Voltage Detector IC Series Free Delay Time Setting CMOS Voltage Detector IC Series No.09006EBT03 BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Description ROHM’s BD52□□G/FVE and BD53□□G/FVE series are highly accurate, low current consumption reset IC series with a built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand. Features 1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps 2) High accuracy detection voltage: ±1.0% 3) Ultra-low current consumption: 0.8µA (Typ.) 4) Nch open drain output (BD52□□G/FVE), CMOS output (BD53□□G/FVE) 5) Compact packages VSOF5: BD52□□FVE, BD53□□FVE SSOP5: BD52□□G, BD53□□G Applications All electronic devices that use micro controllers and logic circuits Selection Guide No. 1 Part Number : BD5 1 2 3 Specifications Output Circuit Format 2 Detection Voltage 3 Package Description 2:Open Drain Output, 3:CMOS Output Example: Displays VS over a 2.3V to 6.0V range in 0.1V increments. G:SSOP5 / FVE:VSOF5 Lineup Marking Detection Part Voltage Number Marking Detection Part Voltage Number Marking Detection Part Voltage Number Marking Detection Part Voltage Number PW 6.0V BD5260 PB 4.1V BD5241 RW 6.0V BD5360 RB 4.1V BD5341 PV 5.9V BD5259 PA 4.0V BD5240 RV 5.9V BD5359 RA 4.0V BD5340 PU 5.8V BD5258 MV 3.9V BD5239 RU 5.8V BD5358 QV 3.9V BD5339 PT 5.7V BD5257 MU 3.8V BD5238 RT 5.7V BD5357 QU 3.8V BD5338 PS 5.6V BD5256 MT 3.7V BD5237 RS 5.6V BD5356 QT 3.7V BD5337 PR 5.5V BD5255 MS 3.6V BD5236 RR 5.5V BD5355 QS 3.6V BD5336 PQ 5.4V BD5254 MR 3.5V BD5235 RQ 5.4V BD5354 QR 3.5V BD5335 PP 5.3V BD5253 MQ 3.4V BD5234 RP 5.3V BD5353 QQ 3.4V BD5334 BD5333 PN 5.2V BD5252 MP 3.3V BD5233 RN 5.2V BD5352 QP 3.3V PM 5.1V BD5251 MN 3.2V BD5232 RM 5.1V BD5351 QN 3.2V BD5332 PL 5.0V BD5250 MM 3.1V BD5231 RL 5.0V BD5350 QM 3.1V BD5331 PK 4.9V BD5249 ML 3.0V BD5230 RK 4.9V BD5349 QL 3.0V BD5330 PJ 4.8V BD5248 MK 2.9V BD5229 RJ 4.8V BD5348 QK 2.9V BD5329 PH 4.7V BD5247 MJ 2.8V BD5228 RH 4.7V BD5347 QJ 2.8V BD5328 PG 4.6V BD5246 MH 2.7V BD5227 RG 4.6V BD5346 QH 2.7V BD5327 PF 4.5V BD5245 MG 2.6V BD5226 RF 4.5V BD5345 QG 2.6V BD5326 PE 4.4V BD5244 MF 2.5V BD5225 RE 4.4V BD5344 QF 2.5V BD5325 PD 4.3V BD5243 ME 2.4V BD5224 RD 4.3V BD5343 QE 2.4V BD5324 PC 4.2V BD5242 MD 2.3V BD5223 RC 4.2V BD5342 QD 2.3V BD5323 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*3 SSOP5 Power *2*3 Dissipation VSOF5 Operating Temperature Ambient Storage Temperature Symbol VDD-GND Limits -0.3 ~ +10 GND-0.3 ~ +10 GND-0.3 ~ VDD+0.3 540 210 -40 ~ +105 -55 ~ +125 VOUT Pd Topr Tstg Unit V V mW °C °C *1 Use above Ta=25°C results in a 5.4mW loss per degree. *2 Use above Ta=25°C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted. Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Detection Voltage Symbol VDET Circuit Current when ON IDD1 Circuit Current when OFF IDD2 Operating Voltage Range VOPL ‘Low’ Output Current (Nch) IOL ‘High’ Output Current (Pch) IOH Leak Current when OFF Ileak Limit Typ. Condition *1 VDD=HL, RL=470kΩ VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET-0.2V VDET =4.3-5.2V VDET =5.3-6.0V VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET+2.0V VDET =4.3-5.2V VDET =5.3-6.0V VOL≤0.4V, Ta=25~105°C, RL=470kΩ VOL≤0.4V, Ta=-40~25°C, RL=470kΩ VDS=0.5V VDD=1.2V VDS=0.5V VDD=2.4V VDS=0.5V VDD=4.8V VDET=2.3-4.2V VDS=0.5V VDD=6.0V VDET=4.3-5.2V VDS=0.5V VDD=8.0V VDET=5.3-6.0V VDD=VDS=10V *1 VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ CT pin Threshold Voltage VCTH VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Hysteresis Voltage RCT ICT VDD=VDET×1.1 VCT=0.5V VCT=0.1V VDD=0.95V VCT=0.5V VDD=1.5V VDET/∆T Ta=-40°C to 105°C ∆VS VDD=LHL, RL=470kΩ *1 *1 Min. Max. VDET(T) VDET(T) VDET(T) ×0.99 ×1.01 0.80 2.40 0.85 2.55 0.90 2.70 0.95 2.85 0.75 2.25 0.80 2.40 0.85 2.55 0.90 2.70 0.95 1.20 0.4 1.2 2.0 5.0 0.7 1.4 0.9 1.8 1.1 2.2 0.1 VDD VDD VDD ×0.30 ×0.40 ×0.60 VDD VDD VDD ×0.30 ×0.45 ×0.60 VDD VDD VDD ×0.35 ×0.50 ×0.60 VDD VDD VDD ×0.40 ×0.50 ×0.60 5.5 9 12.5 15 40 150 240 - Unit V µA µA V mA mA µA V MΩ µA - ±100 ±360 ppm/°C VDET ×0.03 VDET ×0.05 VDET ×0.08 V VS(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25°C. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Block Diagrams BD52□□G/FVE BD53□□G/FVE VDD VDD VOUT VOUT Vref Vref CT GND CT GND Fig.1 Fig.2 TOP VIEW TOP VIEW SSOP5 VSOF5 PIN No. Symbol Function PIN No. Symbol Function 1 VOUT Reset Output 1 VOUT Reset Output 2 VDD Power Supply Voltage 2 SUB 3 GND GND 4 N.C. Unconnected Terminal 5 CT Substrate* Capacitor connection terminal for 3 CT Capacitor connection terminal for 4 GND GND output delay time 5 VDD Power Supply Voltage output delay time *Connect the substrate to GND. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series "LOW" OUTPUT CURRENT ： IOL [mA] 【BD5242G/FVE】 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6 7 8 9 10 18 【BD5242G/FVE】 15 12 9 6 3 1.0 1.5 2.0 6 5 4 Ta=25℃ 2 1 30 25 20 VDD =8.0V 15 VDD =6.0V 10 5 VDD =4.8V 0 0 Ta=25℃ 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 2 3 4 5 6 Fig.5 “High” Output Current 450 【BD5242G/FVE】 0.8 0.6 0.4 0.2 0.0 0.0 1 DRAIN-SOURCE VOLTAGE ： VDS[V] CT OUTPUT CURRENT ： ICT [μA] OUTPUT VOLTAGE： VOUT [V] 7 3 35 2.5 1.0 【BD5242G/FVE】 8 【BD5342G/FVE】 40 Fig.4 “Low” Output Current 9 【BD5242G/FVE】 400 350 300 250 200 150 100 50 0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 VDD SUPPLY VOLTAGE ：VDD [V] VDD SUPPLY VOLTAGE ： VDD [V] VDD SUPPLY VOLTAGE ： VDD [V] Fig.6 I/O Characteristics Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current CIRCUIT CURRENT WHEN ON ： IDD1 [μA] 5.4 【BD5242G/FVE】 5.0 Low to high(VDET+ΔVDET) 4.6 4.2 High to low(VDET) 3.8 3.4 ～ ～ 3.0 -40 0 40 80 TEMPERATURE ： Ta[℃] RESISTANCE OF CT ： RCT [MΩ] 【BD5242G/FVE】 1.0 0.5 20 40 60 80 1.0 0.5 0.0 -40 -20 0 20 40 60 80 【BD5242G/FVE】 1.0 0.5 0.0 -40 -20 100 100 13 12 11 10 9 8 7 6 5 4 3 2 1 0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] Fig.10 Circuit Current when ON 1.5 0 1.5 【BD5242G/FVE】 TEMPERATURE ： Ta[℃] Fig.9 Detection Voltage Release Voltage 0.0 -40 -20 1.5 CIRCUIT CURRENT WHEN OFF ： I DD2 [μA] OUTPUT VOLTAGE： VOUT [V] 0.5 45 DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current DETECTION VOLTAGE： VDET[V] VDD =1.2V 0 0.0 VDD SUPPLY VOLTAGE ：VDD [V] MINIMUM OPERATING VOLTAGE ： V OPL[V] VDD =2.4V Fig.11 Circuit Current when OFF 10000 【BD5242G/FVE】 0 20 40 60 80 【BD5242G/FVE】 1000 DELAY TIME ： TPLH [ms] CIRCUIT CURRENT ： IDD [μA] 2.0 "HIGH" OUTPUT CURRENT ： IOH [mA] Reference Data (Unless specified otherwise, Ta=25°C) 100 100 10 1 0.1 0.01 0.001 0.0001 0.001 0.01 0.1 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] CAPACITANCE OF CT ： CCT[μF] Fig.12 Operating Limit Voltage Fig.13 Ct Terminal Circuit Resistance Fig.14 Delay Time (TPLH) and CT Terminal External Capacitance www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD TPLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+∆VDET) VDD-VCTH TPLH = -CCT×RCT×ln VDD CCT: VCTH: CT pin Externally Attached Capacitance CT pin Threshold Voltage（P.2 VCTH refer.） RCT : CT pin Internal Impedance （P.2 RCT refer.） Ln : Natural Logarithm Reference Data of Falling Time (TPHL) Output Examples of Falling Time (TPHL) Output Part Number tPHL[µs] -40°C tPHL[µs] ,+25°C tPHL[µs],+105°C BD5227G 30.8 30 28.8 BD5327G 26.8 26 24.8 *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52□□G/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD RL R1 Q2 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 Q3 VOUT Q1 Q3 R3 R3 GND GND CT CT Fig.15 (BD52□□Type Internal Block Diagram) Fig.16 (BD53□□Type Internal Block Diagram) Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). 