I2C®-Compatible, Wide Bandwidth, Triple 2 × 2 Crosspoint Switch ADG799A/ADG799G Bandwidth: 230 MHz Low insertion loss and on resistance: 2.6 Ω typical On resistance flatness: 0.3 Ω typical Single 3 V/5 V supply operation 3.3 V analog signal range (5 V supply, 75 Ω load) Low quiescent supply current: 1 nA typical Fast switching times: tON =184 ns, tOFF = 180 ns I2C-compatible interface Compact 24-lead LFCSP Two I2C-controllable logic outputs (ADG799G only) ESD protection 4 kV human body model 200 V machine model 1 kV field-induced charged device model FUNCTIONAL BLOCK DIAGRAMS VDD VDD GND ADG799G ADG799A S1A S1B S2A S2B S3A 2×2 CROSSPOINT D1A S1A D1B S1B 2×2 CROSSPOINT D2A S2A D2B S2B D3A S3A D3B S3B 2×2 CROSSPOINT S3B I2C SERIAL INTERFACE A0 A1 GND D1A 2×2 CROSSPOINT D2A 2×2 CROSSPOINT D3A I2C SERIAL INTERFACE GPO1 A2 SDA SCL 2×2 CROSSPOINT A0 A1 D1B D2B D3B GPO2 A2 SDA SCL 06038-001 FEATURES Figure 1. ADG799A and ADG799G APPLICATIONS RGB/YPbPr video switches HDTV Projection TV DVD-R/RW AV receivers GENERAL DESCRIPTION The ADG799A/ADG799G are monolithic CMOS devices comprising three 2 × 2 crosspoint switches controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation, yet offers high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range, make the ADG799A/ADG799G the ideal switching solution for a wide range of TV applications including RGB and YPbPr video switches for picture-in picture applications. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The ADG799A/ADG799G switches exhibit break-before-make switching action. The ADG799G has two general-purpose logic output pins controlled by the I2C interface that can also be used to control other non-I2C-compatible devices such as video filters. The integrated I2C interface provides a large degree of flexibility in the system design. It has three user-adjustable I2C address pins that allow up to eight devices on the same bus. This allows the user to expand the capability of the device by increasing the size of the switching array. The ADG799A/ADG799G operate from single 3 V or 5 V supply voltages and are available in a compact, 4 mm × 4 mm body, 24-lead, Pb-free LFCSP. PRODUCT HIGHLIGHTS 1. Wide bandwidth: 230 MHz. 2. Ultralow power dissipation. 3. Extended input signal range. 4. Integrated I2C serial interface. 5. Compact 4 mm × 4 mm, 24-lead, Pb-free LFCSP. 6. ESD protection tested as per ESD Association standards: • • • 4 kV HBM (ANSI/ESD STM5.1-2001) 200 V MM (ANSI/ESD STM5.2-1999) 1 kV FICDM (ANSI/ESD STM5.3.1-1999) Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. ADG799A/ADG799G TABLE OF CONTENTS Features .............................................................................................. 1 Terminology .................................................................................... 16 Applications....................................................................................... 1 Theory of Operation ...................................................................... 17 Functional Block Diagrams............................................................. 1 I2C Serial Interface ..................................................................... 17 General Description ......................................................................... 1 I2C Address.................................................................................. 17 Product Highlights ........................................................................... 1 Write Operation.......................................................................... 17 Revision History ............................................................................... 2 LDSW Bit..................................................................................... 19 Specifications..................................................................................... 3 Power On/Software Reset.......................................................... 19 I2C Timing Specifications............................................................ 7 Read Operation........................................................................... 19 Absolute Maximum Ratings............................................................ 9 Evaluation Board ............................................................................ 20 ESD Caution.................................................................................. 9 Using the ADG799G Evaluation Board .................................. 20 Pin Configurations and Function Descriptions ......................... 