AVAGO ASMT-MB00-NDF00 Moonstonetm 1 w power led light source Datasheet

ASMT-Mx00
MoonstoneTM 1 W Power LED Light Source
Data Sheet
Description
Features
TM
The Moonstone 1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to
the motherboard.
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide
variety of applications especially where height is a
constraint.
The package is compatible with reflow soldering
process. This will give more freedom and flexibility to
the light source designer.
 Available in Red, Amber, Green, Blue, Cool White and
Warm White color
 Energy efficient
 Exposed pad for excellent heat transfer
 Suitable for reflow soldering process
 High current operation
 Long operation life
 Wide viewing angle
 Silicone encapsulation
 ESD Class HBM Class 3B (threshold > 8 kV)
 MSL 2A for InGaN products
 MSL 4 for AlInGaP products
Specifications
Applications
 AllnGaP technology for Red and Amber
 Portable (flash light, bicycle head light)
 2.1V (typ) at 350mA for AllnGaP
 Reading light
 InGaN technology for Green, Blue, Cool White and
Warm White
 Architectural lighting
 Garden lighting
 Decorative lighting
 3.2V (typ) at 350mA for InGaN
Package Dimensions
10.00
1
Anode
2 Cathode
3
Heat Sink
3.30
8.50
1.27
Metal Slug
3
Ø 5.26
LED
10.60
8.50
+
−
ZENER
Ø 8.00
2.00
5.25
1.30
2
1
5.08
0.81
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specified.
3. Metal slug is connected to anode for electrically non-isolated option.
Device Selection Guide ( Tj = 25°C)
Luminous Flux, V[1,2] (lm)
Part Number
Color
Min.
Typ.
Max.
Test Current
(mA)
Dice
Technology
ASMT-MR00-AGH00
Red
25.5
35.0
43.0
350
AlInGaP
33.0
40.0
56.0
350
AlInGaP
ASMT-MR00-AHJ00
ASMT-MA00-AGH00
Amber
25.5
35.0
43.0
350
AlInGaP
ASMT-MG00
Green
43.0
60.0
73.0
350
InGaN
ASMT-MB00
Blue
11.5
15.0
25.5
350
InGaN
ASMT-MW00
Cool White
43.0
60.0
73.0
350
InGaN
ASMT-MY00
Warm White
43.0
50.0
73.0
350
InGaN
ASMT-MWB1
Cool White Diffused
43.0
55.0
73.0
350
InGaN
ASMT-MYB1
Warm White Diffused
43.0
46.0
73.0
350
InGaN
Notes
1. V is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition.
2. Flux tolerance is ± 10%.
2
Part Numbering System
ASMT-M x xx – x x1 x2 x3 x4
Packaging Option
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Silicone Type
00 – Non-diffused
B1 – Diffused
Color
R – Red
A – Amber
G - Green
B - Blue
W - Cool White
Y - Warm White
Note:
1. Please refer to Page 8 for selection details.
Absolute Maximum Ratings (TA = 25°C)
Parameter
ASMT-Mx00/ ASMT-MxB1
Units
DC Forward Current [1]
350
mA
Peak Pulsing Current [2]
1000
mA
Power Dissipation for AllnGaP
805
mW
Power Dissipation for InGaN
1225
mW
LED Junction Temperature for AllnGaP
125
°C
LED Junction Temperature for InGaN
110
°C
Operating Ambient Temperature Range
-40 to +100
°C
Storage Temperature Range
-40 to +120
°C
Reverse Volttage
[3]
Not recommended
Notes:
