Anpec APA2308OITU Class ab stereo headphone driver Datasheet

APA2308
Class AB Stereo Headphone Driver
Features
Applications
•
•
Operating Voltage
Single Supply
3V to 6V
±1.5V to ± 3.0V
Dual Supply
•
•
•
•
•
•
•
•
•
Portable Digital Audio
High Signal-to-Noise Ratio
100dB
Low Distortion
-65dB
Gereral Description
The APA2308 is an integrated class AB stereo headphone driver contained in an SO-8, a DIP-8 or a
TSSOP-8 plastic package. The APA2308 is capable
of delivering 280mW of max. Output power to an 8Ω
load or 110mW to a 32Ω load with less than 10%
(THD+N) from a 5V power supply. The device is fabricated in a CMOS process and has been primarily
developed for portable digital audio applications .
Large Output Voltage Swing
Excellent Power Supply Ripple Rejection
Low Power Consumption
Short-circuit Elimination
Wide Temperature Range
No Switch ON/OFF Clicks
Available in 8 pin SOP ,DIP or TSSOP Package
Ordering and Marking Information
A PA 2308
P ackage C ode
J : P D IP - 8
O : TSSOP - 8
T em p. R ange
I : - 4 0 to 8 5 ° C
H a n d lin g C o d e
TU : Tube
H a nd lin g C o d e
T em p. R ange
P a ck a g e C o d e
APA2308 J :
APA2308
XXXXX
X X X X X - D a te C o d e
APA2308 K :
APA2308
XXXXX
X X X X X - D a te C o d e
APA2308 O :
APA2308
XXXXX
K : SOP - 8
TR : Tape & Reel
X X X X X - D a te C o d e
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
1
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APA2308
Block Diagram
Out A
1
Inverting Input A
2
VDD
7
Out B
6
Inverting Input B
5
Non-inverting Input B
-+ +-
Non-inverting Input A 3
VSS
8
4
APA2308
Absolute Maximum Ratings
Symbol
VDD
TSC(O)
TA
TJ
TSTG
TS
VESD
Parameter
Supply Voltage
Output Short-circuit Duration,at TA=25°C,PTOT=1W
Operating Ambient Temperature range
Maximum Junction Temperature
Storage Temperature Range
Soldering Temperature , 10 seconds
Electrostatic Discharge
Rating
7
20
-40 to 85
150
-65 to +150
260
-3000 to 3000*1
Unit
V
S
°C
°C
°C
°C
V
Note : *1. Human body model : C=100pF , R=1500Ω , 3 positive pulses plus 3 negative pulses
Thermal Characteristics
Symbol
Parameter
Value
Unit
RTHJA
Thermal Resistance from Junction to Ambient in Free Air
DIP-8
109
K/W
SO-8
210
K/W
Electrical Characteristics
VDD=5V , VSS=0V , TA=25°C , fi=1kHz , RL=32Ω ( unless otherwise noted)
Symbol
Parameter
Test Condition
Min.
APA2308
Typ. Max
Unit
Supply
VDD
Supply Voltage
Single
3.0
5.0
6.0
Dual
±1.5
±2.5
±3.0
-1.5
-2.5
-3.0
V
V
VSS
Negative Supply Voltage
IDD
Supply Current
No Load
2.5
5
MA
Total Power Dissipation
No Load
12.5
25
mW
PTOT
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
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APA2308
Electrical Characteristics Cont.
VDD=5V, VSS=0V, TA=25°C, fi=1kHz, RL=32Ω ( unless otherwise noted)
Symbol
Parameter
Test Condition
M in.
