TI DRV8834PWP Dual bridge stepper or dc motor driver Datasheet

DRV8834
www.ti.com
SLVSB19A – FEBRUARY 2012 – REVISED MARCH 2012
DUAL BRIDGE STEPPER OR DC MOTOR DRIVER
Check for Samples: DRV8834
FEATURES
1
•
2
•
•
•
•
Dual-H-Bridge Current-Control Motor Driver
– Capable of Driving Two DC Motors or One
Stepper Motor
Two Control Modes:
– Built-In Indexer Logic With Simple
STEP/DIRECTION Control and Up to
1/32-Step Microstepping
– PHASE/ENABLE Control, With the Ability to
Drive External References for > 1/32-Step
Microstepping
Output Current 1.5-A Continuous, 2.2-A Peak
per H-Bridge (at VM = 5 V, 25°C)
Low RDS(ON): 305-mΩ HS + LS
(at VM = 5 V, 25°C)
Wide Power Supply Voltage Range:
2.5 V – 10.8 V
•
•
•
Dynamic tBLANK and Mixed Decay Modes for
Smooth Microstepping
PWM Winding Current Regulation and Limiting
Thermally Enhanced Surface Mount Package
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Toys
POS Printers
Video Security Cameras
Office Automation Machines
Gaming Machines
Robotics
DESCRIPTION
The DRV8834 provides a flexible motor driver solution for toys, printers, cameras, and other mechatronic
applications. The device has two H-bridge drivers, and is intended to drive a bipolar stepper motor or two DC
motors.
The output driver block of each H-bridge consists of N-channel power MOSFET’s configured as an H-bridge to
drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current.
With proper PCB design, each H-bridge of the DRV8834 is capable of driving up to 1.5-A RMS (or DC)
continuously, at 25°C with a VM supply of 5 V. It can support peak currents of up to 2.2 A per bridge. Current
capability is reduced slightly at lower VM voltages.
Internal shutdown functions with a fault output pin are provided for over current protection, short circuit
protection, under voltage lockout and overtemperature. A low-power sleep mode is also provided.
The DRV8834 is packaged in a 24-pin HTSSOP or VQFN package with PowerPAD™ (Eco-friendly: RoHS & no
Sb/Br).
ORDERING INFORMATION (1)
ORDERABLE PART
NUMBER
PACKAGE (2)
PowerPAD™ (HTSSOP) - PWP
PowerPAD™ (VQFN) - RGE
(1)
(2)
Reel of 2000
DRV8834PWPR
Tube of 60
DRV8834PWP
Reel of 3000
DRV8834RGER
Reel of 250
DRV8834RGET
TOP-SIDE
MARKING
DRV8834
8834
For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV8834
SLVSB19A – FEBRUARY 2012 – REVISED MARCH 2012
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DEVICE INFORMATION
Functional Block Diagram
VM
VM
+
0.01µF
VM
VM
VM
10µF
VCP
VINT
2.2µF
VREFO
Internal
Ref &
Regs
VINT,
refs,
Int. supp.
Charge
Pump
VCP
0.01µF
PUC,
UVLO
VM
VREFO
nENBL / AENBL
AOUT1
STEP / BENBL
Gate
Drive
&
OCP
DIR / BPHASE
CONFIG
DCM
VM
M0 / APHASE
Step
Motor
AOUT2
M1
nSLEEP
AISEN
ISEN
nFAULT
VM
Logic
BOUT1
ADECAY
Gate
Drive
&
OCP
BDECAY
VREFO
DCM
VM
OverTemp
BOUT2
AVREF
BVREF
ISEN
BISEN
GND
2
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Table 1. TERMINAL FUNCTIONS
NAME
PIN
(PWP)
PIN
(RGE)
I/O (1)
EXTERNAL COMPONENTS
OR CONNECTIONS
DESCRIPTION
POWER AND GROUND
GND
21,
PPAD
18,
PPAD
-
Device ground
Both the GND pin and device PowerPAD
must be connected to ground
VM
18, 19
15, 16
-
Bridge A power supply
Connect to motor supply. A 10-µF (minimum)
capacitor to GND is recommended.
VINT
20
17
-
Internal supply
Bypass to GND with 2.2-μF (minimum), 6.3-V
capacitor. Can be used to provide logic high
voltage for configuration pins (except
nSLEEP).
VREFO
24
21
O
Reference voltage output
May be connected to AVREF/BVREF inputs.
Do not place a bypass capacitor on this pin.
VCP
17
14
O
High-side gate drive voltage
Connect a 0.01-μF, 16-V (minimum) X7R
ceramic capacitor to VM.
Step motor enable/Bridge A enable
Indexer mode: Logic low enables all outputs.
Phase/enable mode: Logic low enables the
AOUTx outputs.
Internal pulldown.
