CC1100E Low-Power Sub-GHz RF Transceiver (470-510 MHz & 950-960 MHz) Applications Ultra low-power wireless applications operating in the 470/950 MHz ISM/SRD bands Wireless sensor networks Home and building automation Advanced Metering Infrastructure (AMI) Wireless metering Wireless alarm and security systems Product Description The CC1100E is a Sub-GHz high performance radio transceiver designed for very low power RF applications. It is intended for the Industrial, Scientific and Medical (ISM) and Short Range Device (SRD) frequency bands at 470-510 MHz and 950-960 MHz. The CC1100E is especially suited for wireless applications targeted at the Japanese ARIB STD-T96 and the Chinese Short Range Device Regulations at 470-510 MHz. The CC1100E is code, package and pin out compatible with both the CC1101 [1] and CC1100 [2] RF transceivers. The CC1100E, CC1101 and CC1100 support complementary frequency bands and can be used to cover RF designs at the most commonly used sub-1 GHz license free frequencies around the world: The CC1100E provides extensive hardware support for packet handling, data buffering, burst transmissions, clear channel assessment, link quality indication, and wakeon-radio. The main operating parameters and the 64byte transmit/receive FIFOs of the CC1100E can be controlled via an SPI interface. In a typical system, the CC1100E will be used with a microcontroller and a few additional passive components. CC1100E : 470-510 MHz and 950-960 MHz CC1101 : 300-348 MHz, 387-464 MHz and 779-928 MHz CC1100 : 300-348 MHz, 400-464 MHz and 800-928 MHz The CC1100E RF transceiver is integrated with a highly configurable baseband modem. The modem supports various modulation formats and has a configurable data rate of up to 500 kBaud. This product shall not be used in any of the following products or systems without prior express written permission from Texas Instruments: (i) (ii) (iii) implantable cardiac rhythm management systems, including without limitation pacemakers, defibrillators and cardiac resynchronization devices, external cardiac rhythm management systems that communicate directly with one or more implantable medical devices; or other devices used to monitor or treat cardiac function, including without limitation pressure sensors, biochemical sensors and neurostimulators. Please contact [email protected] if your application might fall within the category described above. SWRS082 Page 1 of 92 CC1100E Key Features RF Performance High sensitivity (–112 dBm at 1.2 kBaud, 480 MHz, 1% packet error rate) Low current consumption (15.5 mA in RX, 1.2 kBaud, 480 MHz) Programmable output power up to +10 dBm for all supported frequencies Excellent receiver selectivity and blocking performance Programmable data rate from 1.2 to 500 kBaud Frequency bands: 470-510 MHz and 950960 MHz Low-Power Features Analog Features 2-FSK, GFSK, and MSK supported as well as OOK and flexible ASK shaping Suitable for frequency hopping systems due to a fast settling frequency synthesizer; 90 μs settling time Automatic Frequency Compensation (AFC) can be used to align the frequency synthesizer to the actual received signal center frequency Integrated analog temperature sensor Digital Features SWRS082 400 nA sleep mode current consumption Fast start-up time; 240 μs from sleep to RX or TX mode (measured on EM reference design [3] and [4]) Wake-on-radio functionality for automatic low-power RX polling Separate 64-byte RX and TX data FIFOs (enables burst mode data transmission) General Flexible support for packet oriented systems; On-chip support for sync word detection, address check, flexible packet length, and automatic CRC handling Efficient SPI interface; All registers can be programmed with one “burst” transfer Digital RSSI output Programmable channel filter bandwidth Programmable Carrier Sense (CS) indicator Programmable Preamble Quality Indicator (PQI) for improved protection against false sync word detection in random noise Support for automatic Clear Channel Assessment (CCA) before transmitting (for listen-before-talk systems) Support for per-package Link Quality Indication (LQI) Optional automatic whitening and dewhitening of data Few external components; Completely onchip frequency synthesizer, no external filters or RF switch needed Green package: RoHS compliant and no antimony or bromine Small size (QFN 4x4 mm package, 20 pins) Suited for systems targeting compliance with ARIB STD-T96 Suited for systems targeting compliance with the Chinese Short Range Device Regulations at 470-510 MHz Support for asynchronous and synchronous serial receive/transmit mode for backwards compatibility with existing radio communication protocols Page 2 of 92 CC1100E Abbreviations Abbreviations used in this data sheet are described below. ACP ADC AFC AGC AMR ARIB ASK BER BT CCA CFR CRC CS CW DC DVGA ESR FEC FIFO FHSS 2-FSK GFSK IF I/Q ISM LC LNA LO LSB LQI MCU MSB Adjacent Channel Power Analog to Digital Converter Automatic Frequency Compensation Automatic Gain Control Automatic Meter Reading Association of Radio Industries and Businesses Amplitude Shift Keying Bit Error Rate Bandwidth-Time product Clear Channel Assessment Code of Federal Regulations Cyclic Redundancy Check Carrier Sense Continuous Wave (Unmodulated Carrier) Direct Current Digital Variable Gain Amplifier Equivalent Series Resistance Forward Error Correction First-In-First-Out Frequency Hopping Spread Spectrum Binary Frequency Shift Keying Gaussian shaped Frequency Shift Keying Intermediate Frequency In-Phase/Quadrature Industrial, Scientific, Medical Inductor-Capacitor Low Noise Amplifier Local Oscillator Least Significant Bit Link Quality Indicator Microcontroller Unit Most Significant Bit SWRS082 MSK N/A NRZ OOK PA PCB PD PER PLL POR PQI PQT PTAT QFN QPSK RC RF RSSI RX SAW SMD SNR SPI SRD TBD T/R TX UHF VCO WOR XOSC XTAL Minimum Shift Keying Not Applicable Non Return to Zero (Coding) On-Off Keying Power Amplifier Printed Circuit Board Power Down Packet Error Rate Phase Locked Loop Power-On Reset Preamble Quality Indicator Preamble Quality Threshold Proportional To Absolute Temperature Quad Leadless Package Quadrature Phase Shift Keying Resistor-Capacitor Radio Frequency Received Signal Strength Indicator Receive, Receive Mode Surface Acoustic Wave Surface Mount Device Signal to Noise Ratio Serial Peripheral Interface Short Range Devices To Be Defined Transmit/Receive Transmit, Transmit Mode Ultra High frequency Voltage Controlled Oscillator Wake on Radio, Low power polling Crystal Oscillator Crystal Page 3 of 92 CC1100E Table of Contents APPLICATIONS .................................................................................................................................................. 1 PRODUCT DESCRIPTION................................................................................................................................ 1 KEY FEATURES ................................................................................................................................................. 1 KEY FEATURES ................................................................................................................................................. 2 RF PERFORMANCE .......................................................................................................................................... 2 ANALOG FEATURES ........................................................................................................................................ 2 DIGITAL FEATURES......................................................................................................................................... 2 LOW-POWER FEATURES................................................................................................................................ 2 GENERAL ............................................................................................................................................................ 2 ABBREVIATIONS............................................................................................................................................... 3 TABLE OF CONTENTS ..................................................................................................................................... 4 1 ABSOLUTE MAXIMUM RATINGS ..................................................................................................... 7 2 OPERATING CONDITIONS ................................................................................................................. 7 3 GENERAL CHARACTERISTICS......................................................................................................... 7 4 ELECTRICAL SPECIFICATIONS ....................................................................................................... 8 4.1 CURRENT CONSUMPTION ............................................................................................................................ 8 4.2 RF RECEIVE SECTION ................................................................................................................................ 10 4.3 RF TRANSMIT SECTION ............................................................................................................................. 13 4.4 CRYSTAL OSCILLATOR .............................................................................................................................. 14 4.5 LOW POWER RC OSCILLATOR ................................................................................................................... 14 4.6 FREQUENCY SYNTHESIZER CHARACTERISTICS .......................................................................................... 15 4.7 ANALOG TEMPERATURE SENSOR .............................................................................................................. 15 4.8 DC CHARACTERISTICS .............................................................................................................................. 16 4.9 POWER-ON RESET ..................................................................................................................................... 16 5 PIN CONFIGURATION........................................................................................................................ 16 6 CIRCUIT DESCRIPTION .................................................................................................................... 18 7 APPLICATION CIRCUIT .................................................................................................................... 18 7.1 BIAS RESISTOR .......................................................................................................................................... 18 7.2 BALUN AND RF MATCHING ....................................................................................................................... 18 7.3 CRYSTAL ................................................................................................................................................... 19 7.4 REFERENCE SIGNAL .................................................................................................................................. 19 7.5 ADDITIONAL FILTERING ............................................................................................................................ 19 7.6 POWER SUPPLY DECOUPLING .................................................................................................................... 19 7.7 ANTENNA CONSIDERATIONS ..................................................................................................................... 20 7.8 PCB LAYOUT RECOMMENDATIONS ........................................................................................................... 22 8 CONFIGURATION OVERVIEW ........................................................................................................ 23 9 CONFIGURATION SOFTWARE........................................................................................................ 25 10 4-WIRE SERIAL CONFIGURATION AND DATA INTERFACE .................................................. 25 10.1 CHIP STATUS BYTE ................................................................................................................................... 27 10.2 REGISTER ACCESS ..................................................................................................................................... 27 10.3 SPI READ .................................................................................................................................................. 28 10.4 COMMAND STROBES ................................................................................................................................. 28 10.5 FIFO ACCESS ............................................................................................................................................ 28 10.6 PATABLE ACCESS ................................................................................................................................... 29 11 MICROCONTROLLER INTERFACE AND PIN CONFIGURATION .......................................... 30 11.1 CONFIGURATION INTERFACE ..................................................................................................................... 30 11.2 GENERAL CONTROL AND STATUS PINS ..................................................................................................... 30 11.3 OPTIONAL RADIO CONTROL FEATURE ...................................................................................................... 30 12 DATA RATE PROGRAMMING.......................................................................................................... 31 13 RECEIVER CHANNEL FILTER BANDWIDTH .............................................................................. 31 SWRS082 Page 4 of 92 CC1100E 14 14.1 14.2 14.3 15 15.1 15.2 15.3 15.4 15.5 15.6 16 16.1 16.2 16.3 17 17.1 17.2 17.3 17.4 17.5 17.6 18 18.1 18.2 19 19.1 19.2 19.3 19.4 19.5 19.6 19.7 20 21 22 22.1 23 24 25 26 27 27.1 27.2 28 28.1 28.2 28.3 28.4 28.5 28.6 28.7 29 29.1 29.2 DEMODULATOR, SYMBOL SYNCHRONIZER, AND DATA DECISION.................................. 32 FREQUENCY OFFSET COMPENSATION........................................................................................................ 32 BIT SYNCHRONIZATION ............................................................................................................................. 32 BYTE SYNCHRONIZATION .......................................................................................................................... 32 PACKET HANDLING HARDWARE SUPPORT .............................................................................. 33 DATA WHITENING ..................................................................................................................................... 33 PACKET FORMAT ....................................................................................................................................... 34 PACKET FILTERING IN RECEIVE MODE ...................................................................................................... 36 PACKET HANDLING IN TRANSMIT MODE ................................................................................................... 36 PACKET HANDLING IN RECEIVE MODE ..................................................................................................... 37 PACKET HANDLING IN FIRMWARE ............................................................................................................. 37 MODULATION FORMATS ................................................................................................................. 38 FREQUENCY SHIFT KEYING ....................................................................................................................... 38 MINIMUM SHIFT KEYING........................................................................................................................... 38 AMPLITUDE MODULATION ........................................................................................................................ 39 RECEIVED SIGNAL QUALIFIERS AND LINK QUALITY INFORMATION ............................ 39 SYNC WORD QUALIFIER ............................................................................................................................ 39 PREAMBLE QUALITY THRESHOLD (PQT) .................................................................................................. 39 RSSI.......................................................................................................................................................... 40 CARRIER SENSE (CS)................................................................................................................................. 41 CLEAR CHANNEL ASSESSMENT (CCA) ..................................................................................................... 43 LINK QUALITY INDICATOR (LQI) .............................................................................................................. 43 FORWARD ERROR CORRECTION WITH INTERLEAVING ..................................................... 43 FORWARD ERROR CORRECTION (FEC)...................................................................................................... 43 INTERLEAVING .......................................................................................................................................... 44 RADIO CONTROL................................................................................................................................ 45 POWER-ON START-UP SEQUENCE ............................................................................................................. 45 CRYSTAL CONTROL ................................................................................................................................... 46 VOLTAGE REGULATOR CONTROL.............................................................................................................. 47 ACTIVE MODES ......................................................................................................................................... 47 WAKE ON RADIO (WOR).......................................................................................................................... 48 TIMING ...................................................................................................................................................... 49 RX TERMINATION TIMER .......................................................................................................................... 49 DATA FIFO ............................................................................................................................................ 50 FREQUENCY PROGRAMMING........................................................................................................ 51 VCO ......................................................................................................................................................... 52 VCO AND PLL SELF-CALIBRATION .......................................................................................................... 52 VOLTAGE REGULATORS ................................................................................................................. 52 OUTPUT POWER PROGRAMMING ................................................................................................ 52 SHAPING AND PA RAMPING............................................................................................................ 53 GENERAL PURPOSE / TEST OUTPUT CONTROL PINS ............................................................. 54 ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION .............................................. 56 ASYNCHRONOUS SERIAL OPERATION ........................................................................................................ 56 SYNCHRONOUS SERIAL OPERATION .......................................................................................................... 56 SYSTEM CONSIDERATIONS AND GUIDELINES ......................................................................... 57 SRD REGULATIONS ................................................................................................................................... 57 FREQUENCY HOPPING AND MULTI-CHANNEL SYSTEMS ............................................................................ 57 DATA BURST TRANSMISSIONS................................................................................................................... 58 CONTINUOUS TRANSMISSIONS .................................................................................................................. 58 LOW COST SYSTEMS ................................................................................................................................. 59 BATTERY OPERATED SYSTEMS ................................................................................................................. 59 INCREASING OUTPUT POWER .................................................................................................................... 59 CONFIGURATION REGISTERS........................................................................................................ 59 CONFIGURATION REGISTER DETAILS – REGISTERS WITH PRESERVED VALUES IN SLEEP STATE ............... 64 CONFIGURATION REGISTER DETAILS – REGISTERS THAT LOOSE PROGRAMMING IN SLEEP STATE ......... 84 SWRS082 Page 5 of 92 CC1100E 29.3 STATUS REGISTER DETAILS....................................................................................................................... 85 30 PACKAGE DESCRIPTION (QFN 20)................................................................................................. 89 30.1 RECOMMENDED PCB LAYOUT FOR PACKAGE (QFN 20)........................................................................... 89 30.2 SOLDERING INFORMATION ........................................................................................................................ 89 30.3 ORDERING INFORMATION .......................................................................................................................... 90 REFERENCES ................................................................................................................................................... 90 REFERENCES ................................................................................................................................................... 91 31 GENERAL INFORMATION................................................................................................................ 92 31.1 DOCUMENT HISTORY ................................................................................................................................ 92 SWRS082 Page 6 of 92 CC1100E 1 Absolute Maximum Ratings Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. Parameter Min Max Units Supply voltage –0.3 3.9 V Voltage on any digital pin –0.3 VDD + 0.3 Condition All supply pins must have the same voltage max 3.9 V 2.0 V Voltage ramp-up rate 120 kV/µs Input RF level +10 dBm 150 C Solder reflow temperature 260 C According to IPC/JEDEC J-STD-020 ESD 2000 V According to JEDEC STD 22, method A114, Human Body Model (HBM) ESD 750 V According to JEDEC STD 22, C101C, Charged Device Model (CDM) Voltage on the pins RF_P, RF_N, and DCOUPL –0.3 Storage temperature range –50 Table 1: Absolute Maximum Ratings Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. 