10 Outline Dimensions ....................................................................... 23 Typical Performance Characteristics ........................................... 11 Ordering Guide .......................................................................... 23 Test Circuits..................................................................................... 14 REVISION HISTORY 7/06—Revision 0: Initial Version Rev. 0 | Page 2 of 24 ADG799A/ADG799G SPECIFICATIONS VDD = 5 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS3 A0, A1, A2 Pins Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS SDA Pin3 Output Low Voltage, VOL Conditions Min VS = VDD, RL = 1 MΩ VS =VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA 0 0 Typ 1 2.6 0.15 0.3 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = 4 V/1 V, VS = 1 V/4 V, see Figure 23 VD = VS = 4 V/1 V, see Figure 24 ±0.25 ±0.25 ±0.25 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 184 180 3 1 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal Max Unit 4 3.3 5 5.5 1.85 1.85 0.55 V V Ω Ω Ω Ω Ω nA nA nA 240 235 ns ns ns 130 −60 ns dB −50 −80 230 0.14 4 13 17 35 70 0.56 0.79 dB dB MHz % pC pF pF pF dB % Degrees 2.0 VIN = 0 V to VDD 0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD ISINK = 3 mA ISINK = 6 mA Floating State Leakage Current Floating State Output Capacitance Rev. 0 | Page 3 of 24 +0.005 0.05 × VDD 3 0.8 ±1 V V μA pF VDD + 0.3 +0.3 × VDD ±1 V V μA V pF 0.4 0.6 ±1 10 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min ILOAD = 2 mA ILOAD = −2 mA 2.0 Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz 1 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. 2 Rev. 0 | Page 4 of 24 Typ 1 0.001 Max Unit 0.4 V V 1 μA 0.2 0.7 mA mA ADG799A/ADG799G VDD = 3 V ± 10%, GND = 0 V, TA = −40°C to +85°C, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range 2 On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Source Off Leakage (IS(OFF)) Drain Off Leakage (ID(OFF)) Channel On Leakage (ID(ON), IS(ON)) DYNAMIC CHARACTERISTICS 3 tON, tENABLE tOFF, tDISABLE Break-Before-Make Time Delay, tD I2C to GPO Propagation Delay, tH, tL (ADG799G only) Off Isolation Channel-to-Channel Crosstalk Same Crosspoint Switch Different Crosspoint Switch −3 dB Bandwidth THD + N Charge Injection CS(OFF) CD(OFF) CD(ON), CS(ON) Power Supply Rejection Ratio, PSRR Differential Gain Error Differential Phase Error LOGIC INPUTS A0, A1, A2 Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Input Capacitance, CIN SCL, SDA Pins3 Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUTS3 SDA Pin Output Low Voltage, VOL Conditions Min VS = VDD, RL = 1 MΩ VS = VDD, RL = 75 Ω VD = 0 V, IDS = −10 mA, see Figure 22 VD = 0 V to 1 V, IDS = −10 mA, see Figure 22 VD = 0 V, IDS = −10 mA VD = 1 V, IDS = −10 mA VD = 0 V to 1 V, IDS = −10 mA 0 0 Typ 1 3 0.15 0.3 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = 2 V/1 V, VS = 1 V/2 V, see Figure 23 VD = VS = 2 V/1 V, see Figure 24 ±0.25 ±0.25 ±0.25 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS = 2 V, see Figure 28 CL = 35 pF, RL = 50 Ω, VS1 = VS2 = 2 V, see Figure 29 203 200 3 1 f = 10 MHz, RL = 50 Ω, see Figure 26 f = 10 MHz, RL = 50 Ω, see Figure 27 RL = 50 Ω, see Figure 15 RL = 100 Ω CL = 1 nF, VS = 0 V, see Figure 30 f = 20 kHz CCIR330 test signal CCIR330 test signal Max Unit 2.2 1.7 5.5 8 1.8 2.1 2.8 V V Ω Ω Ω Ω Ω nA nA nA 266 260 ns ns ns 121 ns −60 dB −50 −80 210 0.14 2 13 17 35 70 0.66 1 dB dB MHz % pC pF pF pF dB % Degrees 2.0 VIN = 0 V to VDD +0.005 3 0.7 × VDD −0.3 VIN = 0 V to VDD 0.005 0.05 × VDD 3 ISINK = 3 mA ISINK = 6 mA Floating State Leakage Current Floating State Output Capacitance 3 Rev. 0 | Page 5 of 24 0.8 ±1 V V μA pF VDD + 0.3 +0.3 × VDD ±1 V V μA V pF 0.4 0.6 ±1 V V μA pF ADG799A/ADG799G Parameter GPO1 and GPO2 Pins Output Low Voltage, VOL Output High Voltage, VOH POWER REQUIREMENTS IDD Conditions Min ILOAD = 2 mA ILOAD = −2 mA 2.0 Digital inputs = 0 V or VDD, I2C interface inactive I2C interface active, fSCL = 400 kHz I2C interface active, fSCL = 3.4 MHz 1 All typical values are at TA = +25°C, unless otherwise stated. Guaranteed by initial characterization, not subject to production test. 3 Guaranteed by design, not subject to production test. 2 Rev. 0 | Page 6 of 24 Typ 1 0.001 Max Unit 0.4 V V 1 μA 0.1 0.2 mA mA ADG799A/ADG799G I2C TIMING SPECIFICATIONS VDD = 2.7 V to 5.5 V; GND = 0 V; TA = −40°C to +85°C, unless otherwise noted (see Figure 2 for timing diagram). Table 3. Parameter 1 fSCL t1 Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode Standard mode Fast mode Standard mode Fast mode High speed