APX9131 Hall Effect Micro Switch IC Features General Description • • • The APX9131 integrated circuit is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. 2.5 volt to 3.5 volt operation and a unique clocking scheme reduce the average operating power requirements. Either a north or south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take adv antage of low-voltage and low-power requirements, SOT-23 and TO-92 packages provide an optimized package for most applications. Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture • • Small Size Package Lead Free Available (RoHS Compliant) Applications • • • • Micro Switch Handheld Wireless Application Wake Up Switch Pin Description Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications GND 1 : VDD APX9131 VDD Ordering Information 1 2 3 TO-92M3 Front View Package Code A: SOT-23 AT : SOT-23 Thin E : TO-92M3 Operating Ambient Temp. Range I : -40 to 85 ° C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device Lead Free Code Handling Code Temp. Range Package Code X31X VOUT SOT-23 APX9131 APX9131 A/AT: 2 : GND 3 : VOUT APL9131 E: X: Date Code APX 9131 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 1 www.anpec.com.tw APX9131 Function Pin Descriptions No 1 Name VDD 2 VOUT 3 GND Function Power Input When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN) the output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN), the output turns off (output is high). It is design with open drain configuration and connecting a pull up resistor from VOUT to VDD is necessary. It cannot be floating. Ground Connection Block Diagram VDD Awake & Sleep Timing Logic VOUT Dynamic Offset Cancellation Hall Plane Latch Circuit Chopper Amplifier Hysteresis Control GND Typical Applications 50KΩ VOUT VDD + APX9131 2.5V-3.5V 0.1uF GND - SOT-23 (Top View) Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 2 www.anpec.com.tw APX9131 Absolute Maximum Ratings (T A = 25°C unless otherwise noted) Symbol Parameter Rating Unit VDD Supply Voltage 5 V VOUT Output Voltage 5 V TJ Junction Temperature Range 150 TSTG Storage Temperature Range -65 to +150 Electrical Characteristics Symbol VDD (TA = 25°C, VDD=3V unless otherwise noted) Characteristic Supply Voltage Range Test Condition Operating APX9131 Min. Typ. Supply Current Max. 2.5 Average IDD °C Awake sleep IOFF Output Leakage Current VOUT = 3.5V, BRPN<B<BRPS VOL Output Low Voltage ISINK = 1mA Unit 3.5 V 5 10 µA 1.2 2 mA 2 8 µA 1.0 µA 40 mV 20 tawake Wake up Time 180 µs tperiod Period 60 mS d.c. Duty Cycle 0.3 % Chopping Frequency 11 KHz fc Magnetic Characteristics Symbol BOPS BOPN BRPS BRPN Bhys Characteristic (TA = 25°C, VDD=3V unless otherwise noted) Test Condition Operate Points Release Points Copyright ANPEC Electronics Corp. Min. Typ. Max. 50 75 G -50 G 10 35 G 15 3 Unit -75 -35 Hysteresis Rev. A.7 - Sep., 2005 APX9131 -10 G G www.anpec.com.tw APX9131 Typical Characteristics Switching Points vs. Supply Voltage Switching Points vs. Ambient Temperature 80 80 TA=25°C Switching Points (G) Switching Points (G) 60 BOPS 60 40 BRPS 20 0 -20 BRPN -40 40 BRPS 20 0 -20 BRPN -40 BOPN -60 BOPS BOPN -60 -80 -40 -20 0 20 40 60 80 2.5 100 3 Ambient Temperature (°C) 4 4.5 5 Supply Voltage (V) Average Supply Current vs. Ambient Temperature Average Supply Current vs.Supply Voltage 10 20 Average Supply Current (uA) Average Supply Current (uA) 3.5 8 6 4 2 TA=25°C 18 16 14 12 10 8 6 4 2 0 0 -40 -20 0 20 40 60 80 2.5 100 Ambient Temperature (°C) Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 3 3.5 4 4.5 5 Supply Voltage (V) 4 www.anpec.com.tw APX9131 Typical Characteristics Output Sink Current vs. Output Low Voltage Output Switch Waveform 20 VDD=5V VDD=4V Output Sink Voltage (0.5V/div) Output Sink Current (mA) 18 16 14 12 VDD=3V 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 VDD=3V RL=5.1kΩ CL=12pF VOUT=0.5V/div 0 1 Output Low Voltage (V) Time (2us/div) Output Sink Voltage (0.5V/div) Output Switch Waveform VDD=3V RL=5.1kΩ CL=12pF VOUT=0.5V/div Time (50us/div) Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 5 www.anpec.com.tw APX9131 Function Description Operation Pole-independent The output of APX9131 switches low (turns on) when in presence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1 mA and the output voltage is low (turns on). In absence of flux density below the release point BRPS (or increased above BRPN), the APX9131 output switches high (turns off). The difference in the magnetic