Datasheet DC Brushless Fan Motor Driver Standard Single-phase Full wave Fan motor driver BD6962FVM Description This is the summary of application for BD6962FVM. BD6962FVM can drive FAN motor silently by BTL soft switching, and it can control rotational speed by PWM signal. Features ■ Compact package (MSOP8) ■ BTL soft switching drive ■ PWM speed control ■ Quick start function ■ Lock protection and auto restart (without external capacitor) ■ Rotating speed pulse signal (FG) output Package MSOP8 W(Typ) x D(Typ) x H(Max) 2.90mm x 4.00mm x 0.90mm Application PC, PC peripheral component (Power supply, VGA card, case FAN etc.) BD player, Projector etc. MSOP8 Absolute Maximum Ratings Symbol Limit Unit Supply Voltage VCC 15 V Power Dissipation Pd 0.58(Note 1) W Operating Temperature Topr -40 to +105 °C Storage Temperature Tstg -55 to +150 °C Output Voltage VOMAX 15 V Output Current IOMAX 800(Note 2) mA FG Signal Output Voltage VFG 15 V FG Signal Output Current IFG 10 mA Tjmax 150 °C Parameter Junction Temperature (Note 1) Reduce by 4.68mW/°C over 25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board) (Note 2) This value is not to exceed Pd. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.com TSZ02201-0H1H0B100250-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/13 TSZ22111・14・001 19.May.2014 Rev.002 Datasheet BD6962FVM Recommended Operating Conditions Parameter Symbol Limit Unit Operating Supply Voltage Range VCC 3.3 to 14 V Hall Input Voltage Range VH 0 to VCC/3 V Electrical characteristics (Unless otherwise specified Ta=25°C, VCC=12V) Parameter Limits Symbol Min Typ Max Unit Conditions Characteristics Circuit Current 1 Icc1 1 3 5 mA PWM=GND Figure 1 Circuit Current 2 Icc2 2 5 8 mA PWM=OPEN Figure 2 Input Offset Voltage VHOFS - - ±6 mV - FG Hysteresis Voltage VHYS ±5 ±10 ±15 mV Figure 3 PWM Input H Level VPWMH 2.0 - Vcc+0.3 V - PWM Input L Level VPWML -0.3 - 0.8 V - IPWMH 11 22 33 µA PWM=5V Figure 4 IPWML -42 -28 -14 µA PWM=GND Figure 4 FPWM 0.02 - 50 kHz Output Voltage VO - 0.4 0.6 V Input-output Gain GIO 45 48 51 dB FG Low Voltage VFGL - - 0.4 V IFG=5mA Figure 9 FG Leak Current IFGL - - 20 µA VFG=15V Figure 10 Lock Detection ON Time tON 0.35 0.50 0.65 s Figure 11 Lock Detection OFF Time tOFF 3.5 5.0 6.5 s Figure 12 PWM Input Current Input Frequency IO=300mA Upper and Lower total Figure 5 to 8 - Truth table H+ H- PWM OUT1 OUT2 FG H L H(OPEN) H L L(Output Tr：ON) L H H(OPEN) L H H(Output Tr：OFF) H L L L L L(Output Tr：ON) L H L L L H(Output Tr：OFF) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Reference Data 4.0 105°C 25°C -40°C 2.0 FG hysteresis hysteresis voltage, voltage,Vhys V HYS[mV] [mV] 6.0 Circuit current, I CC [mA] Circuit current, I CC [mA] 15 8.0 8.0 6.0 4.0 105°C 25°C 2.0 -40°C Operating Voltage Range Operating Voltage Range 105°C 10 25°C -40°C 5 Operating Voltage Range 0 -5 -40°C 25°C -10 105°C 0.0 -15 0.0 3 6 9 12 15 0 3 Supply voltage, VCC [V] 60 30 0 3.3V 6 1.0 1.0 0.8 0.8 3.3V 0.6 0.4 12V 14V 9 12 15 9 12 105°C 0.4 25°C -40°C 0.0 0 15 0.6 0.2 0.2 0.4 0.6 0.8 1 0 0.2 0.4 Output current, IO [A] PWM voltage, VPWM [V] 0.8 1 Figure 6. Output L Voltage (Temperature Characteristics) 1.5 1.0 1.0 0.6 Output current, IO [A] Figure 5. Output L Voltage (Voltage Characteristics) Figure 4. PWM Input Current 105°C 3.3V 1.2 0.8 Output H voltage [V] 12V 14V 0.6 0.4 25°C 0.6 -40°C 0.4 FG low voltage, VFGL [V] 0.8 6 Figure 3. FG Hysteresis Voltage 0.0 -60 3 3 Supply voltage, VCC [V] 0.2 -30 0 0 15 14V 12V Output L voltage [V] PWM input current, IPWM [µA] 12 Figure 2. Circuit Current 2 120 Output H voltage [V] 9 Supply voltage, VCC [V] Figure 1. Circuit Current 1 90 6 Output L voltage [V] 0 0.9 0.6 105°C 25°C 0.2 0.2 0.3 0.0 0.0 0.0 -40°C 0 0.2 0.4 0.6 0.8 0 1 0.2 Figure 7. Output H Voltage (Voltage Characteristics) 0.6 0.8 1 0 0.6 0.4 0.2 