected devices to adjacent devices during normal device
operation, while tri-stating all of the I/O pins.
CLAMP (1)
00 0000 1010
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through
selected devices to adjacent devices during normal device
operation while holding I/O pins to a state defined by the data in
the boundary-scan register.
—
Used when configuring an Arria GX device via the JTAG port with
a USB-Blaster TM , MasterBlaster TM , ByteBlasterMVTM,
EthernetBlaster TM , or ByteBlaster II download cable, or when
using a .jam or .jbc via an embedded processor or JRunnerTM .
ICR instructions
PULSE_NCONFIG
00 0000 0001
Emulates pulsing the nCONFIG pin low to trigger
reconfiguration even though the physical pin is unaffected.
CONFIG_IO (2)
00 0000 1101
Allows configuration of I/O standards through the JTAG chain for
JTAG testing. Can be executed before, during, or after
configuration. Stops configuration if executed during
configuration. Once issued, the CONFIG_IO instruction holds
nSTATUS low to reset the configuration device. nSTATUS is
held low until the IOE configuration register is loaded and the
TAP controller state machine transitions to the UPDATE_DR
state.
Notes to Table 3–1:
(1) Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.
(2) For more information about using the CONFIG_IO instruction, refer to the MorphIO: An I/O Reconfiguration Solution for Altera Devices
White Paper.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 3: Configuration and Testing
SignalTap II Embedded Logic Analyzer
3–3
The Arria GX device instruction register length is 10 bits and the USERCODE register
length is 32 bits. Table 3–2 and Table 3–3 show the boundary-scan register length and
device IDCODE information for Arria GX devices.
Table 3–2. Arria GX Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EP1AGX20
1320
EP1AGX35
1320
EP1AGX50
1668
EP1AGX60
1668
EP1AGX90
2016
Table 3–3. 2-Bit Arria GX Device IDCODE
IDCODE (32 Bits)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit)
EP1AGX20
0000
0010 0001 0010 0001
000 0110 1110
1
EP1AGX35
0000
0010 0001 0010 0001
000 0110 1110
1
EP1AGX50
0000
0010 0001 0010 0010
000 0110 1110
1
EP1AGX60
0000
0010 0001 0010 0010
000 0110 1110
1
EP1AGX90
0000
0010 0001 0010 0011
000 0110 1110
1
SignalTap II Embedded Logic Analyzer
Arria GX devices feature the SignalTap II embedded logic analyzer, which monitors
design operation over a period of time through the IEEE Std. 1149.1 (JTAG) circuitry.
You can analyze internal logic at speed without bringing internal signals to the I/O
pins. This feature is particularly important for advanced packages, such as FineLine
BGA (FBGA) packages, because it can be difficult to add a connection to a pin during
the debugging process after a board is designed and manufactured.
Configuration
The logic, circuitry, and interconnects in the Arria GX architecture are configured with
CMOS SRAM elements. Altera® FPGAs are reconfigurable and every device is tested
with a high coverage production test program so you do not have to perform fault
testing and can instead focus on simulation and design verification.
Arria GX devices are configured at system power up with data stored in an Altera
configuration device or provided by an external controller (for example, a MAX ® II
device or microprocessor). You can configure Arria GX devices using the fast passive
parallel (FPP), active serial (AS), passive serial (PS), passive parallel asynchronous
(PPA), and JTAG configuration schemes. Each Arria GX device has an optimized
interface that allows microprocessors to configure it serially or in parallel, and
synchronously or asynchronously. The interface also enables microprocessors to treat
Arria GX devices as memory and configure them by writing to a virtual memory
location, making reconfiguration easy.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
3–4
Chapter 3: Configuration and Testing
Configuration
In addition to the number of configuration methods supported, Arria GX devices also
offer decompression and remote system upgrade features. The decompression feature
allows Arria GX FPGAs to receive a compressed configuration bitstream and
decompress this data in real-time, reducing storage requirements and configuration
time. The remote system upgrade feature allows real-time system upgrades from
remote locations of Arria GX designs. For more information, refer to “Configuration
Schemes” on page 3–5.
Operating Modes
The Arria GX architecture uses SRAM configuration elements that require
configuration data to be loaded each time the circuit powers up. The process of
physically loading the SRAM data into the device is called configuration. During
initialization, which occurs immediately after configuration, the device resets
registers, enables I/O pins, and begins to operate as a logic device. The I/O pins are
tri-stated during power up, and before and during configuration. Together, the
configuration and initialization processes are called command mode. Normal device
operation is called user mode.
SRAM configuration elements allow you to reconfigure Arria GX devices in-circuit by
loading new configuration data into the device. With real-time reconfiguration, the
device is forced into command mode with a device pin. The configuration process
loads different configuration data, re-initializes the device, and resumes user-mode
operation. You can perform in-field upgrades by distributing new configuration files
either within the system or remotely.
PORSEL is a dedicated input pin used to select power-on reset (POR) delay times of
12 ms or 100 ms during power up. When the PORSEL pin is connected to ground, the
POR time is 100 ms. When the PORSEL pin is connected to VCC, the POR time is 12 ms.
The nIO_PULLUP pin is a dedicated input that chooses whether the internal pull-up
resistors on the user I/O pins and dual-purpose configuration I/O pins (nCSO, ASDO,
DATA[7..0], nWS, nRS, RDYnBSY, nCS, CS, RUnLU, PGM[2..0], CLKUSR,
INIT_DONE, DEV_OE, DEV_CLR) are on or off before and during configuration. A
logic high (1.5, 1.8, 2.5, 3.3 V) turns off the weak internal pull-up resistors, while a
logic low turns them on.
Arria GX devices also offer a new power supply, V C CPD, which must be connected to
3.3 V in order to power the 3.3-V/2.5-V buffer available on the configuration input
pins and JTAG pins. VCCPD applies to all the JTAG input pins (TCK, TMS, TDI, and
TRST) and the following configuration pins: nCONFIG, DCLK (when used as an input),
nIO_PULLUP, DATA[7..0], RUnLU, nCE, nWS, nRS, CS, nCS, and CLKUSR. The VCCSEL
pin allows the VCCIO setting (of the banks where the configuration inputs reside) to be
independent of the voltage required by the configuration inputs. Therefore, when
selecting the VCCIO voltage, you do not have to take the VIL and VIH levels driven to
the configuration inputs into consideration. The configuration input pins, nCONFIG,
DCLK (when used as an input), nIO_PULLUP, RUnLU, nCE, nWS, nRS, CS, nCS, and
CLKUSR, have a dual buffer design: a 3.3-V/2.5-V input buffer and a 1.8-V/1.5-V
input buffer. The VCCSEL input pin selects which input buffer is used. The 3.3-V/2.5-V
input buffer is powered by VCCPD , while the 1.8-V/1.5-V input buffer is powered by
VCCIO.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 3: Configuration and Testing
Configuration
3–5
VCCSEL is sampled during power up. Therefore, the V CCSEL setting cannot change
on-the-fly or during a reconfiguration. The V CCSEL input buffer is powered by VCCINT
and must be hard-wired to VC CPD or ground. A logic high VCC SEL connection selects the
1.8-V/1.5-V input buffer, and a logic low selects the 3.3-V/2.5-V input buffer. VCCSEL
should be set to comply with the logic levels driven out of the configuration device or
MAX II microprocessor.
If the design must support configuration input voltages of 3.3 V/2.5 V, set VCCSEL to a
logic low. You can set the VCCIO voltage of the I/O bank that contains the configuration
inputs to any supported voltage. If the design must support configuration input
voltages of 1.8 V/1.5 V, set VCCSEL to a logic high and the VCCIO of the bank that
contains the configuration inputs to 1.8 V/1.5 V.
f
For more information about multi-volt support, including information about using
TDO and nCEO in multi-volt systems, refer to the Arria GX Architecture chapter.
Configuration Schemes
You can load the configuration data for an Arria GX device with one of five
configuration schemes (refer to Table 3–4), chosen on the basis of the target
application. You can use a configuration device, intelligent controller, or the JTAG
port to configure an Arria GX device. A configuration device can automatically
configure an Arria GX device at system power up.
You can configure multiple Arria GX devices in any of the five configuration schemes
by connecting the configuration enable (nCE) and configuration enable output (nCEO)
pins on each device. Arria GX FPGAs offer the following:
■
Configuration data decompression to reduce configuration file storage
■
Remote system upgrades for remotely updating Arria GX designs
Table 3–4 lists which configuration features can be used in each configuration scheme.
f
For more information about configuration schemes in Arria GX devices, refer to the
Configuring Arria GX Devices chapter.
Table 3–4. Arria GX Configuration Features (Part 1 of 2)
Configuration Scheme
FPP
AS
PS
PPA
© December 2009
Configuration Method
Decompression
Remote System Upgrade
MAX II device or microprocessor
and flash device
v (1)
v
Enhanced configuration device
v (2)
v
Serial configuration device
v
v (3)
MAX II device or microprocessor
and flash device
v
v
Enhanced configuration device
v
v
Download cable (4)
v
—
MAX II device or microprocessor
and flash device
—
v
Altera Corporation
Arria GX Device Handbook, Volume 1
3–6
Chapter 3: Configuration and Testing
Configuration
Table 3–4. Arria GX Configuration Features (Part 2 of 2)
Configuration Scheme
JTAG
Configuration Method
Decompression
Remote System Upgrade
Download cable (4)
—
—
MAX II device or microprocessor
and flash device
—
—
Notes for Table 3–4:
(1)
(2)
(3)
(4)
In these modes, the host system must send a DCLK that is 4× the data rate.
The enhanced configuration device decompression feature is available, while the Arria GX decompression feature is not available.
Only remote update mode is supported when using the AS configuration scheme. Local update mode is not supported.
The supported download cables include the Altera USB-Blaster universal serial bus (USB) port download cable, MasterBlaster ™ serial/USB
communications cable, ByteBlaster II parallel port download cable, ByteBlasterMV parallel port download cable, and the EthernetBlaster
download cable.
Device Configuration Data Decompression
Arria GX FPGAs support decompression of configuration data, which saves
configuration memory space and time. This feature allows you to store compressed
configuration data in configuration devices or other memory and transmit this
compressed bitstream to Arria GX FPGAs. During configuration, the Arria GX FPGA
decompresses the bitstream in real time and programs its SRAM cells. Arria GX
FPGAs support decompression in the FPP (when using a MAX II device or
microprocessor and flash memory), AS, and PS configuration schemes.
Decompression is not supported in the PPA configuration scheme nor in JTAG-based
configuration.
Remote System Upgrades
Shortened design cycles, evolving standards, and system deployments in remote
locations are difficult challenges faced by system designers. Arria GX devices can help
effectively deal with these challenges with their inherent re programmability and
dedicated circuitry to perform remote system updates. Remote system updates help
deliver feature enhancements and bug fixes without costly recalls, reduce time to
market, and extend product life.
Arria GX FPGAs feature dedicated remote system upgrade circuitry to facilitate
remote system updates. Soft logic (Nios® processor or user logic) implemented in the
Arria GX device can download a new configuration image from a remote location,
store it in configuration memory, and direct the dedicated remote system upgrade
circuitry to initiate a reconfiguration cycle. The dedicated circuitry performs error
detection during and after the configuration process, recovers from any error
condition by reverting back to a safe configuration image, and provides error status
information. This dedicated remote system upgrade circuitry avoids system
downtime and is the critical component for successful remote system upgrades.
Remote system configuration is supported in the following Arria GX configuration
schemes: FPP, AS, PS, and PPA. You can also implement remote system configuration
in conjunction with Arria GX features such as real-time decompression of
configuration data for efficient field upgrades.
f
For more information about remote configuration in Arria GX devices, refer to the
Remote System Upgrades with Arria GX Devices chapter.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 3: Configuration and Testing
Configuration
3–7
Configuring Arria GX FPGAs with JRunner
The JRunner software driver configures Altera FPGAs, including Arria GX FPGAs,
through the ByteBlaster™ II or ByteBlasterMV cables in JTAG mode. The
programming input file supported is in Raw Binary File (.rbf) format. JRunner also
requires a Chain Description File (.cdf) generated by the Quartus II software. JRunner
is targeted for embedded JTAG configuration. The source code is developed for the
Windows NT operating system (OS), but can be customized to run on other platforms.
f
For more information about the JRunner software driver, refer to the AN414: JRunner
Software Driver: An Embedded Solution for PLD JTAG Configuration and the source files
on the Altera website.
Programming Serial Configuration Devices with SRunner
You can program a serial configuration device in-system by an external
microprocessor using SRunnerTM . SRunner is a software driver developed for
embedded serial configuration device programming that can be easily customized to
fit into different embedded systems. SRunner software driver reads a raw
programming data file (.rpd) and writes to serial configuration devices. The serial
configuration device programming time using SRunner software driver is comparable
to the programming time when using the Quartus II software.
f
For more information about SRunner, refer to the AN418: SRunner: An Embedded
Solution for Serial Configuration Device Programming and the source code on the Altera
website.
f
For more information about programming serial configuration devices, refer to the
Serial Configuration Devices (EPCS1, EPCS4, EPCS64, and EPCS128) Data Sheet in the
Configuration Handbook.
Configuring Arria GX FPGAs with the MicroBlaster Driver
The MicroBlaster™ software driver supports a raw binary file (RBF) programming
input file and is ideal for embedded FPP or PS configuration. The source code is
developed for the Windows NT operating system, although it can be customized to
run on other operating systems.
f
For more information about the MicroBlaster software driver, refer to the Configuring
the MicroBlaster Fast Passive Parallel Software Driver White Paper or the AN423:
Configuring the MicroBlaster Passive Serial Software Driver.
PLL Reconfiguration
The phase-locked loops (PLLs) in the Arria GX device family support reconfiguration
of their multiply, divide, VCO-phase selection, and bandwidth selection settings
without reconfiguring the entire device. You can use either serial data from the logic
array or regular I/O pins to program the PLL’s counter settings in a serial chain. This
option provides considerable flexibility for frequency synthesis, allowing real-time
variation of the PLL frequency and delay. The rest of the device is functional while
reconfiguring the PLL.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
3–8
Chapter 3: Configuration and Testing
Automated Single Event Upset (SEU) Detection
f
For more information about Arria GX PLLs, refer to the PLLs in Arria GX Devices
chapter.
Automated Single Event Upset (SEU) Detection
Arria GX devices offer on-chip circuitry for automated checking of single event upset
(SEU) detection. Some applications that require the device to operate error free at high
elevations or in close proximity to Earth’s North or South Pole requires periodic
checks to ensure continued data integrity. The error detection cyclic redundancy
check (CRC) feature controlled by the Device and Pin Options dialog box in the
Quartus II software uses a 32-bit CRC circuit to ensure data reliability and is one of
the best options for mitigating SEU.
You can implement the error detection CRC feature with existing circuitry in Arria GX
devices, eliminating the need for external logic. Arria GX devices compute CRC
during configuration. The Arria GX device checks the computed-CRC against an
automatically computed CRC during normal operation. The CRC_ERROR pin reports
a soft error when configuration SRAM data is corrupted, triggering device
reconfiguration.
Custom-Built Circuitry
Dedicated circuitry is built into Arria GX devices to automatically perform error
detection. This circuitry constantly checks for errors in the configuration SRAM cells
while the device is in user mode. You can monitor one external pin for the error and
use it to trigger a reconfiguration cycle. You can select the desired time between
checks by adjusting a built-in clock divider.
Software Interface
Beginning with version 7.1 of the Quartus II software, you can turn on the automated
error detection CRC feature in the Device and Pin Options dialog box. This dialog
box allows you to enable the feature and set the internal frequency of the CRC
between 400 kHz to 50 MHz. This controls the rate that the CRC circuitry verifies the
internal configuration SRAM bits in the Arria GX FPGA.
f
For more information about CRC, refer to AN 357: Error Detection Using CRC in Altera
FPGAs.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 3: Configuration and Testing
Document Revision History
3–9
Document Revision History
Table 3–5 lists the revision history for this chapter.
Table 3–5. Document Revision History
Date and Document Version
December 2009, v2.0
May 2009
v1.4
May 2008
Changes Made
■
Document template update.
■
Minor text edits.
■
Removed “Temperature Sensing
Diode” section.
■
Updated Table 3–1 and Table 3–4.
Summary of Changes
—
—
Updated note in “Introduction”
section.
v1.3
Minor text edits.
—
Added the “Referenced Documents”
section.
—
Deleted Signal Tap II information
from Table 3–1.
—
v1.1
May 2007
Initial Release
—
August 2007
v1.2
June 2007
v1.0
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
3–10
Chapter 3: Configuration and Testing
Document Revision History
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
4. DC and Switching Characteristics
AGX51004-2.0
Operating Conditions
Arria® GX devices are offered in both commercial and industrial grades. Both
commercial and industrial devices are offered in –6 speed grade only.
This chapter contains the following sections:
■
“Operating Conditions”
■
“Power Consumption” on page 4–25
■
“I/O Timing Model” on page 4–26
■
“Typical Design Performance” on page 4–32
■
“Block Performance” on page 4–84
■
“IOE Programmable Delay” on page 4–86
■
“Maximum Input and Output Clock Toggle Rate” on page 4–87
■
“Duty Cycle Distortion” on page 4–95
■
“High-Speed I/O Specifications” on page 4–100
■
“PLL Timing Specifications” on page 4–103
■
“External Memory Interface Specifications” on page 4–105
■
“JTAG Timing Specifications” on page 4–106
Table 4–1 through Table 4–42 on page 4–25 provide information on absolute
maximum ratings, recommended operating conditions, DC electrical characteristics,
and other specifications for Arria GX devices.
Absolute Maximum Ratings
Table 4–1 contains the absolute maximum ratings for the Arria GX device family.
Table 4–1. Arria GX Device Absolute Maximum Ratings
Symbol
Parameter
(Note 1), (2), (3) (Part 1 of 2)
Conditions
Minimum
Maximum
Units
VCCINT
Supply voltage
With respect to ground
–0.5
1.8
V
VCCIO
Supply voltage
With respect to ground
–0.5
4.6
V
VCCPD
Supply voltage
With respect to ground
–0.5
4.6
V
VI
DC input voltage (4)
–0.5
4.6
V
IOUT
DC output current, per pin
–25
40
mA
TSTG
Storage temperature
–65
150
C
© December 2009
Altera Corporation
—
—
No bias
Arria GX Device Handbook, Volume 1
4–2
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–1. Arria GX Device Absolute Maximum Ratings
Symbol
Parameter
TJ
(Note 1), (2), (3) (Part 2 of 2)
Conditions
Junction temperature
Minimum
Maximum
Units
–55
125
C
BGA packages under bias
Notes to Table 4–1:
(1) For more information about operating requirements for Altera® devices, refer to the Arria GX Device Family Data Sheet chapter.
(2) Conditions beyond those listed in Table 4–1 may cause permanent damage to a device. Additionally, device operation at the absolute maximum
ratings for extended periods of time may have adverse affects on the device.
(3) Supply voltage specifications apply to voltage readings taken at the device pins, not at the power supply.
(4) During transitions, the inputs may overshoot to the voltage shown in Table 4–2 based upon the input duty cycle. The DC case is equivalent to
100% duty cycle. During transitions, the inputs may undershoot to –2.0 V for input currents less than 100 mA and periods shorter than 20 ns.
Table 4–2. Maximum Duty Cycles in Voltage Transitions
Symbol
VI
Parameter
Maximum duty cycles in
voltage transitions
(Note 1)
Condition
Maximum Duty Cycles (%)
VI = 4.0 V
100
VI = 4.1 V
90
VI = 4.2 V
50
VI = 4.3 V
30
VI = 4.4 V
17
VI = 4.5 V
10
Note to Table 4–2:
(1) During transition, the inputs may overshoot to the voltages shown based on the input duty cycle. The DC case is
equivalent to 100% duty cycle.
Recommended Operating Conditions
Table 4–3 lists the recommended operating conditions for the Arria GX device family.
Table 4–3. Arria GX Device Recommended Operating Conditions (Part 1 of 2)
Symbol
Parameter
Conditions
(Note 1) (Part 1 of 2)
Minimum
Maximum
Units
1.15
1.25
V
Supply voltage for internal
logic and input buffers
Rise time  100 ms (3)
Supply voltage for output
buffers, 3.3-V operation
Rise time  100 ms (3), (6)
3.135
(3.00)
3.465
(3.60)
V
Supply voltage for output
buffers, 2.5-V operation
Rise time  100 ms (3)
2.375
2.625
V
Supply voltage for output
buffers, 1.8-V operation
Rise time  100 ms (3)
1.71
1.89
V
Supply voltage for output
buffers, 1.5-V operation
Rise time  100 ms (3)
1.425
1.575
V
Supply voltage for output
buffers, 1.2-V operation
Rise time  100 ms (3)
1.15
1.25
V
Supply voltage for pre-drivers
as well as configuration and
JTAG I/O buffers.
100 s  rise time  100 ms (4)
3.135
3.465
V
VCCPD
VI
Input voltage
(refer to Table 4–2)
(2), (5)
–0.5
4.0
V
VO
Output voltage
0
VCCIO
V
VCCINT
VCCIO
Arria GX Device Handbook, Volume 1
—
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–3
Table 4–3. Arria GX Device Recommended Operating Conditions (Part 2 of 2)
Symbol
Parameter
TJ
Operating junction temperature
(Note 1) (Part 2 of 2)
Conditions
Minimum
Maximum
Units
0
85
C
–40
100
C
For commercial use
For industrial use
Notes to Table 4–3:
(1) Supply voltage specifications apply to voltage readings taken at the device pins, not at the power supply.
(2) During transitions, the inputs may overshoot to the voltage shown in Table 4–2 based upon the input duty cycle. The DC case is equivalent to
100% duty cycle. During transitions, the inputs may undershoot to –2.0 V for input currents less than 100 mA and periods shorter than 20 ns.
(3) Maximum VCC rise time is 100 ms, and VCC must rise monotonically from ground to VCC .
(4) VCCPD must ramp-up from 0 V to 3.3 V within 100 s to 100 ms. If VCCPD is not ramped up within this specified time, the Arria GX device will
not configure successfully. If the system does not allow for a V CCPD ramp-up time of 100 ms or less, hold nCONFIG low until all power supplies
are reliable.
(5) All pins, including dedicated inputs, clock, I/O, and JTAG pins, can be driven before VCCINT, VCCPD, and VCCIO are powered.
(6) VCCIO maximum and minimum conditions for PCI and PCI-X are shown in parentheses.
Transceiver Block Characteristics
Table 4–4 through Table 4–6 on page 4–4 contain transceiver block specifications.
Table 4–4. Arria GX Transceiver Block Absolute Maximum Ratings
Symbol
Parameter
(Note 1)
Conditions
Minimum
Maximum
Units
VCCA
Transceiver block supply voltage
Commercial and industrial
–0.5
4.6
V
VCCP
Transceiver block supply voltage
Commercial and industrial
–0.5
1.8
V
VCCR
Transceiver block supply voltage
Commercial and industrial
–0.5
1.8
V
VCCT_B
Transceiver block supply voltage
Commercial and industrial
–0.5
1.8
V
VCCL_B
Transceiver block supply voltage
Commercial and industrial
–0.5
1.8
V
VCCH_B
Transceiver block supply voltage
Commercial and industrial
–0.5
2.4
V
Note to Table 4–4:
(1) The device can tolerate prolonged operation at this absolute maximum, as long as the maximum specification is not violated.
Table 4–5. Arria GX Transceiver Block Operating Conditions
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCA
Transceiver block supply voltage
Commercial and industrial
3.135
3.3
3.465
V
VCCP
Transceiver block supply voltage
Commercial and industrial
1.15
1.2
1.25
V
VCCR
Transceiver block supply voltage
Commercial and industrial
1.15
1.2
1.25
V
VCCT_B
Transceiver block supply voltage
Commercial and industrial
1.15
1.2
1.25
V
VCCL_B
Transceiver block supply voltage
Commercial and industrial
1.15
1.2
1.25
V
1.15
1.2
1.25
V
1.425
1.5
1.575
V
2K - 1%
2K
2K +1%

VCCH_B
Transceiver block supply voltage
Commercial and industrial
RREFB (1)
Reference resistor
Commercial and industrial
Note to Table 4–5:
(1) The DC signal on this pin must be as clean as possible. Ensure that no noise is coupled to this pin.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–4
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–6. Arria GX Transceiver Block AC Specification (Part 1 of 3)
Symbol / Description
Conditions
–6 Speed Grade Commercial and
Industrial
Min
Typ
Max
Units
Reference clock
Input reference clock frequency
—
50
—
622.08
MHz
Absolute VM A X for a REFCLK Pin
—
—
—
3.3
V
Absolute VMIN for a REFCLK Pin
—
–0.3
—
—
V
Rise/Fall time
—
—
0.2
—
UI
Duty cycle
—
45
—
55
%
Peak to peak differential input voltage VID
(diff p-p)
—
200
—
2000
mV
Spread spectrum clocking (1)
0 to –0.5%
30
—
33
kHz
On-chip termination resistors
—
115 ± 20%

VICM (AC coupled)
—
1200 ± 5%
mV
VICM (DC coupled) (2)
RREFB
PCI Express
(PIPE) mode
0.25
—
—
0.55
V

2000 +/-1%
Transceiver Clocks
Calibration block clock frequency
—
10
—
125
MHz
Calibration block minimum power-down
pulse width
—
30
—
—
ns
fixedclk clock frequency (3)
reconfig clock frequency
—
125 ±10%
MHz
SDI mode
2.5
—
50
MHz
—
100
—
—
ns
Data rate
—
600
—
3125
Mbps
Absolute VMAX for a receiver pin (4)
—
—
—
2.0
V
Absolute VMIN for a receiver pin
—
–0.4
—
—
V
Maximum peak-to-peak differential input
voltage VID (diff p-p)
Vicm = 0.85 V
—
—
3.3
V
Minimum peak-to-peak differential input
voltage VID (diff p-p)
DC Gain = 3 dB
160
—
—
mV
Transceiver block minimum power-down
pulse width
Receiver
On-chip termination resistors
VICM (15)
Bandwidth at 3.125 Gbps
Arria GX Device Handbook, Volume 1
—
100±15%

Vicm = 0.85 V
setting
850 ± 10% 850 ± 10% 850 ± 10%
mV
Vicm = 1.2 V
setting
1200 ±
10%
1200 ±
10%
1200 ±
10%
BW = Low
—
30
—
BW = Med
—
40
—
BW = High
—
50
—
© December 2009
mV
MHz
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–5
Table 4–6. Arria GX Transceiver Block AC Specification (Part 2 of 3)
Symbol / Description
Bandwidth at 2.5 Gbps
Return loss differential mode
Conditions
–6 Speed Grade Commercial and
Industrial
Min
Typ
Max
BW = Low
—
35
—
BW = Med
—
50
—
BW = High
—
60
—
50 MHz to 1.25
GHz
(PCI Express)
Units
MHz
–10
dB
–6
dB
100 MHz to 2.5
GHz (XAUI)
Return loss common mode
50 MHz to 1.25
GHz
(PCI Express)
100 MHz to 2.5
GHz (XAUI)
Programmable PPM detector (5)
—
± 62.5, 100, 125, 200, 250, 300, 500,
1000
PPM
Run length (6)
—
80
UI
Programmable equalization
—
—
—
5
dB
Signal detect/loss threshold (7)
—
65
—
175
mV
CDR LTR TIme (8), (9)
—
—
—
75
us
CDR Minimum T1b (9), (10)
—
15
—
—
us
LTD lock time (9), (11)
—
0
100
4000
ns
Data lock time from rx_freqlocked (9),
(12)
—
—
—
4
us
Programmable DC gain
—
0, 3, 6
dB
Output Common Mode voltage (Vocm)
—
580 ± 10%
mV
On-chip termination resistors
—
108±10%

Transmitter Buffer
50 MHz to 1.25
GHz (PCI Express)
Return loss differential mode
dB
–10
312 MHz to 625
MHz (XAUI)
625 MHz to
3.125GHz (XAUI)
Return loss common mode
50 MHz to 1.25
GHz (PCI Express)
–10
dB
-----------------------------------decade slope
–6
dB
Rise time
—
35
—
65
ps
Fall time
—
35
—
65
ps
VOD = 800 mV
—
—
15
ps
—
—
—
100
ps
Intra differential pair skew
Intra-transceiver block skew (×4) (13)
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–6
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–6. Arria GX Transceiver Block AC Specification (Part 3 of 3)
Symbol / Description
Conditions
–6 Speed Grade Commercial and
Industrial
Units
Min
Typ
Max
—
500
—
1562.5
BW = Low
—
3
—
BW = Med
—
5
—
BW = High
—
9
—
BW = Low
—
1
—
BW = Med
—
2
—
BW = High
—
4
—
—
—
—
100
us
Interface speed per mode
—
25
—
156.25
MHz
Digital Reset Pulse Width
—
Transmitter PLL
VCO frequency range
Bandwidth at 3.125 Gbps
Bandwidth at 2.5 Gbps
TX PLL lock time from gxb_powerdown
de-assertion (9), (14)
MHz
MHz
MHz
PCS
Minimum is 2 parallel clock cycles
—
Notes to Table 4–6:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
Spread spectrum clocking is allowed only in PCI Express (PIPE) mode if the upstream transmitter and the receiver share the same clock source.
The reference clock DC coupling option is only available in PCI Express (PIPE) mode for the HCSL I/O standard.
The fixedclk is used in PIPE mode receiver detect circuitry.
The device cannot tolerate prolonged operation at this absolute maximum.
The rate matcher supports only up to ± 300 PPM for PIPE mode and ± 100 PPM for GIGE mode.
This parameter is measured by embedding the run length data in a PRBS sequence.
Signal detect threshold detector circuitry is available only in PCI Express (PIPE mode).
Time taken for rx_pll_locked to go high from rx_analogreset deassertion. Refer to Figure 4–1.
For lock times specific to the protocols, refer to protocol characterization documents.
Time for which the CDR needs to stay in LTR mode after rx_pll_locked is asserted and before rx_locktodata is asserted in manual
mode. Refer to Figure 4–1.
Time taken to recover valid data from GXB after the rx_locktodata signal is asserted in manual mode. Measurement results are based on
PRBS31, for native data rates only. Refer to Figure 4–1.
Time taken to recover valid data from GXB after the rx_freqlocked signal goes high in automatic mode. Measurement results are based
on PRBS31, for native data rates only. Refer to Figure 4–2.
This is applicable only to PCI Express (PIPE) ×4 and XAUI ×4 mode.
Time taken to lock TX PLL from gxb_powerdown deassertion.
The 1.2 V RX VICM settings is intended for DC-coupled LVDS links.
Figure 4–1 shows the lock time parameters in manual mode. Figure 4–2 shows the
lock time parameters in automatic mode.
1
LTD = Lock to data
LTR = Lock to reference clock
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–7
Figure 4–1. Lock Time Parameters for Manual Mode
r x_analogreset
CDR status
LTR
LTD
r x_pll_locked
r x_locktodata
Invalid Data
Valid data
r x_dataout
CDR LTR Time
LTD lock time
CDR Minimum T1b
Figure 4–2. Lock Time Parameters for Automatic Mode
CDR status
LTR
LTD
r x_freqlocked
r x_dataout
Invalid
Valid
data
data
Data lock time from rx_freqlocked
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–8
Chapter 4: DC and Switching Characteristics
Operating Conditions
Figure 4–3 and Figure 4–4 show differential receiver input and transmitter output
waveforms, respectively.
Figure 4–3. Receiver Input Waveform
Single-Ended Waveform
Positive Channel (p)
VID
Negative Channel (n)
VCM
Ground
Differential Waveform
VID (diff peak-peak) = 2 x VID (single-ended)
VID
p−n=0V
VID
Figure 4–4. Transmitter Output Waveform
Single-Ended Waveform
Positive Channel (p)
VOD
Negative Channel (n)
VCM
Ground
Differential Waveform
VOD (diff peak-peak) = 2 x VOD (single-ended)
VOD
p−n=0V
VOD
Table 4–7 lists the Arria GX transceiver block AC specification.
