Rohm BU52742GUL Silicon monolithic integrated circuit Datasheet

1/4
STRUCTURE
Silicon Monolithic Integrated Circuit
TYPE
BU52742GUL
PRODUCT
Bipolar latch type Hall effect IC
FEATURES
1) Two hall elements are on the inside
2) High speed operation
●ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
Power Supply Voltage
VDD
-0.1~+4.5
Output Current
IOUT
±1.0
Power dissipation
Pd
460
Operating Temperature Range
Topr
-25~+85
※1
V
mA
※2
mW
℃
Storage Temperature Range
Tstg
-40~+125
℃
※1. Not to exceed Pd
※2. Reduced by 4.60mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
●OPERATING CONDITIONS (Ta=-25~+85℃)
PARAMETERS
SYMBOL MIN
Power Supply Voltage
VDD
2.4
TYP
MAX
UNIT
3.0
3.6
V
Radiation hardiness is not designed.
REV. B
2/4
●MAGNETIC, ELECTRICAL CHARACTERISTICS (Unless otherwise specified, VDD=3.0V, Ta=25℃)
PARAMETERS
SYMBOL
MIN
LIMIT
TYP
MAX
UNIT
Operate Point
Bop
5
10
15
mT
Release Point
Brp
-15
-10
-5
mT
Frequency
fOP
200
250
-
kHz
Output High Voltage
VOH
-
-
V
Output Low Voltage
VOL
-
-
0.4
V
Supply Current
IDD
-
7.5
10.0
mA
VDD
-0.4
CONDITIONS
B<Brp
※3
IOUT=-1.0mA
Bop<B
※3
IOUT=+1.0mA
※3. B=Magnetic Flux Density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to
the branded face of the sensor.
After applying power supply, it takes one cycle of frequency (1/fOP) to become definite output.
REV. B
3/4
●PACKAGE OUTLINES
ABE
Marking
Lot No.
(Unit:mm)
●PIN No.・PIN NAME
PIN No.
PIN NAME
FUNCTION
COMMENT
A1
OUT1
OUTPUT1
A2
TEST1
A3
OUT2
OUTPUT2
B1
VDD
POWER SUPPLY
B2
TEST2
B3
GND
OPEN.
OPEN or Short to GND.
GROUND
REV. B
4/4
●BLOCK DIAGRAM
VDD
VDD
SAMPLE
& HOLD
×
DYNAMIC
HALL ELEMENT
LATCH
TIMING LOGIC
OFFSET CANCELLATION
OSC
VDD
LATCH
×
DYNAMIC
HALL ELEMENT
SAMPLE
& HOLD
TEST1
OFFSET CANCELLATION
TIMING LOGIC
TEST2
OUT1
OUT2
GND
●CAUTIONS ON USE
1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions,
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open
circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given
to take physical safety measures including the use of fuses, etc.
2) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating
state.
3) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation
(Pd) in actual states of use.
4) Pin short and mistake fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is a placement mistake, the
IC may be burned up.
5) Operation in strong electric field
Be noted that using ICs in the strong electric field can malfunction them.
6) Mutual impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance
as small as possible. Use a capacitor to keep ripple to a minimum.
7) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the
large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference
point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current
will cause no fluctuations in voltages of the small–signal GND. Pay attention not to cause fluctuations in the
GND wiring pattern of external parts as well.
REV. B
Notice
Notes
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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R1010A
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