Operating Voltage Range 0 3 6 9 12 15 Supply voltage, VCC [V] Figure 10. FG Leak Current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8 10 7.0 600 500 25°C -40°C 105°C 400 Operating Voltage Range 300 0.0 6 Figure 9. FG L Voltage Lock detection OFF time.tOFF [s] Lock detection ON time, tON [ms] 0.8 4 (Temperature Characteristics) 700 25℃ -40℃ 105℃ 2 FG current, IFG [mA] Figure 8. Output H Voltage 1.0 FG leak current, IFGL [µA] 0.4 Output current, IO [A] Output current, IO [A] 6.0 5.0 25°C -40°C 105°C 4.0 Operating Voltage Range 3.0 0 3 6 9 12 15 0 3 6 9 12 15 Supply voltage, VCC [V] Supply voltage, VCC [V] Figure 11. Lock Detection ON Time Figure 12. Lock detection OFF time 3/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Block Diagram, Application Circuit, and Pin Assignment M Take a measure against Vcc voltage rise due to reverse connection of power supply and back electromotive force. P.8 OUT2 GND 1 8 Speed control by PWM input is enabled. Input frequency must be 50kHz at the maximum. + Incorporates soft switching function. Adjust at an optimum value because gradient of switching of output waveform depends on hall element output. VCC 2 OUT1 OSC 1kΩ to 5kΩ P.5 2.8V Control 90KΩ H+ 3 TSD 10KΩ PWM 6 This is an open drain output. Connect a pull-up resistor. + - HALL P.9 H- OSC : Internal reference oscillation circuit P.6 7 Lock Protection FG 4 + - 5 TSD : Thermal shutdown(head rejection circuit) Lock Protection : Lock protection circuit Pin No. Pin Name 1 OUT2 Motor output 2 VCC Power supply 3 H+ Hall input l+ 4 H- Hall input - 5 FG Rotating speed pulse signal output 6 PWM PWM signal input 7 OUT1 Motor output 8 GND GND www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Function 4/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Description of Operations 1) Lock Protection and Automatic Restart Circuit Motor rotation is detected by hall signal, and lock detection ON time (tON) and lock detection OFF time (tOFF) are set by IC internal counter. External part (C or R) is not required. Timing chart is shown in Figure 13. Idling H+ OUT1 tOFF tON OUT2 Output Tr OFF FG Motor locking Lock detection ON Depends on hall signal. (H in this figure) Lock Recovers release normal operation Figure 13. Lock Protection Timing Chart 2) Soft Switching (silent drive setting) Input signal to hall amplifier is amplified to produce an output signal. When the hall element output signal is small, the gradient of switching of output waveform is gentle; When it is large, the gradient of switching of output waveform is steep. Enter an appropriate hall element output to IC where output waveform swings sufficiently. (H+)-(H-) OUT1 Figure 14. Relation between Hall Element Output Amplitude and Output Waveform 3) Hall Input Setting Hall input voltage range is shown in operating conditions. Hall Input Voltage Range VCC Hall input voltage range upper limit Hall input voltage range lower limit GND Figure 15. Hall Input Voltage Range Adjust the value of hall element bias resistor R1 in Figure 16 so that the input voltage of a hall amplifier is input in "Hall Input Voltage Range" including signal amplitude. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM ○Reducing the Noise of Hall Signal Hall element may be affected by Vcc noise depending on the wiring pattern of board. In this case, place a capacitor like C1 in Figure 16. In addition, when wiring from the hall element output to IC hall input is long, noise may be loaded on wiring. In this case, place a capacitor like C2 in Figure 16. H- H+ VCC C2 R1 C1 RH Bias Current = Vcc / (R1 + RH) Hall element Figure 16. Application near of Hall Signal 4) PWM Input Rotation speed of motor can be changed by controlling ON/OFF of the upper output depending on duty of the signal input to PWM pin. H+ PWM OUT1 OUT2 FG Figure 