Anpec APX9131EI-TRL Hall effect micro switch ic Datasheet

APX9131
Hall Effect Micro Switch IC
Features
General Description
•
•
•
The APX9131 integrated circuit is an ultra-sensitive,
pole independent Hall-effect switch with a latched
digital output. 2.5 volt to 3.5 volt operation and a unique
clocking scheme reduce the average operating power
requirements. Either a north or south pole of sufficient
flux will turn the output on; in the absence of a magnetic
field, the output is off. The polarity independence and
minimal power requirement allow this device to be
easily replaced reed switch for superior for signal
conditioning. Advanced CMOS processing is used to
take adv antage of low-voltage and low-power
requirements, SOT-23 and TO-92 packages provide an
optimized package for most applications.
Micro Power Operation for Battery Applications
Chopper Stabilized Amplifier
Independent of North or South Pole Magnet,
Easy for Manufacture
•
•
Small Size Package
Lead Free Available (RoHS Compliant)
Applications
•
•
•
•
Micro Switch
Handheld Wireless Application Wake Up Switch
Pin Description
Clamp Shell Type Application Switch
Magnet Switch in Low Duty Cycle Applications
GND
1 : VDD
APX9131
VDD
Ordering Information
1 2 3
TO-92M3 Front View
Package Code
A: SOT-23
AT : SOT-23 Thin
E : TO-92M3
Operating Ambient Temp. Range
I : -40 to 85 ° C
Handling Code
TR : Tape & Reel
Lead Free Code
L : Lead Free Device
Blank : Original Device
Lead Free Code
Handling Code
Temp. Range
Package Code
X31X
VOUT
SOT-23
APX9131
APX9131 A/AT:
2 : GND
3 : VOUT
APL9131 E:
X: Date Code
APX
9131
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering
operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C
for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
1
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APX9131
Function Pin Descriptions
No
1
Name
VDD
2
VOUT
3
GND
Function
Power Input
When a magnetic field enters the hall element and exceeds the operate point
BOPS (or less than BOPN) the output turns on (output is low). When the magnetic
field is below the release point BRPS (or above BRPN), the output turns off (output
is high). It is design with open drain configuration and connecting a pull up
resistor from VOUT to VDD is necessary. It cannot be floating.
Ground Connection
Block Diagram
VDD
Awake & Sleep
Timing Logic
VOUT
Dynamic Offset
Cancellation
Hall Plane
Latch
Circuit
Chopper
Amplifier
Hysteresis
Control
GND
Typical Applications
50KΩ
VOUT
VDD
+
APX9131
2.5V-3.5V
0.1uF
GND
-
SOT-23 (Top View)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
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APX9131
Absolute Maximum Ratings
(T A = 25°C unless otherwise noted)
Symbol
Parameter
Rating
Unit
VDD
Supply Voltage
5
V
VOUT
Output Voltage
5
V
TJ
Junction Temperature Range
150
TSTG
Storage Temperature Range
-65 to +150
Electrical Characteristics
Symbol
VDD
(TA = 25°C, VDD=3V unless otherwise noted)
Characteristic
Supply Voltage Range
Test Condition
Operating
APX9131
Min.
Typ.
Supply Current
Max.
2.5
Average
IDD
°C
Awake
sleep
IOFF
Output Leakage Current
VOUT = 3.5V, BRPN<B<BRPS
VOL
Output Low Voltage
ISINK = 1mA
Unit
3.5
V
5
10
µA
1.2
2
mA
2
8
µA
1.0
µA
40
mV
20
tawake
Wake up Time
180
µs
tperiod
Period
60
mS
d.c.
Duty Cycle
0.3
%
Chopping Frequency
11
KHz
fc
Magnetic Characteristics
Symbol
BOPS
BOPN
BRPS
BRPN
Bhys
Characteristic
(TA = 25°C, VDD=3V unless otherwise noted)
Test Condition
Operate Points
Release Points
Copyright  ANPEC Electronics Corp.
Min.
Typ.
Max.
