AP9408AGP
RoHS-compliant Product
Advanced Power
Electronics Corp.
▼ Lower Gate Charge
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
BVDSS
30V
RDS(ON)
10mΩ
ID
G
53A
S
Description
Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
G
D
TO-220(P)
S
The TO-220 package is widely preferred for commercial-industrial
power applications and suited for low voltage applications such as
DC/DC converters.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
30
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V
53
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V
33
A
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
TSTG
TJ
160
A
44.6
W
Storage Temperature Range
-55 to 150
℃
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Rthj-c
Maximum Thermal Resistance, Junction-case
Rthj-a
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
Value
Units
2.8
℃/W
62
℃/W
1
200810282
AP9408AGP
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Min.
Typ.
Max. Units
VGS=0V, ID=250uA
30
-
-
V
VGS=10V, ID=30A
-
-
10
mΩ
VGS=4.5V, ID=20A
-
-
15
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
1
-
3
V
gfs
Forward Transconductance
VDS=10V, ID=30A
-
30
-
S
IDSS
Drain-Source Leakage Current
VDS=30V, VGS=0V
-
-
10
uA
IGSS
Gate-Source Leakage
VGS=±20V
-
-
±100
nA
ID=20A
-
6.5
10.5
nC
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=24V
-
1.8
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
3.7
-
nC
VDS=15V
-
6
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=20A
-
56
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
15
-
ns
tf
Fall Time
RD=0.75Ω
-
3.7
-
ns
Ciss
Input Capacitance
VGS=0V
-
600
960
pF
Coss
Output Capacitance
VDS=25V
-
185
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
80
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2.5
3.8
Ω
Min.
Typ.
Source-Drain Diode
Symbol
Parameter
2
VSD
Forward On Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
2
Test Conditions
Max. Units
IS=30A, VGS=0V
-
-
1.2
V
IS=10A, VGS=0V,
-
23
-
ns
dI/dt=100A/µs
-
16
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9408AGP
160
100
10 V
7.0 V
6.0 V
5.0 V
ID , Drain Current (A)
120
80
V G = 4.0 V
80
10V
7.0V
6.0V
5.0V
V G = 4.0 V
T C = 1 50 o C
ID , Drain Current (A)
o
T C = 25 C
60
40
40
20
0
0
0
1
2
3
4
0
5
Fig 1. Typical Output Characteristics
2
3
4
5
6
Fig 2. Typical Output Characteristics
14
2.0
I D =20A
I D =30A
V G =10V
T C =25 o C
Normalized RDS(ON)
13
RDS(ON) (mΩ)
1
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
12
11
1.6
1.2
10
0.8
9
8
0.4
2
4
6
8
10
-50
0
50
100
150
T j , Junction Temperature ( o C)
V GS Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.6
T j =150 o C
T j =25 o C
IS(A)
20
Normalized VGS(th) (V)
30
10
1.2
0.8
0.4
0
0
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
T j ,Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9408AGP
f=1.0MHz
1000
I D = 20 A
800
V DS = 15 V
V DS = 18 V
V DS = 24 V
6
C (pF)
VGS , Gate to Source Voltage (V)
8
4
600
C iss
400
2
C oss
200
C rss
0
0
0
2
4
6
8
10
1
12
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS ,Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
Normalized Thermal Response (Rthjc)
1
ID (A)
100
100us
10
1ms
10ms
100ms
DC
o
T C =25 C
Single Pulse
1
0.1
1
10
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
0.02
t
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
100
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-220
E
A
E1
SYMBOLS
φ
L1 L5
c1
D1
D
L4
Millimeters
MIN
NOM
MAX
A
4.40
4.60
4.80
b
D
c
E
0.76
0.88
1.00
8.60
8.80
9.00
0.36
0.43
0.50
9.80
10.10
10.40
L4
14.70
15.00
15.30
L5
6.20
6.40
6.60
D1
b1
5.10 REF.
c1
1.25
1.35
1.45
b1
1.17
1.32
1.47
L
13.25
13.75
14.25
2.54 REF.
e
L
c
b
L1
2.60
φ
E1
3.71
2.75
2.89
3.84
3.96
7.4 REF,
1.All Dimensions Are in Millimeters.
2.Dimension Does Not Include Mold Protrusions.
e
Part Marking Information & Packing : TO-220
Part Number
Package Code
meet Rohs requirement
9408AGP
LOGO
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
5