Table 4–7. Arria GX Transceiver Block AC Specification
(Note 1), (2), (3) (Part 1 of 4)
Description
Condition
–6 Speed Grade
Commercial & Units
Industrial
XAUI Transmit Jitter Generation (4)
REFCLK = 156.25 MHz
Total jitter at 3.125 Gbps
Pattern = CJPAT
VOD = 1200 mV
0.3
UI
No Pre-emphasis
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–9
Table 4–7. Arria GX Transceiver Block AC Specification
(Note 1), (2), (3) (Part 2 of 4)
Description
Condition
–6 Speed Grade
Commercial & Units
Industrial
REFCLK = 156.25 MHz
Deterministic jitter at 3.125 Gbps
Pattern = CJPAT
VOD = 1200 mV
0.17
UI
> 0.65
UI
> 0.37
UI
No Pre-emphasis
XAUI Receiver Jitter Tolerance (4)
Pattern = CJPAT
Total jitter
No Equalization
DC Gain = 3 dB
Pattern = CJPAT
Deterministic jitter
No Equalization
DC Gain = 3 dB
Peak-to-peak jitter
Jitter frequency = 22.1 KHz
> 8.5
UI
Peak-to-peak jitter
Jitter frequency = 1.875 MHz
> 0.1
UI
Peak-to-peak jitter
Jitter frequency = 20 MHz
> 0.1
UI
< 0.25
UI p-p
> 0.6
UI p-p
< 0.279
UI p-p
< 0.14
UI p-p
> 0.66
UI p-p
> 0.4
UI p-p
< 0.35
UI p-p
< 0.17
UI p-p
PCI Express (PIPE) Transmitter Jitter Generation (5)
Total Transmitter Jitter Generation
Compliance Pattern; VOD = 800 mV;
Pre-emphasis = 49%
PCI Express (PIPE) Receiver Jitter Tolerance (5)
Total Receiver Jitter Tolerance
Compliance Pattern;
DC Gain = 3 db
Gigabit Ethernet (GIGE) Transmitter Jitter Generation (7)
Total Transmitter Jitter Generation (TJ)
Deterministic Transmitter Jitter
Generation (DJ)
CRPAT: VOD = 800 mV;
Pre-emphasis = 0%
CRPAT; VOD = 800 mV;
Pre-emphasis = 0%
Gigabit Ethernet (GIGE) Receiver Jitter Tolerance
Total Jitter Tolerance
Deterministic Jitter Tolerance
CJPAT Compliance Pattern;
DC Gain = 0 dB
CJPAT Compliance Pattern;
DC Gain = 0 dB
Serial RapidIO (1.25 Gbps, 2.5 Gbps, and 3.125 Gbps) Transmitter Jitter Generation (6)
CJPAT Compliance Pattern;
Total Transmitter Jitter Generation (TJ)
VOD = 800 mV;
Pre-emphasis = 0%
CJPAT Compliance Pattern;
Deterministic Transmitter Jitter
Generation (DJ)
VOD = 800 mV;
Pre-emphasis = 0%
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–10
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–7. Arria GX Transceiver Block AC Specification
(Note 1), (2), (3) (Part 3 of 4)
Description
Condition
–6 Speed Grade
Commercial & Units
Industrial
Serial RapidIO (1.25 Gbps, 2.5 Gbps, and 3.125 Gbps) Receiver Jitter Tolerance (6)
Total Jitter Tolerance
Combined Deterministic and Random
Jitter Tolerance (JDR)
Deterministic Jitter Tolerance (JD)
Sinusoidal Jitter Tolerance
CJPAT Compliance Pattern;
> 0.65
UI p-p
> 0.55
UI p-p
> 0.37
UI p-p
Jitter Frequency = 22.1 KHz
> 8.5
UI p-p
Jitter Frequency = 200 KHz
> 1.0
UI p-p
Jitter Frequency = 1.875 MHz
> 0.1
UI p-p
Jitter Frequency = 20 MHz
> 0.1
UI p-p
Data Rate = 1.485 Gbps (HD)
REFCLK = 74.25 MHz
Pattern = Color Bar
Vod = 800 mV
No Pre-emphasis
Low-Frequency Roll-Off = 100 KHz
0.2
UIv
Data Rate = 2.97 Gbps (3G)
REFCLK = 148.5 MHz
Pattern = Color Bar
Vod = 800 mV
No Pre-emphasis
Low-Frequency Roll-Off = 100 KHz
0.3
UI
DC Gain = 0 dB
CJPAT Compliance Pattern;
DC Gain = 0 dB
CJPAT Compliance Pattern;
DC Gain = 0 dB
SDI Transmitter Jitter Generation (8)
Alignment Jitter (peak-to-peak)
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–11
Table 4–7. Arria GX Transceiver Block AC Specification
Description
(Note 1), (2), (3) (Part 4 of 4)
–6 Speed Grade
Commercial & Units
Industrial
Condition
SDI Receiver Jitter Tolerance (8)
Jitter Frequency = 15 KHz
Data Rate = 2.97 Gbps (3G)
REFCLK = 148.5 MHz
Pattern = Single Line
Scramble Color Bar
No Equalization
DC Gain = 0 dB
Sinusoidal Jitter Tolerance
(peak-to-peak)
Sinusoidal Jitter Tolerance
(peak-to-peak)
>2
UI
Jitter Frequency = 100 KHz
Data Rate = 2.97 Gbps (3G)
REFCLK = 148.5 MHz
Pattern = Single Line Scramble Color Bar
No Equalization
DC Gain = 0 dB
> 0.3
UI
Jitter Frequency = 148.5 MHz
Data Rate = 2.97 Gbps (3G)
REFCLK = 148.5 MHz
Pattern = Single Line
Scramble Color Bar
No Equalization
DC Gain = 0 dB
> 0.3
UI
Jitter Frequency = 20 KHz
Data Rate = 1.485 Gbps (HD)
REFCLK = 74.25 MHz
Pattern = 75% Color Bar
No Equalization
DC Gain = 0 dB
>1
UI
Jitter Frequency = 100 KHz
Data Rate = 1.485 Gbps (HD)
REFCLK = 74.25 MHz
Pattern = 75% Color Bar
No Equalization
DC Gain = 0 dB
> 0.2
UI
Notes to Table 4–7:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Dedicated REFCLK pins were used to drive the input reference clocks.
Jitter numbers specified are valid for the stated conditions only.
Refer to the protocol characterization documents for detailed information.
The jitter numbers for XAUI are compliant to the IEEE802.3ae-2002 Specification.
The jitter numbers for PCI Express are compliant to the PCIe Base Specification 2.0.
The jitter numbers for Serial RapidIO are compliant to the RapidIO Specification 1.3.
The jitter numbers for GIGE are compliant to the IEEE802.3-2002 Specification.
The HD-SDI and 3G-SDI jitter numbers are compliant to the SMPTE292M and SMPTE424M specifications.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–12
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–8 and Table 4–9 list the transmitter and receiver PCS latency for each mode,
respectively.
Table 4–8. PCS Latency (Note 1)
Transmitter PCS Latency
Functional Mode
Configuration
TX PIPE
TX Phase
Comp FIFO
Byte
Serializer
TX State
Machine
8B/10B
Encoder
Sum (2)
—
2–3
1
0.5
0.5
4–5
×1, ×4, ×8
8-bit channel width
1
3–4
1
—
1
6–7
×1, ×4, ×8
16-bit channel width
1
3–4
1
—
0.5
6–7
—
2–3
1
—
1
4–5
1.25 Gbps, 2.5 Gbps,
3.125 Gbps
—
2–3
1
—
0.5
4–5
HD10-bit channel width
—
2–3
1
—
1
4–5
XAUI
—
PIPE
GIGE
—
Serial RapidIO
SDI
BASIC Single
Width
HD, 3G 20-bit channel width
—
2–3
1
—
0.5
4–5
8-bit/10-bit channel width
—
2–3
1
—
1
4–5
16-bit/20-bit channel width
—
2–3
1
—
0.5
4–5
Notes to Table 4–8:
(1) The latency numbers are with respect to the PLD-transceiver interface clock cycles.
(2) The total latency number is rounded off in the Sum column.
Table 4–9. PCS Latency (Part 1 of 2) (Part 1 of 2)
8B/10B Decoder
Receiver State Machine
Byte Deserializer
Byte Order
Receiver Phase Comp FIFO
Receiver PIPE
Sum (2)
Serial
RapidIO
Rate Matcher (3)
GIGE
Deskew FIFO
PIPE
Word Aligner
XAUI
2–2.5
2–2.5
5.5–6.5
0.5
1
1
1
1–2
—
14–17
×1, ×4
8-bit channel width
4–5
—
11–13
1
—
1
1
2–3
1
21–25
×1, ×4
16-bit channel width
2–2.5
—
5.5–6.5
0.5
—
1
1
2–3
1
13–16
4–5
—
11–13
1
—
1
1
1–2
—
19–23
2–2.5
—
—
0.5
—
1
1
1–2
—
6–7
5
—
—
1
—
1
1
1–2
—
9–10
2.5
—
—
0.5
—
1
1
1–2
—
6–7
Configuration
Functional Mode
Receiver PCS Latency
—
—
1.25 Gbps, 2.5 Gbps,
3.125 Gbps
HD 10-bit channel width
SDI
HD, 3G 20-bit channel
width
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–13
Table 4–9. PCS Latency (Part 2 of 2) (Part 2 of 2)
Deskew FIFO
Rate Matcher (3)
8B/10B Decoder
Receiver State Machine
Byte Deserializer
Byte Order
Receiver Phase Comp FIFO
Receiver PIPE
Sum (2)
8/10-bit channel width;
with Rate Matcher
4–5
—
11–13
1
—
1
1
1–2
1
19–23
8/10-bit channel width;
without Rate Matcher
4–5
—
—
1
—
1
1
1–2
—
8–10
16/20-bit channel width;
with Rate Matcher
2–2.5
—
5.5–6.5
0.5
—
1
1
1–2
—
11–14
16/20-bit channel width;
without Rate Matcher
2–2.5
—
—
0.5
—
1
1
1–2
—
6–7
BASIC
Single
Width
Configuration
Functional Mode
Word Aligner
Receiver PCS Latency
Notes to Table 4–9:
(1) The latency numbers are with respect to the PLD-transceiver interface clock cycles.
(2) The total latency number is rounded off in the Sum column.
(3) The rate matcher latency shown is the steady state latency. Actual latency may vary depending on the skip ordered set gap allowed by the
protocol, actual PPM difference between the reference clocks, and so forth.
Table 4–10 through Table 4–13 show the typical VOD for data rates from 600 Mbps to
3.125 Gbps. The specification is for measurement at the package ball.
Table 4–10. Typical VOD Setting, TX Term = 100 
Vcc HTX = 1.5 V
VOD Typical (mV)
VOD Setting (mV)
400
600
800
1000
1200
430
625
830
1020
1200
Table 4–11. Typical VOD Setting, TX Term = 100 
Vcc HTX = 1.2 V
VOD Typical (mV)
VOD Setting (mV)
320
480
640
800
960
344
500
664
816
960
Table 4–12. Typical Pre-Emphasis (First Post-Tap), (Note 1)
Vcc HTX = 1.5 V
VOD Setting (mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
TX Term = 100 
© December 2009
400
24%
62%
112%
184%
—
600
—
31%
56%
86%
122%
800
—
20%
35%
53%
73%
Altera Corporation
Arria GX Device Handbook, Volume 1
4–14
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–12. Typical Pre-Emphasis (First Post-Tap), (Note 1)
Vcc HTX = 1.5 V
VOD Setting (mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
1000
—
—
23%
36%
49%
1200
—
—
17%
25%
35%
Note to Table 4–12:
(1) Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for measurement at the package ball.
Table 4–13. Typical Pre-Emphasis (First Post-Tap), (Note 1)
Vcc HTX = 1.2 V
VOD Setting (mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
TX Term = 100 
320
24%
61%
114%
—
—
480
—
31%
55%
86%
121%
640
—
20%
35%
54%
72%
800
—
—
23%
36%
49%
960
—
—
18%
25%
35%
Note to Table 4–13:
(1) Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for measurement at the package ball.
DC Electrical Characteristics
Table 4–14 lists the Arria GX device family DC electrical characteristics.
Table 4–14. Arria GX Device DC Operating Conditions (Part 1 of 2)
Symbol
Parameter
(Note 1)
Conditions
Device
Min
Typ
Max
Units
II
Input pin leakage current
VI = VCCIOmax to 0 V (2)
All
–10
—
10
A
IOZ
Tri-stated I/O pin leakage
current
VO = VCCIOmax to 0 V (2)
All
–10
—
10
A
—
0.30
(3)
A
ICCINT0
VI = ground, no load, no
toggling inputs
EP1AGX20/35
VCCINT supply current
(standby)
EP1AGX50/60
—
0.50
(3)
A
TJ = 25 °C
EP1AGX90
—
0.62
(3)
A
VI = ground, no load, no
toggling inputs
EP1AGX20/35
—
2.7
(3)
mA
EP1AGX50/60
—
3.6
(3)
mA
TJ = 25 °C,
VCCPD = 3.3V
EP1AGX90
—
4.3
(3)
mA
VI = ground, no load, no
toggling inputs
EP1AGX20/35
—
4.0
(3)
mA
EP1AGX50/60
—
4.0
(3)
mA
TJ = 25 °C
EP1AGX90
—
4.0
(3)
mA
ICCPD0
ICCI00
VCCPD supply current
(standby)
VCCIO supply current
(standby)
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–15
Table 4–14. Arria GX Device DC Operating Conditions (Part 2 of 2)
Symbol
Parameter
Value of I/O pin pull-up
resistor before and during
configuration
RCONF (4)
Conditions
(Note 1)
Device
Min
Typ
Max
Units
Vi = 0, VCCIO = 3.3 V
—
10
25
50
k
Vi = 0, VCCIO = 2.5 V
—
15
35
70
k
Vi = 0, VCCIO = 1.8 V
—
30
50
100
k
Vi = 0, VCCIO = 1.5 V
—
40
75
150
k
Vi = 0, VCCIO = 1.2 V
—
50
90
170
k
—
—
1
2
k
Recommended value of
I/O pin external pull-down
resistor before and during
configuration
—
Notes to Table 4–14:
(1) Typical values are for TA = 25 °C, VCCINT = 1.2 V, and VCCIO = 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
(2) This value is specified for normal device operation. The value may vary during power-up. This applies for all VCCIO settings (3.3, 2.5, 1.8, 1.5,
and 1.2 V).
(3) Maximum values depend on the actual TJ and design utilization. For maximum values, refer to the Excel-based PowerPlay Early Power Estimator
(available at PowerPlay Early Power Estimators (EPE) and Power Analyzer) or the Quartus® II PowerPlay Power Analyzer feature for maximum
values. For more information, refer to “Power Consumption” on page 4–25.
(4) Pin pull-up resistance values will be lower if an external source drives the pin higher than VCCIO.
I/O Standard Specifications
Table 4–15 through Table 4–38 show the Arria GX device family I/O standard
specifications.
Table 4–15. LVTTL Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
—
3.135
3.465
V
VCCIO (1)
Output supply voltage
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.3
0.8
V
VOH
High-level output voltage
IOH = –4 mA (2)
2.4
—
V
VOL
Low-level output voltage
IOL = 4 mA (2)
—
0.45
V
Notes to Table 4–15:
(1) Arria GX devices comply to the narrow range for the supply voltage as specified in the EIA/JEDEC Standard, JESD8-B.
(2) This specification is supported across all the programmable drive strength settings available for this I/O standard.
Table 4–16. LVCMOS Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
VCCIO (1)
Output supply voltage
—
3.135
3.465
V
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.3
0.8
V
VOH
High-level output voltage
VCCIO = 3.0, IOH = –0.1 mA (2)
VCCIO – 0.2
—
V
VOL
Low-level output voltage
VCCIO = 3.0, IOL = 0.1 mA (2)
—
0.2
V
Notes to Table 4–16:
(1) Arria GX devices comply to the narrow range for the supply voltage as specified in the EIA/JEDEC Standard, JESD8-B.
(2) This specification is supported across all the programmable drive strength available for this I/O standard.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–16
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–17. 2.5-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
VCCIO (1)
Output supply voltage
—
2.375
2.625
V
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.3
0.7
V
VOH
High-level output voltage
I OH = –1 mA (2)
2.0
—
V
VOL
Low-level output voltage
I OL = 1 mA (2)
—
0.4
V
Notes to Table 4–17:
(1) The Arria GX device VCCIO voltage level support of 2.5 to 5% is narrower than defined in the normal range of the EIA/JEDEC standard.
(2) This specification is supported across all the programmable drive settings available for this I/O standard.
Table 4–18. 1.8-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
VCCIO (1)
Output supply voltage
—
1.71
1.89
V
VIH
High-level input voltage
—
0.65 × VCCIO
2.25
V
VIL
Low-level input voltage
—
–0.3
0.35 × VCCIO
V
VOH
High-level output voltage
I OH = –2 mA (2)
VCCIO – 0.45
—
V
VOL
Low-level output voltage
I OL = 2 mA (2)
—
0.45
V
Notes to Table 4–18:
(1) The Arria GX device VCCIO voltage level support of 1.8 to 5% is narrower than defined in the normal range of the EIA/JEDEC standard.
(2) This specification is supported across all the programmable drive settings available for this I/O standard, as shown in Arria GX Architecture
chapter.
Table 4–19. 1.5-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
VCCIO (1)
Output supply voltage
—
1.425
1.575
V
VIH
High-level input voltage
—
0.65 VCCIO
VCCIO + 0.3
V
VIL
Low-level input voltage
—
–0.3
0.35 VCCIO
V
VOH
High-level output voltage
IOH = –2 mA (2)
0.75 VCCIO
—
V
VOL
Low-level output voltage
IOL = 2 mA (2)
—
0.25 VCCIO
V
Notes to Table 4–19:
(1) The Arria GX device VCCIO voltage level support of 1.5 to 5% is narrower than defined in the normal range of the EIA/JEDEC standard.
(2) This specification is supported across all the programmable drive settings available for this I/O standard, as shown in the Arria GX
Architecture chapter.
Figure 4–5 and Figure 4–6 show receiver input and transmitter output waveforms,
respectively, for all differential I/O standards (LVDS and LVPECL).
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–17
Figure 4–5. Receiver Input Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VIH
VID
Negative Channel (n) = VIL
VCM
Ground
Differential Waveform
VID
p−n=0V
VID
VID (Peak-to-Peak)
Figure 4–6. Transmitter Output Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VOH
VOD
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
VOD
p−n=0V
VOD
Table 4–20. 2.5-V LVDS I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
I/O supply voltage for left and right I/O
banks (1, 2, 5, and 6)
—
2.375
2.5
2.625
V
VID
Input differential voltage swing
(single-ended)
—
100
350
900
mV
VICM
Input common mode voltage
—
200
1,250
1,800
mV
VOD
Output differential voltage (single-ended)
RL = 100 
250
—
450
mV
VOCM
Output common mode voltage
RL = 100 
1.125
—
1.375
V
RL
Receiver differential input discrete
resistor (external to Arria GX devices)
—
90
100
110

© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–18
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–21. 3.3-V LVDS I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO (1)
I/O supply voltage for top and bottom
PLL banks (9, 10, 11, and 12)
—
3.135
3.3
3.465
V
VID
Input differential voltage swing
(single-ended)
—
100
350
900
mV
VICM
Input common mode voltage
—
200
1,250
1,800
mV
VOD
Output differential voltage (single-ended) RL = 100 
250
—
710
mV
VOCM
Output common mode voltage
RL = 100 
840
—
1,570
mV
RL
Receiver differential input discrete
resistor (external to Arria GX devices)
90
100
110

—
Note to Table 4–21:
(1) The top and bottom clock input differential buffers in I/O banks 3, 4, 7, and 8 are powered by V CCINT, not VCCIO. The PLL clock output/feedback
differential buffers are powered by VCC_PLL_OUT. For differential clock output/feedback operation, connect VCC_PLL_OUT to 3.3 V.
Table 4–22. 3.3-V PCML Specifications
Symbol
Parameter
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
300
—
600
mV
VCCIO
I/O supply voltage
VID
Input differential voltage swing
(single-ended)
VICM
Input common mode voltage
1.5
—
3.465
V
VOD
Output differential voltage (single-ended)
300
370
500
mV
VOD
Change in VO D between high and low
—
—
50
mV
VOCM
Output common mode voltage
2.5
2.85
3.3
V
VOCM
Change in VO C M between high and low
—
—
50
mV
VT
Output termination voltage
—
VC C I O
—
V
R1
Output external pull-up resistors
45
50
55

R2
Output external pull-up resistors
45
50
55

Table 4–23. LVPECL Specifications
Parameter
Conditions
Minimum
Typical
Maximum
Units
Parameter
VCCIO (1)
I/O supply voltage
—
3.135
3.3
3.465
V
VID
Input differential voltage swing
(single-ended)
—
300
600
1,000
mV
VICM
Input common mode voltage
—
1.0
—
2.5
V
VOD
Output differential voltage
(single-ended)
RL = 100 
525
—
970
mV
VOCM
Output common mode voltage
RL = 100 
1,650
—
2,250
mV
RL
Receiver differential input resistor
—
90
100
110

Note to Table 4–23:
(1) The top and bottom clock input differential buffers in I/O banks 3, 4, 7, and 8 are powered by VCCINT, not VCCIO . The PLL clock output/feedback
differential buffers are powered by VCC_PLL_OUT. For differential clock output/feedback operation, connect VCC_PLL_OUT to 3.3 V.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–19
Table 4–24. 3.3-V PCI Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
3.0
3.3
3.6
V
VIH
High-level input voltage
—
0.5 VCCIO
—
VCCIO + 0.5
V
VIL
Low-level input voltage
—
–0.3
—
0.3 VCCIO
V
VOH
High-level output voltage
IOUT = –500 A
0.9 VCCIO
—
—
V
VOL
Low-level output voltage
IOUT = 1,500 A
—
—
0.1 VCCIO
V
Table 4–25. PCI-X Mode 1 Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
VCCIO
Output supply voltage
—
3.0
3.6
V
VIH
High-level input voltage
—
0.5 VCCIO
VCCIO + 0.5
V
VIL
Low-level input voltage
—
–0.3
0.35 VCCIO
V
VIPU
Input pull-up voltage
—
0.7 VCCIO
—
V
VOH
High-level output voltage
I OUT = –500 A
0.9 VCCIO
—
V
VOL
Low-level output voltage
I OUT = 1,500 A
—
0.1 VCCIO
V
Table 4–26. SSTL-18 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.71
1.8
1.89
V
VREF
Reference voltage
—
0.855
0.9
0.945
V
VTT
Termination voltage
—
VREF – 0.04
VREF
VREF + 0.04
V
VIH (DC)
High-level DC input voltage
—
VREF + 0.125
—
—
V
VIL (DC)
Low-level DC input voltage
—
—
—
VREF – 0.125
V
VIH (AC)
High-level AC input voltage
—
VREF + 0.25
—
—
V
VIL (AC)
Low-level AC input voltage
—
—
—
VREF – 0.25
V
VOH
High-level output voltage
I OH = –6.7 mA (1)
VTT + 0.475
—
—
V
VOL
Low-level output voltage
I OL = 6.7 mA (1)
—
—
VTT – 0.475
V
Note to Table 4–26:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX
Architecture chapter.
Table 4–27. SSTL-18 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.71
1.8
1.89
V
VREF
Reference voltage
—
0.855
0.9
0.945
V
VTT
Termination voltage
—
VREF – 0.04
VREF
VREF + 0.04
V
VIH (DC)
High-level DC input voltage
—
VREF + 0.125
—
—
V
VIL (DC)
Low-level DC input voltage
—
—
—
VREF – 0.125
V
VIH (AC)
High-level AC input voltage
—
VREF + 0.25
—
—
V
VIL (AC)
Low-level AC input voltage
—
—
—
VREF – 0.25
V
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–20
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–27. SSTL-18 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VOH
High-level output voltage
I OH = –13.4 mA (1)
VCCIO – 0.28
—
—
V
VOL
Low-level output voltage
I OL = 13.4 mA (1)
—
—
0.28
V
Note to Table 4–27:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX
Architecture chapter.
Table 4–28. SSTL-18 Class I & II Differential Specifications
Symbol
Parameter
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
1.71
1.8
1.89
V
VSWING (DC)
DC differential input voltage
0.25
—
—
V
VX (AC)
AC differential input cross point
voltage
(VCCIO/2) – 0.175
—
(VCCIO/2) + 0.175
V
VSWING (AC)
AC differential input voltage
0.5
—
—
V
VISO
Input clock signal offset voltage
—
0.5 VCC IO
—
V
VISO
Input clock signal offset voltage
variation
—
200
—
mV
VOX (AC)
AC differential cross point voltage
(VCCIO/2) – 0.125
—
(VCCIO/2) + 0.125
V
Table 4–29. SSTL-2 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
2.375
2.5
2.625
V
VTT
Termination voltage
—
VREF – 0.04
VREF
VREF + 0.04
V
VREF
Reference voltage
—
1.188
1.25
1.313
V
VIH (DC)
High-level DC input voltage
—
VREF + 0.18
—
3.0
V
VIL (DC)
Low-level DC input voltage
—
–0.3
—
VREF – 0.18
V
VIH (AC)
High-level AC input voltage
—
VREF + 0.35
—
—
V
VIL (AC)
Low-level AC input voltage
—
—
—
VREF – 0.35
V
VOH
High-level output voltage
IOH = –8.1 mA
(1)
VTT + 0.57
—
VOL
Low-level output voltage
IOL = 8.1 mA (1)
—
—
V
VTT – 0.57
V
Note to Table 4–29:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX Architecture
chapter.
Table 4–30. SSTL-2 Class II Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCC IO
Output supply voltage
—
2.375
2.5
2.625
V
VTT
Termination voltage
—
VREF – 0.04
VREF
VREF + 0.04
V
VREF
Reference voltage
—
1.188
1.25
1.313
V
VIH (DC)
High-level DC input
voltage
—
VREF + 0.18
—
VCCIO + 0.3
V
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–21
Table 4–30. SSTL-2 Class II Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VIL (DC)
Low-level DC input
voltage
—
–0.3
—
VREF – 0.18
V
VIH (AC)
High-level AC input
voltage
—
VREF + 0.35
—
—
V
VIL (AC)
Low-level AC input
voltage
—
—
—
VREF – 0.35
V
VOH
High-level output voltage
IOH = –16.4 mA (1)
VTT + 0.76
—
—
V
VOL
Low-level output voltage
I OL = 16.4 mA (1)
—
—
VTT – 0.76
V
Note to Table 4–30:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX Architecture
chapter.
Table 4–31. SSTL-2 Class I & II Differential Specifications
Symbol
(Note 1)
Parameter
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
2.375
2.5
2.625
V
VSWING (DC)
DC differential input voltage
0.36
—
—
V
VX (AC)
AC differential input cross point voltage
(VCCIO/2) – 0.2
—
(VCCIO /2) + 0.2
V
VSWING (AC)
AC differential input voltage
0.7
—
—
V
VISO
Input clock signal offset voltage
—
0.5 VCCIO
—
V
VISO
Input clock signal offset voltage
variation
—
200
—
mV
VOX (AC)
AC differential output cross point
voltage
(VCCIO/2) – 0.2
—
(VCCIO /2) + 0.2
V
Note to Table 4–31:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX Architecture
chapter.
Table 4–32. 1.2-V HSTL Specifications
Symbol
Parameter
Minimum
Typical
Maximum
Units
1.14
1.2
1.26
V
VCCIO
Output supply voltage
VREF
Reference voltage
0.48 VCCIO
0.5 VCCIO
0.52 VCCIO
V
VIH (DC)
High-level DC input voltage
VREF + 0.08
—
VCCIO + 0.15
V
VIL (DC)
Low-level DC input voltage
–0.15
—
VREF – 0.08
V
VIH (AC)
High-level AC input voltage
VREF + 0.15
—
VCCIO + 0.24
V
VIL (AC)
Low-level AC input voltage
–0.24
—
VREF – 0.15
V
VOH
High-level output voltage
VREF + 0.15
—
VCCIO + 0.15
V
VOL
Low-level output voltage
–0.15
—
VREF – 0.15
V
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–22
Chapter 4: DC and Switching Characteristics
Operating Conditions
Table 4–33. 1.5-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.425
1.5
1.575
V
VREF
Input reference voltage
—
0.713
0.75
0.788
V
VTT
Termination voltage
—
0.713
0.75
0.788
V
VIH (DC)
DC high-level input voltage
—
VREF + 0.1
—
—
V
VIL (DC)
DC low-level input voltage
—
–0.3
—
VREF – 0.1
V
VIH (AC)
AC high-level input voltage
—
VREF + 0.2
—
—
V
VIL (AC)
AC low-level input voltage
—
—
—
VREF – 0.2
V
VOH
High-level output voltage
IOH = 8 mA (1)
VCCIO – 0.4
—
—
V
VOL
Low-level output voltage
IOH = –8 mA (1)
—
—
0.4
V
Note to Table 4–33:
(1) This specification is supported across all the programmable drive settings available for this I/O standard as shown in the Arria GX Architecture
chapter.
Table 4–34. 1.5-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.425
1.50
1.575
V
VREF
Input reference voltage
—
0.713
0.75
0.788
V
VTT
Termination voltage
—
0.713
0.75
0.788
V
VIH (DC)
DC high-level input voltage
—
VREF + 0.1
—
—
V
VIL (DC)
DC low-level input voltage
—
–0.3
—
VREF – 0.1
V
VIH (AC)
AC high-level input voltage
—
VREF + 0.2
—
—
V
VIL (AC)
AC low-level input voltage
—
—
—
VREF – 0.2
V
VOH
High-level output voltage
IOH = 16 mA (1)
VCCIO – 0.4
—
—
V
VOL
Low-level output voltage
I OH = –16 mA (1)
—
—
0.4
V
Note to Table 4–34:
(1) This specification is supported across all the programmable drive settings available for this I/O standard, as shown in the Arria GX Architecture
chapter.
Table 4–35. 1.5-V HSTL Class I & II Differential Specifications
Symbol
Parameter
Minimum
Typical
Maximum
Units
1.425
1.5
1.575
V
VCCIO
I/O supply voltage
VDIF (DC)
DC input differential voltage
0.2
—
—
V
VCM (DC)
DC common mode input voltage
0.68
—
0.9
V
VDIF (AC)
AC differential input voltage
0.4
—
—
V
VOX (AC)
AC differential cross point
voltage
0.68
—
0.9
V
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Operating Conditions
4–23
Table 4–36. 1.8-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.71
1.80
1.89
V
VREF
Input reference voltage
—
0.85
0.90
0.95
V
VTT
Termination voltage
—
0.85
0.90
0.95
V
VIH (DC)
DC high-level input voltage
—
VREF + 0.1
—
—
V
VIL (DC)
DC low-level input voltage
—
–0.3
—
VREF – 0.1
V
VIH (AC)
AC high-level input voltage
—
VREF + 0.2
—
—
V
VIL (AC)
AC low-level input voltage
—
—
—
VREF – 0.2
V
VOH
High-level output voltage
IOH = 8 mA (1)
VCCIO – 0.4
—
—
V
VOL
Low-level output voltage
IOH = –8 mA (1)
—
—
0.4
V
Note to Table 4–36:
(1) This specification is supported across all the programmable drive settings available for this I/O standard, as shown in the Arria GX Architecture
chapter.
Table 4–37. 1.8-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
—
1.71
1.80
1.89
V
VREF
Input reference voltage
—
0.85
0.90
0.95
V
VTT
Termination voltage
—
0.85
0.90
0.95
V
VIH (DC)
DC high-level input voltage
—
VREF + 0.1
—
—
V
VIL (DC)
DC low-level input voltage
—
–0.3
—
VREF – 0.1
V
VIH (AC)
AC high-level input voltage
—
VREF + 0.2
—
—
V
VIL (AC)
AC low-level input voltage
—
—
—
VREF – 0.2
V
VOH
High-level output voltage
I OH = 16 mA (1)
VCCIO – 0.4
—
—
V
VOL
Low-level output voltage
IOH = –16 mA (1)
—
—
0.4
V
Note to Table 4–37:
(1) This specification is supported across all the programmable drive settings available for this I/O standard, as shown in the Arria GX Architecture
chapter in volume 1 of the Arria GX Device Handbook.
