ACPM-5205 UMTS Band5 (824-849MHz) 3x3mm Power Amplifier Module Data Sheet Description Features The ACPM-5205 is a fully matched 10-pin surface mount module developed for UMTS Band5. This power amplifier module operates in the 824-849MHz bandwidth. The ACPM-5205 meets stringent UMTS linearity requirements up to 27.5dBm output power. The 3mmx3mm form factor package is self contained, incorporating 50ohm input and output matching networks. The PA also contains internal DC blocking capacitors for RF input and output ports. x Thin Package (1.0mm typ) The ACPM-5205 features 5th generation of CoolPAM (CoolPAM5) circuit technology which supports 3 power modes – active bypass, mid power and high power modes. The CoolPAM is stage bypass technology enhancing PAE (power added efficiency) at low and medium power range. The active bypass feature is added to CoolPAM5 to enhance the PAE further at low output range and it enables the PA to have exceptionally low quiescent current. It dramatically saves the average power consumption and accordingly extends the talk time of mobiles and prolongs a battery life. A directional coupler is integrated into the module and both coupling and isolation ports are available externally, supporting daisy chain. The integrated coupler has excellent coupler directivity, which minimizes the coupled output power variation or delivered power variation caused by the load mismatch from the antenna. The coupler directivity, or the output power variation into the mismatched load, is critical to the TRP and SAR performance of the mobile phones in real field operations as well as compliance tests for the system specifications. The ACPM-5205 has integrated on-chip Vref and on-module bias switch as the one of the key features of the CoolPAM-5, so an external constant voltage source is not required, eliminating the external LDO regulators and switches from circuit boards of mobile devices. It also makes the PA fully digital-controllable by the Ven pin that simply turns the PA on and off from the digital control logic input from baseband chipsets. All of the digital control input pins such as the Ven, Vmode and Vbp are fully CMOS compatible and can operate down to the 1.35V logic. The current consumption by digital control pins is negligible. x Excellent Linearity x 3-mode power control with Vbp and Vmode – Bypass / Mid Power Mode / High Power Mode x High Efficiency at max output power x 10-pin surface mounting package x Internal 50ohm matching networks for both RF input and output x Integrated coupler – Coupler and Isolation ports for daisy chain x Green (Lead-free and RoHS compliant) Applications x UMTS Band5 Ordering Information Part Number Number of Devices Container ACPM-5205-TR1 1000 178mm (7”) Tape/Reel ACPM-5205-BLK 100 Bulk Description (Cont.) The power amplifier is manufactured on an advanced InGaP HBT (hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering state-of-the-art reliability, temperature stability and ruggedness. Absolute Maximum Ratings No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value. Operation of any single parameter outside these conditions with the remaining parameters set at or below nominal values may result in permanent damage. Description Min. Typ. RF Input Power (Pin) Max. Unit 10 dBm DC Supply Voltage (Vcc1, Vcc2) 0 3.4 5.0 V Enable Voltage (Ven) 0 2.6 3.3 V Mode Control Voltage (Vmode) 0 2.6 3.3 V Bypass Control (Vbp) 0 2.6 3.3 V Storage Temperature (Tstg) -55 25 +125 °C Recommended Operating Condition Description Min. Typ. Max. Unit DC Supply Voltage (Vcc1, Vcc2) 3.2 3.4 4.2 V Low High 0 1.35 0 2.6 0.5 3.1 V V Low High 0 1.35 0 2.6 0.5 3.1 V V Low High 0 1.35 0 2.6 0.5 3.1 V V 849 MHz 85 °C Enable Voltage (Ven) Mode Control Voltage (Vmode) Bypass Control Voltage (Vbp) Operating Frequency (fo) 824 Ambient Temperature (Ta) -20 25 Operating Logic Table Power Mode Ven Vmode Vbp Pout (Rel99) Pout (HSDPA, HSUPA MPR=0dB) High Power Mode High Low Low ~ 27.5 dBm ~ 26.5 dBm Mid Power Mode High High