CONTROL (Indexer Mode or Phase/Enable Mode)
nENBL/AENBL
10
7
I
STEP/BENBL
11
8
I
Step input/Bridge B enable
Indexer mode: Rising edge moves indexer to
next step.
Phase/enable mode: Logic low enables the
BOUTx outputs.
Internal pulldown.
DIR/BPHASE
12
9
I
Direction input/Bridge B Phase
Indexer mode: Level sets direction of step.
Phase/enable mode: Logic high sets BOUT1
high, BOUT2 low.
Internal pulldown.
Microstep mode/Bridge A phase
Indexer mode: Controls microstep mode (full,
half, up to 1/32-step) along with M1.
Phase/enable mode: Logic high sets AOUT1
high, AOUT2 low.
Internal pulldown.
Microstep mode/Disable state
Indexer mode: Controls microstep mode (full,
half, up to 1/32-step) along with M0.
Phase/enable mode: Determines the state of
the outputs when xENBL = 0.
Internal pulldown.
M0/APHASE
M1
13
14
10
11
I
I
CONFIG
15
12
I
Device configuration
Logic high to put the device in indexer mode.
Logic low to put the device into phase/enable
mode. State is latched at power-up and sleep
exit. Internal pulldown.
nSLEEP
1
22
I
Sleep mode input
Logic high to enable device, logic low to
enter low-power sleep mode and reset all
internal logic.
Bridge A current set reference input
Reference voltage for winding current set.
Can be driven individually with an external
DACs for micro-stepping, or tied to a
reference voltage (e.g., VREFO).
AVREF
22
19
I
BVREF
23
20
I
Bridge B current set reference input
Reference voltage for winding current set.
Can be driven individually with an external
DACs for micro-stepping, or tied to a
reference voltage (e.g., VREFO).
ADECAY
3
24
I
Decay mode for bridge A
Determines decay mode for H-Bridge A (or A
and B in indexer mode) – slow, fast or mixed
decay
BDECAY
2
23
I
Decay mode for bridge B
Determines decay mode for H-Bridge B –
slow, fast or mixed decay
(1)
Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
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Table 1. TERMINAL FUNCTIONS (continued)
PIN
(PWP)
PIN
(RGE)
I/O (1)
16
13
OD
Fault output
Logic low when in fault condition (overtemp,
overcurrent, undervoltage)
AISEN
5
2
IO
Bridge A ground/Isense
Connect to current sense resistor for bridge
A, or GND if current control not needed
BISEN
8
5
IO
Bridge B ground/Isense
Connect to current sense resistor for bridge
B, or GND if current control not needed
AOUT1
4
1
O
Bridge A output 1
AOUT2
6
3
O
Bridge A output 2
BOUT1
9
6
O
Bridge B output 1
BOUT2
7
4
O
Bridge B output 2
NAME
EXTERNAL COMPONENTS
OR CONNECTIONS
DESCRIPTION
STATUS
nFAULT
OUTPUT
Connect to motor winding A
Connect to motor winding B
PWP PACKAGE
(TOP VIEW)
GND
AISEN
5
20
VINT
AOUT2
6
19
VM
BOUT2
7
18
VM
BISEN
8
17
VCP
BOUT1
9
16
nFAULT
BOUT 2
4
nENBL / AENBL
10
15
CONFIG
STEP / BENBL
11
14
M1
BISEN
DIR / BPHASE
12
13
M0 / APHASE
BOUT 1
AOUT 1
1
18
GND
AISEN
2
17
VINT
AOUT 2
3
16
VM
15
VM
5
14
VCP
6
13
nFAULT
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7
8
9
10
11
12
S TE P / B E N B L
D IR / B P H A S E
M0 / APHASE
M1
C O N FIG
GND
(PPAD)
nE N B L / A E N B L
GND
(PPAD)
19
21
20
4
21
AVREF
AOUT1
22
22
23
3
24
BVREF
ADECAY
AVREF
VREFO
23
BVREF
24
2
V R E FO
1
nS LE E P
ADECAY
nSLEEP
BDECAY
BDECAY
4
RGE PACKAGE
(TOP VIEW)
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VM
Power supply voltage range
AVREF,
BVREF,
VINT,
ADECAY,
BDECAY
Analog input pin voltage range
(1) (2)
Digital input pin voltage range
xISEN pin voltage
Peak motor drive output current, t < 1 µs
VALUE
UNIT
–0.3 to 11.8
V
-0.5 to 3.6
V
–0.5 to 7
V
–0.3 to 0.5
V
Internally limited
A
TJ
Operating virtual junction temperature range
–40 to 150
°C
Tstg
Storage temperature range
–60 to 150
°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
THERMAL METRIC
PWP
RGE
24 PINS
24 PINS
θJA
Junction-to-ambient thermal resistance (1)
40.2
35.1
θJCtop
Junction-to-case (top) thermal resistance (2)
23.7
36.6
θJB
Junction-to-board thermal resistance (3)
21.9
12.2
0.7
0.6
(4)
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter (5)
21.7
12.2
θJCbot
Junction-to-case (bottom) thermal resistance (6)
3.9
4.0
UNITS
°C/W
xxx
(1)
(2)
(3)
(4)
(5)
(6)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
MIN
(1)
VM
Motor power supply voltage range
VREF
VREF input voltage range (2)
IVINT
VINT external load current
IVREF
VREF external load current
VDIGIN
Digital input pin voltage range
IOUT
Continuous RMS or DC output current per bridge (3)
(1)
(2)
(3)
NOM
MAX
UNIT
2.5
10.8
V
1
2
V
1
mA
400
µA
5.75
V
1.5
A
-0.3
Note that RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
Operational at VREF between 0 V and 1 V, but accuracy is degraded.
