Product Folder Order Now Support & Community Tools & Software Technical Documents Reference Design DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 DRV5032 Ultra-Low-Power Digital-Switch Hall Effect Sensor 1 Features 3 Description • The DRV5032 device is an ultra-low-power digitalswitch Hall effect sensor, designed for the most compact and battery-sensitive systems. The device is offered in multiple magnetic thresholds, sampling rates, output drivers, and packages to accommodate various applications. 1 • • • • • • • Industry-Leading Ultra-Low Power Consumption – 5-Hz Version: 0.54 µA With 1.8 V – 20-Hz Versions: 1.6 µA With 3 V 1.65- to 5.5-V Operating VCC Range Magnetic Threshold Options (Maximum BOP): – 3.9 mT, Highest Sensitivity – 4.8 mT, High Sensitivity – 9.5 mT, Medium Sensitivity – 63 mT, Lowest Sensitivity Omnipolar and Unipolar Options 20-Hz and 5-Hz Sampling Rate Options Open-Drain and Push-Pull Output Options SOT-23 and X2SON Package Options –40°C to +85°C Operating Temperature Range 2 Applications • • • • • • • Battery-Critical Position Sensing Electricity Meter Tamper Detection Cell Phone, Laptop, or Tablet Case Sensing E-locks, Smoke Detectors, Appliances Medical Devices, IoT Systems Valve or Solenoid Position Detection Contactless Diagnostics or Activation When the applied magnetic flux density exceeds the BOP threshold, the device outputs a low voltage. The output stays low until the flux density decreases to less than BRP, and then the output either drives a high voltage or becomes high impedance, depending on the device version. By incorporating an internal oscillator, the device samples the magnetic field and updates the output at a rate of 20 Hz, or 5 Hz for the lowest current consumption. Omnipolar and unipolar magnetic responses are available. The device operates from a VCC range of 1.65 V to 5.5 V, and is packaged in a standard SOT-23 and small X2SON. Device Information(1) PART NUMBER DRV5032 PACKAGE BODY SIZE (NOM) SOT-23 (3) 2.92 mm × 1.30 mm X2SON (4) 1.10 mm × 1.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Current Consumption of 5-Hz Version Typical Schematic 1.4 distance DRV5032 VCC OUT N S Controller GPIO GND Copyright © 201 7, Texas Instrumen ts Incorpor ate d Average Supply Current (PA) VCC 1.2 1 0.8 0.6 0.4 1.65 V 3V 5.5 V 0.2 0 -40 -10 20 Temperature (qC) 50 80 D011 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 5 7.1 7.2 7.3 7.4 7.5 7.6 7.7 5 5 5 5 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Magnetic Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 10 8.1 Overview ................................................................. 10 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 10 8.4 Device Functional Modes........................................ 14 9 Application and Implementation ........................ 15 9.1 Application Information............................................ 15 9.2 Typical Applications ............................................... 15 9.3 Do's and Don'ts ....................................................... 19 10 Power Supply Recommendations ..................... 20 11 Layout................................................................... 20 11.1 Layout Guidelines ................................................. 20 11.2 Layout Examples................................................... 20 12 Device and Documentation Support ................. 21 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ........................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 21 21 13 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (September 2017) to Revision D • Added the DU device version to the data sheet .................................................................................................................... 3 Changes from Revision B (August 2017) to Revision C • 2 Page Added the ZE device version and the preview AJ device version ......................................................................................... 3 Changes from Original (April 2017) to Revision A • Page Changed the status of the AJ device version from Preview to Active ................................................................................... 