Table 4–38. 1.8-V HSTL Class I & II Differential Specifications
Symbol
Parameter
Minimum
Typical
Maximum
Units
VCCIO
I/O supply voltage
1.71
1.80
1.89
V
VDIF (DC)
DC input differential voltage
0.2
—
—
V
VCM (DC)
DC common mode input voltage
0.78
—
1.12
V
VDIF (AC)
AC differential input voltage
0.4
—
—
V
VOX (AC)
AC differential cross point voltage
0.68
—
0.9
V
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–24
Chapter 4: DC and Switching Characteristics
Operating Conditions
Bus Hold Specifications
Table 4–39 shows the Arria GX device family bus hold specifications.
Table 4–39. Bus Hold Parameters
VC CIO Level
Parameter
1.2 V
Conditions
1.5 V
1.8 V
2.5 V
3.3 V
Units
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Low
sustaining
current
VIN > VIL
(maximum)
22.5
—
25
—
30
—
50
—
70
—
A
High
sustaining
current
VIN < VIH
(minimum)
–22.5
—
–25
—
–30
—
–50
—
–70
—
A
Low overdrive
current
0V
<VIN < VCCIO
—
120
—
160
—
200
—
300
—
500
A
High
overdrive
current
0V<
VIN < VCCIO
—
–120
—
–160
—
–200
—
–300
—
–500
A
—
0.45
0.95
0.5
1.0
0.68
1.07
0.7
1.7
0.8
2.0
V
Bus-hold trip
point
On-Chip Termination Specifications
Table 4–40 and Table 4–41 define the specification for internal termination resistance
tolerance when using series or differential on-chip termination.
Table 4–40. Series On-Chip Termination Specification for Top and Bottom I/O Banks
Resistance Tolerance
Symbol
Description
Conditions
Commercial
Max
Industrial
Max
Units
25- RS 3.3/2.5
Internal series termination without
calibration (25- setting
VCCIO = 3.3/2.5V
±30
±30
%
50- RS 3.3/2.5
Internal series termination without
calibration (50- setting
VCCIO = 3.3/2.5V
±30
± 30
%
25- RS 1.8
Internal series termination without
calibration (25- setting
VCCIO = 1.8V
±30
±30
%
50- RS 1.8
Internal series termination without
calibration (50- setting
VCCIO = 1.8V
±30
±30
%
50- RS 1.5
Internal series termination without
calibration (50- setting
VCCIO = 1.5V
±36
±36
%
50- RS 1.2
Internal series termination without
calibration (50- setting
VCCIO = 1.2V
±50
±50
%
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Power Consumption
4–25
Table 4–41. Series On-Chip Termination Specification for Left I/O Banks
Resistance Tolerance
Symbol
Description
Conditions
Commercial
Max
Industrial
Max
Units
25- RS 3.3/2.5
Internal series termination without
calibration (25- setting
VCCIO = 3.3/2.5V
±30
±30
%
50- RS
3.3/2.5/1.8
Internal series termination without
calibration (50- setting
VCCIO = 3.3/2.5/1.8V
±30
±30
%
50- RS 1.5
Internal series termination without
calibration (50- setting
VCCIO = 1.5V
±36
±36
%
RD
Internal differential termination for
LVDS (100- setting)
VCCIO = 2.5V
±20
±25
%
Pin Capacitance
Table 4–42 shows the Arria GX device family pin capacitance.
Table 4–42. Arria GX Device Capacitance
Symbol
(Note 1)
Parameter
Typical
Units
CIOTB
Input capacitance on I/O pins in I/O banks 3, 4, 7, and 8.
5.0
pF
CIOL
Input capacitance on I/O pins in I/O banks 1 and 2, including high-speed differential
receiver and transmitter pins.
6.1
pF
CCLKTB
Input capacitance on top/bottom clock input pins: CLK[4..7] and CLK[12..15] .
6.0
pF
CCLKL
Input capacitance on left clock inputs: CLK0 and CLK2.
6.1
pF
CCLKL+
Input capacitance on left clock inputs: CLK1 and CLK3.
3.3
pF
COUTFB
Input capacitance on dual-purpose clock output/feedback pins in PLL banks 11 and 12.
6.7
pF
Note to Table 4–42:
(1) Capacitance is sample-tested only. Capacitance is measured using time-domain reflections (TDR). Measurement accuracy is within ±0.5 pF.
Power Consumption
Altera offers two ways to calculate power for a design: the Excel-based PowerPlay
early power estimator power calculator and the Quartus II PowerPlay power analyzer
feature.
The interactive Excel-based PowerPlay Early Power Estimator is typically used prior
to designing the FPGA in order to get an estimate of device power. The Quartus II
PowerPlay Power Analyzer provides better quality estimates based on the specifics of
the design after place-and-route is complete. The power analyzer can apply a
combination of user-entered, simulation-derived and estimated signal activities
which, combined with detailed circuit models, can yield very accurate power
estimates.
In both cases, these calculations should only be used as an estimation of power, not as
a specification.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–26
Chapter 4: DC and Switching Characteristics
I/O Timing Model
f
For more information about PowerPlay tools, refer to the PowerPlay Early Power
Estimator and PowerPlay Power Analyzer page and the PowerPlay Power Analysis chapter
in volume 3 of the Quartus II Handbook.
For typical ICC standby specifications, refer to Table 4–14 on page 4–14 .
I/O Timing Model
The DirectDrive technology and MultiTrack interconnect ensures predictable
performance, accurate simulation, and accurate timing analysis across all Arria GX
device densities and speed grades. This section describes and specifies the
performance of I/Os.
All specifications are representative of worst-case supply voltage and junction
temperature conditions.
1
The timing numbers listed in the tables of this section are extracted from the
Quartus II software version 7.1.
Preliminary, Correlated, and Final Timing
Timing models can have either preliminary, correlated, or final status. The Quartus II
software issues an informational message during design compilation if the timing
models are preliminary. Table 4–43 lists the status of the Arria GX device timing
models.
■
Preliminary status means the timing model is subject to change. Initially, timing
numbers are created using simulation results, process data, and other known
parameters. These tests are used to make the preliminary numbers as close to the
actual timing parameters as possible.
■
Correlated numbers are based on actual device operation and testing. These
numbers reflect the actual performance of the device under worst-case voltage and
junction temperature conditions.
■
Final timing numbers are based on complete correlation to actual devices and
addressing any minor deviations from the correlated timing model. When the
timing models are final, all or most of the Arria GX family devices have been
completely characterized and no further changes to the timing model are
expected.
Table 4–43. Arria GX Device Timing Model Status
Device
Preliminary
Correlated
Final
EP1AGX20
—
—
v
EP1AGX35
—
—
v
EP1AGX50
—
—
v
EP1AGX60
—
—
v
EP1AGX90
—
—
v
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
I/O Timing Model
4–27
I/O Timing Measurement Methodology
Different I/O standards require different baseline loading techniques for reporting
timing delays. Altera characterizes timing delays with the required termination for
each I/O standard and with 0 pF (except for PCI and PCI-X which use 10 pF) loading
and the timing is specified up to the output pin of the FPGA device. The Quartus II
software calculates the I/O timing for each I/O standard with a default baseline
loading as specified by the I/O standards.
The following measurements are made during device characterization. Altera
measures clock-to-output delays (tCO) at worst-case process, minimum voltage, and
maximum temperature (PVT) for default loading conditions shown in Table 4–44.
Use the following equations to calculate clock pin to output pin timing for Arria GX
devices:
Equation 4–1.
tCO from clock pin to I/O pin = delay from clock pad to I/O output
register + IOE output register clock-to-output delay + delay
from output register to output pin + I/O output delay
txz/tzx from clock pin to I/O pin = delay from clock pad to I/O
output register + IOE output register clock-to-output delay +
delay from output register to output pin + I/O output delay +
output enable pin delay
Simulation using IBIS models is required to determine the delays on the PCB traces in
addition to the output pin delay timing reported by the Quartus II software and the
timing model in the device handbook.
1. Simulate the output driver of choice into the generalized test setup, using values
from Table 4–44.
2. Record the time to V MEAS.
3. Simulate the output driver of choice into the actual PCB trace and load, using the
appropriate IBIS model or capacitance value to represent the load.
4. Record the time to V MEAS.
5. Compare the results of steps 2 and 4. The increase or decrease in delay should be
added to or subtracted from the I/O Standard Output Adder delays to yield the
actual worst-case propagation delay (clock-to-output) of the PCB trace.
The Quartus II software reports the timing with the conditions shown in Table 4–44
using the above equation. Figure 4–7 shows the model of the circuit that is
represented by the output timing of the Quartus II software.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–28
Chapter 4: DC and Switching Characteristics
I/O Timing Model
Figure 4–7. Output Delay Timing Reporting Setup Modeled by Quartus II
VTT
VCCIO
Outputp
RT
Output
Buffer
RS
Output
VMEAS
Outputn
CL
GND
RD
GND
Notes to Figure 4–7:
(1) Output pin timing is reported at the output pin of the FPGA device. Additional delays for loading and board trace delay
need to be accounted for with IBIS model simulations.
(2) VCCPD is 3.085 V unless otherwise specified.
(3) VCCINT is 1.12 V unless otherwise specified.
Table 4–44. Output Timing Measurement Methodology for Output Pins (Note 1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RS ()
RD ( )
RT ( )
VCCIO
(V)
VTT (V)
CL (pF)
VMEAS (V)
LVTTL (4)
—
—
—
3.135
—
0
1.5675
LVCMOS (4)
—
—
—
3.135
—
0
1.5675
2.5 V (4)
—
—
—
2.375
—
0
1.1875
1.8 V (4)
—
—
—
1.710
—
0
0.855
1.5 V (4)
—
—
—
1.425
—
0
0.7125
PCI (5)
—
—
—
2.970
—
10
1.485
PCI-X (5)
—
—
—
2.970
—
10
1.485
SSTL-2 Class I
25
—
50
2.325
1.123
0
1.1625
SSTL-2 Class II
25
—
25
2.325
1.123
0
1.1625
SSTL-18 Class I
25
—
50
1.660
0.790
0
0.83
SSTL-18 Class II
25
—
25
1.660
0.790
0
0.83
1.8-V HSTL Class I
—
—
50
1.660
0.790
0
0.83
1.8-V HSTL Class II
—
—
25
1.660
0.790
0
0.83
1.5-V HSTL Class I
—
—
50
1.375
0.648
0
0.6875
1.5-V HSTL Class II
—
—
25
1.375
0.648
0
0.6875
1.2-V HSTL with OCT
—
—
—
1.140
—
0
0.570
Differential SSTL-2 Class I
25
—
50
2.325
1.123
0
1.1625
Differential SSTL-2 Class II
25
—
25
2.325
1.123
0
1.1625
Differential SSTL-18 Class I
50
—
50
1.660
0.790
0
0.83
Differential SSTL-18 Class II
25
—
25
1.660
0.790
0
0.83
1.5-V differential HSTL Class I
—
—
50
1.375
0.648
0
0.6875
1.5-V differential HSTL Class II
—
—
25
1.375
0.648
0
0.6875
1.8-V differential HSTL Class I
—
—
50
1.660
0.790
0
0.83
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
I/O Timing Model
4–29
Table 4–44. Output Timing Measurement Methodology for Output Pins (Note 1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RS ()
RD ( )
RT ( )
VCCIO
(V)
VTT (V)
CL (pF)
VMEAS (V)
1.8-V differential HSTL Class II
—
—
25
1.660
0.790
0
0.83
LVDS
—
100
—
2.325
—
0
1.1625
LVPECL
—
100
—
3.135
—
0
1.5675
Notes to Table 4–44:
(1)
(2)
(3)
(4)
(5)
Input measurement point at internal node is 0.5 VCCINT.
Output measuring point for VMEAS at buffer output is 0.5 VCCIO.
Input stimulus edge rate is 0 to VCC in 0.2 ns (internal signal) from the driver preceding the I/O buffer.
Less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V with less than 30-mV ripple.
VCCPD = 2.97 V, less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V.
Figure 4–8 and Figure 4–9 show the measurement setup for output disable and output
enable timing.
Figure 4–8. Measurement Setup for txz
(Note 1)
tXZ, Driving High to Tristate
Enable
OE
OE
½ VCCINT
Dout
Din
100 Ω
Disable
“1”
Din
100 mv
Dout
thz
GND
tXZ, Driving Low to Tristate
Enable
OE
100 Ω
Disable
½ VCCINT
OE
Dout
Din
Din
Dout
“0”
tlz
VCCIO
100 mv
Note to Figure 4–8:
(1) VCCINT is 1.12 V for this measurement.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–30
Chapter 4: DC and Switching Characteristics
I/O Timing Model
Figure 4–9. Measurement Setup for tzx
tZX, Tristate to Driving High
Disable
OE
Enable
½ VCCINT
OE
Dout
Din
“1”
Din
1 MΩ
tzh
Dout
½ VCCIO
tZX, Tristate to Driving Low
Disable
Enable
½ VCCINT
OE
1 MΩ
OE
Dout
Din
“0”
Din
½ VCCIO
tzl
Dout
Table 4–45 specifies the input timing measurement setup.
Table 4–45. Timing Measurement Methodology for Input Pins
(Note 1), (2), (3), (4) (Part 1 of 2)
Measurement Conditions
Measurement Point
VCCIO (V)
VREF (V)
Edge Rate (ns)
VMEAS (V)
LVTTL (5)
3.135
—
3.135
1.5675
LVCMOS (5)
3.135
—
3.135
1.5675
2.5 V (5)
2.375
—
2.375
1.1875
1.8 V (5)
1.710
—
1.710
0.855
1.5 V (5)
1.425
—
1.425
0.7125
PCI (6)
2.970
—
2.970
1.485
PCI-X (6)
2.970
—
2.970
1.485
SSTL-2 Class I
2.325
1.163
2.325
1.1625
SSTL-2 Class II
2.325
1.163
2.325
1.1625
SSTL-18 Class I
1.660
0.830
1.660
0.83
I/O Standard
SSTL-18 Class II
1.660
0.830
1.660
0.83
1.8-V HSTL Class I
1.660
0.830
1.660
0.83
1.8-V HSTL Class II
1.660
0.830
1.660
0.83
1.5-V HSTL Class I
1.375
0.688
1.375
0.6875
1.5-V HSTL Class II
1.375
0.688
1.375
0.6875
1.2-V HSTL with OCT
1.140
0.570
1.140
0.570
Differential SSTL-2 Class I
2.325
1.163
2.325
1.1625
Differential SSTL-2 Class II
2.325
1.163
2.325
1.1625
Differential SSTL-18 Class I
1.660
0.830
1.660
0.83
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
I/O Timing Model
4–31
Table 4–45. Timing Measurement Methodology for Input Pins
(Note 1), (2), (3), (4) (Part 2 of 2)
Measurement Conditions
Measurement Point
VCCIO (V)
VREF (V)
Edge Rate (ns)
VMEAS (V)
Differential SSTL-18 Class II
1.660
0.830
1.660
0.83
1.5-V differential HSTL Class I
1.375
0.688
1.375
0.6875
I/O Standard
1.5-V differential HSTL Class II
1.375
0.688
1.375
0.6875
1.8-V differential HSTL Class I
1.660
0.830
1.660
0.83
1.8-V differential HSTL Class II
1.660
0.830
1.660
0.83
LVDS
2.325
—
0.100
1.1625
LVPECL
3.135
—
0.100
1.5675
Notes to Table 4–45:
(1)
(2)
(3)
(4)
(5)
(6)
Input buffer sees no load at buffer input.
Input measuring point at buffer input is 0.5 VCCIO.
Output measuring point is 0.5 VCC at internal node.
Input edge rate is 1 V/ns.
Less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V with less than 30-mV ripple.
VCCPD = 2.97 V, less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V.
Clock Network Skew Adders
The Quartus II software models skew within dedicated clock networks such as global
and regional clocks. Therefore, the intra-clock network skew adder is not specified.
Table 4–46 specifies the intra clock skew between any two clock networks driving any
registers in the Arria GX device.
Table 4–46. Clock Network Specifications
Name
Description
Min
Typ
Max
Units
Clock skew adder
EP1AGX20/35 (1)
Inter-clock network, same side
—
—
± 50
ps
Inter-clock network, entire chip
—
—
± 100
ps
Clock skew adder
EP1AGX50/60 (1)
Inter-clock network, same side
—
—
± 50
ps
Inter-clock network, entire chip
—
—
± 100
ps
Clock skew adder
EP1AGX90 (1)
Inter-clock network, same side
—
—
± 55
ps
Inter-clock network, entire chip
—
—
± 110
ps
Note to Table 4–46:
(1) This is in addition to intra-clock network skew, which is modeled in the Quartus II software.
Default Capacitive Loading of Different I/O Standards
See Table 4–47 for default capacitive loading of different I/O standards.
Table 4–47. Default Loading of Different I/O Standards for Arria GX Devices (Part 1 of 2)
I/O Standard
© December 2009
Capacitive Load
Units
LVTTL
0
pF
LVCMOS
0
pF
2.5 V
0
pF
Altera Corporation
Arria GX Device Handbook, Volume 1
4–32
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–47. Default Loading of Different I/O Standards for Arria GX Devices (Part 2 of 2)
I/O Standard
Capacitive Load
Units
1.8 V
0
pF
1.5 V
0
pF
PCI
10
pF
PCI-X
10
pF
SSTL-2 Class I
0
pF
SSTL-2 Class II
0
pF
SSTL-18 Class I
0
pF
SSTL-18 Class II
0
pF
1.5-V HSTL Class I
0
pF
1.5-V HSTL Class II
0
pF
1.8-V HSTL Class I
0
pF
1.8-V HSTL Class II
0
pF
Differential SSTL-2 Class I
0
pF
Differential SSTL-2 Class II
0
pF
Differential SSTL-18 Class I
0
pF
Differential SSTL-18 Class II
0
pF
1.5-V differential HSTL Class I
0
pF
1.5-V differential HSTL Class II
0
pF
1.8-V differential HSTL Class I
0
pF
1.8-V differential HSTL Class II
0
pF
LVDS
0
pF
Typical Design Performance
The following section describes the typical design performance for the Arria GX
device family.
User I/O Pin Timing
Table 4–48 through Table 4–77 show user I/O pin timing for Arria GX devices. I/O
buffer tSU , tH , and tCO are reported for the cases when I/O clock is driven by a
non-PLL global clock (GCLK) and a PLL driven global clock (GCLK-PLL). For tSU, tH,
and tCO using regional clock, add the value from the adder tables listed for each device
to the GCLK/GCLK-PLL values for the device.
EP1AGX20 I/O Timing Parameters
Table 4–48 through Table 4–51 show the maximum I/O timing parameters for
EP1AGX20 devices for I/O standards which support general purpose I/O pins.
Table 4–48 describes the row pin delay adders when using the regional clock in
Arria GX devices.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–33
Table 4–48. EP1AGX20 Row Pin Delay Adders for Regional Clock
Fast Corner
Industrial
Commercial
–6 Speed
Grade
0.117
0.117
0.273
ns
RCLK PLL
input adder
0.011
0.011
0.019
ns
RCLK output
–0.117
–0.117
–0.273
ns
–0.011
–0.011
–0.019
ns
Parameter
RCLK input
Units
adder
adder
RCLK PLL
output adder
Table 4–49 describes I/O timing specifications.
Table 4–49. EP1AGX20 Column Pins Input Timing Parameters (Part 1 of 3)
I/O Standard
Fast Corner
Industrial
Commercial
–6 Speed
Grade
tSU
1.251
1.251
2.915
ns
tH
–1.146
–1.146
–2.638
ns
GCLK PLL
tSU
2.693
2.693
6.021
ns
tH
–2.588
–2.588
–5.744
ns
GCLK
tSU
1.251
1.251
2.915
ns
tH
–1.146
–1.146
–2.638
ns
tSU
2.693
2.693
6.021
ns
tH
–2.588
–2.588
–5.744
ns
tSU
1.261
1.261
2.897
ns
tH
–1.156
–1.156
–2.620
ns
GCLK PLL
tSU
2.703
2.703
6.003
ns
tH
–2.598
–2.598
–5.726
ns
GCLK
tSU
1.327
1.327
3.107
ns
tH
–1.222
–1.222
–2.830
ns
tSU
2.769
2.769
6.213
ns
tH
–2.664
–2.664
–5.936
ns
tSU
1.330
1.330
3.200
ns
tH
–1.225
–1.225
–2.923
ns
GCLK PLL
tSU
2.772
2.772
6.306
ns
tH
–2.667
–2.667
–6.029
ns
GCLK
tSU
1.075
1.075
2.372
ns
tH
–0.970
–0.970
–2.095
ns
tSU
2.517
2.517
5.480
ns
tH
–2.412
–2.412
–5.203
ns
Clock
GCLK
3.3-V LVTTL
3.3-V LVCMOS
GCLK PLL
GCLK
2.5 V
1.8 V
GCLK PLL
GCLK
1.5 V
SSTL-2 CLASS I
GCLK PLL
© December 2009
Altera Corporation
Parameter
Units
Arria GX Device Handbook, Volume 1
4–34
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–49. EP1AGX20 Column Pins Input Timing Parameters (Part 2 of 3)
I/O Standard
Fast Corner
Clock
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
3.3-V PCI
GCLK PLL
GCLK
3.3-V PCI-X
GCLK PLL
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tSU
1.075
1.075
2.372
ns
tH
–0.970
–0.970
–2.095
ns
Parameter
Units
tSU
2.517
2.517
5.480
ns
tH
–2.412
–2.412
–5.203
ns
tSU
1.113
1.113
2.479
ns
tH
–1.008
–1.008
–2.202
ns
tSU
2.555
2.555
5.585
ns
tH
–2.450
–2.450
–5.308
ns
tSU
1.114
1.114
2.479
ns
tH
–1.009
–1.009
–2.202
ns
tSU
2.556
2.556
5.587
ns
tH
–2.451
–2.451
–5.310
ns
tSU
1.113
1.113
2.479
ns
tH
–1.008
–1.008
–2.202
ns
tSU
2.555
2.555
5.585
ns
tH
–2.450
–2.450
–5.308
ns
tSU
1.114
1.114
2.479
ns
tH
–1.009
–1.009
–2.202
ns
tSU
2.556
2.556
5.587
ns
tH
–2.451
–2.451
–5.310
ns
tSU
1.131
1.131
2.607
ns
tH
–1.026
–1.026
–2.330
ns
tSU
2.573
2.573
5.713
ns
tH
–2.468
–2.468
–5.436
ns
tSU
1.132
1.132
2.607
ns
tH
–1.027
–1.027
–2.330
ns
tSU
2.574
2.574
5.715
ns
tH
–2.469
–2.469
–5.438
ns
tSU
1.256
1.256
2.903
ns
tH
–1.151
–1.151
–2.626
ns
tSU
2.698
2.698
6.009
ns
tH
–2.593
–2.593
–5.732
ns
tSU
1.256
1.256
2.903
ns
tH
–1.151
–1.151
–2.626
ns
tSU
2.698
2.698
6.009
ns
tH
–2.593
–2.593
–5.732
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–35
Table 4–49. EP1AGX20 Column Pins Input Timing Parameters (Part 3 of 3)
Fast Corner
I/O Standard
Clock
Industrial
Commercial
–6 Speed
Grade
tSU
1.106
1.106
2.489
ns
tH
–1.001
–1.001
–2.212
ns
Parameter
GCLK
LVDS
GCLK PLL
Units
tSU
2.530
2.530
5.564
ns
tH
–2.425
–2.425
–5.287
ns
Units
Table 4–50 describes I/O timing specifications.
Table 4–50. EP1AGX20 Row Pins output Timing Parameters (Part 1 of 2)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Clock
4 mA
GCLK
3.3-V
LVCMOS
8 mA
2.5 V
4 mA
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
© December 2009
Commercial
tCO
2.904
2.904
6.699
ns
GCLK PLL
tCO
1.485
1.485
3.627
ns
GCLK
tCO
2.776
2.776
6.059
ns
GCLK PLL
tCO
1.357
1.357
2.987
ns
Parameter
GCLK
tCO
2.720
2.720
6.022
ns
GCLK PLL
tCO
1.301
1.301
2.950
ns
GCLK
tCO
2.776
2.776
6.059
ns
GCLK PLL
tCO
1.357
1.357
2.987
ns
GCLK
tCO
2.670
2.670
5.753
ns
GCLK PLL
tCO
1.251
1.251
2.681
ns
GCLK
tCO
2.759
2.759
6.033
ns
GCLK PLL
tCO
1.340
1.340
2.961
ns
12 mA
4 mA
2.5 V
Industrial
–6 Speed
Grade
8 mA
3.3-V
LVCMOS
2.5 V
Fast Model
Drive
Strength
GCLK
tCO
2.656
2.656
5.775
ns
GCLK PLL
tCO
1.237
1.237
2.703
ns
GCLK
tCO
2.637
2.637
5.661
ns
GCLK PLL
tCO
1.218
1.218
2.589
ns
GCLK
tCO
2.829
2.829
7.052
ns
GCLK PLL
tCO
1.410
1.410
3.980
ns
GCLK
tCO
2.818
2.818
6.273
ns
GCLK PLL
tCO
1.399
1.399
3.201
ns
8 mA
12 mA
2 mA
4 mA
GCLK
tCO
2.707
2.707
5.972
ns
GCLK PLL
tCO
1.288
1.288
2.900
ns
GCLK
tCO
2.676
2.676
5.858
ns
GCLK PLL
tCO
1.257
1.257
2.786
ns
GCLK
tCO
2.789
2.789
6.551
ns
GCLK PLL
tCO
1.370
1.370
3.479
ns
GCLK
tCO
2.682
2.682
5.950
ns
GCLK PLL
tCO
1.263
1.263
2.878
ns
6 mA
8 mA
2 mA
4 mA
Altera Corporation
Arria GX Device Handbook, Volume 1
4–36
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–50. EP1AGX20 Row Pins output Timing Parameters (Part 2 of 2)
Fast Model
Drive
Strength
Clock
SSTL-2
CLASS I
8 mA
GCLK
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
I/O Standard
LVDS
—
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.626
2.626
5.614
ns
GCLK PLL
tCO
1.207
1.207
2.542
ns
Parameter
Units
GCLK
tCO
2.602
2.602
5.538
ns
GCLK PLL
tCO
1.183
1.183
2.466
ns
GCLK
tCO
2.568
2.568
5.407
ns
GCLK PLL
tCO
1.149
1.149
2.335
ns
GCLK
tCO
2.614
2.614
5.556
ns
GCLK PLL
tCO
1.195
1.195
2.484
ns
GCLK
tCO
2.618
2.618
5.485
ns
GCLK PLL
tCO
1.199
1.199
2.413
ns
GCLK
tCO
2.594
2.594
5.468
ns
GCLK PLL
tCO
1.175
1.175
2.396
ns
GCLK
tCO
2.597
2.597
5.447
ns
GCLK PLL
tCO
1.178
1.178
2.375
ns
GCLK
tCO
2.595
2.595
5.466
ns
GCLK PLL
tCO
1.176
1.176
2.394
ns
GCLK
tCO
2.598
2.598
5.430
ns
GCLK PLL
tCO
1.179
1.179
2.358
ns
GCLK
tCO
2.580
2.580
5.426
ns
GCLK PLL
tCO
1.161
1.161
2.354
ns
GCLK
tCO
2.584
2.584
5.415
ns
GCLK PLL
tCO
1.165
1.165
2.343
ns
GCLK
tCO
2.575
2.575
5.414
ns
GCLK PLL
tCO
1.156
1.156
2.342
ns
GCLK
tCO
2.594
2.594
5.443
ns
GCLK PLL
tCO
1.175
1.175
2.371
ns
GCLK
tCO
2.597
2.597
5.429
ns
GCLK PLL
tCO
1.178
1.178
2.357
ns
GCLK
tCO
2.582
2.582
5.421
ns
GCLK PLL
tCO
1.163
1.163
2.349
ns
GCLK
tCO
2.654
2.654
5.613
ns
GCLK PLL
tCO
1.226
1.226
2.530
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–37
Table 4–51 describes I/O timing specifications.
