ABA-32563 2.5 GHz Broadband Silicon RFIC Amplifier Data Sheet Description Features Avago’s ABA-32563 is an economical, easy-to-use, internally 50Ω matched, silicon monolithic broadband amplifier that offers excellent gain and broadband response from DC to 2.5 GHz. Packaged in an ultraminiature SOT-363 package, it requires half the board spaceof a SOT-143 package. • Operating Frequency DC ~ 2.5 GHz At 2 GHz, the ABA-32563 offers a small-signal gain of 19 dB, output P1dB of 8.4 dBm and 19.5 dBm output third order intercept point. It is suitable for use as wideband applications. They are designed for low cost gain blocks in cellular applications, DBS tuners, LNB and other wireless communication systems. • 3.5 dB Noise Figure ABA-32563 is fabricated using Avago’s HP25 silicon bipolar process, which employs a double-diffused single polysilicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high fT and high NPN breakdown (25 GHz fT at 6V BVCEO). The process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. Applications • 19 dB Gain • VSWR < 2.0 throughout operating frequency • 8.4 dBm Output P1dB • 19.5 dBm Output IP3 • Unconditionally Stable • Single 3V Supply (Id = 37 mA) • Lead-free • Amplifier for Cellular, Cordless, Special Mobile Radio, PCS, ISM, Wireless LAN, DBS, TVRO, and TV Tuner Applications Surface Mount Package: SOT-363/SC70 Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1B) Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control. Pin Connections and Package Marking GND 2 Input 2Kx GND 1 Output & Vcc Simplified Schematic Vcc RF Output & Vcc GND 3 Vcc Note: Top View. Package marking provides orientation and identification. “x” is the date code. RF Input Ground 1 Ground 3 Ground 2 ABA-32563 Absolute Maximum Ratings [1] Symbol Parameter Units Absolute Max. Vcc Pin Pdiss Tj TSTG Device Voltage, RF output to ground (T = 25°C) CW RF Input Power (Vcc = 3V) Total Power Dissipation [3] Junction Temperature Storage Temperature V dBm W °C °C 6 15 0.6 150 -65 to 150 Thermal Resistance[2] (Vcc = 3V) θj-c = 124.3°C/W Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Thermal resistance measured using 150°C Liquid Crystal Measurement Technique. 3. Board (package belly) temperature, Tc, is 25°C. Derate 8.1 mW/°C for Tc > 120.8°C. Electrical Specifications Tc = +25°C, Zo = 50 Ω, Pin = -30 dBm, Vcc = 3V, Freq = 2 GHz, unless stated otherwise. Symbol Parameter and Test Condition Units Min. Typ. Max. Std Dev. Gp[1] Power Gain (|S21|2 ) dB 17.5 19.0 ∆Gp Power Gain Flatness, f = 0.1 ~ 1.5 GHz dB 1.0 f = 0.1 ~ 2.5 GHz 3.0 NF[1] Noise Figure dB 3.5 4.4 [1] P1dB Output Power at 1dB Gain Compression dBm 8.4 [1] OIP3 Output Third Order Intercept Point dBm 19.5 [1] VSWRin Input VSWR <1.5 VSWRout[1] Output VSWR <1.5 Icc[1] Device Current mA 37 42.5 [1] Td Group Delay ps 140 Notes: 1. Measurements taken on 50Ω test board shown on Figure 1. Excess circuit losses had been de-embedded from actual measurements. Standard deviation and typical data based on at least 500 parts sample size from 2 wafer lots. Future wafers allocated to this product may have nominal values anywhere within the upper and lower spec limits. Cblock 1 nF RF Output 2Kx RFC 33 nH RF Input Vcc Cblock 1 nF Cbypass 100 pF Figure 1. ABA-32563 Production Test Circuit. 