1 When the power supply is turned on, the output is unsettled from VDD after over the operating limit voltage (VOPL) until TPHL. There fore it is possible that the reset signal is not outputted when the rise time of VDET+ΔVDET ⑤ VDET VDD is faster than TPHL. 2 When VDD is greater than VOPL but less than the reset release VOPL 0V voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. VCT 3 If VDD exceeds the reset release voltage (VDET+∆VDET), then 1/2 VDD VOUT switches from L to H (with a delay to the CT terminal). 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of TPHL). VOUT PLH T TPHL TPLH 5 The potential difference between the detection voltage and the TPHL release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not flip-flop with power ① ② ③ ④ supply fluctuations within this hysteresis width, preventing malfunctions due to noise. Fig.17 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Circuit Applications 1) Examples of a common power supply detection reset circuit VDD1 VDD2 RL BD52□□□ Application examples of BD52□□G/FVE series (Open Drain output type) and BD53□□G/FVE series (CMOS output type) are shown below. Microcontroller CT CL （Noise-filtering Capacitor） ） GND Fig.18 Open Collector Output Type CASE1: the power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the open drain output type (BD52□□G/FVE) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15) CASE2: the power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BD53□□G/FVE) or open drain output type (BD52□□G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.16) VDD1 BD53□□□ Microcontroller CT CL When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). （Noise-filtering Capacitor） GND Fig.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltages resets the microcontroller. VDD1 VDD3 VDD2 RL BD52□□□ NO.1 BD52□□□ NO.2 RST microcontroller CT CT GND Fig.20 When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52□□G/FVE series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power supply voltage VDD3 of the microcontroller. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series 3) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 IDD R2 I1 R1 Through Current VDD BD52□□ BD53□□ CIN VOUT CL GND VDD VDET 0 Fig.21 A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. VDD - IDD Peak Current Ta=25°C 10 0.1 0.01 0.001 3 4 5 6 7 VDD[V] 8 9 10 VDD3V VDD5V VDD7V VDD10V 0.4 IDD peak current [mA] 1 IDD-peak[mA] Temp - IDD(BD52xx) BU43xx BU42xx BD52xx BD53xx 0.3 0.2 0.1 0 -50 -30 -10 10 30 50 Temp[°C] 70 90 110 Fig.22 Current Consumption vs. Power Supply Voltage *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/9 2009.06 - Rev.B 130 BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Technical Note Operation Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. The VDD line inpedance might cause oscillation because of the detection current. 8. A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9. Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes. 11. External parameters The recommended parameter range for CT is 100pF~0.1µF and RL is 50kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/9 2009.06 - Rev.B Technical Note BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series Part Number Selection B D 5 2 2 BD52: Adjustable Delay Time 3 － G T R Reset Voltage Value Package Taping Specifications CMOS Reset IC 23: 2.3V to (0.1V step) G: SSOP5 Embossed Taping Open Drain Type 60: 6.0V FVE: VSOF5 BD53: Adjustable Delay Time CMOS Reset IC CMOS Output Type SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 +0.05 0.42 −0.04 0.05±0.05 1.1±0.05 1.25Max. ) 0.95 0.1 Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. VSOF5 <Tape and Reel information> 1.2 ± 0.05 4 (MAX 1.28 include BURR) 1.6 ± 0.05 5 0.2MAX 1.6±0.05 1.0±0.05 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin 1 2 3 0.6MAX 0.13±0.05 0.5 Direction of feed 0.22±0.05 (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 9/9 ∗ Order quantity needs to be multiple of the minimum quantity. 2009.06 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A