Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR General Description Features The AP2316 is a series of low dropout three-terminal regulators with a dropout of 1.1V at 600mA output current. · · This product has been optimized for low voltage where transient response and minimum input voltage are critical. The AP2316 provides current limit and thermal shutdown. Its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within ±1%. On-chip thermal shutdown provides protection against any combination of overload and ambient temperatures that would create excessive junction temperatures. Low Dropout Voltage: 1.1V at 600mA Output Current Output Noise from 10Hz to 10KHz: 0.003% of VOUT · PSRR at IOUT=300mA and f=120Hz: 75dB · · · Output Voltage Accuracy: ± 1% On-chip Thermal Shutdown Maximum Quiescent Current: IQMAX=5mA · · ESD (Human Body Model): 3.5KV Operation Junction Temperature: -40 to 125oC Applications The AP2316 is available in 2.5V and 3.3V versions. The fixed versions integrate the corresponding resistor divider. · · · · · The AP2316 is available in the industry standard SOT89-3 power package. DVD/CD-ROM USB Device Add-on Card DVD Player PC Motherboard SOT-89-3 Figure 1. Package Type of AP2316 Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 1 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Pin Configuration R Package (SOT-89-3) 3 OUTPUT 2 INPUT (TAB) 1 GND Figure 2. Pin Configuration of AP2316 (Top View) Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 2 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Functional Block Diagram 2 Thermal Protection INPUT (TAB) + 3 1 OUTPUT GND Figure 3. Functional Block Diagram of AP2316 Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 3 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Ordering Information AP2316 - Circuit Type E1: Lead Free Package R: SOT-89-3 TR: Tape and Reel 2.5: Fixed Output 2.5V 3.3: Fixed Output 3.3V Package Temperature Range SOT-89-3 -40 to 125oC Part Number Marking ID Packing Type AP2316R-2.5TRE1 E27H Tape & Reel AP2316R-3.3TRE1 E27J Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 4 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage VIN 15 V TJ 150 o TSTG -65 to 150 o TLEAD 260 o Operating Junction Temperature Storage Temperature Range Lead Temperature (Soldering, 10sec) C C C Thermal Resistance (Note 2) θJA ESD (Human Body Model) ESD 3500 V ESD (Machine Model) ESD 350 V SOT-89-3 165 oC/W Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(max)=(TJ(max) TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. Recommended Operating Conditions Parameter Symbol Input Voltage VIN Operating Junction Temperature Range TJ Min -40 Apr. 2007 Rev. 1. 1 Max Unit 12 V 125 o C BCD Semiconductor Manufacturing Limited 5 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Electrical Characteristics Operating Conditions: VIN≤10V, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation) Limits appearing in Boldface type apply over the entire junction temperature range for operation, -40oC to 125oC Parameter Output Voltage Line Regulation Load Regulation Symbol VOUT ∆VOUT ∆VOUT Conditions Min Typ Max Unit AP2316-2.5 IOUT=10mA, VIN=4.5V, TJ=25oC 10mA≤IOUT≤600mA, 3.9V≤ VIN ≤10V 2.475 2.450 2.5 2.5 2.525 2.550 V AP2316-3.3 IOUT=10mA, VIN=5.0V, TJ=25oC 10mA≤IOUT≤ 600mA, 4.75V≤VIN≤10V AP2316-2.5 IOUT=10mA, 1.5V≤VIN-VOUT≤10V 3.267 3.235 3.3 3.3 3.333 3.365 V 1 6 mV AP2316-3.3 IOUT=10mA, 1.5V≤VIN-VOUT≤10V 1 6 mV AP2316-2.5 (VIN-VOUT)=2V, 10mA≤IOUT≤600mA 1 10 mV AP2316-3.3 (VIN-VOUT)=2V, 10mA≤ IOUT≤600mA 1 10 mV 1.1 1.3 V Dropout Voltage VDROP ∆VOUT=1%, IOUT=0.6A Current Limit ILIMIT (VIN-VOUT)=2V Quiescent Current IQ Ripple Rejection PSRR 0.75 A 0.9 VIN=VOUT+1.25V 5 f=120Hz, COUT=22µF (VIN-VOUT)=3V, IOUT=300mA Temperature Stability Long-Term Stability TA=125oC, RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature 1000hrs. Thermal Shutdown Hysteresis 60 75 dB 0.5 % 0.3 % 0.003 % 150 oC 25 Apr. 2007 Rev. 1. 