1. DC forward current – derate linearly based on Figure 5 for AlInGaP & Figure 11 for InGaN.
2. Pulse condition duty factor = 10%, Frequency = 1kHz.
3. Not recommended for reverse bias operation.
3
Optical Characteristics at 350 mA (TJ = 25°C)
Peak Wavelength,
λPEAK (nm)
Dominant Wavelength, λD [1] (nm)
Viewing Angle,
2θ½ [2] (°)
Luminous Efficiency
(lm/W)
Part Number
Color
Typ
Typ
Typ
Typ
ASMT-MR00-AGH00
Red
635
625
120
48
ASMT-MR00-AHJ00
Red
635
625
120
54
ASMT-MA00-AGH00
Amber
598
590
120
48
ASMT-MG00
Green
519
525
120
54
ASMT-MB00
Blue
454
460
120
13
Correlated Color
Temperature, CCT (Kelvin)
Viewing Angle,
2θ½ [2] (°)
Luminous Efficiency
(lm/W)
Part Number
Color
Min.
Max.
Typ
Typ
ASMT-MW00
Cool White
4000
10000
110
54
ASMT-MY00
Warm White
2600
4000
110
45
ASMT-MWB1
Cool White Diffused
4000
10000
110
49
ASMT-MYB1
Warm White Diffused
2600
4000
110
41
Electrical Characteristic at 350 mA (TJ = 25°C)
Forward Voltage VF (Volts) at IF = 350mA
Thermal Resistance
Rθ j-ms ( °C/W) [1]
Dice type
Min.
Typ.
Max.
Typ.
AllnGaP
1.7
2.1
2.3
12
InGaN
2.8
3.2
3.5
10
Notes:
1. Rθ j-ms is Thermal Resistance from LED junction to metal slug.
4
FORWARD CURRENT - mA
RED
AMBER
RELATIVE INTENSITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
WAVELENGTH - nm
680
730
780
Figure 1. Relative Intensity vs. Wavelength for AlInGaP
500
450
400
350
300
250
200
150
100
50
0
RELATIVE LUMINOUS FLUX (-v) - lm
1.2
RELATIVE INTENSITY
1.0
0.8
0.6
0.4
0.2
0
50
100
150 200 250 300 350 400
MONO PULSE CURRENT - mA
450 500
Figure 3. Relative Luminous Flux vs. Mono Pulse Current for AlInGaP
RELATIVE LOP (Normalized at 25°C)
I F - MAX FORWARD CURRENT - mA
2.5
3
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
30
OFF-AXIS ANGLE(°)
50
70
90
2
350
R JA = 60°C/W
300
R JA = 50°C/W
250
R JA = 40°C/W
200
150
100
50
0
10
20
30
40
50
60
70
T A - AMBIENT TEMPERATURE - °C
80
90
Figure 5. Maximum forward current vs. ambient temperature for AlInGaP
Derated based on TJMAX = 125°C, RθJA = 40°C/W / 50°C/W and 60°C/W
5
1
1.5
2
FORWARD VOLTAGE - V
Figure 4. Radiation Pattern for AlInGaP
400
0
0.5
Figure 2. Forward Current vs Forward Voltage for AlInGaP
1.4
0.0
0
RED
AMBER
1.5
1
0.5
0
-40 -25 -10
5
20 35 50 65 80
JUNCTION TEMPERATURE - °C
95 110 125
Figure 6. Relative LOP (Normalized at 25°C) vs. junction temperature for
AlInGaP
GREEN
BLUE
COOL WHITE
WARM WHITE
430
480
530
580
630
WAVELENGTH - nm
680
730
780
1.2
1.0
0.8
0.6
0.4
0.2
0
50
100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90
0.5
1
1.5
2
2.5