mode Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max B B t2 t3 t4 2 t5 t6 t7 t8 t9 t10 t11 Min Max 100 400 Unit kHz kHz 3.4 1.7 4 0.6 MHz MHz μs μs 60 120 4.7 1.3 ns ns μs μs 160 320 250 100 10 0 0 ns ns ns ns ns μs μs 3.45 0.9 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 703 150 1000 300 ns ns μs μs ns μs μs ns μs μs μs μs ns ns ns 80 160 300 300 ns ns ns ns 20 + 0.1 CB 80 160 1000 300 ns ns ns ns 10 20 40 80 ns ns 20 + 0.1 CB B 10 20 20 + 0.1 CB B 10 20 B Description Serial clock frequency tHIGH, SCL high time tLOW, SCL low time tSU;DAT, data setup time tHD;DAT, data hold time tSU;STA, setup time for a repeated start condition tHD;STA, hold time (repeated) start condition tBUF, bus free time between a stop and a start condition tSU;STO, setup time for stop condition tRDA, rise time of SDA signal tFDA, fall time of SDA signal tRCL, rise time of SCL signal Rev. 0 | Page 7 of 24 ADG799A/ADG799G Parameter 1 t11A t12 tSP 1 2 Conditions Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Standard mode Fast mode High speed mode CB = 100 pF max CB = 400 pF max Fast mode High speed mode Min Max 1000 300 Unit ns ns 20 + 0.1 CB 80 160 300 300 ns ns ns ns 10 20 0 0 40 80 50 10 ns ns ns ns 20 + 0.1 CB B 10 20 B Description tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit. tFCL, fall time of SCL signal Pulse width of suppressed spike Guaranteed by initial characterization. CB refers to capacitive load on the bus line, tr and tf measured between 0.3 VDD and 0.7 VDD. A device must provide a data hold time for SDA in order to bridge the undefined region of the SCL falling edge. Timing Diagram t11 t12 t6 t2 SCL t1 t6 t4 t5 t3 t8 t10 t9 t7 P S S Figure 2. Timing Diagram for 2-Wire Serial Interface Rev. 0 | Page 8 of 24 P 06038-002 SDA ADG799A/ADG799G ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter VDD to GND Analog, Digital Inputs Continuous Current, S or D Pins Peak Current, S or D Pins Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature θJA Thermal Impedance 24-Lead LFCSP Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (<20 sec) Rating −0.3 V to +6 V −0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 100 mA 300 mA (pulsed at 1 ms, 10% duty cycle max) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating can be applied at any one time. −40°C to +85°C −65°C to +150°C 150°C 30°C/W 300°C 260°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 9 of 24 ADG799A/ADG799G 24 23 22 21 20 19 24 23 22 21 20 19 GND VDD SDA SCL A0 A1 GND VDD SDA SCL A0 A1 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS ADG799A TOP VIEW (Not to Scale) 18 17 16 15 14 13 NC S1A D1A D1B S1B GPO2 A2 S3A D3B D3A S3B NC 06038-034 NC S2A D2A D2B S2B NC NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PAD MUST BE TIED TO GND. 1 2 3 4 5 6 PIN 1 INDICATOR ADG799G TOP VIEW (Not to Scale) 18 17 16 15 14 13 A2 S3A D3B D3A S3B NC NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PAD MUST BE TIED TO GND. Figure 3. ADG799A Pin Configuration 06038-012 PIN 1 INDICATOR NC 7 S2A 8 D2A 9 D2B 10 S2B 11 GPO1 12 1 2 3 4 5 6 7 8 9 10 11 12 NC S1A D1A D1B S1B NC Figure 4. ADG799G Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Mnemonic NC S1A D1A D1B S1B NC/GPO2 NC S2A D2A D2B S2B NC/GPO1 NC S3B D3A D3B S3A A2 A1 A0 SCL 22 23 24 SDA VDD GND Function Not internally connected. A-Side Source Terminal for Crosspoint Switch 1. Can be an input or output. A-Side Drain Terminal for Crosspoint Switch 1. Can be an input or output. B-Side Drain Terminal for Crosspoint Switch 1. Can be an input or output. B-Side Source Terminal for Crosspoint Switch 1. Can be an input or output. Not internally connected (for the ADG799A) / General-Purpose Logic Output 2 (for the ADG799G). Not internally connected. A-Side Source Terminal for Crosspoint Switch 2. Can be an input or output. A-Side Drain Terminal for Crosspoint Switch 2. Can be an input or output. B-Side Drain Terminal for Crosspoint Switch 2. Can be an input or output. B-Side Source Terminal for Crosspoint Switch 2. Can be an input or output. Not internally connected (for the ADG799A) / General-Purpose Logic Output 1 (for the ADG799G). Not internally connected. B-Side Source Terminal for Crosspoint Switch 3. Can be an input or output. A-Side Drain Terminal for Crosspoint Switch 3. Can be an input or output B-Side Drain Terminal for Crosspoint Switch 3. Can be an input or output. A-Side Source Terminal for Crosspoint Switch 3. Can be an input or output. Logic Input. Sets Bit A2 from the least significant bits of the 7-bit slave address. Logic Input. Sets Bit A1 from the least