2 Cbypass 1000 pF ABA-32563 Typical Performance Tc = +25°C, Zo = 50Ω, Vcc = 3V unless stated otherwise. 22 22 20 20 5 3.5V 3V 2.7V 4.5 16 12 0 0.5 1 +85C +25C -40C 14 1.5 2 2.5 3.5 3 12 4 0 0.5 1 FREQUENCY (GHz) P1dB (dBm) NF (dB) 4 3.5 +85C +25C -40C 2.5 1.5 2 2.5 3 3.5 2 4 0 0.5 1 3 3.5 4 11 9 7 3.5V 3V 2.7V FREQUENCY (GHz) 0 0.5 1 2 2.5 2.5 3 3.5 4 9 7 +85C +25C -40C 5 1.5 2 Figure 4. Noise Figure vs. Frequency and Voltage. 11 3 1.5 FREQUENCY (GHz) 13 5 Figure 5. Noise Figure vs. Frequency and Temperature. 3 2.5 13 3 1 2 P1dB (dBm) 4.5 0.5 1.5 Figure 3. Gain vs. Frequency and Temperature. 5 0 2.5 FREQUENCY (GHz) Figure 2. Gain vs. Frequency and Voltage. 2 3.5 16 3 3.5V 3V 2.7V 14 18 NF (dB) GAIN (dB) GAIN (dB) 4 18 3 3.5 4 FREQUENCY (GHz) Figure 6. Output Power for 1 dB Gain Compression vs. Frequency and Voltage. 3 0 0.5 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz) Figure 7. Output Power for 1 dB Gain Compression vs. Frequency and Temperature. ABA-32563 Typical Performance, continued Tc = +25°C, Zo = 50Ω, Vcc = 3V unless stated otherwise. 32 32 3.5V 3V 2.7V 24 20 16 12 +85C +25C -40C 28 OIP3 (dBm) OIP3 (dBm) 28 24 20 16 0 0.5 1 1.5 2 2.5 3 3.5 12 4 0 0.5 FREQUENCY (GHz) 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz) Figure 8. Output IP3 vs. Frequency and Voltage. Figure 9. Output IP3 vs. Frequency and Temperature. 120 1.8 VSWR IN VWSR OUT +85C +25C -40C 100 1.6 Icc (mA) VSWR 80 1.4 60 40 1.2 20 1.0 0 0.5 1 1.5 2 2.5 3 3.5 4 FREQUENCY (GHz) Figure 10. Input and Output VSWR vs. Frequency. 4 0 0 1 2 3 4 5 6 VOLTAGE (V) Figure 11. Supply Current vs. Voltage and Temperature. 7 ABA-32563 Typical Scattering Parameters TC = +25°C, ZO = 50Ω, VCC = 3V, unless stated otherwise Freq S11 S11 S21 S21 (GHz) Mag. Ang. dB Mag. S21 Ang. S12 Mag. S12 Ang. S22 Mag. S22 Ang. K Factor 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 1.20 1.30 1.40 1.50 1.60 1.70 1.80 1.90 2.00 2.20 2.40 2.60 2.80 3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40 4.60 4.80 5.00 5.20 5.40 5.60 5.80 6.00 -5.6 -11.0 -16.7 -22.5 -28.8 -34.7 -40.6 -46.4 -52.2 -58.1 -63.7 -69.5 -75.2 -80.8 -86.5 -92.3 -98.1 -103.6 -109.3 -115.0 -126.4 -137.5 -148.8 -159.3 -169.6 -179.7 170.6 161.4 152.1 142.9 134.4 126.2 117.3 108.7 101.3 94.2 87.6 81.0 74.3 67.7 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.04 0.04 0.04 0.04 0.04 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.07 0.07 0.08 0.08 0.09 0.09 0.09 2.6 6.0 9.5 12.8 15.7 18.6 21.2 23.5 25.5 26.9 28.6 29.6 30.2 30.9 31.4 31.8 31.9 31.7 31.9 31.9 31.8 31.9 32.3 32.4 32.4 32.1 32.2 31.5 31.0 30.5 30.0 28.2 26.7 25.2 23.2 20.8 18.4 15.6 12.7 9.6 0.28 0.27 0.27 0.27 0.26 0.26 0.25 0.25 0.25 0.24 0.24 0.23 0.22 0.22 0.21 0.20 0.18 0.17 0.16 