3 Changes from Revision A (May 2017) to Revision B • Page Page Added the FA and FD device versions................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 5 Device Comparison Table VERSION MAXIMUM THRESHOLD MAGNETIC RESPONSE OUTPUT TYPE SAMPLING RATE PACKAGES AVAILABLE DRV5032DU 3.9 mT Unipolar Push-pull 20 Hz SOT-23, X2SON DRV5032FA Omnipolar Push-pull 20 Hz SOT-23, X2SON DRV5032FB Omnipolar Push-pull 5 Hz SOT-23 Omnipolar Open-drain 20 Hz SOT-23 Unipolar Push-pull 20 Hz X2SON DRV5032FC 4.8 mT DRV5032FD DRV5032AJ 9.5 mT Omnipolar Open-drain 20 Hz SOT-23, X2SON DRV5032ZE 63 mT Omnipolar Open-drain 20 Hz SOT-23 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 3 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 6 Pin Configuration and Functions FA, FB, FC, AJ, ZE Versions DBZ Package 3-Pin SOT-23 Top View VCC VCC 1 1 3 GND 3 OUT DU Version DBZ Package 3-Pin SOT-23 Top View OUT2 2 FA, AJ Versions DMR Package 4-Pin X2SON Top View GND 2 DU, FD Versions DMR Package 4-Pin X2SON Top View VCC OUT VCC OUT1 1 4 1 4 Thermal Pad Thermal Pad 2 3 2 3 GND NC GND OUT2 Pin Functions PIN SOT-23 (FA, FB, FC, AJ, ZE) NAME SOT-23 (DU) X2SON (FA, AJ) X2SON (DU, FD) I/O DESCRIPTION GND 3 3 2 2 — Ground reference OUT 2 — 4 — O Omnipolar output that responds to north and south magnetic poles OUT1 — — — 4 O Unipolar output that responds to north magnetic poles near the top of the package OUT2 — 2 — 3 O Unipolar output that responds to south magnetic poles near the top of the package NC — — 3 — — No-connect. This pin is not connected to the silicon. It should be left floating or tied to ground. It should be soldered to the board for mechanical support. VCC 1 1 1 1 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.1 µF. Thermal Pad — — PAD PAD — No-connect. This pin should be left floating or tied to ground. It should be soldered to the board for mechanical support. 4 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT –0.3 5.5 V Power supply voltage VCC Power supply voltage slew rate VCC Output voltage OUT, OUT1, OUT2 –0.3 VCC + 0.3 V Output current OUT, OUT1, OUT2 –5 5 mA 105 °C 150 °C Unlimited Magnetic flux density, BMAX Unlimited Junction temperature, TJ Storage temperature, Tstg (1) V / µs –65 T Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±6000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±750 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC Power supply voltage VO Output voltage IO Output current TA Operating ambient temperature MIN MAX UNIT 1.65 5.5 V 0 5.5 V –5 5 mA –40 85 °C SOT-23 (DBZ) X2SON (DMR) UNIT 3 PINS 4 PINS 356 159 °C/W 128 77 °C/W 7.4 Thermal Information DRV5032 THERMAL METRIC (1) RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter (1) 94 102 °C/W 11.4 0.9 °C/W 92 100 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 5 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 7.5 Electrical Characteristics for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VCC – 0.35 VCC – 0.1 MAX UNIT PUSH-PULL OUTPUT DRIVER VOH High-level output voltage IOUT = –1 mA VOL Low-level output voltage IOUT = 1 mA V 0.1 0.3 V 5 100 nA 0.1 0.3 V 13.3 20 37 Hz 27 50 75 ms 3.5 µA OPEN-DRAIN OUTPUT IOZ High impedance output leakage current VCC = 5.5 V, OUT = 5.5 V VOL Low-level output voltage IOUT = 1 mA DU, FA, FC, FD, AJ, ZE VERSIONS fS Frequency of magnetic sampling tS Period of magnetic sampling ICC(AVG) Average current consumption VCC = 1.8 V 1.3 VCC = 3 V 1.6 VCC = 5 V 2.3 FB VERSION fS Frequency of magnetic sampling 3.5 5 8.5 Hz tS Period of magnetic sampling 117 200 286 ms 1.8 µA 2 2.7 mA 100 µs ICC(AVG) Average current consumption VCC = 1.8 V 0.54 VCC = 3 V 0.69 VCC = 5 V 1.06 ALL VERSIONS ICC(PK) Peak current consumption tON Power-on time (see Figure 17) 55 tACTIVE Active time period (see Figure 17) 40 6 Submit Documentation Feedback µs Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 7.6 Magnetic Characteristics for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUT1 pin (north) –3.9 –2.5 –1.2 OUT2 pin (south) 1.2 2.5 3.9 OUT1 pin (north) –3.5 –1.8 –0.9 OUT2 pin (south) 0.9 1.8 3.5 Each output 0.1 0.7 1.9 mT DU VERSION BOP Magnetic threshold operate point BRP Magnetic threshold release point BHYS Magnetic hysteresis: |BOP – BRP| mT mT