2 Operating Conditions The operating conditions for the CC1100E are listed Table 2 in below. Parameter Min Max Unit Operating temperature -40 85 C Operating supply voltage 1.8 3.6 V Condition All supply pins must have the same voltage Table 2: Operating Conditions 3 General Characteristics Parameter Min Frequency range Data rate Typ Max Unit Condition/Note 470 510 MHz 950 960 MHz 1.2 500 kBaud 2-FSK 1.2 250 kBaud GFSK, OOK, and ASK 26 500 kBaud (Shaped) MSK (also known as differential offset QPSK) Optional Manchester encoding (the data rate in kbps will be half the baud rate) Table 3: General Characteristics SWRS082 Page 7 of 92 CC1100E 4 Electrical Specifications 4.1 Current Consumption TA = 25C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the CC1100E EM reference designs ([3] and[4]). Reduced current settings (MDMCFG2.DEM_DCFILT_OFF=1) gives a slightly lower current consumption at the cost of a reduction in sensitivity. See Table 6: RF Receive Section for additional details on current consumption and sensitivity. Parameter Current consumption in power down modes Current consumption Current consumption, 480 MHz Min Typ Max Unit Condition 0.3 A Voltage regulator to digital part off, register values retained (SLEEP state). All GDO pins programmed to 0x2F (HW to 0) 0.7 A Voltage regulator to digital part off, register values retained, lowpower RC oscillator running (SLEEP state with WOR enabled) 100 A Voltage regulator to digital part off, register values retained, XOSC running (SLEEP state with MCSM0.OSC_FORCE_ON set) 165 A Voltage regulator to digital part on, all other modules in power down (XOFF state) 10.0 A Automatic RX polling once each second, using low-power RC oscillator, with 460 kHz filter bandwidth and 250 kBaud data rate, PLL calibration every 4th wakeup. Average current with signal in channel below carrier sense level (MCSM2.RX_TIME_RSSI=1) 35 A Same as above, but with signal in channel above carrier sense level, 1.95 ms RX timeout, and no preamble/sync word found 1.3 A Automatic RX polling every 15th second, using low-power RC oscillator, with 460 kHz filter bandwidth and 250 kBaud data rate, PLL calibration every 4th wakeup. Average current with signal in channel below carrier sense level (MCSM2.RX_TIME_RSSI=1) 32 A Same as above, but with signal in channel above carrier sense level, 29.3 ms RX timeout, and no preamble/sync word found 1.7 mA Only voltage regulator to digital part and crystal oscillator running (IDLE state) 9 mA Only the frequency synthesizer is running (FSTXON state). This currents consumption is also representative for the other intermediate states when going from IDLE to RX or TX, including the calibration state 16.5 mA Receive mode, 1.2 kBaud, reduced current, input at sensitivity limit 15.4 mA Receive mode, 1.2 kBaud, reduced current, input well above sensitivity limit 16.6 mA Receive mode, 38.4 kBaud , reduced current, input at sensitivity limit 15.5 mA Receive mode, 38.4 kBaud , reduced current, input well above sensitivity limit 17.5 mA Receive mode, 250 kBaud, reduced current, input at sensitivity limit 16.1 mA Receive mode, 250 kBaud, reduced current, input well above sensitivity limit 20 mA Receive mode, 500 kBaud, input at sensitivity limit 18.7 mA Receive mode, 500 kBaud, input well above sensitivity limit 29.6 mA Transmit mode, +10 dBm output power 16.6 mA Transmit mode, 0 dBm output power 16.5 mA Transmit mode, –6 dBm output power SWRS082 Page 8 of 92 CC1100E Parameter Min Current consumption, 955 MHz Typ Max Unit Condition 16.3 mA Receive mode, 1.2 kBaud , reduced current, input at sensitivity limit 15.2 mA Receive mode, 1.2 kBaud , reduced current, input well above sensitivity limit 17.7 mA Receive mode, 38.4 kBaud , reduced current, input at sensitivity limit 17.0 mA Receive mode, 38.4 kBaud , reduced current, input well above sensitivity limit 16.8 mA Receive mode, 76.8 kBaud , reduced current, input at sensitivity limit 15.1 mA Receive mode, 76.8 kBaud , reduced current, input well above sensitivity limit 30.9 mA Transmit mode, +10 dBm output power 16.5 mA Transmit mode, 0 dBm output power 15.8 mA Transmit mode, –6 dBm output power Table 4: Electrical Specifications Temperature [°C] Supply Voltage VDD = 1.8 V -40 25 85 Supply Voltage VDD = 3.0 V -40 25 85 Supply Voltage VDD = 3.6 V -40 25 85 Current [mA] 29.3 31.6 31.9 28.7 28.1 30.9 30.3 31.2 30.6 Table 5: Typical Variation in TX Current Consumption over Temperature and Supply Voltage, 955 MHz and +10 dBm Output Power Setting Current Consumption vs. Input Power 19 18.5 Current (mA) 18 -40c 17.5 25c 85c 17 16.5 16 -100.00 -80.00 -60.00 -40.00 -20.00 Input Power (dBm) Figure 1: Typical Variation in RX Current Consumption overt Temperature and Input Power Level, 955 MHz, 76.8 kBaud GFSK, Sensitivity Optimized Setting SWRS082 Page 9 of 92 CC1100E 4.2 RF Receive Section TA = 25C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the CC1100E EM reference designs ([3] and[4]). Parameter Digital channel filter bandwidth Min Typ 58 Max Unit Condition/Note 812 kHz User programmable. The bandwidth limits are proportional to crystal frequency (given values assume a 26.0 MHz crystal) 480 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 5.2 kHz deviation, 58 kHz digital channel filter bandwidth) Receiver sensitivity -112 dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 17.9 mA to 16.5 mA at sensitivity limit. The sensitivity is typically reduced to -110 dBm 480 MHz, 38.4 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 20 kHz deviation, 100 kHz digital channel filter bandwidth) Receiver sensitivity –104 dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 18mA to 16.6 mA at sensitivity limit. 480 MHz, 250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 127 kHz deviation, 540 kHz digital channel filter bandwidth) Receiver sensitivity -95 dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 19.2mA to 17.5 mA at sensitivity limit. 480 MHz, 500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth) Receiver sensitivity -88 dBm Setting MDMCFG2.DEM_DCFILT_OFF=1 is not an valid option at 500 kBaud dara rate 955 MHz, 1.2 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 5.2 kHz deviation, 58 kHz digital channel filter bandwidth) Receiver sensitivity –111 dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 18.2 mA to 16.3 mA at sensitivity limit. The sensitivity is typically reduced to -109 dBm Saturation -15 dBm FIFOTHR.CLOSE_IN_RX=0. See more in DN010 [11] Adjacent channel rejection 28 dB Desired channel 3 dB above the sensitivity limit. 200 kHz channel spacing Alternate channel rejection 37 dB Desired channel 3 dB above the sensitivity limit. 200 kHz channel spacing See Figure 2 for plot of selectivity versus frequency offset Image channel rejection, 955 MHz 32 dB IF frequency 152 kHz Desired channel 3 dB above the sensitivity limit SWRS082 Page 10 of 92 CC1100E TA = 25C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the CC1100E EM reference designs ([3] and[4]) 955 MHz, 38.4 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 20 kHz deviation, 100 kHz digital channel filter bandwidth) Receiver sensitivity -104 dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 18.3mA to 17.7 mA at sensitivity limit. Saturation -18 dBm FIFOTHR.CLOSE_IN_RX=0. See more in DN010 [11] Adjacent channel rejection 12 dB Desired channel 3 dB above the sensitivity limit. 200 kHz channel spacing Alternate channel rejection 27 dB Desired channel 3 dB above the sensitivity limit. 200 kHz channel spacing See Figure 3 for plot of selectivity versus frequency offset Image channel rejection, 955 MHz Parameter 23 dB IF frequency 152 kHz Desired channel 3 dB above the sensitivity limit Min Typ Max Unit Condition/Note 955 MHz, 76.8 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (GFSK with BT=1, 1% packet error rate, 20 bytes packet length, 32 kHz deviation, 232 kHz digital channel filter bandwidth) -100 Receiver sensitivity dBm Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced from 18.6mA to 16.8 mA at sensitivity limit. Blocking Blocking at ±2 MHz offset, 1.2 kBaud, 955 MHz -49 dBm Desired channel 3 dB above the sensitivity limit Blocking at ±2 MHz offset, 38.4 kBaud, 955 MHz -49 dBm Desired channel 3 dB above the sensitivity limit Blocking at ±10 MHz offset, 1.2 kBaud, 955 MHz -39 dBm Desired channel 3 dB above the sensitivity limit Blocking at ±10 MHz offset, 38.4 kBaud, 955 MHz -40 dBm Desired channel 3 dB above the sensitivity limit dBm 25 MHz – 1 GHz General Spurious Emmissions -38 Excluding the 470-510 MHz band, signal at 960 MHz, 2nd harmonicAbove 1 GHz -32 dBm Typical radiated spurious emission is -49 dBm measured at the VCO frequency Data above is for the 470-510 MHz band, for spurious emmisions at 950-960 MHz, look at section 28. RX latency 9 Bit Serial operation. Time from start of reception until data is available on the receiver data output pin is equal to 9 bits. Table 6: RF Receive Section SWRS082 Page 11 of 92 CC1100E Supply VDD = 1.8 V Voltage Supply VDD = 3.0 V Voltage Supply VDD = 3.6 V Voltage Temperature [°C] -40 25 85 -40 25 85 -40 25 85 Sensitivity [dBm] -101 -100 -96 -102 -100 -98 -102 -100 -98 Table 7: Typical Variation in Sensitivity over Temperature and Supply Voltage, 955 MHz, 76.8 kBaud GFSK, Sensitivity Optimized Setting, 770 MHz notch filter Used 60.0 50.0 Selectivity [dB] 40.0 30.0 20.0 10.0 0.0 -10.0 -20.0 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Frequency offset [MHz] Figure 2: Typical Selectivity at 1.2 kBaud Data Rate, 955 MHz, GFSK, 5.2 kHz Deviation. IF Frequency is 152.3 kHz and the Digital Channel Filter Bandwidth is 58 kHz 50.0 40.0 Selectivity [dB] 30.0 20.0 10.0 0.0 -10.0 -20.0 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Frequency offset [MHz] Figure 3: Typical Selectivity at 38.4 kBaud Data Rate, 955 MHz, GFSK, 20 kHz Deviation. IF Frequency is 152.3 kHz and the Digital Channel Filter Bandwidth is 100 kHz SWRS082 Page 12 of 92 CC1100E 4.3 RF Transmit Section TA = 25C, VDD = 3.0 V, +10dBm if nothing else stated. All measurement results are obtained using the CC1100E EM reference designs ([3] and[4]). Parameter Min Typ Max Unit Differential load impedance 480 MHz 132 – j2 955 MHz 59 – j67 Output power, highest setting Condition/Note Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. Follow the CC1100E EM reference designs ([3] and 0) available from the TI website Output power is programmable, and full range is available in all frequency bands. Output power may be restricted by regulatory limits. 480 MHz +10 dBm 955 MHz +9 dBm Output power, lowest setting -30 dBm Delivered to a 50 single-ended load via the CC1100E EM reference designs ([3] and 0) RF matching network Output power is programmable, and full range is available in all frequency bands Delivered to a 50 single-ended load via the CC1100E EM reference designs ([3] and 0) RF matching network Harmonics, conducted 480 MHz 2nd Harm, 480 MHz 3rd Harm, 480 MHz -40 -48 dBm dBm 955 MHz 2nd Harm, 955 MHz 3rd Harm, 955 MHz -34 -50 dBm dBm Spurious emissions, conducted, harmonics not included 480 MHz 955MHz Measured with 10 dBm CW, TX frequency at 480 / 955 MHz Frequencies below 960 MHz Frequencies above 960 MHz Measured with +10 dBm CW, TX frequency at 480 / 955 MHz -39 -50 dBm dBm Frequencies below 1 GHz, outside 470-510 MHz band Frequencies above 1 GHz Refer to section 28.1 for information on Spurious Emissions General TX latency 8 bit Serial operation. Time from sampling the data on the transmitter data input pin until it is observed on the RF output ports Table 8: RF Transmit Section SWRS082 Page 13 of 92 CC1100E Supply Voltage VDD = 1.8 V Supply Voltage VDD = 3.0 V Supply Voltage VDD = 3.6 V Temperature [°C] -40 25 85 -40 25 85 -40 25 85 Output Power [dBm] 10.1 10.8 10.8 10.2 10.4 10.5 9.2 9.9 9.9 Table 9: Typical Variation in Output Power over Temperature and Supply Voltage, 480 MHz, +10 dBm Output Power Setting Supply Voltage VDD = 1.8 V Supply Voltage VDD = 3.0 V Supply Voltage VDD = 3.6 V Temperature [°C] -40 25 85 -40 25 85 -40 25 85 Output Power [dBm] 8.8 8.4 7.9 9.6 9.2 8.8 9.6 9.2 8.8 Table 10: Typical Variation in Output Power over Temperature and Supply Voltage, 955 MHz, +10 dBm Output Power Setting 4.4 Crystal Oscillator TA = 25C, VDD = 3.0 V if nothing else is stated. All measurement results obtained using the CC1100E EM reference designs ([3] and[4]). Parameter Crystal frequency Min Typ Max Unit 26 26 27 MHz Tolerance Load capacitance ±40 10 ppm 13 ESR Start-up time 20 pF 100 150 µs Condition/Note This is the total tolerance including a) initial tolerance, b) crystal loading, c) aging, and d) temperature dependence. The acceptable crystal tolerance depends on RF frequency and channel spacing / bandwidth. Simulated over operating conditions This parameter is to a large degree crystal dependent. Measured on the CC1100E EM reference designs ([3] and[4]) using crystal AT-41CD2 from NDK Table 11: Crystal Oscillator Parameters 4.5 Low Power RC Oscillator TA = 25C, VDD = 3.0 V if nothing else is stated. All measurement results obtained using the CC1100E EM reference designs ([3] and[4]). Parameter Min Typ Max Calibrated frequency 34.7 34.7 36 kHz ±1 % Frequency accuracy after calibration Unit Condition/Note Calibrated RC Oscillator frequency is XTAL frequency divided by 750 +0.5 % / C Frequency drift when temperature changes after calibration Supply voltage coefficient +3 %/V Frequency drift when supply voltage changes after calibration Initial calibration time 2 ms Temperature coefficient When the RC Oscillator is enabled, calibration is continuously done in the background as long as the crystal oscillator is running Table 12: RC Oscillator Parameters SWRS082 Page 14 of 92 CC1100E 4.6 Frequency Synthesizer Characteristics TA = 25C, VDD = 3.0 V if nothing else is stated. All measurement results are obtained using the CC1100E EM reference designs ([3] and[4]). Min figures are given using a 27 MHz crystal. Typ and max figures are given using a 26 MHz crystal. Parameter Programmed frequency resolution Min Typ 397 Max FXOSC/ 216 Unit 412 Condition/Note Hz 26-27 MHz crystal. The resolution (in Hz) is equal for all frequency bands Given by crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth / spacing Synthesizer frequency tolerance ±40 ppm RF carrier phase noise –92 dBc/Hz @ 50 kHz offset from carrier RF carrier phase noise –92 dBc/Hz @ 100 kHz offset from carrier RF carrier phase noise –92 dBc/Hz @ 200 kHz offset from carrier RF carrier phase noise –98 dBc/Hz @ 500 kHz offset from carrier RF carrier phase noise –107 dBc/Hz @ 1 MHz offset from carrier RF carrier phase noise –113 dBc/Hz @ 2 MHz offset from carrier RF carrier phase noise –119 dBc/Hz @ 5 MHz offset from carrier RF carrier phase noise –129 dBc/Hz @ 10 MHz offset from carrier PLL turn-on / hop time 85.1 88.4 88.4 s Time from leaving the IDLE state until arriving in the RX, FSTXON or TX state, when not performing calibration. Crystal oscillator running PLL RX/TX settling time 9.3 9.6 9.6 s Settling time for the 1·IF frequency step from RX to TX PLL TX/RX settling time 20.7 21.5 21.5 s Settling time for the 1·IF frequency step from TX to RX PLL calibration time 694 721 721 s Calibration can be initiated manually or automatically before entering or after leaving RX/TX Table 13: Frequency Synthesizer Parameters 4.7 Analog Temperature Sensor TA = 25C, VDD = 3.0 V if nothing else is stated. All measurement results obtained using the CC1100E EM reference designs ([3] and[4]). Note that it is necessary to write 0xBF to the PTEST register to use the analog temperature sensor in the IDLE state. Parameter Min Typ Max Unit Output voltage at –40C 0.651 V Output voltage at 0C 0.747 V Output voltage at +40C 0.847 V Output voltage at +80C 0.945 V Temperature coefficient Error in calculated temperature, calibrated 2.47 -2 * 0 mV/C 2 * C Condition/Note Fitted from –20 C to +80 C From –20 C to +80 C when using 2.47 mV / C, after 1-point calibration at room temperature * The indicated minimum and maximum error with 1point calibration is based on simulated values for typical process parameters Current consumption increase when enabled 0.3 mA Table 14: Analog Temperature Sensor Parameters SWRS082 Page 15 of 92 CC1100E 4.8 DC Characteristics TA = 25C if nothing else stated. Digital Inputs/Outputs Min Max Unit Condition Logic "0" input voltage 0 0.7 V Logic "1" input voltage VDD-0.7 VDD V Logic "0" output voltage 0 0.5 V For up to 4 mA output current Logic "1" output voltage VDD-0.3 VDD V For up to 4 mA output current Logic "0" input current N/A –50 nA Input equals 0V Logic "1" input current N/A 50 nA Input equals VDD Table 15: DC Characteristics 4.9 Power-On Reset When the power supply complies with the requirements in Table 16 below, proper Power-On-Reset functionality is guaranteed. Otherwise, the chip should be assumed to have unknown state until transmitting an SRES strobe over the SPI interface. See Section 19.1 on page 45 for further details. Parameter Min Typ Power-up ramp-up time Power off time Max Unit 5 ms From 0V until reaching 1.8V ms Minimum time between power-on and power-off 1 Condition/Note Table 16: Power-On Reset Requirements 5 Pin Configuration GND RBIAS DGUARD GND SI The CC1100E pin-out is shown in Figure 4 and Table 17. See Section 26 for details on the I/O configuration. 20 19 18 17 16 SCLK 1 15 AVDD SO (GDO1) 2 14 AVDD GDO2 3 13 RF_N DVDD 4 12 RF_P DCOUPL 5 11 AVDD 7 8 9 10 GDO0 (ATEST) CSn XOSC_Q1 AVDD XOSC_Q2 6 GND Exposed die attach pad Figure 4: Pin out Top View . Note: The exposed die attach pad must be connected to a solid ground plane as this is the main ground connection for the chip SWRS082 Page 16 of 92 CC1100E Pin # Pin Name Pin type Description 1 SCLK Digital Input Serial configuration interface, clock input 2 SO (GDO1) Digital Output Serial configuration interface, data output Optional general output pin when CSn is high 3 GDO2 Digital Output Digital output pin for general use: Test signals FIFO status signals Clear channel indicator Clock output, down-divided from XOSC Serial output RX data 4 DVDD Power (Digital) 1.8 - 3.6 V digital power supply for digital I/O’s and for the digital core voltage regulator 5 DCOUPL Power (Digital) 1.6 - 2.0 V digital power supply output for decoupling NOTE: This pin is intended for use only by the CC1100E. It can not be used to provide supply voltage to other devices 6 GDO0 Digital I/O Digital output pin for general use: Test signals (ATEST) FIFO status signals Clear channel indicator Clock output, down-divided from XOSC Serial output RX data Serial input TX data Also used as analog test I/O for prototype/production testing 7 CSn Digital Input Serial configuration interface, chip select 8 XOSC_Q1 Analog I/O Crystal oscillator pin 1, or external clock input 9 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection 10 XOSC_Q2 Analog I/O Crystal oscillator pin 2 11 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection 12 RF_P RF I/O Positive RF input signal to LNA in receive mode Positive RF output signal from PA in transmit mode 13 RF_N RF I/O Negative RF input signal to LNA in receive mode Negative RF output signal from PA in transmit mode 14 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection 15 AVDD Power (Analog) 1.8 - 3.6 V analog power supply connection 16 GND Ground (Analog) Analog ground connection 17 RBIAS Analog I/O External bias resistor for reference current 18 DGUARD Power (Digital) Power supply connection for digital noise isolation 19 GND Ground (Digital) Ground connection for digital noise isolation 20 SI Digital Input Serial configuration interface, data input Table 17: Pin out Overview SWRS082 Page 17 of 92 CC1100E 6 Circuit Description 90 PA RC OSC BIAS RBIAS XOSC XOSC_Q1 RXFIFO DIGITAL INTERFACE TO MCU 0 RF_N TXFIFO FREQ SYNTH MODULATOR RF_P PACKET HANDLER ADC FEC / INTERLEAVER ADC LNA DEMODULATOR RADIO CONTROL SCLK SO (GDO1) SI CSn GDO0 (ATEST) GDO2 XOSC_Q2 Figure 5: CC1100E Simplified Block Diagram A simplified block diagram of the CC1100E is shown in Figure 5. The CC1100E features a low-IF receiver. The received RF signal is amplified by the lownoise amplifier (LNA) and down-converted in quadrature (I and Q) to the intermediate frequency (IF). At IF, the I/Q signals are digitized by the ADCs. Automatic gain control (AGC), fine channel filtering and demodulation bit/packet synchronization are performed digitally. The transmitter part of the CC1100E is based on direct synthesis of the RF frequency. The 7 A 4-wire SPI serial interface is used for configuration and data buffer access. The digital baseband includes support for channel configuration, packet handling, and data buffering. are described in Table 18, and typical values are given in Table 19. Bias Resistor The bias resistor R171 is used to set an 7.2 A crystal is to be connected to XOSC_Q1 and XOSC_Q2. The crystal oscillator generates the reference frequency for the synthesizer, as well as clocks for the ADC and the digital part. Application Circuit Only a few external components are required for using the CC1100E. The recommended application circuits for the CC1100E are shown in Figure 6 and Figure 7. The external components 7.1 frequency synthesizer includes a completely on-chip LC VCO and a 90 degree phase shifter for generating the I and Q LO signals to the down-conversion mixers in receive mode. accurate bias current. Balun and RF Matching The balanced RF input and output of the CC1100E share two common pins and are designed for a simple, low-cost matching and balun network on the printed circuit board. The receive and transmit switching at the CC1100E front-end is controlled by a dedicated on-chip SWRS082 function, eliminating the need for an external RX/TX-switch. A few external passive components combined with the internal RX/TX switch/termination circuitry ensures match in both RX and TX mode. The components between the RF_N/RF_P pins and the point where the two Page 18 of 92 CC1100E signals are joined together (C131, C121, L121 and L131 for the 470 MHz reference design [3], and L121, L131, C121, L122, C131, C122 and L132 for the 950 MHz reference design [4]) form a balun that converts the differential RF signal on the CC1100E to a single-ended RF signal. C124 is needed for DC blocking. Together with an appropriate LC network, the balun components also transform the impedance to match a 50 load. C125 provides DC blocking and is only needed if there is a DC path in the antenna. For the 950 7.3 CL 1 1 1 C81 C101 C parasitic The crystal oscillator is amplitude regulated. This means that a high current is used to start up the oscillations. When the amplitude builds up, the current is reduced to what is necessary to maintain approximately 0.4 Vpp signal swing. This ensures a fast start-up, and keeps the drive level to a minimum. The ESR of the crystal should be within the specification in order to ensure a reliable start-up (see Section 4.4 on page 14). Reference Signal XOSC_Q1 input. The sine wave must be connected to XOSC_Q1 using a serial capacitor. This capacitor can be omitted when using a full-swing digital signal. The XOSC_Q2 line must be left un-connected. C81 and C101 can be omitted when using a reference signal. Additional Filtering In the 950 MHz reference design, C126 and L125 together with C125 build an optional filter to reduce emission at 770 MHz. This filter is necessary for applications with an external antenna connector that target compliance with ARIB STD-T96. If this filtering is not necessary, C125 will work as a DC block (only 7.6 The parasitic capacitance is constituted by pin input capacitance and PCB stray capacitance. Total parasitic capacitance is typically 2.5 pF. The initial tolerance, temperature drift, aging and load pulling should be carefully specified in order to meet the required frequency accuracy in a certain application. The chip can alternatively be operated with a reference signal from 26 to 27 MHz instead of a crystal. This input clock can either be a fullswing digital signal (0 V to VDD) or a sine wave of maximum 1 V peak-peak amplitude. The reference signal must be connected to the 7.5 The balun and LC filter component values and their placement are important to keep the performance optimized. It is highly recommended to follow the CC1100E EM reference design ([3] and 0). Gerber files and schematics for the reference designs are available for download from the TI website. Crystal A crystal in the frequency range 26-27 MHz must be connected between the XOSC_Q1 and XOSC_Q2 pins. The oscillator is designed for parallel mode operation of the crystal. In addition, loading capacitors (C81 and C101) for the crystal are required. The loading capacitor values depend on the total load capacitance, CL, specified for the crystal. The total load capacitance seen between the crystal terminals should equal CL for the crystal to oscillate at the specified frequency. 