ASB AWG0117E 30 ~ 4000 mhz wide-band gain block amplifier mmic Datasheet

AWG0117E
AWG0117E Data Sheet
30 ~ 4000 MHz Wide-band Gain Block Amplifier MMIC
1. Product Overview
1.1
General Description
AWG0117E, a gain block amplifier MMIC, has high linearity, low noise and high efficiency over a wide
range of frequency from 30 MHz to 4000 MHz, being suitable for use in both receiver and transmitter of
telecommunication system up to 4 GHz. It has an active bias network for stable current over
temperature and process variation. The amplifier is available in an SOT363 package and passes
through the stringent DC, RF, and reliability tests.
Features
Gain & Return Loss vs. Frequency (with Bias Tees)
 16.2 dB gain at 2000 MHz
30
 16.0 dBm P1dB at 2000 MHz
20
 30.0 dBm OIP3 at 2000 MHz
 Gain flatness = 0.9 dB at 500 ~ 2500 MHz
 50  input & output matching
 MTTF > 100 Years
S-parameters (dB)
1.2
S21
10
0
-10
S11
-20
S22
-30
 Single supply: +3 V
-40
0
1.3
1000
2000
3000
Frequency (MHz)
4000
5000
Applications
 Wide-band application at 500 ~ 3000 MHz
 IF, CATV application at 30 ~ 1200 MHz
 SMATV, ONU application at 50 ~ 3000 MHz
1.4
Package Profile & RoHS Compliance
SOT363, 2.1x2.0 mm2, surface mount
1/13
ASB Inc.

[email protected]
RoHS-compliant
January 2017
AWG0117E
2. Summary on Product Performances
2.1
Typical Performance
Supply voltage = +3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
70
150
300
450
900
2000
2500
2700
MHz
Gain
17.4
17.3
17.2
17.1
16.9
16.2
16.1
16.1
dB
S11
-17.0
-18.0
-18.0
-18.0
-20.0
-18.0
-18.0
-18.0
dB
S22
-20.0
-20.0
-20.0
-20.0
-17.0
-17.0
-18.0
-20.0
dB
Noise Figure
2.0
2.0
2.0
2.0
2.0
2.5
3.0
3.4
dB
IP31)
29.0
30.0
30.0
31.0
31.0
30.0
25.0
22.0
dBm
Output P1dB
16.0
16.0
16.0
16.0
16.0
16.0
15.0
14.0
dBm
Current
50
Device Voltage
+3
Output
1) OIP3 is measured with two tones at an output power of +0 dBm/tone separated by 1MHz.
2.2
Product Specification
Supply voltage = +3 V, TA = +25 C, ZO = 50 
Parameter
Typ
Max
Unit
Frequency
2000
MHz
Gain
16.2
dB
S11
-18.0
dB
S22
-17.0
dB
Noise Figure
2.5
dB
OIP3
30.0
dBm
P1dB
16.0
dBm
Current
50
mA
Device Voltage
+3
V
2.3
2/13
Min
Pin Configuration
Pin
Description
1, 2, 4, 5
Ground
3
RF_INPUT
6
RF_OUT & Bias
ASB Inc.
Simplified Outline
1
2
3

[email protected]
6
5
4
January 2017
AWG0117E
2.4
Absolute Maximum Ratings
Parameters
Max. Ratings
Operation Case Temperature
-40 to 85 C
Storage Temperature
-40 to 150 C
Device Voltage
+4 V
Operation Junction Temperature
+150 C
Input RF Power (At 2000 MHz, CW, 50  matched)*
+ 27 dBm
*Please find the max. input power data from http://www.asb.co.kr/pdf/Maximum_Input_Power_Analysis.pdf
The max. input power, in principle, depends upon the application frequency and matching circuit.
2.5
Thermal Resistance
Symbol
Description
Typ
Unit
Rth
Thermal resistance from junction to lead
155
C/W
2.6
ESD Classification & Moisture Sensitivity Level
ESD Classification
HBM
Class 1B
Voltage Level: 750 V
MM
Class A
Voltage Level: 100 V
CAUTION: Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can
be damaged by static electricity. Proper ESD control techniques should be used when
handling these devices.
Moisture Sensitivity Level
MSL 3 at 260 C reflow
(Intentionally Blanked)
3/13
ASB Inc.