FA, FB, FC VERSIONS BOP Magnetic threshold operate point ±1.5 ±3 ±4.8 mT BRP Magnetic threshold release point ±0.5 ±1.5 ±3 mT BHYS Magnetic hysteresis: |BOP – BRP| 0.8 1.5 3 mT OUT1 pin (north) –4.8 –3 –1.5 OUT2 pin (south) 1.5 3 4.8 OUT1 pin (north) –3 –1.5 –0.5 OUT2 pin (south) 0.5 1.5 3 Each output 0.8 1.5 3 mT FD VERSION BOP Magnetic threshold operate point BRP Magnetic threshold release point BHYS Magnetic hysteresis: |BOP – BRP| mT mT AJ VERSION BOP Magnetic threshold operate point ±4 ±7 ±9.5 mT BRP Magnetic threshold release point ±3 ±5.6 ±7.5 mT BHYS Magnetic hysteresis: |BOP – BRP| 0.5 1.4 3 mT ZE VERSION BOP Magnetic threshold operate point ±33 ±47 ±63 mT BRP Magnetic threshold release point ±30 ±43 ±58 mT BHYS Magnetic hysteresis: |BOP – BRP| 1.2 4 8.5 mT (1) For a graphical description of magnetic thresholds, see the Magnetic Response section. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 7 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 7.7 Typical Characteristics 1.4 2.5 Average Supply Current (PA) Average Supply Current (PA) 3 2 1.5 1 1.65 V 3V 5.5 V 0.5 0 -40 -10 20 Temperature (qC) 50 1.2 1 0.8 0.6 0.4 0 -40 80 Magnetic Threshold Release Point (mT) 6 FA, FB, FC, FD Versions AJ Version DU Version 5 4 3 -20 0 20 40 Temperature (°C) 60 80 D011 4 FA, FB, FC, FD Versions AJ Version DU Version 3 2 1 -40 100 -20 0 D023 20 40 Temperature (°C) 60 80 100 D025 Figure 4. |BRP| vs Temperature 8 6 Magnetic Threshold Release Point (mT) Magnetic Threshold Operate Point (mT) 80 5 Figure 3. |BOP| vs Temperature 7 6 FA, FB, FC, FD Versions AJ Version DU Version 5 4 3 2.5 3.5 Supply Voltage (V) 4.5 5.5 5 4 FA, FB, FC, FD Versions AJ Version DU Version 3 2 1 1.5 D022 Figure 5. |BOP| vs VCC 8 50 6 7 2 1.5 20 Temperature (qC) Figure 2. ICC(AVG) vs Temperature (5-Hz version) 8 Magnetic Threshold Operate Point (mT) -10 D016 Figure 1. ICC(AVG) vs Temperature (20-Hz versions) 2 -40 1.65 V 3V 5.5 V 0.2 2.5 3.5 Supply Voltage (V) 4.5 5.5 D024 Figure 6. |BRP| vs VCC Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 Typical Characteristics (continued) 60 Magnetic Threshold Release Point (mT) Magnetic Threshold Operate Point (mT) 60 55 50 45 40 35 30 -40 -10 20 Temperature (°C) 50 55 50 45 40 35 30 -40 80 Figure 7. ZE Version |BOP| vs Temperature 50 80 D021 45 Magnetic Threshold Release Point (mT) Magnetic Threshold Operate Point (mT) 20 Temperature (°C) Figure 8. ZE Version |BRP| vs Temperature 50 49 48 47 46 45 1.5 -10 D020 2.5 3.5 Supply Voltage (V) 4.5 5.5 44 43 42 41 40 1.5 D018 Figure 9. ZE Version |BOP| vs VCC 2.5 3.5 Supply Voltage (V) 4.5 5.5 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 D019 Figure 10. ZE Version |BRP| vs VCC 9 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 8 Detailed Description 8.1 Overview The DRV5032 device is a magnetic sensor with a digital output that indicates when the magnetic flux density threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a lowfrequency oscillator that enables ultra-low average power consumption. By operating from a 1.65-V to 5.5-V supply, the device periodically measures magnetic flux density, updates the output, and enters a low-power sleep state. 8.2 Functional Block Diagram 0.1 F (min) VCC (1) VCC Ultra-low-power Oscillator Voltage Regulator OUT / OUT1 Output Control REF Element Bias Offset Cancellation (1) VCC Amp OUT2 Temperature Compensation (1) Output type depe nds on de vice ve rsi on GND Copyright © 201 7, Texas Instrumen ts Incorpor ate d 8.3 Feature Description 8.3.1 Magnetic Flux Direction The DRV5032 device is sensitive to the magnetic field component that is perpendicular to the top of the package (as shown in Figure 11). B B SOT-23 X2SON PCB Figure 11. Direction of Sensitivity 10 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 Feature Description (continued) Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the top to the bottom of the package results in negative millitesla values. positive B negative B N S S N PCB PCB Figure 12. Flux Direction Polarity 8.3.2 Device Version Comparison The following table lists the available device versions. VERSION MAXIMUM THRESHOLD DRV5032DU 3.9 mT MAGNETIC RESPONSE OUTPUT TYPE SAMPLING RATE PACKAGES AVAILABLE Unipolar Push-pull 20 Hz SOT-23, X2SON DRV5032FA Omnipolar Push-pull 20 Hz SOT-23, X2SON DRV5032FB Omnipolar Push-pull 5 Hz SOT-23 Omnipolar Open-drain 20 Hz SOT-23 DRV5032FC 4.8 mT DRV5032FD Unipolar Push-pull 20 Hz X2SON DRV5032AJ 9.5 mT Omnipolar Open-drain 20 Hz SOT-23, X2SON DRV5032ZE 63 mT Omnipolar Open-drain 20 Hz SOT-23 8.3.2.1 Magnetic Threshold Devices that have a lower magnetic threshold detect magnets at a farther distance. Higher thresholds generally require a closer distance or larger magnet. 