Datasheet General-Purpose 4ch Electronic Volume with Built-in Advanced Switch BD3464FV General Description Key Specifications BD3464FV is a 4ch electronic volume which has the best audio efficiency in the industry. It has a volume switching shock sound prevention technique called “Advanced Switch,” supporting the construction of high quality car audio space by simple control. Features Reduce switching noise of volume by using Advanced Switch circuit. Energy-saving design resulting in low-current consumption by utilizing the Bi-CMOS process. It has the advantage in quality over scaling down the power heat control of the internal regulators. Arranges all I/O terminals together for easier PCB layout and smaller PCB area. I2C BUS can be controlled by 3.3V / 5V. Power Supply Voltage Range: Circuit Current (no signal): Total Harmonic Distortion: Maximum Input Voltage: Cross-talk between Selectors: Volume Control Range: Output Noise Voltage: Residual Output Noise Voltage: Operating Temperature Range: Package 7.0V to 9.5V 25mA (Typ) 0.0004%(Typ) 2.35Vrms (Typ) -105dB (Typ) +23dB to -79dB 1.9µVrms(Typ) 1.6µVrms (Typ) -40°C to +85°C W(Typ) x D(Typ) x H(Max) Applications It is optimal for car audio. It can also be used for car navigation, audio equipment of mini Compo, micro Compo, DVD, TV, etc. SSOP-B20 6.50mm x 6.40mm x 1.45mm Typical Application Circuit FIL SDA GND SCL CS VCC 10μ 10μ 15 14 13 12 Volume★ 16 4.7μ Volume★ 17 4.7μ Volume★ 18 19 4.7μ 4.7μ 2.2K Volume★ 20 OUTF1 OUTF2 OUTR1 OUTR2 0.1μ 11 7 8 9 10 VCC VCC/2 GND I2 C BUS LOGIC ■4 ch Volume +23dB～-79ｄB/1 step +23dB to -79dB/1dBdB step, -∞,-∞ ★： Advanced switch circuit 100k 1 100k 2 1μ INF1 3 1μ INF2 100k 100k 4 1μ INR1 5 6 Unit R : [Ω] C : [F] 1μ INR2 ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Pin Configuration TOP VIEW INF1 1 20 FIL INF2 2 19 GND INR1 3 18 SDA INR2 4 17 SCL NC 5 16 CS NC 6 15 VCC TEST1 7 14 OUTF1 TEST2 8 13 OUTF2 TEST3 9 12 OUTR1 10 11 OUTR2 NC Pin Descriptions 1 INF1 1ch Front input terminal 11 Pin Name OUTR2 2 INF2 2ch Front input terminal 12 OUTR1 1ch Rear output terminal 3 INR1 1ch Rear input terminal 13 OUTF2 2ch Front output terminal 4 INR2 2ch Rear input terminal 14 OUTF1 1ch Front output terminal 5 NC 15 VCC Pin No. Pin Name Description Pin No. Description 2ch Rear output terminal Power supply terminal 6 NC 16 CS Chip select terminal 7 TEST1 Test Pin 17 SCL I2C Communication clock terminal 8 TEST2 Test Pin 18 SDA I2C Communication data terminal 9 TEST3 Test Pin 19 GND GND terminal 10 NC 20 FIL www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/26 VCC/2 terminal TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Block Diagram 15 14 13 12 Volume★ 16 Volume★ 17 Volume★ 18 19 Volume★ 20 11 7 8 9 10 VCC VCC/2 GND I2C BUS LOGIC ■4ch Volume +23dB～-79ｄB/1dB step,-∞ +23dB to -79dB/1dB step, --∞ ★：Advanced switch circuit 100k 100k 1 2 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100k 3 100k 4 5 6 3/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Absolute Maximum Ratings (Ta=25°C) Symbol Rating Unit Power Supply Voltage Parameter VCC 10.0V V Input Voltage VIN VCC+0.3 to GND-0.3 V Power Dissipation Pd Storage Temperature 0.81 Tastg (Note 1) W °C -55 to +150 (Note 1) This value decreases 6.5mW/°C for Ta=25°C or more when mounted on ROHM standard board. Thermal resistance θja=153.8 (°C/W) ROHM Standard board Size : 70 x 70 x 1.6(mm3) Material : FR4 grass epoxy board(3% or less of copper foil area) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Rating Symbol Min Typ Max Unit Power Supply Voltage VCC 7.0 - 9.5 V Temperature Topr -40 - +85 °C Electrical Characteristics GENERAL BLOCK (Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, INF1 input, Volume 0dB) Limit Parameter Symbol Unit Conditions Min Typ Max Circuit Current (No Signal) IQ － 25 40 mA No signal Voltage Gain GV -1.5 0 +1.5 dB GV=20log(VOUT/VIN) Channel Balance CB -1.5 0 +1.5 dB Total Harmonic Distortion THD － 0.0004 0.05 % Output Noise Voltage ＊ VNO － 1.9 10 μVrms Residual Output Noise Voltage＊ VNOR － 1.6 10 μVrms Cross-talk Between Channels ＊ CTC － -105 -90 dB RR － -80 -40 THD CB=GV1-GV2 VOUT=1Vrms BW=400Hz-30KHz Rg=0Ω BW=IHF-A Volume=-∞dB Rg=0Ω BW=IHF-A Rg=0Ω CTC=20log(VOUT/VIN) BW=IHF-A f=100Hz VRR=100mVrms RR=20log(VOUT/VCCIN) Ripple Rejection www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Electrical Characteristics – continued BLOCK (Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, INF1 input, Volume 0dB) Limit Parameter Symbol Unit Conditions Min Typ Max Input Impedance RIN_V 70 100 130 kΩ VIM 2 2.35 － Vrms Maximum Gain GV_BST 21 23 25 dB Maximum Attenuation ＊ GV_MIN － -109 -90 dB Step Resolution GV_STEP － 1 － dB VIM AT THD+N(VOUT)=1% BW=400Hz-30KHz GAIN=23DB VIN=100mVrms GV=20log(VOUT/VIN) Volume=-∞dB GV=20log(VOUT/VIN) BW=IHF-A GAIN&ATT=+23dB to -79dB Gain Set Error GV_ERR -2 0 +2 dB GAIN=+1dB to +23dB Attenuation Set Error 1 GV_ERR1 -2 0 +2 dB ATT=-1dB to -15dB Attenuation Set Error 2 GV_ERR2 -3 0 +3 dB ATT=-16dB to -47dB Attenuation Set Error 3 GV_ERR3 -4 0 +4 dB ATT=-48dB to -79dB Output Impedance ROUT - － 50 Ω Maximum Output Voltage VOM 2 2.35 － Vrms VIN =100mVrms THD+N=1% BW=400Hz-30kHz VOLUME Maximum Input Voltage VP-9690A (Average value detection, effective value display) filter by Matsushita Communication is used for * measurement. Phase between input / output is same. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Typical Performance Curves Total Harmonic Distortion : THD+N [%] Quiescent Current : IQ [mA] 50 40 30 20 10 0 0 2 4 6 8 10 1 0.1 0.01 0.001 0.0001 0.001 10 Supply Voltage : VCC [V] Figure 1. Quiescent Current vs Supply Voltage 0.1 1 10 Figure 2. Total Harmonic Distortion vs Output Voltage 5 30 4 25 3 Volume Gain : GV [dB] Voltage Gain : GV [dB] 0.01 Output Voltage : VOUT [Vrms] 2 Gain=0dB 1 0 -1 -2 -3 20 15 10 5 0 -4 -5 -5 10 100 1k 10k 100k 10 Frequency : f [Hz] 1k 10k 100k Frequency : f [Hz] Figure 4. Volume Gain vs Frequency (0dB to +23dB) Figure 3. Voltage Gain vs Frequency www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 6/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Typical Performance Curves – continued 5 -30 Volume Attenuation : ATT [dB] Volume Attenuation : ATT [dB] 0 -5 -10 -15 -20 -25 -30 -35 -40 -50 -60 -70 -80 -90 -100 -40 -45 -110 10 100 1k 10k 100k 10 100 Frequency :f [Hz] 10k 100k Frequency :f [Hz] Figure 5. Volume Gain vs Frequency 1 (0dB to -40dB) Figure 6. Volume Gain vs Frequency 2 (-41dB to -79dB) 0 0 -20 Ripple Rejection : RR [dB] Cross-talk Between Channels : CTC [dB] 1k -40 -60 -80 -100 -20 -40 -60 -80 -100 -120 10 100 1k 10k 10 100k 100 1k 10k 100k Frequency : f [Hz] Frequency : f [Hz] Figure 7. Cross-Talk Between Channels vs Frequency Figure 8. Ripple Rejection Ratio vs Frequency 対 周波数特性 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Typical Performance Curves – continued 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 