17. Timing Chart in PWM Control When the voltage input to PWM pin applies H logic : normal operation L logic : H side output is off When PWM pin is open, H logic is applied. PWM pin has hysteresis of 100mV (Typ). *If H logic is applied to PWM pin before VCC voltage is applied to IC, current flows to VCC pin through ESD protection diode inside PWM pin, resulting in malfunction may possibly occur. When VCC voltage is not apply to IC, do not apply voltage to PWM pin. 5) Quick Start, Stand-by Function The function can start motor at once regardless of the detection time of lock protection function when the PWM signal is input. Lock protection function is turned off when the time of PWM = L has elapsed more than 66.5ms in order to disable lock protection function when the motor is stopped by PWM signal. When H level duty of PWM input signal is close to 0%, lock protection function does not work at an input frequency slower than 15Hz, therefore enter a frequency faster than 20Hz. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Equivalent Circuit 1) Hall Input 2) Motor Output VCC OUT1 H+、H- OUT2 GND 3) PWM Signal Input 4) FG Output FG PWM www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Safety Measure 1) Reverse Connection Protection Diode Reverse connection of power results in IC destruction as shown in Figure 18. When reverse connection is possible, reverse connection destruction preventive diode must be added between power supply and VCC. In normal energization Reverse power connection Vcc After reverse connection destruction prevention Vcc Vcc Circuit block Each pin GND Internal circuit impedance high amperage small Circuit block Each pin GND Large current flows Thermal destruction Circuit block Each pin GND No destruction Figure 18. Flow of Current when Power is Connected Reversely 2) Measure against VCC voltage Rise by Back Electromotive Force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply. ON ON ON Phase switching ON Figure 19. VCC Voltage Rise by Back Electromotive Force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zener diode between Vcc and GND. If necessary, add both (C). (B) Zener diode (A) Capacitor ON ON ON ON (C) Capacitor and zener diode ON ON Figure 20. Measure against VCC voltage rise www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM 3) Problem of GND Line PWM Switching Do not perform PWM switching of GND line because the potential of GND terminal cannot be kept at the minimum. VCC M Motor Driver Controller GND PWM input Prohibited Figure 21. GND Line PWM Switching Prohibited 4) FG Output FG output is an open drain and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG output terminal is directly connected to power supply, could damage the IC. VCC Pull-up resistor FG Protection Resistor R1 Connector of board Figure 22. Protection of FG Pin Thermal Derating Curve Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Figure 23 shows a thermal derating curve. Pd(W) 0.7 0.6 0.58 0.5 0.4 0.3 0.2 0.1 0 25 50 75 100 105 125 150 Ta(°C) * Reduce by 4.68 mW/°C over 25°C. (70.0mm x 70.0mm x 1.6mm glass epoxy board) Figure 23. Thermal Derating Curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 24. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Ordering Information B D 6 9 6 2 Part Number F V M Package FVM: MSOP8 - TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram MSOP8 (TOP VIEW) Ｄ６９ ６ ２ Lot No. 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet BD6962FVM Physical Dimension, Tape and Reel Information Package Name MSOP8 <Tape and Reel information> Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 13/13 TSZ02201-0H1H0B100250-1-2 19.May.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD6962FVM - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD6962FVM MSOP8 3000 3000 Taping inquiry Yes