Power dissipation and thermal limits must be observed.
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ELECTRICAL CHARACTERISTICS
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VM = 5 V, excluding winding current
2.4
4
VM = 10 V, excluding winding current
2.75
UNIT
POWER SUPPLY
IVM
VM operating supply current
IVMQ
VM sleep mode supply current
VUVLO
VM undervoltage lockout voltage
VM = 5 V
0.6
VM = 10 V
9.6
VM falling
2
mA
μA
2.39
V
INTERNAL REGULATORS
VINT
VINT voltage
VM > 3.3 V, IOUT = 0 A to 1 mA
VREFO
VREF voltage
IOUT = 0 A to 400 µA
2.85
3
3.15
V
1.9
2
2.1
V
LOGIC-LEVEL INPUTS
VIL
Input low voltage
VIH
Input high voltage
VHYS
Input hysteresis
RPD
Input pull-down resistance
IIL
Input low current
IIN
Input current (M0)
IIH
Input high current
tDEG
Input deglitch time
nSLEEP
0.5
All other digital input pins
0.7
nSLEEP
All other digital input pins
2.5
V
2
nSLEEP
0.2
All except nSLEEP
0.4
nSLEEP
500
All except nSLEEP, M0
200
VIN = 0
-20
VIN = 3.3 V, nSLEEP
VIN = 3.3 V, all except nSLEEP
V
V
kΩ
1
μA
20
µA
6.6
13
16.5
33
312
468
μA
ns
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL
Output low voltage
IO = 5 mA
IOH
Output high leakage current
VO = 3.3 V
0.5
V
1
μA
H-BRIDGE FETS
HS FET on resistance
RDS(ON)
LS FET on resistance
VM = 5 V, I O = 500 mA, TJ = 25°C
160
VM = 5 V, IO = 500 mA, TJ = 85°C
190
VM = 2.7 V, I O = 500 mA, TJ = 25°C
200
VM = 2.7 V, IO = 500 mA, TJ = 85°C
240
VM = 5 V, I O = 500 mA, TJ = 25°C
145
VM = 5 V, IO = 500 mA, TJ = 85°C
180
VM = 2.7 V, I O = 500 mA, TJ = 25°C
190
VM = 2.7 V, IO = 500 mA, TJ = 85°C
IOFF
Off-state leakage current
250
295
240
mΩ
285
235
–2
2
μA
MOTOR DRIVER
fPWM
Current control PWM frequency
Internal PWM frequency
42.5
VREF > 375 mV or DAC codes > 29%
2.4
VREF < 375 mV or DAC codes < 29%
1.6
kHz
tBLANK
Current sense blanking time
µs
tR
Rise time
VM = 5 V, 16 Ω to GND, 10% to 90% VM
120
ns
tF
Fall time
VM = 5 V, 16 Ω to GND, 10% to 90% VM
100
ns
PROTECTION CIRCUITS
IOCP
Overcurrent protection trip level
tOCP
Overcurrent protection period
6
2
A
VREF > 375 mV or DAC codes > 29%
1.6
VREF < 375 mV or DAC codes < 29%
1.1
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ELECTRICAL CHARACTERISTICS (continued)
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
PARAMETER
tTSD
TEST CONDITIONS
Thermal shutdown temperature
Die temperature
MIN
TYP
MAX
UNIT
150
160
180
°C
CURRENT CONTROL
IREF
VREF input current
VREF = 3.3 V
VTRIP
xISEN trip voltage
For 100% current step
-1
AISENSE
Current sense amplifier gain
Reference only
1
µA
400
mV
5
V/V
TIMING REQUIREMENTS
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
NO.