Voltage Gain : GV [dB] Output Noise : VNO [μVrms] 100 10 1 -40 -30 -20 -10 0 10 VCC=8.5V VOUT=2Vrms Volume=0dB 10 100 1k 10k 100k Frequency : f [Hz] 1000k Volume Attenuation : ATT [dB] Figure 9. Output Noise vs Volume Attenuation Figure 10. Volume Gain of Large Output Level vs Frequency Maximum Output Voltage : VOUT [Vrms] Total Harmonic Distortion : THD+N [dB] 1 0.1 0.01 0.001 0.0001 10 100 1k 10k 2.0 1.5 1.0 0.5 0.0 100 100k 1000 10000 100000 Load Resistance : RL [Ω] Frequency : f [Hz] Figure 11. Total Harmonic Distortion vs Frequency www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2.5 8/26 Figure 12. Maximum Output Voltage vs Load Resistance TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Typical Performance Curves – continued OUTF1 OUTF1 OUTF2 OUTF2 Figure 13. Advanced Switch 1 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 14. Advanced Switch 2 9/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Timing Chart Control Signal Specifications (1) Electrical Specifications and Timing for Bus Lines and I/O Stages SDA tBUF tHD;STAT tF tR tLOW tSP SCL tHD;STA P tHD;DAT tHIGH tSU;STAT tSU;DAT tSU;STOT Sr S P Figure15. I2C-bus Signal Timing Diagram Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices (Unless specified, Ta=25°C, VCC=8.5V) Parameter 1 2 3 4 5 6 7 8 9 Symbol SCL clock frequency Bus free time between a STOP and START condition Hold time (repeated) START condition. After this period, the first clock pulse is generated LOW period of the SCL clock HIGH period of the SCL clock Set-up time for a repeated START condition Data hold time Data set-up time Set-up time for STOP condition fSCL tBUF Fast-mode I2C-bus Min Max 400 0 1.3 － Unit kHz μS tHD;STA 0.6 － μS tLOW tHIGH 1.3 0.6 0.6 － － － － － － μS μS μS μS ns μS tSU;STA tHD;DAT tSU;DAT tSU;STO 0 (Note) 100 0.6 All values referred to VIH Min and VIL Max Levels (see Table 2). (Note) To avoid sending right after the fall-edge of SCL (VIH min of the SCL signal), the transmitter sets a holding time of 300ns or more for the SDA signal. About 7(tHD;DAT), 8(tSU;DAT), make it the setup which a margin is fully in . Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices Parameter 10 11 12 13 14 Symbol LOW level input voltage HIGH level input voltage Pulse width of spikes which must be suppressed by the input filter. LOW level output voltage (open drain or open collector) at 3mA sink current Input current of each I/O pin with an input voltage between 0.4V and 4.5V tHD;STA tHD;DAT ｔHD;STA :2µs ：2us ｔHD;DAT :1µs ：1us VIL VIH tSP Fast-mode devices Min Max -0.5 +1 2.3 － 0 50 Unit V V ns VOL1 0 0.4 V II -10 +10 μA tSU;DAT ｔSU;DAT :1µs ：1us tSU;STO ｔSU;STO :2µs ：2us SCL SCL ｔBUF tBUF ：4us :4µs ｔLOW tLOW ：3us :3µs tHIGH ｔHIGH ：1us :1µs SDA SDA SCL clock clock frequency：250kHz frequency : 250 kHz SCL Figure16. I2C Command Data Transmission Timing Diagram www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV (2) I2C BUS FORMAT S 1bit MSB LSB Slave Address 8bit S Slave Address MSB LSB MSB LSB A Select Address A Data A P 1bit 8bit 1bit 8bit 1bit 1bit = Start condition (Recognition of start bit) = Recognition of slave address. The first 7 bits correspond to the slave address. The least significant bit is “L” which corresponds to write mode. = ACKNOWLEDGE bit (Recognition of acknowledgement) = Select address corresponding to volume, bass or treble. = Data on every volume and tone. = Stop condition (Recognition of stop bit) A Select Address Data P (3) I2C BUS Interface Protocol (a) S (b) S Basic format Slave Address MSB LSB A MSB Select Address LSB A Data MSB LSB A P Automatic increment (Select Address increases (+1) according to the number of data. Slave Address A Select Address A Data1 A Data2 A ････ MSB LSB MSB LSB MSB LSB MSB LSB (Example) ①Data1 shall be set as data of address specified by Select Address. ②Data2 shall be set as data of address specified by Select Address +1. ③DataN shall be set as data of address specified by Select Address +N-1. DataN MSB (c) Configuration unavailable for transmission (In this case, only Select Address1 is set. S Slave Address A Select Address1 A Data A Select Address 2 A Data A MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB (Note)If any data is transmitted as Select Address 2 next to data, it is recognized as data, not as Select Address 2. A P LSB P (4) Slave Address Because the slave address can be changed by the setting of CS, it is possible to use two chips at the same time on identical BUS. MSB LSB SEL Voltage Condition A6 A5 A4 A3 A2 A1 A0 R/W 80H GND to 0.2 x VCC 1 0 0 0 0 0 0 0 84H 0.8 x VCC to VCC 1 0 0 0 0 1 0 0 Establish the CS voltage to define the setting. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV (5) Select Address & Data Items to be set Initial Setup 1 Volume 1ch Front Volume 2ch Front Volume 1ch Rear Volume 2ch Rear Test Mode1 Test Mode2 Test Mode3 System Reset Select Address (hex) MSB D7 D6 D5 01 28 29 2A 2B 2C 2D F0 FE 0 0 0 1 1 0 1 1 1 0 0 1 1 0 0 Data D4 LSB D3 0 0 Volume Gain / Attenuation Volume Gain / Attenuation Volume Gain / Attenuation Volume Gain / Attenuation 1 1 1 1 0 0 0 0 D2 D1 D0 0 0 0 1 1 0 0 1 1 0 0 1 1 0 1 Advanced Switch (Note) 1. The Advanced Switch works in the latch part while changing from one function to another. 2. Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as shown below. →01→28→29→2A→2B→2C→2D Select address 28, 29, 2A, 2B(hex) MSB Gain & ATT D7 0 0 Prohibition (Note) ： 0 23dB 0 22dB 0 21dB 0 D6 0 0 Volume Gain/Attenuation D5 D4 D3 D2 0 0 0 0 0 0 0 0 D1 0 0 LSB D0 0 1 ： 1 1 1 1 ： 1 1 1 1 ： 0 0 0 0 ： 1 1 1 1 ： 0 0 0 0 ： 0 0 1 1 ： 0 1 0 1 ： -78dB -78dB -79dB ： 1 1 1 1 ： 1 1 1 1 ： 0 0 0 0 ： 0 0 0 1 ： 1 1 1 0 ： 1 1 1 0 ： 1 1 1 0 ： 0 0 1 0 Prohibition (Note) ： 1 1 ： 1 1 ： 1 1 ： 1 1 ： 1 1 ： 1 1 ： 1 1 ： 0 1 -∞dB (Note) Gain is set to “-∞dB” when sending “Prohibition data”. (6) About Power ON Reset Initialization inside IC is carried out at one of supply voltage circuits. Initial data is sent to all addresses at supply voltage ON. Mute is ON until this initial data is sent. Parameter Limit Symbol Min Typ Max Unit Rise Time of VCC tRISE 20 － － μsec VCC Voltage of Release Power ON Reset VPOR － 4.1 － V www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/26 Conditions VCC rise time from 0V to 3V TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Application Information 1. Volume Gain/Attenuation of the details (dB) D7 D6 D5 D4 D3 D2 D1 +23 0 1 1 0 1 0 0 +22 0 1 1 0 1 0 1 +21 0 1 1 0 1 0 1 +20 0 1 1 0 1 1 0 +19 0 1 1 0 1 1 0 +18 0 1 1 0 1 1 1 +17 0 1 1 0 1 1 1 +16 0 1 1 1 0 0 0 +15 0 1 1 1 0 0 0 +14 0 1 1 1 0 0 1 +13 0 1 1 1 0 0 1 +12 0 1 1 1 0 1 0 +11 0 1 1 1 0 1 0 +10 0 1 1 1 0 1 1 +9 0 1 1 1 0 1 1 +8 0 1 1 1 1 0 0 +7 0 1 1 1 1 0 0 +6 0 1 1 1 1 0 1 +5 0 1 1 1 1 0 1 +4 0 1 1 1 1 1 0 +3 0 1 1 1 1 1 0 +2 0 1 1 1 1 1 1 +1 0 1 1 1 1 1 1 0 1 0 0 0 0 0 0 -1 1 0 0 0 0 0 0 -2 1 0 0 