FORWARD VOLTAGE - V
400
540
350
530
RθJA = 50 C/W
300
RθJA = 40 C/W
250
200
RθJA = 30 C/W
150
100
50
0
10
20
30
40
50
60
70
T A – AMBIENT TEMPERATURE – °C
3
3.5
4
70
90
GREEN
BLUE
COOL WHITE
WARM WHITE
-70
-50
-30
-10 10
30
OFF-AXIS ANGLE (°)
50
Figure 10. Radiation Pattern for InGaN
DOMINANT WAVELENGTH – nm
I F – MAXIMUM FORWARD CURRENT – mA
Figure 9. Relative Luminous Flux vs Mono Pulse Current for InGaN
0
0
RELATIVE INTENSITY
RELATIVE LUMINOUS FLUX (φV) - lm
1.4
80
90
Figure 11. Maximum Forward Current vs. Ambient Temperature for InGaN
Derated based on TJMAX = 110°C, RJA = 30°C/W, 40°C/W and 50°C/W
6
500
450
400
350
300
250
200
150
100
50
0
Figure 8. Forward Current vs. Forward Voltage for InGaN
Figure 7. Relative Intensity vs. Wavelength for InGaN
0.0
FORWARD CURRENT - mA
RELATIVE INTENSITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
GREEN
520
510
500
490
480
BLUE
470
460
450
100
150
200
250
300
FORWARD CURRENT – mA
350
Figure 12. Dominant wavelength vs. forward current – InGaN devices
400
0.016
100 mA
0.014
150 mA
Y-COORDINATES
0.012
0.01
0.008
250 mA
0.006
0.004
300 mA
0.002
0
0
350 mA
0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008
X-COORDINATES
Figure 13. Chromaticity shift vs. current
*Note: (x,y) values @ 350 mA reference to (0.0)
10.70 ± 0.10
TEMPERATURE
10 - 30 SEC.
217 °C
200 °C
255 - 260 °C
3 °C/SEC. MAX.
8.40 ± 0.10
-6 °C/SEC. MAX.
17.00 ± 0.20
150 °C
3 °C/SEC. MAX.
1.00 ± 0.10
60 - 120 SEC.
100 SEC. MAX.
3.1 ± 0.10
5.08 ± 0.10
TIME
(Acc. to J-STD-020C)
300
250
200
150
100
50
0
-50
-100
-150
-200
-250
-300
-40
Figure 15. Recommended soldering land pattern
100
90
80
70
60
50
40
30
20
10
0
25 30 35 40 45 50 55 60 65 70 75 80 85 90
JUNCTION TEMPERATURE (°C)
RELATIVE LOP (%)
RELATIVE FORWARD VOLTAGE SHIFT (mV)
Figure 14. Recommended reflow soldering profile
-15
10
35
TEMPERATURE - °C
Figure 16. Temperature vs. relative forward voltage shift
60
85
GREEN
BLUE
COOL WHITE
WARM WHITE
95 100105110
Figure 17. Relative LOP vs Junction Temperature for InGaN Devices
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
7
Option Selection Details
Flux Bin Limit [x1 x2]
ASMT-Mxxx – x x1 x2 x3 x4
x1 – Minimum Flux Bin Selection
x2 – Maximum Flux Bin Selection
x3 – Color Bin Selection
x4 – Packaging Option
Bin
Luminous Flux (lm) at IF = 350mA
Min.
Max.
D
11.5
15.0
E
15.0
19.5
F
19.5
25.5
G
25.5
33.0
H
33.0
43.0
J
43.0
56.0
K
56.0
73.0
Tolerance for each bin limits is ±10%
Color Bin Selection [x3]
Individual reel will contain parts from one full bin only.