significant bits of the 7-bit slave address. Logic Input. Sets Bit A0 from the least significant bits of the 7-bit slave address. Digital Input, Serial Clock Line. Open drain input used in conjunction with SDA to clock data into the device. External pull-up resistor required. Digital Input/Output. Bidirectional open drain data line. External pull-up resistor required. Positive Power Supply Input. Ground (0 V) Reference. Rev. 0 | Page 10 of 24 ADG799A/ADG799G TYPICAL PERFORMANCE CHARACTERISTICS 3.0 4.0 VDD = 3.3V, RL = 1MΩ TA = 25°C 1 CHANNEL VDD = 3V, RL = 1MΩ 2.5 VDD = 5.0V VDD = 4.5V VDD = 5.5V 3.0 VDD = 3.3V, RL = 75Ω 2.5 RON (Ω) OUTPUT SIGNAL (V) VDD = 2.7V, RL = 1MΩ 2.0 TA = 25°C 1 CHANNEL 3.5 VDD = 3V, RL = 75Ω 1.5 VDD = 2.7V, RL = 75Ω 2.0 1.5 1.0 1.0 0.5 1.0 1.5 2.0 2.5 3.5 3.0 INPUT SIGNAL (V) 0 0 2.0 2.5 3.0 1.6 7 TA = 25°C 1 CHANNEL 6 VDD = 3V TA = +85°C 5 3.5 VDD = 5V, RL = 75Ω 3.0 RON (Ω) OUTPUT SIGNAL (V) 4.0 1.5 Figure 8. On Resistance vs. VD (VS), 5 V Supply VDD = 5.5V, RL = 1MΩ VDD = 5V, RL = 1MΩ VDD = 5.5V, RL = 75Ω VDD = 4.5V, RL = 1MΩ 4.5 1.0 VD (VS) (V) Figure 5. Analog Signal Range, 3 V Supply 5.0 0.5 06038-021 0.5 06038-022 0 06038-018 0 0.5 VDD = 4.5V, RL = 75Ω 2.5 2.0 4 TA = –40°C 3 TA = +25°C 1.5 2 1.0 1 0.5 0 1 2 3 4 6 5 INPUT SIGNAL (V) 0 06038-019 0 TA = 25°C 1 CHANNEL VDD = 3.0V 5 0.6 0.8 1.0 TA = +25°C 1 CHANNEL VDD = 5V 4.0 VDD = 2.7V 1.2 1.4 TA = +85°C TA = +25°C 3.5 4 TA = –40°C 3.0 RON (Ω) VDD = 3.3V 3 2 2.5 2.0 1.5 1.0 1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VD (VS) (V) Figure 7. On Resistance vs. VD (VS), 3 V Supply 1.6 1.8 0 0 0.5 1.0 1.5 VD (VS) (V) 2.0 2.5 3.0 06038-023 0.5 06038-020 RON (Ω) 0.4 Figure 9. On Resistance vs. VD (VS) for Various Temperatures, 3 V Supply 4.5 TA = 25°C 1 CHANNEL 0.2 VD (VS) (V) Figure 6. Analog Signal Range, 5 V Supply 6 0 Figure 10. On Resistance vs. VD (VS) for Various Temperatures, 5 V Supply Rev. 0 | Page 11 of 24 ADG799A/ADG799G 0 0 TA = 25°C –0.5 –20 CROSSTALK (dB) VDD = 5V –1.5 –2.0 –2.5 –40 SAME CROSS POINT SWITCH –60 –80 DIFFERENT CROSS POINT SWITCH –3.0 –100 –3.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) –120 0.01 06038-029 –4.0 0.1 1 10 Figure 11. Charge Injection vs. Source Voltage Figure 14. Crosstalk vs. Frequency 225 0 TA = 25°C VDD = 5V –2 215 –4 ATTENUATION (dB) tON (3V) 205 tON/tOFF (ns) 1000 100 FREQUENCY (MHz) 06038-032 VDD = 3V –1.0 CHARGE INJECTION (pC) TA = 25°C VDD = 3V/5V tOFF (3V) 195 tON (5V) 185 tOFF (5V) –6 –8 –10 –12 –14 –16 175 0 20 40 60 80 TEMPERATURE (°C) –20 0.1 1 1000 1000 Figure 15. Bandwidth 0 TA = 25°C –10 1 CHANNEL VDD = 3V/5V NO DECOUPLING CAPACITORS USED –20 TA = 25°C VDD = 3V/5V –20 –30 PSRR (dB) –40 –60 –80 –40 –50 –60 –70 –80 –100 –90 –120 0.01 0.1 1 10 100 FREQUENCY (MHz) 1000 06038-031 OFF-ISOLATION (dB) 100 FREQUENCY (MHz) Figure 12. tON/tOFF vs. Temperature 0 10 06038-033 –20 06038-030 165 –40 06038-024 –18 Figure 13. Off Isolation vs. Frequency –100 0.0001 0.001 0.01 0.1 1 10 FREQUENCY (MHz) Figure 16. PSRR vs. Frequency Rev. 0 | Page 12 of 24 100 ADG799A/ADG799G 0.40 6 TA = 25°C 0.35 TA = 25°C 5 0.30 VDD = 5V GPO VOLTAGE (V) VDD = 5V IDD (mA) 0.25 0.20 0.15 VDD = 3V 4 3 VDD = 3V 2 0.10 1.1 1.6 2.1 3.1 2.6 0 –20 fCLK FREQUENCY (MHz) –18 –16 –12 –10 –8 –6 –4 0 35 –2 LOAD CURRENT (mA) Figure 20. GPO VOH vs. Load Current Figure 17. IDD vs. fCLK Frequency 1.4 –14 06038-027 0.6 06038-025 0 0.1 06038-028 1 0.05 2.5 TA = 25°C TA = 25°C 1.2 VDD = 5V VDD = 3V 2.0 VDD = 5V GPO VOLTAGE (V) 1.0 IDD (mA) 0.8 0.6 0.4 VDD = 3V 0.2 1.5 1.0 0.5 0 0 0 1 2 3 4 6 5 I2C LOGIC INPUT VOLTAGE (V) 06038-026 –0.2 Figure 18. IDD vs. I2C Logic Input Voltage (SDA, SCL) tPHL (3V) tPLH (5V) 105 tPLH (3V) 100 95 –40 –20 0 20 40 60 80 TEMPERATURE (°C) 06038-038 PROPAGATION DELAY (ns) 115 tPHL (5V) 5 10 15 20 25 LOAD CURRENT (mA) Figure 21. GPO VOL vs. Load Current 120 110 0 Figure 19. I2C to GPO Propagation Delay vs. Temperature (ADG799G Only) Rev. 0 | Page 13 of 24 30 ADG799A/ADG799G TEST CIRCUITS VDD 0.1µF IDS NETWORK ANALYZER V1 50Ω SA S VS D 50Ω SB 06038-003 RON = V1/IDS VS 50Ω VOUT D 50Ω 06038-008 GND Figure 25. Bandwidth Figure 22. On Resistance VDD 0.1µF A S D NETWORK ANALYZER ID (OFF) A VS VD 50Ω S 50Ω 50Ω 06038-004 IS (OFF) VS 50Ω D VOUT 50Ω 06038-009 GND Figure 23. Off Leakage Figure 26. Off Isolation VDD 0.1µF NETWORK ANALYZER S D ID (ON) VD NC = NO CONNECT SX 50Ω A 50Ω VS 06038-005 SY 50Ω VOUT RL 50Ω DY DX GND 50Ω 50Ω Figure 27. Channel-to-Channel Crosstalk Figure 24. On Leakage Rev. 0 | Page 14 of 24 06038-010 NC ADG799A/ADG799G 5V CLOCK PULSES CORRESPONDING TO THE LDSW BITS 0.1µF CLOCK