8.3.2.2 Magnetic Response The FA, FB, FC, AJ, and ZE device versions have omnipolar functionality, and respond the same to north and south poles as shown in Figure 13. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 11 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com OUT BHYS BHYS VCC 0V BOP BRP north B BRP BOP 0 mT south Figure 13. Omnipolar Functionality The DU and FD device versions have unipolar functionality. Pin OUT1 only responds to flux in the top-down direction (north), and pin OUT2 only responds to flux in the bottom-up direction (south). OUT1 OUT2 BHYS BHYS VCC VCC 0V north BOP BRP 0V B 0 mT south north B 0 mT BRP BOP south Figure 14. Unipolar Functionality 8.3.2.3 Output Type The DU, FA, FB, and FD device versions have push-pull CMOS outputs that can drive a VCC or ground level. The FC, AJ, and ZE device versions have open-drain outputs that can become high impedance or drive ground, and an external pullup resistor must be used. VCC Output Control Output Output Control Figure 15. Push-Pull Output (Simplified) 12 Output Figure 16. Open-Drain Output (Simplified) Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 8.3.2.4 Sampling Rate When the DRV5032 device powers up, it measures the first magnetic sample and sets the output within the tON time. The output is latched, and the device enters an ultra-low-power sleep state. After each tS time has passed, the device measures a new sample and updates the output if necessary. If the magnetic field does not change between periods, the output also does not change. VCC 1.65 V tON time tS ICC tS tACTIVE ICC(PK) time Output VCC Invalid 1st sample 2nd sample 3rd sample GND time Figure 17. Timing Diagram Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 13 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 8.3.3 Hall Element Location The sensing element inside the device is in the center of both packages when viewed from the top. Figure 18 shows the tolerances and side-view dimensions. SOT-23 Top View SOT-23 Side View centered 650 µm ±70 µm ±80 µm X2SON Top View X2SON Side View centered 250 µm ±60 µm ±50 µm Figure 18. Hall Element Location 8.4 Device Functional Modes The DRV5032 device has one mode of operation that applies when the Recommended Operating Conditions are met. 14 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The DRV5032 device is typically used to detect the proximity of a magnet. The magnet is often attached to a movable component in the system. 9.1.1 Output Type Tradeoffs The push-pull output allows for the lowest system power consumption, since there is no current leakage path when the output drives high or low. The open-drain output involves a leakage path when the output drives low, through the external pullup resistor. The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of sensors. 9.2 Typical Applications 9.2.1 General-Purpose Magnet Sensing distance VCC DRV5032 VCC OUT N S Controller GPIO GND Copyright © 201 7, Texas Instrumen ts Incorpor ate d Figure 19. Typical Application Diagram 9.2.1.1 Design Requirements For this design example, use the parameters listed in Table 1. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE VCC 3.3 V Magnet 1-cm Cube NdFeB Closest magnet distance 2.5 cm Magnetic flux density at closest distance 7.8 mT Magnetic flux density when magnet moves away Close to 0 mT Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 15 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 9.2.1.2 Detailed Design Procedure When designing a digital-switch magnetic sensing system, three variables should always be considered: the magnet, sensing distance, and threshold of the sensor. The DRV5032 device has a detection threshold specified by parameter BOP. To reliably activate the sensor, the magnet must apply greater than the max specified BOP. In such a system, the sensor typically detects the magnet before it has moved to the closest position. When the magnet moves away from the sensor, it must apply less than the minimum specified BRP to reliably release the sensor. Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature, absolute max temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given distance centered with the magnet. Thickness Thickness Width Distance Length S S B N Distance N Diameter B Figure 20. Rectangular Block and Cylinder Magnets Use Equation 1 for the rectangular block shown in Figure 20: B= Br Œ ( ( WL arctan 2 2 2D 4D + W + L 2 ) ± arctan Use Equation 2 for the cylinder shown in Figure 20: Br D+T D ± B= 2 2 2 (0.5C) + (D + T) (0.5C)2 + D2 ( ( WL 2(D + T) 4(D + T)2 + W2 + L2 )) (1) ) where • • • • • W is width. L is length. T is thickness (the direction of magnetization). D is distance. C is diameter. (2) An online tool that uses these formulas is located at http://www.ti.com/product/drv5033. All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to account for this, as well as for mechanical tolerances. 16 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 9.2.1.3 Application Curve 60 Magnetic Flux Density (mT) 55 50 45 40 35 30 25 20 15 10 5 0 1 1.5 2 2.5 3 3.5 Distance (cm) 4 4.5 5 D017 Figure 21. Magnetic Profile of a 1-cm Cube NdFeB Magnet 9.2.2 Three-Position Switch This application uses the DRV5032FD for a three-position switch. 1 2 3 PCB Figure 22. Three-Position Slider Switch with Embedded Magnet 9.2.2.1 Design Requirements For this design example, use the parameters listed in Table 2. Table 2. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Hall effect device DRV5032FD VCC 5V Switch travel distance 5 mm in each direction Magnet 10 mm cylinder Mechanical tolerance per position ±0.5 mm 9.2.2.2 Detailed Design Procedure A standard 2-pole magnet produces strong perpendicular flux components near the outer edges of the poles, and no perpendicular flux near the center at the north-south pole boundary. When the DRV5032FD is below the center of the magnet, it receives close to 0 mT, and both outputs drive high. If the switch with the embedded magnet moves left or right, the sensor receives a north or south field, and OUT1 or OUT2 drive low. This provides 3 digital states of detection. The length of the magnet should ideally be two times the distance of travel toward each side. Then, when the switch is pushed to either side, the outer edge of the magnet is positioned directly above the sensor where it applies the strongest perpendicular flux component. To determine the magnitude of magnetic flux density for a given magnet and distance, TI recommends using simulation software, testing with a linear Hall effect sensor, or testing with a gaussmeter. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 17 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 9.2.2.3 Application Curve Figure 23 shows the typical magnetic flux lines around a 2-pole magnet. Figure 23. Typical Magnetic Flux Lines 18 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 9.3 Do's and Don'ts Because the Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, a correct magnet approach must be used for the sensor to detect the field. Figure 24 shows correct and incorrect approaches. CORRECT S S N N N S INCORRECT N S Figure 24. Correct and Incorrect Magnet Approaches Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 19 DRV5032 SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 www.ti.com 10 Power Supply Recommendations The DRV5032 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor with a value of at least 0.1 µF. 11 Layout 11.1 Layout Guidelines Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice. Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the opposite side possible. 