PARAMETER
CONDITIONS
MIN
MAX
UNIT
250
kHz
1
fSTEP
Step frequency
2
tWH(STEP)
Pulse duration, STEP high
1.9
µs
3
tWL(STEP)
Pulse duration, STEP low
1.9
µs
4
tSU(STEP)
Setup time, command to STEP rising
200
ns
5
tH(STEP)
Hold time, command to STEP rising
6
tWAKE
Wakeup time, nSLEEP inactive to STEP
1
µs
1
ms
1
2
3
STEP
DIR, M0, M1
4
5
nSLEEP
6
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FUNCTIONAL DESCRIPTION
Device Configuration
The DRV8834 supports two configurations: phase/enable mode, where the outputs are controlled by phase
(direction) and enable signals for each H-bridge, and indexer mode, which allow control of a stepper motor using
simple step and direction inputs.
DC motors can only be controlled in phase/enable mode; indexer mode is not applicable to DC motors.
Stepper motors can be controlled using either phase/enable lode, or indexer mode.
The device is configured to be controlled either way using CONFIG pin. Logic HIGH on the CONFIG pin puts the
device in the STEP/DIR mode; logic LOW lets the motor to be controlled using the xPHASE/xENBL pins.
The state of the CONFIG pin is latched at power-up, and also whenever exiting sleep mode. CONFIG has an
internal pull-down resistor.
PWM Motor Drivers
DRV8834 contains two identical H-bridge motor drivers with current-control PWM circuitry. A block diagram of the
circuitry is shown below:
VM
OCP
VM
VCP, VM
xOUT1
From Logic
xON
Predrive
Step
Motor
xOUT 2
xPHASE
PWM
OCP
xISEN
+
Optional
DAC
/5
xVREF
xI[4:0]
4
Figure 1. Motor Control Circuitry
Current Control
The current through the motor windings may be regulated by a fixed-frequency PWM current regulation, or
current chopping.
With stepping motors, current control is normally used at all times. Often it is used to vary the current in the two
windings in a sinusoidal fashion to provide smooth motion. This is referred to as microstepping. The DRV8834
can provide up to 1/32 step microstepping, using internal 5-bit DACs. Finer microstepping can be implemented
using the xPHASE/xENBL signals to control the stepper motor, and varying the xVREF voltages. The current
flowing through the corresponding H-bridge varies according to the equation given below. A very high degree of
microstepping can be achieved through this technique.
With DC motors, current control can be used to limit the start-up current of the motor to less than the stall current
of the motor.
8
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Current regulation works as follows:
When an H-bridge is enabled, current rises through the winding at a rate dependent on the supply voltage and
inductance of the winding. If the current reaches the current chopping threshold, the bridge disables the current
until the beginning of the next PWM cycle. Note that immediately after the current is enabled, the voltage on the
xISEN pin is ignored for a period of time before enabling the current sense circuitry. This blanking time also sets
the minimum on time of the PWM when operating in current chopping mode.
Note that the blanking time also sets the minimum PWM duty cycle. This can cause current control errors near
the zero current level when microstepping. To help eliminate this error, the DRV8834 has a "dynamic" tBLANK
time. When the commanded current is low, the blanking period is reduced, which in turn lowers the minimum
duty cycle. This provides a smoother current transition across the zero crossing region of the current waveform.
The end result is smoother and quieter motor operation.
The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor
connected to the xISEN pins, with a reference voltage supplied to the AVREF and BVREF pins. In indexer mode,
the reference voltages are scaled by internal DACs to provide scaled currents used to perform microstepping.
The chopping current is calculated as follows:
xVREF
ICHOP = 5¾
· RISENSE
(1)
Example: If xVREF is 2 V (as it would be if xVREF is connected directly to VREFO) and a 400-mΩ sense resistor
is used, the chopping current will be 2 V/5 x 400 mΩ = 1 A.
In indexer mode, this current value is scaled by between 5% and 100% by the internal DACs, as shown in the
step table in the "Microstepping Indexer" section of the datasheet.
Note that if current control is not needed, the xISEN pins may be connected directly to ground. in this case it is
also recommended to connect AVREF and BVREF directly to VREFO.
Current Recirculation and Decay Modes
During PWM current chopping, the H-bridge is enabled to drive current through the motor winding until the PWM
current chopping threshold is reached. This is shown in Figure 2 as case 1. The current flow direction shown
indicates positive current flow in the step table below for indexer mode, or the current flow with xPHASE = 1 in
phase/enable mode.
Once the chopping current threshold is reached, the drive current is interrupted, but due to the inductive nature
of the motor, the current must continue to flow. This is called recirculation current. To handle this recirculation
current, the H-bridge can operate in two different states, fast decay or slow decay.
In fast decay mode, once the PWM chopping current level has been reached, the H-bridge reverses state to
allow winding current to flow in through the opposing FETs. As the winding current approaches zero, the bridge
is disabled to prevent any reverse current flow. Fast decay mode is shown in Figure 2 as case 2.
In slow decay mode, winding current is re-circulated by enabling both of the low-side FETs in the bridge. This is
shown as case 3 below.
