CM1405 LCD EMI Filter Array with ESD Protection Features Product Description • • California Micro Device's CM1405 is an EMI filter array with ESD protection, which integrates eight Pi- filters (C-R-C). The CM1405 has component values of 25pF100Ω-25pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±30kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • Eight channels of EMI filtering ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 35dB of attenuation at 800-2700MHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package OptiGuard™ coated version available for improved reliability at assembly Lead-free version available Applications • • • • • • • LCD data lines in mobile handsets EMI filtering & ESD protection for high-speed I/O ports EMI filtering for high-speed data lines Wireless handsets Cell phones Notebook computers PDAs / Handheld PCs This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CM1405 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CM1405-03 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in space-saving, low-profile chip-scale packages with optional lead-free finishing. Electrical Schematic 100Ω FILTERn* FILTERn* 25pF 25pF GND (Pins B1-Bn) 1 of 8 EMI Filtering + ESD Channels * See Package/Pinout Diagram for expanded pin information. © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 CM1405 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 C1 C2 C3 C4 C5 C6 C7 C8 A GND N051 B GND B1 Orientation Marking C GND B2 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 C1 C2 C3 C4 C5 C6 C7 C8 A1 CM1405-01 Chip Scale Package Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 A GND N053 B GND B1 Orientation Marking C GND B2 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 A1 CM1405-03 Notes: Chip Scale Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 C1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 C2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 C3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 C4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 C5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 C6 FILTER6 Filter Channel 6 A7 FILTER7 Filter Channel 7 C7 FILTER7 Filter Channel 7 A8 FILTER8 Filter Channel 8 C8 FILTER8 Filter Channel 8 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish OptiguardTM Coated No Coating Ordering Part OptiguardTM Coated No Coating Number1 Number1 Part Marking Ordering Part Number1 Part Marking Ordering Part PKG Part Marking Ordering Part Bumps Number1 Part Marking 20 CSP CM1405-01CS N051 CM1405-03CS N053 CM1405-01CP N051 CM1405-03CP N053 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04 CM1405 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER MIN TYP MAX UNITS 80 100 120 Ω At 2.5V DC, 1MHz, 30mV AC 20 25 30 pF Diode Standoff Voltage IDIODE = 10µA 5.5 ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA R Resistance C Capacitance VDIODE VESD VCL fC CONDITIONS V 100 5.6 -0.4 In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R = 100Ω, C = 25pF 6.8 -0.8 nA 9.0 -1.5 V V ±30 kV ±30 kV +12 -7 V V 70 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 CM1405 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04 CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. A4-C4 EMI Filter Performance © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. A5-C5 EMI Filter Performance Figure 6. A6-C6 EMI Filter Performance © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04 CM1405 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 7. A7-C7 EMI Filter Performance Figure 8. A8-C8 EMI Filter Performance © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 CM1405 Performance Information (cont’d) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04 CM1405 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder MaskDefinedPad 0.275mmDIA. Solder Stencil Opening 0.330mmDIA. Solder MaskOpening 0.325mmDIA. Figure 10. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 9 CM1405 Mechanical Details CM1405-01 Mechanical Specifications Mechanical Package Diagrams The package dimensions for the CM1405-01 are presented below. BOTTOM VIEW A1 C1 C B Bumps 20 A Millimeters Min Nom Max Inches Min Nom A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel A 1 Max A2 Custom CSP C2 Package Dim B4 B3 PACKAGE DIMENSIONS SIDE VIEW B2 B1 2 3 4 5 6 7 8 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CM1405-01 Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2004 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/16/04 CM1405 Mechanical Details (cont’d) CM1405-03 Mechanical Specifications Mechanical Package Diagrams The package dimensions for the CM1405-03 are presented below. OptiGuardTM Coating BOTTOM VIEW A1 PACKAGE DIMENSIONS Custom CSP Bumps 20 B2 B1 B4 B3 Package C1 C Inches A Min Nom Max Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel A2 Dim C2 B Millimeters A 1 2 3 4 5 7 6 8 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1405-03 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1405 4.00 X 1.46 X 0.6 4.11 X 1.57 X 0.76 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 12mm 330mm (13") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 13. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 06/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11