Cool White
Warm White
0
Full Distribution
0
Full Distribution
A
A only
A
A only
B
B only
B
B only
C
C only
C
C only
D
D only
D
D only
E
E only
E
E only
F
F only
F
F only
N
A and C only
G
G only
P
B and D only
H
H only
Q
E and C only
L
A and G only
R
F and D only
M
B and H only
U
E and F only
N
A and C only
W
C and D only
P
B and D only
Z
A and B only
Q
E and C only
1
A, B, C and D only
R
F and D only
4
C, D, E and F only
S
G and H only
U
E and F only
W
C and D only
Other Colors
0
Full Distribution
Z
A and B only
Z
A and B
1
A, B, C and D only
Y
B and C
2
G, H, A and B only
C and D
4
C, D, E and F only
W
V
D and E
Q
A, B and C
P
B, C and D
N
C, D and E
8
0.44
0.48
0.42
0.46
0.40
G
4.0k
A
0.36
C
0.34
5.6k
0.32
4.5k
H
Black Body Curve
7k D
E
0.30
B
0.44
Y - COORDINATE
Y - COORDINATE
0.38
0.40
E
0.38
3.5k
D
4.0k
F
2.6k
3.0k
B
Black Body Curve
0.34
0.26
0.24
0.24
C
0.36
10k F
0.28
A
0.42
0.26
0.28
0.30
0.32 0.34 0.36
X - COORDINATE
0.38
0.40
0.42
0.44
0.32
0.34
0.36
0.38
0.40
0.42
0.44
X - COORDINATE
0.46
0.48
0.50
Figure 19. Color bins (Warm White).
Figure 18. Color bins (Cool White).
Color Bin Limits
Warm
White
Color Limits
(Chromaticity Coordinates)
Cool
White
Color Limits
(Chromaticity Coordinates)
Bin A
x
y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
Bin A
x
y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin B
x
y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
Bin B
x
y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
Bin C
x
y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
Bin C
x
y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
Bin D
x
y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
Bin D
x
y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
Bin E
x
y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
Bin E
x
y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
Bin F
x
y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Bin F
x
y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
Bin G
x
y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Bin H
x
y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: ± 0.01
Color
Bin
Min.
Max.
Red
Full Distribution
620.0
635.0
Amber
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
E
592.0
594.5
A
455.0
460.0
B
460.0
465.0
C
465.0
470.0
D
470.0
475.0
A
515.0
520.0
B
520.0
525.0
C
525.0
530.0
D
530.0
535.0
Blue
Green
Tolerance: ± 1 nm
9
Tolerance: ± 0.01
0.52
Sub-Color Binning
(Only Applicable for Color Bin A to Bin D and Bin G to Bin H)
Color Limits
Cool White
(Chromaticity Coordinates)
Bin A1
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
Bin A2
Bin A3
Bin A4
Bin B1
Bin B2
Bin B3
Bin B4
Bin B5
Bin B6
Bin C1
Bin C2
Bin C3
Bin C4
0.364
0.383
0.364
0.383
0.329
0.357
0.329
0.345
0.362
0.372
0.360
0.357
0.358
0.343
0.329
0.331
0.329
0.331
0.343
0.331
0.329
0.369
0.329
0.357
0.314
0.355
0.315
0.344
0.367
0.400
0.362
0.372
0.329
0.369
0.329
0.357
0.360
0.357
0.358
0.343
0.356
0.330
0.329
0.345
0.344
0.344
0.341
0.314
0.329
0.357
0.329
0.345
0.315
0.344
0.316
0.333
0.348
0.385
0.346
0.359
0.348
0.385
0.347
0.372
0.344
0.344
0.343
0.331
0.341
0.314
0.346
0.359
0.343
0.331
0.329
0.302
0.315
0.344
0.316
0.333
0.303
0.333
0.305
0.322
0.347
0.372
0.347
0.372
0.347
0.372
0.346
0.359
0.346
0.359
0.344
0.344
0.343
0.331
0.344
0.344
0.329
0.320
0.329
0.320
0.314
0.355
0.315
0.344
0.301
0.342
0.303
0.333
Cool White
(Chromaticity Coordinates)
Bin D1