50
75
G
-50
G
10
35
G
15
3
Unit
-75
-35
Hysteresis
Rev. A.7 - Sep., 2005
APX9131
-10
G
G
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APX9131
Typical Characteristics
Switching Points vs. Supply Voltage
Switching Points vs. Ambient Temperature
80
80
TA=25°C
Switching Points (G)
Switching Points (G)
60
BOPS
60
40
BRPS
20
0
-20
BRPN
-40
40
BRPS
20
0
-20
BRPN
-40
BOPN
-60
BOPS
BOPN
-60
-80
-40
-20
0
20
40
60
80
2.5
100
3
Ambient Temperature (°C)
4
4.5
5
Supply Voltage (V)
Average Supply Current vs. Ambient Temperature
Average Supply Current vs.Supply Voltage
10
20
Average Supply Current (uA)
Average Supply Current (uA)
3.5
8
6
4
2
TA=25°C
18
16
14
12
10
8
6
4
2
0
0
-40
-20
0
20
40
60
80
2.5
100
Ambient Temperature (°C)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
3
3.5
4
4.5
5
Supply Voltage (V)
4
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APX9131
Typical Characteristics
Output Sink Current vs. Output Low Voltage
Output Switch Waveform
20
VDD=5V
VDD=4V
Output Sink Voltage (0.5V/div)
Output Sink Current (mA)
18
16
14
12
VDD=3V
10
8
6
4
2
0
0
0.2
0.4
0.6
0.8
VDD=3V
RL=5.1kΩ
CL=12pF
VOUT=0.5V/div
0
1
Output Low Voltage (V)
Time (2us/div)
Output Sink Voltage (0.5V/div)
Output Switch Waveform
VDD=3V
RL=5.1kΩ
CL=12pF
VOUT=0.5V/div
Time (50us/div)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
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APX9131
Function Description
Operation
Pole-independent
The output of APX9131 switches low (turns on) when
in presence of strong flux density facing the marked
side of package exceeds the operate point BOPS (or is
less than BOPN). After turn-on, the output is capable of
sinking up to 1 mA and the output voltage is low (turns
on). In absence of flux density below the release point
BRPS (or increased above BRPN), the APX9131 output
switches high (turns off). The difference in the magnetic
operated and released point is the hysteresis (Bhys) of
the device. This built-in hysteresis allows clean
switching of the output even in the presence of external
mechanical bouncing vibration and electrical noise.
The pole-independent sensing technique allows for
operation with either a north or south pole magnet
orientation, enhancing the manufacturability of the
device. The state-of-the-art technology provides the
same output polarity for either pole in presence.
Awake & Sleep
Internal awake & sleep timing block circuit activates the
sensor for 180 us and deactivates it for the remainder of
the period (60 ms). A short “awake” time allows for
stabilization prior to the sensor sampling and data
latching on the falling edge of the timing pulse. While
in sleep cycle the output is latched in its previous
state.
OUTPUT OFF
5V
MAX
BOPN
Chopper Stabilized Technique
BOPS
OUTPUT VOLTAGE
The chopper stabilized technique cancels the
mismatching of the hall element, the amplifier offset
voltage and temperature sensitive drift by the dynamic
offset cancellation and switched capacitor technique.
This technique produces devices have an extremely
stable Hall output voltage, therefore the magnetic
switch points are stable.
BRPN
0
-B
BRPS
OUTPUT ON
0
+B
MAGNETIC FLUX
Application Information
It is strongly recommended that an external bypass
capacitor be connected (in close to the Hall sensor)
between the supply and ground of the device to reduce
both external noise and noise generated by the
chopper-stabilization technique. This is especially
true due to the relatively high impedance of battery
supplies.The output is an open drain output, it must be
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
connected a pull-up resistor to a supply voltage which
is lower than 5V, connect a 50kΩ resistor to VDD in
common use.
6
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APX9131
Packaging Information
SOT-23
D
B
3
E
H
2
1
e
A
L
A1
Dim
A
A1
B
C
D
E
e
H
L
Millimeters
Min.
1.00
0.00
0.35
0.10
2.70
1.40
Min.
0.039
0.000
0.014
0.004
0.106
0.055
Max.
0.051
0.004
0.020
0.010
0.122
0.071
0.075/0.083 BSC.
0.094
0.118
0.015
1.90/2.1 BSC.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
Inches
Max.