7.4 MHz reference design, this component may also be used for additional filtering, see section 7.5 below. Suggested values for 470 MHz, and 950 MHz are listed in Table 19. necessary if there is a DC path in the antenna). C126 and L125 should in that case be left unmounted. Additional external components (e.g. an RF SAW filter) may be used in order to improve the performance in specific applications. Power Supply Decoupling The power supply must be properly decoupled close to the supply pins. Note that decoupling capacitors are not shown in the application circuit. The placement and the size of the SWRS082 decoupling capacitors are very important to achieve the optimum performance. The CC1100E EM reference designs ([3] and 0) should be followed closely. Page 19 of 92 CC1100E 7.7 Antenna Considerations The reference designs ([3] and 0) contain an SMA connector and are matched for a 50 load. The SMA connector makes it easy to connect evaluation modules and prototypes to different test equipment for example a Component C51 spectrum analyzer. The SMA connector can also be replaced by an antenna suitable for the desired application. Please refer to the antenna selection guide [14] for further details regarding antenna solutions provided by TI. Description Decoupling capacitor for on-chip voltage regulator to digital part C81/C101 Crystal loading capacitors C121/C131 RF balun/matching capacitors C122 RF LC filter/matching filter capacitor (470 MHz). RF balun/matching capacitor (950 MHz). C123 RF LC filter/matching capacitor C124 RF balun DC blocking capacitor C125 RF LC filter DC blocking capacitor and part of optional RF LC filter (950 MHz) C126 Part of optional RF LC filter and DC-block (950 MHz) L121/L131 RF balun/matching inductors (wire wound or multi-layer type) L122 RF LC filter/matching filter inductor (470 MHz). RF balun/matching inductor (950 MHz). (wire wound or multi-layer type) L123 RF LC filter/matching filter inductor (wire wound or multi-layer type) L124 RF LC filter/matching filter inductor (wire wound or multi-layer type) L125 Optional RF LC filter/matching filter inductor (950 MHz) (wire wound or multi-layer type) L132 RF balun/matching inductor. (wire wound or multi-layer type) R171 Resistor for internal bias current reference XTAL 26MHz - 27MHz crystal Table 18: Overview of External Components (excluding supply decoupling capacitors) SWRS082 Page 20 of 92 CC1100E 1.8V-3.6V power supply R171 1 SCLK 2 SO (GDO1) GND 16 RBIAS 17 DGUARD 18 SI 20 SO (GDO1) GDO2 (optional) Antenna (50 Ohm) AVDD 15 CC1100E 3 GDO2 AVDD 14 C131 L131 C125 RF_N 13 DIE ATTACH PAD: RF_P 12 9 AVDD 7 CSn C51 8 XOSC_Q1 5 DCOUPL 10 XOSC_Q2 4 DVDD 6 GDO0 Digital Inteface SCLK GND 19 SI AVDD 11 C121 L121 L122 L123 C122 C123 C124 GDO0 (optional) CSn XTAL C81 C101 RBIAS 17 GND 16 10 XOSC_Q2 9 AVDD GND 19 DGUARD 18 8 XOSC_Q1 7 CSn 6 GDO0 Digital Interface SI 20 Figure 6: Typical Application and Evaluation Circuit 470 MHz (excluding supply decoupling capacitors) Figure 7: Typical Application and Evaluation Circuit 950 MHz (excluding supply decoupling capacitors) SWRS082 Page 21 of 92 CC1100E Component Value at 470MHz Value at 950MHz Manufacturer C51 100 nF ± 10%, 0402 X5R Murata GRM1555C series C81 27 pF ± 5%, 0402 NP0 Murata GRM1555C series C101 27 pF ± 5%, 0402 NP0 Murata GRM1555C series C121 3.9 pF ± 0.25 pF, 0402 NP0 1.0 pF ± 0.25 pF, 0402 NP0 Murata GRM1555C series C122 6.8 pF ± 5% pF, 0402 NP0 1.5 pF ± 0.25 pF, 0402 NP0 Murata GRM1555C series C123 5.6 pF ± 0.5 pF, 0402 NP0 2.7 pF ± 0.25 pF, 0402 NP0 Murata GRM1555C series C124 .220 pF pF ± 5%, 0402 NP0 100 pF ± 5%, 0402 NP0 Murata GRM1555C series C125 220 pF ± 5%, 0402 NP0 100 pF ± 5%, 0402 NP0 or 11 pF ± 5%, 0402 NP0 when part of optional filter Murata GRM1555C series 47 pF ± 5%, 0402 NP0 Murata GRM1555C series C126 C131 3.9 pF ± 0.25 pF, 0402 NP0 1.5 pF ± 0.25 pF, 0402 NP0 Murata GRM1555C series L121 27 nH ± 5%, 0402 wire wound 12 nH ± 5%, 0402 wire wound Murata LQW15 series L122 22 nH ± 5%, 0402 wire wound 18 nH ± 5%, 0402 wire wound Murata LQW15 series L123 27 nH ± 5%, 0402 wire wound 12 nH ± 5%, 0402 wire wound Murata LQW15 series L124 12 nH ± 5%, 0402 wire wound Murata LQW15 series L125 2.7 nH ± 0.2nH, 0402 wire wound Murata LQW15 series 12 nH ± 5%, 0402 wire wound Murata LQW15 series 18 nH ± 5%, 0402 wire wound Murata LQW15 series L131 27 nH ± 5%, 0402 wire wound L132 R171 56k Ω, 0402, 1% Koa RK73 series XTAL 26.0 MHz surface mount crystal NDK, AT-41CD2 Table 19: Bill Of Materials for the Application Circuit 7.8 PCB Layout Recommendations The top layer should be used for signal routing, and the open areas should be filled with metallization connected to ground using several vias. The area under the chip is used for grounding and shall be connected to the bottom ground plane with several vias for good thermal performance and sufficiently low inductance to ground. In the CC1100E EM reference designs ([3] and 0), 5 vias are placed inside the exposed SWRS082 die attached pad. These vias should be “tented” (covered with solder mask) on the component side of the PCB to avoid migration of solder through the vias during the solder reflow process. The solder paste coverage should not be 100%. If it is, out gassing may occur during the reflow process, which may cause defects (splattering, solder balling). Using “tented” vias reduces the solder paste coverage below Page 22 of 92 CC1100E 100%. See Figure 8 for top solder resist and top paste masks. Each decoupling capacitor should be placed as close as possible to the supply pin it decouples. Each decoupling capacitor should be connected to the power line (or power plane) by separate vias. The best routing is from the power line (or power plane) to the decoupling capacitor and then to the CC1100E supply pin. Supply power filtering is very important. Each decoupling capacitor ground pad should be connected to the ground plane by separate vias. Direct connections between neighboring power pins will increase noise coupling and should be avoided unless absolutely necessary. Routing in the ground plane underneath the chip or the balun/RF matching circuit, or between the chip’s ground vias and the decoupling capacitor’s ground vias should be avoided. This improves the grounding and ensures the shortest possible current return path. The external components should ideally be as small as possible (0402 is recommended) and surface mount devices are highly recommended. Please note that components with different sizes than those specified may have differing characteristics. Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF circuitry. A CC1100E DK Development Kit with a fully assembled CC1100E EM Evaluation Module is available. It is strongly advised that this reference layout is followed very closely in order to get the best performance. The schematic, BOM and layout Gerber files are all available from the TI website ([3] and 0). Figure 8: Left: Top Solder Resist Mask (Negative). Right: Top Paste Mask. Circles are Vias 8 Configuration Overview The CC1100E can be configured to achieve optimum performance for many different applications. Configuration is done using the SPI interface. See Section 10 below for more description of the SPI interface. The following key parameters can be programmed: Details of each configuration register can be found in Section 29, starting on page 59. Power-down / power up mode Crystal oscillator power-up / power-down Receive / transmit mode RF channel selection Data rate Modulation format RX channel filter bandwidth RF output power Data buffering with separate 64-byte receive and transmit FIFOs SWRS082 Packet radio hardware support Forward Error Correction (FEC) interleaving Data whitening Wake-On-Radio (WOR) with Figure 9 shows a simplified state diagram that explains the main CC1100E states together with typical usage and current consumption. For detailed information on controlling the CC1100E state machine, and a complete state diagram, see Section 19, starting on page 45. Page 23 of 92 CC1100E Sleep SPWD or wake-on-radio (WOR) SIDLE Default state when the radio is not receiving or transmitting. Typ. current consumption: 1.7 mA. CSn = 0 Lowest power mode. Most register values are retained. Current consumption typ 300 nA, or typ 700 nA when wake-on-radio (WOR) is enabled. IDLE SXOFF SCAL Used for calibrating frequency synthesizer upfront (entering CSn = 0 receive or transmit mode can Manual freq. then be done quicker). synth. calibration SRX or STX or SFSTXON or wake-on-radio (WOR) Transitional state. Typ. current consumption: 9 mA. SFSTXON Frequency synthesizer is on, ready to start transmitting. Transmission starts very quickly after receiving the STX command strobe.Typ. current consumption: 9 mA. Frequency synthesizer startup, optional calibration, settling Crystal oscillator off All register values are retained. Typ. current consumption; 165 µA. Frequency synthesizer is turned on, can optionally be calibrated, and then settles to the correct frequency. Transitional state. Typ. current consumption: 9 mA. Frequency synthesizer on STX SRX or wake-on-radio (WOR) STX TXOFF_MODE = 01 SFSTXON or RXOFF_MODE = 01 Typ. current consumption: 15.8 mA at -6 dBm output, 16.5 mA at 0 dBm output, 30.9 mA at +10 dBm output. STX or RXOFF_MODE=10 Transmit mode SRX or TXOFF_MODE = 11 TXOFF_MODE = 00 In FIFO-based modes, transmission is turned off and this state entered if the TX FIFO becomes empty in the middle of a packet. Typ. current consumption: 1.7 mA. Receive mode RXOFF_MODE = 00 Optional transitional state. Typ. current consumption: 9 mA. TX FIFO underflow Typ. current consumption: from 15.2 mA (strong input signal) to 16.3 mA (weak input signal). Optional freq. synth. calibration SFTX RX FIFO overflow In FIFO-based modes, reception is turned off and this state entered if the RX FIFO overflows. Typ. current consumption: 1.7 mA. SFRX IDLE Figure 9: Simplified State Diagram, with Typical Current Consumption at 1.2 kBaud Data Rate and MDMCFG2.DEM_DCFILT_OFF=1 (current optimized). Frequency Band = 955 MHz SWRS082 Page 24 of 92 CC1100E 9 Configuration Software The CC1100E can be configured using the SmartRF Studio software [8]. The SmartRF Studio software is highly recommended for obtaining optimum register settings, and for evaluating performance and functionality. A screenshot of the SmartRF Studio user interface for the CC1100E is shown in Figure 10. After chip reset, all the registers have default values as shown in the tables in Section 29. The optimum register setting might differ from the default value. After a reset all registers that shall be different from the default value therefore needs to be programmed through the SPI interface. Figure 10: SmartRF Studio [8] User Interface 10 4-wire Serial Configuration and Data Interface The CC1100E is configured via a simple 4-wire SPI-compatible interface (SI, SO, SCLK and CSn) where the CC1100E is the slave. This interface is also used to read and write buffered data. All transfers on the SPI interface are done most significant bit first. All transactions on the SPI interface start with a header byte containing an R/W;¯ bit, a burst access bit (B), and a 6-bit address (A5 – A0). The CSn pin must be kept low during transfers on the SPI bus. If CSn goes high during the SWRS082 transfer of a header byte or during read/write from/to a register, the transfer will be cancelled. The timing for the address and data transfer on the SPI interface is shown in Figure 11 with reference to Table 20. When CSn is pulled low, the MCU must wait until the CC1100E SO pin goes low before starting to transfer the header byte. This indicates that the crystal is running. Unless the chip was in the SLEEP or XOFF states, the SO pin will always go low immediately after taking CSn low. Page 25 of 92 CC1100E tsp tch tcl tsd thd tns SCLK: CSn: Write to register: SI X 0 B A5 SO Hi-Z S7 B S5 SI X A4 A3 A2 A1 A0 S4 S3 S2 S1 S0 X DW7 DW 6 S6 S7 DW5 S5 DW4 DW 3 DW2 DW1 DW0 S3 S2 S1 S0 DR2 DR1 S4 X Hi-Z Read from register: SO Hi-Z 1 B A5 A4 A3 A2 A1 A0 S7 B S5 S4 S3 S2 S1 S0 X DR7 DR6 DR5 DR4 DR3 DR0 Hi-Z Figure 11: Configuration Registers Write and Read Operations Parameter Description Min Max Units fSCLK SCLK frequency - 10 MHz - 9 - 6.5 100 ns delay inserted between address byte and data byte (single access), or between address and data, and between each data byte (burst access). SCLK frequency, single access No delay between address and data byte SCLK frequency, burst access No delay between address and data byte, or between data bytes tsp,pd CSn low to positive edge on SCLK, in power-down mode 150 - s tsp CSn low to positive edge on SCLK, in active mode 20 - ns tch Clock high 50 - ns tcl Clock low 50 - ns trise Clock rise time - 5 ns tfall Clock fall time - 5 ns tsd Setup data (negative SCLK edge) to positive edge on SCLK Single access 55 - ns Burst access 76 - (tsd applies between address and data bytes, and between data bytes) thd Hold data after positive edge on SCLK 20 - ns tns Negative edge on SCLK to CSn high. 20 - ns Table 20: SPI Interface Timing Requirements Note: The minimum tsp,pd figure in Table 20 can be used in cases where the user does not read the CHIP_RDYn signal. CSn low to positive edge on SCLK when the chip is woken from powerdown depends on the start-up time of the crystal being used. The 150 μs in Table 20 is the crystal oscillator start-up time measured on CC1100E EM reference designs (0 and 0) using crystal AT-41CD2 from NDK. SWRS082 Page 26 of 92 CC1100E 10.1 Chip Status Byte When the header byte, data byte, or command strobe is sent on the SPI interface, the chip status byte is sent by the CC1100E on the SO pin. The status byte contains key status signals, useful for the MCU. The first bit, s7, is the CHIP_RDYn signal; this signal must go low before the first positive edge of SCLK. The CHIP_RDYn signal indicates that the crystal is running. Bits 6, 5, and 4 comprise the STATE value. This value reflects the state of the chip. The XOSC and power to the digital core are on in the IDLE state, but all other modules are in power down. The frequency and channel configuration should only be updated when the chip is in this state. The RX state will be active when the chip is in the receive mode. Likewise, TX is active when the chip is transmitting. Bits The last four bits (3:0) in the status byte contains FIFO_BYTES_AVAILABLE. For read operations (the R/W;¯ bit in the header byte is set to 1), the FIFO_BYTES_AVAILABLE field contains the number of bytes available for reading from the RX FIFO. For write operations (the R/W;¯ bit in the header byte is set to 0), the FIFO_BYTES_AVAILABLE field contains the number of bytes that can be written to the TX FIFO. When FIFO_BYTES_AVAILABLE=15, 15 or more bytes are available/free. Table 21 gives a status byte summary. Name Description 7 CHIP_RDYn Stays high until power and crystal have stabilized. Should always be low when using the SPI interface. 6:4 STATE[2:0] Indicates the current main state machine mode Value State Description 000 IDLE IDLE state (Also reported for some transitional states instead of SETTLING or CALIBRATE) 3:0 FIFO_BYTES_AVAILABLE[3:0] 001 RX Receive mode 010 TX Transmit mode 011 FSTXON Fast TX ready 100 CALIBRATE Frequency synthesizer calibration is running 101 SETTLING PLL is settling 110 RXFIFO_OVERFLOW RX FIFO has overflowed. Read out any useful data, then flush the FIFO with SFRX 111 TXFIFO_UNDERFLOW TX FIFO has underflowed. Acknowledge with SFTX The number of bytes available in the RX FIFO or free bytes in the TX FIFO Table 21: Status Byte Summary 10.2 Register Access The configuration registers on the CC1100E are located on SPI addresses from 0x00 to 0x2E. Table 39 on page 61 lists all configuration registers. It is highly recommended to use ® SmartRF Studio [8] to generate optimum register settings. The detailed description of each register is found in Section 29.1 and 29.2, starting on page 64. All configuration registers can be both written to and read. The SWRS082 R/W;¯ bit controls if the register should be written to or read. When writing to registers, the status byte is sent on the SO pin each time a header byte or data byte is transmitted on the SI pin. When reading from registers, the status byte is sent on the SO pin each time a header byte is transmitted on the SI pin. Registers with consecutive addresses can be accessed in an efficient way by setting the Page 27 of 92 CC1100E burst bit (B) in the header byte. The address bits (A5 – A0) set the start address in an internal address counter. This counter is incremented by one each new byte (every 8 clock pulses). The burst access is either a read or a write access and must be terminated by setting CSn high. status registers when burst bit is one, and between command strobes when burst bit is zero. See more in Section 10.3 below. Because of this, burst access is not available for status registers and they must be accessed one at a time. The status registers can only be read. For register addresses in the range 0x300x3D, the burst bit is used to select between 10.3 SPI Read When reading register fields over the SPI interface while the register fields are updated by the radio hardware (e.g. MARCSTATE or TXBYTES), there is a small, but finite, probability that a single read from the register is corrupt. As an example, the probability of any single read from TXBYTES being corrupt, assuming the maximum data rate is used, is approximately 80 ppm. Refer to the CC1100E Errata Note [5] for more details. 10.4 Command Strobes Command Strobes may be viewed as single byte instructions to the CC1100E. By addressing a command strobe register, internal sequences will be started. These commands are used to disable the crystal oscillator, enable receive mode, enable wake-on-radio etc. The 13 command strobes are listed in Table 38 on page 60. Note: An SIDLE strobe will clear all pending command strobes until IDLE state is reached. This means that if for example an SIDLE strobe is issued while the radio is in RX state, any other command strobes issued before the radio reaches IDLE state will be ignored. address bits (in the range 0x30 through 0x3D) are written. The R/W;¯ bit can be either one or zero and will determine how the FIFO_BYTES_AVAILABLE field in the status byte should be interpreted. When writing command strobes, the status byte is sent on the SO pin. A command strobe may be followed by any other SPI access without pulling CSn high. However, if an SRES strobe is being issued, one will have to wait for SO to go low again before the next header byte can be issued as shown in Figure 12. The command strobes are executed immediately, with the exception of the SPWD and the SXOFF strobes that are executed when CSn goes high. The command strobe registers are accessed by transferring a single header byte (no data is being transferred). That is, only the R/W;¯ bit, the burst access bit (set to 0), and the six Figure 12: SRES Command Strobe 10.5 FIFO Access The 64-byte TX FIFO and the 64-byte RX FIFO are accessed through the 0x3F address. When the R/W;¯ bit is zero, the TX FIFO is accessed, and the RX FIFO is accessed when the R/W;¯ bit is one. SWRS082 The TX FIFO is write-only, while the RX FIFO is read-only. The burst bit is used to determine if the FIFO access is a single byte access or a burst access. The single byte access method Page 28 of 92 CC1100E expects a header byte with the burst bit set to zero and one data byte. After the data byte, a new header byte is expected; hence, CSn can remain low. The burst access method expects one header byte and then consecutive data bytes until terminating the access by setting CSn high. Note that the status byte contains the number of bytes free before writing the byte in progress to the TX FIFO. When the last byte that fits in the TX FIFO is transmitted on SI, the status byte received concurrently on SO will indicate that one byte is free in the TX FIFO. The following header bytes access the FIFOs: The TX FIFO may be flushed by issuing a SFTX command strobe. Similarly, a SFRX command strobe will flush the RX FIFO. A SFTX or SFRX command strobe can only be issued in the IDLE, TXFIFO_UNDERFLOW, or RXFIFO_OVERFLOW states. Both FIFOs are flushed when going to the SLEEP state. 0x3F: Single byte access to TX FIFO 0x7F: Burst access to TX FIFO 0xBF: Single byte access to RX FIFO 0xFF: Burst access to RX FIFO When writing to the TX FIFO, the status byte (see Section 10.1) is output on SO for each new data byte as shown in Figure 11. This status byte can be used to detect TX FIFO underflow while writing data to the TX FIFO. Figure 13 gives a brief overview of different register access types possible. 10.6 PATABLE Access The 0x3E address is used to access the PATABLE, which is used for selecting PA power control settings. The SPI expects up to eight data bytes after receiving the address. By programming the PATABLE, controlled PA power ramp-up and ramp-down can be achieved, as well as ASK modulation shaping ® for reduced bandwidth. See SmartRF Studio [8] for recommended shaping / PA ramping sequences. See also Section 24 on page 52 for details on output power programming. The PATABLE is an 8-byte table that defines the PA control settings to use for each of the eight PA power values (selected by the 3-bit value FREND0.PA_POWER). The table is written and read from the lowest setting (0) to the highest (7), one byte at a time. An index counter is used to control the access to the table. This counter is incremented each time a byte is read or written to the table, and set to the lowest index when CSn is high. When the highest value is reached the counter restarts at zero. The access to the PATABLE is either single byte or burst access depending on the burst bit. When using burst access the index counter will count up; when reaching 7 the counter will restart at 0. The R/W;¯ bit controls whether the access is a read or a write access. If one byte is written to the PATABLE and this value is to be read out, CSn must be set high before the read access in order to set the index counter back to zero. Note that the content of the PATABLE is lost when entering the SLEEP state, except for the first byte (index 0). Please referr to Design Note DN501 [17] for more information Figure 13: Register Access Types SWRS082 Page 29 of 92 CC1100E 11 Microcontroller Interface and Pin Configuration In a typical system, the CC1100E will interface to a microcontroller. This microcontroller must be able to: Program the CC1100E into different modes Read and write buffered data Read back status information via the 4-wire SPI-bus configuration interface (SI, SO, SCLK and CSn) 11.1 Configuration Interface The microcontroller uses four I/O pins for the SPI configuration interface (SI, SO, SCLK and CSn). The SPI is described in Section 10 on page 25. 11.2 General Control and Status Pins The CC1100E has two dedicated configurable pins (GDO0 and GDO2) and one shared pin (GDO1) that can output internal status information useful for control software. These pins can be used to generate interrupts on the MCU. See Section 26 page 54 for more details on the signals that can be programmed. GDO1 is shared with the SO pin in the SPI interface. The default setting for GDO1/SO is 3-state output. By selecting any other of the programming options, the GDO1/SO pin will become a generic pin. When CSn is low, the pin will always function as a normal SO pin. In the synchronous and asynchronous serial modes, the GDO0 pin is used as a serial TX data input pin while in transmit mode. The GDO0 pin can also be used for an on-chip analog temperature sensor. By measuring the voltage on the GDO0 pin with an external ADC, the temperature can be calculated. Specifications for the temperature sensor are found in Section 4.7 on page 15. With default PTEST register setting (0x7F), the temperature sensor output is only available if the frequency synthesizer is enabled (e.g. the MANCAL, FSTXON, RX, and TX states). It is necessary to write 0xBF to the PTEST register to use the analog temperature sensor in the IDLE state. Before leaving the IDLE state, the PTEST register should be restored to its default value (0x7F). 11.3 Optional Radio Control Feature The CC1100E has an optional way of controlling the radio by reusing SI, SCLK, and CSn from the SPI interface. This feature allows for a simple three-pin control of the major states of the radio: SLEEP, IDLE, RX, and TX. This optional functionality is enabled with the MCSM0.PIN_CTRL_EN configuration bit. SCLK are set to RX and CSn toggles. When CSn is low the SI and SCLK has normal SPI functionality. All pin control command strobes are executed immediately except the SPWD strobe. The SPWD strobe is delayed until CSn goes high. State changes are commanded as follows: CSn SCLK SI Function If CSn is high, the SI and SCLK are set to the desired state according to Table 22. 1 X X Chip unaffected by SCLK/SI 0 0 Generates SPWD strobe If CSn goes low, the state of SI and SCLK is latched and a command strobe is generated internally according to the pin configuration. 