1/4 STRUCTURE Silicon Monolithic Integrated Circuit TYPE BU52742GUL PRODUCT Bipolar latch type Hall effect IC FEATURES 1) Two hall elements are on the inside 2) High speed operation ●ABSOLUTE MAXIMUM RATINGS (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1～+4.5 Output Current IOUT ±1.0 Power dissipation Pd 460 Operating Temperature Range Topr -25～+85 ※1 V mA ※2 mW ℃ Storage Temperature Range Tstg -40～+125 ℃ ※1. Not to exceed Pd ※2. Reduced by 4.60mW for each increase in Ta of 1℃ over 25℃ （mounted on 70mm×70mm×1.6mm Glass-epoxy PCB） ●OPERATING CONDITIONS (Ta=-25～+85℃) PARAMETERS SYMBOL MIN Power Supply Voltage VDD 2.4 TYP MAX UNIT 3.0 3.6 V Radiation hardiness is not designed. REV. B 2/4 ●MAGNETIC, ELECTRICAL CHARACTERISTICS (Unless otherwise specified, VDD=3.0V, Ta=25℃) PARAMETERS SYMBOL MIN LIMIT TYP MAX UNIT Operate Point Bop 5 10 15 mT Release Point Brp -15 -10 -5 mT Frequency fOP 200 250 - kHｚ Output High Voltage VOH - - V Output Low Voltage VOL - - 0.4 V Supply Current IDD - 7.5 10.0 mA VDD -0.4 CONDITIONS B<Brp ※3 IOUT=-1.0mA Bop<B ※3 IOUT=+1.0mA ※3. B＝Magnetic Flux Density 1mT＝10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of frequency (1/ｆOP) to become definite output. REV. B 3/4 ●PACKAGE OUTLINES ABE Marking Lot No. (Unit:mm) ●PIN No.・PIN NAME PIN No. PIN NAME FUNCTION COMMENT A1 OUT1 OUTPUT1 A2 TEST1 A3 OUT2 OUTPUT2 B1 VDD POWER SUPPLY B2 TEST2 B3 GND OPEN. OPEN or Short to GND. GＲOUND REV. B 4/4 ●BLOCK DIAGRAM ＶDD ＶDD SAMPLE & HOLD × DYNAMIC HALL ELEMENT LATCH TIMING LOGIC OFFSET CANCELLATION OSC ＶDD LATCH × DYNAMIC HALL ELEMENT SAMPLE & HOLD TEST1 OFFSET CANCELLATION TIMING LOGIC TEST2 OUT1 OUT2 GND ●CAUTIONS ON USE 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. 3) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. 4) Pin short and mistake fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is a placement mistake, the IC may be burned up. 5) Operation in strong electric field Be noted that using ICs in the strong electric field can malfunction them. 6) Mutual impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. 7) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small–signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. REV. B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. 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