Table 4–51. EP1AGX20 Column Pins Output Timing Parameters (Part 1 of 4)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V
LVCMOS
16 mA
3.3-V
LVCMOS
20 mA
3.3-V
LVCMOS
24 mA
2.5 V
4 mA
1.8 V
1.8 V
© December 2009
6.541
ns
GCLK PLL
tCO
1.467
1.467
3.435
ns
GCLK
tCO
2.764
2.764
6.169
ns
GCLK PLL
tCO
1.322
1.322
3.063
ns
GCLK
tCO
2.697
2.697
6.169
ns
GCLK PLL
tCO
1.255
1.255
3.063
ns
GCLK
tCO
2.671
2.671
6.000
ns
GCLK PLL
tCO
1.229
1.229
2.894
ns
GCLK
tCO
2.649
2.649
5.875
ns
GCLK PLL
tCO
1.207
1.207
2.769
ns
GCLK
tCO
2.642
2.642
5.877
ns
GCLK PLL
tCO
1.200
1.200
2.771
ns
GCLK
tCO
2.764
2.764
6.169
ns
GCLK PLL
tCO
1.322
1.322
3.063
ns
GCLK
tCO
2.672
2.672
5.874
ns
GCLK PLL
tCO
1.230
1.230
2.768
ns
GCLK
tCO
2.644
2.644
5.796
ns
GCLK PLL
tCO
1.202
1.202
2.690
ns
GCLK
tCO
2.651
2.651
5.764
ns
GCLK PLL
tCO
1.209
1.209
2.658
ns
GCLK
tCO
2.638
2.638
5.746
ns
GCLK PLL
tCO
1.196
1.196
2.640
ns
GCLK
tCO
2.627
2.627
5.724
ns
GCLK PLL
tCO
1.185
1.185
2.618
ns
GCLK
tCO
2.726
2.726
6.201
ns
GCLK PLL
tCO
1.284
1.284
3.095
ns
GCLK
tCO
2.674
2.674
5.939
ns
GCLK PLL
tCO
1.232
1.232
2.833
ns
GCLK
tCO
2.653
2.653
5.822
ns
GCLK PLL
tCO
1.211
1.211
2.716
ns
GCLK
tCO
2.635
2.635
5.748
ns
GCLK PLL
tCO
1.193
1.193
2.642
ns
GCLK
tCO
2.766
2.766
7.193
ns
GCLK PLL
tCO
1.324
1.324
4.087
ns
GCLK
tCO
2.771
2.771
6.419
ns
GCLK PLL
tCO
1.329
1.329
3.313
ns
24 mA
12 mA
2.5 V
2.909
20 mA
3.3-V
LVCMOS
Units
2.909
16 mA
8 mA
Commercial
tCO
12 mA
3.3-V
LVCMOS
Industrial
–6 Speed
Grade
Parameter
GCLK
8 mA
4 mA
2.5 V
Clock
4 mA
3.3-V
LVCMOS
2.5 V
Fast Corner
Drive
Strength
8 mA
12 mA
16 mA
2 mA
4 mA
Altera Corporation
Arria GX Device Handbook, Volume 1
4–38
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–51. EP1AGX20 Column Pins Output Timing Parameters (Part 2 of 4)
I/O Standard
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
1.5 V
1.5 V
SSTL-2
CLASS I
Drive
Strength
6 mA
8 mA
10 mA
12 mA
2 mA
4 mA
6 mA
8 mA
8 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-2
CLASS II
20 mA
SSTL-2
CLASS II
24 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
SSTL-18
CLASS I
12 mA
SSTL-18
CLASS II
8 mA
Arria GX Device Handbook, Volume 1
Fast Corner
Clock
Industrial
Commercial
–6 Speed
Grade
Parameter
Units
GCLK
tCO
2.695
2.695
6.155
ns
GCLK PLL
tCO
1.253
1.253
3.049
ns
GCLK
tCO
2.697
2.697
6.064
ns
GCLK PLL
tCO
1.255
1.255
2.958
ns
GCLK
tCO
2.651
2.651
5.987
ns
GCLK PLL
tCO
1.209
1.209
2.881
ns
GCLK
tCO
2.652
2.652
5.930
ns
GCLK PLL
tCO
1.210
1.210
2.824
ns
GCLK
tCO
2.746
2.746
6.723
ns
GCLK PLL
tCO
1.304
1.304
3.617
ns
GCLK
tCO
2.682
2.682
6.154
ns
GCLK PLL
tCO
1.240
1.240
3.048
ns
GCLK
tCO
2.685
2.685
6.036
ns
GCLK PLL
tCO
1.243
1.243
2.930
ns
GCLK
tCO
2.644
2.644
5.983
ns
GCLK PLL
tCO
1.202
1.202
2.877
ns
GCLK
tCO
2.629
2.629
5.762
ns
GCLK PLL
tCO
1.184
1.184
2.650
ns
GCLK
tCO
2.612
2.612
5.712
ns
GCLK PLL
tCO
1.167
1.167
2.600
ns
GCLK
tCO
2.590
2.590
5.639
ns
GCLK PLL
tCO
1.145
1.145
2.527
ns
GCLK
tCO
2.591
2.591
5.626
ns
GCLK PLL
tCO
1.146
1.146
2.514
ns
GCLK
tCO
2.587
2.587
5.624
ns
GCLK PLL
tCO
1.142
1.142
2.512
ns
GCLK
tCO
2.626
2.626
5.733
ns
GCLK PLL
tCO
1.184
1.184
2.627
ns
GCLK
tCO
2.630
2.630
5.694
ns
GCLK PLL
tCO
1.185
1.185
2.582
ns
GCLK
tCO
2.609
2.609
5.675
ns
GCLK PLL
tCO
1.164
1.164
2.563
ns
GCLK
tCO
2.614
2.614
5.673
ns
GCLK PLL
tCO
1.169
1.169
2.561
ns
GCLK
tCO
2.608
2.608
5.659
ns
GCLK PLL
tCO
1.163
1.163
2.547
ns
GCLK
tCO
2.597
2.597
5.625
ns
GCLK PLL
tCO
1.152
1.152
2.513
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–39
Table 4–51. EP1AGX20 Column Pins Output Timing Parameters (Part 3 of 4)
I/O Standard
SSTL-18
CLASS II
Clock
18 mA
SSTL-18
CLASS II
20 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.8-V HSTL
CLASS II
16 mA
1.8-V HSTL
CLASS II
18 mA
1.8-V HSTL
CLASS II
20 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
1.5-V HSTL
CLASS I
10 mA
1.5-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS II
16 mA
1.5-V HSTL
CLASS II
18 mA
1.5-V HSTL
CLASS II
20 mA
Industrial
Commercial
–6 Speed
Grade
Parameter
Units
GCLK
tCO
2.609
2.609
5.603
ns
GCLK PLL
tCO
1.164
1.164
2.491
ns
GCLK
tCO
2.605
2.605
5.611
ns
GCLK PLL
tCO
1.160
1.160
2.499
ns
GCLK
tCO
2.605
2.605
5.609
ns
GCLK PLL
tCO
1.160
1.160
2.497
ns
GCLK
tCO
2.629
2.629
5.664
ns
GCLK PLL
tCO
1.187
1.187
2.558
ns
GCLK
tCO
2.634
2.634
5.649
ns
GCLK PLL
tCO
1.189
1.189
2.537
ns
GCLK
tCO
2.612
2.612
5.638
ns
GCLK PLL
tCO
1.167
1.167
2.526
ns
GCLK
tCO
2.616
2.616
5.644
ns
GCLK PLL
tCO
1.171
1.171
2.532
ns
GCLK
tCO
2.608
2.608
5.637
ns
GCLK PLL
tCO
1.163
1.163
2.525
ns
GCLK
tCO
2.591
2.591
5.401
ns
GCLK PLL
tCO
1.146
1.146
2.289
ns
GCLK
tCO
2.593
2.593
5.412
ns
GCLK PLL
tCO
1.148
1.148
2.300
ns
GCLK
tCO
2.593
2.593
5.421
ns
GCLK PLL
tCO
1.148
1.148
2.309
ns
GCLK
tCO
2.629
2.629
5.663
ns
GCLK PLL
tCO
1.187
1.187
2.557
ns
GCLK
tCO
2.633
2.633
5.641
ns
GCLK PLL
tCO
1.188
1.188
2.529
ns
GCLK
tCO
2.615
2.615
5.643
ns
GCLK PLL
tCO
1.170
1.170
2.531
ns
GCLK
tCO
2.615
2.615
5.645
ns
GCLK PLL
tCO
1.170
1.170
2.533
ns
GCLK
tCO
2.609
2.609
5.643
ns
GCLK PLL
tCO
1.164
1.164
2.531
ns
GCLK
tCO
2.596
2.596
5.455
ns
GCLK PLL
tCO
1.151
1.151
2.343
ns
GCLK
tCO
2.599
2.599
5.465
ns
GCLK PLL
tCO
1.154
1.154
2.353
ns
GCLK
tCO
2.601
2.601
5.478
ns
GCLK PLL
tCO
1.156
1.156
2.366
ns
16 mA
SSTL-18
CLASS II
© December 2009
Fast Corner
Drive
Strength
Altera Corporation
Arria GX Device Handbook, Volume 1
4–40
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–51. EP1AGX20 Column Pins Output Timing Parameters (Part 4 of 4)
I/O Standard
3.3-V PCI
3.3-V PCI-X
LVDS
Fast Corner
Drive
Strength
Clock
—
GCLK
—
—
Industrial
Commercial
–6 Speed
Grade
tCO
2.755
2.755
5.791
ns
GCLK PLL
tCO
1.313
1.313
2.685
ns
Parameter
Units
GCLK
tCO
2.755
2.755
5.791
ns
GCLK PLL
tCO
1.313
1.313
2.685
ns
GCLK
tCO
3.621
3.621
6.969
ns
GCLK PLL
tCO
2.190
2.190
3.880
ns
Table 4–52 through Table 4–53 list EP1AGX20 regional clock (RCLK) adder values that
should be added to GCLK values. These adder values are used to determine I/O
timing when the I/O pin is driven using the regional clock. This applies for all I/O
standards supported by Arria GX with general purpose I/O pins.
Table 4–52 describes row pin delay adders when using the regional clock in Arria GX
devices.
Table 4–52. EP1AGX20 Row Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.117
0.273
ns
0.011
0.011
0.019
ns
RCLK output adder
–0.117
–0.117
–0.273
ns
RCLK PLL output adder
–0.011
–0.011
–0.019
ns
Industrial
Commercial
RCLK input adder
0.117
RCLK PLL input adder
Table 4–53 lists column pin delay adders when using the regional clock in Arria GX
devices.
Table 4–53. EP1AGX20 Column Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.081
0.223
ns
–0.012
–0.012
–0.008
ns
–0.081
–0.081
–0.224
ns
1.11
1.11
2.658
ns
Industrial
Commercial
RCLK input adder
0.081
RCLK PLL input
adder
RCLK output
adder
RCLK PLL output
adder
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–41
EP1AGX35 I/O Timing Parameters
Table 4–54 through Table 4–57 list the maximum I/O timing parameters for
EP1AGX35 devices for I/O standards which support general purpose I/O pins.
Table 4–54 lists I/O timing specifications.
Table 4–54. EP1AGX35 Row Pins Input Timing Parameters (Part 1 of 2)
Fast Model
I/O Standard
Clock
GCLK
3.3-V LVTTL
GCLK PLL
GCLK
3.3-V LVCMOS
GCLK PLL
GCLK
2.5 V
GCLK PLL
GCLK
1.8 V
GCLK PLL
GCLK
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
© December 2009
Altera Corporation
Industrial
Commercial
–6 Speed
Grade
t SU
1.561
1.561
3.556
ns
tH
–1.456
–1.456
–3.279
ns
t SU
2.980
2.980
6.628
ns
Parameter
Units
tH
–2.875
–2.875
–6.351
ns
t SU
1.561
1.561
3.556
ns
tH
–1.456
–1.456
–3.279
ns
t SU
2.980
2.980
6.628
ns
tH
–2.875
–2.875
–6.351
ns
t SU
1.573
1.573
3.537
ns
tH
–1.468
–1.468
–3.260
ns
t SU
2.992
2.992
6.609
ns
tH
–2.887
–2.887
–6.332
ns
t SU
1.639
1.639
3.744
ns
tH
–1.534
–1.534
–3.467
ns
t SU
3.058
3.058
6.816
ns
tH
–2.953
–2.953
–6.539
ns
t SU
1.642
1.642
3.839
ns
tH
–1.537
–1.537
–3.562
ns
t SU
3.061
3.061
6.911
ns
tH
–2.956
–2.956
–6.634
ns
t SU
1.385
1.385
3.009
ns
tH
–1.280
–1.280
–2.732
ns
t SU
2.804
2.804
6.081
ns
tH
–2.699
–2.699
–5.804
ns
t SU
1.385
1.385
3.009
ns
tH
–1.280
–1.280
–2.732
ns
t SU
2.804
2.804
6.081
ns
tH
–2.699
–2.699
–5.804
ns
t SU
1.417
1.417
3.118
ns
tH
–1.312
–1.312
–2.841
ns
t SU
2.836
2.836
6.190
ns
tH
–2.731
–2.731
–5.913
ns
Arria GX Device Handbook, Volume 1
4–42
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–54. EP1AGX35 Row Pins Input Timing Parameters (Part 2 of 2)
Fast Model
I/O Standard
Clock
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
LVDS
GCLK PLL
Industrial
Commercial
–6 Speed
Grade
t SU
1.417
1.417
3.118
ns
tH
–1.312
–1.312
–2.841
ns
Parameter
Units
t SU
2.836
2.836
6.190
ns
tH
–2.731
–2.731
–5.913
ns
t SU
1.417
1.417
3.118
ns
tH
–1.312
–1.312
–2.841
ns
t SU
2.836
2.836
6.190
ns
tH
–2.731
–2.731
–5.913
ns
t SU
1.417
1.417
3.118
ns
tH
–1.312
–1.312
–2.841
ns
t SU
2.836
2.836
6.190
ns
tH
–2.731
–2.731
–5.913
ns
t SU
1.443
1.443
3.246
ns
tH
–1.338
–1.338
–2.969
ns
t SU
2.862
2.862
6.318
ns
tH
–2.757
–2.757
–6.041
ns
t SU
1.443
1.443
3.246
ns
tH
–1.338
–1.338
–2.969
ns
t SU
2.862
2.862
6.318
ns
tH
–2.757
–2.757
–6.041
ns
t SU
1.341
1.341
3.088
ns
tH
–1.236
–1.236
–2.811
ns
t SU
2.769
2.769
6.171
ns
tH
–2.664
–2.664
–5.894
ns
–6 Speed
Grade
Units
Table 4–55 lists I/O timing specifications.
Table 4–55. EP1AGX35 Column Pins Input Timing Parameters (Part 1 of 3)
Fast Corner
I/O Standard
Clock
Parameter
Industrial
GCLK
3.3-V LVTTL
GCLK PLL
GCLK
3.3-V LVCMOS
GCLK PLL
Arria GX Device Handbook, Volume 1
Commercial
tSU
1.251
1.251
2.915
ns
tH
–1.146
–1.146
–2.638
ns
tSU
2.693
2.693
6.021
ns
tH
–2.588
–2.588
–5.744
ns
tSU
1.251
1.251
2.915
ns
tH
–1.146
–1.146
–2.638
ns
tSU
2.693
2.693
6.021
ns
tH
–2.588
–2.588
–5.744
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–43
Table 4–55. EP1AGX35 Column Pins Input Timing Parameters (Part 2 of 3)
Fast Corner
I/O Standard
Clock
GCLK
2.5 V
GCLK PLL
GCLK
1.8 V
GCLK PLL
GCLK
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
© December 2009
Altera Corporation
Industrial
Commercial
–6 Speed
Grade
tSU
1.261
1.261
2.897
ns
tH
–1.156
–1.156
–2.620
ns
Parameter
Units
tSU
2.703
2.703
6.003
ns
tH
–2.598
–2.598
–5.726
ns
tSU
1.327
1.327
3.107
ns
tH
–1.222
–1.222
–2.830
ns
tSU
2.769
2.769
6.213
ns
tH
–2.664
–2.664
–5.936
ns
tSU
1.330
1.330
3.200
ns
tH
–1.225
–1.225
–2.923
ns
tSU
2.772
2.772
6.306
ns
tH
–2.667
–2.667
–6.029
ns
tSU
1.075
1.075
2.372
ns
tH
–0.970
–0.970
–2.095
ns
tSU
2.517
2.517
5.480
ns
tH
–2.412
–2.412
–5.203
ns
tSU
1.075
1.075
2.372
ns
tH
–0.970
–0.970
–2.095
ns
tSU
2.517
2.517
5.480
ns
tH
–2.412
–2.412
–5.203
ns
tSU
1.113
1.113
2.479
ns
tH
–1.008
–1.008
–2.202
ns
tSU
2.555
2.555
5.585
ns
tH
–2.450
–2.450
–5.308
ns
tSU
1.114
1.114
2.479
ns
tH
–1.009
–1.009
–2.202
ns
tSU
2.556
2.556
5.587
ns
tH
–2.451
–2.451
–5.310
ns
tSU
1.113
1.113
2.479
ns
tH
–1.008
–1.008
–2.202
ns
tSU
2.555
2.555
5.585
ns
tH
–2.450
–2.450
–5.308
ns
tSU
1.114
1.114
2.479
ns
tH
–1.009
–1.009
–2.202
ns
tSU
2.556
2.556
5.587
ns
tH
–2.451
–2.451
–5.310
ns
Arria GX Device Handbook, Volume 1
4–44
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–55. EP1AGX35 Column Pins Input Timing Parameters (Part 3 of 3)
Fast Corner
I/O Standard
Clock
Industrial
Commercial
–6 Speed
Grade
tSU
1.131
1.131
2.607
ns
tH
–1.026
–1.026
–2.330
ns
Parameter
GCLK
1.5-V HSTL CLASS I
GCLK PLL
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
3.3-V PCI
GCLK PLL
GCLK
3.3-V PCI-X
GCLK PLL
GCLK
LVDS
GCLK PLL
Units
tSU
2.573
2.573
5.713
ns
tH
–2.468
–2.468
–5.436
ns
tSU
1.132
1.132
2.607
ns
tH
–1.027
–1.027
–2.330
ns
tSU
2.574
2.574
5.715
ns
tH
–2.469
–2.469
–5.438
ns
tSU
1.256
1.256
2.903
ns
tH
–1.151
–1.151
–2.626
ns
tSU
2.698
2.698
6.009
ns
tH
–2.593
–2.593
–5.732
ns
tSU
1.256
1.256
2.903
ns
tH
–1.151
–1.151
–2.626
ns
tSU
2.698
2.698
6.009
ns
tH
–2.593
–2.593
–5.732
ns
tSU
1.106
1.106
2.489
ns
tH
–1.001
–1.001
–2.212
ns
tSU
2.530
2.530
5.564
ns
tH
–2.425
–2.425
–5.287
ns
Table 4–56 lists I/O timing specifications.
Table 4–56. EP1AGX35 Row Pins Output Timing Parameters (Part 1 of 3)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Fast Model
Drive
Strength
Clock
4 mA
GCLK
8 mA
12 mA
3.3-V
LVCMOS
4 mA
3.3-V
LVCMOS
8 mA
2.5 V
4 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.904
2.904
6.699
ns
GCLK PLL
tCO
1.485
1.485
3.627
ns
GCLK
tCO
2.776
2.776
6.059
ns
GCLK PLL
tCO
1.357
1.357
2.987
ns
Parameter
Units
GCLK
tCO
2.720
2.720
6.022
ns
GCLK PLL
tCO
1.301
1.301
2.950
ns
GCLK
tCO
2.776
2.776
6.059
ns
GCLK PLL
tCO
1.357
1.357
2.987
ns
GCLK
tCO
2.670
2.670
5.753
ns
GCLK PLL
tCO
1.251
1.251
2.681
ns
GCLK
tCO
2.759
2.759
6.033
ns
GCLK PLL
tCO
1.340
1.340
2.961
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–45
Table 4–56. EP1AGX35 Row Pins Output Timing Parameters (Part 2 of 3)
I/O Standard
2.5 V
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
SSTL-2
CLASS I
Clock
2.656
5.775
ns
GCLK PLL
tCO
1.237
1.237
2.703
ns
GCLK
tCO
2.637
2.637
5.661
ns
GCLK PLL
tCO
1.218
1.218
2.589
ns
GCLK
tCO
2.829
2.829
7.052
ns
GCLK PLL
tCO
1.410
1.410
3.980
ns
GCLK
tCO
2.818
2.818
6.273
ns
GCLK PLL
tCO
1.399
1.399
3.201
ns
GCLK
tCO
2.707
2.707
5.972
ns
GCLK PLL
tCO
1.288
1.288
2.900
ns
4 mA
6 mA
GCLK
tCO
2.676
2.676
5.858
ns
GCLK PLL
tCO
1.257
1.257
2.786
ns
GCLK
tCO
2.789
2.789
6.551
ns
GCLK PLL
tCO
1.370
1.370
3.479
ns
GCLK
tCO
2.682
2.682
5.950
ns
GCLK PLL
tCO
1.263
1.263
2.878
ns
GCLK
tCO
2.626
2.626
5.614
ns
GCLK PLL
tCO
1.207
1.207
2.542
ns
GCLK
tCO
2.602
2.602
5.538
ns
GCLK PLL
tCO
1.183
1.183
2.466
ns
GCLK
tCO
2.568
2.568
5.407
ns
GCLK PLL
tCO
1.149
1.149
2.335
ns
GCLK
tCO
2.614
2.614
5.556
ns
GCLK PLL
tCO
1.195
1.195
2.484
ns
GCLK
tCO
2.618
2.618
5.485
ns
GCLK PLL
tCO
1.199
1.199
2.413
ns
GCLK
tCO
2.594
2.594
5.468
ns
GCLK PLL
tCO
1.175
1.175
2.396
ns
GCLK
tCO
2.597
2.597
5.447
ns
GCLK PLL
tCO
1.178
1.178
2.375
ns
GCLK
tCO
2.595
2.595
5.466
ns
GCLK PLL
tCO
1.176
1.176
2.394
ns
GCLK
tCO
2.598
2.598
5.430
ns
GCLK PLL
tCO
1.179
1.179
2.358
ns
GCLK
tCO
2.580
2.580
5.426
ns
GCLK PLL
tCO
1.161
1.161
2.354
ns
GCLK
tCO
2.584
2.584
5.415
ns
GCLK PLL
tCO
1.165
1.165
2.343
ns
8 mA
2 mA
4 mA
8 mA
16 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
Units
2.656
2 mA
SSTL-2
CLASS II
Commercial
tCO
12 mA
12 mA
Industrial
–6 Speed
Grade
Parameter
GCLK
8 mA
SSTL-2
CLASS I
© December 2009
Fast Model
Drive
Strength
Altera Corporation
Arria GX Device Handbook, Volume 1
4–46
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–56. EP1AGX35 Row Pins Output Timing Parameters (Part 3 of 3)
I/O Standard
1.8-V HSTL
CLASS I
Drive
Strength
12 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
LVDS
—
Fast Model
Clock
Industrial
Commercial
–6 Speed
Grade
Parameter
Units
GCLK
tCO
2.575
2.575
5.414
ns
GCLK PLL
tCO
1.156
1.156
2.342
ns
GCLK
tCO
2.594
2.594
5.443
ns
GCLK PLL
tCO
1.175
1.175
2.371
ns
GCLK
tCO
2.597
2.597
5.429
ns
GCLK PLL
tCO
1.178
1.178
2.357
ns
GCLK
tCO
2.582
2.582
5.421
ns
GCLK PLL
tCO
1.163
1.163
2.349
ns
GCLK
tCO
2.654
2.654
5.613
ns
GCLK PLL
tCO
1.226
1.226
2.530
ns
Units
Table 4–57 lists I/O timing specifications.
Table 4–57. EP1AGX35 Column Pins Output Timing Parameters (Part 1 of 4)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Fast Corner
Drive
Strength
Clock
4 mA
GCLK
8 mA
12 mA
16 mA
20 mA
24 mA
3.3-V
LVCMOS
4 mA
3.3-V
LVCMOS
8 mA
3.3-V
LVCMOS
12 mA
3.3-V
LVCMOS
16 mA
3.3-V
LVCMOS
20 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.909
2.909
6.541
ns
GCLK PLL
tCO
1.467
1.467
3.435
ns
GCLK
tCO
2.764
2.764
6.169
ns
GCLK PLL
tCO
1.322
1.322
3.063
ns
GCLK
tCO
2.697
2.697
6.169
ns
GCLK PLL
tCO
1.255
1.255
3.063
ns
Parameter
GCLK
tCO
2.671
2.671
6.000
ns
GCLK PLL
tCO
1.229
1.229
2.894
ns
GCLK
tCO
2.649
2.649
5.875
ns
GCLK PLL
tCO
1.207
1.207
2.769
ns
GCLK
tCO
2.642
2.642
5.877
ns
GCLK PLL
tCO
1.200
1.200
2.771
ns
GCLK
tCO
2.764
2.764
6.169
ns
GCLK PLL
tCO
1.322
1.322
3.063
ns
GCLK
tCO
2.672
2.672
5.874
ns
GCLK PLL
tCO
1.230
1.230
2.768
ns
GCLK
tCO
2.644
2.644
5.796
ns
GCLK PLL
tCO
1.202
1.202
2.690
ns
GCLK
tCO
2.651
2.651
5.764
ns
GCLK PLL
tCO
1.209
1.209
2.658
ns
GCLK
tCO
2.638
2.638
5.746
ns
GCLK PLL
tCO
1.196
1.196
2.640
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–47
Table 4–57. EP1AGX35 Column Pins Output Timing Parameters (Part 2 of 4)
Fast Corner
Drive
Strength
Clock
3.3-V
LVCMOS
24 mA
GCLK
2.5 V
4 mA
I/O Standard
2.5 V
2.5 V
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
1.5 V
1.5 V
Commercial
tCO
2.627
2.627
5.724
ns
GCLK PLL
tCO
1.185
1.185
2.618
ns
GCLK
tCO
2.726
2.726
6.201
ns
tCO
1.284
1.284
3.095
ns
GCLK
tCO
2.674
2.674
5.939
ns
GCLK PLL
tCO
1.232
1.232
2.833
ns
GCLK
tCO
2.653
2.653
5.822
ns
GCLK PLL
tCO
1.211
1.211
2.716
ns
GCLK
tCO
2.635
2.635
5.748
ns
GCLK PLL
tCO
1.193
1.193
2.642
ns
12 mA
16 mA
GCLK
tCO
2.766
2.766
7.193
ns
GCLK PLL
tCO
1.324
1.324
4.087
ns
GCLK
tCO
2.771
2.771
6.419
ns
GCLK PLL
tCO
1.329
1.329
3.313
ns
GCLK
tCO
2.695
2.695
6.155
ns
GCLK PLL
tCO
1.253
1.253
3.049
ns
GCLK
tCO
2.697
2.697
6.064
ns
GCLK PLL
tCO
1.255
1.255
2.958
ns
2 mA
4 mA
6 mA
8 mA
GCLK
tCO
2.651
2.651
5.987
ns
GCLK PLL
tCO
1.209
1.209
2.881
ns
GCLK
tCO
2.652
2.652
5.930
ns
GCLK PLL
tCO
1.210
1.210
2.824
ns
GCLK
tCO
2.746
2.746
6.723
ns
GCLK PLL
tCO
1.304
1.304
3.617
ns
GCLK
tCO
2.682
2.682
6.154
ns
GCLK PLL
tCO
1.240
1.240
3.048
ns
10 mA
12 mA
2 mA
4 mA
GCLK
tCO
2.685
2.685
6.036
ns
GCLK PLL
tCO
1.243
1.243
2.930
ns
GCLK
tCO
2.644
2.644
5.983
ns
GCLK PLL
tCO
1.202
1.202
2.877
ns
GCLK
tCO
2.629
2.629
5.762
ns
GCLK PLL
tCO
1.184
1.184
2.650
ns
GCLK
tCO
2.612
2.612
5.712
ns
GCLK PLL
tCO
1.167
1.167
2.600
ns
6 mA
8 mA
8 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-2
CLASS II
20 mA
Units
GCLK PLL
8 mA
SSTL-2
CLASS I
© December 2009
Industrial
–6 Speed
Grade
Parameter
GCLK
tCO
2.590
2.590
5.639
ns
GCLK PLL
tCO
1.145
1.145
2.527
ns
GCLK
tCO
2.591
2.591
5.626
ns
GCLK PLL
tCO
1.146
1.146
2.514
ns
Altera Corporation
Arria GX Device Handbook, Volume 1
4–48
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–57. EP1AGX35 Column Pins Output Timing Parameters (Part 3 of 4)
Fast Corner
Drive
Strength
Clock
SSTL-2
CLASS II
24 mA
GCLK
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
SSTL-18
CLASS I
12 mA
SSTL-18
CLASS II
8 mA
SSTL-18
CLASS II
16 mA
SSTL-18
CLASS II
18 mA
SSTL-18
CLASS II
20 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.8-V HSTL
CLASS II
16 mA
1.8-V HSTL
CLASS II
18 mA
1.8-V HSTL
CLASS II
20 mA
1.5-V HSTL
CLASS I
4 mA
I/O Standard
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.587
2.587
5.624
ns
GCLK PLL
tCO
1.142
1.142
2.512
ns
Parameter
Units
GCLK
tCO
2.626
2.626
5.733
ns
GCLK PLL
tCO
1.184
1.184
2.627
ns
GCLK
tCO
2.630
2.630
5.694
ns
GCLK PLL
tCO
1.185
1.185
2.582
ns
GCLK
tCO
2.609
2.609
5.675
ns
GCLK PLL
tCO
1.164
1.164
2.563
ns
GCLK
tCO
2.614
2.614
5.673
ns
GCLK PLL
tCO
1.169
1.169
2.561
ns
GCLK
tCO
2.608
2.608
5.659
ns
GCLK PLL
tCO
1.163
1.163
2.547
ns
GCLK
tCO
2.597
2.597
5.625
ns
GCLK PLL
tCO
1.152
1.152
2.513
ns
GCLK
tCO
2.609
2.609
5.603
ns
GCLK PLL
tCO
1.164
1.164
2.491
ns
GCLK
tCO
2.605
2.605
5.611
ns
GCLK PLL
tCO
1.160
1.160
2.499
ns
GCLK
tCO
2.605
2.605
5.609
ns
GCLK PLL
tCO
1.160
1.160
2.497
ns
GCLK
tCO
2.629
2.629
5.664
ns
GCLK PLL
tCO
1.187
1.187
2.558
ns
GCLK
tCO
2.634
2.634
5.649
ns
GCLK PLL
tCO
1.189
1.189
2.537
ns
GCLK
tCO
2.612
2.612
5.638
ns
GCLK PLL
tCO
1.167
1.167
2.526
ns
GCLK
tCO
2.616
2.616
5.644
ns
GCLK PLL
tCO
1.171
1.171
2.532
ns
GCLK
tCO
2.608
2.608
5.637
ns
GCLK PLL
tCO
1.163
1.163
2.525
ns
GCLK
tCO
2.591
2.591
5.401
ns
GCLK PLL
tCO
1.146
1.146
2.289
ns
GCLK
tCO
2.593
2.593
5.412
ns
GCLK PLL
tCO
1.148
1.148
2.300
ns
GCLK
tCO
2.593
2.593
5.421
ns
GCLK PLL
tCO
1.148
1.148
2.309
ns
GCLK
tCO
2.629
2.629
5.663
ns
GCLK PLL
tCO
1.187
1.187
2.557
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–49
Table 4–57. EP1AGX35 Column Pins Output Timing Parameters (Part 4 of 4)
Fast Corner
Drive
Strength
Clock
1.5-V HSTL
CLASS I
6 mA
GCLK
1.5-V HSTL
CLASS I
8 mA
1.5-V HSTL
CLASS I
10 mA
1.5-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS II
16 mA
1.5-V HSTL
CLASS II
18 mA
1.5-V HSTL
CLASS II
20 mA
I/O Standard
3.3-V PCI
3.3-V PCI-X
LVDS
Industrial
Commercial
–6 Speed
Grade
tCO
2.633
2.633
5.641
ns
GCLK PLL
tCO
1.188
1.188
2.529
ns
Parameter
Units
GCLK
tCO
2.615
2.615
5.643
ns
GCLK PLL
tCO
1.170
1.170
2.531
ns
GCLK
tCO
2.615
2.615
5.645
ns
GCLK PLL
tCO
1.170
1.170
2.533
ns
GCLK
tCO
2.609
2.609
5.643
ns
GCLK PLL
tCO
1.164
1.164
2.531
ns
GCLK
tCO
2.596
2.596
5.455
ns
GCLK PLL
tCO
1.151
1.151
2.343
ns
GCLK
tCO
2.599
2.599
5.465
ns
GCLK PLL
tCO
1.154
1.154
2.353
ns
GCLK
tCO
2.601
2.601
5.478
ns
GCLK PLL
tCO
1.156
1.156
2.366
ns
GCLK
tCO
2.755
2.755
5.791
ns
GCLK PLL
tCO
1.313
1.313
2.685
ns
GCLK
tCO
2.755
2.755
5.791
ns
GCLK PLL
tCO
1.313
1.313
2.685
ns
GCLK
tCO
3.621
3.621
6.969
ns
GCLK PLL
tCO
2.190
2.190
3.880
ns
—
—
—
Table 4–58 through Table 4–59 list EP1AGX35 regional clock (RCLK) adder values that
should be added to GCLK values. These adder values are used to determine I/O
timing when the I/O pin is driven using the regional clock. This applies for all I/O
standards supported by Arria GX with general purpose I/O pins.
Table 4–58 describes row pin delay adders when using the regional clock in Arria GX
devices.
Table 4–58. EP1AGX35 Row Pin Delay Adders for Regional Clock
Fast Corner
Parameter
© December 2009
–6 Speed Grade
Units
0.126
0.281
ns
0.011
0.011
0.018
ns
RCLK output adder
–0.126
–0.126
–0.281
ns
RCLK PLL output
adder
–0.011
–0.011
–0.018
ns
Industrial
Commercial
RCLK input adder
0.126
RCLK PLL input
adder
Altera Corporation
Arria GX Device Handbook, Volume 1
4–50
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–59 lists column pin delay adders when using the regional clock in Arria GX
devices.
Table 4–59. EP1AGX35 Column Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.099
0.254
ns
–0.012
–0.012
–0.01
ns
RCLK output adder
–0.086
–0.086
–0.244
ns
RCLK PLL output adder
1.253
1.253
3.133
ns
Industrial
Commercial
RCLK input adder
0.099
RCLK PLL input adder
EP1AGX50 I/O Timing Parameters
Table 4–60 through Table 4–63 list the maximum I/O timing parameters for
EP1AGX50 devices for I/O standards which support general purpose I/O pins.
Table 4–60 lists I/O timing specifications.