0 1 Generates STX strobe 1 0 Generates SIDLE strobe 1 1 Generates SRX strobe It is only possible to change state with the latter functionality. That means that for instance RX will not be restarted if SI and 0 SPI mode SPI mode SPI mode (wakes up into IDLE if in SLEEP/XOFF) SWRS082 Table 22: Optional Pin Control Coding Page 30 of 92 CC1100E 12 Data Rate Programming The data rate used when transmitting, or the data rate expected in receive is programmed by the MDMCFG3.DRATE_M and the MDMCFG4.DRATE_E configuration registers. The data rate is given by the formula below. As the formula shows, the programmed data rate depends on the crystal frequency. RDATA 256 DRATE _ M 2DRATE _ E f 2 28 XOSC The following approach can be used to find suitable values for a given data rate: R 2 20 DRATE _ E log 2 DATA f XOSC RDATA 2 28 DRATE _ M 256 f XOSC 2 DRATE _ E If DRATE_M is rounded to the nearest integer and becomes 256, increment DRATE_E and use DRATE_M = 0. The data rate can be set from 0.8 kBaud to 500 kBaud with the minimum step size according to Table 23 below. Min Data Rate [kBaud] Typical Data Rate [kBaud] Max Data Rate [kBaud] Data rate Step Size [kBaud] 0.8 1.2 / 2.4 3.17 0.0062 3.17 4.8 6.35 0.0124 6.35 9.6 12.7 0.0248 12.7 19.6 25.4 0.0496 25.4 38.4 50.8 0.0992 50.8 76.8 101.6 0.1984 101.6 153.6 203.1 0.3967 203.1 250 406.3 0.7935 406.3 500 500 1.5869 Table 23: Data Rate Step Size 13 Receiver Channel Filter Bandwidth In order to meet different channel width requirements, the receiver channel filter is programmable. The MDMCFG4.CHANBW_E and MDMCFG4.CHANBW_M configuration registers control the receiver channel filter bandwidth, which scales with the crystal oscillator frequency. The following formula gives the relation between the register settings and the channel filter bandwidth: BWchannel f XOSC 8 ( 4 CHANBW _ M )·2 CHANBW _ E Table 24 lists the channel filter bandwidths supported by the CC1100E. For best performance, the channel filter bandwidth should be selected so that the signal bandwidth occupies at most 80% of the channel filter bandwidth. The channel centre tolerance due to crystal inaccuracy should also be subtracted from the channel filter bandwidth. The following example illustrates this: With the channel filter bandwidth set to 500 kHz, the signal should stay within 80% of SWRS082 500 kHz, which is 400 kHz. Assuming 955 MHz frequency and ±20 ppm frequency uncertainty for both the transmitting device and the receiving device, the total frequency uncertainty is ±40 ppm of 955 MHz, which is ±38.2 kHz. If the whole transmitted signal bandwidth is to be received within 400 kHz, the transmitted signal bandwidth should be maximum 400 kHz – 2·38.2 kHz, which is 323.6 kHz. By compensating for a frequency offset between the transmitter and the receiver, the filter bandwidth can be reduced and the sensitivity can be improved, see more in DN005 [16] and in Section 14.1. MDMCFG4.CHANBW_E MDMCFG4. CHANBW_M 00 01 10 11 00 812 406 203 102 01 650 325 162 81 10 541 270 135 68 11 464 232 116 58 Table 24: Channel Filter Bandwidths [kHz] (assuming a 26 MHz crystal) Page 31 of 92 CC1100E 14 Demodulator, Symbol Synchronizer, and Data Decision The CC1100E contains an advanced and highly configurable demodulator. Channel filtering and frequency offset compensation is performed digitally. To generate the RSSI level (see Section 17.3 for more information), the signal level in the channel is estimated. Data filtering is also included for enhanced performance. 14.1 Frequency Offset Compensation The CC1100E has a very fine frequency resolution (see Table 13). This feature can be used to compensate for frequency offset and drift. When using 2-FSK, GFSK, or MSK modulation, the demodulator will compensate for the offset between the transmitter and receiver frequency within certain limits, by estimating the centre of the received data. The frequency offset compensation configuration is controlled from the FOCCFG register. By compensating for a large frequency offset between the transmitter and the receiver, the sensitivity can be improved, see DN005 [16]. The tracking range of the algorithm is selectable as fractions of the channel bandwidth with the FOCCFG.FOC_LIMIT configuration register. If the FOCCFG.FOC_BS_CS_GATE bit is set, the offset compensator will freeze until carrier sense asserts. This may be useful when the radio is in RX for long periods with no traffic, since the algorithm may drift to the boundaries when trying to track noise. The tracking loop has two gain factors, which affects the settling time and noise sensitivity of the algorithm. FOCCFG.FOC_PRE_K sets the gain before the sync word is detected, and FOCCFG.FOC_POST_K selects the gain after the sync word has been found. Note: Frequency offset compensation is not supported for ASK or OOK modulation. The estimated frequency offset value is available in the FREQEST status register. This can be used for permanent frequency offset compensation. By writing the value from FREQEST into FSCTRL0.FREQOFF, the frequency synthesizer will automatically be adjusted according to the estimated frequency offset. More details regarding this permanent frequency compensation algorithm can be found in DN015 [12]. 14.2 Bit Synchronization The bit synchronization algorithm extracts the clock from the incoming symbols. The algorithm requires that the expected data rate is programmed as described in Section 12 on page 31. Re-synchronization is performed continuously to adjust for error in the incoming symbol rate. 14.3 Byte Synchronization Byte synchronization is achieved by a continuous sync word search. The sync word is a 16 bit configurable field (can be repeated to get a 32 bit) that is automatically inserted at the start of the packet by the modulator in transmit mode. The MSB in the sync word is sent first. The demodulator uses this field to find the byte boundaries in the stream of bits. The sync word will also function as a system identifier; since only packets with the correct predefined sync word will be received if the sync word detection in RX is enabled in register MDMCFG2 (see Section 17.1). The sync word detector correlates against the user-configured 16 or 32 bit sync word. The SWRS082 correlation threshold can be set to 15/16, 16/16, or 30/32 bits match. The sync word can be further qualified using the preamble quality indicator mechanism described below and/or a carrier sense condition. The sync word is configured through the SYNC1 and SYNC0 registers. In order to make false detections of sync words less likely, a mechanism called preamble quality indication (PQI) can be used to qualify the sync word. A threshold value for the preamble quality must be exceeded in order for a detected sync word to be accepted. See Section 17.2 on page 39 for more details. Page 32 of 92 CC1100E 15 Packet Handling Hardware Support The CC1100E has built-in hardware support for packet oriented radio protocols. In transmit mode, the packet handler can be configured to add the following elements to the packet stored in the TX FIFO: A programmable number of preamble bytes A two byte synchronization (sync) word. Can be duplicated to give a 4-byte sync word (recommended). It is not possible to only insert preamble or only insert a sync word A CRC checksum computed over the data field. The recommended setting is 4-byte preamble and 4-byte sync word, except for 500 kBaud data rate where the recommended preamble length is 8 bytes. In addition, the following can be implemented on the data field and the optional 2-byte CRC checksum: Whitening of the data with a PN9 sequence Forward Error Correction (FEC) by the use of interleaving and coding of the data (convolutional coding) In receive mode, the packet handling support will de-construct the data packet by implementing the following (if enabled): Preamble detection Sync word detection CRC computation and CRC check One byte address check Packet length check (length byte checked against a programmable maximum length) De-whitening De-interleaving and decoding Optionally, two status bytes (see Table 25 and Table 26) with RSSI value, Link Quality Indication, and CRC status can be appended in the RX FIFO. Bit Field Name Description 7:0 RSSI RSSI value Table 25: Received Packet Status Byte 1 (first byte appended after the data) Bit Field Name Description 7 CRC_OK 1: CRC for received data OK (or CRC disabled) 0: CRC error in received data 6:0 LQI Indicating the link quality Table 26: Received Packet Status Byte 2 (second byte appended after the data) Note: Register fields that control the packet handling features should only be altered when CC1100E is in the IDLE state. 15.1 Data Whitening From a radio perspective, the ideal over the air data are random and DC free. This results in the smoothest power distribution over the occupied bandwidth. This also gives the regulation loops in the receiver uniform operation conditions (no data dependencies). Real data often contain long sequences of zeros and ones. In these cases, performance can be improved by whitening the data before transmitting, and de-whitening the data in the receiver. SWRS082 With the CC1100E, this can be done automatically. By setting PKTCTRL0.WHITE_DATA=1, all data, except the preamble and the sync word will be XORed with a 9-bit pseudo-random (PN9) sequence before being transmitted. This is shown in Figure 14. At the receiver end, the data are XOR-ed with the same pseudorandom sequence. In this way, the whitening is reversed, and the original data appear in the receiver. The PN9 sequence is initialized to all 1’s. Page 33 of 92 CC1100E Figure 14: Data Whitening in TX Mode 15.2 Packet Format The format of the data packet can be configured and consists of the following items (see Figure 15): Preamble Synchronization word Optional length byte Optional address byte Payload Optional 2 byte CRC Data field 16/32 bits 8 bits 8 bits 8 x n bits Legend: Inserted automatically in TX, processed and removed in RX. CRC-16 Address field 8 x n bits Length field Preamble bits (1010...1010) Sync word Optional data whitening Optionally FEC encoded/decoded Optional CRC-16 calculation Optional user-provided fields processed in TX, processed but not removed in RX. Unprocessed user data (apart from FEC and/or whitening) 16 bits Figure 15: Packet Format The preamble pattern is an alternating sequence of ones and zeros (10101010…). The minimum length of the preamble is programmable through the value of MDMCFG1.NUM_PREAMBLE. When enabling TX, the modulator will start transmitting the preamble. When the programmed number of preamble bytes has been transmitted, the modulator will send the sync word and then data from the TX FIFO if data is available. If the TX FIFO is empty, the modulator will continue to send preamble bytes until the first byte is written to the TX FIFO. The modulator will then send the sync word and then the data bytes. SWRS082 The synchronization word is a two-byte value set in the SYNC1 and SYNC0 registers. The sync word provides byte synchronization of the incoming packet. A one-byte sync word can be emulated by setting the SYNC1 value to the preamble pattern. It is also possible to emulate a 32 bit sync word by setting MDMCFG2.SYNC_MODE to 3 or 7. The sync word will then be repeated twice. The CC1100E supports both constant packet length protocols and variable length protocols. Variable or fixed packet length mode can be used for packets up to 255 bytes. For longer Page 34 of 92 CC1100E packets, infinite packet length mode must be used. Fixed packet length mode is selected by setting PKTCTRL0.LENGTH_CONFIG=0. The desired packet length is set by the PKTLEN register. In variable packet length mode, PKTCTRL0.LENGTH_CONFIG=1, the packet length is configured by the first byte after the sync word. The packet length is defined as the payload data, excluding the length byte and the optional CRC. The PKTLEN register is used to set the maximum packet length allowed in RX. Any packet received with a length byte with a value greater than PKTLEN will be discarded. With PKTCTRL0.LENGTH_CONFIG=2, the packet length is set to infinite and transmission and reception will continue until turned off manually. As described in the next section, this can be used to support packet formats with different length configuration than natively supported by the CC1100E. One should make sure that TX mode is not turned off during the transmission of the first half of any byte. Refer to the CC1100E Errata Note [5] for more details. Note: The minimum packet length supported (excluding the optional length byte and CRC) is one byte of payload data. 15.2.1 Arbitrary Length Field Configuration The packet length register, PKTLEN, can be reprogrammed during receive and transmit. In combination with fixed packet length mode (PKTCTRL0.LENGTH_CONFIG=0), this opens the possibility to have a different length field configuration than supported for variable length packets (in variable packet length mode the length byte is the first byte after the sync word). At the start of reception, the packet length is set to a large value. The MCU reads out enough bytes to interpret the length field in the packet. Then the PKTLEN value is set according to this value. The end of packet will occur when the byte counter in the packet SWRS082 handler is equal to the PKTLEN register. Thus, the MCU must be able to program the correct length, before the internal counter reaches the packet length. 15.2.2 Packet Length > 255 The packet automation control register, PKTCTRL0, can be reprogrammed during TX and RX. This opens the possibility to transmit and receive packets that are longer than 256 bytes and still be able to use the packet handling hardware support. At the start of the packet, the infinite packet length mode (PKTCTRL0.LENGTH_CONFIG=2) must be active. On the TX side, the PKTLEN register is set to mod (length, 256). On the RX side the MCU reads out enough bytes to interpret the length field in the packet and sets the PKTLEN register to mod (length, 256). When less than 256 bytes remains of the packet, the MCU disables infinite packet length mode and activates fixed packet length mode. When the internal byte counter reaches the PKTLEN value, the transmission or reception ends (the radio enters the state determined by TXOFF_MODE or RXOFF_MODE). Automatic CRC appending/checking can also be used (by setting PKTCTRL0.CRC_EN=1). When for example a 600-byte packet is to be transmitted, the MCU should do the following (see also Figure 16) Set PKTCTRL0.LENGTH_CONFIG=2. Pre-program the PKTLEN register to mod (600, 256) = 88. Transmit at least 345 bytes (600 - 255), for example by filling the 64-byte TX FIFO six times (384 bytes transmitted). Set PKTCTRL0.LENGTH_CONFIG=0. The transmission ends when the packet counter reaches 88. A total of 600 bytes are transmitted. Page 35 of 92 CC1100E Internal byte counter in packet handler counts from 0 to 255 and then starts at 0 again 0,1,..........,88,....................255,0,........,88,..................,255,0,........,88,..................,255,0,....................... Infinite packet length enabled Fixed packet length enabled when less than 256 bytes remains of packet 600 bytes transmitted and received Length field transmitted and received. Rx and Tx PKTLEN value set to mod(600,256) = 88 Figure 16: Packet Length > 255 15.3 Packet Filtering in Receive Mode The CC1100E supports three different types of packet-filtering; address filtering, maximum length filtering, and CRC filtering. length. If the received length byte has a larger value than this, the packet is discarded and receive mode restarted (regardless of the MCSM1.RXOFF_MODE setting). 15.3.1 Address Filtering Setting PKTCTRL1.ADR_CHK to any other value than zero enables the packet address filter. The packet handler engine will compare the destination address byte in the packet with the programmed node address in the ADDR register and the 0x00 broadcast address when PKTCTRL1.ADR_CHK=10 or both the 0x00 and 0xFF broadcast addresses when PKTCTRL1.ADR_CHK=11. If the received address matches a valid address, the packet is received and written into the RX FIFO. If the address match fails, the packet is discarded and receive mode restarted (regardless of the MCSM1.RXOFF_MODE setting). If the received address matches a valid address when using infinite packet length mode and address filtering is enabled, 0xFF will be written into the RX FIFO followed by the address byte and then the payload data. 15.3.2 Maximum Length Filtering In variable packet length mode, PKTCTRL0.LENGTH_CONFIG=1, the PKTLEN.PACKET_LENGTH register value is used to set the maximum allowed packet 15.3.3 CRC Filtering The filtering of a packet when CRC check fails is enabled by setting PKTCTRL1.CRC_AUTOFLUSH=1. The CRC auto flush function will flush the entire RX FIFO if the CRC check fails. After auto flushing the RX FIFO, the next state depends on the MCSM1.RXOFF_MODE setting. When using the auto flush function, the maximum packet length is 63 bytes in variable packet length mode and 64 bytes in fixed packet length mode. Note that when PKTCTRL1.APPEND_STATUS is enabled, the maximum allowed packet length is reduced by two bytes in order to make room in the RX FIFO for the two status bytes appended at the end of the packet. Since the entire RX FIFO is flushed when the CRC check fails, the previously received packet must be read out of the FIFO before receiving the current packet. The MCU must not read from the current packet until the CRC has been checked as OK. 15.4 Packet Handling in Transmit Mode The payload that is to be transmitted must be written into the TX FIFO. The first byte written must be the length byte when variable packet length is enabled. The length byte has a value equal to the payload of the packet (including the optional address byte). If address recognition is enabled on the receiver, the SWRS082 second byte written to the TX FIFO must be the address byte. If fixed packet length is enabled, the first byte written to the TX FIFO should be the address (assuming the receiver uses address recognition). Page 36 of 92 CC1100E The modulator will first send the programmed number of preamble bytes. If data is available in the TX FIFO, the modulator will send the two-byte (optionally 4-byte) sync word followed by the payload in the TX FIFO. If CRC is enabled, the checksum is calculated over all the data pulled from the TX FIFO, and the result is sent as two extra bytes following the payload data. If the TX FIFO runs empty before the complete packet has been transmitted, the radio will enter TXFIFO_UNDERFLOW state. The only way to exit this state is by issuing an SFTX strobe. Writing to the TX FIFO after it has underflowed will not restart TX mode. If whitening is enabled, everything following the sync words will be whitened. This is done before the optional FEC/Interleave stage. Whitening is enabled by setting PKTCTRL0.WHITE_DATA=1. If FEC/Interleaving is enabled, everything following the sync words will be scrambled by the interleave and FEC encoded before being modulated. FEC is enabled by setting MDMCFG1.FEC_EN=1. 15.5 Packet Handling in Receive Mode In receive mode, the demodulator and packet handler will search for a valid preamble and the sync word. When found, the demodulator has obtained both bit and byte synchronism and will receive the first payload byte. If FEC/Interleaving is enabled, the FEC decoder will start to decode the first payload byte. The interleaver will de-scramble the bits before any other processing is done to the data. If whitening is enabled, the data will be dewhitened at this stage. When variable packet length mode is enabled, the first byte is the length byte. The packet handler stores this value as the packet length and receives the number of bytes indicated by the length byte. If fixed packet length mode is used, the packet handler will accept the programmed number of bytes. Next, the packet handler optionally checks the address and only continues the reception if the address matches. If automatic CRC check is enabled, the packet handler computes CRC and matches it with the appended CRC checksum. At the end of the payload, the packet handler will optionally write two extra packet status bytes (see Table 25 and Table 26) that contain CRC status, link quality indication, and RSSI value. 15.6 Packet Handling in Firmware When implementing a packet oriented radio protocol in firmware, the MCU needs to know when a packet has been received/transmitted. Additionally, for packets longer than 64 bytes, the RX FIFO needs to be read while in RX and the TX FIFO needs to be refilled while in TX. This means that the MCU needs to know the number of bytes that can be read from or written to the RX FIFO and TX FIFO respectively. There are two possible solutions to get the necessary status information: a) Interrupt Driven Solution The GDO pins can be used in both RX and TX to give an interrupt when a sync word has been received/transmitted or when a complete packet has been received/transmitted by setting IOCFGx.GDOx_CFG=0x06. In addition, there are two configurations for the IOCFGx.GDOx_CFG register that can be used as an interrupt source to provide information on how many bytes are in the RX FIFO and SWRS082 TX FIFO respectively. The IOCFGx.GDOx_CFG=0x00 and the IOCFGx.GDOx_CFG=0x01 configurations are associated with the RX FIFO while the IOCFGx.GDOx_CFG=0x02 and the IOCFGx.GDOx_CFG=0x03 configurations are associated with the TX FIFO. See Table 36 for more information. b) SPI Polling The PKTSTATUS register can be polled at a given rate to get information about the current GDO2 and GDO0 values respectively. The RXBYTES and TXBYTES registers can be polled at a given rate to get information about the number of bytes in the RX FIFO and TX FIFO respectively. Alternatively, the number of bytes in the RX FIFO and TX FIFO can be read from the chip status byte returned on the MISO line each time a header byte, data byte, or command strobe is sent on the SPI bus. Page 37 of 92 CC1100E It is recommended to employ an interrupt driven solution since high rate SPI polling reduces the RX sensitivity. Furthermore, as explained in Section 10.3 and the CC1100E Errata Note [5], when using SPI polling, there is a small, but finite, probability that a single read from registers PKTSTATUS , RXBYTES and TXBYTES is being corrupt. The same is the case when reading the chip status byte. Refer to the TI website for SW examples ([9] and [10]). 16 Modulation Formats The CC1100E supports amplitude, frequency, and phase shift modulation formats. The desired modulation format is set in the MDMCFG2.MOD_FORMAT register. Optionally, the data stream can be Manchester coded by the modulator and decoded by the demodulator. This option is enabled by setting MDMCFG2.MANCHESTER_EN=1. Note: Manchester encoding is not supported at the same time as using the FEC/Interleaver option or when using MSK modulation. 16.1 Frequency Shift Keying The CC1100E has the possibility to use Gaussian shaped 2-FSK (GFSK). The 2-FSK signal is then shaped by a Gaussian filter with BT = 1, producing a GFSK modulated signal. This spectrum-shaping feature improves adjacent channel power (ACP) and occupied bandwidth. In ‘true’ 2-FSK systems with abrupt frequency shifting, the spectrum is inherently broad. By making the frequency shift ‘softer’, the spectrum can be made significantly narrower. Thus, higher data rates can be transmitted in the same bandwidth using GFSK. When 2-FSK/GFSK modulation is used, the DEVIATN register specifies the expected frequency deviation of incoming signals in RX and should be the same as the TX deviation for demodulation to be performed reliably and robustly. The frequency deviation is programmed with the DEVIATION_M and DEVIATION_E values in the DEVIATN register. The value has an exponent/mantissa form, and the resultant deviation is given by: f dev f xosc (8 DEVIATION _ M ) 2 DEVIATION _ E 217 The symbol encoding is shown in Table 27. Format Symbol Coding ‘0’ – Deviation ‘1’ + Deviation 2-FSK/GFSK Table 27: Symbol Encoding for 2-FSK/GFSK Modulation 16.2 Minimum Shift Keying 1 When using MSK , the complete transmission (preamble, sync word, and payload) will be MSK modulated. This is equivalent to changing the shaping of the symbol. The DEVIATN register setting has no effect in RX when using MSK. Phase shifts are performed with a constant transition time. The fraction of a symbol period used to change the phase can be modified with the DEVIATN.DEVIATION_M setting. When using MSK, Manchester encoding/decoding should be disabled by setting MDMCFG2 MANCHESTER_EN = 0 1 Identical to offset QPSK with half-sine shaping (data coding may differ). SWRS082 The MSK modulation format implemented in the CC1100E inverts the sync word and data compared to e.g. signal generators. Page 38 of 92 CC1100E 16.3 Amplitude Modulation The CC1100E supports two different forms of amplitude modulation: On-Off Keying (OOK) and Amplitude Shift Keying (ASK). OOK modulation simply turns the PA on or off to modulate ones and zeros respectively. The ASK variant supported by the CC1100E allows programming of the modulation depth (the difference between 1 and 0), and shaping of the pulse amplitude. Pulse shaping produces a more output spectrum. bandwidth constrained When using OOK/ASK, the AGC settings from ® the SmartRF Studio [8] preferred FSK/MSK settings are not optimum. DN022 [15] give guidelines on how to find optimum OOK/ASK settings from the preferred settings in ® SmartRF Studio [8]. The DEVIATN register setting has no effect in either TX or RX when using OOK/ASK. 17 Received Signal Qualifiers and Link Quality Information The CC1100E has several qualifiers that can be used to increase the likelihood that a valid sync word is detected: RSSI Sync Word Qualifier Clear Channel Assessment Preamble Quality Threshold Link Quality Indicator 17.1 Carrier Sense Sync Word Qualifier If sync word detection in RX is enabled in the MDMCFG2 register, the CC1100E will not start filling the RX FIFO and perform the packet filtering described in Section 15.3 before a valid sync word has been detected. The sync word qualifier mode is set by MDMCFG2.SYNC_MODE and is summarized in Table 28. Carrier sense in Table 28 is described in Section 17.4. MDMCFG2. Sync Word Qualifier Mode SYNC_MODE 000 No preamble/sync 001 15/16 sync word bits detected 010 16/16 sync word bits detected 011 30/32 sync word bits detected 100 No preamble/sync + carrier sense above threshold 101 15/16 + carrier sense above threshold 110 16/16 + carrier sense above threshold 111 30/32 + carrier sense above threshold Table 28: Sync Word Qualifier Mode 17.2 Preamble Quality Threshold (PQT) The Preamble Quality Threshold (PQT) sync word qualifier adds the requirement that the received sync word must be preceded with a preamble with a quality above the programmed threshold. Another use of the preamble quality threshold is as a qualifier for the optional RX termination timer. See Section 19.7 on page 49 for details. The preamble quality estimator increases an internal counter by one each time a bit is received that is different from the previous bit, and decreases the counter by eight each time a bit is received that is the same as the last bit. SWRS082 The threshold is configured with the register field PKTCTRL1.PQT. A threshold of 4∙PQT for this counter is used to gate sync word detection. By setting the value to zero, the preamble quality qualifier of the sync word is disabled. A “Preamble Quality Reached” signal can be observed on one of the GDO pins by setting IOCFGx.GDOx_CFG=8. It is also possible to determine if preamble quality is reached by checking the PQT_REACHED bit in the PKTSTATUS register. This signal / bit asserts when the received signal exceeds the PQT. Page 39 of 92 CC1100E 17.3 RSSI The RSSI value is an estimate of the signal power level in the chosen channel. This value is based on the current gain setting in the RX chain and the measured signal level in the channel. In RX mode, the RSSI value can be read continuously from the RSSI status register until the demodulator detects a sync word (when sync word detection is enabled). At that point the RSSI readout value is frozen until the next time the chip enters the RX state. The RSSI value read from the RSSI status register is a 2’s complement number. The following procedure can be used to convert the RSSI reading to an absolute power level (RSSI_dBm) 1) Read the RSSI status register 2) Convert the reading from a hexadecimal number to a decimal number (RSSI_dec) Note: It takes some time from the radio enters RX mode until a valid RSSI value is present in the RSSI register. Please see DN505 [13] for details on how the RSSI response time can be estimated. 