[email protected]
January 2017
AWG0117E
3. Application: 500 ~ 3000 MHz
3.1
Application Circuit & Evaluation Board
Vdevice = +3 V
C4
C3
L1
C2
RF OUT
C1
RF IN
AWG0117E
PCB Information
Material
FR4
Thickness (mm)
0.8
Size (mm)
40x40
EB No.
EB-363-A2
Bill of Material
4/13
Symbol
Value
Size
Description
Manufacturer
AWG0117E
-
-
MMIC Amplifier
ASB
C1, C2, C3
100 pF
0603
DC blocking capacitor
Murata
C4
1 F
0603
Decoupling capacitor
Murata
L1
39 nH
0603
RF choke inductor
Murata
ASB Inc.

[email protected]
January 2017
AWG0117E
3.2
Performance Table
Supply voltage = +3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
500
900
2000
2500
2700
3000
MHz
Gain
17.0
16.9
16.2
16.1
16.1
16.0
dB
S11
-16.0
-20.0
-18.0
-18.0
-18.0
-14.0
dB
S22
-14.0
-17.0
-17.0
-18.0
-20.0
-18.0
dB
Noise Figure
2.0
2.0
2.5
3.0
3.4
3.9
dB
IP31)
32.0
31.0
30.0
25.0
22.0
20.0
dBm
Output P1dB
16.0
16.0
16.0
15.0
14.0
12.0
dBm
Current
50
mA
Device Voltage
+3
V
Output
1) OIP3 is measured with two tones at an output power of +0 dBm/tone separated by 1MHz.
Plot of S-parameter & Stability Factor
30
7
S-parameter (dB)
20
6
S21
10
5
0
4
-10
S22
S11
-20
3
Stability Factor K
3.3
2
S12
-30
1
K
-40
0
5/13
1000
ASB Inc.

2000
Frequency (MHz)
[email protected]
3000
0
4000
January 2017
AWG0117E
3.4
Plots of Noise Figure and Performances with Temperature
25
0
-10
S11 (dB)
Gain (dB)
20
15
10
-40 °C
-40 °C
+25 °C
-30
+25 °C
5
-20
+85 °C
+85 °C
0
-40
0
500 1000 1500 2000 2500 3000 3500 4000
Frequency (MHz)
0
0
500 1000 1500 2000 2500 3000 3500 4000
Frequency (MHz)
70
65
60
Current (mA)
S22 (dB)
-10
-20
-40 °C
+25 °C
-30
55
50
45
40
+85 °C
35
-40
30
0
-60
500 1000 1500 2000 2500 3000 3500 4000
Frequency (MHz)
25
5
20
4
15
3
-40
-20
0
20
40
Temperature (°C)
60
80
100
NF (dB)
Gain (dB)
Frequency = 2000 MHz
10
5
2
1
Frequency = 2000 MHz
0
0
-60
6/13
-40
-20
0
20
40
Temperature (°C)
60
80
100
ASB Inc.

-60
[email protected]
-40
-20
0
20
40
Temperature (°C)
60
80
100
January 2017
AWG0117E
34
20
Frequency = 2000 MHz
Frequency = 2000 MHz
18
P1dB (dBm)
OIP3 (dBm)
32
30
28
16
14
26
12
-60
-40
-20
0
20
40
Temperature (°C)
60
80
100
-60
-40
-20
0
20
40
Temperature (°C)
60
80
100
(Intentionally Blanked)
7/13
ASB Inc.

[email protected]
January 2017
AWG0117E
4. Application: 30 ~ 1200 MHz (IF, CATV)
4.1
Application Circuit & Evaluation Board
Vdevice = +3 V
C4
C3
L1
C2
RF OUT
C1
RF IN
AWG0117E
PCB Information
Material
FR4
Thickness (mm)
0.8
Size (mm)
40x40
EB No.
EB-363-A2
Bill of Material
8/13
Symbol
Value
Size
Description
Manufacturer
AWG0117E
-
-
MMIC Amplifier
ASB
C1, C2
1 F
0603
DC blocking capacitor
Murata
C3
-
-
Not used
C4
10 F
0805
Decoupling capacitor
Murata
L1
3.3 H
0603
RF choke inductor
Samsung
ASB Inc.