PULSES CORRESPONDING TO THE LDSW BITS VDD VOUT D VS SCL CL 35pF RL 50Ω I2C INTERFACE SDA 50% SCL 50% 90% VOUT tON 50% 90% VGPO 10% SCL 50% 10% tOFF tH tL GND Figure 28. Switching Times 5V CLOCK PULSES CORRESPONDING TO THE LDSW BIT 0.1µF VDD SA SB RL 50Ω CL 35pF VOUT 80% VS I2C INTERFACE SCL 06038-007 SDA tD GND Figure 29. Break-Before-Make Time Delay 5V VDD RS S SWITCH ON D VOUT CL 1nF VS ΔVOUT SWITCH OFF GND Figure 30. Charge Injection Rev. 0 | Page 15 of 24 QINJ = CL × ΔVOUT 06038-011 VS SCL VOUT D 06038-006 S ADG799A/ADG799G TERMINOLOGY On Resistance (RON) The series on-channel resistance measured between the S and D pins. On Resistance Match (ΔRON) The channel-to-channel matching of on resistance when channels are operated under identical conditions. On Resistance Flatness (RFLAT(ON)) The variation of on resistance over the specified range produced by the specified analog input voltage change with a constant load current. I2C to GPO Propagation Delay (tH, tL) The time required for the logic value at the GPO pin to settle after loading a GPO command. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 90% of the final value for high and 10% for low. Total Harmonic Distortion + Noise (THD + N) The ratio of the harmonic amplitudes plus noise of a signal to the fundamental. −3 dB Bandwidth The frequency at which the output is attenuated by 3 dB. Channel Off Leakage (IOFF) The sum of leakage currents into or out of an off channel input. Off Isolation The measure of unwanted signal coupling through an off switch. Channel On Leakage (ION) The current loss/gain through an on-channel resistance, creating a voltage offset across the device. Crosstalk The measure of unwanted signal that is coupled through from one channel to another because of parasitic capacitance. Input Leakage Current (IIN, IINL, IINH) The current flowing into a digital input when a specified low level or high level voltage is applied to that input. Charge Injection The measure of the glitch impulse transferred from the digital input to the analog output during on/off switching. Input/Output Off Capacitance (COFF) The capacitance between an analog input and ground when the switch channel is off. Differential Gain Error The measure of how much color saturation shift occurs when the luminance level changes. Both attenuation and amplification can occur; therefore, the largest amplitude change between any two levels is specified and expressed in %. Input/Output On Capacitance (CON) The capacitance between the inputs or outputs and ground when the switch channel is on. Differential Phase Error The measure of how much hue shift occurs when the luminance level changes. It can be a negative or positive value and is expressed in degrees of subcarrier phase. Digital Input Capacitance (CIN) The capacitance between a digital input and ground. Output On Switching Time (tON) The time required for the switch channel to close. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 90% of the final value. Output Off Switching Time (tOFF) The time required for the switch to open. The time is measured from 50% of the falling edge of the LDSW bit to the time the output reaches 10% of the final value. Input High Voltage (VINH) The minimum input voltage for Logic 1. Input Low Voltage (VINL) The maximum input voltage for Logic 0. Output High Voltage (VOH) The minimum output voltage for Logic 1. Output Low Voltage (VOL) The maximum output voltage for Logic 0. IDD Positive supply current. Rev. 0 | Page 16 of 24 ADG799A/ADG799G THEORY OF OPERATION The ADG799A/ADG799G are monolithic CMOS device comprising three 2 × 2 crosspoint switches controllable via a standard I2C serial interface. The CMOS process provides ultralow power dissipation, yet offers high switching speed and low on resistance. The on resistance profile is very flat over the full analog input range, and wide bandwidth ensures excellent linearity and low distortion. These features, combined with a wide input signal range, make the ADG799A/ADG799G an ideal switching solution for a wide range of TV applications. 3. Data transmits over the serial bus in sequences of nine clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of the clock signal, SCL, and remain stable during the high period of SCL. Otherwise, a low-to-high transition when the clock signal is high can be interpreted as a stop event that ends the communication between the master and the addressed slave device. 