1.30
0.10
0.51
0.25
3.10
1.80
2.40
0.37
C
3.00
7
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APX9131
Package Information
SOT-23 Thin
D
b
3
E1
E
2
1
e
e1
L1
R
A2
A
θ
c
L
A1
Dim
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
R
θ
Millimeters
Min.
0.70
0.00
0.70
0.35
0.10
2.80
2.60
1.50
Max.
0.90
0.10
0.80
0.51
0.25
3.00
3.00
1.70
Min.
0.028
0.000
0.028
0.014
0.004
0.110
0.102
0.059
0.95 BSC
1.90 BSC
0.37
-
0.10
0°
Max.
0.035
0.004
0.031
0.020
0.010
0.118
0.118
0.067
0.0374 BSC
0.0748 BSC
0.015
0.60 REF
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
Inches
0.0236 REF
8°
0.004
0°
8
8°
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APX9131
Package Information
TO-92M3
B
1
C
A
S
OVERLOOK
H
D
3
e
2
E
F
3
1
FRONT
2
RIGHT-SIDE LOOK
PIN 1 : VDD
H
PIN 2 : GND
PIN 3 : OUTPUT
Dim
A
B
C
D
e
E
F
G
H
I
S
φ1
φ2
φ3
Millimeters
Min.
1.40
10
14
0.35
2.80
1.24
3.90
2.34
4.04
0.35
2.51
0.63
Max.
1.60
11
15
0.41
3.20
1.30
4.30
2.64
4.24
0.41
2.57
0.81
Min.
0.055
0.394
0.551
0.014
0.110
0.049
0.154
0.092
0.159
0.014
0.099
0.025
5°
3°
45°
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
Inches
Max.
0.063
0.433
0.591
0.016
0.126
0.051
0.169
0.104
0.167
0.016
0.101
0.032
5°
3°
45°
9
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APX9131
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
3000 devices per reel
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
T L to T P
Temperature
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25 °C to Peak
Time
Classificatin Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (T L)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package .Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
10
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APX9131
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s
3
3
Package Thickness
Volume mm
Volume mm
<350
≥350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
Carrier Tape & Reel Dimensions
D
P
Po
t
E
P1
Bo
F
W
Ko
Ao
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
D1
11
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APX9131
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Application
SOT-23
A
B
C
J
T1
T2
178±1
60 ± 1.0
12.0
2.5 ± 0.15
9.0 ± 0.5
1.4
F
D
D1
φ0.1MIN
C
Po
P1
4.0
J
2.0 ± 0.05
T1
3.5 ± 0.05 1.5 +0.1
Application
A
B
SOT-23 Thin
TO-92
E
4.0
1.75
Ko
t
3.1
T2
3.0
W
1.3
P
0.2±0.03
E
178±1
60 ± 1.0
12.0
2.5 ± 0.15
9.0 ± 0.5
1.4
8.0+ 0.2
4.0±0.1
1.75±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
φ 1.1±0.1
4.0±0.1
2.0 ± 0.05
3.3±0.1
3.2±0.1
1.1±0.1
0.25±0.05
A2
A3
B0
B1
B2
C0
C1
90±1
31±1
76±1
5.8
3.8
F1=F2
F1-F2
M
H
H1
±0.3
2.5±0.5
16±0.5
9±0.5
L
L1
P
P1
18.5±0.5
11.0 MAX
2.5 MIN
12.7±0.3
6.35±0.4
T3
T4
W
W1
W2
15
1.7
18.0±0.2
6.0±0.2
≤1
A0
φ1.55+
0.05
A1
3.18~12
90±1
76±1
30±1
C2
D
D1
D2
3.5 ± 0.05
Application
P
Ao
W
8.0+ 0.3
- 0.3
Bo
7.8
4.0±0.2
H2
H2A
2.5+0.2
-0.1
H5=H0+M
0.36~0.53 9.0 MAX
H3
H4
0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX
P2
T
T1
T2
50.8±0.5 0.55 MAX 1.42 MAX 0.36~0.68
(mm)
Cover Tape Dimensions
Application
SOT- 23
SOT- 23 Thin
TO-92
Carrier Width
8
8
17.5~19
Cover Tape Width
5.3
5.3
5.0~7.0
Devices Per Reel
3000
3000
2000
(mm)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
12
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APX9131
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Sep., 2005
13
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