Table 4–60. EP1AGX50 Row Pins Input Timing Parameters (Part 1 of 2)
Fast Model
I/O Standard
Clock
Parameter
Industrial
Commercial
–6 Speed
Grade
Units
t SU
1.550
1.550
3.542
ns
tH
–1.445
–1.445
–3.265
ns
t SU
2.978
2.978
6.626
ns
tH
–2.873
–2.873
–6.349
ns
t SU
1.550
1.550
3.542
ns
tH
–1.445
–1.445
–3.265
ns
GCLK PLL
t SU
2.978
2.978
6.626
ns
tH
–2.873
–2.873
–6.349
ns
GCLK
t SU
1.562
1.562
3.523
ns
tH
–1.457
–1.457
–3.246
ns
t SU
2.990
2.990
6.607
ns
tH
–2.885
–2.885
–6.330
ns
t SU
1.628
1.628
3.730
ns
tH
–1.523
–1.523
–3.453
ns
GCLK PLL
t SU
3.056
3.056
6.814
ns
tH
–2.951
–2.951
–6.537
ns
GCLK
t SU
1.631
1.631
3.825
ns
tH
–1.526
–1.526
–3.548
ns
t SU
3.059
3.059
6.909
ns
tH
–2.954
–2.954
–6.632
ns
GCLK
3.3-V LVTTL
GCLK PLL
GCLK
3.3-V LVCMOS
2.5 V
GCLK PLL
GCLK
1.8 V
1.5 V
GCLK PLL
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–51
Table 4–60. EP1AGX50 Row Pins Input Timing Parameters (Part 2 of 2)
Fast Model
I/O Standard
Clock
GCLK
SSTL-2 CLASS
I
GCLK PLL
GCLK
SSTL-2 CLASS
II
GCLK PLL
GCLK
SSTL-18
CLASS I
GCLK PLL
GCLK
SSTL-18
CLASS II
GCLK PLL
GCLK
1.8-V HSTL
CLASS I
GCLK PLL
GCLK
1.8-V HSTL
CLASS II
GCLK PLL
GCLK
1.5-V HSTL
CLASS I
GCLK PLL
GCLK
1.5-V HSTL
CLASS II
GCLK PLL
GCLK
LVDS
GCLK PLL
© December 2009
Altera Corporation
Industrial
Commercial
–6 Speed
Grade
t SU
1.375
1.375
2.997
ns
tH
–1.270
–1.270
–2.720
ns
Parameter
Units
t SU
2.802
2.802
6.079
ns
tH
–2.697
–2.697
–5.802
ns
t SU
1.375
1.375
2.997
ns
tH
–1.270
–1.270
–2.720
ns
t SU
2.802
2.802
6.079
ns
tH
–2.697
–2.697
–5.802
ns
t SU
1.406
1.406
3.104
ns
tH
–1.301
–1.301
–2.827
ns
t SU
2.834
2.834
6.188
ns
tH
–2.729
–2.729
–5.911
ns
t SU
1.407
1.407
3.106
ns
tH
–1.302
–1.302
–2.829
ns
t SU
2.834
2.834
6.188
ns
tH
–2.729
–2.729
–5.911
ns
t SU
1.406
1.406
3.104
ns
tH
–1.301
–1.301
–2.827
ns
t SU
2.834
2.834
6.188
ns
tH
–2.729
–2.729
–5.911
ns
t SU
1.407
1.407
3.106
ns
tH
–1.302
–1.302
–2.829
ns
t SU
2.834
2.834
6.188
ns
tH
–2.729
–2.729
–5.911
ns
t SU
1.432
1.432
3.232
ns
tH
–1.327
–1.327
–2.955
ns
t SU
2.860
2.860
6.316
ns
tH
–2.755
–2.755
–6.039
ns
t SU
1.433
1.433
3.234
ns
tH
–1.328
–1.328
–2.957
ns
t SU
2.860
2.860
6.316
ns
tH
–2.755
–2.755
–6.039
ns
t SU
1.341
1.341
3.088
ns
tH
–1.236
–1.236
–2.811
ns
t SU
2.769
2.769
6.171
ns
tH
–2.664
–2.664
–5.894
ns
Arria GX Device Handbook, Volume 1
4–52
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–61 lists I/O timing specifications.
Table 4–61. EP1AGX50 Column Pins Input Timing Parameters (Part 1 of 2)
Fast Corner
I/O Standard
Industrial
Commercial
–6 Speed
Grade
tSU
1.242
1.242
2.902
ns
tH
–1.137
–1.137
–2.625
ns
GCLK PLL
tSU
2.684
2.684
6.009
ns
tH
–2.579
–2.579
–5.732
ns
GCLK
tSU
1.242
1.242
2.902
ns
tH
–1.137
–1.137
–2.625
ns
tSU
2.684
2.684
6.009
ns
tH
–2.579
–2.579
–5.732
ns
tSU
1.252
1.252
2.884
ns
tH
–1.147
–1.147
–2.607
ns
GCLK PLL
tSU
2.694
2.694
5.991
ns
tH
–2.589
–2.589
–5.714
ns
GCLK
tSU
1.318
1.318
3.094
ns
tH
–1.213
–1.213
–2.817
ns
tSU
2.760
2.760
6.201
ns
tH
–2.655
–2.655
–5.924
ns
tSU
1.321
1.321
3.187
ns
tH
–1.216
–1.216
–2.910
ns
GCLK PLL
tSU
2.763
2.763
6.294
ns
tH
–2.658
–2.658
–6.017
ns
GCLK
tSU
1.034
1.034
2.314
ns
tH
–0.929
–0.929
–2.037
ns
tSU
2.500
2.500
5.457
ns
tH
–2.395
–2.395
–5.180
ns
tSU
1.034
1.034
2.314
ns
tH
–0.929
–0.929
–2.037
ns
GCLK PLL
tSU
2.500
2.500
5.457
ns
tH
–2.395
–2.395
–5.180
ns
GCLK
tSU
1.104
1.104
2.466
ns
tH
–0.999
–0.999
–2.189
ns
tSU
2.546
2.546
5.573
ns
tH
–2.441
–2.441
–5.296
ns
tSU
1.074
1.074
2.424
ns
tH
–0.969
–0.969
–2.147
ns
tSU
2.539
2.539
5.564
ns
tH
–2.434
–2.434
–5.287
ns
Clock
GCLK
3.3-V LVTTL
3.3-V
LVCMOS
GCLK PLL
GCLK
2.5 V
1.8 V
GCLK PLL
GCLK
1.5 V
SSTL-2
CLASS I
GCLK PLL
GCLK
SSTL-2
CLASS II
SSTL-18
CLASS I
GCLK PLL
GCLK
SSTL-18
CLASS II
GCLK PLL
Arria GX Device Handbook, Volume 1
Parameter
Units
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–53
Table 4–61. EP1AGX50 Column Pins Input Timing Parameters (Part 2 of 2)
Fast Corner
I/O Standard
Clock
GCLK
1.8-V HSTL
CLASS I
GCLK PLL
GCLK
1.8-V HSTL
CLASS II
GCLK PLL
GCLK
1.5-V HSTL
CLASS I
GCLK PLL
GCLK
1.5-V HSTL
CLASS II
Industrial
Commercial
–6 Speed
Grade
tSU
1.104
1.104
2.466
ns
tH
–0.999
–0.999
–2.189
ns
Parameter
GCLK PLL
GCLK
3.3-V PCI
GCLK PLL
GCLK
3.3-V PCI-X
GCLK PLL
GCLK
LVDS
GCLK PLL
Units
tSU
2.546
2.546
5.573
ns
tH
–2.441
–2.441
–5.296
ns
tSU
1.074
1.074
2.424
ns
tH
–0.969
–0.969
–2.147
ns
tSU
2.539
2.539
5.564
ns
tH
–2.434
–2.434
–5.287
ns
tSU
1.122
1.122
2.594
ns
tH
–1.017
–1.017
–2.317
ns
tSU
2.564
2.564
5.701
ns
tH
–2.459
–2.459
–5.424
ns
tSU
1.094
1.094
2.557
ns
tH
–0.989
–0.989
–2.280
ns
tSU
2.557
2.557
5.692
ns
tH
–2.452
–2.452
–5.415
ns
tSU
1.247
1.247
2.890
ns
tH
–1.142
–1.142
–2.613
ns
tSU
2.689
2.689
5.997
ns
tH
–2.584
–2.584
–5.720
ns
tSU
1.247
1.247
2.890
ns
tH
–1.142
–1.142
–2.613
ns
tSU
2.689
2.689
5.997
ns
tH
–2.584
–2.584
–5.720
ns
tSU
1.106
1.106
2.489
ns
tH
–1.001
–1.001
–2.212
ns
tSU
2.530
2.530
5.564
ns
tH
–2.425
–2.425
–5.287
ns
Table 4–62 lists I/O timing specifications.
Table 4–62. EP1AGX50 Row Pins Output Timing Parameters (Part 1 of 3)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
© December 2009
Fast Model
Drive
Strength
Clock
4 mA
GCLK
Industrial
Commercial
–6 Speed
Grade
tCO
2.915
2.915
6.713
ns
GCLK PLL
tCO
1.487
1.487
3.629
ns
GCLK
tCO
2.787
2.787
6.073
ns
GCLK PLL
tCO
1.359
1.359
2.989
ns
8 mA
Altera Corporation
Parameter
Units
Arria GX Device Handbook, Volume 1
4–54
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–62. EP1AGX50 Row Pins Output Timing Parameters (Part 2 of 3)
I/O Standard
3.3-V LVTTL
Clock
12 mA
GCLK
3.3-V
LVCMOS
4 mA
3.3-V
LVCMOS
8 mA
2.5 V
4 mA
2.5 V
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
Fast Model
Drive
Strength
8 mA
12 mA
2 mA
4 mA
6 mA
8 mA
2 mA
4 mA
SSTL-2
CLASS I
8 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.731
2.731
6.036
ns
GCLK PLL
tCO
1.303
1.303
2.952
ns
Parameter
Units
GCLK
tCO
2.787
2.787
6.073
ns
GCLK PLL
tCO
1.359
1.359
2.989
ns
GCLK
tCO
2.681
2.681
5.767
ns
GCLK PLL
tCO
1.253
1.253
2.683
ns
GCLK
tCO
2.770
2.770
6.047
ns
GCLK PLL
tCO
1.342
1.342
2.963
ns
GCLK
tCO
2.667
2.667
5.789
ns
GCLK PLL
tCO
1.239
1.239
2.705
ns
GCLK
tCO
2.648
2.648
5.675
ns
GCLK PLL
tCO
1.220
1.220
2.591
ns
GCLK
tCO
2.840
2.840
7.066
ns
GCLK PLL
tCO
1.412
1.412
3.982
ns
GCLK
tCO
2.829
2.829
6.287
ns
GCLK PLL
tCO
1.401
1.401
3.203
ns
GCLK
tCO
2.718
2.718
5.986
ns
GCLK PLL
tCO
1.290
1.290
2.902
ns
GCLK
tCO
2.687
2.687
5.872
ns
GCLK PLL
tCO
1.259
1.259
2.788
ns
GCLK
tCO
2.800
2.800
6.565
ns
GCLK PLL
tCO
1.372
1.372
3.481
ns
GCLK
tCO
2.693
2.693
5.964
ns
GCLK PLL
tCO
1.265
1.265
2.880
ns
GCLK
tCO
2.636
2.636
5.626
ns
GCLK PLL
tCO
1.209
1.209
2.544
ns
GCLK
tCO
2.612
2.612
5.550
ns
GCLK PLL
tCO
1.185
1.185
2.468
ns
GCLK
tCO
2.578
2.578
5.419
ns
GCLK PLL
tCO
1.151
1.151
2.337
ns
GCLK
tCO
2.625
2.625
5.570
ns
GCLK PLL
tCO
1.197
1.197
2.486
ns
GCLK
tCO
2.628
2.628
5.497
ns
GCLK PLL
tCO
1.201
1.201
2.415
ns
GCLK
tCO
2.604
2.604
5.480
ns
GCLK PLL
tCO
1.177
1.177
2.398
ns
GCLK
tCO
2.607
2.607
5.459
ns
GCLK PLL
tCO
1.180
1.180
2.377
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–55
Table 4–62. EP1AGX50 Row Pins Output Timing Parameters (Part 3 of 3)
Fast Model
Drive
Strength
Clock
1.8-V HSTL
CLASS I
4 mA
GCLK
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
I/O Standard
LVDS
Industrial
Commercial
–6 Speed
Grade
tCO
2.606
2.606
5.480
ns
GCLK PLL
tCO
1.178
1.178
2.396
ns
Parameter
Units
GCLK
tCO
2.608
2.608
5.442
ns
GCLK PLL
tCO
1.181
1.181
2.360
ns
GCLK
tCO
2.590
2.590
5.438
ns
GCLK PLL
tCO
1.163
1.163
2.356
ns
GCLK
tCO
2.594
2.594
5.427
ns
GCLK PLL
tCO
1.167
1.167
2.345
ns
GCLK
tCO
2.585
2.585
5.426
ns
GCLK PLL
tCO
1.158
1.158
2.344
ns
GCLK
tCO
2.605
2.605
5.457
ns
GCLK PLL
tCO
1.177
1.177
2.373
ns
GCLK
tCO
2.607
2.607
5.441
ns
GCLK PLL
tCO
1.180
1.180
2.359
ns
GCLK
tCO
2.592
2.592
5.433
ns
GCLK PLL
tCO
1.165
1.165
2.351
ns
GCLK
tCO
2.654
2.654
5.613
ns
GCLK PLL
tCO
1.226
1.226
2.530
ns
Units
—
Table 4–63 lists I/O timing specifications.
Table 4–63. EP1AGX50 Column Pins Output Timing Parameters (Part 1 of 4)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V
LVCMOS
© December 2009
Fast Corner
Drive
Strength
Clock
4 mA
GCLK
8 mA
12 mA
16 mA
20 mA
24 mA
4 mA
Altera Corporation
Industrial
Commercial
–6 Speed
Grade
tCO
2.948
2.948
6.608
ns
GCLK PLL
tCO
1.476
1.476
3.447
ns
GCLK
tCO
2.797
2.797
6.203
ns
GCLK PLL
tCO
1.331
1.331
3.075
ns
GCLK
tCO
2.722
2.722
6.204
ns
GCLK PLL
tCO
1.264
1.264
3.075
ns
Parameter
GCLK
tCO
2.694
2.694
6.024
ns
GCLK PLL
tCO
1.238
1.238
2.906
ns
GCLK
tCO
2.670
2.670
5.896
ns
GCLK PLL
tCO
1.216
1.216
2.781
ns
GCLK
tCO
2.660
2.660
5.895
ns
GCLK PLL
tCO
1.209
1.209
2.783
ns
GCLK
tCO
2.797
2.797
6.203
ns
GCLK PLL
tCO
1.331
1.331
3.075
ns
Arria GX Device Handbook, Volume 1
4–56
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–63. EP1AGX50 Column Pins Output Timing Parameters (Part 2 of 4)
Fast Corner
Drive
Strength
Clock
3.3-V
LVCMOS
8 mA
GCLK
3.3-V
LVCMOS
12 mA
3.3-V
LVCMOS
16 mA
3.3-V
LVCMOS
20 mA
3.3-V
LVCMOS
24 mA
2.5 V
4 mA
I/O Standard
2.5 V
2.5 V
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
1.5 V
1.5 V
8 mA
12 mA
16 mA
2 mA
4 mA
6 mA
8 mA
10 mA
12 mA
2 mA
4 mA
6 mA
8 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.695
2.695
5.893
ns
GCLK PLL
tCO
1.239
1.239
2.780
ns
Parameter
Units
GCLK
tCO
2.663
2.663
5.809
ns
GCLK PLL
tCO
1.211
1.211
2.702
ns
GCLK
tCO
2.666
2.666
5.776
ns
GCLK PLL
tCO
1.218
1.218
2.670
ns
GCLK
tCO
2.651
2.651
5.758
ns
GCLK PLL
tCO
1.205
1.205
2.652
ns
GCLK
tCO
2.638
2.638
5.736
ns
GCLK PLL
tCO
1.194
1.194
2.630
ns
GCLK
tCO
2.754
2.754
6.240
ns
GCLK PLL
tCO
1.293
1.293
3.107
ns
GCLK
tCO
2.697
2.697
5.963
ns
GCLK PLL
tCO
1.241
1.241
2.845
ns
GCLK
tCO
2.672
2.672
5.837
ns
GCLK PLL
tCO
1.220
1.220
2.728
ns
GCLK
tCO
2.654
2.654
5.760
ns
GCLK PLL
tCO
1.202
1.202
2.654
ns
GCLK
tCO
2.804
2.804
7.295
ns
GCLK PLL
tCO
1.333
1.333
4.099
ns
GCLK
tCO
2.808
2.808
6.479
ns
GCLK PLL
tCO
1.338
1.338
3.325
ns
GCLK
tCO
2.717
2.717
6.195
ns
GCLK PLL
tCO
1.262
1.262
3.061
ns
GCLK
tCO
2.719
2.719
6.098
ns
GCLK PLL
tCO
1.264
1.264
2.970
ns
GCLK
tCO
2.671
2.671
6.012
ns
GCLK PLL
tCO
1.218
1.218
2.893
ns
GCLK
tCO
2.671
2.671
5.953
ns
GCLK PLL
tCO
1.219
1.219
2.836
ns
GCLK
tCO
2.779
2.779
6.815
ns
GCLK PLL
tCO
1.313
1.313
3.629
ns
GCLK
tCO
2.703
2.703
6.210
ns
GCLK PLL
tCO
1.249
1.249
3.060
ns
GCLK
tCO
2.705
2.705
6.118
ns
GCLK PLL
tCO
1.252
1.252
2.942
ns
GCLK
tCO
2.660
2.660
6.014
ns
GCLK PLL
tCO
1.211
1.211
2.889
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–57
Table 4–63. EP1AGX50 Column Pins Output Timing Parameters (Part 3 of 4)
Fast Corner
Drive
Strength
Clock
SSTL-2
CLASS I
8 mA
GCLK
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-2
CLASS II
20 mA
SSTL-2
CLASS II
24 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
SSTL-18
CLASS I
12 mA
SSTL-18
CLASS II
8 mA
SSTL-18
CLASS II
16 mA
SSTL-18
CLASS II
18 mA
SSTL-18
CLASS II
20 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
I/O Standard
© December 2009
Industrial
Commercial
–6 Speed
Grade
tCO
2.648
2.648
5.777
ns
GCLK PLL
tCO
1.202
1.202
2.675
ns
Parameter
Units
GCLK
tCO
2.628
2.628
5.722
ns
GCLK PLL
tCO
1.185
1.185
2.625
ns
GCLK
tCO
2.606
2.606
5.649
ns
GCLK PLL
tCO
1.163
1.163
2.552
ns
GCLK
tCO
2.606
2.606
5.636
ns
GCLK PLL
tCO
1.164
1.164
2.539
ns
GCLK
tCO
2.601
2.601
5.634
ns
GCLK PLL
tCO
1.160
1.160
2.537
ns
GCLK
tCO
2.643
2.643
5.749
ns
GCLK PLL
tCO
1.193
1.193
2.639
ns
GCLK
tCO
2.649
2.649
5.708
ns
GCLK PLL
tCO
1.203
1.203
2.607
ns
GCLK
tCO
2.626
2.626
5.686
ns
GCLK PLL
tCO
1.182
1.182
2.588
ns
GCLK
tCO
2.630
2.630
5.685
ns
GCLK PLL
tCO
1.187
1.187
2.586
ns
GCLK
tCO
2.625
2.625
5.669
ns
GCLK PLL
tCO
1.181
1.181
2.572
ns
GCLK
tCO
2.614
2.614
5.635
ns
GCLK PLL
tCO
1.170
1.170
2.538
ns
GCLK
tCO
2.623
2.623
5.613
ns
GCLK PLL
tCO
1.182
1.182
2.516
ns
GCLK
tCO
2.616
2.616
5.621
ns
GCLK PLL
tCO
1.178
1.178
2.524
ns
GCLK
tCO
2.616
2.616
5.619
ns
GCLK PLL
tCO
1.178
1.178
2.522
ns
GCLK
tCO
2.637
2.637
5.676
ns
GCLK PLL
tCO
1.196
1.196
2.570
ns
GCLK
tCO
2.645
2.645
5.659
ns
GCLK PLL
tCO
1.207
1.207
2.562
ns
GCLK
tCO
2.623
2.623
5.648
ns
GCLK PLL
tCO
1.185
1.185
2.551
ns
GCLK
tCO
2.627
2.627
5.654
ns
GCLK PLL
tCO
1.189
1.189
2.557
ns
GCLK
tCO
2.619
2.619
5.647
ns
GCLK PLL
tCO
1.181
1.181
2.550
ns
Altera Corporation
Arria GX Device Handbook, Volume 1
4–58
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–63. EP1AGX50 Column Pins Output Timing Parameters (Part 4 of 4)
Fast Corner
Drive
Strength
Clock
1.8-V HSTL
CLASS II
16 mA
GCLK
1.8-V HSTL
CLASS II
18 mA
1.8-V HSTL
CLASS II
20 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
1.5-V HSTL
CLASS I
10 mA
1.5-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS II
16 mA
1.5-V HSTL
CLASS II
18 mA
1.5-V HSTL
CLASS II
20 mA
I/O Standard
3.3-V PCI
3.3-V PCI-X
LVDS
—
—
—
Industrial
Commercial
–6 Speed
Grade
tCO
2.602
2.602
5.574
ns
GCLK PLL
tCO
1.164
1.164
2.314
ns
Parameter
Units
GCLK
tCO
2.604
2.604
5.578
ns
GCLK PLL
tCO
1.166
1.166
2.325
ns
GCLK
tCO
2.604
2.604
5.577
ns
GCLK PLL
tCO
1.166
1.166
2.334
ns
GCLK
tCO
2.637
2.637
5.675
ns
GCLK PLL
tCO
1.196
1.196
2.569
ns
GCLK
tCO
2.644
2.644
5.651
ns
GCLK PLL
tCO
1.206
1.206
2.554
ns
GCLK
tCO
2.626
2.626
5.653
ns
GCLK PLL
tCO
1.188
1.188
2.556
ns
GCLK
tCO
2.626
2.626
5.655
ns
GCLK PLL
tCO
1.188
1.188
2.558
ns
GCLK
tCO
2.620
2.620
5.653
ns
GCLK PLL
tCO
1.182
1.182
2.556
ns
GCLK
tCO
2.607
2.607
5.573
ns
GCLK PLL
tCO
1.169
1.169
2.368
ns
GCLK
tCO
2.610
2.610
5.571
ns
GCLK PLL
tCO
1.172
1.172
2.378
ns
GCLK
tCO
2.612
2.612
5.581
ns
GCLK PLL
tCO
1.174
1.174
2.391
ns
GCLK
tCO
2.786
2.786
5.803
ns
GCLK PLL
tCO
1.322
1.322
2.697
ns
GCLK
tCO
2.786
2.786
5.803
ns
GCLK PLL
tCO
1.322
1.322
2.697
ns
GCLK
tCO
3.621
3.621
6.969
ns
GCLK PLL
tCO
2.190
2.190
3.880
ns
Table 4–64 through Table 4–65 list EP1AGX50 regional clock (RCLK) adder values that
should be added to the GCLK values. These adder values are used to determine I/O
timing when the I/O pin is driven using the regional clock. This applies for all I/O
standards supported by Arria GX with general purpose I/O pins.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–59
Table 4–64 lists row pin delay adders when using the regional clock in Arria GX
devices.
Table 4–64. EP1AGX50 Row Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.151
0.329
ns
0.011
0.011
0.016
ns
RCLK output adder
–0.151
–0.151
–0.329
ns
RCLK PLL output adder
–0.011
–0.011
–0.016
ns
Industrial
Commercial
RCLK input adder
0.151
RCLK PLL input adder
Table 4–65 lists column pin delay adders when using the regional clock in Arria GX
devices.
Table 4–65. EP1AGX50 Column Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.146
0.334
ns
–1.713
–1.713
–3.645
ns
RCLK output adder
–0.146
–0.146
–0.336
ns
RCLK PLL output adder
1.716
1.716
4.488
ns
Industrial
Commercial
RCLK input adder
0.146
RCLK PLL input adder
EP1AGX60 I/O Timing Parameters
Table 4–66 through Table 4–69 list the maximum I/O timing parameters for
EP1AGX60 devices for I/O standards which support general purpose I/O pins.
Table 4–66 lists I/O timing specifications.
Table 4–66. EP1AGX60 Row Pins Input Timing Parameters (Part 1 of 3)
Fast Model
I/O Standard
Industrial
Commercial
–6 Speed
Grade
t SU
1.413
1.413
3.113
ns
tH
–1.308
–1.308
–2.836
ns
GCLK PLL
t SU
2.975
2.975
6.536
ns
tH
–2.870
–2.870
–6.259
ns
GCLK
t SU
1.413
1.413
3.113
ns
tH
–1.308
–1.308
–2.836
ns
t SU
2.975
2.975
6.536
ns
tH
–2.870
–2.870
–6.259
ns
t SU
1.425
1.425
3.094
ns
tH
–1.320
–1.320
–2.817
ns
t SU
2.987
2.987
6.517
ns
tH
–2.882
–2.882
–6.240
ns
Clock
GCLK
3.3-V LVTTL
3.3-V LVCMOS
GCLK PLL
GCLK
2.5 V
GCLK PLL
© December 2009
Altera Corporation
Parameter
Units
Arria GX Device Handbook, Volume 1
4–60
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–66. EP1AGX60 Row Pins Input Timing Parameters (Part 2 of 3)
Fast Model
I/O Standard
Clock
GCLK
1.8 V
GCLK PLL
GCLK
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
t SU
1.477
1.477
3.275
ns
tH
–1.372
–1.372
–2.998
ns
Parameter
Units
t SU
3.049
3.049
6.718
ns
tH
–2.944
–2.944
–6.441
ns
t SU
1.480
1.480
3.370
ns
tH
–1.375
–1.375
–3.093
ns
t SU
3.052
3.052
6.813
ns
tH
–2.947
–2.947
–6.536
ns
t SU
1.237
1.237
2.566
ns
tH
–1.132
–1.132
–2.289
ns
t SU
2.800
2.800
5.990
ns
tH
–2.695
–2.695
–5.713
ns
t SU
1.237
1.237
2.566
ns
tH
–1.132
–1.132
–2.289
ns
t SU
2.800
2.800
5.990
ns
tH
–2.695
–2.695
–5.713
ns
t SU
1.255
1.255
2.649
ns
tH
–1.150
–1.150
–2.372
ns
t SU
2.827
2.827
6.092
ns
tH
–2.722
–2.722
–5.815
ns
t SU
1.255
1.255
2.649
ns
tH
–1.150
–1.150
–2.372
ns
t SU
2.827
2.827
6.092
ns
tH
–2.722
–2.722
–5.815
ns
t SU
1.255
1.255
2.649
ns
tH
–1.150
–1.150
–2.372
ns
t SU
2.827
2.827
6.092
ns
tH
–2.722
–2.722
–5.815
ns
t SU
1.255
1.255
2.649
ns
tH
–1.150
–1.150
–2.372
ns
t SU
2.827
2.827
6.092
ns
tH
–2.722
–2.722
–5.815
ns
t SU
1.281
1.281
2.777
ns
tH
–1.176
–1.176
–2.500
ns
t SU
2.853
2.853
6.220
ns
tH
–2.748
–2.748
–5.943
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–61
Table 4–66. EP1AGX60 Row Pins Input Timing Parameters (Part 3 of 3)
Fast Model
I/O Standard
Clock
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
LVDS
GCLK PLL
Industrial
Commercial
–6 Speed
Grade
t SU
1.281
1.281
2.777
ns
tH
–1.176
–1.176
–2.500
ns
Parameter
Units
t SU
2.853
2.853
6.220
ns
tH
–2.748
–2.748
–5.943
ns
t SU
1.208
1.208
2.664
ns
tH
–1.103
–1.103
–2.387
ns
t SU
2.767
2.767
6.083
ns
tH
–2.662
–2.662
–5.806
ns
–6 Speed
Grade
Units
Table 4–67 lists I/O timing specifications.
Table 4–67. EP1AGX60 Column Pins Input Timing Parameters (Part 1 of 3)
Fast Corner
I/O Standard
Clock
Parameter
Industrial
tSU
1.124
1.124
2.493
ns
tH
–1.019
–1.019
-2.216
ns
tSU
2.694
2.694
5.928
ns
tH
–2.589
–2.589
-5.651
ns
tSU
1.124
1.124
2.493
ns
tH
–1.019
–1.019
-2.216
ns
GCLK PLL
tSU
2.694
2.694
5.928
ns
tH
–2.589
–2.589
-5.651
ns
GCLK
tSU
1.134
1.134
2.475
ns
tH
–1.029
–1.029
-2.198
ns
tSU
2.704
2.704
5.910
ns
tH
–2.599
–2.599
-5.633
ns
tSU
1.200
1.200
2.685
ns
tH
–1.095
–1.095
-2.408
ns
GCLK PLL
tSU
2.770
2.770
6.120
ns
tH
–2.665
–2.665
-5.843
ns
GCLK
tSU
1.203
1.203
2.778
ns
tH
–1.098
–1.098
-2.501
ns
tSU
2.773
2.773
6.213
ns
tH
–2.668
–2.668
-5.936
ns
tSU
0.948
0.948
1.951
ns
tH
–0.843
–0.843
-1.674
ns
tSU
2.519
2.519
5.388
ns
tH
–2.414
–2.414
-5.111
ns
GCLK
3.3-V LVTTL
GCLK PLL
GCLK
3.3-V LVCMOS
2.5 V
GCLK PLL
GCLK
1.8 V
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
© December 2009
Commercial
Altera Corporation
Arria GX Device Handbook, Volume 1
4–62
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–67. EP1AGX60 Column Pins Input Timing Parameters (Part 2 of 3)
Fast Corner
I/O Standard
Clock
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
3.3-V PCI
GCLK PLL
GCLK
3.3-V PCI-X
GCLK PLL
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tSU
0.948
0.948
1.951
ns
tH
–0.843
–0.843
–1.674
ns
Parameter
Units
tSU
2.519
2.519
5.388
ns
tH
–2.414
–2.414
–5.111
ns
tSU
0.986
0.986
2.057
ns
tH
–0.881
–0.881
–1.780
ns
tSU
2.556
2.556
5.492
ns
tH
–2.451
–2.451
–5.215
ns
tSU
0.987
0.987
2.058
ns
tH
–0.882
–0.882
–1.781
ns
tSU
2.558
2.558
5.495
ns
tH
–2.453
–2.453
–5.218
ns
tSU
0.986
0.986
2.057
ns
tH
–0.881
–0.881
–1.780
ns
tSU
2.556
2.556
5.492
ns
tH
–2.451
–2.451
–5.215
ns
tSU
0.987
0.987
2.058
ns
tH
–0.882
–0.882
–1.781
ns
tSU
2.558
2.558
5.495
ns
tH
–2.453
–2.453
–5.218
ns
tSU
1.004
1.004
2.185
ns
tH
–0.899
–0.899
–1.908
ns
tSU
2.574
2.574
5.620
ns
tH
–2.469
–2.469
–5.343
ns
tSU
1.005
1.005
2.186
ns
tH
–0.900
–0.900
–1.909
ns
tSU
2.576
2.576
5.623
ns
tH
–2.471
–2.471
–5.346
ns
tSU
1.129
1.129
2.481
ns
tH
–1.024
–1.024
–2.204
ns
tSU
2.699
2.699
5.916
ns
tH
–2.594
–2.594
–5.639
ns
tSU
1.129
1.129
2.481
ns
tH
–1.024
–1.024
–2.204
ns
tSU
2.699
2.699
5.916
ns
tH
–2.594
–2.594
–5.639
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–63
Table 4–67. EP1AGX60 Column Pins Input Timing Parameters (Part 3 of 3)
Fast Corner
I/O Standard
Clock
GCLK
LVDS
GCLK PLL
Industrial
Commercial
–6 Speed
Grade
tSU
0.980
0.980
2.062
ns
tH
–0.875
–0.875
–1.785
ns
Parameter
Units
tSU
2.557
2.557
5.512
ns
tH
–2.452
–2.452
–5.235
ns
Units
Table 4–68 lists I/O timing specifications.