3) If RSSI_dec ≥ 128 then RSSI_dBm = (RSSI_dec - 256)/2 – RSSI_offset 4) Else if RSSI_dec < 128 then RSSI_dBm = (RSSI_dec)/2 – RSSI_offset The RSSI value is given in dBm with a ½ dB resolution. The RSSI update rate, fRSSI, depends on the receiver filter bandwidth (BW channel is defined in Section 13) and AGCCTRL0.FILTER_LENGTH. f RSSI If PKTCTRL1.APPEND_STATUS is enabled, the last RSSI value of the packet is automatically added to the first byte appended after the payload. Table 29 gives typical values for the RSSI_offset. Figure 17 and Figure 18 show typical plots of RSSI readings as a function of input power level for different data rates. 2 BWchannel 8 2 FILTER _ LENGTH Data rate [kBaud] RSSI_offset [dB], 490 MHz RSSI_offset [dB], 955 MHz 1.2 75 75 38.4 75 75 76.8 N/A 79 250 79 N/A Table 29: Typical RSSI_offset Values SWRS082 Page 40 of 92 CC1100E 0 -10 -20 RSSI Readout (dBm) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 Input Power (dBm) 1.2 kBaud 38.4 kBaud 250 kBaud Figure 17: Typical RSSI Value vs. Input Power Level for Different Data Rates at 480 MHz 0.00 -10.00 -20.00 RSSI Readout (dBm) -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 -110.00 -120.00 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 Input Power (dBm) 1.2 kBaud 38.4 kBaud 76.8 kBaud Figure 18: Typical RSSI Value vs. Input Power Level for Different Data Rates at 955 MHz 17.4 Carrier Sense (CS) Carrier sense (CS) is used as a sync word qualifier and for Clear Channel Assessment (see Section 17.5). CS can be asserted based on two conditions which can be individually adjusted: CS is asserted when the RSSI is above a programmable absolute threshold, and deasserted when RSSI is below the same SWRS082 threshold (with hysteresis). See more in Section 17.4.1. CS is asserted when the RSSI has increased with a programmable number of dB from one RSSI sample to the next, and de-asserted when RSSI has decreased with the same number of dB. This setting is not dependent on the absolute signal Page 41 of 92 CC1100E level and is thus useful to detect signals in environments with time varying noise floor. See more in Section 17.4.2. Other uses of Carrier sense include the TX-ifCCA function (see Section 17.5 on page 43) and the optional fast RX termination (see Section 19.7 on page 49). CS can be used to avoid interference from other RF sources in the ISM bands. MAX_LNA_GAIN[2:0] Carrier sense can be used as a sync word qualifier that requires the signal level to be higher than the threshold for a sync word search to be performed and is set by setting MDMCFG2 The carrier sense signal can be observed on one of the GDO pins by setting IOCFGx.GDOx_CFG=14 and in the status register bit PKTSTATUS.CS. MAX_DVGA_GAIN[1:0] 00 01 10 11 000 -97.5 -91.5 -85.5 -79.5 001 -94 -88 -82.5 -76 010 -90.5 -84.5 -78.5 -72.5 011 -88 -82.5 -76.5 -70.5 100 -85.5 -80 -73.5 -68 101 -84 -78 -72 -66 110 -82 -76 -70 -64 111 -79 -73.5 -67 -61 Table 30: Typical RSSI Value in dBm at CS Threshold with Default MAGN_TARGET at 2.4 kBaud, 955 MHz MAX_DVGA_GAIN[1:0] 00 01 10 11 000 -90.5 -84.5 -78.5 -72.5 001 -88 -82 -76 -70 010 -84.5 -78.5 -72 -66 011 -82.5 -76.5 -70 -64 100 -80.5 -74.5 -68 -62 101 -78 -72 -66 -60 110 -76.5 -70 -64 -58 111 -74.5 -68 -62 -56 The absolute threshold related to the RSSI value depends on the following register fields: AGCCTRL2.MAX_LNA_GAIN AGCCTRL2.MAX_DVGA_GAIN AGCCTRL1.CARRIER_SENSE_ABS_THR AGCCTRL2.MAGN_TARGET For given AGCCTRL2.MAX_LNA_GAIN and AGCCTRL2.MAX_DVGA_GAIN settings, the absolute threshold can be adjusted ±7 dB in steps of 1 dB using CARRIER_SENSE_ABS_THR. The MAGN_TARGET setting is a compromise between blocker tolerance/selectivity and sensitivity. The value sets the desired signal level in the channel into the demodulator. Increasing this value reduces the headroom for blockers, and therefore close-in selectivity. ® It is strongly recommended to use SmartRF Studio [8] to generate the correct MAGN_TARGET setting. Table 30 and Table 31 show the typical RSSI readout values at the CS threshold at 2.4 kBaud and 250 kBaud data rate respectively. The default CARRIER_SENSE_ABS_THR=0 (0 dB) and MAGN_TARGET=3 (33 dB) have been used. For other data rates, the user must generate similar tables to find the CS absolute threshold. SWRS082 MAX_LNA_GAIN[2:0] 17.4.1 CS Absolute Threshold Table 31: Typical RSSI Value in dBm at CS Threshold with Default MAGN_TARGET at 250 kBaud, 955 MHz If the threshold is set high, i.e. only strong signals are wanted; the threshold should be adjusted upwards by first reducing the MAX_LNA_GAIN value and then the MAX_DVGA_GAIN value. This will reduce power consumption in the receiver front end, since the highest gain settings are avoided. 17.4.2 CS Relative Threshold The relative threshold detects sudden changes in the measured signal level. This setting does not depend on the absolute signal level and is thus useful to detect signals in environments with a time varying noise floor. The register field AGCCTRL1.CARRIER_SENSE_REL_THR is used to enable/disable relative CS, and to select threshold of 6 dB, 10 dB, or 14 dB RSSI change. Page 42 of 92 CC1100E 17.5 Clear Channel Assessment (CCA) The Clear Channel Assessment (CCA) is used to indicate if the current channel is free or busy. The current CCA state is viewable on any of the GDO pins by setting IOCFGx.GDOx_CFG=0x09. not enter TX or FSTXON state before a new strobe command is sent on the SPI interface. This feature is called TX-if-CCA. Four CCA requirements can be programmed: Always (CCA disabled, always goes to TX) MCSM1.CCA_MODE selects the mode to use when determining CCA. If RSSI is below threshold Unless currently receiving a packet Both the above (RSSI below threshold and not currently receiving a packet) When the STX or SFSTXON command strobe is given while the CC1100E is in the RX state, the TX or FSTXON state is only entered if the clear channel requirements are fulfilled. Otherwise, the chip will remain in RX. If the channel then becomes available, the radio will 17.6 Link Quality Indicator (LQI) The Link Quality Indicator is a metric of the current quality of the received signal. If PKTCTRL1.APPEND_STATUS is enabled, the value is automatically added to the last byte appended after the payload. The value can also be read from the LQI status register. The LQI gives an estimate of how easily a received signal can be demodulated by accumulating the magnitude of the error between ideal constellations and the received signal over the 64 symbols immediately following the sync word. LQI is best used as a relative measurement of the link quality (a high value indicates a better link than what a low value does), since the value is dependent on the modulation format. 18 Forward Error Correction with Interleaving 18.1 Forward Error Correction (FEC) The CC1100E has built in support for Forward Error Correction (FEC). To enable this option, set MDMCFG1.FEC_EN to 1. FEC is only supported in fixed packet length mode, i.e. when PKTCTRL0.LENGTH_CONFIG=0. FEC is employed on the data field and CRC word in order to reduce the gross bit error rate when operating near the sensitivity limit. Redundancy is added to the transmitted data in such a way that the receiver can restore the original data in the presence of some bit errors. phenomena will produce occasional errors even in otherwise good reception conditions. FEC will mask such errors and, combined with interleaving of the coded data, even correct relatively long periods of faulty reception (burst errors). The use of FEC allows correct reception at a lower Signal-to-Noise Ratio (SNR), thus extending communication range if the receiver bandwidth remains constant. Alternatively, for a given SNR, using FEC decreases the bit error rate (BER). The packet error rate (PER) is related to BER by The convolutional coder is a rate ½ code with a constraint length of m = 4. The coder codes one input bit and produces two output bits; hence, the effective data rate is halved. This means that in order to transmit at the same effective data rate when using FEC, it is necessary to use twice as high over-the-air data rate. This will require a higher receiver bandwidth, and thus reduce sensitivity. In other words the improved reception by using FEC and the degraded sensitivity from a higher receiver bandwidth will be counteracting factors. Please see Design Note DN504 [18] for more information PER 1 (1 BER) packet _ length A lower BER can therefore be used to allow longer packets, or a higher percentage of packets of a given length, to be transmitted successfully. Finally, in realistic ISM radio environments, transient and time-varying SWRS082 The FEC scheme adopted for the CC1100E is convolutional coding, in which n bits are generated based on k input bits and the m most recent input bits, forming a code stream able to withstand a certain number of bit errors between each coding state (the m-bit window). Page 43 of 92 CC1100E 18.2 Interleaving Data received through radio channels will often experience burst errors due to interference and time-varying signal strengths. In order to increase the robustness to errors spanning multiple bits, interleaving is used when FEC is enabled. After de-interleaving, a continuous span of errors in the received stream will become single errors spread apart. passed onto the convolutional decoder is read from the columns of the matrix. When FEC and interleaving is used, at least one extra byte is required for trellis termination. In addition, the amount of data transmitted over the air must be a multiple of the size of the interleaver buffer (two bytes). The packet control hardware therefore automatically inserts one or two extra bytes at the end of the packet, so that the total length of the data to be interleaved is an even number. Note that these extra bytes are invisible to the user, as they are removed before the received packet enters the RX FIFO. The CC1100E employs matrix interleaving, which is illustrated in Figure 19. The on-chip interleaving and de-interleaving buffers are 4 x 4 matrices. In the transmitter, the data bits from the rate ½ convolutional coder are written into the rows of the matrix, whereas the bit sequence to be transmitted is read from the columns of the matrix. Conversely, in the receiver, the received symbols are written into the rows of the matrix, whereas the data When FEC and interleaving is used the minimum data payload is 2 bytes. Interleaver Write buffer Packet Engine Interleaver Read buffer FEC Encoder Modulator Interleaver Write buffer Interleaver Read buffer FEC Decoder Demodulator Packet Engine Figure 19: General Principle of Matrix Interleaving SWRS082 Page 44 of 92 CC1100E 19 Radio Control SIDLE SPWD | SWOR SLEEP 0 CAL_COMPLETE MANCAL 3,4,5 IDLE 1 CSn = 0 | WOR SXOFF SCAL CSn = 0 XOFF 2 SRX | STX | SFSTXON | WOR FS_WAKEUP 6,7 FS_AUTOCAL = 01 & SRX | STX | SFSTXON | WOR FS_AUTOCAL = 00 | 10 | 11 & SRX | STX | SFSTXON | WOR SETTLING 9,10,11 SFSTXON CALIBRATE 8 CAL_COMPLETE FSTXON 18 STX SRX STX TXOFF_MODE=01 SFSTXON | RXOFF_MODE = 01 STX | RXOFF_MODE = 10 TXOFF_MODE = 10 SRX | WOR RXTX_SETTLING 21 TX 19,20 SRX | TXOFF_MODE = 11 TXOFF_MODE = 00 & FS_AUTOCAL = 00 | 01 RX 13,14,15 RXOFF_MODE = 11 TXRX_SETTLING 16 RXOFF_MODE = 00 & FS_AUTOCAL = 10 | 11 TXOFF_MODE = 00 & FS_AUTOCAL = 10 | 11 TXFIFO_UNDERFLOW ( STX | SFSTXON ) & CCA | RXOFF_MODE = 01 | 10 CALIBRATE 12 TX_UNDERFLOW 22 SFTX RXOFF_MODE = 00 & FS_AUTOCAL = 00 | 01 RXFIFO_OVERFLOW RX_OVERFLOW 17 SFRX IDLE 1 Figure 20: Complete Radio Control State Diagram The CC1100E has a built-in state machine that is used to switch between different operational states (modes). The change of state is done either by using command strobes or by internal events such as TX FIFO underflow. shown in Figure 9 on page 24. The complete radio control state diagram is shown in Figure 20. The numbers refer to the state number readable in the MARCSTATE status register. This register is primarily for test purposes. A simplified state diagram, together with typical usage and current consumption, is 19.1 Power-On Start-Up Sequence When the power supply is turned on, the system must be reset. This is achieved by one of the two sequences described below, i.e. Automatic power-on reset (POR) or manual SWRS082 reset. After the automatic power-on reset or manual reset, it is also recommended to change the signal that is output on the GDO0 pin. The default setting is to output a clock Page 45 of 92 CC1100E signal with a frequency of CLK_XOSC/192. However, to optimize performance in TX and RX, an alternative GDO setting from the settings found in Table 36 on page 55 should be selected. manual power-up sequence is as follows (see Figure 22): Set SCLK = 1 and SI = 0, to avoid potential problems with pin control mode (see Section 11.3 on page 30). 19.1.1 Automatic POR Strobe CSn low / high. A power-on reset circuit is included in the CC1100E. The minimum requirements stated in Table 16 must be followed for the power-on reset to function properly. The internal powerup sequence is completed when CHIP_RDYn goes low. CHIP_RDYn is observed on the SO pin after CSn is pulled low. See Section 10.1 for more details on CHIP_RDYn. Hold CSn low and then high for at least 40 µs relative to pulling CSn low Pull CSn low and wait for SO to go low (CHIP_RDYn). Issue the SRES strobe on the SI line. When SO goes low again, reset is complete and the chip is in the IDLE state. When the CC1100E reset is completed, the chip will be in the IDLE state and the crystal oscillator will be running. If the chip has had sufficient time for the crystal oscillator to stabilize after the power-on-reset, the SO pin will go low immediately after taking CSn low. If CSn is taken low before reset is completed, the SO pin will first go high, indicating that the crystal oscillator is not stabilized, before going low as shown in Figure 21. Figure 22: Power-On Reset with SRES Note that the above reset procedure is only required just after the power supply is first turned on. If the user wants to reset the CC1100E after this, it is only necessary to issue an SRES command strobe. Figure 21: Power-On Reset 19.1.2 Manual Reset The other global reset possibility on the CC1100E uses the SRES command strobe. By issuing this strobe, all internal registers and states are set to the default, IDLE state. The 19.2 Crystal Control The crystal oscillator (XOSC) is either automatically controlled or always on, if MCSM0.XOSC_FORCE_ON is set. In the automatic mode, the XOSC will be turned off if the SXOFF or SPWD command strobes are issued; the state machine then goes to XOFF or SLEEP respectively. This can only be done from the IDLE state. The XOSC will be turned off when CSn is released (goes high). The XOSC will be automatically turned on again when CSn goes low. The SWRS082 state machine will then go to the IDLE state. The SO pin on the SPI interface must be pulled low before the SPI interface is ready to be used as described in Section 10.1 on page 27. If the XOSC is forced on, the crystal will always stay on even in the SLEEP state. Crystal oscillator start-up time depends on crystal ESR and load capacitances. The electrical specification for the crystal oscillator can be found in Section 4.4 on page 14. Page 46 of 92 CC1100E 19.3 Voltage Regulator Control The voltage regulator to the digital core is controlled by the radio controller. When the chip enters the SLEEP state which is the state with the lowest current consumption, the voltage regulator is disabled. This occurs after CSn is released when a SPWD command strobe has been sent on the SPI interface. The chip is then in the SLEEP state. Setting CSn low again will turn on the regulator and crystal oscillator and make the chip enter the IDLE state. When Wake on Radio is enabled, the WOR module will control the voltage regulator as described in Section19.5. 19.4 Active Modes The CC1100E has two active modes: receive and transmit. These modes are activated directly by the MCU by using the SRX and STX command strobes, or automatically by Wake on Radio. The frequency synthesizer must be calibrated regularly. The CC1100E has one manual calibration option (using the SCAL strobe), and three automatic calibration options that are controlled by the MCSM0.FS_AUTOCAL setting: Calibrate when going from IDLE to either RX or TX (or FSTXON) Calibrate when going from either RX or TX to IDLE automatically Calibrate every fourth time when going from either RX or TX to IDLE automatically If the radio goes from TX or RX to IDLE by issuing an SIDLE strobe, calibration will not be performed. The calibration takes a constant number of XOSC cycles; see Table 32 for timing details regarding calibration. When RX is activated, the chip will remain in receive mode until a packet is successfully received or the RX termination timer expires (see Section 19.7). The probability that a false sync word is detected can be reduced by using PQT, CS, maximum sync word length, and sync word qualifier mode as described in Section 17. After a packet is successfully received, the radio controller goes to the state indicated by the MCSM1.RXOFF_MODE setting. The possible destinations are: IDLE FSTXON: Frequency synthesizer on and ready at the TX frequency. Activate TX with STX TX: Start sending preamble SWRS082 RX: Start search for a new packet Note: When MCSM1.RXOFF_MODE=11 and a packet has been received, it will take some time before a valid RSSI value is present in the RSSI register again even if the radio has never exited RX mode. This time is the same as the RSSI response time discussed in DN505 [13]. Similarly, when TX is active the chip will remain in the TX state until the current packet has been successfully transmitted. Then the state will change as indicated by the MCSM1.TXOFF_MODE setting. The possible destinations are the same as for RX. The MCU can manually change the state from RX to TX and vice versa by using the command strobes. If the radio controller is currently in transmit and the SRX strobe is used, the current transmission will be ended and the transition to RX will be done. If the radio controller is in RX when the STX or SFSTXON command strobes are used, the TXif-CCA function will be used. If the channel is not clear, the chip will remain in RX. The MCSM1.CCA_MODE setting controls the conditions for clear channel assessment. See Section 17.5 on page 43 for details. The SIDLE command strobe can always be used to force the radio controller to go to the IDLE state. Page 47 of 92 CC1100E 19.5 Wake On Radio (WOR) The optional Wake on Radio (WOR) functionality enables the CC1100E to periodically wake up from SLEEP and listen for incoming packets without MCU interaction. When the SWOR strobe command is sent on the SPI interface, the CC1100E will go to the SLEEP state when CSn is released. The RC oscillator must be enabled before the SWOR strobe can be used, as it is the clock source for the WOR timer. The on-chip timer will set the CC1100E into IDLE state and then RX state. After a programmable time in RX, the chip will go back to the SLEEP state, unless a packet is received. See Figure 23 and Section 19.7 for details on how the timeout works. To exit WOR mode, set the CC1100E into the IDLE state The CC1100E can be set up to signal the MCU that a packet has been received by using the GDO pins. If a packet is received, the MCSM1.RXOFF_MODE will determine the behaviour at the end of the received packet. When the MCU has read the packet, it can put the chip back into SLEEP with the SWOR strobe from the IDLE state. Note: The FIFO looses its content in the SLEEP state. Figure 23: Event 0 and Event 1 Relationship The time from the CC1100E enters SLEEP state until the next Event0 is programmed to appear, tSLEEP in Figure 23, should be larger than 11.08 ms when using a 26 MHz crystal and 10.67 ms when a 27 MHz crystal is used. If tSLEEP is less than 11.08 (10.67) ms, there is a chance that the consecutive Event 0 will occur 750 128 seconds f XOSC too early. Application Note AN047 [7] explains in detail the theory of operation and the different registers involved when using WOR, as well as highlighting important aspects when using WOR mode. 19.5.1 RC Oscillator and Timing The WOR timer has two events, Event 0 and Event 1. In the SLEEP state with WOR activated, reaching Event 0 will turn on the digital regulator and start the crystal oscillator. Event 1 follows Event 0 after a programmed timeout. The time between two consecutive Event 0 is programmed with a mantissa value given by WOREVT1.EVENT0 and WOREVT0.EVENT0, and an exponent value set by WORCTRL.WOR_RES. The equation is: t Event 0 750 EVENT 0 2 5WOR _ RES f XOSC The Event 1 timeout is programmed with WORCTRL.EVENT1. Figure 23 shows the timing relationship between Event 0 timeout and Event 1 timeout. SWRS082 The frequency of the low-power RC oscillator used for the WOR functionality varies with temperature and supply voltage. In order to keep the frequency as accurate as possible, the RC oscillator will be calibrated whenever possible, which is when the XOSC is running and the chip is not in the SLEEP state. When the power and XOSC are enabled, the clock used by the WOR timer is a divided XOSC clock. When the chip goes to the sleep state, the RC oscillator will use the last valid calibration result. The frequency of the RC oscillator is locked to the main crystal frequency divided by 750. In applications where the radio wakes up very often, typically several times every second, it is possible to do the RC oscillator calibration once and then turn off calibration to reduce the current consumption. This is done by setting WORCTRL.RC_CAL=0 and requires that RC oscillator calibration values are read from registers RCCTRL0_STATUS and RCCTRL1_STATUS and written back to RCCTRL0 and RCCTRL1 respectively. If the Page 48 of 92 CC1100E RC oscillator calibration is turned off, it will have to be manually turned on again if the temperature and/or the supply voltage changes. Refer to Application Note AN047 [7] for further details. 