ASMT-TWBM / ASMT-TBBM / ASMT-TGBM Surface Mount LED Indicator Reliability Data Sheet Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of MIL-STD-883 and JEDEC. The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: Avago tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. TJ(°C) = TA(°C) + θJA PAVG Where; TA = ambient temperature in (°C) θJA = thermal resistance of junction-to ambient in °C/watt PAVG = average power dissipated in watts The estimated MTTF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.43eV (reference MIL-HDBK-217). Table 1. Life Tests Demonstrated Performance Point Typical Performance Colors Stress Test Conditions Total Device Hours Units Tested Units Failed MTBF (60% Confidence) Failure Rate (%/1K Hrs) Green TA = 55°C, IF = 20 mA 56,000 56 0 61,100 1.64 Blue / Ice Blue / Cool White TA = 55°C, IF = 18 mA 56,000 56 0 71,700 1.39 Reliability Prediction Table 2a. Green (IF = 20mA) Ambient Temperature (°C) Junction Temperature (°C) Point Typical Performance in Time [1 - 5] (60% Confidence) Failure Rate MTTF (%/1K Hours) 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 125 125 124 123 123 122 122 121 116 111 106 101 96 91 86 81 38500 39200 40000 40700 41500 42300 43100 43900 51700 61100 72500 86500 103600 124700 151000 183700 2.60 2.55 2.50 2.46 2.41 2.36 2.32 2.28 1.93 1.64 1.38 1.16 0.97 0.80 0.66 0.54 Performance in Time [1 - 5] (90% Confidence) Failure Rate MTTF (%/1K Hours) 15300 15600 15900 16200 16500 16800 17200 17500 20600 24300 28900 34400 41200 49600 60100 73100 6.54 6.41 6.29 6.17 6.06 5.95 5.81 5.71 4.85 4.12 3.46 2.91 2.43 2.02 1.66 1.37 Table 2b. Blue / Ice Blue / Cool White (IF = 18mA) Ambient Temperature (°C) Junction Temperature (°C) Point Typical Performance in Time [1 - 5] (60% Confidence) Failure Rate MTTF (%/1K Hours) 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 108 108 107 107 107 106 106 106 105 105 104 99 94 89 84 79 63800 64600 65400 66300 67100 68000 68900 69800 70700 71700 72600 86700 104100 125600 152200 185600 1.57 1.55 1.53 1.51 1.49 1.47 1.45 1.43 1.41 1.39 1.38 1.15 0.96 0.80 0.66 0.54 Performance in Time [1 - 5] (90% Confidence) Failure Rate MTTF (%/1K Hours) 25400 25700 26000 26400 26700 27100 27400 27800 28200 28500 28900 34500 41400 50000 60600 73900 3.94 3.89 3.85 3.79 3.75 3.69 3.65 3.60 3.55 3.51 3.46 2.90 2.42 2.00 1.65 1.35 Notes: 1. The 60% or 90% confidence MTTF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples. The confidence level is established based on the chi-square distribution. 2. Failure rate (FIT) is 1/MTTF x 105, assuming the failures are exponentially distributed 3. A failure is any LED that is open, shorted or fails to emit light. 4. Calculated from data generated at 55°C biased at 20mA (Green) 18mA (Blue/Ice Blue/Cool White). 5. Junction temperature is calculated based on θJA = 850°C/W 2 Example of Failure Rate Calculation Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.24 The point failure rate per year (8760 hours) at 25°C ambient temperature is (60% confidence level): (0.54%/1K hours) x 0.24 x (8760 hours/year) = 1.13% per year Similarly, 90% confidence level failure rate per year at 25°C: (1.35%/1K hours) x 0.24 x (8760 hours/year) = 2.84% per year. Table 3. Environmental Tests Units Tested Units Failed -40/100°C 15 min dwell, 5 min transfer, 1000 cycles 468 0 JESD 22-B106 260°C for 10 seconds, 2x 30 0 Temperature Humidity Power Cycle Avago Req. 25/65°C, 95%RH Dwell time: 3|6|3 hrs IF = 15mA, 5 mins on/off for 100cyc 231 0 Power Temperature Cycle Avago Req. -40/85°C, Dwell time: 15|15|15 Min IF = 8mA, 5 mins on/off for 1000cyc 231 0 Unbiased AutoClave JESD22-A102 TA = 121°C, 100%RH, Vapor Pressure = 205kPa for 96 hours 231 0 Temperature Humidity Storage Life Avago Req. TA = 85°C, 85%RH, for 1000 hours 168 0 Temperature Humidity Operating Life JESD22-A101 TA = 85°C, 85%RH, IF = 13 mA for 1000 hours 84 0 High Temperature Operating Life JESD22-A108 TA = 85°C, IF = 8 mA for 1000 hours 84 0 Room Temperature Operating Life JESD22-A108 TA = 25°C, IF = 20 mA for 1000 hours 84 0 Test Name Reference Test Conditions Temperature Cycle Avago Req. Resistance to Soldering Heat For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-2328EN - January 25, 2010