11.2 Layout Examples VCC VCC SEL Thermal Pad GND GND OUT OUT Figure 25. Layout Examples 20 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 DRV5032 www.ti.com SLVSDC7D – APRIL 2017 – REVISED NOVEMBER 2017 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: • Texas Instruments, DRV5032-SOLAR-EVM user's guide • Texas Instruments, Power Gating Systems with Magnetic Sensors TI TechNote • Texas Instruments, Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life • Texas Instruments, Magnetic Tamper Detection Using Low-Power Hall Effect Sensors • Texas Instruments, Fault Monitoring for Overhead Fault Indicators Using Ultra-Low-Power 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DRV5032 21 PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DRV5032AJDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2AJ DRV5032AJDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2AJ DRV5032AJDMRR ACTIVE X2SON DMR 4 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2AJ DRV5032AJDMRT ACTIVE X2SON DMR 4 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2AJ DRV5032DUDBZR PREVIEW SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2DU DRV5032DUDBZT PREVIEW SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2DU DRV5032DUDMRR ACTIVE X2SON DMR 4 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2DU DRV5032DUDMRT ACTIVE X2SON DMR 4 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2DU DRV5032FADBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FA DRV5032FADBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FA DRV5032FADMRR ACTIVE X2SON DMR 4 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FA DRV5032FADMRT ACTIVE X2SON DMR 4 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FA DRV5032FBDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FB DRV5032FBDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FB DRV5032FCDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FC DRV5032FCDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FC DRV5032FDDMRR ACTIVE X2SON DMR 4 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FD Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Nov-2017 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DRV5032FDDMRT ACTIVE X2SON DMR 4 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2FD DRV5032ZEDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2ZE DRV5032ZEDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 2ZE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2017 Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV5032AJDMRR Package Package Pins Type Drawing X2SON DMR 4 DRV5032AJDMRT X2SON DMR DRV5032FADBZR SOT-23 DBZ DRV5032FADBZT SOT-23 DRV5032FADMRR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 0.5 4.0 8.0 Q1 3000 179.0 8.4 1.27 1.57 4 250 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3 X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1 DRV5032FDDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1 DRV5032FDDMRT X2SON DMR 4 250 180.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV5032AJDMRR X2SON DMR 4 3000 203.0 203.0 35.0 DRV5032AJDMRT X2SON DMR 4 250 203.0 203.0 35.0 DRV5032FADBZR SOT-23 DBZ 3 3000 183.0 183.0 20.0 DRV5032FADBZT SOT-23 DBZ 3 250 183.0 183.0 20.0 DRV5032FADMRR X2SON DMR 4 3000 203.0 203.0 35.0 DRV5032FDDMRR X2SON DMR 4 3000 203.0 203.0 35.0 DRV5032FDDMRT X2SON DMR 4 250 203.0 203.0 35.0 Pack Materials-Page 2 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DMR0004A X2SON - 0.4 mm max height SCALE 9.000 PLASTIC SMALL OUTLINE - NO LEAD 1.15 1.05 B A PIN 1 INDEX AREA 1.45 1.35 C 0.4 MAX SEATING PLANE 0.05 0.00 0.08 C 2X 0.5 SYMM 2 3 EXPOSED THERMAL PAD 5 0.6±0.05 SYMM 4X PIN 1 ID (OPTIONAL) 0.25 0.15 4 1 4X 0.8±0.05 0.27 0.17 0.1 0.05 C B C A 4222825/A 03/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT DMR0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 2X (0.5) 4X (0.22) (R0.05) TYP 4 1 4X (0.4) 5 SYMM (0.6) (1.4) ( 0.2) VIA 2 SYMM 3 (0.8) LAND PATTERN EXAMPLE SCALE:35X 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND METAL SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK SOLDER MASK DEFINED SOLDER MASK DETAILS 4222825/A 03/2016 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DMR0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 2X (0.5) 4X (0.22) (R0.05) TYP 4 1 4X (0.4) 5 SYMM (0.57) (1.4) METAL TYP 2 SYMM 3 (0.76) SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD 5: 90% PRINTED SOLDER COVERAGE BY AREA SCALE:50X 4222825/A 03/2016 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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