Reversible Motor Drivers for Brush Motors 0.5A or Less Reversible Motor Drivers (Single Moter) BH6578FVM,BD7931F No.11008EBT05 ●Description The BH6578FVM and BD7931F are reversible motor drivers with a wide output dynamic range, with power MOS used for the output transistor. The motor drivers can set the output mode to four modes of normal rotation, reverse rotation, stop (idling), and braking in accordance with input logic (2 inputs). ●Features 1) Wide dynamic range loading driver with MOS output, Ron = 1.0Ω (Top+Bottom) 2) With loading driver voltage setting terminal 3) Built-in thermal shutdown circuit (TSD) 4) MSOP8 package (BH6578FVM) 5) SOP8 package (BD7931F) ●Applications Tray loading of CD/DVD, applications using DC motors ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings BH6578FVM BD7931F Unit Supply Voltage Vcc 7 15 V Power dissipation Pd 0.55 * 0.69** W Operating temperature Topr -35～+85 -40～85 ℃ Storage temperature Tstg -55～+150 ℃ Output current Iout 500 mA Tjmax 150 ℃ Junction temperature * ** When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 4.4 mW/°C. When 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. When used at Ta=25°C or higher, derated at 5.5 mW/°C. ●Recommended operating range Parameter Symbol Supply voltage Vcc ●Truth table BH6578FVM,BD7931F INPUT OUTPUT Range BH6578FVM BD7931F 4.5~5.5 4.5～ 14 Unit V Function INFWD INREV OUT+ OUT- L L Hi Z Hi Z High Impedance L H L H REV mode H L H L FWD mode H H L L Brake mode Hiz：Hi-impedance www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/8 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Electrical characteristics BH6578FVM(Unless otherwise specified, Ta=25℃, Vcc=5V) Parameter Symbol Limits. Unit Conditions Min. Typ. Max. ICC1 - 0.4 0.8 mA No load VOFSL -15 0 +15 mV Brake mode Input threshold voltage H VIH 2.0 － Vcc V Input threshold voltage L VIL GND － 0.5 V ON resistance RON － 1.0 1.8 Ω Io=500mA,Top+Bottom Voltage gain (Loading) GVLD 4.5 6.0 7.5 dB *1 ΔGVLD -2.0 0 2.0 dB Input bias current IINL － 86 120 µA FIN=5V,RIN=5V LDCONT bias current ILDC － － 300 nA CONT=2V Standby current (Loading Driver) Output offset voltage Voltage gain difference (Loading) * No radiation-resistant design is adopted for the present product. *1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage when CONT=3.5V, voltage gain can be expressed by the following equation:GVLD=20log|(V02-V01)/2.5| BD7931F(Unless otherwise specified, Ta=25℃, Vcc=8V) Parameter Symbol Limits. Min. Typ. Max. Unit Conditions Standby current ICC1 - 0 5 µA Supply current 1 ICC2 - 1.1 2.2 mA FIN=5V,RIN=0V Supply current 2 ICC3 - 0.8 1.6 mA FIN=RIN=5V VOFSL -35 0 +35 mV Brake mode Input threshold voltage H VIH 2.0 － Vcc V Input threshold voltage L VIL GND － 0.5 V ON resistance RON － 1.0 1.8 Ω Io=500mA,Top+Bottom Voltage gain (Loading) GVLD 4.0 6.0 8.0 dB *2 ΔGVLD -2.0 0 2.0 dB Input bias current IINL － 165 250 µA FIN=5V,RIN=5V LDCONT bias current ILDC － － 300 nA CONT=5V (Loading Driver) Output offset voltage Voltage gain difference (Loading) * No radiation-resistant design is adopted for the present product. *1. Let V01 denote output-to-output voltage when CONT=1V and V02 denote output-to-output voltage when CONT=3.5V, voltage gain can be expressed by the following equation:GVLD=20log|(V02-V01)/2.5| www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/8 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Reference data 0.4 0.3 0.2 0.1 5 85℃ 25℃ -35℃ 0.3 0.2 0.1 0 100 200 300 400 100 400 0 500 -0.2 -35℃ 25℃ 85℃ -0.3 100 200 300 400 -0.2 -35℃ 25℃ 85℃ -0.3 100 200 300 400 0 500 0.1 0.0 200 300 400 0.1 100 200 300 400 500 0 40℃ 25℃ 85℃ 100 200 300 400 500 Load current[mA] Fig.10 Output loss voltage H(BD7931F) Vcc=8V, CONT=OPEN FWD mode www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3 4 5 0 85℃ 25℃ -40℃ -2 -0.1 -0.2 40℃ 25℃ 85℃ -0.3 -4 -6 -8 -10 -0.4 0 2 Fig.9 Voltage gain (BD7931F) Vcc=8V, CONT=SWEEP RL=20Ω+47µH Output voltage[V -0.2 1 Input voltage : LDCONT[V] Fig.8 Output loss voltage L(BD7931F) Vcc=8V, CONT=OPEN