HDSEMI ES1DF Super fast recovery rectifier diode Datasheet

ES1AF THRU ES1JF
HD AF46
SMAF Plastic-Encapsulate Diodes
Super Fast Recovery Rectifier Diode
Features
●Io
1A
SMAF
●VRRM
50V-600V
●High surge current capability
●Glass passivated chip
● Polarity: Color band denotes cathode
Applications
● Rectifier
Marking
● ES1AF-ES1JF : ES1A-ES1J
Item
Symbol Unit
Test Conditions
ES1
AF BF
CF DF EF
GF HF
JF
Repetitive Peak Reverse Voltage
VRRM
V
50
100
150 200
300
400
500 600
Maximum RMS Voltage
V RMS
V
35
70
105 140
210
280
350 420
Average Forward Current
IF(AV)
A
60HZ Half-sine wave, Resistance
load, TL=120℃
1.0
Surge(Non-repetitive)Forward
Current
IFSM
A
60Hz Half-sine wave ,1 cycle ,
Ta =25℃
30
TJ
℃
-55~+150
TSTG
℃
-55 ~ +150
Junction Temperature
Storage Temperature
Electrical Characteristics (T=25℃ Unless otherwise specified)
ES1
Item
Symbol
Unit
Peak Forward Voltage
VF
V
Maximum reverse recovery
time
trr
ns
Peak Reverse Current
Thermal
Resistance(Typical)
IRRM1
I
μA
RθJ-A
Test Condition
IF =1.0A
AF BF
CF DF EF
0.95
IF=0.5A,IR=1.0A,Irr=0.25A
1.25
JF
1.70
35
Ta =25℃
5
Ta =100℃
100
Between junction and ambient
85
Between junction and terminal
351)
VRM=VRRM
GF HF
1)
℃/W
RθJ-L
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper
pad areas
High Diode Semiconductor
1
J
Typical Characteristics
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
IFSM(A)
IO(A)
FIG.1: FORWARD CURRENT DERATING CURVE
1.2
1.0
25
0.8
15
0.4
0
80
8.3ms Single Half Sine Wave
20
0.6
0.2
30
10
5
Resistive or Inductive Load
P.C.B. Mounted on 0.2"×0.2"
(5.0mm×5.0mm)Copper Pad Areas
90
100
110
120
130
140
0
150
TL(℃)
1
10
FIG.4:TYPICAL REVERSE CHARACTERISTICS
IR(uA)
FIG.3: TYPICAL FORWARD CHARACTERISTICS
IF(A)
100
Number of Cycles
100
TJ=25℃
Pulse width=300us
1% Duty Cycle
1000
Tj=150℃
ES1A-ES1D
10
Tj=125℃
100
Tj=100℃
ES1E-ES1G
1.0
10
ES1H-ES1J
0.1
1.0
Tj=25℃
0.01
0.4
0.1
0.6
0.8
1.0
1.2
1.4
1.6
VF(V)
0
20
40
60
80
100
Voltage(%)
FIG.5: Diagram of circuit and Testing wave form of reverse recovery time
I
D
trr
IF
VR
IF
RL
t
0
IRR
IR
High Diode Semiconductor
2
SMAF
.193(4.90)
.173(4.40)
.047(1.20)
.035(0.90)
.146(3.70)
.130(3.30)
.063(1.60)
.106(2.70) .051(1.30)
.094(2.40)
.007(0.18)
.005(0.12)
.051(1.30)
.031(0.80)
Dimensions in inches and (millimeters)
SMAF
1.9
4.65
0.55
JSHD
JSHD
High Diode Semiconductor
3
Reel Taping Specifications For Surface Mount Devices-SMAF
High Diode Semiconductor
4
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