Table 4–68. EP1AGX60 Row Pins Output Timing Parameters (Part 1 of 2)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Clock
4 mA
GCLK
3.3-V
LVCMOS
8 mA
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
© December 2009
Commercial
tCO
3.052
3.052
7.142
ns
GCLK PLL
tCO
1.490
1.490
3.719
ns
GCLK
tCO
2.924
2.924
6.502
ns
GCLK PLL
tCO
1.362
1.362
3.079
ns
Parameter
GCLK
tCO
2.868
2.868
6.465
ns
GCLK PLL
tCO
1.306
1.306
3.042
ns
GCLK
tCO
2.924
2.924
6.502
ns
GCLK PLL
tCO
1.362
1.362
3.079
ns
GCLK
tCO
2.818
2.818
6.196
ns
GCLK PLL
tCO
1.256
1.256
2.773
ns
GCLK
tCO
2.907
2.907
6.476
ns
GCLK PLL
tCO
1.345
1.345
3.053
ns
12 mA
4 mA
2.5 V
Industrial
–6 Speed
Grade
8 mA
3.3-V
LVCMOS
2.5 V
Fast Model
Drive
Strength
4 mA
GCLK
tCO
2.804
2.804
6.218
ns
GCLK PLL
tCO
1.242
1.242
2.795
ns
GCLK
tCO
2.785
2.785
6.104
ns
GCLK PLL
tCO
1.223
1.223
2.681
ns
GCLK
tCO
2.991
2.991
7.521
ns
GCLK PLL
tCO
1.419
1.419
4.078
ns
GCLK
tCO
2.980
2.980
6.742
ns
GCLK PLL
tCO
1.408
1.408
3.299
ns
8 mA
12 mA
2 mA
4 mA
GCLK
tCO
2.869
2.869
6.441
ns
GCLK PLL
tCO
1.297
1.297
2.998
ns
GCLK
tCO
2.838
2.838
6.327
ns
GCLK PLL
tCO
1.266
1.266
2.884
ns
GCLK
tCO
2.951
2.951
7.020
ns
GCLK PLL
tCO
1.379
1.379
3.577
ns
GCLK
tCO
2.844
2.844
6.419
ns
GCLK PLL
tCO
1.272
1.272
2.976
ns
6 mA
8 mA
2 mA
4 mA
Altera Corporation
Arria GX Device Handbook, Volume 1
4–64
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–68. EP1AGX60 Row Pins Output Timing Parameters (Part 2 of 2)
Fast Model
Drive
Strength
Clock
SSTL-2
CLASS I
8 mA
GCLK
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
I/O Standard
LVDS
—
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.774
2.774
6.057
ns
GCLK PLL
tCO
1.211
1.211
2.633
ns
GCLK
tCO
2.750
2.750
5.981
ns
GCLK PLL
tCO
1.187
1.187
2.557
ns
GCLK
tCO
2.716
2.716
5.850
ns
GCLK PLL
tCO
1.153
1.153
2.426
ns
GCLK
tCO
2.776
2.776
6.025
ns
GCLK PLL
tCO
1.204
1.204
2.582
ns
GCLK
tCO
2.780
2.780
5.954
ns
GCLK PLL
tCO
1.208
1.208
2.511
ns
GCLK
tCO
2.756
2.756
5.937
ns
GCLK PLL
tCO
1.184
1.184
2.494
ns
GCLK
tCO
2.759
2.759
5.916
ns
GCLK PLL
tCO
1.187
1.187
2.473
ns
GCLK
tCO
2.757
2.757
5.935
ns
GCLK PLL
tCO
1.185
1.185
2.492
ns
GCLK
tCO
2.760
2.760
5.899
ns
GCLK PLL
tCO
1.188
1.188
2.456
ns
GCLK
tCO
2.742
2.742
5.895
ns
GCLK PLL
tCO
1.170
1.170
2.452
ns
GCLK
tCO
2.746
2.746
5.884
ns
GCLK PLL
tCO
1.174
1.174
2.441
ns
GCLK
tCO
2.737
2.737
5.883
ns
GCLK PLL
tCO
1.165
1.165
2.440
ns
GCLK
tCO
2.756
2.756
5.912
ns
GCLK PLL
tCO
1.184
1.184
2.469
ns
GCLK
tCO
2.759
2.759
5.898
ns
GCLK PLL
tCO
1.187
1.187
2.455
ns
GCLK
tCO
2.744
2.744
5.890
ns
GCLK PLL
tCO
1.172
1.172
2.447
ns
GCLK
tCO
2.787
2.787
6.037
ns
GCLK PLL
tCO
1.228
1.228
2.618
ns
Parameter
© December 2009
Units
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–65
Table 4–69 lists I/O timing specifications.
Table 4–69. EP1AGX60 Column Pins Output Timing Parameters (Part 1 of 4)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Clock
4 mA
GCLK
3.036
3.036
6.963
ns
GCLK PLL
tCO
1.466
1.466
3.528
ns
GCLK
tCO
2.891
2.891
6.591
ns
GCLK PLL
tCO
1.321
1.321
3.156
ns
GCLK
tCO
2.824
2.824
6.591
ns
GCLK PLL
tCO
1.254
1.254
3.156
ns
GCLK
tCO
2.798
2.798
6.422
ns
GCLK PLL
tCO
1.228
1.228
2.987
ns
GCLK
tCO
2.776
2.776
6.297
ns
GCLK PLL
tCO
1.206
1.206
2.862
ns
GCLK
tCO
2.769
2.769
6.299
ns
GCLK PLL
tCO
1.199
1.199
2.864
ns
GCLK
tCO
2.891
2.891
6.591
ns
GCLK PLL
tCO
1.321
1.321
3.156
ns
GCLK
tCO
2.799
2.799
6.296
ns
GCLK PLL
tCO
1.229
1.229
2.861
ns
GCLK
tCO
2.771
2.771
6.218
ns
GCLK PLL
tCO
1.201
1.201
2.783
ns
GCLK
tCO
2.778
2.778
6.186
ns
GCLK PLL
tCO
1.208
1.208
2.751
ns
GCLK
tCO
2.765
2.765
6.168
ns
GCLK PLL
tCO
1.195
1.195
2.733
ns
GCLK
tCO
2.754
2.754
6.146
ns
GCLK PLL
tCO
1.184
1.184
2.711
ns
GCLK
tCO
2.853
2.853
6.623
ns
GCLK PLL
tCO
1.283
1.283
3.188
ns
GCLK
tCO
2.801
2.801
6.361
ns
GCLK PLL
tCO
1.231
1.231
2.926
ns
GCLK
tCO
2.780
2.780
6.244
ns
GCLK PLL
tCO
1.210
1.210
2.809
ns
GCLK
tCO
2.762
2.762
6.170
ns
GCLK PLL
tCO
1.192
1.192
2.735
ns
GCLK
tCO
2.893
2.893
7.615
ns
GCLK PLL
tCO
1.323
1.323
4.180
ns
GCLK
tCO
2.898
2.898
6.841
ns
GCLK PLL
tCO
1.328
1.328
3.406
ns
20 mA
24 mA
8 mA
3.3-V
LVCMOS
12 mA
3.3-V
LVCMOS
16 mA
3.3-V
LVCMOS
20 mA
3.3-V
LVCMOS
24 mA
2.5 V
4 mA
2.5 V
8 mA
2.5 V
12 mA
© December 2009
tCO
16 mA
3.3-V
LVCMOS
1.8 V
Commercial
12 mA
3.3-V
LVCMOS
1.8 V
Industrial
–6 Speed
Grade
8 mA
4 mA
2.5 V
Fast Corner
Drive
Strength
16 mA
2 mA
4 mA
Altera Corporation
Parameter
Units
Arria GX Device Handbook, Volume 1
4–66
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–69. EP1AGX60 Column Pins Output Timing Parameters (Part 2 of 4)
I/O Standard
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
1.5 V
1.5 V
Fast Corner
Drive
Strength
Clock
6 mA
GCLK
8 mA
10 mA
12 mA
2 mA
4 mA
6 mA
8 mA
SSTL-2
CLASS I
8 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-2
CLASS II
20 mA
SSTL-2
CLASS II
24 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
SSTL-18
CLASS I
12 mA
SSTL-18
CLASS II
8 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.822
2.822
6.577
ns
GCLK PLL
tCO
1.252
1.252
3.142
ns
Parameter
Units
GCLK
tCO
2.824
2.824
6.486
ns
GCLK PLL
tCO
1.254
1.254
3.051
ns
GCLK
tCO
2.778
2.778
6.409
ns
GCLK PLL
tCO
1.208
1.208
2.974
ns
GCLK
tCO
2.779
2.779
6.352
ns
GCLK PLL
tCO
1.209
1.209
2.917
ns
GCLK
tCO
2.873
2.873
7.145
ns
GCLK PLL
tCO
1.303
1.303
3.710
ns
GCLK
tCO
2.809
2.809
6.576
ns
GCLK PLL
tCO
1.239
1.239
3.141
ns
GCLK
tCO
2.812
2.812
6.458
ns
GCLK PLL
tCO
1.242
1.242
3.023
ns
GCLK
tCO
2.771
2.771
6.405
ns
GCLK PLL
tCO
1.201
1.201
2.970
ns
GCLK
tCO
2.757
2.757
6.184
ns
GCLK PLL
tCO
1.184
1.184
2.744
ns
GCLK
tCO
2.740
2.740
6.134
ns
GCLK PLL
tCO
1.167
1.167
2.694
ns
GCLK
tCO
2.718
2.718
6.061
ns
GCLK PLL
tCO
1.145
1.145
2.621
ns
GCLK
tCO
2.719
2.719
6.048
ns
GCLK PLL
tCO
1.146
1.146
2.608
ns
GCLK
tCO
2.715
2.715
6.046
ns
GCLK PLL
tCO
1.142
1.142
2.606
ns
GCLK
tCO
2.753
2.753
6.155
ns
GCLK PLL
tCO
1.183
1.183
2.720
ns
GCLK
tCO
2.758
2.758
6.116
ns
GCLK PLL
tCO
1.185
1.185
2.676
ns
GCLK
tCO
2.737
2.737
6.097
ns
GCLK PLL
tCO
1.164
1.164
2.657
ns
GCLK
tCO
2.742
2.742
6.095
ns
GCLK PLL
tCO
1.169
1.169
2.655
ns
GCLK
tCO
2.736
2.736
6.081
ns
GCLK PLL
tCO
1.163
1.163
2.641
ns
GCLK
tCO
2.725
2.725
6.047
ns
GCLK PLL
tCO
1.152
1.152
2.607
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–67
Table 4–69. EP1AGX60 Column Pins Output Timing Parameters (Part 3 of 4)
Fast Corner
Drive
Strength
Clock
SSTL-18
CLASS II
16 mA
GCLK
SSTL-18
CLASS II
18 mA
SSTL-18
CLASS II
20 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.8-V HSTL
CLASS II
16 mA
1.8-V HSTL
CLASS II
18 mA
1.8-V HSTL
CLASS II
20 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
1.5-V HSTL
CLASS I
10 mA
1.5-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS II
16 mA
1.5-V HSTL
CLASS II
18 mA
1.5-V HSTL
CLASS II
20 mA
I/O Standard
© December 2009
Industrial
Commercial
–6 Speed
Grade
tCO
2.737
2.737
6.025
ns
GCLK PLL
tCO
1.164
1.164
2.585
ns
GCLK
tCO
2.733
2.733
6.033
ns
GCLK PLL
tCO
1.160
1.160
2.593
ns
GCLK
tCO
2.733
2.733
6.031
ns
GCLK PLL
tCO
1.160
1.160
2.591
ns
GCLK
tCO
2.756
2.756
6.086
ns
GCLK PLL
tCO
1.186
1.186
2.651
ns
GCLK
tCO
2.762
2.762
6.071
ns
GCLK PLL
tCO
1.189
1.189
2.631
ns
GCLK
tCO
2.740
2.740
6.060
ns
GCLK PLL
tCO
1.167
1.167
2.620
ns
GCLK
tCO
2.744
2.744
6.066
ns
GCLK PLL
tCO
1.171
1.171
2.626
ns
GCLK
tCO
2.736
2.736
6.059
ns
GCLK PLL
tCO
1.163
1.163
2.619
ns
GCLK
tCO
2.719
2.719
5.823
ns
GCLK PLL
tCO
1.146
1.146
2.383
ns
GCLK
tCO
2.721
2.721
5.834
ns
GCLK PLL
tCO
1.148
1.148
2.394
ns
GCLK
tCO
2.721
2.721
5.843
ns
GCLK PLL
tCO
1.148
1.148
2.403
ns
GCLK
tCO
2.756
2.756
6.085
ns
GCLK PLL
tCO
1.186
1.186
2.650
ns
GCLK
tCO
2.761
2.761
6.063
ns
GCLK PLL
tCO
1.188
1.188
2.623
ns
GCLK
tCO
2.743
2.743
6.065
ns
GCLK PLL
tCO
1.170
1.170
2.625
ns
GCLK
tCO
2.743
2.743
6.067
ns
GCLK PLL
tCO
1.170
1.170
2.627
ns
GCLK
tCO
2.737
2.737
6.065
ns
GCLK PLL
tCO
1.164
1.164
2.625
ns
GCLK
tCO
2.724
2.724
5.877
ns
GCLK PLL
tCO
1.151
1.151
2.437
ns
GCLK
tCO
2.727
2.727
5.887
ns
GCLK PLL
tCO
1.154
1.154
2.447
ns
GCLK
tCO
2.729
2.729
5.900
ns
GCLK PLL
tCO
1.156
1.156
2.460
ns
Altera Corporation
Parameter
Units
Arria GX Device Handbook, Volume 1
4–68
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–69. EP1AGX60 Column Pins Output Timing Parameters (Part 4 of 4)
I/O Standard
3.3-V PCI
3.3-V PCI-X
LVDS
Fast Corner
Drive
Strength
Clock
—
GCLK
—
—
Industrial
Commercial
–6 Speed
Grade
tCO
2.882
2.882
6.213
ns
GCLK PLL
tCO
1.312
1.312
2.778
ns
Parameter
Units
GCLK
tCO
2.882
2.882
6.213
ns
GCLK PLL
tCO
1.312
1.312
2.778
ns
GCLK
tCO
3.746
3.746
7.396
ns
GCLK PLL
tCO
2.185
2.185
3.973
ns
Table 4–70 through Table 4–71 list EP1AGX60 regional clock (RCLK) adder values that
should be added to the GCLK values. These adder values are used to determine I/O
timing when the I/O pin is driven using the regional clock. This applies for all I/O
standards supported by Arria GX with general purpose I/O pins.
Table 4–70 describes row pin delay adders when using the regional clock in Arria GX
devices.
Table 4–70. EP1AGX60 Row Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.138
0.311
ns
–0.003
–0.003
–0.006
ns
RCLK output adder
–0.138
–0.138
–0.311
ns
RCLK PLL output adder
0.003
0.003
0.006
ns
Industrial
Commercial
RCLK input adder
0.138
RCLK PLL input adder
Table 4–71 lists column pin delay adders when using the regional clock in Arria GX
devices.
Table 4–71. EP1AGX60 Column Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.153
0.344
ns
–1.066
–1.066
–2.338
ns
RCLK output adder
–0.153
–0.153
–0.343
ns
RCLK PLL output adder
1.721
1.721
4.486
ns
Industrial
Commercial
RCLK input adder
0.153
RCLK PLL input adder
EP1AGX90 I/O Timing Parameters
Table 4–72 through Table 4–75 list the maximum I/O timing parameters for
EP1AGX90 devices for I/O standards which support general purpose I/O pins.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–69
Table 4–72 lists I/O timing specifications.
Table 4–72. EP1AGX90 Row Pins Input Timing Parameters (Part 1 of 2)
Fast Model
I/O Standard
Industrial
Commercial
–6 Speed
Grade
t SU
1.295
1.295
2.873
ns
tH
–1.190
–1.190
–2.596
ns
GCLK PLL
t SU
3.366
3.366
7.017
ns
tH
–3.261
–3.261
–6.740
ns
GCLK
t SU
1.295
1.295
2.873
ns
tH
–1.190
–1.190
–2.596
ns
t SU
3.366
3.366
7.017
ns
tH
–3.261
–3.261
–6.740
ns
t SU
1.307
1.307
2.854
ns
tH
–1.202
–1.202
–2.577
ns
t SU
3.378
3.378
6.998
ns
Clock
GCLK
3.3-V LVTTL
3.3-V LVCMOS
GCLK PLL
GCLK
2.5 V
GCLK PLL
GCLK
1.8 V
GCLK PLL
GCLK
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
© December 2009
Altera Corporation
Parameter
Units
tH
–3.273
–3.273
–6.721
ns
t SU
1.381
1.381
3.073
ns
tH
–1.276
–1.276
–2.796
ns
t SU
3.434
3.434
7.191
ns
tH
–3.329
–3.329
–6.914
ns
t SU
1.384
1.384
3.168
ns
tH
–1.279
–1.279
–2.891
ns
t SU
3.437
3.437
7.286
ns
tH
–3.332
–3.332
–7.009
ns
t SU
1.121
1.121
2.329
ns
tH
–1.016
–1.016
–2.052
ns
t SU
3.187
3.187
6.466
ns
tH
–3.082
–3.082
–6.189
ns
t SU
1.121
1.121
2.329
ns
tH
–1.016
–1.016
–2.052
ns
t SU
3.187
3.187
6.466
ns
tH
–3.082
–3.082
–6.189
ns
t SU
1.159
1.159
2.447
ns
tH
–1.054
–1.054
–2.170
ns
t SU
3.212
3.212
6.565
ns
tH
–3.107
–3.107
–6.288
ns
t SU
1.157
1.157
2.441
ns
tH
–1.052
–1.052
–2.164
ns
t SU
3.235
3.235
6.597
ns
tH
–3.130
–3.130
–6.320
ns
Arria GX Device Handbook, Volume 1
4–70
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–72. EP1AGX90 Row Pins Input Timing Parameters (Part 2 of 2)
Fast Model
I/O Standard
Clock
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
LVDS
GCLK PLL
Industrial
Commercial
–6 Speed
Grade
t SU
1.159
1.159
2.447
ns
tH
–1.054
–1.054
–2.170
ns
Parameter
Units
t SU
3.212
3.212
6.565
ns
tH
–3.107
–3.107
–6.288
ns
t SU
1.157
1.157
2.441
ns
tH
–1.052
–1.052
–2.164
ns
t SU
3.235
3.235
6.597
ns
tH
–3.130
–3.130
–6.320
ns
t SU
1.185
1.185
2.575
ns
tH
–1.080
–1.080
–2.298
ns
t SU
3.238
3.238
6.693
ns
tH
–3.133
–3.133
–6.416
ns
t SU
1.183
1.183
2.569
ns
tH
–1.078
–1.078
–2.292
ns
t SU
3.261
3.261
6.725
ns
tH
–3.156
–3.156
–6.448
ns
t SU
1.098
1.098
2.439
ns
tH
–0.993
–0.993
–2.162
ns
t SU
3.160
3.160
6.566
ns
tH
–3.055
–3.055
–6.289
ns
–6 Speed
Grade
Units
Table 4–73 lists I/O timing specifications.
\
Table 4–73. EP1AGX90 Column Pins Input Timing Parameters (Part 1 of 3)
Fast Corner
I/O Standard
Clock
Parameter
Industrial
Commercial
t SU
1.018
1.018
2.290
ns
tH
–0.913
–0.913
–2.013
ns
t SU
3.082
3.082
6.425
ns
tH
–2.977
–2.977
–6.148
ns
t SU
1.018
1.018
2.290
ns
tH
–0.913
–0.913
–2.013
ns
GCLK PLL
t SU
3.082
3.082
6.425
ns
tH
–2.977
–2.977
–6.148
ns
GCLK
t SU
1.028
1.028
2.272
ns
tH
–0.923
–0.923
–1.995
ns
t SU
3.092
3.092
6.407
ns
tH
–2.987
–2.987
–6.130
ns
GCLK
3.3-V LVTTL
GCLK PLL
GCLK
3.3-V LVCMOS
2.5 V
GCLK PLL
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–71
Table 4–73. EP1AGX90 Column Pins Input Timing Parameters (Part 2 of 3)
Fast Corner
I/O Standard
Clock
GCLK
1.8 V
GCLK PLL
GCLK
1.5 V
GCLK PLL
GCLK
SSTL-2 CLASS I
GCLK PLL
GCLK
SSTL-2 CLASS II
GCLK PLL
GCLK
SSTL-18 CLASS I
GCLK PLL
GCLK
SSTL-18 CLASS II
GCLK PLL
GCLK
1.8-V HSTL CLASS I
GCLK PLL
GCLK
1.8-V HSTL CLASS II
GCLK PLL
GCLK
1.5-V HSTL CLASS I
GCLK PLL
© December 2009
Altera Corporation
Industrial
Commercial
–6 Speed
Grade
t SU
1.094
1.094
2.482
ns
tH
–0.989
–0.989
–2.205
ns
Parameter
Units
t SU
3.158
3.158
6.617
ns
tH
–3.053
–3.053
–6.340
ns
t SU
1.097
1.097
2.575
ns
tH
–0.992
–0.992
–2.298
ns
t SU
3.161
3.161
6.710
ns
tH
–3.056
–3.056
–6.433
ns
t SU
0.844
0.844
1.751
ns
tH
–0.739
–0.739
–1.474
ns
t SU
2.908
2.908
5.886
ns
tH
–2.803
–2.803
–5.609
ns
t SU
0.844
0.844
1.751
ns
tH
–0.739
–0.739
–1.474
ns
t SU
2.908
2.908
5.886
ns
tH
–2.803
–2.803
–5.609
ns
t SU
0.880
0.880
1.854
ns
tH
–0.775
–0.775
–1.577
ns
t SU
2.944
2.944
5.989
ns
tH
–2.839
–2.839
–5.712
ns
t SU
0.883
0.883
1.858
ns
tH
–0.778
–0.778
–1.581
ns
t SU
2.947
2.947
5.993
ns
tH
–2.842
–2.842
–5.716
ns
t SU
0.880
0.880
1.854
ns
tH
–0.775
–0.775
–1.577
ns
t SU
2.944
2.944
5.989
ns
tH
–2.839
–2.839
–5.712
ns
t SU
0.883
0.883
1.858
ns
tH
–0.778
–0.778
–1.581
ns
t SU
2.947
2.947
5.993
ns
tH
–2.842
–2.842
–5.716
ns
t SU
0.898
0.898
1.982
ns
tH
–0.793
–0.793
–1.705
ns
t SU
2.962
2.962
6.117
ns
tH
–2.857
–2.857
–5.840
ns
Arria GX Device Handbook, Volume 1
4–72
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–73. EP1AGX90 Column Pins Input Timing Parameters (Part 3 of 3)
Fast Corner
I/O Standard
Clock
Industrial
Commercial
–6 Speed
Grade
t SU
0.901
0.901
1.986
ns
tH
–0.796
–0.796
–1.709
ns
Parameter
GCLK
1.5-V HSTL CLASS II
GCLK PLL
GCLK
3.3-V PCI
GCLK PLL
GCLK
3.3-V PCI-X
GCLK PLL
GCLK
LVDS
GCLK PLL
Units
t SU
2.965
2.965
6.121
ns
tH
–2.860
–2.860
–5.844
ns
t SU
1.023
1.023
2.278
ns
tH
–0.918
–0.918
–2.001
ns
t SU
3.087
3.087
6.413
ns
tH
–2.982
–2.982
–6.136
ns
t SU
1.023
1.023
2.278
ns
tH
–0.918
–0.918
–2.001
ns
t SU
3.087
3.087
6.413
ns
tH
–2.982
–2.982
–6.136
ns
t SU
0.891
0.891
1.920
ns
tH
–0.786
–0.786
–1.643
ns
t SU
2.963
2.963
6.066
ns
tH
–2.858
–2.858
–5.789
ns
Table 4–74 lists I/O timing specifications.
Table 4–74. EP1AGX90 Row Pins Output Timing Parameters (Part 1 of 3)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Drive
Strength
4 mA
8 mA
12 mA
3.3-V
LVCMOS
4 mA
3.3-V
LVCMOS
8 mA
2.5 V
4 mA
2.5 V
2.5 V
8 mA
12 mA
Arria GX Device Handbook, Volume 1
Fast Model
Clock
Commercial
–6 Speed
Grade
Units
Industrial
Parameter
GCLK
tCO
3.170
3.170
7.382
ns
GCLK PLL
tCO
1.099
1.099
3.238
ns
GCLK
tCO
3.042
3.042
6.742
ns
GCLK PLL
tCO
0.971
0.971
2.598
ns
GCLK
tCO
2.986
2.986
6.705
ns
GCLK PLL
tCO
0.915
0.915
2.561
ns
GCLK
tCO
3.042
3.042
6.742
ns
GCLK PLL
tCO
0.971
0.971
2.598
ns
GCLK
tCO
2.936
2.936
6.436
ns
GCLK PLL
tCO
0.865
0.865
2.292
ns
GCLK
tCO
3.025
3.025
6.716
ns
GCLK PLL
tCO
0.954
0.954
2.572
ns
GCLK
tCO
2.922
2.922
6.458
ns
GCLK PLL
tCO
0.851
0.851
2.314
ns
GCLK
tCO
2.903
2.903
6.344
ns
GCLK PLL
tCO
0.832
0.832
2.200
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–73
Table 4–74. EP1AGX90 Row Pins Output Timing Parameters (Part 2 of 3)
I/O Standard
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
Clock
2 mA
GCLK
Industrial
Commercial
–6 Speed
Grade
tCO
3.087
3.087
7.723
ns
GCLK PLL
tCO
1.034
1.034
3.605
ns
tCO
3.076
3.076
6.944
ns
tCO
1.023
1.023
2.826
ns
GCLK
tCO
2.965
2.965
6.643
ns
GCLK PLL
tCO
0.912
0.912
2.525
ns
GCLK
tCO
2.934
2.934
6.529
ns
GCLK PLL
tCO
0.881
0.881
2.411
ns
GCLK
tCO
3.047
3.047
7.222
ns
GCLK PLL
tCO
0.994
0.994
3.104
ns
8 mA
2 mA
GCLK
tCO
2.940
2.940
6.621
ns
GCLK PLL
tCO
0.887
0.887
2.503
ns
GCLK
tCO
2.890
2.890
6.294
ns
GCLK PLL
tCO
0.824
0.824
2.157
ns
GCLK
tCO
2.866
2.866
6.218
ns
GCLK PLL
tCO
0.800
0.800
2.081
ns
GCLK
tCO
2.832
2.832
6.087
ns
GCLK PLL
tCO
0.766
0.766
1.950
ns
4 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-18
CLASS I
4 mA
SSTL-18
CLASS I
6 mA
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS I
4 mA
Units
GCLK
6 mA
8 mA
Parameter
GCLK PLL
4 mA
SSTL-2
CLASS I
© December 2009
Fast Model
Drive
Strength
GCLK
tCO
2.872
2.872
6.227
ns
GCLK PLL
tCO
0.819
0.819
2.109
ns
GCLK
tCO
2.878
2.878
6.162
ns
GCLK PLL
tCO
0.800
0.800
2.006
ns
GCLK
tCO
2.854
2.854
6.145
ns
GCLK PLL
tCO
0.776
0.776
1.989
ns
GCLK
tCO
2.857
2.857
6.124
ns
GCLK PLL
tCO
0.779
0.779
1.968
ns
GCLK
tCO
2.853
2.853
6.137
ns
GCLK PLL
tCO
0.800
0.800
2.019
ns
GCLK
tCO
2.858
2.858
6.107
ns
GCLK PLL
tCO
0.780
0.780
1.951
ns
GCLK
tCO
2.840
2.840
6.103
ns
GCLK PLL
tCO
0.762
0.762
1.947
ns
GCLK
tCO
2.844
2.844
6.092
ns
GCLK PLL
tCO
0.766
0.766
1.936
ns
GCLK
tCO
2.835
2.835
6.091
ns
GCLK PLL
tCO
0.757
0.757
1.935
ns
GCLK
tCO
2.852
2.852
6.114
ns
GCLK PLL
tCO
0.799
0.799
1.996
ns
Altera Corporation
Arria GX Device Handbook, Volume 1
4–74
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–74. EP1AGX90 Row Pins Output Timing Parameters (Part 3 of 3)
Fast Model
Drive
Strength
Clock
1.5-V HSTL
CLASS I
6 mA
GCLK
1.5-V HSTL
CLASS I
8 mA
I/O Standard
LVDS
—
Industrial
Commercial
–6 Speed
Grade
tCO
2.857
2.857
6.106
ns
GCLK PLL
tCO
0.779
0.779
1.950
ns
GCLK
tCO
2.842
2.842
6.098
ns
GCLK PLL
tCO
0.764
0.764
1.942
ns
GCLK
tCO
2.898
2.898
6.265
ns
GCLK PLL
tCO
0.831
0.831
2.129
ns
Units
Parameter
Units
Table 4–75 lists I/O timing specifications.