APA2308
Typ. M ax
Unit
DC Characteristics
V I(OS)
Input Offset Voltage
5
MV
IBIAS
Input Bias Current
10
PA
V CM
Comm on Mode Voltage
GV
Open-loop Voltage Gain
R L =5kΩ
75
dB
IO
Max. Output Current
(THD+N)/S<0.1%
140
MA
RO
Output Resistance
0.25
Ω
0
3.5
V
AC Characteristics
VO
Output Voltage Swing
R L =32Ω* 1
R L =16Ω*
PSRR
Power Supply Rejection Ratio
1
0.25
4.75
0.5
4.5
F i=100Hz
V RIPPLE(P-P) =100m V
\ CS
CL
Channel Separation
R L =32Ω
R L =32Ω* 2
S/N
Signal to Noise Ratio
FG
Unity Gain Frequency
R L =5kΩ
PO
Max. Output Power
(THD+N)/S<0.1%
CI
Input Capacitance
B
Power Bandwidth
Notes
65
dB
95
dB
Load Capacitance
(THD+N)/S Total Harm onic Distortion Plus
Noise to Signal Ratio
90
Unity Gain Inverting
V
200
pF
-65
-60
dB
0.05
0.1
100
dB
5
MHz
84
mW
3
pF
20
kHz
*1 : Values are proportional to V DD ; (THD+N)/S < 0.1%
*2 : V DD =5.0V ; V O(P-P) =3.5V (at 0 dB)
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
3
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APA2308
Test And Application Circuits
VDD
220pF
220µF
VOUTA
15kΩ
1
2
15kΩ
3
VREF
typ.1/2VDD
VINB
2.2µF 15kΩ
5
6
-+
VINA
APA2308
7
100µF
4
VOUTB
15kΩ
220µF
RL
220pF
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
RL
8
-+
2.2µF
4
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APA2308
Typical Characteristics
Total Harmonic Distortion Plus Noise-toSignal Ratio as a Function of Input Frequency
-80
p o =50mW
R L =16 Ω
p o =50mW
R L =32 Ω
p o =50mW
R L =5k Ω
V o(PP) =3.5V
R L =8 Ω
200
R L =16 Ω
R L =32 Ω
100
PO (mW)
(THD+N) / S (dB)
-60
R L =8 Ω
Output Power as a Function of Supply
Voltage
20
10
5
-100
2
100
1k
10k
2.5
3.5
5.5
4.5
Frequency (Hz)
VDD (Vrms)
Crosstalk as a Function of Input
Frequency
Open Loop Gain as a Function of Input
Frequency
RL=8Ω
RL=16Ω
+80
RL=32Ω
-80
Gv (dB)
Xtalk
+60
-100
RL=5kΩ
No load
+40
RL=32Ω
+20
-120
100
1k
1k
10k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
10k
100k
1M
Frequency (Hz)
5
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APA2308
Typical Characteristics Cont.
Total Harmonic Distortion Plus Noise-toSignal Ratio as a Function of output
Voltage
-40
(THD+N) / S (dB)
RL=8Ω
RL=16Ω
-50
-60
-70
RL=32Ω
RL=5KΩ
-80
-90
100m
500m
1
2
Vo (Vrms)
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
6
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APA2308
Packaging Information
PDIP-8 pin ( Reference JEDEC Registration MS-001)
D
E1
E
1
1
A2
A
E3
A1
L
e2
e1
e3
Dim
A
A1
A2
D
e1
e2
e3
E
E1
E3
L
φ1
Min.
0.38
2.92
9.02
0.36
1.14
6.10
Millimeters
2.54BSC
7.62 BSC
2.92
Max.
5.33
Min.
3.68
10.16
0.015
0.115
0.355
0.56
1.78
0.014
0.045
7.11
10.92
3.81
0.240
0.100BSC
0.300 BSC
0.115
15°
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
Inches
Max.
0.210
0.145
0.400
0.022
0.070
0.280
0.430
0.150
15°
7
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APA2308
Packaging Information
E
e1
0.015X45
SOP-8 pin ( Reference JEDEC Registration MS-012)
H
e2
D
A1
1
L
0.004max.
Dim
A
Mi ll im et er s
Inche s
A
Min .
1. 35
Max .
1. 75
Min.
0. 053
Max .