0 0 0 1 -3 1 0 0 0 0 0 1 -4 1 0 0 0 0 1 0 -5 1 0 0 0 0 1 0 -6 1 0 0 0 0 1 1 -7 1 0 0 0 0 1 1 -8 1 0 0 0 1 0 0 -9 1 0 0 0 1 0 0 -10 1 0 0 0 1 0 1 -11 1 0 0 0 1 0 1 -12 1 0 0 0 1 1 0 -13 1 0 0 0 1 1 0 -14 1 0 0 0 1 1 1 -15 1 0 0 0 1 1 1 -16 1 0 0 1 0 0 0 -17 1 0 0 1 0 0 0 -18 1 0 0 1 0 0 1 -19 1 0 0 1 0 0 1 -20 1 0 0 1 0 1 0 -21 1 0 0 1 0 1 0 -22 1 0 0 1 0 1 1 -23 1 0 0 1 0 1 1 -24 1 0 0 1 1 0 0 -25 1 0 0 1 1 0 0 -26 1 0 0 1 1 0 1 -27 1 0 0 1 1 0 1 -28 1 0 0 1 1 1 0 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 (dB) -29 -30 -31 -32 -33 -34 -35 -36 -37 -38 -39 -40 -41 -42 -43 -44 -45 -46 -47 -48 -49 -50 -51 -52 -53 -54 -55 -56 -57 -58 -59 -60 -61 -62 -63 -64 -65 -66 -67 -68 -69 -70 -71 -72 -73 -74 -75 -76 -77 -78 -79 -∞ D7 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D5 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 D4 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 D3 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 D2 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 D1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 1 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 ：Initial condition www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV 2. Application Circuit Diagram FIL SDA GND SCL CS VCC 10μ 10μ 4.7μ 2.2K 15 14 13 12 Volume★ 16 4.7μ Volume★ 17 4.7μ Volume★ 18 19 4.7μ Volume★ 20 OUTF1 OUTF2 OUTR1 OUTR2 0.1μ 11 7 8 9 10 VCC VCC/2 GND I2C BUS LOGIC ■4ch Volume +23dB～-79ｄB/1dB step,-∞ +23dB to -79dB/1dB step, --∞ ★：Advanced switch circuit 100k 100k 1 2 1μ INF1 100k 3 1μ INF2 100k 4 1μ INR1 5 6 1μ INR2 Figure 17. Application Circuit Diagram Unit R : [Ω] C : [F] Notes on wiring ① Please connect the decoupling capacitor of the power supply in the shortest distance as much as possible to GND. ② Lines of GND shall be one-point connected. ③ Wiring pattern of Digital shall be away from that of analog unit and cross-talk shall not be acceptable. ④ Lines of SCL and SDA of I2C BUS shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other. ⑤ Lines of analog input shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Power Dissipation About the thermal design by the IC Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two standpoints of immediate damage and long-term reliability of operation. Reference data SSOP-B20 Power Dissipation : Pd (W) 1.5 0.81W 1.0 Measurement condition: ROHM Standard board board Size : 70 x 70 x 1.6 (mm3) material : A FR4 grass epoxy board (3% or less of copper foil area) θja = 153.8°C/W 0.5 0.0 0 25 50 75 85 100 125 150 Ambient Temperature : Ta (°C) Figure 18. Temperature Derating Curve (SSOP-B20) (Note) Values are actual measurements and are not guaranteed. Power dissipation values vary according to the board on which the IC is mounted. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV I/O Equivalent Circuits Terminal No. Terminal Voltage Equivalent Circuit Signal input terminal. The input impedance is 100kΩ(typ). VCC INF1 INF2 INR1 INR2 Terminal Description 4.25 100KΩ GND Fader output terminal. VCC OUTR2 OUTR1 OUTF2 OUTF1 4.25 GND Slave address selection terminal. “CS” is “High” to slave address “84 H” “CS” is “Low” to slave address “80 H” VCC CS - GND The values in the input/output equivalent circuits are reference values only and are not guaranteed. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV I/O Equivalent Circuits – continued Terminal Name Terminal Voltage VCC 8.5 Equivalent Circuit Terminal Description Power supply terminal. Clock input terminal of I2C BUS communication. VCC Vcc SCL － 1.65V GND Data input terminal of I2C BUS communication. VCC Vcc SDA － 1.65V GND GND Ground terminal. 0 Voltage terminal for reference bias of analog signal system. The simple precharge circuit and simple discharge circuit for an external capacitor are built in. VCC 50k FIL 4.25 50k GND The values in the input/output equivalent circuits are reference values only and are not guaranteed. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 19. Example of monolithic IC structure 13. About a Signal Input Part About Input Coupling Capacitor Constant Value The constant value of input coupling capacitor C(F) is decided with respect to the input impedance RIN(Ω) at the input signal terminal of the IC. The first HPF characteristic of RC is composed. G〔dB〕 C〔F〕 0 RIN A(f) 〔Ω〕 SSH f〔Hz〕 INPUT A f www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/26 2 fCRIN 2 2 1 2 fCRIN TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes – continued 14. About Output Load Characteristics The usages of output load are below (reference). Please use more than 10[kΩ] (TYP) load. Output pin on target Pin Name Pin Name OUTF1 OUTR1 OUTF2 OUTR2 2.5 Output Voltage [Vrms] 2 1.5 1 VCC=8.5V VCC=8.5V THD+n=1% THD+n=1% BW=400Hz to 30kHz BW=400～30kHz 0.5 0 100 1k 10k 100k (Load)［Ω] Output Load Characteristic at VCC=8.5V. (Reference) 15. Frequency Characteristic at Large Output Level High slew-rate amplifiers are used for high quality sound. This IC corresponds to “192kHz sampling on DVD-Audio” which is highest quality. Output level is “2Vrms, 192kHz flat(typ)”. (See the below graph (reference)). Gain vs Frequency (Volume=0dB setting) 2 1 0 -1 Gain[dB] -2 -3 -4 -5 -6 -7 -8 -9 -10 10 100 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1k 10k Frequency [Hz] 20/26 100k 1000k TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes – continued 16. Oscillation Countermeasure for Volume Outputs at Power Supply ON/OFF Using higher capacitance than 22pF at volume outputs may cause oscillation at the moment you turn ON/OFF the power supply (when VCC is about 3V to 4V). As oscillation countermeasure, insert resistor in series to terminal directly as shown below, and set volume output to mute outside this device when turning ON/OFF the power supply. Resistor for oscillation countermeasure Capacitance Resistor in series to terminal directly C＜22pF 22＜C＜220pF Not necessary 220Ω Coupling capacitor Output Capacitive load (Included PCB capacitance etc) 17. I2C BUS Transferring Data [1] Types of Data Transfer 1-1. 1-2. The data transfer without Advanced Switch (data transfer without data latching format) does not have regulations on transferring data. The data transfer with Advanced Switch (data transfer with data latching format) does not have regulations on transferring data too. But Advanced Switch data transfer follows the order in [2]. [2] Advanced Switch Data Transfer 2-1. The timing chart of Advanced Switch data transfer is as follows. Data Transfer Example 1 slave select (VolumeF1 0dB) I2C BUS 80 28 AKS data 80 (VolumeR1 0dB) 80 2A 80 Test mode1 80 2C FF It starts after the Advanced switch of VolumeF1 Advanced switch timing VolumeF1 changing time VolumeF2 changing time VolumeF1 output VolumeR1 changing time VolumeR2 changing time VolumeR1 output (Note) It is the same even if it transfers data in auto increment mode. There are no timing regulations in I2C BUS transferring data. But the changing time starts after the end of the present change. In addition, the timing of Advanced Switch is not dependent on transferring data turn. Instead, it follows the following turn. Group① Group② VolumeF1 VolumeR1 28h 2Ah VolumeF2 VolumeR2 29h 2Bh Select address Advanced Switch Start Turn (Note) The block in the same group can start the Advanced Switch at the same time. