APL5522 Dual-Channel, 3.3V/500mA and 2.5V/500mA Linear Regulator Features General Description • The APL5522 is a dual low dropout regulator with output 1 with 3.3V/0.5A and output2 with 2.5V/0.5A output Fixed Output Voltage : VOUT1=3.3V/500mA (within Maximum Power Dissipation) capability. In order to obtain lower dropout voltage and faster transient response, which is critical for low voltage VOUT2=2.5V/500mA (within Maximum Power applications, the APL5522 has been optimized. VOUT1 typical dropout voltage is 550mV at 500mA loading and VOUT2 Dissipation) • Low Dropout Voltage (Defined as the Minimum typical dropout voltage is 630mV at 500mA loading. Current limit is trimmed to ensure specified output current Input/Output Voltage Difference): Output 1 Dropout Voltage : 550mV (at 500mA) and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of over- Output 2 Dropout Voltage : 630mV (at 500mA) • Stable with 4.7µF Output Capacitor(at VOUT1 ) Stable with 4.7µF Output Capacitor(at VOUT2 ) • load that would create excessive junction temperatures. The APL5522 regulator comes in a SOP-8 and SOP-8P No Protection Diodes Needed packages. • Built-In Thermal Protection • Built-In Current-Limit Protection • Fast transient Response • Short Setting Time • SOP-8 and SOP-8P Packages Available • Lead Free and Green Devices Available Pin Configuration SOP-8 Top View (RoHS Compliant) Applications • Desktop Computer • Networking Systems • Optical Data Storage Systems SOP-8P Top View VOUT1 1 8 GND VOUT1 VIN 2 7 GND VIN VIN 3 4 6 5 GND GND VIN VOUT2 4 VOUT2 8 NC 2 7 GND 3 6 NC 5 NC 1 = Thermal Pad (The thermal pad of SOP-8P has to be connected to the GND plane to get better heat dissipation than SOP-8.) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 1 www.anpec.com.tw APL5522 Ordering and Marking Information Package Code K : SOP-8 KA : SOP-8P Operating Ambient Temperature Range C : 0 to 70 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL5522 Assembly Material Handling Code Temperature Range Package Code APL5522 K /KA: APL5522 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN, VOUT Parameter Power Dissipation TJ Operating Junction Temperature TL Rating Unit 6 V Internally Limited W Input Voltage or Out Voltage PD TSTG (Note 1) Storage Temperature Range 0 to 150 °C -65 to +150 °C 260 °C Maximum Lead Soldering Temperature, 10 Seconds Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit SOP-8 SOP-8P 120 65 °C/W SOP-8 SOP-8P 30 5 °C/W Thermal Resistance – Junction to Ambient RTH,JA Thermal Resistance – Junction to Case RTH,JC Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=COUT2=4.7µF, TJ=0 to 150°C. Typical values refer to TJ=25°C. Symbol Parameter VIN Input Voltage ISHORT Short Current VOUT=0V PSRR Ripple Rejection F≤1kHz, 1Vpp at VIN = VOUT+1.0V COUT=10nf Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 APL5522 Test Conditions 2 Unit Min. Typ. Max. 2.7 - 6 V - 50 - mA 45 55 - dB www.anpec.com.tw APL5522 Electrical Characteristics (Cont.) Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=COUT2=4.7µF, TJ=0 to 150°C. Typical values refer to TJ=25°C. Symbol IQ Parameter Quiescent Current APL5522 Test Conditions Unit Min. Typ. Max. IOUT1=300mA, IOUT2=300mA - 900 1000 IOUT1=0mA, IOUT2=0mA - 100 200 VOUT -2% 3.3 VOUT +2% V 800 - mA µA OUTPUT1 (500mA) VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX ILIMIT Circuit Current Limit VIN=VOUT+1V - Load Current VIN=VOUT+1V 500 - - mA REGLINE IOUT Line Regulation VOUT+1V< VCC<6.0V, IOUT=1mA - 4 10 mV REGLOAD Load Regulation VIN =VOUT+1V, 0mA< IOUT < IMAX - 26 40 mV % Load Transient VIN= VOUT+1V, IOUT=1mA-500mA in 1µs - 150 250 mV VDROP Dropout Voltage (Note2) IOUT =500mA - 0.6 0.7 V COUT Output Capacitor ESR - 4.7 - µF 0.01 0.1 1 Ohm VOUT -2% 2.5 VOUT +2% V 800 - mA OUTPUT2 (500mA) VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX ILIMIT Circuit Current Limit VIN=VOUT+1V - IOUT Load Current VIN=VOUT+1V 500 - - mA REGLINE Line Regulation VOUT+1V< VCC<6.0V, IOUT=1mA - 4 10 mV REGLOAD Load Regulation VIN =VOUT+1V, 0mA< IOUT < IMAX - 26 40 mV % VIN= VOUT+1V, IOUT=1mA-500mA in 1µs - 150 250 mV IOUT =500mA - 0.6 0.7 V - 4.7 - µF 0.01 0.1 1 Ohm Load Transient (Note2) VDROP Dropout Voltage COUT Output Capacitor ESR Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT+1V 1 Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 