19.6 Timing The radio controller controls most of the timing in the CC1100E, such as synthesizer calibration, PLL lock time, and RX/TX turnaround times. Timing from IDLE to RX and IDLE to TX is constant, dependent on the auto calibration setting. RX/TX and TX/RX turnaround times are constant. The calibration time is constant 18739 clock periods. Table 32 shows timing in crystal clock cycles for key state transitions. Power on time and XOSC start-up times are variable, but within the limits stated in Table 11. Note that in a frequency hopping spread spectrum or a multi-channel protocol the calibration time can be reduced from 721 µs to approximately 150 µs. This is explained in Section 28.2. Description XOSC Periods 26 MHz Crystal IDLE to RX, no calibration 2298 88.4μs IDLE to RX, with calibration ~21037 809μs IDLE to TX/FSTXON, no calibration 2298 88.4μs IDLE to TX/FSTXON, with calibration ~21037 809μs TX to RX switch 560 21.5μs RX to TX switch 250 9.6μs RX or TX to IDLE, no calibration 2 0.1μs RX or TX to IDLE, with calibration ~18739 721μs Manual calibration ~18739 721μs Table 32: State Transition Timing 19.7 RX Termination Timer The CC1100E has optional functions for automatic termination of RX after a programmable time. The main use for this functionality is Wake on Radio, but it may also be useful for other applications. The termination timer starts when in RX state. The timeout is programmable with the MCSM2.RX_TIME setting. When the timer expires, the radio controller will check the condition for staying in RX; if the condition is not met, RX will terminate. The programmable conditions are: MCSM2.RX_TIME_QUAL=0: Continue receive if sync word has been found MCSM2.RX_TIME_QUAL=1: Continue receive if sync word has been found, or if the preamble quality is above threshold (PQT) If the system expects the transmission to have started when enabling the receiver, the MCSM2.RX_TIME_RSSI function can be used. The radio controller will then terminate RX if the first valid carrier sense sample indicates no carrier (RSSI below threshold). See Section 17.4 on page 41 for details on Carrier Sense. SWRS082 For ASK/OOK modulation, lack of carrier sense is only considered valid after eight symbol periods. Thus, the MCSM2.RX_TIME_RSSI function can be used in ASK/OOK mode when the distance between “1” symbols is eight or less. If RX terminates due to no carrier sense when the MCSM2.RX_TIME_RSSI function is used, or if no sync word was found when using the MCSM2.RX_TIME timeout function, the chip will always go back to IDLE if WOR is disabled and back to SLEEP if WOR is enabled. Otherwise, the MCSM1.RXOFF_MODE setting determines the state to go to when RX ends. This means that the chip will not automatically go back to SLEEP once a sync word has been received. It is therefore recommended to always wake up the microcontroller on sync word detection when using WOR mode. This can be done by selecting output signal 6 (see Table 36 on page 55) on one of the programmable GDO output pins, and programming the microcontroller to wake up on an edge-triggered interrupt from this GDO pin. Page 49 of 92 CC1100E 20 Data FIFO The CC1100E contains two 64 byte FIFOs, one for received data and one for data to be transmitted. The SPI interface is used to read from the RX FIFO and write to the TX FIFO. Section 10.5 contains details on the SPI FIFO access. The FIFO controller will detect overflow in the RX FIFO and underflow in the TX FIFO. When writing to the TX FIFO it is the responsibility of the MCU to avoid TX FIFO overflow. A TX FIFO overflow will result in an error in the TX FIFO content. Likewise, when reading the RX FIFO the MCU must avoid reading the RX FIFO past its empty value since a RX FIFO underflow will result in an error in the data read out of the RX FIFO. 3. Repeat steps 1 and 2 until n = # of bytes remaining in packet. 4. Read the remaining bytes from the RX FIFO. The 4-bit FIFOTHR.FIFO_THR setting is used to program threshold points in the FIFOs. Table 33 lists the 16 FIFO_THR settings and the corresponding thresholds for the RX and TX FIFOs. The threshold value is coded in opposite directions for the RX FIFO and TX FIFO. This gives equal margin to the overflow and underflow conditions when the threshold is reached. FIFO_THR Bytes in TX FIFO Bytes in RX FIFO 0 (0000) 61 4 The chip status byte that is available on the SO pin while transferring the SPI header and contains the fill grade of the RX FIFO if the access is a read operation and the fill grade of the TX FIFO if the access is a write operation. Section 10.1 on page 27 contains more details on this. 1 (0001) 57 8 2 (0010) 53 12 3 (0011) 49 16 4 (0100) 45 20 5 (0101) 41 24 6 (0110) 37 28 7 (0111) 33 32 The number of bytes in the RX FIFO and TX FIFO can be read from the status registers RXBYTES.NUM_RXBYTES and TXBYTES.NUM_TXBYTES respectively. If a received data byte is written to the RX FIFO at the exact same time as the last byte in the RX FIFO is read over the SPI interface, the RX FIFO pointer is not properly updated and the last read byte will be duplicated. To avoid this problem, the RX FIFO should never be emptied before the last byte of the packet is received. 8 (1000) 29 36 9 (1001) 25 40 10 (1010) 21 44 11 (1011) 17 48 12 (1100) 13 52 13 (1100E) 9 56 14 (1110) 5 60 15 (1111) 1 64 For packet lengths less than 64 bytes it is recommended to wait until the complete packet has been received before reading it out of the RX FIFO. If the packet length is larger than 64 bytes, the MCU must determine how many bytes can be read from the RX FIFO (RXBYTES.NUM_RXBYTES-1). The following software routine can be used: 1. Read RXBYTES.NUM_RXBYTES repeatedly at a rate guaranteed to be at least twice that of which RF bytes are received until the same value is returned twice; store value in n. Table 33: FIFO_THR Settings and the Corresponding FIFO Thresholds A signal will assert when the number of bytes in the FIFO is equal to or higher than the programmed threshold. This signal can be viewed on the GDO pins (see Table 36 on page 55). Figure 24 shows the number of bytes in both the RX FIFO and TX FIFO when the threshold signal toggles in the case of FIFO_THR=13. Figure 25 shows the signal on the GDO pin as the respective FIFO is filled above the threshold, and then drained below in the case of FIFO_THR=13. 2. If n < # of bytes remaining in packet, read n-1 bytes from the RX FIFO. SWRS082 Page 50 of 92 CC1100E Figure 24 Example of FIFOs at Threshold Overflow margin FIFO_THR=13 NUM_RXBYTES 53 54 55 56 57 56 55 54 53 GDO 56 bytes NUM_TXBYTES 6 7 8 9 10 9 8 7 6 GDO Figure 25: Number of Bytes in FIFO vs. the GDO Signal (GDOx_CFG=0x00 in RX and GDOx_CFG=0x02 in TX, FIFO_THR=13) FIFO_THR=13 Underflow margin 8 bytes RXFIFO TXFIFO 21 Frequency Programming The frequency programming in the CC1100E is designed to minimize the programming needed in a channel-oriented system. To set up a system with channel numbers, the desired channel spacing is programmed with the MDMCFG0.CHANSPC_M and MDMCFG1.CHANSPC_E registers. The channel spacing registers are mantissa and exponent respectively. The base or start frequency is set f carrier The desired channel number is programmed with the 8-bit channel number register, CHANNR.CHAN, which is multiplied by the channel offset. The resultant carrier frequency is given by: f XOSC FREQ CHAN 256 CHANSPC _ M 2 CHANSPC _ E 2 216 With a 26 MHz crystal the maximum channel spacing is 405 kHz. To get e.g. 1 MHz channel spacing, one solution is to use 333 kHz channel spacing and select each third channel in CHANNR.CHAN. The preferred IF frequency is programmed with the FSCTRL1.FREQ_IF register. The IF frequency is given by: f IF by the 24 bit frequency word located in the FREQ2, FREQ1, and FREQ0 registers. This word will typically be set to the centre of the lowest channel frequency that is to be used. f XOSC FREQ _ IF 210 SWRS082 ® Note that the SmartRF Studio software [8] automatically calculates the optimum FSCTRL1.FREQ_IF register setting based on channel spacing and channel filter bandwidth. If any frequency programming register is altered when the frequency synthesizer is running, the synthesizer may give an undesired response. Hence, the frequency programming should only be updated when the radio is in the IDLE state. Page 51 of 92 CC1100E 22 VCO The VCO is completely integrated on-chip. 22.1 VCO and PLL Self-Calibration The VCO characteristics vary with temperature and supply voltage changes as well as the desired operating frequency. In order to ensure reliable operation, the CC1100E includes frequency synthesizer self-calibration circuitry. This calibration should be done regularly, and must be performed after turning on power and before using a new frequency (or channel). The number of XOSC cycles for completing the PLL calibration is given in Table 32 on page 49. The calibration can be initiated automatically or manually. The synthesizer can be automatically calibrated each time the synthesizer is turned on, or each time the synthesizer is turned off automatically. This is configured with the MCSM0.FS_AUTOCAL register setting. In manual mode, the calibration is initiated when the SCAL command strobe is activated in the IDLE mode. Note: The calibration values are maintained in SLEEP mode, so the calibration is still valid after waking up from SLEEP mode unless supply voltage or temperature has changed significantly. To check that the PLL is in lock, the user can program register IOCFGx.GDOx_CFG to 0x0A, and use the lock detector output available on the GDOx pin as an interrupt for the MCU (x = 0,1, or 2). A positive transition on the GDOx pin means that the PLL is in lock. As an alternative the user can read register FSCAL1. The PLL is in lock if the register content is different from 0x3F. Refer also to the CC1100E Errata Note [5]. For more robust operation, the source code could include a check so that the PLL is recalibrated until PLL lock is achieved if the PLL does not lock the first time. 23 Voltage Regulators The CC1100E contains several on-chip linear voltage regulators that generate the supply voltages needed by low-voltage modules. These voltage regulators are invisible to the user, and can be viewed as integral parts of the various modules. The user must however make sure that the absolute maximum ratings and required pin voltages in Table 1 and Table 17 are not exceeded. By setting the CSn pin low, the voltage regulator to the digital core turns on and the crystal oscillator starts. The SO pin on the SPI interface must go low before the first positive edge of SCLK (setup time is given in Table 20). If the chip is programmed to enter power-down mode (SPWD strobe issued), the power will be turned off after CSn goes high. The power and crystal oscillator will be turned on again when CSn goes low. The voltage regulator for the digital core requires one external decoupling capacitor. The voltage regulator output should only be used for driving the CC1100E. 24 Output Power Programming The RF output power level from the device has two levels of programmability as illustrated in Figure 26. The special PATABLE register can hold up to eight user selected output power settings. The 3-bit FREND0.PA_POWER value selects the PATABLE entry to use. This twolevel functionality provides flexible PA power ramp up and ramp down at the start and end of transmission as well as ASK modulation SWRS082 shaping. All the PA power settings in the PATABLE from index 0 up to the FREND0.PA_POWER value are used. The power ramping at the start and at the end of a packet can be turned off by setting FREND0.PA_POWER=0 and then program the desired output power to index 0 in the PATABLE. Page 52 of 92 CC1100E If OOK modulation is used, the logic 0 and logic 1 power levels shall be programmed to index 0 and 1 respectively. See Section 10.6 on page 29 for PATABLE programming details. PATABLE must be programmed in burst mode if you want to write to other entries than PATABLE[0]. Table 33 contains recommended PATABLE settings for various output levels and frequency bands. DN013 Error! Reference source not found. gives the complete tables for the different frequency bands. Using PA settings from 0x61 to 0x6F is not recommended. Note: All content of the PATABLE except for the first byte (index 0) is lost when entering the SLEEP state. Table 34 contains output power and current consumption for default PATABLE setting (0xC6). 480 MHz Output Power [dBm] 955 MHz Setting Current Consumption, Typ. [mA] Setting Current Consumption, Typ. [mA] -30 0x04 12.5 0x30 13.0 -20 0x0E 13.0 0x14 12.9 -15 0x1C 13.5 0x18 13.6 -10 0x26 14.9 0x24 14.6 -5 0x2B 16.9 0x28 16.2 0 0x60 16.6 0x60 16.5 5 0x86 19.8 0x86 19.1 7 0xCB 24.6 0xC7 26.3 10 (9) 0xC2 29.6 0xC0 30.9 Table 34: Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands 480 MHz 955 MHz Default Power Setting Output Power [dBm] Current Consumption, Typ. [mA] Output Power [dBm] 0xC6 8.8 26.9 7.3 Current Consumption, Typ. [mA] 26.7 Table 35: Output Power and Current Consumption for Default PATABLE Setting 25 Shaping and PA Ramping With ASK modulation, up to eight power settings are used for shaping. The modulator contains a counter that counts up when transmitting a one and down when transmitting a zero. The counter counts at a rate equal to 8 times the symbol rate. The counter saturates SWRS082 at FREND0.PA_POWER and 0 respectively. This counter value is used as an index for a lookup in the power table. Thus, in order to utilize the whole table, FREND0.PA_POWER should be 7 when ASK is active. The shaping of the ASK signal is dependent on the Page 53 of 92 CC1100E shows some examples of ASK shaping. configuration of the PATABLE. Figure 27 PATABLE(7)[7:0] PATABLE(6)[7:0] The PA uses this setting. PATABLE(5)[7:0] PATABLE(4)[7:0] PATABLE(3)[7:0] PATABLE(2)[7:0] PATABLE(1)[7:0] Settings 0 to PA_POWER are used during ramp-up at start of transmission and ramp-down at end of transmission, and for ASK/OOK modulation. PATABLE(0)[7:0] Index into PATABLE(7:0) e.g 6 PA_POWER[2:0] in FREND0 register The SmartRF® Studio software should be used to obtain optimum PATABLE settings for various output powers. Figure 26: PA_POWER and PATABLE Figure 27: Shaping of ASK Signal 26 General Purpose / Test Output Control Pins The three digital output pins GDO0, GDO1, and GDO2 are general control pins configured with IOCFG0.GDO0_CFG, IOCFG1.GDO1_CFG, and IOCFG2.GDO2_CFG respectively. Table 36 shows the different signals that can be monitored on the GDO pins. These signals can be used as inputs to the MCU. GDO1 is the same pin as the SO pin on the SPI interface, thus the output programmed on this pin will only be valid when CSn is high. The default value for GDO1 is 3-stated which is useful when the SPI interface is shared with other devices. The default value for GDO0 is a 135-141 kHz clock output (XOSC frequency divided by 192). Since the XOSC is turned on at poweron-reset, this can be used to clock the MCU in systems with only one crystal. When the MCU is up and running, it can change the clock frequency by writing to IOCFG0.GDO0_CFG. SWRS082 An on-chip analog temperature sensor is enabled by writing the value 128 (0x80) to the IOCFG0 register. The voltage on the GDO0 pin is then proportional to temperature. See Section 4.7 on page 15 for temperature sensor specifications. If the IOCFGx.GDOx_CFG setting is less than 0x20 and IOCFGx_GDOx_INV is 0 (1), the GDO0 and GDO2 pins will be hardwired to 0 (1), and the GDO1 pin will be hardwired to 1 (0) in the SLEEP state. These signals will be hardwired until the CHIP_RDYn signal goes low. If the IOCFGx.GDOx_CFG setting is 0x20 or higher, the GDO pins will work as programmed also in SLEEP state. As an example, GDO1 is high impedance in all states if IOCFG1.GDO1_CFG=0x2E. Page 54 of 92 CC1100E GDOx_CFG[5:0] 0 (0x00) 1 (0x01) 2 (0x02) 3 (0x03) 4 (0x04) 5 (0x05) 6 (0x06) 7 (0x07) 8 (0x08) 9 (0x09) 10 (0x0A) 11 (0x0B) 12 (0x0C) 13 (0x0D) 14 (0x0E) 15 (0x0F) 16 (0x10) 17 (0x11) 18 (0x12) 19 (0x13) 20 (0x14) 21 (0x15) 22 (0x16) 23 (0x17) 24 (0x18) 25 (0x19) 26 (0x1A) 27 (0x1B) 28 (0x1C) 29 (0x1D) 30 (0x1E) 31 (0x1F) 32 (0x20) 33 (0x21) 34 (0x22) 35 (0x23) 36 (0x24) 37 (0x25) 38 (0x26) 39 (0x27) 40 (0x28) 41 (0x29) 42 (0x2A) 43 (0x2B) 44 (0x2C) 45 (0x2D) 46 (0x2E) 47 (0x2F) 48 (0x30) 49 (0x31) 50 (0x32) 51 (0x33) 52 (0x34) 53 (0x35) 54 (0x36) 55 (0x37) 56 (0x38) 57 (0x39) 58 (0x3A) 59 (0x3B) 60 (0x3C) 61 (0x3D) 62 (0x3E) 63 (0x3F) Description Associated to the RX FIFO: Asserts when RX FIFO is filled at or above the RX FIFO threshold. De-asserts when RX FIFO is drained below the same threshold. Associated to the RX FIFO: Asserts when RX FIFO is filled at or above the RX FIFO threshold or the end of packet is reached. De-asserts when the RX FIFO is empty. Associated to the TX FIFO: Asserts when the TX FIFO is filled at or above the TX FIFO threshold. De-asserts when the TX FIFO is below the same threshold. Associated to the TX FIFO: Asserts when TX FIFO is full. De-asserts when the TX FIFO is drained below the TX FIFO threshold. Asserts when the RX FIFO has overflowed. De-asserts when the FIFO has been flushed. Asserts when the TX FIFO has underflowed. De-asserts when the FIFO is flushed. Asserts when sync word has been sent / received, and de-asserts at the end of the packet. In RX, the pin will de-assert when the optional address check fails or the RX FIFO overflows. In TX the pin will de-assert if the TX FIFO underflows. Asserts when a packet has been received with CRC OK. De-asserts when the first byte is read from the RX FIFO. Preamble Quality Reached. Asserts when the PQI is above the programmed PQT value. Clear channel assessment. High when RSSI level is below threshold (dependent on the current CCA_MODE setting). Lock detector output. The PLL is in lock if the lock detector output has a positive transition or is constantly logic high. To check for PLL lock the lock detector output should be used as an interrupt for the MCU. Serial Clock. Synchronous to the data in synchronous serial mode. In RX mode, data is set up on the falling edge by the CC1100E when GDOx_INV=0. In TX mode, data is sampled by the CC1100E on the rising edge of the serial clock when GDOx_INV=0. Serial Synchronous Data Output. Used for synchronous serial mode. Serial Data Output. Used for asynchronous serial mode. Carrier sense. High if RSSI level is above threshold. CRC_OK. The last CRC comparison matched. Cleared when entering/restarting RX mode. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. RX_HARD_DATA [1]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output. RX_HARD_DATA [0]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. RX_SYMBOL_TICK. Can be used together with RX_HARD_DATA for alternative serial RX output. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. Reserved – used for test. WOR_EVNT0. WOR_EVNT1. Reserved – used for test. CLK_32k. Reserved – used for test. CHIP_RDYn. Reserved – used for test. XOSC_STABLE. Reserved – used for test. GDO0_Z_EN_N. When this output is 0, GDO0 is configured as input (for serial TX data). High impedance (3-state). HW to 0 (HW1 achieved by setting GDOx_INV=1). Can be used to control an external LNA/PA or RX/TX switch. CLK_XOSC/1 CLK_XOSC/1.5 CLK_XOSC/2 CLK_XOSC/3 CLK_XOSC/4 Note: There are 3 GDO pins, but only one CLK_XOSC/n can be selected as an output at any CLK_XOSC/6 time. If CLK_XOSC/n is to be monitored on one of the GDO pins, the other two GDO pins must CLK_XOSC/8 be configured to values less than 0x30. The GDO0 default value is CLK_XOSC/192. CLK_XOSC/12 To optimize RF performance, these signals should not be used while the radio is in RX or TX CLK_XOSC/16 CLK_XOSC/24 mode. CLK_XOSC/32 CLK_XOSC/48 CLK_XOSC/64 CLK_XOSC/96 CLK_XOSC/128 CLK_XOSC/192 Table 36: GDOx Signal Selection (x = 0, 1, or 2) SWRS082 Page 55 of 92 CC1100E 27 Asynchronous and Synchronous Serial Operation Several features and modes of operation have been included in the CC1100E to provide backward compatibility with previous Chipcon products and other existing RF communication systems. For new systems, it is recommended to use the built-in packet handling features, as they can give more robust communication, significantly offload the microcontroller, and simplify software development. 27.1 Asynchronous Serial Operation Asynchronous transfer is included in the CC1100E for backward compatibility with systems that are already using the asynchronous data transfer. When asynchronous transfer is enabled, several of the support mechanisms for the MCU that are included in the CC1100E will be disabled, such as packet handling hardware, buffering in the FIFO, and so on. The asynchronous transfer mode does not allow for the use of the data whitener, interleaver, and FEC, and it is not possible to use Manchester encoding. MSK is not supported for asynchronous transfer. Setting PKTCTRL0.PKT_FORMAT to 3 enables asynchronous serial mode. In TX, the GDO0 pin is used for data input (TX data). Data output can be on GDO0, GDO1, or GDO2. This is set by the IOCFG0.GDO0_CFG, IOCFG1.GDO1_CFG and IOCFG2.GDO2_CFG fields. The CC1100E modulator samples the level of the asynchronous input 8 times faster than the programmed data rate. The timing requirement for the asynchronous stream is that the error in the bit period must be less than one eighth of the programmed data rate. 27.2 Synchronous Serial Operation Setting PKTCTRL0.PKT_FORMAT to 1 enables synchronous serial mode. In the synchronous serial mode, data is transferred on a two-wire serial interface. The CC1100E provides a clock that is used to set up new data on the data input line or sample data on the data output line. Data input (TX data) is on the GDO0 pin. This pin will automatically be configured as an input when TX is active. The TX latency is 8 bits. The data output pin can be any of the GDO pins. This is set by the IOCFG0.GDO0_CFG, IOCFG1.GDO1_CFG, and IOCFG2.GDO2_CFG fields. Time from start of reception until data is available on the receiver data output pin is equal to 9 bit. Preamble and sync word insertion/detection may or may not be active, dependent on the sync mode set by the MDMCFG2.SYNC_MODE. If preamble and sync word is disabled, all other packet handler features and FEC should also be disabled. The MCU must then handle preamble and sync word insertion and detection in software. SWRS082 If preamble and sync word insertion/detection is left on, all packet handling features and FEC can be used. One exception is that the address filtering feature is unavailable in synchronous serial mode. When using the packet handling features in synchronous serial mode, the CC1100E will insert and detect the preamble and sync word and the MCU will only provide/get the data payload. This is equivalent to the recommended FIFO operation mode. An alternative serial RX output option is to configure any of the GD0 pins for RX_SYMBOL_TICK and RX_HARD_[1:0], see Table 36. RX_HARD_[1:0] is the hard decision symbol. RX_HARD_[1:0] contain data for 4-ary modulation formats while RX_HARD_DATA [1] contain data for 2-ary modulation formats. The RX_SYMBOL_TICK signal is the symbol clock and is high for one half symbol period whenever a new symbol is presented on the hard and soft data outputs. This option may be used for both synchronous and asynchronous interfaces. Page 56 of 92 CC1100E 28 System Considerations and Guidelines 28.1 SRD Regulations International regulations and national laws regulate the use of radio receivers and transmitters. The CC1100E is specifically designed for use in the license free 470-510 MHz and 950-960 MHz frequency bands in China and Japan, respectively. with two and three unit channels. For data rates higher than 100 kbps, the frequency deviation may have to be reduced compared to the default settings in order to comply with the ARIB STD-T96 transmit specifications. Typical margins to the transmit spectrum mask measured according to the ARIB STDT96 using the CC1100E reference design at 0 dBm output power are shown in Table 37. Higher margins can be achieved by reducing the output power accordingly. 