4. After transferring all data bytes, the master establishes a stop condition, defined as a low-to-high transition on the SDA line while SCL is high. In write mode, the master pulls the SDA line high during the 10th clock pulse to establish a stop condition. In read mode, the master issues a no acknowledge for the ninth clock pulse (the SDA line remains high). The master then brings the SDA line low before the 10th clock pulse, and then high during the 10th clock pulse to establish a stop condition. The switches conduct equally well in both directions when on. In the off condition, signal levels up to the supplies are blocked. The integrated serial I2C interface controls the operation of the crosspoint switches (ADG799A/ADG799G) and generalpurpose logic pins (ADG799G only). The ADG799A/ADG799G have many attractive features, such as the ability to individually control each switch, the option of reading back the status of any switch. The ADG799G has two generalpurpose logic output pins controllable through the I2C interface. The following sections describe these features in more detail. I2C SERIAL INTERFACE The ADG799A/ADG799G are controlled via an I2C-compatible serial bus interface (refer to the I2C-Bus Specification available from Philips Semiconductor) that allows the part to operate as a slave device (no clock is generated by the ADG799A/ADG799G). The communication protocol between the I2C master and the device operates as follows: 1. 2. The master initiates data transfer by establishing a start condition (defined as a high-to-low transition on the SDA line while SCL is high). This indicates that an address/data stream follows. All slave devices connected to the bus respond to the start condition and shift in the next eight bits, consisting of a seven bit address (MSB first) plus an R/W bit. This bit determines the direction of the data flow during the communication between the master and the addressed slave device. The slave device whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse (this is known as the acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to, or read from, its serial register. If the R/W bit is set high, the master reads from the slave device. However, if the R/W bit is set low, the master writes to the slave device. I2C ADDRESS The ADG799A/ADG799G each have a seven-bit I2C address. The four most significant bits are internally hardwired while the last three bits (A0, A1, and A2) are user-adjustable. This allows the user to connect up to eight ADG799A/ADG799Gs to the same bus. The I2C bit map shows the configuration of the seven-bit address. Seven-Bit I2C Address Bit Configuration MSB 1 0 1 0 A2 A1 LSB A0 WRITE OPERATION When writing to the ADG799A/ADG799G, the user must begin with an address byte and R/W bit. Next, the switch acknowledges that it is prepared to receive data by pulling SDA low. Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCL. Figure 31 illustrates the entire write sequence for the ADG799A/ADG799G. The first data byte (AX7 to AX0) controls the status of the crosspoint switches and the GPO pins, while the LDSW and RESETB bits from the second byte controls the operation mode of the device. Table 6 shows a list of all commands supported by the ADG799A/ADG799G with the corresponding byte that needs to be loaded during a write operation. To achieve the desired configuration, one or more commands can be loaded into the device. Any combination of the commands listed in Table 6 can be used with the following restrictions: • The commands referring to more than one switch overwrite any previous command. • When a sequence of successive commands affect the same element (that is, the switch or GPO pin), only the last command is executed. Rev. 0 | Page 17 of 24 ADG799A/ADG799G SCL START CONDITION BY MASTER A1 A0 R/W AX7 AX6 AX5 AX4 AX3 AX2 AX1 AX0 X ADDRESS BYTE ACKNOWLEDGE BY SWITCH ACKNOWLEDGE BY SWITCH X X X X X RESETB LDSW STOP CONDITION BY MASTER ACKNOWLEDGE BY SWITCH Figure 31. ADG799A/ADG799G Write Operation Table 6. ADG799A/ADG799G Command List AX7 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X1 X1 AX6 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 AX5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 X1 0 1 0 1 0 1 0 1 1 1 1 0 1 0 0 Crosspoint Switch 3 disabled (All switches connected to D3A and D3B are off) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 1 1 0 0 1 1 1 1 GPO1 low for ADG799G/Reserved for ADG799A GPO1 high for ADG799G/Reserved for ADG799A GPO2 low for ADG799G/Reserved for ADG799A GPO2 high for ADG799G/Reserved for ADG799A GPO1 and GPO2 low for ADG799G/Reserved for ADG799A GPO1 and GPO2 high for ADG799G/Reserved for ADG799A All muxes disabled (all switches are