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xVM
1 Drive Current
1
2 Fast decay
xOUT2
xOUT1
3 Slow decay
2
3
Figure 2. Decay Modes
The DRV8834 supports fast, slow, and also mixed decay modes. With DC motors, slow decay is nearly always
used to minimize current ripple and optimize speed control; with stepper motors, the decay mode is chosen for a
given stepper motor and operating conditions to minimize mechanical noise and vibration.
In mixed decay mode, the current recirculation begins as fast decay, but at a fixed period of time (determined by
the state of the xDECAY pins shown in Table 2) switches to slow decay mode for the remainder of the fixed
PWM period.
Table 2. Decay Pin Configuration
RESISTANCE ON xDECAY PIN
10
-OR- VOLTAGE FORCED ON xDECAY PIN
% OF PWM CYCLE IS FAST DECAY
< 1 kΩ
< 0.1 V
0%
20 kΩ ±5%
0.2 V ±5%
25%
50 kΩ ±5%
0.5 V ±5%
50%
100 kΩ ±5%
1 V ±5%
75%
kΩ
>2V
100%
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Figure 3 illustrates the current waveforms in slow, fast, and 25% and 75% mixed decay modes.
PWM
ON
PWM OFF (tOFF)
Slow Decay
Fast Decay
Mixed Decay
25%
Mixed Decay
75%
Itrip
25% of cycle
75% of cycle
PWM CYCLE
Figure 3. PWM Cycle
Decay mode is selected by the voltage present on the xDECAY pins. Internal current sources of 10 µA (typical)
are connected to the pins, which allows setting of the decay mode by a resistor connected to ground if desired.
It is possible to drive the xDECAY pin with a tri-state GPIO pin and also place the resistor to ground. This allows
a microcontroller to select fast, slow, or mixed decay modes by driving the pin high, low, or high-impedance.
Note that the logic-low voltage must be less than 0.1 V with 10-µA of current sourced from the DRV8834 to attain
slow decay.
In indexer mode, only the ADECAY pin is used, and slow decay mode is always used when at any point in the
step table where the current is increasing. When current is decreasing or remaining constant, the decay mode
used will be fast, slow, or mixed, as commanded by the ADECAY pin.
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Phase/Enable Mode
In phase/enable mode, the xPHASE input pins control the direction of current flow through each H-bridge. This
sets the direction of rotation of a DC motor, or the direction of the current flow in a stepper motor winding. Driving
the xENBL input pins active high enables the H-bridge outputs. This can be used as PWM speed control of a DC
motor, or to enable/disable the current in a stepper motor.
In phase/enable mode, the M1 input pin controls the state of the H-bridges when xENBL = 0. If M1 is high, the
outputs are disabled (high impedance) when xENBL = 0; this corresponds to asynchronous fast decay mode,
and is usually used in stepper motor applications to command a "zero current" state. If M1 is low, then the
outputs are both driven low; this corresponds to slow decay or brake mode, and is usually used when controlling
the speed of a DC motor by PWMing the xENBL pin.
Table 3. H-Bridge Control Using Phase/Enable Mode
M1
xENBL
xPHASE
xOUT1
xOUT2
1
0
X
Z
Z
0
0
X
0
0
X
1
0
L
H
X
1
1
H
L
Indexer Mode
To allow a simple step and direction interface to control stepper motors, the DRV8834 contains a microstepping
indexer. The indexer controls the state of the H-bridges automatically. Whenever there's a rising edge at the
STEP input, the indexer moves to the next step, according to the direction set by the DIR pin.
The nENBL pin is used to disable the output stage in indexer mode. When nENBL = 1, the indexer inputs are still
active and will respond to the STEP and DIR input pins; only the output stage is disabled.
The indexer logic in the DRV8834 allows a number of different stepping configurations. The M0 and M1 pins are
used to configure the stepping format as shown in Table 4.
Table 4. Stepping Format
M1
M0
STEP MODE
0
0
Full step (2-phase excitation)
0
1
1/2 step (1-2 phase excitation)
0
Z
1/4 step (W1-2 phase excitation)
1
0
8 microsteps/step
1
1
16 microsteps/step
1
Z
32 microsteps/step
Note that the M0 pin is a tri-level input. It can be driven logic low, logic high, or high-impedance (Z).
The M0 and M1 pins can be statically configured by connecting to VINT, GND, or left open, or can be driven with
standard tri-state microcontroller I/O port pins. Their state is latched at each rising edge of the STEP input.
The step mode may be changed on-the-fly while the motor is moving. The indexer will advance to the next valid
state for the new M0/M1 setting at the next rising edge of STEP.
The home state is 45°. This state is entered after power-up, after exiting undervoltage lockout, or after exiting
sleep mode. This is shown in Table 5 by cells shaded yellow.
