Anpec APL5522 Dual-channel, 3.3v/500ma and 2.5v/500ma linear regulator Datasheet

APL5522
Dual-Channel, 3.3V/500mA and 2.5V/500mA Linear Regulator
Features
General Description
•
The APL5522 is a dual low dropout regulator with output
1 with 3.3V/0.5A and output2 with 2.5V/0.5A output
Fixed Output Voltage :
VOUT1=3.3V/500mA (within Maximum Power
Dissipation)
capability. In order to obtain lower dropout voltage and
faster transient response, which is critical for low voltage
VOUT2=2.5V/500mA (within Maximum Power
applications, the APL5522 has been optimized. VOUT1 typical dropout voltage is 550mV at 500mA loading and VOUT2
Dissipation)
•
Low Dropout Voltage (Defined as the Minimum
typical dropout voltage is 630mV at 500mA loading. Current limit is trimmed to ensure specified output current
Input/Output Voltage Difference):
Output 1 Dropout Voltage : 550mV (at 500mA)
and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of over-
Output 2 Dropout Voltage : 630mV (at 500mA)
•
Stable with 4.7µF Output Capacitor(at VOUT1 )
Stable with 4.7µF Output Capacitor(at VOUT2 )
•
load that would create excessive junction temperatures.
The APL5522 regulator comes in a SOP-8 and SOP-8P
No Protection Diodes Needed
packages.
•
Built-In Thermal Protection
•
Built-In Current-Limit Protection
•
Fast transient Response
•
Short Setting Time
•
SOP-8 and SOP-8P Packages Available
•
Lead Free and Green Devices Available
Pin Configuration
SOP-8 Top View
(RoHS Compliant)
Applications
•
Desktop Computer
•
Networking Systems
•
Optical Data Storage Systems
SOP-8P Top View
VOUT1
1
8
GND
VOUT1
VIN
2
7
GND
VIN
VIN
3
4
6
5
GND
GND
VIN
VOUT2
4
VOUT2
8
NC
2
7
GND
3
6
NC
5
NC
1
= Thermal Pad
(The thermal pad of SOP-8P has to be connected
to the GND plane to get better heat dissipation
than SOP-8.)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain
the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
1
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APL5522
Ordering and Marking Information
Package Code
K : SOP-8
KA : SOP-8P
Operating Ambient Temperature Range
C : 0 to 70 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5522
Assembly Material
Handling Code
Temperature Range
Package Code
APL5522 K /KA:
APL5522
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VIN, VOUT
Parameter
Power Dissipation
TJ
Operating Junction Temperature
TL
Rating
Unit
6
V
Internally Limited
W
Input Voltage or Out Voltage
PD
TSTG
(Note 1)
Storage Temperature Range
0 to 150
°C
-65 to +150
°C
260
°C
Maximum Lead Soldering Temperature, 10 Seconds
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
SOP-8
SOP-8P
120
65
°C/W
SOP-8
SOP-8P
30
5
°C/W
Thermal Resistance – Junction to Ambient
RTH,JA
Thermal Resistance – Junction to Case
RTH,JC
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=COUT2=4.7µF, TJ=0 to 150°C. Typical values
refer to TJ=25°C.
Symbol
Parameter
VIN
Input Voltage
ISHORT
Short Current
VOUT=0V
PSRR
Ripple Rejection
F≤1kHz, 1Vpp at VIN = VOUT+1.0V
COUT=10nf
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
APL5522
Test Conditions
2
Unit
Min.
Typ.
Max.
2.7
-
6
V
-
50
-
mA
45
55
-
dB
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APL5522
Electrical Characteristics (Cont.)
Unless otherwise noted these specifications apply over full temperature, CIN=1µF, COUT1=COUT2=4.7µF, TJ=0 to 150°C. Typical values
refer to TJ=25°C.
Symbol
IQ
Parameter
Quiescent Current
APL5522
Test Conditions
Unit
Min.
Typ.
Max.
IOUT1=300mA, IOUT2=300mA
-
900
1000
IOUT1=0mA, IOUT2=0mA
-
100
200
VOUT
-2%
3.3
VOUT
+2%
V
800
-
mA
µA
OUTPUT1 (500mA)
VOUT
Output Voltage
VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX
ILIMIT
Circuit Current Limit
VIN=VOUT+1V
-
Load Current
VIN=VOUT+1V
500
-
-
mA
REGLINE
IOUT
Line Regulation
VOUT+1V< VCC<6.0V, IOUT=1mA
-
4
10
mV
REGLOAD
Load Regulation
VIN =VOUT+1V, 0mA< IOUT < IMAX
-
26
40
mV %
Load Transient
VIN= VOUT+1V, IOUT=1mA-500mA in 1µs
-
150
250
mV
VDROP
Dropout Voltage (Note2)
IOUT =500mA
-
0.6
0.7
V
COUT
Output Capacitor
ESR
-
4.7
-
µF
0.01
0.1
1
Ohm
VOUT
-2%
2.5
VOUT
+2%
V
800
-
mA
OUTPUT2 (500mA)
VOUT
Output Voltage
VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX
ILIMIT
Circuit Current Limit
VIN=VOUT+1V
-
IOUT
Load Current
VIN=VOUT+1V
500
-
-
mA
REGLINE
Line Regulation
VOUT+1V< VCC<6.0V, IOUT=1mA
-
4
10
mV
REGLOAD
Load Regulation
VIN =VOUT+1V, 0mA< IOUT < IMAX
-
26
40
mV
%
VIN= VOUT+1V, IOUT=1mA-500mA in 1µs
-
150
250
mV
IOUT =500mA
-
0.6
0.7
V
-
4.7
-
µF
0.01
0.1
1
Ohm
Load Transient
(Note2)
VDROP
Dropout Voltage
COUT
Output Capacitor
ESR
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT+1V
1
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
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APL5522
Typical Operating Characteristics
Quiescent Current vs. Input Voltage
Output Voltage vs. Input Voltage
160
4
IOUT1=IOUT1=0mA
IOUT=0mA
120
3
Output Voltage (V)
Quiescent Current (µA)
140
100
80
60
40
2
1
20
0
0
0
1
2
3
4
5
6
0
1
2
4
5
6
Input Voltage (V)
Input Voltage (V)
Quiescent Current vs. Output Current
Dropout Voltage vs. Output Current
900
700
800
VIN=5V
600
IOUT1=IOUT2
700
Dropout Voltage (mV)
Quiescent Current (µA)
3
600
500
400
300
IOUT1=no load
IOUT2=no load
200
500
400
VOUT2
300
200
VOUT1
100
100
0
0
0
100
200
0
300
Output Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
100
200
300
400
500
Output Current (mA)
4
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APL5522
Typical Operating Characteristics (Cont.)