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
Bin D2
Bin D3
Bin D4
Bin D5
Bin D6
Bin G1
Bin G2
Bin H1
Bin H2
Bin H3
Tolerances ±0.01
0.44
0.42
0.40
G1
0.38
A3
Y - COORDINATE
G2
A1
0.36
C3
0.34
C4
0.32
7k
C2
B4
5.6k
B5
D1
D2
D4
0.30
C1
A4
D5
H1
A2
B1
B2
4.5k
4.0k
H2
H3
Black Body Curve
B3
B6
D3
D6
10k
0.28
0.26
0.24
0.24
0.26
0.28
0.30
0.32
0.34
X - COORDINATE
Figure 20. Sub-color bins (Cool White)
10
0.36
0.38
0.40
0.42
0.44
0.329
0.345
0.329
0.331
0.329
0.320
0.316
0.333
0.317
0.320
0.318
0.310
0.392
0.421
0.386
0.400
0.382
0.385
0.378
0.370
0.375
0.358
0.329
0.331
0.329
0.320
0.329
0.302
0.317
0.320
0.318
0.310
0.320
0.293
0.386
0.400
0.382
0.385
0.378
0.370
0.375
0.358
0.371
0.344
0.317
0.320
0.318
0.310
0.320
0.293
0.307
0.311
0.309
0.300
0.311
0.285
0.364
0.383
0.362
0.372
0.360
0.357
0.358
0.343
0.356
0.330
0.316
0.333
0.317
0.320
0.318
0.310
0.305
0.322
0.307
0.311
0.309
0.300
0.367
0.400
0.364
0.383
0.362
0.372
0.360
0.357
0.358
0.343
Packaging option [x4]
Example
Selection
Option
ASMT-MR00-AHJ00
0
Tube
1
Tape & Reel
ASMT-MR00-Axxxx
x1 = H
x2 = J
x3 = 0
x4 = 0
–
–
–
–
–
AllnGaP Red, Non-diffused
Minimum Flux Bin H
Maximum Flux Bin J
Full Distribution
Tube Option
Packing Tube - Option 0
1.00
5.80
4.65
5.50
37.00
5.45
10.10
8.30
535.00
SIDE VIEW
TOP VIEW
Figure 21. Tube dimensions
Tape & Reel - Option 1
Tape Dimension
B
Bo
W
F
E
A
2.5
B
A
Ko
Value
A0
8.80±0.10
B0
16.45±0.10
K0
3.60±0.10
W
24.0±0.10
P
16.0±0.10
Qty/Reel
250EA
Unit: mm
P
SECTION A
Ao
SECTION B
Figure 22. Carrier tape dimensions
Dim
Tape & Reel - Option 1 (Cont.)
Tape Dimension
END
START
THERE SHALL BE A MINIMUM OF
160 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A MINIMUM OF 390 mm OF EMPTY
COMPONENT POCKETS SEALED WITH COVER TAPE.
Figure 23. Carrier tape leader and trailer dimensions
Reel Dimensions
+1.00
24.0 −0.00
2.30
2.30
0
60.
99.50 ± 1.00
R10.0
2.50 ± 0.50
0º
0
±
.50
268.00
R10
13.50
330.00 ± 1.00
Figure 24. Reel dimensions
0.5
120.0º
± 0.50
Handling Precaution
The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage
the product and cause premature failure. During assembly or handling, the unit should be held on the body
only. Please refer to Avago Application Note AN5288 for
detail information.
B. Control after opening the MBB
Moisture Sensitivity
C. Control for unfinished reel
This product is qualified as Moisture Sensitive Level 2a
for InGaN devices and MSL 4 for AlInGaP devices per
Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
 Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, then it is safe to reflow the LEDs per the
original MSL rating.
 It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
 The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
 The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours for MSL 2a and 72 hours for MSL
4.
 For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
 If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their floor life of 672 hours for MSL 2a
and 72 hours for MSL 4.
E. Baking is required if
 HIC “10%” indicator is not blue and “5%” indicator
is pink. - The LEDs are exposed to condition of
>30°C/60% RH at any time.
 The LEDs floor life exceeded 672 hours for MSL 2a
and 72 hours for MSL 4.
Recommended baking condition: 60±5ºC for 20hrs.
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,
EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. Obsoletes AV01-0668EN
AV02-0129EN - May 24, 2011