operated and released point is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise. The pole-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180 us and deactivates it for the remainder of the period (60 ms). A short “awake” time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle the output is latched in its previous state. OUTPUT OFF 5V MAX BOPN Chopper Stabilized Technique BOPS OUTPUT VOLTAGE The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely stable Hall output voltage, therefore the magnetic switch points are stable. BRPN 0 -B BRPS OUTPUT ON 0 +B MAGNETIC FLUX Application Information It is strongly recommended that an external bypass capacitor be connected (in close to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies.The output is an open drain output, it must be Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 connected a pull-up resistor to a supply voltage which is lower than 5V, connect a 50kΩ resistor to VDD in common use. 6 www.anpec.com.tw APX9131 Packaging Information SOT-23 D B 3 E H 2 1 e A L A1 Dim A A1 B C D E e H L Millimeters Min. 1.00 0.00 0.35 0.10 2.70 1.40 Min. 0.039 0.000 0.014 0.004 0.106 0.055 Max. 0.051 0.004 0.020 0.010 0.122 0.071 0.075/0.083 BSC. 0.094 0.118 0.015 1.90/2.1 BSC. Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 Inches Max. 1.30 0.10 0.51 0.25 3.10 1.80 2.40 0.37 C 3.00 7 www.anpec.com.tw APX9131 Package Information SOT-23 Thin D b 3 E1 E 2 1 e e1 L1 R A2 A θ c L A1 Dim A A1 A2 b c D E E1 e e1 L L1 R θ Millimeters Min. 0.70 0.00 0.70 0.35 0.10 2.80 2.60 1.50 Max. 0.90 0.10 0.80 0.51 0.25 3.00 3.00 1.70 Min. 0.028 0.000 0.028 0.014 0.004 0.110 0.102 0.059 0.95 BSC 1.90 BSC 0.37 - 0.10 0° Max. 0.035 0.004 0.031 0.020 0.010 0.118 0.118 0.067 0.0374 BSC 0.0748 BSC 0.015 0.60 REF Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 Inches 0.0236 REF 8° 0.004 0° 8 8° www.anpec.com.tw APX9131 Package Information TO-92M3 B 1 C A S OVERLOOK H D 3 e 2 E F 3 1 FRONT 2 RIGHT-SIDE LOOK PIN 1 : VDD H PIN 2 : GND PIN 3 : OUTPUT Dim A B C D e E F G H I S φ1 φ2 φ3 Millimeters Min. 1.40 10 14 0.35 2.80 1.24 3.90 2.34 4.04 0.35 2.51 0.63 Max. 1.60 11 15 0.41 3.20 1.30 4.30 2.64 4.24 0.41 2.57 0.81 Min. 0.055 0.394 0.551 0.014 0.110 0.049 0.154 0.092 0.159 0.014 0.099 0.025 5° 3° 45° Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 Inches Max. 0.063 0.433 0.591 0.016 0.126 0.051 0.169 0.104 0.167 0.016 0.101 0.032 5° 3° 45° 9 www.anpec.com.tw APX9131 Physical Specifications Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 3000 devices per reel Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25 °C to Peak Time Classificatin Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (T L) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Note: All temperatures refer to topside of the package .Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 10 www.anpec.com.tw APX9131 Classificatin Reflow Profiles(Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s 3 3 Package Thickness Volume mm Volume mm <350 ≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121°C -65°C ~ 150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions D P Po t E P1 Bo F W Ko Ao Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 D1 11 www.anpec.com.tw APX9131 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Application SOT-23 A B C J T1 T2 178±1 60 ± 1.0 12.0 2.5 ± 0.15 9.0 ± 0.5 1.4 F D D1 φ0.1MIN C Po P1 4.0 J 2.0 ± 0.05 T1 3.5 ± 0.05 1.5 +0.1 Application A B SOT-23 Thin TO-92 E 4.0 1.75 Ko t 3.1 T2 3.0 W 1.3 P 0.2±0.03 E 178±1 60 ± 1.0 12.0 2.5 ± 0.15 9.0 ± 0.5 1.4 8.0+ 0.2 4.0±0.1 1.75±0.1 F D D1 Po P1 Ao Bo Ko t φ 1.1±0.1 4.0±0.1 2.0 ± 0.05 3.3±0.1 3.2±0.1 1.1±0.1 0.25±0.05 A2 A3 B0 B1 B2 C0 C1 90±1 31±1 76±1 5.8 3.8 F1=F2 F1-F2 M H H1 ±0.3 2.5±0.5 16±0.5 9±0.5 L L1 P P1 18.5±0.5 11.0 MAX 2.5 MIN 12.7±0.3 6.35±0.4 T3 T4 W W1 W2 15 1.7 18.0±0.2 6.0±0.2 ≤1 A0 φ1.55+ 0.05 A1 3.18~12 90±1 76±1 30±1 C2 D D1 D2 3.5 ± 0.05 Application P Ao W 8.0+ 0.3 - 0.3 Bo 7.8 4.0±0.2 H2 H2A 2.5+0.2 -0.1 H5=H0+M 0.36~0.53 9.0 MAX H3 H4 0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX P2 T T1 T2 50.8±0.5 0.55 MAX 1.42 MAX 0.36~0.68 (mm) Cover Tape Dimensions Application SOT- 23 SOT- 23 Thin TO-92 Carrier Width 8 8 17.5~19 Cover Tape Width 5.3 5.3 5.0~7.0 Devices Per Reel 3000 3000 2000 (mm) Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 12 www.anpec.com.tw APX9131 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 13 www.anpec.com.tw