The following table shows the relative current and step directions for different step mode settings. At each rising
edge of the STEP input, the indexer travels to the next state in the table. The direction is shown with the DIR pin
high; if the DIR pin is low the sequence is reversed. Positive current is defined as xOUT1 = positive with respect
to xOUT2.
12
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Table 5. Current and Step Directions
1/32 STEP
1/16 STEP
1/8 STEP
1/4 STEP
1/2 STEP
1
1
1
1
1
FULL STEP
70%
2
3
2
4
5
3
2
6
7
4
8
9
5
3
2
10
11
6
12
13
7
4
14
15
8
16
17
9
5
3
2
1
18
19
10
20
21
11
6
22
23
12
24
25
13
7
4
26
27
14
28
29
15
8
30
31
16
32
33
17
9
5
3
34
35
18
36
37
19
10
38
39
20
40
41
21
11
6
42
43
22
44
45
23
12
46
47
24
WINDING
CURRENT A
WINDING
CURRENT B
ELECTRICAL
ANGLE
100%
0%
0
100%
5%
3
100%
10%
6
99%
15%
8
98%
20%
11
97%
24%
14
96%
29%
17
94%
34%
20
92%
38%
23
90%
43%
25
88%
47%
28
86%
51%
31
83%
56%
34
80%
60%
37
77%
63%
39
74%
67%
42
71%
71%
45
67%
74%
48
63%
77%
51
60%
80%
53
56%
83%
56
51%
86%
59
47%
88%
62
43%
90%
65
38%
92%
68
34%
94%
70
29%
96%
73
24%
97%
76
20%
98%
79
15%
99%
82
10%
100%
84
5%
100%
87
0%
100%
90
-5%
100%
93
-10%
100%
96
-15%
99%
98
-20%
98%
101
-24%
97%
104
-29%
96%
107
-34%
94%
110
-38%
92%
113
-43%
90%
115
-47%
88%
118
-51%
86%
121
-56%
83%
124
-60%
80%
127
-63%
77%
129
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Table 5. Current and Step Directions (continued)
1/32 STEP
1/16 STEP
1/8 STEP
1/4 STEP
1/2 STEP
FULL STEP
70%
25
13
7
4
2
48
49
50
51
26
52
53
27
14
54
55
28
56
57
29
15
8
58
59
30
60
61
31
16
62
63
32
64
65
33
17
9
5
66
67
34
68
69
35
18
70
71
36
72
73
37
19
10
74
75
38
76
77
39
20
78
79
40
80
81
41
21
11
6
3
82
83
42
84
85
43
22
86
87
44
88
89
45
23
12
90
91
46
92
93
47
24
94
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WINDING
CURRENT A
WINDING
CURRENT B
ELECTRICAL
ANGLE
-67%
74%
132
-71%
71%
135
-74%
67%
138
-77%
63%
141
-80%
60%
143
-83%
56%
146
-86%
51%
149
-88%
47%
152
-90%
43%
155
-92%
38%
158
-94%
34%
160
-96%
29%
163
-97%
24%
166
-98%
20%
169
-99%
15%
172
-100%
10%
174
-100%
5%
177
-100%
0%
180
-100%
-5%
183
-100%
-10%
186
-99%
-15%
188
-98%
-20%
191
-97%
-24%
194
-96%
-29%
197
-94%
-34%
200
-92%
-38%
203
-90%
-43%
205
-88%
-47%
208
-86%
-51%
211
-83%
-56%
214
-80%
-60%
217
-77%
-63%
219
-74%
-67%
222
-71%
-71%
225
-67%
-74%
228
-63%
-77%
231
-60%
-80%
233
-56%
-83%
236
-51%
-86%
239
-47%
-88%
242
-43%
-90%
245
-38%
-92%
248
-34%
-94%
250
-29%
-96%
253
-24%
-97%
256
-20%
-98%
259
-15%
-99%
262
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Table 5. Current and Step Directions (continued)
1/32 STEP
1/16 STEP
95
48
1/8 STEP
1/4 STEP
1/2 STEP
FULL STEP
70%
96
97
49
25
13
7
98
99
50
100
101
51
26
102
103
52
104
105
53
27
14
106
107
54
108
109
55
28
110
111
56
112
113
57
29
15
8
4
114
115
58
116
117
59
30
118
119
60
120
121
61
31
16
122
123
62
124
125
63
32
126
127
64
128
WINDING
CURRENT A
WINDING
CURRENT B
ELECTRICAL
ANGLE
-10%
-100%
264
-5%
-100%
267
0%
-100%
270
5%
-100%
273
10%
-100%
276
15%
-99%
278
20%
-98%
281
24%
-97%
284
29%
-96%
287
34%
-94%
290
38%
-92%
293
43%
-90%
295
47%
-88%
298
51%
-86%
301
56%
-83%
304
60%
-80%
307
63%
-77%
309
67%
-74%
312
71%
-71%
315
74%
-67%
318
77%
-63%
321
80%
-60%
323
83%
-56%
326
86%
-51%
329
88%
-47%
332
90%
-43%
335
92%
-38%
338
94%
-34%
340
96%
-29%
343
97%
-24%
346
98%
-20%
349
99%
-15%
352
100%
-10%
354
100%
-5%
357
nSLEEP Operation
Driving nSLEEP low will put the device into a low power sleep state. In this state, the H-bridges are disabled, the
gate drive charge pump is stopped, all internal logic is reset (note that this returns the indexer to the home state),
the VINT supply is disabled, and all internal clocks are stopped. All inputs are ignored until nSLEEP returns
inactive high.