1 mA o C BCD Semiconductor Manufacturing Limited 6 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR 15 20 10 15 Load Regulation (mV) Line Regulation (mV) Typical Performance Characteristics 5 0 -5 5 0 -5 -10 -15 -40 10 -20 0 20 40 60 80 100 120 -10 -40 140 -20 0 Figure 4. Line Regulation vs. Junction Temperature 60 80 100 120 140 Figure 5. Load Regulation vs. Junction Temperature 1.40 3.400 1.35 3.375 1.30 3.350 AP2316-3.3 VIN=4.8V, IOUT=10mA 1.25 Dropout Voltage (V) 3.325 Output Voltage (V) 40 Junction Temperature ( C) Junction Temperature ( C) 3.300 3.275 3.250 3.225 3.200 1.20 1.15 o TJ=-40 C 1.10 1.05 o TJ=0 C o TJ=25 C 1.00 0.95 0.90 3.175 0.85 3.150 0.80 3.125 0.75 3.100 -40 20 o o o TJ=125 C 0.70 -20 0 20 40 60 80 100 120 0 140 100 200 300 400 500 600 Output Current (mA) o Junction Temperature ( C) Figure 7. Dropout Voltage vs. Output Current Figure 6. Output Voltage vs. Junction Temperature Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 7 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics (Continued) 1.2 5.0 1.1 4.5 SOT-89-3 1.0 4.0 0.9 Current Limit (A) Power (W) 3.5 3.0 2.5 2.0 1.5 0.8 0.7 0.6 0.5 0.4 0.3 1.0 0.2 0.5 0.1 0.0 20 40 60 80 100 120 0.0 -40 140 -20 0 60 80 100 120 140 Figure 9. Current Limit vs. Junction Temperature 100 ∆VOUT (50mV/Div) 0.2 ∆VOUT (0.1V/Div) 40 Junction Temperature ( C) Figure 8. Maximum Power Dissipation 0.1 0 -0.1 5.8 50 0 -50 0.6 IOUT (0.3A/Div) VIN (0.5V/Div) 20 o o Case Temperature ( C) 5.3 4.8 4.3 0.3 0 0.01A -0.3 -0.6 3.8 Time (10µs/Div) Time (20µs/Div) Figure 10. Line Transient Response (Conditions: VIN=4.8 to 5.8V, VOUT=3.33V, IOUT=0.1A, CIN=1µF, COUT=10µF) Apr. 2007 Rev. 1. 1 Figure 11. Load Transient Response (Conditions: VIN=4.8V, VOUT=3.33V, IOUT=0.01 to 0.6A, CIN=COUT=10µF) BCD Semiconductor Manufacturing Limited 8 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics (Continued) 80 70 PSRR (dB) 60 50 40 30 20 10 10 100 1k 10k 100k Frequency (Hz) Figure 12. PSRR vs. Frequency Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 9 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Typical Application VIN=5.3V AP2316-3.3 + 10µF VIN 3.3V at 0.6A VOUT + 22µF GND Figure 13. Typical Application of AP2316 Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 10 Data Sheet AP1117M AP2316 600mA LOW DROPOUT LINEAR REGULATOR 600mA LOW DROPOUT LINEAR REGULATOR Mechanical Dimensions SOT-89-3 Unit: mm(inch) 4.400(0.173) 4.600(0.181) 1.630(0.064) 1.400(0.055) 1.600(0.063) 1.830(0.072) 0.000(0.000) 0.076(0.003) 1.400(0.055)* 1.200(0.047) 0.900(0.035) 3.950(0.156) 4.250(0.167) R0.200(0.008) 2.300(0.091) 2.600(0.102) 3° 10° 0.360(0.014) 0.360(0.014) 0.360(0.014) 0.520(0.020) 0.480(0.019) 0.440(0.017) 0.440(0.017) 3.000(0.118) 0.560(0.022) 3° 10° R0.150(0.006) Apr. 2007 Rev. 1. 1 BCD Semiconductor Manufacturing Limited 11 http://www.bcdsemi.com IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. MAIN SITE BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. 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