[email protected]
January 2017
AWG0117E
4.2
Performance Table
Supply voltage = +3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
30
70
150
300
450
860
1000
1200
MHz
Gain
18.0
17.4
17.3
17.2
17.1
16.8
16.7
16.6
dB
S11
-11.0
-17.0
-18.0
-18.0
-18.0
-17.0
-17.0
-16.0
dB
S22
-20.0
-20.0
-20.0
-20.0
-20.0
-20.0
-20.0
-20.0
dB
Noise Figure
2.4
2.0
2.0
2.0
2.0
2.0
2.0
2.1
dB
Output IP31)
29.0
29.0
30.0
30.0
31.0
30.0
29.5
28.5
dBm
Output P1dB
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
dBm
Current
50
mA
Device Voltage
+3
V
1) OIP3 is measured with two tones at an output power of +0 dBm/tone separated by 1MHz.
Plot of S-parameter & Stability Factor
30
7
S21
S-parameter (dB)
20
6
10
5
0
4
-10
3
S11
-20
2
S12
S22
-30
1
K
-40
0
9/13
Stability Factor K
4.3
300
ASB Inc.

600
Frequency (MHz)
[email protected]
900
0
1200
January 2017
AWG0117E
5. Application: 50 ~ 3000 MHz (SMATV, ONU)
5.1
Application Circuit & Evaluation Board
Vdevice = +3 V
C4
C3
L1
C2
RF OUT
C1
RF IN
AWG0117E
PCB Information
Material
FR4
Thickness (mm)
0.8
Size (mm)
40x40
EB No.
EB-363-A2
Bill of Material
10/13
Symbol
Value
Size
Description
Manufacturer
AWG0117E
-
-
MMIC Amplifier
ASB
C1, C2
1 F
0603
DC blocking capacitor
Murata
C3
-
-
Not used
C4
10 F
0805
Decoupling capacitor
Murata
L1
1 H
0603
RF choke inductor
Samsung
ASB Inc.

[email protected]
January 2017
AWG0117E
5.2
Performance Table
Supply voltage = +3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
50
500
1000
2000
2500
3000
MHz
Gain
17.4
16.9
16.5
15.2
14.7
13.9
dB
S11
-13.0
-18.0
-16.0
-18.0
-17.0
-13.0
dB
S22
-20.0
-20.0
-20.0
-17.0
-14.0
-9.0
dB
Noise Figure
2.2
2.2
2.1
2.5
3.0
3.6
dB
Output IP31)
29.0
30.0
30.0
29.0
25.0
20.0
dBm
Output P1dB
16.0
16.0
16.0
15.5
14.5
12.0
dBm
Current
50
mA
Device Voltage
+3
V
1) OIP3 is measured with two tones at an output power of +0 dBm/tone separated by 1MHz.
Plot of S-parameter & Stability Factor
30
7
S21
S-parameter (dB)
20
6
10
5
0
4
S22
-10
3
S11
-20
2
-30
S12
K
-40
0
11/13
Stability Factor K
5.3
500
ASB Inc.
1000

1500
2000
Frequency (MHz)
[email protected]
2500
3000
1
0
3500
January 2017
AWG0117E
6. Package Outline (SOT363, 2.1x2.0x1.0 mm)
Symbols
W17
A
A1
A2
b
C
D
F
E1
e
e1
L
Dimensions (In mm)
MIN
NOM
0.900
1.000
0.025
0.062
0.875
0.937
0.200
0.300
0.100
0.125
1.900
2.000
1.150
1.250
2.000
2.100
0.65BSC
1.30BSC
0.425REF
MAX
1.10
0.10
1.00
0.40
0.15
2.10
1.35
2.20
7. Surface Mount Recommendation (In mm)
1.48
NOTE
0.30
1. The number and size of ground via holes in a
circuit board are critical for thermal and RF
grounding considerations.
0.25
0.30
1.23
12/13
0.50
2. Recommend is that the ground via holes be
placed on the bottom of the ground leads of the
device for better RF and thermal performance, as
shown in the drawing at the left side.
1.75
0.40
1.33
0.42
ASB Inc.

[email protected]
January 2017
AWG0117E
8. Recommended Soldering Reflow Profile
260 C
20~40 sec
Ramp-up
(3 C/sec)
Ramp-down
(6 C/sec)
200 C
150 C
60~180 sec
(End of Datasheet)
Copyright 2014-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB
assumes no responsibility for any errors which may appear in this datasheet. No part of the datasheet
may be copied or reproduced in any form or by any means without the prior written consent of ASB.
13/13
ASB Inc.

[email protected]
January 2017
Similar pages