Data sheet acquired from Harris Semiconductor SCHS294 This data sheet is applicable to the CD74AC562, CD74ACT651, and CD74ACT652. The CD54/74AC651, CD54AC652, CD54ACT651, and CD54ACT652 were not acquired from Harris Semiconductor. PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74AC652M ACTIVE SOIC DW 24 CD74AC652M96 ACTIVE SOIC DW CD74AC652M96E4 ACTIVE SOIC CD74AC652M96G4 ACTIVE CD74AC652ME4 25 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC652MG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT652EN ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT652ENE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT652M ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT652M96 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT652M96G4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT652MG4 ACTIVE SOIC DW 24 CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC652M96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 CD74ACT652M96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC652M96 SOIC DW 24 2000 346.0 346.0 41.0 CD74ACT652M96 SOIC DW 24 2000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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