28.1.1 ARIB STD-T96 The applicable regulatory requirements for using the CC1100E at the 950-956 MHz frequency band in Japan are specified by the ARIB STD-T96 [6]. Please note that compliance with regulations is dependent on the complete system performance. It is the customer’s responsibility to ensure that the system complies with regulations. For applications targeting ARIB STD-T96, FSCAL3 [7:4] needs to be set to 0xA and FSCAL0 needs to be set to 0x07 for optimum performance. The CC1100E can support operation with one (200 kHz), two (400 kHz) and three (600 kHz) unit channels as defined by the ARIB STD-T96 but will typically be used in wireless systems Data Rate [kbps] Deviation [kHz] Typical Sensitivity Typical Margin [dB] [dBm] 400 kHz 600 kHz 1.2 5.2 -111 3 4 4.8 25.4 -110 1.5 5.5 10 19 -106 3 4.5 38.4 20 -103 1.5 6.5 76.8 32 -100 3 6 100 47 -100 1 5.5 175 41 -91 2.5 5.5 200 100 -96 N/A 2 200 38 -89 1.5 4.5 250 70 -93 N/A 2.5 Table 37: CC1100E typical performance values for ARIB STD-T96 using the CC1100E reference design, 25C and 3V (FSCAL3 [7:4] set to 0xA and FSCAL0 set to 0x07) 28.2 Frequency Hopping and Multi-Channel Systems The 470 MHz and 950 MHz bands are shared by many systems both in industrial, office, and home environments. It is therefore recommended to use frequency hopping spread spectrum (FHSS) or a multi-channel SWRS082 protocol because the frequency diversity makes the system more robust with respect to interference from other systems operating in the same frequency band. FHSS also combats multipath fading. Page 57 of 92 CC1100E The CC1100E is highly suited for FHSS or multichannel systems due to its agile frequency synthesizer and effective communication interface. Using the packet handling support and data buffering is also beneficial in such systems as these features will significantly offload the host controller. Charge pump current, VCO current, and VCO capacitance array calibration data is required for each frequency when implementing frequency hopping for the CC1100E. There are 3 ways of obtaining the calibration data from the chip: 1) Frequency hopping with calibration for each hop. The PLL calibration time is approximately 720 µs. The blanking interval between each frequency hop is then approximately 810 us. 2) Fast frequency hopping without calibration for each hop can be done by performing the necessary calibrating at startup and saving the resulting FSCAL3, FSCAL2, and FSCAL1 register values in MCU memory. The VCO capacitance array calibration FSCAL1 register value must be found for each RF frequency to be used. The VCO current calibration value and the charge pump current calibration value available in FSCAL2 and FSCAL3 respectively are not dependent on the RF frequency, so the same value can therefore be used for all RF frequencies for these two registers. Between each frequency hop, the calibration process can then be replaced by writing the FSCAL3, FSCAL2 and FSCAL1 register values that corresponds to the next RF frequency. The PLL turn on time is approximately 90 µs. The blanking interval between each frequency hop is then approximately 90 µs. 3) Run calibration on a single frequency at startup. Next write 0 to FSCAL3 [5:4] to disable the charge pump calibration. After writing to FSCAL3 [5:4], strobe SRX (or STX) with MCSM0.FS_AUTOCAL=1 for each new frequency hop. That is, VCO current and VCO capacitance calibration is done, but not charge pump current calibration. When charge pump current calibration is disabled the calibration time is reduced from approximately 720 µs to approximately 150 µs. The blanking interval between each frequency hop is then approximately 240 µs. There is a trade off between blanking time and memory space needed for storing calibration data in non-volatile memory. Solution 2) above gives the shortest blanking interval, but requires more memory space to store calibration values. This solution also requires that the supply voltage and temperature do not vary much in order to have a robust solution. Solution 3) gives approximately 570 µs smaller blanking interval than solution 1). The recommended settings for TEST0.VCO_SEL_CAL_EN changes with frequency. This means that one should always ® use SmartRF Studio [8] to get the correct settings for a specific frequency before doing a calibration, regardless of which calibration method is being used. Note: The content in the TESTn registers (n = 0, 1, or 2) are not retained in SLEEP state, thus it is necessary to re-write these registers when returning from the SLEEP state. 28.3 Data Burst Transmissions The high maximum data rate of the CC1100E opens up for burst transmissions. A low average data rate link (e.g. 10 kBaud) can be realized by using a higher over-the-air data rate. Buffering the data and transmitting in bursts at high data rate (e.g. 500 kBaud) will reduce the time in active mode, and hence also reduce the average current consumption significantly. Reducing the time in active mode will reduce the likelihood of collisions with other systems in the same frequency range. Note: The sensitivity and thus transmission range is reduced for high data rate bursts compared to lower data rates. 28.4 Continuous Transmissions In data streaming applications, the CC1100E opens up for continuous transmissions at a 500 kBaud effective data rate. As the modulation is done with a closed loop PLL, there is no limitation in the length of a SWRS082 transmission (open loop modulation used in some transceivers often prevents this kind of continuous data streaming and reduces the effective data rate). Page 58 of 92 CC1100E 28.5 Low Cost Systems As the CC1100E provides 1.2 - 500 kBaud multichannel performance without any external SAW or loop filters, a very low cost system can be made. The crystal package strongly influences the price. In a size constrained PCB design, a smaller, but more expensive, crystal may be used. A HC-49 type SMD crystal is used in the CC1100E EM reference designs ([3] and 0). 28.6 Battery Operated Systems In low power applications, the SLEEP state with the crystal oscillator core switched off should be used when the CC1100E is not active. It is possible to leave the crystal oscillator core running in the SLEEP state if start-up time is critical. The WOR functionality should be used in low power applications. 28.7 Increasing Output Power In some applications it may be necessary to extend the link range. Adding an external power amplifier is the most effective way of doing this. The power amplifier should be inserted between the antenna and the balun and matching circuit. Two T/R switches are needed to disconnect the PA in RX mode, see details in Figure 28. Antenna Filter PA Balun and Matching T/R switch CC1100E T/R switch Figure 28: Block Diagram of the CC1100E Usage with External Power Amplifier 29 Configuration Registers The configuration of the CC1100E is done by programming 8-bit registers. The optimum configuration data based on selected system parameters are most easily found by using the SmartRF Studio software [8]. Complete descriptions of the registers are given in the following tables. After chip reset, all the registers have default values as shown in the tables. The optimum register setting might differ from the default value. After a reset, all registers that shall be different from the default value therefore needs to be programmed through the SPI interface. There are 13 command strobe registers, listed in Table 38. Accessing these registers will initiate the change of an internal state or mode. There are 47 normal 8-bit configuration registers listed in Table 39. Many of these SWRS082 registers are for test purposes only, and need not be written for normal operation of the CC1100E. There are also 12 status registers that are listed in Table 40. These registers, which are read-only, contain information about the status of the CC1100E. The two FIFOs are accessed through one 8-bit register. Write operations write to the TX FIFO, while read operations read from the RX FIFO. During the header byte transfer and while writing data to a register or the TX FIFO, a status byte is returned on the SO line. This status byte is described in Table 21 on page 27. Page 59 of 92 CC1100E Table 41 summarizes the SPI address space. The address to use is given by adding the base address to the left and the burst and read/write bits on the top. Note that the burst bit has different meaning for base addresses above and below 0x2F. Address Strobe Name Description 0x30 SRES Reset chip. 0x31 SFSTXON 0x32 SXOFF 0x33 SCAL Calibrate frequency synthesizer and turn it off. SCAL can be strobed from IDLE mode without setting manual calibration mode (MCSM0.FS_AUTOCAL=0) 0x34 SRX Enable RX. Perform calibration first if coming from IDLE and MCSM0.FS_AUTOCAL=1. 0x35 STX In IDLE state: Enable TX. Perform calibration first if MCSM0.FS_AUTOCAL=1. If in RX state and CCA is enabled: Only go to TX if channel is clear. 0x36 SIDLE Exit RX / TX, turn off frequency synthesizer and exit Wake-On-Radio mode if applicable. 0x38 SWOR Start automatic RX polling sequence (Wake-on-Radio) as described in Section 19.5 if WORCTRL.RC_PD=0. 0x39 SPWD Enter power down mode when CSn goes high. 0x3A SFRX Flush the RX FIFO buffer. Only issue SFRX in IDLE or RXFIFO_OVERFLOW states. 0x3B SFTX Flush the TX FIFO buffer. Only issue SFTX in IDLE or TXFIFO_UNDERFLOW states. 0x3C SWORRST 0x3D SNOP Enable and calibrate frequency synthesizer (if MCSM0.FS_AUTOCAL=1). If in RX (with CCA): Go to a wait state where only the synthesizer is running (for quick RX / TX turnaround). Turn off crystal oscillator. Reset real time clock to Event1 value. No operation. May be used to get access to the chip status byte. Table 38: Command Strobes SWRS082 Page 60 of 92 CC1100E Preserved in SLEEP State Details on Page Number GDO2 output pin configuration GDO1 output pin configuration GDO0 output pin configuration Yes 64 Yes 64 Yes 64 RX FIFO and TX FIFO thresholds Yes 65 Address Register Description 0x00 IOCFG2 0x01 IOCFG1 0x02 IOCFG0 0x03 FIFOTHR 0x04 SYNC1 Sync word, high byte Yes 66 0x05 SYNC0 Sync word, low byte Yes 66 0x06 PKTLEN Packet length Yes 66 0x07 PKTCTRL1 Packet automation control Yes 66 0x08 PKTCTRL0 Packet automation control Yes 67 0x09 ADDR Device address Yes 67 0x0A CHANNR Channel number Yes 67 0x0B FSCTRL1 Frequency synthesizer control Yes 68 0x0C FSCTRL0 Frequency synthesizer control Yes 68 0x0D FREQ2 Frequency control word, high byte Yes 68 0x0E FREQ1 Frequency control word, middle byte Yes 68 0x0F FREQ0 Frequency control word, low byte Yes 68 0x10 MDMCFG4 Modem configuration Yes 69 0x11 MDMCFG3 Modem configuration Yes 69 0x12 MDMCFG2 Modem configuration Yes 70 0x13 MDMCFG1 Modem configuration Yes 71 0x14 MDMCFG0 Modem configuration Yes 71 0x15 DEVIATN Modem deviation setting Yes 72 0x16 MCSM2 Main Radio Control State Machine configuration Yes 73 0x17 MCSM1 Main Radio Control State Machine configuration Yes 74 0x18 MCSM0 Main Radio Control State Machine configuration Yes 75 0x19 FOCCFG Frequency Offset Compensation configuration Yes 76 0x1A BSCFG Bit Synchronization configuration Yes 77 0x1B AGCTRL2 AGC control Yes 78 0x1C AGCTRL1 AGC control Yes 79 0x1D AGCTRL0 AGC control Yes 80 0x1E WOREVT1 High byte Event 0 timeout Yes 80 0x1F WOREVT0 Low byte Event 0 timeout Yes 81 0x20 WORCTRL Wake On Radio control Yes 81 0x21 FREND1 Front end RX configuration Yes 82 0x22 FREND0 Front end TX configuration Yes 82 0x23 FSCAL3 Frequency synthesizer calibration Yes 82 0x24 FSCAL2 Frequency synthesizer calibration Yes 83 0x25 FSCAL1 Frequency synthesizer calibration Yes 83 0x26 FSCAL0 Frequency synthesizer calibration Yes 83 0x27 RCCTRL1 RC oscillator configuration Yes 83 0x28 RCCTRL0 RC oscillator configuration Yes 83 0x29 FSTEST Frequency synthesizer calibration control No 84 0x2A PTEST Production test No 84 0x2B AGCTEST AGC test No 84 0x2C TEST2 Various test settings No 84 0x2D TEST1 Various test settings No 84 0x2E TEST0 Various test settings No 85 Table 39: Configuration Registers Overview SWRS082 Page 61 of 92 CC1100E Address Register Description Details on page number 0x30 (0xF0) PARTNUM Part number for the CC1100E 85 0x31 (0xF1) VERSION Current version number 85 0x32 (0xF2) FREQEST Frequency Offset Estimate 85 0x33 (0xF3) LQI Demodulator estimate for Link Quality 85 0x34 (0xF4) RSSI Received signal strength indication 85 0x35 (0xF5) MARCSTATE Control state machine state 86 0x36 (0xF6) WORTIME1 High byte of WOR timer 86 0x37 (0xF7) WORTIME0 Low byte of WOR timer 86 0x38 (0xF8) PKTSTATUS Current GDOx status and packet status 87 VCO_VC_DAC Current setting from PLL calibration module 87 0x39 (0xF9) TXBYTES Underflow and number of bytes in the TX FIFO 87 0x3A (0xFA) RXBYTES Overflow and number of bytes in the RX FIFO 87 0x3B (0xFB) 0x3C (0xFC) RCCTRL1_STATUS Last RC oscillator calibration result 87 0x3D (0xFD) RCCTRL0_STATUS Last RC oscillator calibration result 88 Table 40: Status Registers Overview SWRS082 Page 62 of 92 CC1100E SRES SFSTXON SXOFF SCAL SRX STX SIDLE SRES SFSTXON SXOFF SCAL SRX STX SIDLE SWOR SPWD SFRX SFTX SWORRST SNOP PATABLE TX FIFO SWOR SPWD SFRX SFTX SWORRST SNOP PATABLE RX FIFO PATABLE TX FIFO Burst +0xC0 R/W configuration registers, burst access possible 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F Read Single Byte +0x80 IOCFG2 IOCFG1 IOCFG0 FIFOTHR SYNC1 SYNC0 PKTLEN PKTCTRL1 PKTCTRL0 ADDR CHANNR FSCTRL1 FSCTRL0 FREQ2 FREQ1 FREQ0 MDMCFG4 MDMCFG3 MDMCFG2 MDMCFG1 MDMCFG0 DEVIATN MCSM2 MCSM1 MCSM0 FOCCFG BSCFG AGCCTRL2 AGCCTRL1 AGCCTRL0 WOREVT1 WOREVT0 WORCTRL FREND1 FREND0 FSCAL3 FSCAL2 FSCAL1 FSCAL0 RCCTRL1 RCCTRL0 FSTEST PTEST AGCTEST TEST2 TEST1 TEST0 PARTNUM VERSION FREQEST LQI RSSI MARCSTATE WORTIME1 WORTIME0 PKTSTATUS VCO_VC_DAC TXBYTES RXBYTES RCCTRL1_STATUS RCCTRL0_STATUS PATABLE RX FIFO Command Strobes, Status registers (read only) and multi byte registers Write Single Byte Burst +0x00 +0x40 Table 41: SPI Address Space SWRS082 Page 63 of 92 CC1100E 29.1 Configuration Register Details – Registers with preserved values in SLEEP state 0x00: IOCFG2 – GDO2 Output Pin Configuration Bit Field Name Reset 7 R/W Description R0 Not used 6 GDO2_INV 0 R/W Invert output, i.e. select active low (1) / high (0) 5:0 GDO2_CFG[5:0] 41 (0x29) R/W Default is CHP_RDYn (See Table 36 on page 55). 0x01: IOCFG1 – GDO1 Output Pin Configuration Bit Field Name Reset R/W Description 7 GDO_DS 0 R/W Set high (1) or low (0) output drive strength on the GDO pins. 6 GDO1_INV 0 R/W Invert output, i.e. select active low (1) / high (0) 5:0 GDO1_CFG[5:0] 46 (0x2E) R/W Default is 3-state (See Table 36 on page 55). 0x02: IOCFG0 – GDO0 Output Pin Configuration Bit Field Name Reset R/W Description 7 TEMP_SENSOR_ENABLE 0 R/W Enable analog temperature sensor. Write 0 in all other register bits when using temperature sensor. 6 GDO0_INV 0 R/W Invert output, i.e. select active low (1) / high (0) 5:0 GDO0_CFG[5:0] 63 (0x3F) R/W Default is CLK_XOSC/192 (See Table 36 on page 55). It is recommended to disable the clock output in initialization, in order to optimize RF performance. SWRS082 Page 64 of 92 CC1100E 0x03: FIFOTHR – RX FIFO and TX FIFO Thresholds Bit Field Name 7 6 ADC_RETENTION Reset R/W Description 0 R/W Reserved , write 0 for compatibility with possible future extensions 0 R/W 0: TEST1 = 0x31 and TEST2= 0x88 when waking up from SLEEP 1: TEST1 = 0x35 and TEST2 = 0x81 when waking up from SLEEP Note that the changes in the TEST registers due to the ADC_RETENTION bit setting are only seen INTERNALLY in the analog part. The values read from the TEST registers when waking up from SLEEP mode will always be the reset value. The ADC_RETENTION bit should be set to 1 before going into SLEEP mode if settings with an RX filter bandwidth below 325 kHz are wanted at time of wake-up. 5:4 3:0 CLOSE_IN_RX [1:0] FIFO_THR[3:0] 0 (00) 7 (0111) R/W R/W For more details, please see DN010 [11] Setting RX Attenuation, Typical Values 0 (00) 0dB 1 (01) 6dB 2 (10) 12dB 3 (11) 18dB Set the threshold for the TX FIFO and RX FIFO. The threshold is exceeded when the number of bytes in the FIFO is equal to or higher than the threshold value. Setting Bytes in TX FIFO Bytes in RX FIFO 0 (0000) 61 4 1 (0001) 57 8 2 (0010) 53 12 3 (0011) 49 16 4 (0100) 45 20 5 (0101) 41 24 6 (0110) 37 28 7 (0111) 33 32 8 (1000) 29 36 9 (1001) 25 40 10 (1010) 21 44 11 (1011) 17 48 12 (1100) 13 52 13 (1100E) 9 56 14 (1110) 5 60 15 (1111) 1 64 SWRS082 Page 65 of 92 CC1100E 0x04: SYNC1 – Sync Word, High Byte Bit Field Name Reset R/W Description 7:0 SYNC[15:8] 211 (0xD3) R/W 8 MSB of 16-bit sync word 0x05: SYNC0 – Sync Word, Low Byte Bit Field Name Reset R/W Description 7:0 SYNC[7:0] 145 (0x91) R/W 8 LSB of 16-bit sync word 0x06: PKTLEN – Packet Length Bit Field Name Reset R/W Description 7:0 PACKET_LENGTH 255 (0xFF) R/W Indicates the packet length when fixed packet length mode is enabled. If variable packet length mode is used, this value indicates the maximum packet length allowed. 0x07: PKTCTRL1 – Packet Automation Control Bit Field Name Reset R/W Description 7:5 PQT[2:0] 0 (0x00) R/W Preamble quality estimator threshold. The preamble quality estimator increases an internal counter by one each time a bit is received that is different from the previous bit, and decreases the counter by 8 each time a bit is received that is the same as the last bit. A threshold of 4∙PQT for this counter is used to gate sync word detection. When PQT=0 a sync word is always accepted. 4 0 R0 Not Used. 3 CRC_AUTOFLUSH 0 R/W Enable automatic flush of RX FIFO when CRC is not OK. This requires that only one packet is in the RXIFIFO and that packet length is limited to the RX FIFO size. 2 APPEND_STATUS 1 R/W When enabled, two status bytes will be appended to the payload of the packet. The status bytes contain RSSI and LQI values, as well as CRC OK. 1:0 ADR_CHK[1:0] 0 (00) R/W Controls address check configuration of received packages. Setting Address check configuration 0 (00) No address check 1 (01) Address check, no broadcast 2 (10) Address check and 0 (0x00) broadcast 3 (11) Address check and 0 (0x00) and 255 (0xFF) broadcast SWRS082 Page 66 of 92 CC1100E 0x08: PKTCTRL0 – Packet Automation Control Bit Field Name Reset 7 6 WHITE_DATA 1 R/W Description R0 Not used R/W Turn data whitening on / off 0: Whitening off 1: Whitening on 5:4 PKT_FORMAT[1:0] 3 2 CRC_EN 0 (00) R/W Format of RX and TX data Setting Packet format 0 (00) Normal mode, use FIFOs for RX and TX 1 (01) Synchronous serial mode, Data in on GDO0 and data out on either of the GDOx pins 2 (10) Random TX mode; sends random data using PN9 generator. Used for test. Works as normal mode, setting 0 (00), in RX 3 (11) Asynchronous serial mode, Data in on GDO0 and data out on either of the GDOx pins 0 R0 Not used 1 R/W 1: CRC calculation in TX and CRC check in RX enabled 0: CRC disabled for TX and RX 1:0 LENGTH_CONFIG[1:0] 1 (01) R/W Configure the packet length Setting Packet length configuration 0 (00) Fixed packet length mode. Length configured in PKTLEN register 1 (01) Variable packet length mode. Packet length configured by the first byte after sync word 2 (10) Infinite packet length mode 3 (11) Reserved 0x09: ADDR – Device Address Bit Field Name Reset R/W Description 7:0 DEVICE_ADDR[7:0] 0 (0x00) R/W Address used for packet filtration. Optional broadcast addresses are 0 (0x00) and 255 (0xFF). 0x0A: CHANNR – Channel Number Bit Field Name Reset R/W Description 7:0 CHAN[7:0] 0 (0x00) R/W The 8-bit unsigned channel number, which is multiplied by the channel spacing setting and added to the base frequency. SWRS082 Page 67 of 92 CC1100E 0x0B: FSCTRL1 – Frequency Synthesizer Control Bit Field Name Reset R/W Description R0 Not used 0 R/W Reserved 15 (0x0F) R/W The desired IF frequency to employ in RX. Subtracted from FS base frequency in RX and controls the digital complex mixer in the demodulator. 7:6 5 4:0 FREQ_IF[4:0] f IF f XOSC FREQ _ IF 210 The default value gives an IF frequency of 381kHz, assuming a 26.0 MHz crystal. 0x0C: FSCTRL0 – Frequency Synthesizer Control Bit Field Name Reset R/W Description 7:0 FREQOFF[7:0] 0 (0x00) R/W Frequency offset added to the base frequency before being used by the frequency synthesizer. (2s-complement). Resolution is FXTAL/214 (1.59kHz-1.65kHz); range is ±202 kHz to ±210 kHz, dependent of XTAL frequency. 0x0D: FREQ2 – Frequency Control Word, High Byte Bit Field Name Reset R/W Description 7:6 FREQ[23:22] 0 (00) R FREQ[23:22] is always 0 (the FREQ2 register is less than 36 with 26-27 MHz crystal) 5:0 FREQ[21:16] 30 (0x1E) R/W FREQ [23:0] is the base frequency for the frequency synthesiser in increments of fXOSC/216. f carrier f XOSC FREQ 23 : 0 216 0x0E: FREQ1 – Frequency Control Word, Middle Byte Bit Field Name Reset R/W Description 7:0 FREQ[15:8] 196 (0xC4) R/W Ref. FREQ2 register 0x0F: FREQ0 – Frequency Control Word, Low Byte Bit Field Name Reset R/W Description 7:0 FREQ[7:0] 236 (0xEC) R/W Ref. FREQ2 register SWRS082 Page 68 of 92 CC1100E 0x10: MDMCFG4 – Modem Configuration Bit Field Name Reset R/W 7:6 CHANBW_E[1:0] 2 (0x02) R/W 5:4 CHANBW_M[1:0] 0 (0x00) R/W Description Sets the decimation ratio for the delta-sigma ADC input stream and thus the channel bandwidth. BWchannel f XOSC 8 (4 CHANBW _ M )·2 CHANBW _ E The default values give 203 kHz channel filter bandwidth, assuming a 26.0 MHz crystal. 3:0 DRATE_E[3:0] 12 (0x0C) R/W The exponent of the user specified symbol rate 0x11: MDMCFG3 – Modem Configuration Bit Field Name Reset R/W Description 7:0 DRATE_M[7:0] 34 (0x22) R/W The mantissa of the user specified symbol rate. The symbol rate is configured using an unsigned, floating-point number with 9-bit mantissa and 4-bit exponent. The 9th bit is a hidden ‘1’. The resulting data rate is: RDATA 256 DRATE _ M 2 DRATE _ E f 2 28 XOSC The default values give a data rate of 115.051 kBaud (closest setting to 115.2 kBaud), assuming a 26.0 MHz crystal. SWRS082 Page 69 of 92 CC1100E 0x12: MDMCFG2 – Modem Configuration Bit Field Name Reset R/W Description 7 DEM_DCFILT_OFF 0 R/W Disable digital DC blocking filter before demodulator. 0 = Enable (better sensitivity) 1 = Disable (current optimized). Only for data rates ≤ 250 kBaud The recommended IF frequency changes when the DC blocking is disabled. Please use SmartRF Studio [8] to calculate correct register setting. 6:4 MOD_FORMAT[2:0] 0 (000) R/W The modulation format of the radio signal Setting Modulation format 0 (000) 2-FSK 1 (001) GFSK 2 (010) - 3 (011) ASK/OOK 4 (100) - 5 (101) - 6 (110) - 7 (111) MSK ASK is only supported for output powers up to -1 dBm MSK is only supported for data rates above 26 kBaud 3 MANCHESTER_EN 0 R/W Enables Manchester encoding/decoding. 0 = Disable 1 = Enable 2:0 SYNC_MODE[2:0] 2 (010) R/W Combined sync-word qualifier mode. The values 0 (000) and 4 (100) disables preamble and sync word transmission in TX and preamble and sync word detection in RX. The values 1 (001), 2 (010), 5 (101) and 6 (110) enables 16-bit sync word transmission in TX and 16-bits sync word detection in RX. Only 15 of 16 bits need to match in RX when using setting 1 (001) or 5 (101). The values 3 (011) and 7 (111) enables repeated sync word transmission in TX and 32-bits sync word detection in RX (only 30 of 32 bits need to match). Setting Sync-word qualifier mode 0 (000) No preamble/sync 1 (001) 15/16 sync word bits detected 2 (010) 16/16 sync word bits detected 3 (011) 30/32 sync word bits detected 4 (100) No preamble/sync, carrier-sense above threshold 5 (101) 15/16 + carrier-sense above threshold 6 (110) 16/16 + carrier-sense above threshold 7 (111) 30/32 + carrier-sense above threshold SWRS082 Page 70 of 92 CC1100E 0x13: MDMCFG1– Modem Configuration Bit Field Name Reset R/W Description 7 FEC_EN 0 R/W Enable Forward Error Correction (FEC) with interleaving for packet payload 0 = Disable 1 = Enable (Only supported for fixed packet length mode, i.e. PKTCTRL0.LENGTH_CONFIG=0) 6:4 NUM_PREAMBLE[2:0] 2 (010) 3:2 1:0 CHANSPC_E[1:0] 2 (10) R/W Sets the minimum number of preamble bytes to be transmitted Setting Number of preamble bytes 0 (000) 2 1 (001) 3 2 (010) 4 3 (011) 6 4 (100) 8 5 (101) 12 6 (110) 16 7 (111) 24 R0 Not used R/W 2 bit exponent of channel spacing 0x14: MDMCFG0– Modem Configuration Bit Field Name Reset R/W Description 7:0 CHANSPC_M[7:0] 248 (0xF8) R/W 8-bit mantissa of channel spacing. The channel spacing is multiplied by the channel number CHAN and added to the base frequency. It is unsigned and has the format: f CHANNEL f XOSC 256 CHANSPC _ M 2 CHANSPC _ E 218 The default values give 199.951 kHz channel spacing (the closest setting to 200 kHz), assuming 26.0 MHz crystal frequency. SWRS082 Page 71 of 92 CC1100E 0x15: DEVIATN – Modem Deviation Setting Bit Field Name Reset 7 6:4 DEVIATION_E[2:0] 4 (100) 3 2:0 DEVIATION_M[2:0] 7 (111) R/W Description R0 Not used. R/W Deviation exponent. R0 Not used. R/W TX Specifies the nominal frequency deviation from the carrier for a ‘0’ (-DEVIATN) and ‘1’ (+DEVIATN) in a mantissa-exponent format, interpreted as a 4-bit value with MSB implicit 1. The resulting frequency deviation is given by: 2-FSK/ GFSK f dev f xosc (8 DEVIATION _ M ) 2 DEVIATION _ E 217 The default values give ±47.607 kHz deviation assuming 26.0 MHz crystal frequency. MSK Specifies the fraction of symbol period (1/8-8/8) during which a phase change occurs (‘0’: +90deg, ‘1’:-90deg). Refer to the SmartRF Studio software [8] for correct DEVIATN setting when using MSK. ASK/OOK This setting has no effect. RX 2-FSK/ GFSK Specifies the expected frequency deviation of incoming signal, must be approximately right for demodulation to be performed reliably and robustly. MSK/ This setting has no effect. ASK/OOK SWRS082 Page 72 of 92 CC1100E 0x16: MCSM2 – Main Radio Control State Machine Configuration Bit Field Name Reset 7:5 R/W Description R0 Not used 4 RX_TIME_RSSI 0 R/W Direct RX termination based on RSSI measurement (carrier sense). For ASK/OOK modulation, RX times out if there is no carrier sense in the first 8 symbol periods. 3 RX_TIME_QUAL 0 R/W When the RX_TIME timer expires, the chip checks if sync word is found when RX_TIME_QUAL=0, or either sync word is found or PQI is set when RX_TIME_QUAL=1. 