Table 4–75. EP1AGX90 Column Pins Output Timing Parameters (Part 1 of 4)
I/O Standard
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
3.3-V LVTTL
Fast Corner
Drive
Strength
Clock
4 mA
GCLK
8 mA
12 mA
16 mA
20 mA
24 mA
3.3-V
LVCMOS
4 mA
3.3-V
LVCMOS
8 mA
3.3-V
LVCMOS
12 mA
3.3-V
LVCMOS
16 mA
3.3-V
LVCMOS
20 mA
3.3-V
LVCMOS
24 mA
2.5 V
4 mA
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
3.141
3.141
7.164
ns
GCLK PLL
tCO
1.077
1.077
3.029
ns
Parameter
GCLK
tCO
2.996
2.996
6.792
ns
GCLK PLL
tCO
0.932
0.932
2.657
ns
GCLK
tCO
2.929
2.929
6.792
ns
GCLK PLL
tCO
0.865
0.865
2.657
ns
GCLK
tCO
2.903
2.903
6.623
ns
GCLK PLL
tCO
0.839
0.839
2.488
ns
GCLK
tCO
2.881
2.881
6.498
ns
GCLK PLL
tCO
0.817
0.817
2.363
ns
GCLK
tCO
2.874
2.874
6.500
ns
GCLK PLL
tCO
0.810
0.810
2.365
ns
GCLK
tCO
2.996
2.996
6.792
ns
GCLK PLL
tCO
0.932
0.932
2.657
ns
GCLK
tCO
2.904
2.904
6.497
ns
GCLK PLL
tCO
0.840
0.840
2.362
ns
GCLK
tCO
2.876
2.876
6.419
ns
GCLK PLL
tCO
0.812
0.812
2.284
ns
GCLK
tCO
2.883
2.883
6.387
ns
GCLK PLL
tCO
0.819
0.819
2.252
ns
GCLK
tCO
2.870
2.870
6.369
ns
GCLK PLL
tCO
0.806
0.806
2.234
ns
GCLK
tCO
2.859
2.859
6.347
ns
GCLK PLL
tCO
0.795
0.795
2.212
ns
GCLK
tCO
2.958
2.958
6.824
ns
GCLK PLL
tCO
0.894
0.894
2.689
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–75
Table 4–75. EP1AGX90 Column Pins Output Timing Parameters (Part 2 of 4)
I/O Standard
2.5 V
2.5 V
2.5 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.5 V
1.5 V
1.5 V
1.5 V
Clock
8 mA
GCLK
Industrial
Commercial
–6 Speed
Grade
tCO
2.906
2.906
6.562
ns
GCLK PLL
tCO
0.842
0.842
2.427
ns
tCO
2.885
2.885
6.445
ns
tCO
0.821
0.821
2.310
ns
GCLK
tCO
2.867
2.867
6.371
ns
GCLK PLL
tCO
0.803
0.803
2.236
ns
GCLK
tCO
2.998
2.998
7.816
ns
GCLK PLL
tCO
0.934
0.934
3.681
ns
GCLK
tCO
3.003
3.003
7.042
ns
GCLK PLL
tCO
0.939
0.939
2.907
ns
2 mA
4 mA
GCLK
tCO
2.927
2.927
6.778
ns
GCLK PLL
tCO
0.863
0.863
2.643
ns
GCLK
tCO
2.929
2.929
6.687
ns
GCLK PLL
tCO
0.865
0.865
2.552
ns
GCLK
tCO
2.883
2.883
6.610
ns
GCLK PLL
tCO
0.819
0.819
2.475
ns
GCLK
tCO
2.884
2.884
6.553
ns
GCLK PLL
tCO
0.820
0.820
2.418
ns
6 mA
8 mA
10 mA
12 mA
GCLK
tCO
2.978
2.978
7.346
ns
GCLK PLL
tCO
0.914
0.914
3.211
ns
GCLK
tCO
2.914
2.914
6.777
ns
GCLK PLL
tCO
0.850
0.850
2.642
ns
GCLK
tCO
2.917
2.917
6.659
ns
GCLK PLL
tCO
0.853
0.853
2.524
ns
GCLK
tCO
2.876
2.876
6.606
ns
GCLK PLL
tCO
0.812
0.812
2.471
ns
2 mA
4 mA
6 mA
8 mA
SSTL-2
CLASS I
12 mA
SSTL-2
CLASS II
16 mA
SSTL-2
CLASS II
20 mA
SSTL-2
CLASS II
24 mA
SSTL-18
CLASS I
4 mA
Units
GCLK
16 mA
8 mA
Parameter
GCLK PLL
12 mA
SSTL-2
CLASS I
© December 2009
Fast Corner
Drive
Strength
GCLK
tCO
2.859
2.859
6.381
ns
GCLK PLL
tCO
0.797
0.797
2.250
ns
GCLK
tCO
2.842
2.842
6.331
ns
GCLK PLL
tCO
0.780
0.780
2.200
ns
GCLK
tCO
2.820
2.820
6.258
ns
GCLK PLL
tCO
0.758
0.758
2.127
ns
GCLK
tCO
2.821
2.821
6.245
ns
GCLK PLL
tCO
0.759
0.759
2.114
ns
GCLK
tCO
2.817
2.817
6.243
ns
GCLK PLL
tCO
0.755
0.755
2.112
ns
GCLK
tCO
2.858
2.858
6.356
ns
GCLK PLL
tCO
0.794
0.794
2.221
ns
Altera Corporation
Arria GX Device Handbook, Volume 1
4–76
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–75. EP1AGX90 Column Pins Output Timing Parameters (Part 3 of 4)
Fast Corner
Drive
Strength
Clock
SSTL-18
CLASS I
6 mA
GCLK
SSTL-18
CLASS I
8 mA
SSTL-18
CLASS I
10 mA
SSTL-18
CLASS I
12 mA
SSTL-18
CLASS II
8 mA
SSTL-18
CLASS II
16 mA
SSTL-18
CLASS II
18 mA
SSTL-18
CLASS II
20 mA
1.8-V HSTL
CLASS I
4 mA
1.8-V HSTL
CLASS I
6 mA
1.8-V HSTL
CLASS I
8 mA
1.8-V HSTL
CLASS I
10 mA
1.8-V HSTL
CLASS I
12 mA
1.8-V HSTL
CLASS II
16 mA
1.8-V HSTL
CLASS II
18 mA
1.8-V HSTL
CLASS II
20 mA
1.5-V HSTL
CLASS I
4 mA
1.5-V HSTL
CLASS I
6 mA
1.5-V HSTL
CLASS I
8 mA
I/O Standard
Arria GX Device Handbook, Volume 1
Industrial
Commercial
–6 Speed
Grade
tCO
2.860
2.860
6.313
ns
GCLK PLL
tCO
0.798
0.798
2.182
ns
Parameter
Units
GCLK
tCO
2.839
2.839
6.294
ns
GCLK PLL
tCO
0.777
0.777
2.163
ns
GCLK
tCO
2.844
2.844
6.292
ns
GCLK PLL
tCO
0.782
0.782
2.161
ns
GCLK
tCO
2.838
2.838
6.278
ns
GCLK PLL
tCO
0.776
0.776
2.147
ns
GCLK
tCO
2.827
2.827
6.244
ns
GCLK PLL
tCO
0.765
0.765
2.113
ns
GCLK
tCO
2.839
2.839
6.222
ns
GCLK PLL
tCO
0.777
0.777
2.091
ns
GCLK
tCO
2.835
2.835
6.230
ns
GCLK PLL
tCO
0.773
0.773
2.099
ns
GCLK
tCO
2.835
2.835
6.228
ns
GCLK PLL
tCO
0.773
0.773
2.097
ns
GCLK
tCO
2.861
2.861
6.287
ns
GCLK PLL
tCO
0.797
0.797
2.152
ns
GCLK
tCO
2.864
2.864
6.268
ns
GCLK PLL
tCO
0.802
0.802
2.137
ns
GCLK
tCO
2.842
2.842
6.257
ns
GCLK PLL
tCO
0.780
0.780
2.126
ns
GCLK
tCO
2.846
2.846
6.263
ns
GCLK PLL
tCO
0.784
0.784
2.132
ns
GCLK
tCO
2.838
2.838
6.256
ns
GCLK PLL
tCO
0.776
0.776
2.125
ns
GCLK
tCO
2.821
2.821
6.020
ns
GCLK PLL
tCO
0.759
0.759
1.889
ns
GCLK
tCO
2.823
2.823
6.031
ns
GCLK PLL
tCO
0.761
0.761
1.900
ns
GCLK
tCO
2.823
2.823
6.040
ns
GCLK PLL
tCO
0.761
0.761
1.909
ns
GCLK
tCO
2.861
2.861
6.286
ns
GCLK PLL
tCO
0.797
0.797
2.151
ns
GCLK
tCO
2.863
2.863
6.260
ns
GCLK PLL
tCO
0.801
0.801
2.129
ns
GCLK
tCO
2.845
2.845
6.262
ns
GCLK PLL
tCO
0.783
0.783
2.131
ns
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–77
Table 4–75. EP1AGX90 Column Pins Output Timing Parameters (Part 4 of 4)
Fast Corner
Drive
Strength
Clock
1.5-V HSTL
CLASS I
10 mA
GCLK
1.5-V HSTL
CLASS I
12 mA
1.5-V HSTL
CLASS II
16 mA
1.5-V HSTL
CLASS II
18 mA
1.5-V HSTL
CLASS II
20 mA
I/O Standard
3.3-V PCI
3.3-V PCI-X
LVDS
Industrial
Commercial
–6 Speed
Grade
tCO
2.845
2.845
6.264
ns
GCLK PLL
tCO
0.783
0.783
2.133
ns
Parameter
Units
GCLK
tCO
2.839
2.839
6.262
ns
GCLK PLL
tCO
0.777
0.777
2.131
ns
GCLK
tCO
2.826
2.826
6.074
ns
GCLK PLL
tCO
0.764
0.764
1.943
ns
GCLK
tCO
2.829
2.829
6.084
ns
GCLK PLL
tCO
0.767
0.767
1.953
ns
GCLK
tCO
2.831
2.831
6.097
ns
GCLK PLL
tCO
0.769
0.769
1.966
ns
GCLK
tCO
2.987
2.987
6.414
ns
GCLK PLL
tCO
0.923
0.923
2.279
ns
GCLK
tCO
2.987
2.987
6.414
ns
GCLK PLL
tCO
0.923
0.923
2.279
ns
GCLK
tCO
3.835
3.835
7.541
ns
GCLK PLL
tCO
1.769
1.769
3.404
ns
—
—
—
Table 4–76 through Table 4–77 list the EP1AGX90 regional clock (RCLK) adder values
that should be added to the GCLK values. These adder values are used to determine
I/O timing when the I/O pin is driven using the regional clock. This applies for all
I/O standards supported by Arria GX with general purpose I/O pins.
Table 4–76 lists row pin delay adders when using the regional clock in Arria GX
devices.
Table 4–76. EP1AGX90 Row Pin Delay Adders for Regional Clock
Fast Corner
Parameter
© December 2009
–6 Speed Grade
Units
0.175
0.418
ns
0.007
0.007
0.015
ns
RCLK output adder
–0.175
–0.175
–0.418
ns
RCLK PLL output adder
–0.007
–0.007
–0.015
ns
Industrial
Commercial
RCLK input adder
0.175
RCLK PLL input adder
Altera Corporation
Arria GX Device Handbook, Volume 1
4–78
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–77 lists column pin delay adders when using the regional clock in Arria GX
devices.
Table 4–77. EP1AGX90 Column Pin Delay Adders for Regional Clock
Fast Corner
Parameter
–6 Speed Grade
Units
0.138
0.354
ns
–1.697
–1.697
–3.607
ns
RCLK output adder
–0.138
–0.138
–0.353
ns
RCLK PLL output adder
1.966
1.966
5.188
ns
Industrial
Commercial
RCLK input adder
0.138
RCLK PLL input adder
Dedicated Clock Pin Timing
Table 4–79 through Table 4–98 list clock pin timing for Arria GX devices when the
clock is driven by the global clock, regional clock, periphery clock, and a PLL.
Table 4–78 lists Arria GX clock timing parameters.
Table 4–78. Arria GX Clock Timing Parameters
Symbol
Parameter
tCIN
Delay from clock pad to I/O input register
tCOUT
Delay from clock pad to I/O output register
tPLLCIN
Delay from PLL inclk pad to I/O input register
tPLLCOUT
Delay from PLL inclk pad to I/O output register
EP1AGX20 Clock Timing Parameters
Table 4–79 through Table 4–80 list the GCLK clock timing parameters for EP1AGX20
devices.
Table 4–79 lists clock timing specifications.
Table 4–79. EP1AGX20 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.394
3.161
ns
1.399
1.399
3.155
ns
tpllcin
–0.027
–0.027
0.091
ns
tpllcout
–0.022
–0.022
0.085
ns
Industrial
Commercial
tcin
1.394
tcout
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–79
Table 4–80 lists clock timing specifications.
Table 4–80. EP1AGX20 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.655
3.726
ns
1.655
1.655
3.726
ns
tPLLCIN
0.236
0.236
0.655
ns
tPLLCOUT
0.236
0.236
0.655
ns
Industrial
Commercial
tCIN
1.655
tCOUT
Table 4–81 through Table 4–82 list the RCLK clock timing parameters for EP1AGX20
devices.
Table 4–81 lists clock timing specifications.
Table 4–81. EP1AGX20 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.283
2.901
ns
1.288
1.288
2.895
ns
tPLLCIN
–0.034
–0.034
0.077
ns
tPLLCOUT
–0.029
–0.029
0.071
ns
Industrial
Commercial
tCIN
1.283
tCOUT
Table 4–82 lists clock timing specifications.
Table 4–82. EP1AGX20 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.569
3.487
ns
1.569
1.569
3.487
ns
tPLLCIN
0.278
0.278
0.706
ns
tPLLCOUT
0.278
0.278
0.706
ns
Industrial
Commercial
tCIN
1.569
tCOUT
EP1AGX35 Clock Timing Parameters
Table 4–83 through Table 4–84 list the GCLK clock timing parameters for EP1AGX35
devices.
Table 4–83 lists clock timing specifications.
Table 4–83. EP1AGX35 Row Pins Global Clock Timing Parameters (Part 1 of 2)
Fast Model
Parameter
© December 2009
–6 Speed Grade
Units
1.394
3.161
ns
1.399
3.155
ns
Industrial
Commercial
tCIN
1.394
tCOUT
1.399
Altera Corporation
Arria GX Device Handbook, Volume 1
4–80
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–83. EP1AGX35 Row Pins Global Clock Timing Parameters (Part 2 of 2)
Fast Model
Parameter
–6 Speed Grade
Units
–0.027
0.091
ns
–0.022
0.085
ns
–6 Speed Grade
Units
Industrial
Commercial
tPLLCIN
–0.027
tPLLCOUT
–0.022
Table 4–84 lists clock timing specifications.
Table 4–84. EP1AGX35 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
Industrial
Commercial
tCIN
1.655
1.655
3.726
ns
tCOUT
1.655
1.655
3.726
ns
tPLLCIN
0.236
0.236
0.655
ns
tPLLCOUT
0.236
0.236
0.655
ns
Table 4–85 through Table 4–86 list the RCLK clock timing parameters for EP1AGX35
devices.
Table 4–85 lists clock timing specifications.
Table 4–85. EP1AGX35 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.283
2.901
ns
1.288
1.288
2.895
ns
tPLLCIN
–0.034
–0.034
0.077
ns
tPLLCOUT
–0.029
–0.029
0.071
ns
Industrial
Commercial
tCIN
1.283
tCOUT
Table 4–86 lists clock timing specifications.
Table 4–86. EP1AGX35 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.569
3.487
ns
1.569
3.487
ns
0.278
0.278
0.706
ns
0.278
0.278
0.706
ns
Industrial
Commercial
tCIN
1.569
tCOUT
1.569
tPLLCIN
tPLLCOUT
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–81
EP1AGX50 Clock Timing Parameters
Table 4–87 through Table 4–88 list the GCLK clock timing parameters for EP1AGX50
devices.
Table 4–87 lists clock timing specifications.
Table 4–87. EP1AGX50 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.529
3.587
ns
1.534
1.534
3.581
ns
tPLLCIN
–0.024
–0.024
0.181
ns
tPLLCOUT
–0.019
–0.019
0.175
ns
–6 Speed Grade
Units
Industrial
Commercial
tCIN
1.529
tCOUT
Table 4–88 lists clock timing specifications.
Table 4–88. EP1AGX50 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
Industrial
Commercial
tCIN
1.793
1.793
4.165
ns
tCOUT
1.793
1.793
4.165
ns
tPLLCIN
0.238
0.238
0.758
ns
tPLLCOUT
0.238
0.238
0.758
ns
Table 4–89 through Table 4–90 list the RCLK clock timing parameters for EP1AGX50
devices.
Table 4–89 lists clock timing specifications.
Table 4–89. EP1AGX50 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
© December 2009
–6 Speed Grade
Units
1.396
3.287
ns
1.401
1.401
3.281
ns
tPLLCIN
–0.017
–0.017
0.195
ns
tPLLCOUT
–0.012
–0.012
0.189
ns
Industrial
Commercial
tCIN
1.396
tCOUT
Altera Corporation
Arria GX Device Handbook, Volume 1
4–82
Chapter 4: DC and Switching Characteristics
Typical Design Performance
Table 4–90 lists clock timing specifications.
Table 4–90. EP1AGX50 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.653
3.841
ns
1.651
1.651
3.839
ns
tPLLCIN
0.245
0.245
0.755
ns
tPLLCOUT
0.245
0.245
0.755
ns
Industrial
Commercial
tCIN
1.653
tCOUT
EP1AGX60 Clock Timing Parameters
Table 4–91 to Table 4–92 on page 4–82 list the GCLK clock timing parameters for
EP1AGX60 devices.
Table 4–91 lists clock timing specifications.
Table 4–91. EP1AGX60 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.531
3.593
ns
1.536
1.536
3.587
ns
tPLLCIN
–0.023
–0.023
0.188
ns
tPLLCOUT
–0.018
–0.018
0.182
ns
–6 Speed Grade
Units
Industrial
Commercial
tCIN
1.531
tCOUT
Table 4–92 lists clock timing specifications.
Table 4–92. EP1AGX60 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
Industrial
Commercial
tCIN
1.792
1.792
4.165
ns
tCOUT
1.792
1.792
4.165
ns
tPLLCIN
0.238
0.238
0.758
ns
tPLLCOUT
0.238
0.238
0.758
ns
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Typical Design Performance
4–83
Table 4–93 through Table 4–94 list the RCLK clock timing parameters for EP1AGX60
devices.
Table 4–93 lists clock timing specifications.
Table 4–93. EP1AGX60 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
tCIN
Industrial
Commercial
1.382
1.382
–6 Speed Grade
Units
3.268
ns
tCOUT
1.387
1.387
3.262
ns
tPLLCIN
–0.031
–0.031
0.174
ns
tPLLCOUT
–0.026
–0.026
0.168
ns
Table 4–94 lists clock timing specifications.
Table 4–94. EP1AGX60 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.649
3.835
ns
1.651
1.651
3.839
ns
tPLLCIN
0.245
0.245
0.755
ns
tPLLCOUT
0.245
0.245
0.755
ns
Industrial
Commercial
tCIN
1.649
tCOUT
EP1AGX90 Clock Timing Parameters
Table 4–95 through Table 4–96 list the GCLK clock timing parameters for EP1AGX90
devices.
Table 4–95 lists clock timing specifications.
Table 4–95. EP1AGX90 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
© December 2009
–6 Speed Grade
Units
1.630
3.799
ns
1.635
1.635
3.793
ns
tPLLCIN
–0.422
–0.422
–0.310
ns
tPLLCOUT
–0.417
–0.417
–0.316
ns
Industrial
Commercial
tCIN
1.630
tCOUT
Altera Corporation
Arria GX Device Handbook, Volume 1
4–84
Chapter 4: DC and Switching Characteristics
Block Performance
Table 4–96 lists clock timing specifications.
Table 4–96. EP1AGX90 Row Pins Global Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.904
4.376
ns
1.904
1.904
4.376
ns
tPLLCIN
–0.153
–0.153
0.254
ns
tPLLCOUT
–0.153
–0.153
0.254
ns
Industrial
Commercial
tCIN
1.904
tCOUT
Table 4–97 through Table 4–98 list the RCLK clock timing parameters for EP1AGX90
devices.
Table 4–97 lists clock timing specifications.
Table 4–97. EP1AGX90 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.462
3.407
ns
1.467
1.467
3.401
ns
tPLLCIN
–0.430
–0.430
–0.322
ns
tPLLCOUT
–0.425
–0.425
–0.328
ns
Industrial
Commercial
tCIN
1.462
tCOUT
Table 4–98 lists clock timing specifications.
Table 4–98. EP1AGX90 Row Pins Regional Clock Timing Parameters
Fast Model
Parameter
–6 Speed Grade
Units
1.760
4.011
ns
1.760
1.760
4.011
ns
tPLLCIN
–0.118
–0.118
0.303
ns
tPLLCOUT
–0.118
–0.118
0.303
ns
Industrial
Commercial
tCIN
1.760
tCOUT
Block Performance
Table 4–99 shows the Arria GX performance for some common designs. All
performance values were obtained with the Quartus II software compilation of library
of parameterized modules (LPM) or MegaCore functions for finite impulse response
(FIR) and fast Fourier transform (FFT) designs.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Block Performance
4–85
Table 4–99 lists performance notes.
Table 4–99. Arria GX Performance Notes
Resources Used
Applications
LE
TriMatrix Memory
M512 block
TriMatrix Memory
M4K block
TriMatrix Memory
MegaRAM block
© December 2009
Performance
ALUTs
TriMatrix
Memory Blocks
DSP Blocks
–6 Speed Grade
16-to-1
multiplexer
5
0
0
168.41
32-to-1
multiplexer
11
0
0
334.11
16-bit counter
16
0
0
374.0
64-bit counter
64
0
0
168.41
Simple dual-port
RAM 32 x 18 bit
0
1
0
348.0
FIFO 32 x 18 bit
0
1
0
333.22
Simple dual-port
RAM 128 x 36 bit
0
1
0
344.71
True dual-port
RAM 128 x 18 bit
0
1
0
348.0
Single port RAM
4K x 144 bit
0
2
0
244.0
Simple dual-port
RAM 4K x 144 bit
0
1
0
292.0
True dual-port
RAM 4K x 144 bit
0
2
0
244.0
Single port RAM
8K x 72 bit
0
1
0
247.0
Simple dual-port
RAM 8K x 72 bit
0
1
0
292.0
Single port RAM
16K x 36 bit
0
1
0
254.0
Simple dual-port
RAM 16K x 36 bit
0
1
0
292.0
True dual-port
RAM 16K x 36 bit
0
1
0
251.0
Single port RAM
32K x 18 bit
0
1
0
317.36
Simple dual-port
RAM 32K x 18 bit
0
1
0
292.0
True dual-port
RAM 32K x 18 bit
0
1
0
251.0
Single port RAM
64K x 9 bit
0
1
0
254.0
Simple dual-port
RAM 64K x 9 bit
0
1
0
292.0
True dual-port
RAM 64K x 9 bit
0
1
0
251.0
Altera Corporation
Arria GX Device Handbook, Volume 1
4–86
Chapter 4: DC and Switching Characteristics
IOE Programmable Delay
Table 4–99. Arria GX Performance Notes
Resources Used
Applications
DSP block
Larger Designs
Performance
ALUTs
TriMatrix
Memory Blocks
DSP Blocks
–6 Speed Grade
9 x 9-bit
multiplier
0
0
1
335.35
18 x 18-bit
multiplier
0
0
2
285.0
18 x 18-bit
multiplier
0
0
4
335.35
36 x 36-bit
multiplier
0
0
8
174.4
36 x 36-bit
multiplier
0
0
8
285.0
18-bit 4-tap FIR
filter
0
0
8
163.0
8-bit 16-tap
parallel FIR filter
0
0
4
163.0
IOE Programmable Delay
For IOE programmable delay, refer to Table 4–100 through Table 4–101.
Table 4–100 lists IOE programmable delays.
Table 4–100. Arria GX IOE Programmable Delay on Row Pins
Fast Model
–6 Speed Grade
Parameter
Paths Affected
Available
Settings
Industrial
Commercial
Units
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Input delay
from pin to
internal cells
Pad to I/O dataout
to core
8
0
1.782
0
1.782
0
4.124
ns
Input delay
from pin to
input register
Pad to I/O input
register
64
0
2.054
0
2.054
0
4.689
ns
Delay from
output
register to
output pin
I/O output register
to pad
2
0
0.332
0
0.332
0
0.717
ns
Output
enable pin
delay
txz/tzx
2
0
0.32
0
0.32
0
0.693
ns
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
4–87
Table 4–101 lists IOE programmable delays.
Table 4–101. Arria GX IOE Programmable Delay on Column Pins
Fast Model
–6 Speed Grade
Parameter
Input delay
from pin to
internal cells
Paths Affected
Available
Settings
Pad to I/O dataout to
core
Pad to I/O input register
Input delay
from pin to
input register
Industrial
Commercial
Units
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Min
Offset
Max
Offset
8
0
1.781
0
1.781
0
4.132
ns
64
0
2.053
0
2.053
0
4.697
ns
Delay from
output
register to
output pin
I/O output register to
pad
2
0
0.332
0
0.332
0
0.717
ns
Output
enable pin
delay
txz/tzx
2
0
0.32
0
0.32
0
0.693
ns
Maximum Input and Output Clock Toggle Rate
Maximum clock toggle rate is defined as the maximum frequency achievable for a
clock type signal at an I/O pin. The I/O pin can be a regular I/O pin or a dedicated
clock I/O pin.
The maximum clock toggle rate is different from the maximum data bit rate. If the
maximum clock toggle rate on a regular I/O pin is 300 MHz, the maximum data bit
rate for dual data rate (DDR) could be potentially as high as 600 Mbps on the same
I/O pin.
Table 4–105, Table 4–106, and Table 4–107 provide output toggle rates at the default
capacitive loading. Use the Quartus II software to obtain output toggle rates at loads
different from the default capacitive loading.
Table 4–102 shows the maximum input clock toggle rates for Arria GX device column
I/O pins.
Table 4–102. Arria GX Maximum Input Toggle Rate for Column I/O Pins
I/O Standards
© December 2009
–6 Speed Grade
Units
3.3-V LVTTL
420
MHz
3.3-V LVCMOS
420
MHz
2.5 V
420
MHz
1.8 V
420
MHz
1.5 V
420
MHz
SSTL-2 CLASS I
467
MHz
SSTL-2 CLASS II
467
MHz
SSTL-18 CLASS I
467
MHz
Altera Corporation
Arria GX Device Handbook, Volume 1
4–88
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
Table 4–102. Arria GX Maximum Input Toggle Rate for Column I/O Pins
I/O Standards
–6 Speed Grade
Units
SSTL-18 CLASS II
467
MHz
1.8-V HSTL CLASS I
467
MHz
1.8-V HSTL CLASS II
467
MHz
1.5-V HSTL CLASS I
467
MHz
1.5-V HSTL CLASS II
467
MHz
3.3-V PCI
420
MHz
3.3-V PCI-X
420
MHz
Table 4–103 shows the maximum input clock toggle rates for Arria GX device row I/O
pins.
Table 4–103. Arria GX Maximum Input Toggle Rate for Row I/O Pins
I/O Standards
–6 Speed Grade
Units
3.3-V LVTTL
420
MHz
3.3-V LVCMOS
420
MHz
2.5 V
420
MHz
1.8 V
420
MHz
1.5 V
420
MHz
SSTL-2 CLASS I
467
MHz
SSTL-2 CLASS II
467
MHz
SSTL-18 CLASS I
467
MHz
SSTL-18 CLASS II
467
MHz
1.8-V HSTL CLASS I
467
MHz
1.8-V HSTL CLASS II
467
MHz
1.5-V HSTL CLASS I
467
MHz
1.5-V HSTL CLASS II
467
MHz
LVDS
392
MHz
Table 4–104 shows the maximum input clock toggle rates for Arria GX device
dedicated clock pins.
Table 4–104. Arria GX Maximum Input Clock Rate for Dedicated Clock Pins (Part 1 of 2)
I/O Standards
–6 Speed Grade
Units
3.3-V LVTTL
373
MHz
3.3-V LVCMOS
373
MHz
2.5 V
373
MHz
1.8 V
373
MHz
1.5 V
373
MHz
SSTL-2 CLASS I
467
MHz
SSTL-2 CLASS II
467
MHz
3.3-V PCI
373
MHz
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
4–89
Table 4–104. Arria GX Maximum Input Clock Rate for Dedicated Clock Pins (Part 2 of 2)
I/O Standards
–6 Speed Grade
Units
3.3-V PCI-X
373
MHz
SSTL-18 CLASS I
467
MHz
SSTL-18 CLASS II
467
MHz
1.8-V HSTL CLASS I
467
MHz
1.8-V HSTL CLASS II
467
MHz
1.5-V HSTL CLASS I
467
MHz
1.5-V HSTL CLASS II
467
MHz
1.2-V HSTL
233
MHz
DIFFERENTAL SSTL-2
467
MHz
DIFFERENTIAL 2.5-V
SSTL CLASS II
467
MHz
DIFFERENTIAL 1.8-V
SSTL CLASS I
467
MHz
DIFFERENTIAL 1.8-V
SSTL CLASS II
467
MHz
DIFFERENTIAL 1.8-V
HSTL CLASS I
467
MHz
DIFFERENTIAL 1.8-V
HSTL CLASS II
467
MHz
DIFFERENTIAL 1.5-V
HSTL CLASS I
467
MHz
DIFFERENTIAL 1.5-V
HSTL CLASS II
467
MHz
DIFFERENTIAL 1.2-V
HSTL
233
MHz
LVDS
640
MHz
LVDS (1)
373
MHz
Note to Table 4–104:
(1) This set of numbers refers to the VIO dedicated input clock pins.
Table 4–105 shows the maximum output clock toggle rates for Arria GX device
column I/O pins.
Table 4–105. Arria GX Maximum Output Toggle Rate for Column I/O Pins (Part 1 of 3)
I/O Standards
3.3-V LVTTL
© December 2009
Altera Corporation
Drive Strength
–6 Speed Grade
Units
4 mA
196
MHz
8 mA
303
MHz
12 mA
393
MHz
16 mA
486
MHz
20 mA
570
MHz
24 mA
626
MHz
Arria GX Device Handbook, Volume 1
4–90
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
Table 4–105. Arria GX Maximum Output Toggle Rate for Column I/O Pins (Part 2 of 3)
I/O Standards
3.3-V LVCMOS
2.5 V
1.8 V
1.5 V
SSTL-2 CLASS I
SSTL-2 CLASS II
SSTL-18 CLASS I
SSTL-18 CLASS II
1.8-V HSTL CLASS I
Arria GX Device Handbook, Volume 1
Drive Strength
–6 Speed Grade
Units
4 mA
215
MHz
8 mA
411
MHz
12 mA
626
MHz
16 mA
819
MHz
20 mA
874
MHz
24 mA
934
MHz
4 mA
168
MHz
8 mA
355
MHz
12 mA
514
MHz
16 mA
766
MHz
2 mA
97
MHz
4 mA
215
MHz
6 mA
336
MHz
8 mA
486
MHz
10 mA
706
MHz
12 mA
925
MHz
2 mA
168
MHz
4 mA
303
MHz
6 mA
350
MHz
8 mA
392
MHz
8 mA
280
MHz
12 mA
327
MHz
16 mA
280
MHz
20 mA
327
MHz
24 mA
327
MHz
4 mA
140
MHz
6 mA
186
MHz
8 mA
280
MHz
10 mA
373
MHz
12 mA
373
MHz
8 mA
140
MHz
16 mA
327
MHz
18 mA
373
MHz
20 mA
420
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
561
MHz
12 mA
607
MHz
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
4–91
Table 4–105. Arria GX Maximum Output Toggle Rate for Column I/O Pins (Part 3 of 3)
I/O Standards
Drive Strength
–6 Speed Grade
Units
16 mA
420
MHz
18 mA
467
MHz
20 mA
514
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
607
MHz
12 mA
654
MHz
16 mA
514
MHz
18 mA
561
MHz
20 mA
561
MHz
3.3-V PCI
—
626
MHz
3.3-V PCI-X
—
626
MHz
1.8-V HSTL CLASS II
1.5-V HSTL CLASS I
1.5-V HSTL CLASS II
Table 4–106 shows the maximum output clock toggle rates for Arria GX device row
I/O pins.
Table 4–106. Arria GX Maximum Output Toggle Rate for Row I/O Pins
I/O Standards
3.3-V LVTTL
3.3-V LVCMOS
2.5 V
1.8 V
1.5 V
SSTL-2 CLASS I
SSTL-2 CLASS II
SSTL-18 CLASS I
© December 2009
Altera Corporation
Drive Strength
–6 Speed Grade
Units
4 mA
196
MHz
8 mA
303
MHz
12 mA
393
MHz
4 mA
215
MHz
8 mA
411
MHz
4 mA
168
MHz
8 mA
355
MHz
12 mA
514
MHz
2 mA
97
MHz
4 mA
215
MHz
6 mA
336
MHz
8 mA
486
MHz
2 mA
168
MHz
4 mA
303
MHz
8 mA
280
MHz
12 mA
327
MHz
16 mA
280
MHz
4 mA
140
MHz
6 mA
186
MHz
8 mA
280
MHz
10 mA
373
MHz
Arria GX Device Handbook, Volume 1
4–92
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
Table 4–106. Arria GX Maximum Output Toggle Rate for Row I/O Pins
I/O Standards
1.8-V HSTL CLASS I
1.5-V HSTL CLASS I
LVDS
Drive Strength
–6 Speed Grade
Units
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
561
MHz
12 mA
607
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
—
598
MHz
Table 4–107 lists maximum output clock rate for dedicated clock pins.