Output1 Line Transient
Output2 Line Transient
VIN=4.5V to 5.5V
(1V/div)
Output2 Voltage
Output Voltage
VIN=4.5V to 5.5V
(1V/div)
CIN=1µF
COUT1=4.7µF
IOUT=10mA
VOUT1(20mV/div)
VOUT2(20mV/div)
Time (100µs/div)
Time (100µs/div)
Output2 Load Transient
VOUT(100mV/div)
VOUT2=(200mV/div)
Output1 Voltage (100mV/div)
Output1 Voltage (100mV/div)
Output1 Load Transient
IL1=1mA~500mA
COUT1=4.7µF(Aluminum)
Tr=1µs
Time (100µs/div)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
CIN=1µF
COUT2=4.7µF
IOUT=10mA
IL2=1mA~500mA
COUT2=4.7µF(Aluminum)
Tr=1µs
Time (100µs/div)
5
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APL5522
Typical Operating Characteristics (Cont.)
Output1 Voltage vs. Temperature
Output2 Voltage vs. Temperature
3.40
2.80
IOUT2=0mA
IOUT1=0mA
2.70
Output2 Voltage (V)
Output1 Voltage (V)
3.30
3.20
3.10
2.60
2.50
2.40
2.30
3.00
2.20
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (°C)
Temperature (°C)
Safe Operating Area of SOP-8P
Mounted on recommend mimimum footprint(RθJA=65°C/W)
600
, 2OZ Copper PCB area.(TJ,MAX=150°C )
500
TA=25°C
TA=55°C
400
200mil
Output Current (mA) on both channels
700
300
TA=85°C
200
100
0
4.5
100mil
4.75
5
5.25
5.5
5.75
6
20mil
20mil
V IN(V)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
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APL5522
Pin Description
PIN
I/O
FUNCTION
NO.
NAME
1
VOUT1
O
VOUT1 output Voltage 3.3V. sources up to 500 mA.
2
VIN
I
Supply Voltage. Voltage can range from 4V to 6V
3
VIN
I
Supply Voltage. Voltage can range from 4V to 6V
4
VOUT2
O
VOUT2 output Voltage 2.5V. sources up to 500 mA.
5
GND
6
GND
7
GND
8
GND
Ground also functions as a heatsink. Solder to the ground plane to
maximize thermal dissipation
Typical Application Circuit
VOUT1
1
8
2
7
3
6
4
5
4.7µF
VIN
1µF
VOUT2
4.7µF
APL5522K/KA
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
7
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APL5522
Package Information
SOP-8
D
E
E1
SEE VIEW A
h X 45
°
A
GAUGE PLANE
SEATING PLANE
A1
A2
c
0.25
b
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
INCHES
MILLIMETERS
MIN.
MAX.
A
MIN.
MAX.
1.75
0.069
0.010
0.004
0.25
A1
0.10
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
0.049
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
8
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APL5522
Package Information
SOP-8P
D
SEE VIEW
A
E
E1
THERMAL
PAD
E2
D1
h X 45
°
c
A
0.25
b
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
SOP-8P
MILLIMETERS
MIN.
INCHES
MAX.
MAX.
MIN.
0.063
A
1.60
A1
0.00
0.15
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
0.138
0.006
0.000
0.049
D1
2.25
3.50
0.098
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
E2
2.00
3.00
0.079
0.118
0.020
e
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
L
0.40
1.27
0.016
0.050
0
0o
8o
0o
8o
Note : 1. Follow JEDEC MS-012 BA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
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APL5522
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOP-8(P)
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
4.0±0.10
8.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-8(P)
Tape & Reel
2500
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
10
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APL5522
Taping Direction Information
SOP-8(P)
USER DIRECTION OF FEED
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
11
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
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APL5522
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness
<2.5 mm
≥2.5 mm
Volume mm3
<350
240 +0/-5°C
225 +0/-5°C
Volume mm3
≥350
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification
temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Dec., 2008
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