Central CMPP6028R Transistor Datasheet

CMPP6027R
CMPP6028R
w w w. c e n t r a l s e m i . c o m
SURFACE MOUNT SILICON
PROGRAMMABLE UNIJUNCTION
TRANSISTORS
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMPP6027R and
CMPP6028R are silicon programmable unijunction
transistors, manufactured in a surface mount SOT-23
package, designed for adjustable (programmable)
characteristics such as, valley current (IV), peak current
(IP), and intrinsic standoff ratio (η).
MARKING CODES: CMPP6027R: P27
CMPP6028R: P28
SOT-23 CASE
MAXIMUM RATINGS: (TA=25°C)
Gate-Cathode Forward Voltage
Gate-Cathode Reverse Voltage
Gate-Anode Reverse Voltage
Anode-Cathode Voltage
Peak Non-Repetitive Forward Current (t=10μs)
Peak Repetitive Forward Current (t=20μs, D.C.=1.0%)
Peak Repetitive Forward Current (t=100μs, D.C.=1.0%)
DC Forward Anode Current
DC Gate Current
Power Dissipation (Note 1)
Storage Temperature
Operating Junction Temperature
Thermal Resistance (Note 1)
SYMBOL
VGKF
VGKR
VGAR
VAK
ITSM
ITRM
ITRM
IT
IG
PD
Tstg
TJ
ΘJA
40
5.0
40
40
5.0
2.0
1.0
150
50
167
-55 to +150
-50 to +100
450
UNITS
V
V
V
V
A
A
A
mA
mA
mW
°C
°C
°C/W
Note 1: Mounted on 2 inch square FR-4 PCB with minimum copper pad area.
ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted)
CMPP6027R
SYMBOL
TEST CONDITIONS
MIN MAX
IGAO
VS=40V
10
IGKS
VS=40V
50
IP
VS=10V, RG=1.0M
2.0
IP
VS=10V, RG=10k
5.0
IV
VS=10V, RG=1.0M
50
IV
VS=10V, RG=10k
70
IV
VS=10V, RG=200
1.5
VT
VS=10V, RG=1.0M
0.2 1.6
VT
VS=10V, RG=10k
0.2 0.6
VF
IF=50mA
1.5
VO
VB=20V, CC=0.2μF
6.0
tr
VB=20V, CC=0.2μF
80
CMPP6028R
MIN MAX
10
50
0.15
1.0
25
25
1.0
0.2 0.6
0.2 0.6
1.5
6.0
80
UNITS
nA
nA
μA
μA
μA
μA
mA
V
V
V
V
ns
R0 (24-June 2015)
CMPP6027R
CMPP6028R
SURFACE MOUNT SILICON
PROGRAMMABLE UNIJUNCTION
TRANSISTORS
SOT-23 CASE - MECHANICAL OUTLINE
2
1
3
LEAD CODE:
1) Anode
2) Cathode
3) Gate
MARKING CODES:
CMPP6027R: P27
CMPP6028R: P28
R0 (24-June 2015)
w w w. c e n t r a l s e m i . c o m
CMPP6027R
CMPP6028R
SURFACE MOUNT SILICON
PROGRAMMABLE UNIJUNCTION
TRANSISTORS
SERVICES
• Bonded Inventory
• Custom Electrical Screening
• Custom Electrical Characteristic Curves
• SPICE Models
• Custom Packaging
• Package Base Options
• Custom Device Development / Multi Discrete Modules (MDM™)
• Bare Die Available for Hybrid Applications
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R0 (24-June 2015)
w w w. c e n t r a l s e m i . c o m
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