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes – continued Data Transfer Example 2 Priority is given to the data of the same select address when it is transferred to the timing which Advanced Switch has not ended. In addition, when two or more data are transferred to the same select address, the end transferred data is effective. VolumeF1 Only the last of the data transmitted during the VolumeF1 change is effective. The data which have become invalid as a result (VolumeF1 0dB) I2C BUS 80 28 80 (VolumeF1 +1dB) 80 28 7F (VolumeF1 -1dB) 80 28 81 VolumeF1 Changing time Advanced switch timing VolumeF1 Changing time Data Transfer Example 3 Refresh data is the same as the present setup data, therefore Advanced switch does not change. The gain change data of other channels are transferred after refresh data as below. (VolumeF1 0dB) 2 I C BUS 80 28 VolumeF1 0dB) 80 80 28 80 VolumeR1 dB) 80 2A 80 Refresh data Advanced switch timing VolumeF1 changing time www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VolumeR1 changing time 22/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Operational Notes – continued [3] Attention on Transferring Data BD3464FV cannot set the data transfer from a microcomputer correctly on very rare occasions. In such cases, the following phenomenon may occur. 1. Volume gain does not change. 2. Volume gain changes to MUTE. Therefore, the data transfer from a microcomputer should send data as shown in the following conditions. ① When sending the Volume change data, please send the same data twice as below. slave select AKS data slave select AKS data Original Data 80 I2C BUS 28 80 80 80 80 Refresh Data FF FF 80 28 80 80 80 80 FF FF under 1.6msec under 1.6msec Output wave If Refresh data can’t be sent like ①timing, the output wave may be put on mute momentarily. slave select AKS data slave select AKS data Original Data 80 I2C BUS 28 80 80 80 80 Refresh Data FF FF 80 28 80 80 80 80 FF FF over 1.6msec over 1.6msec Output wave Output wave may not change the gain or may be mute until refresh data reception. ② If Volume change data can send over 94.08msec interval transferring data, there is no need to send Refresh data. slave select AKS data slave select AKS data data1 I 2C BUS 80 28 80 80 80 80 data2 FF FF 80 28 82 82 82 82 FF FF over 94.08msec over 94.08msec Output wave www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Ordering Information B D 3 4 6 4 Part Number F V - Package FV: SSOP-B20 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B20(TOP VIEW) Part Number Marking BD3464FV LOT Number 1PIN MARK www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP-B20 25/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 BD3464FV Revision History Date Revision 16.Dec.2015 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/26 TSZ02201-0C2C0E100370-1-2 16.Dec.2015 rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD3464FV - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD3464FV SSOP-B20 2500 2500 Taping inquiry Yes