off) Reserved 1 AX4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 AX3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 AX2 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 AX1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 AX0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 Addressed Switch /GPO Pin S1A/D1A, S1B/D1B, S2A/D2A, S2B/D2B, S3A/D3A, S3B/D3B off S1A/D1A, S1B/D1B, S2A/D2A, S2B/D2B, S3A/D3A, S3B/D3B on S1A/D1B, S1B/D1A, S2A/D2B, S2B/D2A, S3A/D3B, S3B/D3A off S1A/D1B, S1B/D1A, S2A/D2B, S2B/D2A, S3A/D3B, S3B/D3A on S1A/D1A and S1A/D1B, S2A/D2A and S2A/D2B, S3A/D3A and S3A/D3B off S1A/D1A and S1A/D1B, S2A/D2A and S2A/D2B, S3A/D3A and S3A/D3B on S1B/D1A and S1B/D1B, S2B/D2A and S2B/D2B, S3B/D3A and S3B/D3B off S1B/D1A and S1B/D1B, S2B/D2A and S2B/D2B, S3B/D3A and S3B/D3B on S1A/D1A and S1B/D1A, S2A/D2A and S2B/D2A, S3A/D3A and S3B/D3A off S1A/D1A and S1B/D1A, S2A/D2A and S2B/D2A, S3A/D3A and S3B/D3A on S1A/D1B and S1B/D1B, S2A/D2B and S2B/D2B, S3A/D3B and S3B/D3B off S1A/D1B and S1B/D1B, S2A/D2B and S2B/D2B, S3A/D3B and S3B/D3B on S1A/D1A off S1A/D1A on S1A/D1B off S1A/D1B on S1B/D1A off S1B/D1A on S1B/D1B off S1B/D1B on S2A/D2A off S2A/D2A on S2A/D2B off S2A/D2B on S2B/D2A off S2B/D2A on S2B/D2B off S2B/D2B on S3A/D3A off S3A/D3A on S3A/D3B off S3A/D3B on S3B/D3A off S3B/D3A on S3B/D3B off S3B/D3B on Crosspoint Switch 1 disabled (All switches connected to D1A and D1B are off) Crosspoint Switch 2 disabled (All switches connected to D2A and D2B are off) X = Logic state does not matter. Rev. 0 | Page 18 of 24 06033-031 A2 SDA ADG799A/ADG799G LDSW BIT POWER ON/SOFTWARE RESET The LDSW bit allows the user to control the way the device executes the commands loaded during the write operations. The ADG799A/ADG799G execute all the commands loaded between two successive write operations that have set the LDSW bit high. The ADG799A/ADG799G has a software reset function implemented by the RESETB bit from the second data byte written to the device. For normal operation of the crosspoint switch and GPO pins, this bit should be set high. When RESETB = low or after power-up, the switches from all crosspoint switch pins are turned off (open) and the GPO pins are set low. Setting the LDSW high for every write cycle ensures that the device executes the command immediately after the LDSW bit is loaded into the device. This setting can be used when the desired configuration can be achieved by sending a single command or when the switches and/or GPO pins are not required to be updated at the same time. When the desired configuration requires multiple commands with simultaneous updates, the LDSW bit should be set low while loading the commands except for the last one when the LDSW bit should be set high. Once the last command with LDSW = high is loaded, the device simultaneously executes all commands received since the last update. READ OPERATION When reading data back from the ADG799A/ADG799G, the user must begin with an address byte and R/W bit. The switch then acknowledges that it is prepared to transmit data by pulling SDA low. Following this acknowledgement, the ADG799A/ADG799G transmit two bytes on the next clock edges. These bytes contain the status of the switches, and each byte is followed by an acknowledge bit. A logic high bit represents a switch in the on (close) state while a low represents a switch in the off (open) state. For the GPO pins (ADG799G only), the bit represents the logic value of the pin. Figure 32 illustrates the entire read sequence. The bit maps accompanying Figure 32 show the relationship between the elements of the ADG799A and ADG799G (that is, the switches and GPO pins) and the bits that represent their status after a completed read operation. ADG799A Bit Map RB15 S1A/D1A RB14 S1B/D1A RB13 S1A/D1B RB12 S1B/D1B RB11 S2A/D2A RB10 S2B/D2A RB9 S2A/D2B RB8 S2B/D2B RB7 S3A/D3A RB6 S3B/D3A RB5 S3A/D3B RB4 S3B/D3B RB3 - RB2 - RB1 - RB0 - RB12 S1B/D1B RB11 S2A/D2A RB10 S2B/D2A RB9 S2A/D2B RB8 S2B/D2B RB7 S3A/D3A RB6 S3B/D3A RB5 S3A/D3B RB4 S3B/D3B RB3 GPO1 RB2 GPO2 RB1 - RB0 - ADG799G Bit Map RB15 S1A/D1A RB14 S1B/D1A RB13 S1A/D1B A2 SDA START CONDITION BY MASTER A1 A0 R/W RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 ADDRESS BYTE ACKNOWLEDGE BY SWITCH ACKNOWLEDGE BY SWITCH Figure 32. ADG799A/ADG799G Read Operation Rev. 0 | Page 19 of 24 RB6 RB5 RB4 RB3 RB2 RB1 RB0 STOP CONDITION BY MASTER ACKNOWLEDGE BY SWITCH 06033-032 SCL ADG799A/ADG799G EVALUATION BOARD The EVAL-ADG799GEB allows designers to evaluate the high performance of the device with minimum effort. The