Since the VINT supply is disabled during sleep mode, it cannot be used to provide a logic high signal to the
nSLEEP pin. To simplify board design, the nSLEEP can be pulled up directly to the supply (VM) if it is not
actively driven. Unless VM is less than 5.75 V, a pullup resistor is required.
The nSLEEP pin is protected by a zener diode that will clamp the pin voltage to approximately 6.5 V. The pullup
resistor limits the current to the input in case VM is higher than 6.5 V. The recommended pullup resistor is 20 kΩ
- 50 kΩ.
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When exiting sleep mode, the nFAULT pin will be briefly driven active low as the internal power supplies turn on.
nFAULT will return to inactive high once the internal power supplies (including charge pump) have stabilized.
This process takes some time (up to 1 ms), before the motor driver becomes fully operational.
Protection Circuits
The DRV8834 is fully protected against undervoltage, overcurrent and overtemperature events.
Overcurrent Protection (OCP)
An analog current limit circuit on each FET limits the current through the FET by limiting the gate drive. If this
analog current limit persists for longer than the OCP deglitch time (tOCP), all FETs in the H-bridge will be disabled
and the nFAULT pin will be driven low. The driver will be re-enabled after the OCP retry period (approximately
1.2 ms) has passed. nFAULT becomes high again at this time. If the fault condition is still present, the cycle
repeats. If the fault is no longer present, normal operation resumes and nFAULT remains deasserted. Please
note that only the H-bridge in which the OCP is detected will be disabled while the other bridge will function
normally.
Overcurrent conditions are detected independently on both high and low side devices; i.e., a short to ground,
supply, or across the motor winding will all result in an overcurrent shutdown. Note that overcurrent protection
does not use the current sense circuitry used for PWM current control, so functions even without presence of the
xISEN resistors.
Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all FETs in the H-bridge will be disabled and the nFAULT pin will be
driven low. Once the die temperature has fallen to a safe level operation will automatically resume and nFAULT
will become inactive.
Undervoltage Lockout (UVLO)
If at any time the voltage on the VM pin falls below the undervoltage lockout threshold voltage, all circuitry in the
device will be disabled, and all internal logic will be reset. Operation will resume when VM rises above the UVLO
threshold. The nFAULT pin is driven low during an undervoltage condition, and also at power-up or sleep mode,
until the internal power supplies have stabilized.
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APPLICATIONS INFORMATION
The DRV8834 is a very flexible motor driver. It can be used to drive two DC motors or a stepper motor, in a
number of different configurations.
The following applications schematics show various configurations and connections for the DRV8834.
Note that component values, especially for RSENSE and the DECAY pins, may be different depending on your
motor and application. Refer to the information above to determine the best values for these components in your
application.
Phase/Enable Mode Driving Two DC Motors
In this configuration, the DRV8834 is used to drive two independent DC motors. Current up to 1 A per motor is
possible. The M1 pin is pulled low to allow slow decay PWM from the controller (if desired) to control the motor
speed by PWMing the xENBL inputs, and ADECAY and BDECAY are connected to ground to set slow decay
mode during current limiting. The value of the RSENSE resistors shown is for a 1-A current limit; if current
limiting is not needed, the AISEN and BISEN pins may be connected directly to ground. If the sleep function is
not needed, nSLEEP can be connected to VM with an approximate 47-kΩ resistor.
Figure 4. Phase/Enable Mode Driving Two DC Motors
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Phase/Enable Mode Driving a Stepper Motor
Phase/enable mode can be used with a simple interface to a controller to operate a stepper motor in full, half, or
quarter step modes. The decay mode can be set by changing the values of the resistors connected to the
ADECAY and BDECAY pins. The M1 pin is driven to logic high (by connecting to the VINT supply), to allow a
zero-current (off) state when the xENBL pin is set low. Coil current is set by the RSENSE resistors. If the sleep
function is not needed, nSLEEP can be connected to VM with an approximate 47-kΩ resistor.
