Product Folder Order Now Support & Community Tools & Software Technical Documents DAC8740H, DAC8741H, DAC8742H SBAS862 – JUNE 2017 DAC874xH, HART and FOUNDATION Fieldbus / PROFIBUS PA Modems 1 Features 3 Description • The DAC8740H, DAC8741H, and DAC8742H are HART®, FOUNDATION Fieldbus™, and PROFIBUS PA compliant low power modems designed for industrial process control and industrial automation applications. • • • • • • • • HART-Compliant Physical Layer Modem – 1200/2200 Hz HART FSK Sinusoids – Register Programmable Amplitude of TX Signals (DAC8741H / DAC8742H only) – Integrated RX Demodulator and Band-Pass Filter with Minimal External Components Foundation Fieldbus Compliant H1 Controller and Medium Attachment Unit (MAU) – 31.25 kbit/s Communication Based on Manchester Coded Bus Powered (MBP) – Integrated Manchester Encoder and Decoder – Compliant with PROFIBUS PA Low Quiescent Current: 200 uA Max Integrated 1.5 V Reference Flexible Clocking Options – External Crystal Oscillator – External CMOS Clock Digital Interface – DAC8740H: UART – DAC8741H: SPI – DAC8742H: UART and SPI Reliability: CRC Bit Error Checking, Watchdog Timer (DAC8741H and DAC8742H only) Wide Operating Temperature: –55°C to 125°C 4 mm x 4 mm QFN and 5 mm x 5 mm TQFP Packages In HART mode, the DAC874xH integrates all of the required circuitry to operate as half-duplex HART physical layer modems, in either slave or master configurations with minimal external components for filtering. In FOUNDATION Fieldbus mode, the DAC874xH integrates all of the required circuitry to operate as half-duplex FOUNDATION Fieldbus compliant H1 Controllers and MAUs. The HART, FOUNDATION Fieldbus, or PROFIBUS PA, data stream can be transferred from the microcontroller through either a UART interface or an integrated FIFO accessed by a SPI interface. The SPI interface includes an SDO pin for daisy-chain support, various interrupts, and other extended features. The devices operate from a supply of 2.7V to 5.5V while consuming only 200 uA, making them an excellent choice for loop-powered or 2-wire applications. They operate from –55°C to 125°C and are available in 24-lead VQFN and 32-lead TQFP packages. Device Information(1) PART NUMBER 2 Applications • • • PACKAGE BODY SIZE (NOM) DAC8740H VQFN (24) 4 mm × 4 mm DAC8741H VQFN (24) 4 mm × 4 mm DAC8742H TQFP (32) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Industrial Process Control and Automation PLC or DCS I/O Modules Field and Sensor Transmitters Simplified Schematic IOVDD CLK_CFG0 CLK_CFG1 CLKO Clock Generator XEN X1 X2 Precision Oscillator REF_EN REF REG_CAP AVDD Voltage Reference CD / IRQ UART_IN / CS DUPLEX / SDI UART_OUT / SDO UART_RTS / SCLK Digital Interface UART (DAC8740H), SPI (DAC8741H), UART/SPI (DAC8742H) RST HART Transmit Modulator DAC Buffer MOD_OUT MUX MOD_INF PA/FF Receive Modulator Carrier Detect Bandpass Filter MOD_IN IF_SEL DGND BPFEN GND Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION 1 DAC8740H, DAC8741H, DAC8742H SBAS862 – JUNE 2017 www.ti.com 4 Device and Documentation Support 4.1 Documentation Support 4.1.1 Related Documentation For related documentation see the following: DAC8742H Evaluation Module User's Guide (SLAU700) 4.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY DAC8740H Click here Click here Click here Click here Click here DAC8741H Click here Click here Click here Click here Click here DAC8742H Click here Click here Click here Click here Click here ADVANCE INFORMATION 4.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.5 Trademarks E2E is a trademark of Texas Instruments. FOUNDATION Fieldbus is a trademark of FieldComm Group. HART is a registered trademark of FieldComm Group. All other trademarks are the property of their respective owners. 4.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DAC8740H DAC8741H DAC8742H DAC8740H, DAC8741H, DAC8742H www.ti.com SBAS862 – JUNE 2017 5 Mechanical, Packaging, and Orderable Information ADVANCE INFORMATION The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: DAC8740H DAC8741H DAC8742H 3 DAC8740H, DAC8741H, DAC8742H SBAS862 – JUNE 2017 www.ti.com PACKAGE OUTLINE RGE0024F VQFN - 1 mm max height SCALE 3.300 PLASTIC QUAD FLATPACK - NO LEAD 4.1 3.9 A B PIN 1 INDEX AREA 0.5 0.3 4.1 3.9 ADVANCE INFORMATION 0.30 0.18 DETAIL OPTIONAL TERMINAL TYPICAL C 1 MAX SEATING PLANE 0.05 0.00 0.08 2.8 0.1 2X 2.5 (0.2) TYP 12 7 EXPOSED THERMAL PAD 20X 0.5 6 13 2X 2.5 25 1 SEE TERMINAL DETAIL 18 24X 24 PIN 1 ID (OPTIONAL) 19 0.5 24X 0.3 0.30 0.18 0.1 0.05 C A B 4222437/A 12/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Reference JEDEC registration MO-220. www.ti.com 4 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DAC8740H DAC8741H DAC8742H DAC8740H, DAC8741H, DAC8742H www.ti.com SBAS862 – JUNE 2017 EXAMPLE BOARD LAYOUT RGE0024F VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 2.8) SYMM 24 19 24X (0.6) 1 18 24X (0.24) 25 ADVANCE INFORMATION (1.15) TYP SYMM 20X (0.5) (3.8) 13 6 ( 0.2) TYP VIA 7 12 (R0.05) ALL PAD CORNERS (3.8) LAND PATTERN EXAMPLE SCALE:18X 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4222437/A 12/2015 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 6. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. www.ti.com Copyright © 2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: DAC8740H DAC8741H DAC8742H 5 DAC8740H, DAC8741H, DAC8742H SBAS862 – JUNE 2017 www.ti.com EXAMPLE STENCIL DESIGN RGE0024F VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.23) (0.715) TYP (R0.05) TYP 19 24 24X (0.6) 25 1 18 24X (0.24) ADVANCE INFORMATION (0.715) TYP SYMM 20X (0.5) (3.8) 13 6 METAL TYP 7 SYMM 12 (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 25: 77% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4222437/A 12/2015 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com 6 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: DAC8740H DAC8741H DAC8742H PACKAGE OPTION ADDENDUM www.ti.com 12-Nov-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DAC8740HRGER PREVIEW VQFN RGE 24 3000 TBD Call TI Call TI -55 to 125 DAC8740HRGET PREVIEW VQFN RGE 24 250 TBD Call TI Call TI -55 to 125 DAC 8740H DAC8742HPBS PREVIEW TQFP PBS 32 250 TBD Call TI Call TI -55 to 125 8742H DAC8742HPBSR PREVIEW TQFP PBS 32 1000 TBD Call TI Call TI -55 to 125 XDAC8740HRGET ACTIVE VQFN RGE 24 250 TBD Call TI Call TI -55 to 125 XDAC8742HPBST ACTIVE TQFP PBS 32 250 TBD Call TI Call TI -55 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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