evaluation kit includes a printed circuit board populated with the ADG799G. The evaluation board can be used to evaluate the performance of both the ADG799A and ADG799G. It interfaces to the USB port of a PC, or it can be used as a standalone evaluation board. Software is available with the evaluation board that allows the user to easily program the ADG799G through the USB port. Schematics of the evaluation board are shown in Figure 33 and Figure 34. The software runs on any PC with Microsoft® Windows® 2000 or Windows XP and a minimum screen resolution of 1200 × 768. USING THE ADG799G EVALUATION BOARD The ADG799G evaluation kit is a test system designed to simplify the evaluation of the device. Each input/output of the part comes with a socket specifically chosen for easy audio/video evaluation. A data sheet is also available with the evaluation board offering full information on how to operate the evaluation board. Rev. 0 | Page 20 of 24 Rev. 0 | Page 21 of 24 C13 10µF Figure 33. EVAL-ADG799GEB Schematic, USB Controller Section T4 J5 C3 0.1µF A B AGND C6 0.1µF GND 7 5 8 AGND AGND C7 0.1µF 1 AGND IN1 OUT1 2 OUT2 IN2 6 SD ERROR 3 NR GND 4 U5 C16 0.1µF C8 0.1µF C19 0.1µF T26 AGND C14 10µF C20 0.1µF C21 0.1µF AGND C15 0.1µF 33 34 35 36 37 38 39 40 4 3.3V AGND AGND AGND 3.3V D4 R11 1kΩ 3.3V 6 AGND 8 AGND R1 2.2kΩ SCL_EN C17 22pF AGND AGND U4 S G GND IN2 D1 S1 S2 D2 IN1 VDD 5 6 7 8 Q2 3.3V S G Q1 D 3.3V ADG821 AGND 4 3 1 5 R2 2.2kΩ 2 C10 22pF T28 R32 10kΩ T27 XTAL1 24MHz AGND R31 10kΩ U2 A0 VCC 7 WP 6 A1 A2 SCL 5 VSS SDA 24LC64 C22 0.1µF 4 15 16 18 19 20 21 22 23 24 25 45 46 47 48 49 50 51 52 29 30 31 1 2 3 4 AGND 3.3V AGND PB0/FD0 PB1/FD1 PB2/FD2 PB3/FD3 RESET PB4/FD4 *WAKEUP PB5/FD5 PB6/FD6 CLKOUT PB7/FD7 U3 PD0/FD8 CY7C68013-CSP PD1/FD9 D– PD2/FD10 PD3/FD11 D+ PD4/FD12 PA0/INT0 PD5/FD13 PA1/INT1 PD6/FD14 PA2/*SLOE PD7/FD15 PA3/*WU2 CTL0/*FLAGA PA4/FIFOADR0 CTL1/*FLAGB PA5/FIFOADR1 PA6/*PKTEND CTL2/*FLAGC PA7/*FLD/SLCS SDA RDY0/*SLRD SCL RDY1/*SLWR IFCLK XTALOUT RSVD XTALIN R10 10kΩ 13 14 1 2 8 5 9 54 44 42 C23 2.2µF R7 OR C18 0.1µF * DENOTES PROGRAMMABLE POLARITY. AGND C9 0.1µF R6 75Ω 3.3V 3 AGND AGND C4 10µF R5 75Ω 3.3V 2 1 ADP3303-3.3 C5 0.1µF 3.3V D+ AGND IO D– VBUS J1 USB-MINI-B T1 SHIELD AGND J2-2 AGND VDD AGND J2-1 3 7 11 17 27 32 43 55 AVCC VCC VCC VCC VCC VCC VCC VCC GND GND GND GND GND GND GND 10 12 26 28 41 53 56 3.3V SCL_EN C2 0.1µF D R12 2.2kΩ AGND R9 2.2kΩ SCL SDA VDD 06038-016 3.3V ADG799A/ADG799G GPO2 PHONO_DUAL GND 2 BOTTOM 3 CASE TOP 5 CASE 4 1 K6 PHONO_DUAL K5 GND 2 BOTTOM 4 3 CASE TOP 5 CASE 1 PHONO_DUAL GND 2 BOTTOM 3 CASE TOP 5 CASE 4 1 K4 R24 R23 R22 R21 R20 R19 1 K7 T16 T17 T15 T14 T13 T12 R25 T11 GND 2 BOTTOM 3 CASE TOP CASE PHONO_DUAL T10 4 5 Rev. 0 | Page 22 of 24 Figure 34. EVAL-ADG799GEB Schematic, Chip Section R13 PHONO_DUAL 5 CASE 3 TOP 4 CASE BOTTOM 1 GND R26 2 T18 K8 R27 T19 12 11 10 9 8 7 T20 25 PADDLE ADG799G 13 14 15 16 17 18 K3 R14 R15 T22 T23 6 5 4 3 2 1 R29 PHONO_DUAL 5 CASE 3 TOP 4 CASE BOTTOM 1 GND 2 R36 0Ω 19 20 21 22 23 24 T21 U1 R34 0Ω K2 R16 R35 0Ω R17 A GPO1 CASE A CASE R28 K9 GND 2 BOTTOM 3 CASE TOP T3 GND 2 BOTTOM 3 CASE TOP T2 1 4 5 PHONO_DUAL 1 4 5 PHONO_DUAL R30 PHONO_DUAL 5 CASE 3 TOP 4 CASE BOTTOM 1 GND T24 2 T7 K1 T8 T25 R18 T9 R3 10kΩ J3 R4 10kΩ J7 J6-2 GPO2 T5 J6-1 J8 GPO1 R8 10kΩ T6 J4-1 J4-3 SCL SDA SCL C1 0.1µF SDA J6-3 J4-2 SCL SDA VDD 06038-017 ADG799A/ADG799G ADG799A/ADG799G OUTLINE DIMENSIONS 0.60 MAX 4.00 BSC SQ PIN 1 INDICATOR 0.60 MAX TOP VIEW 0.50 BSC 3.75 BSC SQ 0.50 0.40 0.30 1.00 0.85 0.80 12° MAX SEATING PLANE 0.80 MAX 0.65 TYP 0.30 0.23 0.18 PIN 1 INDICATOR 19 18 24 1 *2.45 EXPOSED PAD 2.30 SQ 2.15 (BOTTOMVIEW) 13 12 7 6 0.23 MIN 2.50 REF 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 *COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2 EXCEPT FOR EXPOSED PAD DIMENSION Figure 35. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-24-2) Dimensions shown in millimeters ORDERING GUIDE Model ADG799ABCPZ-REEL 1 ADG799ABCPZ-500RL71 ADG799ACCPZ-REEL1 ADG799ACCPZ-500RL71 ADG799GBCPZ-REEL1 ADG799GBCPZ-500RL71 ADG799GCCPZ-REEL1 ADG799GCCPZ-500RL71 EVAL-ADG799GEB 2 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C I2C Speed 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz, 3.4 MHz Z = Pb-free part. Evaluation board is RoHS compliant. Rev. 0 | Page 23 of 24 Package Description 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ Evaluation Board Package Option CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 CP-24-2 ADG799A/ADG799G NOTES Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06038-0-7/06(0) Rev. 0 | Page 24 of 24