Figure 5. Phase/Enable Mode Driving a Stepper Motor
1 Step
1 Step
APHASE
APHASE
BPHASE
BPHASE
AENBL
AENBL
BENBL
BENBL
A Current
A Current
B Current
B Current
Figure 6. Full Step Sequence
(2-Phase)
18
Figure 7. Half Step Sequence
(1-2 Phase)
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Indexer Mode Driving a Stepper Motor
In indexer mode, only a rising edge on the STEP pin is needed to move the motor to the next step. The DIR pin
sets which direction the motor rotates, by reversing the step sequence. The internal indexer can operate in fullstep, half-step, and smaller microsteps up to 1/32-step, depending on the state of the M0 and M1 pins. The M0
and M1 pins can also be connected directly to ground or to VINT to program the step modes, if desired. If the
sleep function is not needed, nSLEEP can be connected to VM with an approximate 47-kΩ resistor. Step
sequences for full and half step are shown below.
Figure 8. Indexer Mode Driving a Stepper Motor
1 Step
1 Step
STEP
STEP
DIR
DIR
A Current
A Current
B Current
B Current
Figure 9. Full Step Sequence
(2-Phase)
Figure 10. Half Step Sequence
(1-2 Phase)
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High-Resolution Microstepping Using a Microcontroller to Modulate VREF Signals
Using a microcontroller with two DAC outputs, very high resolution microstepping can be performed with the
DRV8834. In this mode, the coil current direction is controlled by the PHASE pins, and the current in each coil is
independently set using the two VREF input pins, which are connected to DACs. In addition, the microcontroller
can set the decay mode for each coil dynamically, by driving the xDECAY pin low for slow decay, high for fast
decay, or high-impedance which sets mixed decay (based on the value of a resistor connected to ground). If the
sleep function is not needed, nSLEEP can be connected to VM with an approximate 47-kΩ resistor.
For more details on this technique, please refer to TI Application Report (SLVA416), "High Resolution
Microstepping Driver With the DRV88xx Series".
Figure 11. High-Resolution Microstepping
1 Step
APHASE
BPHASE
AVREF
BVREF
A Current
B Current
Figure 12. Microstepping Sequence
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THERMAL INFORMATION
Maximum Output Current
In actual operation, the maximum output current achievable with a motor driver is a function of die temperature.
This in turn is greatly affected by ambient temperature and PCB design. Basically, the maximum motor current
will be the amount of current that results in a power dissipation level that, along with the thermal resistance of the
package and PCB, keeps the die at a low enough temperature to stay out of thermal shutdown.
The thermal data given in the datasheet can be used as a guide to calculate the approximate maximum power
dissipation that can be expected to be possible without entering thermal shutdown for several different PCB
constructions. However, for accurate data, the actual PCB design must be analyzed via measurement or thermal
simulation.
Thermal Protection
The DRV8834 has thermal shutdown (TSD) as described above. If the die temperature exceeds approximately
160°C, the device will be disabled until the temperature drops to a safe level.
Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation,
insufficient heatsinking, or too high an ambient temperature.
Power Dissipation
Power dissipation in the DRV8834 is dominated by the DC power dissipated in the output FET resistance, or
RDS(ON). There is additional power dissipated due to PWM switching losses, which are dependent on PWM
frequency, rise and fall times, and VM supply voltages. These switching losses are typically on the order of 10%
to 20% of the DC power dissipation.
The DC power dissipation of one H-bridge can be roughly estimated by Equation 2.
2
2
PTOT = (HS - RDS(ON) · IOUT(RMS) ) + (LS - RDS(ON) · IOUT(RMS) )
(2)
where PTOT is the total power dissipation, HS - RDS(ON) is the resistance of the high side FET, LS - RDS(ON) is the
resistance of the low side FET, and IOUT(RMS) is the RMS output current being applied to the motor.
Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. This must
be taken into consideration when sizing the heatsink.
Heatsinking
The PowerPAD™ package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, refer to TI application report SLMA002, " PowerPAD™ Thermally
Enhanced Package" and TI application brief SLMA004, " PowerPAD™ Made Easy", available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
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PACKAGE OPTION ADDENDUM
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14-Jun-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
DRV8834PWP
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
DRV8834PWPR
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
DRV8834RGER
ACTIVE
VQFN
RGE
24
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
DRV8834RGET
ACTIVE
VQFN
RGE
24
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
DRV8834PWPR
HTSSOP
PWP
24
2000
330.0
16.4
DRV8834RGER
VQFN
RGE
24
3000
330.0
DRV8834RGET
VQFN
RGE
24
250
180.0
6.95
8.3
1.6
8.0
16.0
Q1
12.4
4.25
4.25
1.15
8.0
12.0
Q2
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8834PWPR
HTSSOP
PWP
24
2000
346.0
346.0
33.0
DRV8834RGER
VQFN
RGE
24
3000
346.0
346.0
29.0
DRV8834RGET
VQFN
RGE
24
250
210.0
185.0
35.0
Pack Materials-Page 2
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