REV mode Loss voltage[V] -0.1 -0.4 -40℃ 25℃ 85℃ Load current[mA] 0.0 -0.3 4 0 0 0.0 5 6 2 Load current[mA] Fig.7 Output loss voltage L(BD7931F) Vcc=8V, CONT=OPEN FWD mode 4 8 0.2 500 3 10 85℃ 25℃ -35℃ 0.3 2 Fig.6 Voltage gain (BH6578FVM) Vcc=5V, CONT=SWEEP RL=8Ω+47µH 0.0 100 1 Input voltage : LDCONT[V] Fig.5 Output loss voltage H(BH6578FVM) Vcc=5V, CONT=OPEN REV mode 0.4 0.2 0 -3 Load current[mA] Loss voltage[V] 0.3 -2 -5 0 85℃ 25℃ -35℃ 5 -4 Output voltage[V 0.4 4 85℃ 25℃ -35℃ -1 Load current[mA] Fig.4 Output loss voltage H(BH6578FVM) Vcc=5V, CONT=OPEN FWD mode 3 0 -0.1 500 2 Fig.3 Voltage gain(BH6578FVM) Vcc=5V, CONT=SWEEP RL=8Ω+47µH -0.4 0 1 Input voltage : LDCONT[V] Output voltage[V Loss voltage[V] Loss voltage[V] 300 0.0 -0.4 Loss voltage[V] 200 Fig.2 Output loss voltage L(BH6578FVM) Vcc=5V, CONT=OPEN REV mode 0.0 -0.1 -35℃ 25℃ 85℃ Load current[mA] Load current[mA] Fig.1 Output loss voltage L(BH6578FVM) Vcc=5V, CONT=OPEN FWD mode 2 0 0 500 3 1 0.0 0.0 Loss voltage[V] 4 Output voltage[V 85℃ 25℃ -35℃ Loss voltage[V] Loss voltage[V] 0.4 0 100 200 300 400 500 Load current[mA] Fig.11 Output loss voltage H(BD7931F) Vcc=8V, CONT=OPEN REV mode 3/8 0 1 2 3 4 5 Input voltage : LDCONT[V] Fig.12 Voltage gain(BD7931F) Vcc=8V, CONT=SWEEP RL=20Ω+47µH 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Thermal derating curves BH6578FVM BD7931F 0.8 0.6 0.6 [W] [W] 0.8 0.4 Pd Pd 0.4 0.2 0 0 25 50 75 85 100 AMBIENT TEMPERATURE 125 : 150 0.2 0 175 0 25 Ta [℃] 50 75 85 100 125 AMBIENT TEMPERATURE Pd : Power Dissipation : 150 175 Ta [℃] Pd : Power Dissipation *when 70 mmx70 mmx1.6 mm thick glass epoxy substrate with less than 3% copper foil occupancy ratio is mounted. ●Block diagram, applied circuit diagram example BH6578FVM, BD7931F (in common) FWD IN 8 F LDCONT PREGND REV IN 7 6 5 R PRE GND Control Logic LDCONT + T.S.D POW CMOS H-Bridge 1 2 3 POW GND 4 M Vcc 0.1µF Bypass capacitor POWG T.S.D: Thermal shutdown Fig.13 ●Pin descriptions Pin No. Pin Name Function Pin No. PinName Function 1 Vcc Supply voltage 5 GND_S 2 OUT+ FWD output 6 LDCONT 3 OUT- REV output 7 INREV REV input 4 GND Power ground 8 INFWD FWD input www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/8 Signal ground Loading driver voltage setting pin 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Interfaces BH6578FVM BD7931F LDCONT LDCONT VCC 10KΩ 10KΩ 6 6 39KΩ 49.6KΩ Fig.14 Fig.17 OUT+/OUT- VCC VCC VCC VCC FIN/RIN OUT+/OUT- INFWD/INREV 200KΩ 200KΩ 7 2 3 8 2 50KΩ 3 7 8 50KΩ 50KΩ 50KΩ 50KΩ 50KΩ Fig.15 Fig.16 Fig.18 Fig.19 ●Operations (1) CONTROL LOGIC Operation of each mode is carried out as follows: + When INFWD is “H” and INREV is “L,” the normal rotation mode is achieved and current flows from OUT to OUT . When both INFWD and INREV are “H,” the brake mode is achieved. Operation in such event is described as follows: the top-side transistor turns OFF to stop supplying motor drive current, the bottom-side transistor turns ON to absorb + reverse EMF of motor and applies brake to motor. When both INFWD and INREV are “L,” OUT and OUT potentials become open and the motor stops. (2) LOADING CONT Controlling the output voltage can vary voltage applied to the motor and can control the motor speed. By the voltage entered to the CONT terminal, the output H voltage can be controlled (gain 6dB Typ.). Even if the voltage entered is increased more than necessary (Vcc Max), the output voltage never exceeds the power supply voltage. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/8 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Notes for use (1) Absolute maximum ratings In the event that applied voltage (VCC, VM), working temperature range (Topr), and other absolute maximum rating are exceeded, the IC may be destroyed. Because it is unable to identify the short-circuit mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. (2) Reverse connection of power supply connector Reverse connection of power supply connector may destroy the IC. Take necessary measures to protect the IC from reverse connection breakage such as externally inserting diodes across power supply and IC power supply terminal as well as across power supply and motor coil. (3) Power supply line Because return of current regenerated by reverse EMF of a motor occurs, take necessary measures such as inserting capacitors across the power supply and GND as a path for regenerated current, and determine the capacity value after thoroughly confirming that there would be no problems in various characteristics such as capacitance drop at low temperature which may occur with electrolytic capacitors. (4) Ground potential Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check if there is actually any terminal which provides voltage below GND including transient phenomena. (5) Thermal design Consider permissible dissipation (Pd) under actual working condition and carry out thermal design with sufficient margin provided. (6) Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. (7) Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. (8) ASO When IC is used, design in such a manner that the output transistor to a motor does not exceed absolute maximum ratings and ASO. (9) Thermal shutdown circuit (TSD) (common) When junction temperature (Tj) becomes thermal shutdown ON temperature 175°C, the thermal shutdown circuit (TSD circuit) is activated and driver output current is shorted. There is 25°C temperature hysteresis. The thermal shutdown protection circuit is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. (10) Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 0.1 µF between output and GND. (11) Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/8 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F (12) IC terminal input The present IC is a monolithic IC and has P+ isolation and a P substrate between elements to separate elements. With this P layer and N layer of each element, PN junction is formed, and various parasitic elements are formed. For example, when resistors and transistors are connected to terminals as is the case of Fig.20, where in the case of resistor, the potential difference satisfies the relation of ground (GND)>(terminal A), and in the case of transistor (NPN), the potential difference satisfies the relation of ground (GND)>(terminal B), PN junction works as a diode. Furthermore, in the case of transistor (NPN), a parasitic NPN transistor operates by the N-layer of other elements adjacent to the parasitic diode. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal. In addition, when the power supply voltage is not applied to IC, do not apply voltage to the input terminal, either. Similarly, when the power supply voltage is applied, each input terminals shall be the voltage below the power supply voltage or within the guaranteed values of electrical properties. Resistor Transistor(NPN) Terminal B Terminal A C Terminal B B E Terminal A N P+ N P P+ N Parasitic element N P+ B N P Parasitic element Parasitic element N C E P-sub P-sub GND P+ GND GND Parasitic element GND Fig.20 Example of the basic structure of a bipolar IC (13) GND wiring pattern If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/8 2011.05 - Rev.B Technical Note BH6578FVM,BD7931F ●Operating part numer B H 6 Part No BH BD 5 7 8 Part No 6578 7931 F V M - Package FVM : MSOP8 F : SOP8 T R Packaging and forming specification E2: Embossed tape and reel (SOP8) TR: Embossed tape and reel (MSOP8) MSOP8 <Tape and Reel information> 4.0±0.2 2.8±0.1 8 7 6 5 0.29±0.15 +6° 4° −4° 0.6±0.2 2.9±0.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 −0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 −0.04 0.08 S Direction of feed 0.65 Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. SOP8 <Tape and Reel information> 6 5 +6° 4° −4° 4.4±0.2 0.3MIN 7 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S 0.1 S 0.11 6.2±0.3 8 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) 1.27 1pin 0.42±0.1 Reel (Unit : mm) 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. 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