3 www.anpec.com.tw APL5522 Typical Operating Characteristics Quiescent Current vs. Input Voltage Output Voltage vs. Input Voltage 160 4 IOUT1=IOUT1=0mA IOUT=0mA 120 3 Output Voltage (V) Quiescent Current (µA) 140 100 80 60 40 2 1 20 0 0 0 1 2 3 4 5 6 0 1 2 4 5 6 Input Voltage (V) Input Voltage (V) Quiescent Current vs. Output Current Dropout Voltage vs. Output Current 900 700 800 VIN=5V 600 IOUT1=IOUT2 700 Dropout Voltage (mV) Quiescent Current (µA) 3 600 500 400 300 IOUT1=no load IOUT2=no load 200 500 400 VOUT2 300 200 VOUT1 100 100 0 0 0 100 200 0 300 Output Current (mA) Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 100 200 300 400 500 Output Current (mA) 4 www.anpec.com.tw APL5522 Typical Operating Characteristics (Cont.) Output1 Line Transient Output2 Line Transient VIN=4.5V to 5.5V (1V/div) Output2 Voltage Output Voltage VIN=4.5V to 5.5V (1V/div) CIN=1µF COUT1=4.7µF IOUT=10mA VOUT1(20mV/div) VOUT2(20mV/div) Time (100µs/div) Time (100µs/div) Output2 Load Transient VOUT(100mV/div) VOUT2=(200mV/div) Output1 Voltage (100mV/div) Output1 Voltage (100mV/div) Output1 Load Transient IL1=1mA~500mA COUT1=4.7µF(Aluminum) Tr=1µs Time (100µs/div) Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 CIN=1µF COUT2=4.7µF IOUT=10mA IL2=1mA~500mA COUT2=4.7µF(Aluminum) Tr=1µs Time (100µs/div) 5 www.anpec.com.tw APL5522 Typical Operating Characteristics (Cont.) Output1 Voltage vs. Temperature Output2 Voltage vs. Temperature 3.40 2.80 IOUT2=0mA IOUT1=0mA 2.70 Output2 Voltage (V) Output1 Voltage (V) 3.30 3.20 3.10 2.60 2.50 2.40 2.30 3.00 2.20 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) Temperature (°C) Safe Operating Area of SOP-8P Mounted on recommend mimimum footprint(RθJA=65°C/W) 600 , 2OZ Copper PCB area.(TJ,MAX=150°C ) 500 TA=25°C TA=55°C 400 200mil Output Current (mA) on both channels 700 300 TA=85°C 200 100 0 4.5 100mil 4.75 5 5.25 5.5 5.75 6 20mil 20mil V IN(V) Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 6 www.anpec.com.tw APL5522 Pin Description PIN I/O FUNCTION NO. NAME 1 VOUT1 O VOUT1 output Voltage 3.3V. sources up to 500 mA. 2 VIN I Supply Voltage. Voltage can range from 4V to 6V 3 VIN I Supply Voltage. Voltage can range from 4V to 6V 4 VOUT2 O VOUT2 output Voltage 2.5V. sources up to 500 mA. 5 GND 6 GND 7 GND 8 GND Ground also functions as a heatsink. Solder to the ground plane to maximize thermal dissipation Typical Application Circuit VOUT1 1 8 2 7 3 6 4 5 4.7µF VIN 1µF VOUT2 4.7µF APL5522K/KA Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 7 www.anpec.com.tw APL5522 Package Information SOP-8 D E E1 SEE VIEW A h X 45 ° A GAUGE PLANE SEATING PLANE A1 A2 c 0.25 b e L VIEW A S Y M B O L SOP-8 INCHES MILLIMETERS MIN. MAX. A MIN. MAX. 1.75 0.069 0.010 0.004 0.25 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0° 8° 0° 8° Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 8 www.anpec.com.tw APL5522 Package Information SOP-8P D SEE VIEW A E E1 THERMAL PAD E2 D1 h X 45 ° c A 0.25 b L 0 GAUGE PLANE SEATING PLANE A1 A2 e VIEW A S Y M B O L SOP-8P MILLIMETERS MIN. INCHES MAX. MAX. MIN. 0.063 A 1.60 A1 0.00 0.15 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 0.138 0.006 0.000 0.049 D1 2.25 3.50 0.098 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 E2 2.00 3.00 0.079 0.118 0.020 e 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 L 0.40 1.27 0.016 0.050 0 0o 8o 0o 8o Note : 1. Follow JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 9 www.anpec.com.tw APL5522 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOP-8(P) A H T1 C d D W E1 F 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.40±0.20 5.20±0.20 2.10±0.20 4.0±0.10 8.0±0.10 (mm) Devices Per Unit Package Type Unit Quantity SOP-8(P) Tape & Reel 2500 Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 10 www.anpec.com.tw APL5522 Taping Direction Information SOP-8(P) USER DIRECTION OF FEED Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 11 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA www.anpec.com.tw APL5522 Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness <2.5 mm ≥2.5 mm Volume mm3 <350 240 +0/-5°C 225 +0/-5°C Volume mm3 ≥350 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures Volume mm3 Volume mm3 Volume mm3 <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.7 - Dec., 2008 12 www.anpec.com.tw