0.15 0.12 0.10 0.08 0.07 0.07 0.08 0.09 0.10 0.12 0.13 0.14 0.15 0.15 0.16 0.16 0.16 0.16 0.16 0.16 0.15 -6.5 -12.9 -18.8 -24.8 -27.6 -31.7 -35.9 -40.4 -45.0 -49.8 -54.5 -59.4 -64.5 -69.8 -75.2 -80.7 -86.4 -92.0 -98.5 -105.6 -120.6 -139.2 -163.9 167.4 137.7 115.7 98.7 86.3 78.9 71.9 65.2 59.1 55.0 50.2 45.0 40.1 35.1 30.3 25.3 23.8 2.70 2.70 2.70 2.70 2.60 2.60 2.50 2.40 2.40 2.30 2.30 2.20 2.10 2.10 2.10 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.10 2.10 2.10 2.10 2.10 2.10 2.10 2.10 2.10 2.10 2.10 2.20 2.20 2.20 2.20 2.20 2.20 5 0.12 0.11 0.11 0.10 0.10 0.10 0.10 0.09 0.09 0.09 0.08 0.08 0.08 0.08 0.08 0.07 0.08 0.08 0.08 0.08 0.08 0.09 0.10 0.12 0.13 0.15 0.16 0.19 0.20 0.22 0.23 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.34 0.35 171.5 167.2 162.7 158.0 139.9 129.4 121.2 111.6 102.0 93.3 84.1 75.4 66.5 55.2 45.2 34.1 24.4 10.6 -2.2 -12.5 -34.6 -57.6 -77.3 -93.3 -108.3 -124.9 -137.7 -150.1 -162.9 -175.0 175.0 166.1 155.3 145.8 138.3 131.7 126.2 120.9 115.6 110.4 20.0 20.0 20.1 20.1 20.0 20.0 19.9 19.8 19.7 19.6 19.5 19.4 19.3 19.2 19.1 19.0 18.8 18.6 18.5 18.4 17.9 17.5 17.0 16.4 15.9 15.3 14.6 14.0 13.5 12.8 12.1 11.6 11.0 10.2 9.5 8.8 8.2 7.7 7.2 6.6 10.00 10.04 10.07 10.09 10.02 9.95 9.88 9.79 9.69 9.58 9.48 9.35 9.24 9.12 8.99 8.86 8.71 8.54 8.41 8.27 7.87 7.51 7.08 6.64 6.21 5.81 5.39 5.04 4.71 4.38 4.04 3.79 3.54 3.25 2.99 2.77 2.57 2.42 2.28 2.14 Device Models Refer to Avago’s web site www.avagotech.com/view/rf Ordering Information Part Number Devices per Container Container ABA-32563-TR1G ABA-32563-TR2G ABA-32563-BLKG 3000 10000 100 7" reel 13" reel antistatic bag Note: Only lead-free option available. Package Dimensions Outline 63 (SOT-363/SC-70) Recommended PCB Pad Layout for Avago's SC70 6L/SOT-363 Products 0.026 HE E 0.079 e 0.039 D 0.018 Q1 A2 Dimensions in inches. A c A1 L b DIMENSIONS (mm) SYMBOL E D HE A A2 A1 Q1 e b c L 6 MAX. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 MIN. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.650 BCS 0.15 0.10 0.10 0.30 0.20 0.30 NOTES: 1. All dimensions are in mm. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to EIAJ SC70. 5. Die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. Package surface to be mirror finish. Device Orientation REEL TOP VIEW END VIEW 4 mm 8 mm CARRIER TAPE USER FEED DIRECTION 2Kx 2Kx 2Kx 2Kx (Package marking example orientation shown.) COVER TAPE Tape Dimensions and Product Orientation for Outline 63 P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) K0 10° MAX. A0 DESCRIPTION Tt (COVER TAPE THICKNESS) 10° MAX. B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.50 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 0.061 + 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 + 0.30 - 0.10 0.254 ± 0.02 0.315 + 0.012 0.0100 ± 0.0008 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.40 ± 0.10 0.062 ± 0.001 0.205 + 0.004 0.0025 ± 0.0004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-1969EN AV02-1783EN - February 11, 2009