Table 4–107. Arria GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 1 of 4)
I/O Standards
3.3-V LVTTL
3.3-V LVCMOS
2.5 V
1.8 V
1.5 V
Arria GX Device Handbook, Volume 1
Drive Strength
–6 Speed Grade
Units
4 mA
196
MHz
8 mA
303
MHz
12 mA
393
MHz
16 mA
486
MHz
20 mA
570
MHz
24 mA
626
MHz
4 mA
215
MHz
8 mA
411
MHz
12 mA
626
MHz
16 mA
819
MHz
20 mA
874
MHz
24 mA
934
MHz
4 mA
168
MHz
8 mA
355
MHz
12 mA
514
MHz
16 mA
766
MHz
2 mA
97
MHz
4 mA
215
MHz
6 mA
336
MHz
8 mA
486
MHz
10 mA
706
MHz
12 mA
925
MHz
2 mA
168
MHz
4 mA
303
MHz
6 mA
350
MHz
8 mA
392
MHz
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
4–93
Table 4–107. Arria GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 2 of 4)
I/O Standards
SSTL-2 CLASS I
SSTL-2 CLASS II
SSTL-18 CLASS I
SSTL-18 CLASS II
1.8-V HSTL CLASS I
1.8-V HSTL CLASS II
1.5-V HSTL CLASS I
1.5-V HSTL CLASS II
DIFFERENTIAL SSTL-2
DIFFERENTIAL 2.5-V
SSTL CLASS II
© December 2009
Altera Corporation
Drive Strength
–6 Speed Grade
Units
8 mA
280
MHz
12 mA
327
MHz
16 mA
280
MHz
20 mA
327
MHz
24 mA
327
MHz
4 mA
140
MHz
6 mA
186
MHz
8 mA
280
MHz
10 mA
373
MHz
12 mA
373
MHz
8 mA
140
MHz
16 mA
327
MHz
18 mA
373
MHz
20 mA
420
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
561
MHz
12 mA
607
MHz
16 mA
420
MHz
18 mA
467
MHz
20 mA
514
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10mA
607
MHz
12 mA
654
MHz
16 mA
514
MHz
18 mA
561
MHz
20 mA
561
MHz
24 mA
278
MHz
8 mA
280
MHz
12 mA
327
MHz
16 mA
280
MHz
20 mA
327
MHz
24 mA
327
MHz
Arria GX Device Handbook, Volume 1
4–94
Chapter 4: DC and Switching Characteristics
Maximum Input and Output Clock Toggle Rate
Table 4–107. Arria GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 3 of 4)
I/O Standards
DIFFERENTIAL 1.8-V
SSTL CLASS I
DIFFERENTIAL 1.8-V
SSTL CLASS II
DIFFERENTIAL 1.8-V
HSTL CLASS I
DIFFERENTIAL 1.8-V
HSTL CLASS II
DIFFERENTIAL 1.5-V
HSTL CLASS I
DIFFERENTIAL 1.5-V
HSTL CLASS II
3.3-V PCI
Drive Strength
–6 Speed Grade
Units
4 mA
140
MHz
6 mA
186
MHz
8 mA
280
MHz
10 mA
373
MHz
12 mA
373
MHz
8 mA
140
MHz
16 mA
327
MHz
18 mA
373
MHz
20 mA
420
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
561
MHz
12 mA
607
MHz
16 mA
420
MHz
18 mA
467
MHz
20 mA
514
MHz
4 mA
280
MHz
6 mA
420
MHz
8 mA
561
MHz
10 mA
607
MHz
12 mA
654
MHz
16 mA
514
MHz
18 mA
561
MHz
20 mA
561
MHz
24 mA
278
MHz
—
626
MHz
3.3-V PCI-X
—
626
MHz
LVDS
—
280
MHz
HYPERTRANSPORT
—
116
MHz
LVPECL
—
280
MHz
SERIES_25_OHMS
327
MHz
SERIES_50_OHMS
327
MHz
SERIES_25_OHMS
280
MHz
SERIES_50_OHMS
280
MHz
SERIES_25_OHMS
280
MHz
SERIES_50_OHMS
280
MHz
SERIES_25_OHMS
420
MHz
SERIES_50_OHMS
420
MHz
3.3-V LVTTL
3.3-V LVCMOS
2.5 V
1.8 V
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Duty Cycle Distortion
4–95
Table 4–107. Arria GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 4 of 4)
I/O Standards
Drive Strength
–6 Speed Grade
Units
1.5 V
SERIES_50_OHMS
373
MHz
SSTL-2 CLASS I
SERIES_50_OHMS
467
MHz
SSTL-2 CLASS II
SERIES_25_OHMS
467
MHz
SSTL-18 CLASS I
SERIES_50_OHMS
327
MHz
SSTL-18 CLASS II
SERIES_25_OHMS
420
MHz
1.8-V HSTL CLASS I
SERIES_50_OHMS
561
MHz
1.8-V HSTL CLASS II
SERIES_25_OHMS
420
MHz
1.5-V HSTL CLASS I
SERIES_50_OHMS
467
MHz
1.2-V HSTL
SERIES_50_OHMS
233
MHz
DIFFERENTIAL SSTL-2
SERIES_50_OHMS
467
MHz
DIFFERENTIAL 2.5-V
SSTL CLASS II
SERIES_25_OHMS
467
MHz
DIFFERENTIAL 1.8-V
SSTL CLASS I
SERIES_50_OHMS
327
MHz
DIFFERENTIAL 1.8-V
SSTL CLASS II
SERIES_25_OHMS
420
MHz
DIFFERENTIAL 1.8-V
HSTL CLASS I
SERIES_50_OHMS
561
MHz
DIFFERENTIAL 1.8-V
HSTL CLASS II
SERIES_25_OHMS
420
MHz
DIFFERENTIAL 1.5-V
HSTL CLASS I
SERIES_50_OHMS
467
MHz
DIFFERENTIAL 1.2-V
HSTL
SERIES_50_OHMS
233
MHz
Duty Cycle Distortion
Duty cycle distortion (DCD) describes how much the falling edge of a clock is off from
its ideal position. The ideal position is when both the clock high time (CLKH) and the
clock low time (CLKL) equal half of the clock period (T), as shown in Figure 4–10.
DCD is the deviation of the non-ideal falling edge from the ideal falling edge, such as
D1 for the falling edge A and D2 for the falling edge B (refer to Figure 4–10). The
maximum DCD for a clock is the larger value of D1 and D2.
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–96
Chapter 4: DC and Switching Characteristics
Duty Cycle Distortion
Figure 4–10. Duty Cycle Distortion
Ideal Falling Edge
CLKH = T/2
CLKL = T/2
D1
Falling Edge A
D2
Falling Edge B
Clock Period (T)
DCD expressed in absolution derivation, for example, D1 or D2 in Figure 4–10, is
clock-period independent. DCD can also be expressed as a percentage, and the
percentage number is clock-period dependent. DCD as a percentage is defined as:
(T/2 – D1) / T (the low percentage boundary)
(T/2 + D2) / T (the high percentage boundary)
DCD Measurement Techniques
DCD is measured at an FPGA output pin driven by registers inside the corresponding
I/O element (IOE) block. When the output is a single data rate signal (non-DDIO),
only one edge of the register input clock (positive or negative) triggers output
transitions (Figure 4–11). Therefore, any DCD present on the input clock signal or
caused by the clock input buffer or different input I/O standard does not transfer to
the output signal.
Figure 4–11. DCD Measurement Technique for Non-DDIO (Single-Data Rate) Outputs
However, when the output is a double data rate input/output (DDIO) signal, both
edges of the input clock signal (positive and negative) trigger output transitions
(Figure 4–12). Therefore, any distortion on the input clock and the input clock buffer
affect the output DCD.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Duty Cycle Distortion
4–97
Figure 4–12. DCD Measurement Technique for DDIO (Double-Data Rate) Outputs
When an FPGA PLL generates the internal clock, the PLL output clocks the IOE block.
As the PLL only monitors the positive edge of the reference clock input and internally
re-creates the output clock signal, any DCD present on the reference clock is filtered
out. Therefore, the DCD for a DDIO output with PLL in the clock path is better than
the DCD for a DDIO output without PLL in the clock path.
Table 4–108 through Table 4–113 show the maximum DCD in absolution derivation
for different I/O standards on Arria GX devices. Examples are also provided that
show how to calculate DCD as a percentage.
Table 4–108. Maximum DCD for Non-DDIO Output on Row I/O Pins
Maximum DCD (ps) for Non-DDIO Output
Row I/O Output Standard
–6 Speed Grade
Units
3.3-V LVTTTL
275
ps
3.3-V LVCMOS
155
ps
2.5 V
135
ps
1.8 V
180
ps
1.5-V LVCMOS
195
ps
SSTL-2 Class I
145
ps
SSTL-2 Class II
125
ps
SSTL-18 Class I
85
ps
1.8-V HSTL Class I
100
ps
1.5-V HSTL Class I
115
ps
LVDS
80
ps
Here is an example for calculating the DCD as a percentage for a non-DDIO output on
a row I/O:
If the non-DDIO output I/O standard is SSTL-2 Class II, the maximum DCD is 125 ps
(see Table 4–109). If the clock frequency is 267 MHz, the clock period T is:
T = 1/ f = 1 / 267 MHz = 3.745 ns = 3,745 ps
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–98
Chapter 4: DC and Switching Characteristics
Duty Cycle Distortion
To calculate the DCD as a percentage:
(T/2 – DCD) / T = (3,745 ps/2 – 125 ps) / 3,745 ps = 46.66% (for low boundary)
(T/2 + DCD) / T = (3,745 ps/2 + 125 ps) / 3,745 ps = 53.33% (for high boundary)
Therefore, the DCD percentage for the output clock at 267 MHz is from 46.66% to
53.33%.
Table 4–109. Maximum DCD for Non-DDIO Output on Column I/O Pins
Column I/O Output Standard I/O Standard
Maximum DCD (ps)
for Non-DDIO Output
Units
–6 Speed Grade
3.3-V LVTTL
220
ps
3.3-V LVCMOS
175
ps
2.5 V
155
ps
1.8 V
110
ps
1.5-V LVCMOS
215
ps
SSTL-2 Class I
135
ps
SSTL-2 Class II
130
ps
SSTL-18 Class I
115
ps
SSTL-18 Class II
100
ps
1.8-V HSTL Class I
110
ps
1.8-V HSTL Class II
110
ps
1.5-V HSTL Class I
115
ps
1.5-V HSTL Class II
80
ps
1.2-V HSTL-12
200
ps
LVPECL
80
ps
Table 4–110. Maximum DCD for DDIO Output on Row I/O Pins Without PLL in the Clock Path Note (1)
Input I/O Standard (No PLL in the Clock Path)
Maximum DCD (ps) for
Row DDIO Output I/O
Standard
TTL/CMOS
SSTL-2
SSTL/HSTL
LVDS
Units
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
3.3V
3.3-V LVTTL
440
495
170
160
105
ps
3.3-V LVCMOS
390
450
120
110
75
ps
2.5 V
375
430
105
95
90
ps
1.8 V
325
385
90
100
135
ps
1.5-V LVCMOS
430
490
160
155
100
ps
SSTL-2 Class I
355
410
85
75
85
ps
SSTL-2 Class II
350
405
80
70
90
ps
SSTL-18 Class I
335
390
65
65
105
ps
1.8-V HSTL Class I
330
385
60
70
110
ps
1.5-V HSTL Class I
330
390
60
70
105
ps
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
Duty Cycle Distortion
4–99
Table 4–110. Maximum DCD for DDIO Output on Row I/O Pins Without PLL in the Clock Path Note (1)
Input I/O Standard (No PLL in the Clock Path)
Maximum DCD (ps) for
Row DDIO Output I/O
Standard
TTL/CMOS
SSTL-2
SSTL/HSTL
LVDS
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
3.3V
180
180
180
180
180
LVDS
Units
ps
Note to Table 4–110:
(1) Table 4–110 assumes the input clock has zero DCD.
Table 4–111. Maximum DCD for DDIO Output on Column I/O Pins Without PLL in the Clock Path
(Note 1)
Input IO Standard (No PLL in the Clock Path)
Maximum DCD (ps) for
DDIO Column Output I/O
Standard
TTL/CMOS
SSTL-2
SSTL/HSTL
Units
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
3.3-V LVTTL
440
495
170
160
ps
3.3-V LVCMOS
390
450
120
110
ps
2.5 V
375
430
105
95
ps
1.8 V
325
385
90
100
ps
1.5-V LVCMOS
430
490
160
155
ps
SSTL-2 Class I
355
410
85
75
ps
SSTL-2 Class II
350
405
80
70
ps
SSTL-18 Class I
335
390
65
65
ps
SSTL-18 Class II
320
375
70
80
ps
1.8-V HSTL Class I
330
385
60
70
ps
1.8-V HSTL Class II
330
385
60
70
ps
1.5-V HSTL Class I
330
390
60
70
ps
1.5-V HSTL Class II
330
360
90
100
ps
LVPECL
180
180
180
180
ps
Note to Table 4–111:
(1) Table 4–111 assumes the input clock has zero DCD.
Table 4–112. Maximum DCD for DDIO Output on Row I/O Pins With PLL in the Clock Path
Maximum DCD (ps) for Row DDIO Output I/O Standard
Arria GX Devices (PLL Output
Feeding DDIO)
Units
–6 Speed Grade
3.3-V LVTTL
105
ps
3.3-V LVCMOS
75
ps
2.5V
90
ps
1.8V
100
ps
1.5-V LVCMOS
100
ps
SSTL-2 Class I
75
ps
SSTL-2 Class II
70
ps
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–100
Chapter 4: DC and Switching Characteristics
High-Speed I/O Specifications
Table 4–112. Maximum DCD for DDIO Output on Row I/O Pins With PLL in the Clock Path
Maximum DCD (ps) for Row DDIO Output I/O Standard
Arria GX Devices (PLL Output
Feeding DDIO)
Units
–6 Speed Grade
SSTL-18 Class I
65
ps
1.8-V HSTL Class I
70
ps
1.5-V HSTL Class I
70
ps
LVDS
180
ps
Table 4–113. Maximum DCD for DDIO Output on Column I/O Pins With PLL in the Clock Path
Maximum DCD (ps) for Column
DDIO Output I/O Standard
Arria GX Devices (PLL Output
Feeding DDIO)
Units
–6 Speed Grade
3.3-V LVTTL
160
ps
3.3-V LVCMOS
110
ps
2.5V
95
ps
1.8V
100
ps
1.5-V LVCMOS
155
ps
SSTL-2 Class I
75
ps
SSTL-2 Class II
70
ps
SSTL-18 Class I
65
ps
SSTL-18 Class II
80
ps
1.8-V HSTL Class I
70
ps
1.8-V HSTL Class II
70
ps
1.5-V HSTL Class I
70
ps
1.5-V HSTL Class II
100
ps
1.2-V HSTL
155
ps
LVPECL
180
ps
High-Speed I/O Specifications
Table 4–114 lists high-speed timing specifications definitions.
Table 4–114. High-Speed Timing Specifications and Definitions (Part 1 of 2)
High-Speed Timing Specifications
Definitions
tC
High-speed receiver/transmitter input and output clock period.
fH S C L K
High-speed receiver/transmitter input and output clock frequency.
J
Deserialization factor (width of parallel data bus).
W
PLL multiplication factor.
tR I S E
Low-to-high transmission time.
tF A L L
High-to-low transmission time.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
High-Speed I/O Specifications
4–101
Table 4–114. High-Speed Timing Specifications and Definitions (Part 2 of 2)
High-Speed Timing Specifications
Definitions
Timing unit interval (TUI)
The timing budget allowed for skew, propagation delays, and data sampling window.
(TUI = 1/(Receiver Input Clock Frequency × Multiplication Factor) = tC /w).
fH S D R
Maximum/minimum LVDS data transfer rate (f H S D R = 1/TUI), non-DPA.
fH S D R D PA
Maximum/minimum LVDS data transfer rate (f H S D R D P A = 1/TUI), DPA.
Channel-to-channel skew (TCCS)
The timing difference between the fastest and slowest output edges, including tC O
variation and clock skew. The clock is included in the TCCS measurement.
Sampling window (SW)
The period of time during which the data must be valid in order to capture it
correctly. The setup and hold times determine the ideal strobe position within the
sampling window.
Input jitter
Peak-to-peak input jitter on high-speed PLLs.
Output jitter
Peak-to-peak output jitter on high-speed PLLs.
tD U T Y
Duty cycle on high-speed transmitter output clock.
tL O CK
Lock time for high-speed transmitter and receiver PLLs.
Table 4–115 shows the high-speed I/O timing specifications.
Table 4–115. High-Speed I/O Specifications (Part 1 of 2)Note (1), (2)
–6 Speed Grade
Symbol
Conditions
Units
Min
Typ
Max
W = 2 to 32 (LVDS, HyperTransport technology) (3)
16
—
420
MHz
W = 1 (SERDES bypass, LVDS only)
16
—
500
MHz
W = 1 (SERDES used, LVDS only)
150
—
640
MHz
J = 4 to 10 (LVDS, HyperTransport technology)
150
—
840
Mbps
J = 2 (LVDS, HyperTransport technology)
(4)
—
700
Mbps
J = 1 (LVDS only)
(4)
—
500
Mbps
fH S D R D PA (DPA data rate)
J = 4 to 10 (LVDS, HyperTransport technology)
150
—
840
Mbps
TCCS
All differential I/O standards
—
—
200
ps
SW
All differential I/O standards
440
—
—
ps
Output jitter
—
—
—
190
ps
Output t R I SE
All differential I/O standards
—
—
290
ps
Output t F AL L
All differential I/O standards
—
—
290
ps
tD U T Y
—
45
50
55
%
DPA run length
—
—
—
6,400
UI
0.44
—
—
UI
fH S C L K (clock frequency)
fH S C L K = f H S D R / W
fH S D R (data rate)
DPA jitter tolerance
© December 2009
Data channel peak-to-peak jitter
Altera Corporation
Arria GX Device Handbook, Volume 1
4–102
Chapter 4: DC and Switching Characteristics
High-Speed I/O Specifications
Table 4–115. High-Speed I/O Specifications (Part 2 of 2)Note (1), (2)
–6 Speed Grade
Symbol
Conditions
Units
Min
DPA lock time
Typ
Max
—
—
Standard
Training Pattern
Transition
Density
SPI-4
000000000011
11111111
10%
256
—
—
Parallel Rapid
I/O
00001111
25%
256
—
—
10010000
50%
256
—
—
Miscellaneous
10101010
100%
256
—
—
01010101
—
256
—
—
Number of
repetitions
Notes to Table 4–115:
(1)
(2)
(3)
(4)
When J = 4 to 10, the SERDES block is used.
When J = 1 or 2, the SERDES block is bypassed.
The input clock frequency and the W factor must satisfy the following fast PLL VCO specification: 150  input clock frequency × W  1,040.
The minimum specification is dependent on the clock source (fast PLL, enhanced PLL, clock pin, and so on) and the clock routing resource
(global, regional, or local) used. The I/O differential buffer and input register do not have a minimum toggle rate.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
PLL Timing Specifications
4–103
PLL Timing Specifications
Table 4–116 and Table 4–117 describe the Arria GX PLL specifications when operating
in both the commercial junction temperature range (0 to 85 C) and the industrial
junction temperature range (–40 to 100 C), except for the clock switchover and
phase-shift stepping features. These two features are only supported from the 0 to
100 C junction temperature range.
Table 4–116. Enhanced PLL Specifications (Part 1 of 2)
Name
Description
Min
Typ
Max
Units
fIN
Input clock frequency
2
—
500
MHz
fINPFD
Input frequency to the PFD
2
—
420
MHz
fINDUTY
Input clock duty cycle
40
—
60
%
fENDUTY
External feedback input clock duty cycle
40
—
60
%
Input or external feedback clock input jitter
tolerance in terms of period jitter.
—
0.5
—
ns (peak-to-peak)
—
1.0
—
ns (peak-to-peak)
tINJITTER
Bandwidth  0.85 MHz
Input or external feedback clock input jitter
tolerance in terms of period jitter.
Bandwidth  0.85 MHz
tOUTJITTER
Dedicated clock output period jitter
50
100
250
ps (p-p)
tFCOMP
External feedback compensation time
—
—
10
ns
fOUT
Output frequency for internal global or regional
clock
1.5 (2)
—
550
MHz
fSCANCLK
Scanclk frequency
—
—
100
MHz
tCONFIGEPLL
Time required to reconfigure scan chains for
EPLLs
—
174/fSCANCLK
—
ns
fOUT_EXT
PLL external clock output frequency
1.5 (2)
(1)
MHz
fOUTDUTY
Duty cycle for external clock output
45
50
55
%
tLOCK
Time required for the PLL to lock from the time
it is enabled or the end of device configuration
—
0.03
1
ms
tDLOCK
Time required for the PLL to lock dynamically
after automatic clock switchover between two
identical clock frequencies
—
—
1
ms
fSWITCHOVER
Frequency range where the clock switchover
performs properly
1.5
1
500
MHz
fCLBW
PLL closed-loop bandwidth
0.13
1.2
16.9
MHz
fVCO
PLL VCO operating range
300
—
840
MHz
fSS
Spread-spectrum modulation frequency
100
—
500
kHz
% spread
Percent down spread for a given clock
frequency
0.4
0.5
0.6
%
tPLL_PSERR
Accuracy of PLL phase shift
—
—
±30
ps
tARESET
Minimum pulse width on areset signal.
10
—
—
ns
tARESET_RECONFIG
Minimum pulse width on the areset signal
when using PLL reconfiguration. Reset the PLL
after scandone goes high.
500
—
—
ns
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
4–104
Chapter 4: DC and Switching Characteristics
PLL Timing Specifications
Table 4–116. Enhanced PLL Specifications (Part 2 of 2)
Name
tRECONFIGWAIT
Description
The time required for the wait after the
reconfiguration is done and the areset is
applied.
Min
Typ
Max
Units
—
—
2
us
Notes to Table 4–116:
(1) This is limited by the I/O f MAX.
(2) If the counter cascading feature of the PLL is used, there is no minimum output clock frequency.
Table 4–117. Fast PLL Specifications (Part 1 of 2)
Name
Description
Min
Typ
Max
Units
fIN
Input clock frequency
16.08
—
640
MHz
fINPFD
Input frequency to the
PFD
16.08
—
500
MHz
fINDUTY
Input clock duty cycle
40
—
60
%
Input clock jitter
tolerance in terms of
period jitter.
Bandwidth 2 MHz
—
0.5
—
ns (p-p)
Input clock jitter
tolerance in terms of
period jitter.
Bandwidth  0.2 MHz
—
1.0
—
ns (p-p)
Upper VCO frequency
range
300
—
840
MHz
Lower VCO frequency
range
150
—
420
MHz
PLL output frequency
to GCLK or RCLK
4.6875
—
550
MHz
PLL output frequency
to LVDS or DPA clock
150
—
840
MHz
fOUT_EXT
PLL clock output
frequency to regular
I/O
4.6875
—
(1)
MHz
tCONFIGPLL
Time required to
reconfigure scan
chains for fast PLLs
—
75/f SCANCLK
—
ns
fCLBW
PLL closed-loop
bandwidth
1.16
5
28
MHz
tLOCK
Time required for the
PLL to lock from the
time it is enabled or
the end of the device
configuration
—
0.03
1
ms
tPLL_PSERR
Accuracy of PLL phase
shift
—
—
±30
ps
tARESET
Minimum pulse width
on areset signal.
10
—
—
ns
tINJITTER
fVCO
fOUT
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
External Memory Interface Specifications
4–105
Table 4–117. Fast PLL Specifications (Part 2 of 2)
Name
tARESET_RECONFIG
Description
Min
Typ
Max
Units
Minimum pulse width
on the areset signal
when using PLL
reconfiguration. Reset
the PLL after
scandone goes high.
500
—
—
ns
Note to Table 4–117:
(1) This is limited by the I/O f MAX.
External Memory Interface Specifications
Table 4–118 through Table 4–122 list Arria GX device specifications for the dedicated
circuitry used for interfacing with external memory devices.
Table 4–118. DLL Frequency Range Specifications
Frequency Mode
Frequency Range (MHz)
0
100 to 175
1
150 to 230
2
200 to 310
Table 4–119. DQS Jitter Specifications for DLL-Delayed Clock (tDQS_JITTER) , (Note 1)
Number of DQS Delay Buffer Stages (2)
Commercial (ps)
Industrial (ps)
1
80
110
2
110
130
3
130
180
4
160
210
Notes to Table 4–119:
(1) Peak-to-peak period jitter on the phase-shifted DQS clock. For example, jitter on two delay stages under
commercial conditions is 200 ps peak-to-peak or 100 ps.
(2) Delay stages used for requested DQS phase shift are reported in a project’s Compilation Report in the Quartus II
software.
Table 4–120. DQS Phase-Shift Error Specifications for DLL-Delayed Clock (tDQS_PSERR )
© December 2009
Number of DQS Delay Buffer Stages
–6 Speed Grade (ps)
1
35
2
70
3
105
4
140
Altera Corporation
Arria GX Device Handbook, Volume 1
4–106
Chapter 4: DC and Switching Characteristics
JTAG Timing Specifications
Table 4–121. DQS Bus Clock Skew Adder Specifications (t DQS_CLOCK_SKEW_A DDER )
Mode
DQS Clock Skew Adder (ps)
4 DQ per DQS
40
9 DQ per DQS
70
18 DQ per DQS
75
36 DQ per DQS
95
Table 4–122. DQS Phase Offset Delay Per Stage (ps)
Note (1), (2), (3)
Positive Offset
Negative Offset
Speed Grade
–6
Min
Max
Min
Max
10
16
8
12
Notes to Table 4–122:
(1) The delay settings are linear.
(2) The valid settings for phase offset are –32 to +31.
(3) The typical value equals the average of the minimum and maximum values.
JTAG Timing Specifications
Figure 4–13 shows the timing requirements for the JTAG signals
Figure 4–13. Arria GX JTAG Waveforms.
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSSU
Signal
to be
Captured
Signal
to be
Driven
Arria GX Device Handbook, Volume 1
tJSZX
tJSH
tJSCO
tJSXZ
© December 2009
Altera Corporation
Chapter 4: DC and Switching Characteristics
JTAG Timing Specifications
4–107
Table 4–123 lists the JTAG timing parameters and values for Arria GX devices.
Table 4–123. Arria GX JTAG Timing Parameters and Values
Symbol
© December 2009
Parameter
Min
Max
Units
tJCP
TCK clock period
30
—
ns
tJCH
TCK clock high time
12
—
ns
tJCL
TCK clock low time
12
—
ns
tJPSU
JTAG port setup time
4
—
ns
tJPH
JTAG port hold time
5
—
ns
tJPCO
JTAG port clock to output
—
9
ns
tJPZX
JTAG port high impedance to valid output
—
9
ns
tJPXZ
JTAG port valid output to high impedance
—
9
ns
tJSSU
Capture register setup time
4
—
ns
tJSH
Capture register hold time
5
—
ns
tJSCO
Update register clock to output
—
12
ns
tJSZX
Update register high impedance to valid
output
—
12
ns
tJSXZ
Update register valid output to high
impedance
—
12
ns
Altera Corporation
Arria GX Device Handbook, Volume 1
4–108
Chapter 4: DC and Switching Characteristics
Document Revision History
Document Revision History
Table 4–124 lists the revision history for this chapter.
Table 4–124. Document Revision History
Date and Document Version
December 2009, v2.0
April 2009
v1.4
Changes Made
■
Updated Table 4–104, Table 4–105,
and Table 4–106.
■
Document template update.
■
Minor text edits.
■
Updated Table 4–6 and Table 4–7.
■
Updated “Maximum Input and Output
Clock Toggle Rate” section.
Summary of Changes
—
—
Updated:
May 2008
v1.3
■
Table 4–5
■
Table 4–7
■
Table 4–8
■
Table 4–9
■
Table 4–10
■
Table 4–11
■
Table 4–12
■
Table 4–13
■
Table 4–14
■
Table 4–15
■
Table 4–16
■
Table 4–17
■
Table 4–43
■
Table 4–116
■
Table 4–117
Updated:
■
Figure 4–4
—
—
Minor text edits.
—
Removed “Preliminary” from each page.
—
Removed “Preliminary” note from
Tables 4–44, 4–45, and 4–47.
—
Added “Referenced Documents” section.
—
June 2007
v1.1
Updated Table 4–99.
—
Added GIGE information.
—
May 2007
v1.0
Initial release.
August 2007 v1.2
Arria GX Device Handbook, Volume 1
—
© December 2009
Altera Corporation
5. Reference and Ordering Information
AGX51005-2.0
Software
Arria® GX devices are supported by the Altera® Quartus® II design software, which
provides a comprehensive environment for system-on-a-programmable-chip (SOPC)
design. The Quartus II software includes HDL and schematic design entry,
compilation and logic synthesis, full simulation and advanced timing analysis,
SignalTap® II logic analyzer, and device configuration.
f
For more information about the Quartus II software features, refer to the Quartus II
Development Software Handbook .
The Quartus II software supports the Windows XP/2000/NT, Sun Solaris 8/9, Linux
Red Hat v7.3, Linux Red Hat Enterprise 3, and HP-UX operating systems. It also
supports seamless integration with industry-leading EDA tools through the
NativeLink interface.
Device Pin-Outs
f
Arria GX device pin-outs are available on the Altera web site at www.altera.com.
Ordering Information
Figure 5–1 describes the ordering codes for Arria GX devices.
f
© December 2009
For more information on a specific package, refer to the Package Information for Arria
GX Devices chapter.
Altera Corporation
Arria GX Device Handbook, Volume 1
5–2
Chapter 5: Reference and Ordering Information
Document Revision History
Figure 5–1. Arria GX Device Packaging Ordering Information
EP1AGX
20
C
F
484
C
6
N
Family Signature
Optional Suffix
EP1AGX : Arria GX
Indicates specific device options or
shipment method.
N:
Lead-free devices
Device Type
20
35
50
60
90
Speed Grade
6
Operating Temperature
Number of
Transceiver
Channels
C: Commercial temperature (TJ = 0˚ C to 85˚ C)
I: Industrial temperature (TJ = -40˚ C to 100˚ C)
Pin Count
C: 4
D: 8
E: 12
Package Type
484
780
1152
F: FineLine BGA (FBGA)
Document Revision History
Table 5–1 shows the revision history for this chapter.
Table 5–1. Document Revision History
Date and Document
Version
December 2009, v2.0
Changes Made
■
Document template update.
■
Minor text edits.
Summary of Changes
—
August 2007, v1.1
Added the “Referenced Documents” section.
—
May 2007, v1.0
Initial Release.
—
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation
Additional Information
About this Handbook
This handbook provides comprehensive information about the Altera® Arria® GX
family of devices.
How to Contact Altera
For the most up-to-date information about Altera products, see the following table.
Contact (Note 1)
Contact
Method
Address
Technical support
Website
www.altera.com/support
Technical training
Website
www.altera.com/training
Email
[email protected]
Product literature
Email
www.altera.com/literature
Non-technical support (General)
Email
[email protected]
(Software Licensing)
Email
[email protected]
Note:
(1) You can also contact your local Altera sales office or sales representative.
Typographic Conventions
The following table shows the typographic conventions that this document uses.
Visual Cue
Meaning
Bold Type with Initial Capital
Letters
Indicates command names and dialog box titles. For example, Save As dialog box.
bold type
Indicates directory names, project names, disk drive names, file names, file name
extensions, dialog box options, software utility names, and other GUI labels. For
example, \qdesigns directory, d: drive, and chiptrip.gdf file.
Italic Type with Initial Capital Letters
Indicates document titles. For example, AN 519: Stratix IV Design Guidelines.
Italic type
Indicates variables. For example, n + 1.
Variable names are enclosed in angle brackets (< >). For example, <file name> and
<project name>.pof file.
Initial Capital Letters
Indicates keyboard keys and menu names. For example, Delete key and the Options
menu.
“Subheading Title”
Quotation marks indicate references to sections within a document and titles of
Quartus II Help topics. For example, “Typographic Conventions.”
© December 2009
Altera Corporation
Arria GX Device Handbook, Volume 1
Info–2
Additional Information
Visual Cue
Courier type
Meaning
Indicates signal, port, register, bit, block, and primitive names. For example, data1,
tdi, and input. Active-low signals are denoted by suffix n. For example,
resetn.
Indicates command line commands and anything that must be typed exactly as it
appears. For example, c:\qdesigns\tutorial\chiptrip.gdf.
Also indicates sections of an actual file, such as a Report File, references to parts of
files (for example, the AHDL keyword SUBDESIGN), and logic function names (for
example, TRI).
1., 2., 3., and
a., b., c., and so on.
Numbered steps indicate a list of items when the sequence of the items is important,
such as the steps listed in a procedure.
■ ■
Bullets indicate a list of items when the sequence of the items is not important.
1
The hand points to information that requires special attention.
c
A caution calls attention to a condition or possible situation that can damage or
destroy the product or your work.
w
A warning calls attention to a condition or possible situation that can cause you
injury.
r
The angled arrow instructs you to press Enter.
f
The feet direct you to more information about a particular topic.
Arria GX Device Handbook, Volume 1
© December 2009
Altera Corporation