March 1999 FDG6323L Integrated Load Switch General Description Features VDROP=0.2V @ VIN=5V, IL=0.36A. R(ON) = 0.55Ω VDROP=0.2V @ VIN=2.5V, IL=0.27A. R(ON) = 0.75Ω. This device is particularly suited for compact power management in portable electronic equipment where 2.5V to 8V input and 0.6A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 package. Very small package outline SC70-6. Control MOSFET (Q1) includes Zener protection for ESD ruggedness (>6KV Human Body Model). High density cell design for extremely low on-resistance. Compact industry standard SC70-6 surface mount package. SuperSOTTM-6 SOT-23 SC70-6 V IN , R1 4 VON/OFF 5 .23 SuperSOTTM-8 3 VOUT , C1 2 VOUT , C1 1 R2 SO-8 SOT-223 EQUIVALENT APPLICATION Q2 + IN VDROP - OUT Q1 pin 1 R1 , C1 6 SC70-6 See Application Circuit Absolute Maximum Ratings Symbol Parameter VIN VON/OFF IL Load Current ON/OFF TA = 25°C unless otherwise noted FDG6323L Units Input Voltage Range 2.5 - 8 V On/Off Voltage Range 1.5 - 8 V 0.6 A - Continuous (Note 1) - Pulsed (Note 1 & 3) PD Maximum Power Dissipation TJ,TSTG Operating and Storage Temperature Range ESD Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf/1500Ohm) (Note 2) 1.8 0.3 W -55 to 150 °C 6 kV 415 °C/W THERMAL CHARACTERISTICS RθJA Thermal Resistance, Junction-to-Ambient © 1999 Fairchild Semiconductor Corporation (Note 2) FDG6323L Rev.C Electrical Characteristics (T Symbol A = 25°C unless otherwise noted) Parameter Conditions Min Typ Max Units 1 µA 0.2 V OFF CHARACTERISTICS IFL Forward Leakage Current VIN = 8 V, VON/OFF = 0 V ON CHARACTERISTICS (Note 3) VDROP Conduction Voltage Drop R(ON) Q2 - Static On-Resistance IL Load Current VIN = 5 V, VON/OFF = 3.3 V, IL = 0.36 A 0.14 VIN = 2.5 V, VON/OFF = 3.3 V, IL = 0.27 A 0.15 0.2 VGS = -5 V, ID = -0.6 A 0.41 0.55 VGS = -2.5 V, ID = -0.5 A 0.58 0.75 VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 0.36 VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V 0.27 Ω A Notes: 1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V. 2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. 3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% FDG6323L Load Switch Application APPLICATION CIRCUIT Q2 IN OUT R1 C1 Q1 Co LOAD ON/OFF R2 External Component Recommendation R1 is required to turn Q2 off. R2 is optional for Slew Rate Control. For Co ≤ 1uF applications: First select R2,100 - 1KΩ, for Slew Rate control. Then select R1 such that R1/R2 ratio maintains between 10 - 100. FDG6323L Rev.C Typical Electrical Characteristics (TA = 25 OC unless otherwise noted ) 1.5 1.5 1.2 VDROP , (V) VDROP ,(V) TJ = 125°C V IN = 5V VON/OFF = 1.5 - 8V PW =300us, D≤ 2% 1.2 0.9 T = 125°C J 0.6 T = 25°C J 0.9 0.6 T = 25°C J 0.3 V IN = 2.5V VON/OFF = 1.5 - 8V PW =300us, D≤ 2% 0.3 0 0 0.4 0.8 1.2 1.6 0 2 0 0.4 0.8 IL ,(A) 1.2 1.6 2 IL , (A) Figure 2. Conduction Voltage Drop Variation with Load Current. Figure 1. Conduction Voltage Drop Variation with Load Current. 1 I L = 1A V ON/OFF = 1.5 - 8V PW =300us, D≤ 2% R (ON) ,(Ohm) 0.8 0.6 T = 125°C J 0.4 T = 25°C J 0.2 0 2 4 6 8 10 VIN , (V) Figure 3. On-Resistance Variation with Input Voltage. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 0.5 D = 0.5 0.2 0.2 0.1 0.05 0.02 0.01 R θJA (t) = r(t) * R θJA R θJA =415 °C/W 0.1 P(pk) 0.05 t1 0.02 0.01 t2 TJ - TA = P * R θJA (t) Single Pulse Duty Cycle, D = t 1/ t 2 0.005 0.002 0.0001 0.001 0.01 0.1 1 10 100 200 t 1, TIME (sec) Figure 4. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 2. Transient thermal response will change depending on the circuit board design. FDG6323L Rev.C SC70-6 Tape and Reel Data and Package Dimensions SC70-6 Packaging Configuration: Figure 1.0 Packaging Description: Customized Label SC70-6 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and some other options are described in the Packaging Information table. Antistatic Cover Tape These full reels are individually barcode labeled and placed inside a pizza box (illustrated in figure 1.0) made of recyclable corrugated brown paper with a Fairchild logo printing. One pizza box contains three reels maximum. And these pizza boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. F63TNR Static Dissipative Label Embossed Carrier Tape 21 21 21 21 21 SC70-6 Packaging Information Packaging Option Packaging type Standard (no flow code) TNR Pin 1 D87Z SC70-6 Unit Orientation TNR Qty per Reel/Tube/Bag 3,000 Reel Size 7" Dia 13" 184x187x47 343x343x64 Max qty per Box 9,000 30,000 Weight per unit (gm) 0.0055 0.0055 Weight per Reel (kg) 0.1140 0.3960 Box Dimension (mm) 10,000 343mm x 342mm x 64mm Intermediate box for D87Z Option F63TNR Barcode Label Note/Comments F63TNR Label F63TNR Label sample 184mm x 187mm x 47mm Pizza Box for Standard Option F63TNR Label LOT: CBVK741B019 QTY: 3000 FSID: FDG6302P SPEC: D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 SC70-6 Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 75 empty pockets Leader Tape 500mm minimum or 125 empty pockets August 1999, Rev. C SC70-6 Tape and Reel Data and Package Dimensions, continued SC70-6 Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SC70-6 (8mm) 2.24 +/-0.10 2.34 +/-0.10 W 8.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.125 +/-0.125 1.75 +/-0.10 F 6.25 min 3.50 +/-0.05 P1 P0 4.0 +/-0.1 4.0 +/-0.1 K0 T 1.20 +/-0.10 0.255 +/-0.150 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). Wc 5.2 +/-0.3 0.06 +/-0.02 0.5mm maximum 20 deg maximum Typical component cavity center line B0 Tc 0.5mm maximum 20 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SC70-6 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max See detail AA Dim N 7" Diameter Option B Min Dim C See detail AA W3 13" Diameter Option Dim D min W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B 8mm 7" Dia 7.00 177.8 0.059 1.5 0.512 +0.020/-0.008 13 +0.5/-0.2 Dim C 0.795 20.2 Dim D 2.165 55 Dim N 0.331 +0.059/-0.000 8.4 +1.5/0 Dim W1 Dim W2 0.567 14.4 0.311 – 0.429 7.9 – 10.9 Dim W3 (LSL-USL) 8mm 13" Dia 13.00 330 0.059 1.5 0.512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 – 0.429 7.9 – 10.9 July 1999, Rev. C SC70-6 Tape and Reel Data and Package Dimensions, continued SC70-6 (FS PKG Code 76) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0055 September 1998, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ISOPLANAR™ MICROWIRE™ POP™ PowerTrench™ QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ TinyLogic™ UHC™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.