0. 069
A1
D
E
0. 10
4. 80
3. 80
0. 25
5. 00
4. 00
0. 004
0. 189
0. 150
0. 010
0. 197
0. 157
H
L
e1
e2
5. 80
0. 40
0. 33
6. 20
1. 27
0. 51
0. 228
0. 016
0. 013
0. 244
0. 050
0. 020
φ 1
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
1. 27B S C
0. 50B S C
8°
8°
8
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APA2308
Packaging Information
TSSOP-8
e
8 7
2x E/2
E1
( 2)
E
GAUGE
PLANE
S
1 2
e/2
0.25
D
L
A2
A
b
Dim
A
A1
A2
b
D
e
E
E1
L
L1
R
R1
S
φ1
φ2
φ3
1
(L1)
( 3)
A1
Millimeters
Min.
0.00
0.80
0.19
2.9
4.30
0.45
Inches
Max.
1.2
0.15
1.05
0.30
3.1
0.65 BSC
6.40 BSC
0.09
0.09
0.2
0°
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
1.0 REF
12° REF
12° REF
Min.
Max.
0.047
0.006
0.041
0.012
0.122
0.000
0.031
0.007
0.114
4.50
0.75
0.169
0.018
8°
0.004
0.004
0.008
0°
9
0.026 BSC
0.252 BSC
0.039REF
12° REF
12° REF
0.177
0.030
8°
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APA2308
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
temperature
Reference JEDEC Standard J-STD-020A APRIL 1999
Peak temperature
183°C
Pre-heat temperature
Time
Classification Reflow Profiles
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak)
3°C/second max.
120 seconds max
Preheat temperature 125 ± 25°C)
60 – 150 seconds
Temperature maintained above 183°C
Time within 5°C of actual peak temperature 10 –20 seconds
Peak temperature range
220 +5/-0°C or 235 +5/-0°C
Ramp-down rate
6 °C /second max.
6 minutes max.
Time 25°C to peak temperature
VPR
10 °C /second max.
60 seconds
215-219°C or 235 +5/-0°C
10 °C /second max.
Package Reflow Conditions
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0 °C
VPR 215-219 °C
IR/Convection 220 +5/-0 °C
pkg. thickness < 2.5mm and
pkg. volume ≥ 350 mm³
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
10
pkg. thickness < 2.5mm and pkg.
volume < 350mm³
Convection 235 +5/-0 °C
VPR 235 +5/-0 °C
IR/Convection 235 +5/-0 °C
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APA2308
Reliability test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245° C , 5 SEC
1000 Hrs Bias @ 125 ° C
168 Hrs, 100 % RH , 121 ° C
-65° C ~ 150° C , 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ao
D1
Ko
T2
J
C
A
B
T1
Application
SOP- 8
A
B
C
J
T1
T2
W
P
E
330 ± 1
62 +1.5
12.75+
0.15
2 ± 0.5
12.4 ± 0.2
2 ± 0.2
12± 0. 3
8± 0.1
1.75±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
4.0 ± 0.1
2.0 ± 0.1
6.4 ± 0.1
5.2± 0. 1
2.1± 0.1
0.3±0.013
5.5± 1
Application
TSSOP-8
A
1.55 +0.1 1.55+ 0.25
B
C
J
T1
T2
W
P
E
330 ± 1
62 +1.5
12.75+
0.15
2 + 0.5
12.4 ± 0.2
2 ± 0.2
12± 0. 3
8± 0.1
1.75±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
5.5 ± 0. 1
1.5 + 0.1
1.5 + 0.1
4.0 ± 0.1
2.0 ± 0.1
7.0 ± 0.1
3.6 ± 0.3
1.6 ± 0.1 0.3±0.013
(m m )
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
11
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APA2308
Cover Tape Dimensions
Application
SOP- 8
TSSOP- 8
Carrier Width
12
12
Cover Tape Width
9.3
9.3
Devices Per Reel
2500
2500
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. B.3 - Jun., 2003
12
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