2:0 RX_TIME[2:0] 7 (111) R/W Timeout for sync word search in RX for both WOR mode and normal RX operation. The timeout is relative to the programmed EVENT0 timeout. The RX timeout in µs is given by EVENT0·C(RX_TIME, WOR_RES) ·26/X, where C is given by the table below and X is the crystal oscillator frequency in MHz: Setting WOR_RES = 0 WOR_RES = 1 WOR_RES = 2 WOR_RES = 3 0 (000) 3.6058 18.0288 32.4519 46.8750 1 (001) 1.8029 9.0144 16.2260 23.4375 2 (010) 0.9014 4.5072 8.1130 11.7188 3 (011) 0.4507 2.2536 4.0565 5.8594 4 (100) 0.2254 1.1268 2.0282 2.9297 5 (101) 0.1127 0.5634 1.0141 1.4648 6 (110) 0.0563 0.2817 0.5071 0.7324 7 (111) Until end of packet As an example, EVENT0=34666, WOR_RES=0 and RX_TIME=6 corresponds to 1.96 ms RX timeout, 1 s polling interval and 0.195% duty cycle. Note that WOR_RES should be 0 or 1 when using WOR because using WOR_RES > 1 will give a very low duty cycle. In applications where WOR is not used all settings of WOR_RES can be used. The duty cycle using WOR is approximated by: Setting WOR_RES=0 WOR_RES=1 0 (000) 12.50% 1.95% 1 (001) 6.250% 9765ppm 2 (010) 3.125% 4883ppm 3 (011) 1.563% 2441ppm 4 (100) 0.781% NA 5 (101) 0.391% NA 6 (110) 0.195% NA 7 (111) NA Note that the RC oscillator must be enabled in order to use setting 0-6, because the timeout counts RC oscillator periods. WOR mode does not need to be enabled. The timeout counter resolution is limited: With RX_TIME=0, the timeout count is given by the 13 MSBs of EVENT0, decreasing to the 7MSBs of EVENT0 with RX_TIME=6. SWRS082 Page 73 of 92 CC1100E 0x17: MCSM1– Main Radio Control State Machine Configuration Bit Field Name Reset 7:6 5:4 3:2 CCA_MODE[1:0] RXOFF_MODE[1:0] 3 (11) 0 (00) R/W Description R0 Not used R/W Selects CCA_MODE; Reflected in CCA signal R/W Setting Clear channel indication 0 (00) Always 1 (01) If RSSI below threshold 2 (10) Unless currently receiving a packet 3 (11) If RSSI below threshold unless currently receiving a packet Select what should happen when a packet has been received Setting Next state after finishing packet reception 0 (00) IDLE 1 (01) FSTXON 2 (10) TX 3 (11) Stay in RX It is not possible to set RXOFF_MODE to be TX or FSTXON and at the same time use CCA. 1:0 TXOFF_MODE[1:0] 0 (00) R/W Select what should happen when a packet has been sent (TX) Setting Next state after finishing packet transmission 0 (00) IDLE 1 (01) FSTXON 2 (10) Stay in TX (start sending preamble) 3 (11) RX SWRS082 Page 74 of 92 CC1100E 0x18: MCSM0– Main Radio Control State Machine Configuration Bit Field Name Reset 7:6 5:4 FS_AUTOCAL[1:0] 0 (00) R/W Description R0 Not used R/W Automatically calibrate when going to RX or TX, or back to IDLE Setting When to perform automatic calibration 0 (00) Never (manually calibrate using SCAL strobe) 1 (01) When going from IDLE to RX or TX (or FSTXON) 2 (10) When going from RX or TX back to IDLE automatically 3 (11) Every 4th time when going from RX or TX to IDLE automatically In some automatic wake-on-radio (WOR) applications, using setting 3 (11) can significantly reduce current consumption. 3:2 PO_TIMEOUT 1 (01) R/W Programs the number of times the six-bit ripple counter must expire after XOSC has stabilized before CHP_RDYn goes low. If XOSC is on (stable) during power-down, PO_TIMEOUT should be set so that the regulated digital supply voltage has time to stabilize before CHP_RDYn goes low (PO_TIMEOUT=2 recommended). Typical start-up time for the voltage regulator is 50 μs. If XOSC is off during power-down and the regulated digital supply voltage has sufficient time to stabilize while waiting for the crystal to be stable, PO_TIMEOUT can be set to 0. For robust operation it is recommended to use PO_TIMEOUT=2. Setting Expire count Timeout after XOSC start 0 (00) 1 Approx. 2.3 – 2.4 μs 1 (01) 16 Approx. 37 – 39 μs 2 (10) 64 Approx. 149 – 155 μs 3 (11) 256 Approx. 597 – 620 μs Exact timeout depends on crystal frequency. 1 PIN_CTRL_EN 0 R/W Enables the pin radio control option 0 XOSC_FORCE_ON 0 R/W Force the XOSC to stay on in the SLEEP state. SWRS082 Page 75 of 92 CC1100E 0x19: FOCCFG – Frequency Offset Compensation Configuration Bit Field Name Reset 7:6 R/W Description R0 Not used 5 FOC_BS_CS_GATE 1 R/W If set, the demodulator freezes the frequency offset compensation and clock recovery feedback loops until the CS signal goes high. 4:3 FOC_PRE_K[1:0] 2 (10) R/W The frequency compensation loop gain to be used before a sync word is detected. 2 1:0 FOC_POST_K FOC_LIMIT[1:0] 1 2 (10) R/W R/W Setting Freq. compensation loop gain before sync word 0 (00) K 1 (01) 2K 2 (10) 3K 3 (11) 4K The frequency compensation loop gain to be used after a sync word is detected. Setting Freq. compensation loop gain after sync word 0 Same as FOC_PRE_K 1 K/2 The saturation point for the frequency offset compensation algorithm: Setting Saturation point (max compensated offset) 0 (00) ±0 (no frequency offset compensation) 1 (01) ±BWCHAN/8 2 (10) ±BWCHAN/4 3 (11) ±BWCHAN/2 Frequency offset compensation is not supported for ASK/OOK; Always use FOC_LIMIT=0 with these modulation formats. SWRS082 Page 76 of 92 CC1100E 0x1A: BSCFG – Bit Synchronization Configuration Bit Field Name Reset R/W Description 7:6 BS_PRE_KI[1:0] 1 (01) R/W The clock recovery feedback loop integral gain to be used before a sync word is detected (used to correct offsets in data rate): 5:4 3 2 1:0 BS_PRE_KP[1:0] BS_POST_KI BS_POST_KP BS_LIMIT[1:0] 2 (10) 1 1 0 (00) R/W R/W R/W R/W Setting Clock recovery loop integral gain before sync word 0 (00) KI 1 (01) 2KI 2 (10) 3KI 3 (11) 4KI The clock recovery feedback loop proportional gain to be used before a sync word is detected. Setting Clock recovery loop proportional gain before sync word 0 (00) KP 1 (01) 2KP 2 (10) 3KP 3 (11) 4KP The clock recovery feedback loop integral gain to be used after a sync word is detected. Setting Clock recovery loop integral gain after sync word 0 Same as BS_PRE_KI 1 KI /2 The clock recovery feedback loop proportional gain to be used after a sync word is detected. Setting Clock recovery loop proportional gain after sync word 0 Same as BS_PRE_KP 1 KP The saturation point for the data rate offset compensation algorithm: Setting Data rate offset saturation (max data rate difference) 0 (00) ±0 (No data rate offset compensation performed) 1 (01) ±3.125 % data rate offset 2 (10) ±6.25 % data rate offset 3 (11) ±12.5 % data rate offset SWRS082 Page 77 of 92 CC1100E 0x1B: AGCCTRL2 – AGC Control Bit Field Name Reset R/W Description 7:6 MAX_DVGA_GAIN[1:0] 0 (00) R/W Reduces the maximum allowable DVGA gain. 5:3 2:0 MAX_LNA_GAIN[2:0] MAGN_TARGET[2:0] 0 (000) 3 (011) R/W R/W Setting Allowable DVGA settings 0 (00) All gain settings can be used 1 (01) The highest gain setting can not be used 2 (10) The 2 highest gain settings can not be used 3 (11) The 3 highest gain settings can not be used Sets the maximum allowable LNA + LNA 2 gain relative to the maximum possible gain. Setting Maximum allowable LNA + LNA 2 gain 0 (000) Maximum possible LNA + LNA 2 gain 1 (001) Approx. 2.6 dB below maximum possible gain 2 (010) Approx. 6.1 dB below maximum possible gain 3 (011) Approx. 7.4 dB below maximum possible gain 4 (100) Approx. 9.2 dB below maximum possible gain 5 (101) Approx. 11.5 dB below maximum possible gain 6 (110) Approx. 14.6 dB below maximum possible gain 7 (111) Approx. 17.1 dB below maximum possible gain These bits set the target value for the averaged amplitude from the digital channel filter (1 LSB = 0 dB). Setting Target amplitude from channel filter 0 (000) 24 dB 1 (001) 27 dB 2 (010) 30 dB 3 (011) 33 dB 4 (100) 36 dB 5 (101) 38 dB 6 (110) 40 dB 7 (111) 42 dB SWRS082 Page 78 of 92 CC1100E 0x1C: AGCCTRL1 – AGC Control Bit Field Name Reset 7 R/W Description R0 Not used 6 AGC_LNA_PRIORITY 1 R/W Selects between two different strategies for LNA and LNA 2 gain adjustment. When 1, the LNA gain is decreased first. When 0, the LNA 2 gain is decreased to minimum before decreasing LNA gain. 5:4 CARRIER_SENSE_REL_THR[1:0] 0 (00) R/W Sets the relative change threshold for asserting carrier sense 3:0 CARRIER_SENSE_ABS_THR[3:0] 0 (0000) R/W Setting Carrier sense relative threshold 0 (00) Relative carrier sense threshold disabled 1 (01) 6 dB increase in RSSI value 2 (10) 10 dB increase in RSSI value 3 (11) 14 dB increase in RSSI value Sets the absolute RSSI threshold for asserting carrier sense. The 2-complement signed threshold is programmed in steps of 1 dB and is relative to the MAGN_TARGET setting. Setting Carrier sense absolute threshold (Equal to channel filter amplitude when AGC has not decreased gain) SWRS082 -8 (1000) Absolute carrier sense threshold disabled -7 (1001) 7 dB below MAGN_TARGET setting … … -1 (1111) 1 dB below MAGN_TARGET setting 0 (0000) At MAGN_TARGET setting 1 (0001) 1 dB above MAGN_TARGET setting … … 7 (0111) 7 dB above MAGN_TARGET setting Page 79 of 92 CC1100E 0x1D: AGCCTRL0 – AGC Control Bit Field Name Reset R/W Description 7:6 HYST_LEVEL[1:0] 2 (10) R/W Sets the level of hysteresis on the magnitude deviation (internal AGC signal that determine gain changes). 5:4 3:2 1:0 WAIT_TIME[1:0] AGC_FREEZE[1:0] FILTER_LENGTH[1:0] 1 (01) 0 (00) 1 (01) R/W R/W R/W Setting Description 0 (00) No hysteresis, small symmetric dead zone, high gain 1 (01) Low hysteresis, small asymmetric dead zone, medium gain 2 (10) Medium hysteresis, medium asymmetric dead zone, medium gain 3 (11) Large hysteresis, large asymmetric dead zone, low gain Sets the number of channel filter samples from a gain adjustment has been made until the AGC algorithm starts accumulating new samples. Setting Channel filter samples 0 (00) 8 1 (01) 16 2 (10) 24 3 (11) 32 Control when the AGC gain should be frozen. Setting Function 0 (00) Normal operation. Always adjust gain when required. 1 (01) The gain setting is frozen when a sync word has been found. 2 (10) Manually freeze the analogue gain setting and continue to adjust the digital gain. 3 (11) Manually freezes both the analogue and the digital gain setting. Used for manually overriding the gain. Sets the averaging length for the amplitude from the channel filter. Sets the OOK/ASK decision boundary for OOK/ASK reception. Setting Channel filter samples OOK/ASK decision boundary 0 (00) 8 4 dB 1 (01) 16 8 dB 2 (10) 32 12 dB 3 (11) 64 16 dB 0x1E: WOREVT1 – High Byte Event0 Timeout Bit Field Name Reset R/W Description 7:0 EVENT0[15:8] 135 (0x87) R/W High byte of EVENT0 timeout register t Event 0 SWRS082 750 EVENT 0 2 5WOR _ RES f XOSC Page 80 of 92 CC1100E 0x1F: WOREVT0 –Low Byte Event0 Timeout Bit Field Name Reset R/W Description 7:0 EVENT0[7:0] 107 (0x6B) R/W Low byte of EVENT0 timeout register. The default EVENT0 value gives 1.0s timeout, assuming a 26.0 MHz crystal. 0x20: WORCTRL – Wake On Radio Control Bit Field Name Reset R/W Description 7 RC_PD 1 R/W Power down signal to RC oscillator. When written to 0, automatic initial calibration will be performed 6:4 EVENT1[2:0] 7 (111) R/W Timeout setting from register block. Decoded to Event 1 timeout. RC oscillator clock frequency equals FXOSC/750, which is 34.7 – 36 kHz, depending on crystal frequency. The table below lists the number of clock periods after Event 0 before Event 1 times out. 3 RC_CAL 1 2 1:0 WOR_RES 0 (00) Setting tEvent1 0 (000) 4 (0.111 – 0.115 ms) 1 (001) 6 (0.167 – 0.173 ms) 2 (010) 8 (0.222 – 0.230 ms) 3 (011) 12 (0.333 – 0.346 ms) 4 (100) 16 (0.444 – 0.462 ms) 5 (101) 24 (0.667 – 0.692 ms) 6 (110) 32 (0.889 – 0.923 ms) 7 (111) 48 (1.333 – 1.385 ms) R/W Enables (1) or disables (0) the RC oscillator calibration. R0 Not used R/W Controls the Event 0 resolution as well as maximum timeout of the WOR module and maximum timeout under normal RX operation:: Setting Resolution (1 LSB) Max timeout 0 (00) 1 period (28 – 29 μs) 1.8 – 1.9 seconds 5 1 (01) 2 periods (0.89 – 0.92 ms) 58 – 61 seconds 2 (10) 210 periods (28 – 30 ms) 31 – 32 minutes 3 (11) 15 2 periods (0.91 – 0.94 s) 16.5 – 17.2 hours Note that WOR_RES should be 0 or 1 when using WOR because WOR_RES > 1 will give a very low duty cycle. In normal RX operation all settings of WOR_RES can be used. SWRS082 Page 81 of 92 CC1100E 0x21: FREND1 – Front End RX Configuration Bit Field Name Reset R/W Description 7:6 LNA_CURRENT[1:0] 1 (01) R/W Adjusts front-end LNA PTAT current output 5:4 LNA2MIX_CURRENT[1:0] 1 (01) R/W Adjusts front-end PTAT outputs 3:2 LODIV_BUF_CURRENT_RX[1:0] 1 (01) R/W Adjusts current in RX LO buffer (LO input to mixer) 1:0 MIX_CURRENT[1:0] 2 (10) R/W Adjusts current in mixer 0x22: FREND0 – Front End TX Configuration Bit Field Name Reset 7:6 5:4 LODIV_BUF_CURRENT_TX[1:0] 1 (0x01) 3 2:0 PA_POWER[2:0] 0 (0x00) R/W Description R0 Not used R/W Adjusts current TX LO buffer (input to PA). The value to use in this field is given by the SmartRF Studio software [8]. R0 Not used R/W Selects PA power setting. This value is an index to the PATABLE, which can be programmed with up to 8 different PA settings. In OOK/ASK mode, this selects the PATABLE index to use when transmitting a ‘1’. PATABLE index zero is used in OOK/ASK when transmitting a ‘0’. The PATABLE settings from index ‘0’ to the PA_POWER value are used for ASK TX shaping, and for power ramp-up/ramp-down at the start/end of transmission in all TX modulation formats. 0x23: FSCAL3 – Frequency Synthesizer Calibration Bit Field Name Reset R/W Description 7:6 FSCAL3[7:6] 2 (0x02) R/W Frequency synthesizer calibration configuration. The value to write in this field before calibration is given by the SmartRF Studio software. 5:4 CHP_CURR_CAL_EN[1:0] 2 (0x02) R/W Disable charge pump calibration stage when 0. 3:0 FSCAL3[3:0] 9 (1001) R/W Frequency synthesizer calibration results register. Digital bit vector defining the charge pump output current, on an FSCAL3[3:0]/4 exponential scale: I_OUT = I0·2 Fast frequency hopping without calibration for each hop can be done by calibrating upfront for each frequency and saving the resulting FSCAL3, FSCAL2 and FSCAL1 register values. Between each frequency hop, calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1 register values corresponding to the next RF frequency. Please note that for operation at 950-956 MHz targeting ARIB STD-T96 FSCAL3 [7:4] needs to be set to 0xA SWRS082 Page 82 of 92 CC1100E 0x24: FSCAL2 – Frequency Synthesizer Calibration Bit Field Name Reset 7:6 R/W Description R0 Not used 5 VCO_CORE_H_EN 0 R/W Choose high (1) / low (0) VCO 4:0 FSCAL2[4:0] 10 (0x0A) R/W Frequency synthesizer calibration results register. VCO current calibration result and override value. Fast frequency hopping without calibration for each hop can be done by calibrating upfront for each frequency and saving the resulting FSCAL3, FSCAL2 and FSCAL1 register values. Between each frequency hop, calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1 register values corresponding to the next RF frequency. 0x25: FSCAL1 – Frequency Synthesizer Calibration Bit Field Name Reset 7:6 5:0 FSCAL1[5:0] 32 (0x20) R/W Description R0 Not used R/W Frequency synthesizer calibration results register. Capacitor array setting for VCO coarse tuning. Fast frequency hopping without calibration for each hop can be done by calibrating upfront for each frequency and saving the resulting FSCAL3, FSCAL2 and FSCAL1 register values. Between each frequency hop, calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1 register values corresponding to the next RF frequency. 0x26: FSCAL0 – Frequency Synthesizer Calibration Bit Field Name Reset FSCAL0[6:0] 13 (0x0D) 7 6:0 R/W Description R0 Not used R/W Frequency synthesizer calibration control. The value to use in this register is given by the SmartRF Studio software [8]. Please note that for operation at 950-956 MHz targeting ARIB STD-T96, FSCAL0 needs to be set to 0x07 0x27: RCCTRL1 – RC Oscillator Configuration Bit Field Name 7 6:0 RCCTRL1[6:0] Reset R/W Description 0 R0 Not used 65 (0x41) R/W RC oscillator configuration. 0x28: RCCTRL0 – RC Oscillator Configuration Bit Field Name 7 6:0 RCCTRL0[6:0] Reset R/W Description 0 R0 Not used 0 (0x00) R/W RC oscillator configuration. SWRS082 Page 83 of 92 CC1100E 29.2 Configuration Register Details – Registers that Loose Programming in SLEEP State 0x29: FSTEST – Frequency Synthesizer Calibration Control Bit Field Name Reset R/W Description 7:0 FSTEST[7:0] 89 (0x59) R/W For test only. Do not write to this register. 0x2A: PTEST – Production Test Bit Field Name Reset R/W Description 7:0 PTEST[7:0] 127 (0x7F) R/W Writing 0xBF to this register makes the on-chip temperature sensor available in the IDLE state. The default 0x7F value should then be written back before leaving the IDLE state. Other use of this register is for test only. 0x2B: AGCTEST – AGC Test Bit Field Name Reset R/W Description 7:0 AGCTEST[7:0] 63 (0x3F) R/W For test only. Do not write to this register. 0x2C: TEST2 – Various Test Settings Bit Field Name Reset R/W Description 7:0 TEST2[7:0] 136 (0x88) R/W The value to use in this register is given by the SmartRF Studio software [8]. This register will be forced to 0x88 or 0x81 when it wakes up from SLEEP mode, depending on the configuration of FIFOTHR. ADC_RETENTION. Note that the value read from this register when waking up from SLEEP always is the reset value (0x88) regardless of the ADC_RETENTION setting. The inversion of some of the bits due to the ADC_RETENTION setting is only seen INTERNALLY in the analog part. 0x2D: TEST1 – Various Test Settings Bit Field Name Reset R/W Description 7:0 TEST1[7:0] 49 (0x31) R/W The value to use in this register is given by the SmartRF Studio software [8]. This register will be forced to 0x31 or 0x35 when it wakes up from SLEEP mode, depending on the configuration of FIFOTHR. ADC_RETENTION. Note that the value read from this register when waking up from SLEEP always is the reset value (0x31) regardless of the ADC_RETENTION setting. The inversion of some of the bits due to the ADC_RETENTION setting is only seen INTERNALLY in the analog part. SWRS082 Page 84 of 92 CC1100E 0x2E: TEST0 – Various Test Settings Bit Field Name Reset R/W Description 7:2 TEST0[7:2] 2 (0x02) R/W The value to use in this register is given by the SmartRF Studio software [8]. 1 VCO_SEL_CAL_EN 1 R/W Enable VCO selection calibration stage when 1 0 TEST0[0] 1 R/W The value to use in this register is given by the SmartRF Studio software [8]. 29.3 Status Register Details 0x30 (0xF0): PARTNUM – Chip ID Bit Field Name Reset R/W Description 7:0 PARTNUM[7:0] 0 (0x00) R Chip part number 0x31 (0xF1): VERSION – Chip ID Bit Field Name Reset R/W Description 7:0 VERSION[7:0] 5 (0x05) R Chip version number. 0x32 (0xF2): FREQEST – Frequency Offset Estimate from Demodulator Bit Field Name Reset 7:0 FREQOFF_EST R/W Description R The estimated frequency offset (2’s complement) of the carrier. Resolution is FXTAL/214 (1.59 - 1.65 kHz); range is ±202 kHz to ±210 kHz, depending on XTAL frequency. Frequency offset compensation is only supported for 2-FSK, GFSK, and MSK modulation. This register will read 0 when using ASK or OOK modulation. 0x33 (0xF3): LQI – Demodulator Estimate for Link Quality Bit Field Name 7 6:0 Reset R/W Description CRC OK R The last CRC comparison matched. Cleared when entering/restarting RX mode. LQI_EST[6:0] R The Link Quality Indicator estimates how easily a received signal can be demodulated. Calculated over the 64 symbols following the sync word 0x34 (0xF4): RSSI – Received Signal Strength Indication Bit Field Name 7:0 RSSI Reset R/W Description R Received signal strength indicator SWRS082 Page 85 of 92 CC1100E 0x35 (0xF5): MARCSTATE – Main Radio Control State Machine State Bit Field Name Reset 7:5 4:0 MARC_STATE[4:0] R/W Description R0 Not used R Main Radio Control FSM State Value State name State (Figure 20, page 45) 0 (0x00) SLEEP SLEEP 1 (0x01) IDLE IDLE 2 (0x02) XOFF XOFF 3 (0x03) VCOON_MC MANCAL 4 (0x04) REGON_MC MANCAL 5 (0x05) MANCAL MANCAL 6 (0x06) VCOON FS_WAKEUP 7 (0x07) REGON FS_WAKEUP 8 (0x08) STARTCAL CALIBRATE 9 (0x09) BWBOOST SETTLING 10 (0x0A) FS_LOCK SETTLING 11 (0x0B) IFADCON SETTLING 12 (0x0C) ENDCAL CALIBRATE 13 (0x0D) RX RX 14 (0x0E) RX_END RX 15 (0x0F) RX_RST RX 16 (0x10) TXRX_SWITCH TXRX_SETTLING 17 (0x11) RXFIFO_OVERFLOW RXFIFO_OVERFLOW 18 (0x12) FSTXON FSTXON 19 (0x13) TX TX 20 (0x14) TX_END TX 21 (0x15) RXTX_SWITCH RXTX_SETTLING 22 (0x16) TXFIFO_UNDERFLOW TXFIFO_UNDERFLOW Note: it is not possible to read back the SLEEP or XOFF state numbers because setting CSn low will make the chip enter the IDLE mode from the SLEEP or XOFF states. 0x36 (0xF6): WORTIME1 – High Byte of WOR Time Bit Field Name 7:0 TIME[15:8] Reset R/W Description R High byte of timer value in WOR module 0x37 (0xF7): WORTIME0 – Low Byte of WOR Time Bit Field Name 7:0 TIME[7:0] Reset R/W Description R Low byte of timer value in WOR module SWRS082 Page 86 of 92 CC1100E 0x38 (0xF8): PKTSTATUS – Current GDOx Status and Packet Status Bit Field Name 7 Reset R/W Description CRC_OK R The last CRC comparison matched. Cleared when entering/restarting RX mode. 6 CS R Carrier sense 5 PQT_REACHED R Preamble Quality reached 4 CCA R Channel is clear 3 SFD R Sync word found. Asserted when sync word has been sent / received, and de-asserted at the end of the packet. In RX, this bit will de-assert when the optional address check fails or the radio enter RX_OVERFLOW state. In TX this bit will de-assert if the radio enters TX_UNDERFLOW state. 2 GDO2 R Current GDO2 value. Note: the reading gives the non-inverted value irrespective of what IOCFG2.GDO2_INV is programmed to. It is not recommended to check for PLL lock by reading PKTSTATUS [2] with GDO2_CFG=0x0A. 1 0 GDO0 R0 Not used R Current GDO0 value. Note: the reading gives the non-inverted value irrespective of what IOCFG0.GDO0_INV is programmed to. It is not recommended to check for PLL lock by reading PKTSTATUS [0] with GDO0_CFG=0x0A. 0x39 (0xF9): VCO_VC_DAC – Current Setting from PLL Calibration Module Bit Field Name Reset 7:0 VCO_VC_DAC[7:0] R/W Description R Status register for test only. 0x3A (0xFA): TXBYTES – Underflow and Number of Bytes Bit Field Name Reset R/W 7 TXFIFO_UNDERFLOW R 6:0 NUM_TXBYTES R Description Number of bytes in TX FIFO 0x3B (0xFB): RXBYTES – Overflow and Number of Bytes Bit Field Name Reset R/W 7 RXFIFO_OVERFLOW R 6:0 NUM_RXBYTES R Description Number of bytes in RX FIFO 0x3C (0xFC): RCCTRL1_STATUS – Last RC Oscillator Calibration Result Bit Field Name 7 6:0 RCCTRL1_STATUS[6:0] Reset R/W Description R0 Not used R Contains the value from the last run of the RC oscillator calibration routine. For usage description refer to AN047 [7] SWRS082 Page 87 of 92 CC1100E 0x3D (0xFD): RCCTRL0_STATUS – Last RC Oscillator Calibration Result Bit Field Name 7 6:0 RCCTRL0_STATUS[6:0] Reset R/W Description R0 Not used R Contains the value from the last run of the RC oscillator calibration routine. For usage description refer to Application Note AN047 [7]. SWRS082 Page 88 of 92 CC1100E 30 Package Description (QFN 20) 30.1 Recommended PCB Layout for Package (QFN 20) Figure 29: Recommended PCB Layout for QFN 20 Package Note: Figure 29 is an illustration only and not to scale. There are five 10 mil via holes distributed symmetrically in the ground pad under the package. See also the CC1100EEM reference designs ([3] and [4]). 30.2 Soldering Information The recommendations for lead-free reflow in IPC/JEDEC J-STD-020 should be followed. SWRS082 Page 89 of 92 CC1100E 30.3 Ordering Information Orderable Device Status Package Type Package Drawing Pins Package Qty Eco Plan (2) (1) Lead Finish MSL Peak Temp (3) CC1100ERTKR Active QFN RTK 20 3000 Green (RoHS & no Sb/Br) Cu NiPdAu LEVEL3-260C Green (RoHS & no Sb/Br) Cu NiPdAu CC1100ERTKT Active QFN RTK 20 250 1 YEAR LEVEL3-260C 1 YEAR Orderable Evaluation Module Description Minimum Order Quantity CC1100E-EMK470 CC1100E Evaluation Module Kit, 470-510 MHz 1 CC1100E-EMK950 CC1100E Evaluation Module Kit, 950-960 MHz 1 Table 42: Ordering Information SWRS082 Page 90 of 92 CC1100E References [1] CC1101 Datasheet [2] CC1100 Datasheet [3] CC1100E EM 470 MHz Reference Design [4] CC1100E EM 950 MHz Reference Design [5] CC1100E Errata Note [6] ARIB STD-T96 ver.1.0 [7] AN047 CC1100/CC2500 – Wake-On-Radio (swra126.pdf) [8] SmartRF Studio (swrc046.zip) [9] CC1100 CC1101 CC1100E CC2500 Examples Libraries (swrc021.zip) [10] CC1100/CC1150DK, CC1101DK, and CC2500/CC2550DK Examples and Libraries User Manual (swru109.pdf) [11] DN010 Close-in Reception with CC1101 (and CC1100E) (swra147.pdf) [12] DN015 Permanent Frequency Offset Compensation (swra159.pdf) [13] DN505 RSSI Interpretation and Timing (swra114.pdf) [14] AN058 Antenna Selection Guide (swra161.pdf) [15] DN022 CC11xx OOK/ASK register settings (swra215.pdf) [16] DN005 CC11xx Sensitivity versus Frequency Offset and Crystal Accuracy (swra122.pdf) [17] DN501 PATABLE Access [18] DN504 FEC Implementation ® SWRS082 Page 91 of 92 CC1100E 31 General Information 31.1 Document History Revision Date Description/Changes SWRS082 April 2009 First data sheet release Table 43: Document History SWRS082 Page 92 of 92 PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC1100ERGPR QFN RGP 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 CC1100ERGPT QFN RGP 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 27-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC1100ERGPR QFN RGP 20 3000 338.1 338.1 20.6 CC1100ERGPT QFN RGP 20 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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