Low ~ 18 dBm ~ 17 dBm Bypass Mode High High High ~ 12 dBm ~ 11 dBm Shut Down Mode Low Low Low – – 2 Electrical Characteristics for WCDMA Mode – Conditions: Vcc = 3.4V, Ven = 2.6V, Ta = 25°C, Zin/Zout = 50ohm – Signal Configuration: 3GPP (DPCCH + 1DPDCH) Up-Link unless specified otherwise. Characteristics Condition Min. Operating Frequency Range Gain High Power Mode, Pout=27.5dBm Mid Power Mode, Pout=18dBm Power Added Efficiency Total Supply Current Typ. Max. 824 – 849 24 27 dB 15.5 19.5 dB Bypass Mode, Pout=12dBm 10 14 dB High Power Mode, Pout=27.5dBm 34.2 39 % Enable Current MHz Mid Power Mode, Pout=18dBm 16.8 23 % Bypass Mode, Pout=12dBm 11.4 15 % High Power Mode, Pout=27.5dBm 423 483 mA Mid Power Mode, Pout=18dBm 79.5 109.5 mA 29.1 39.1 mA 105 130 mA Bypass Mode, Pout=12dBm Quiescent Current Unit High Power Mode 80 Mid Power Mode 10 19 34 mA Bypass Mode 1 3.5 5.5 mA High Power Mode PA 10 Mid Power Mode 10 PA Bypass Mode 10 PA Mid Power Mode 5 PA Bypass Mode 5 PA Bypass Control Current Bypass 5 Total Current in Power-down mode 5 MHz offset Adjacent Channel 10 MHz offset Leakage Ratio 5 MHz offset 10 MHz offset 5 MHz offset 10 MHz offset 5 MHz offset 10 MHz offset 5 MHz offset 10 MHz offset 5 MHz offset 10 MHz offset Harmonic Second Suppression Third Input VSWR Ven=0V, Vmode=0V, Vbp=0V High Power Mode, Pout=27.5dBm Mode Control Current Stability (Spurious Output) High Power Mode, Pout=26.5dBm (HSDPA, HSUPA MPR=0dB) Mid Power Mode, Pout=18dBm Mid Power Mode, Pout=17dBm (HSDPA, HSUPA MPR=0dB) Bypass Mode, Pout=12dBm Bypass Mode, Pout=11dBm (HSDPA, HSUPA MPR=0dB) High Power Mode, Pout=27.5dBm -42 -57 -40 -55 -41 -58 -40 -56 -42 -57 -40 -55 -38 -48 2.5:1 VSWR 5:1, All phase PA 5 -36 -46 -35 -46 -36 -46 -36 -46 -36 -46 -36 -46 -35 -42 PA dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc -60 dBc Rx Band Noise Power (Vcc=4.2V) High Power Mode, Pout=27.5dBm -135 dBm/Hz GPS Band Noise Power (Vcc=4.2V) High Power Mode, Pout=27.5dBm -138 dBm/Hz ISM Band Noise Power (Vcc=4.2V) Phase Discontinuity -140 17 25 dBm/Hz deg 2 25 deg 10:1 VSWR Coupling factor High Power Mode, Pout=27.5dBm bypass modelmid power mode, at Pout=12dBm mid power modelhigh power mode, at Pout=18dBm Pout<27.5dBm, Pin<5dBm, All phase High Power Mode RF Out to CPL port 20 dB Daisy Chain Insertion Loss ISO port to CPL port, Ven=Low 0.15 dB Ruggedness 3 HSDPA Signal configuration used: 3GPP TS 34.121-1 Annex C (normative e): Measurement channels C.10.1 UL reference measurement channel for HSDPA tests Table C.10.1.4: E values for transmitter characteristics tests with HS-DPCCH Sub-test 2 (CM=1.0, MPR=0.0) HSUPA signal configuration used: 3GPP TS 34.121-1 Annex C (normative): Measurement channels C.11.1 UL reference measurement channel for E-DCH tests Table C.11.1.3: E values for transmitter characteristics tests with HS-DPCCH and E-DCH Sub-test 1 (CM=1.0, MPR=0.0) Footprint All dimensions are in millimeter (Tolerance of pad dimension: +/-0.05mm) 1.50 0.10 0.125 Pin 1 0.60 0.35 0.35 0.25 0.3 X-Ray Top View 4 0.10 PIN Description Pin # Name Description 1 Vcc1 DC Supply Voltage 2 RFin RF Input 3 Vbp Bypass Control 4 Vmode Mode Control 5 Ven PA Enable 6 CPL Coupling port of Coupler 7 GND Ground 8 ISO Isolation port of Coupler 9 RFOut RF Out 10 Vcc2 DC Supply Voltage Package Dimensions All dimensions ae in millimeter 0.6 Pin 1 Mark 1 10 2 9 3 8 4 7 5 6 3 ± 0.1 3 ± 0.1 1.0 ± 0.1 Marking Specification Pin 1 Mark A5205 Manufacturing Part Number PYYWW Lot Number P Manufacturing Info YY Manufacturing Year WW Work Week AAAAA Assembly Lot Number AAAAA 5 PCB Design Guidelines Metallization on 0.5mm pitch Ø 0.3mm 0.45 0.30 The recommended PCB land pattern is shown in figures on the left side. The substrate is coated with solder mask between the I/O and conductive paddle to protect the gold pads from short circuit that is caused by solder bleeding/bridging. 0.60 Stencil Design Guidelines A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. 0.35 0.475 connected to a inner layer through a via hole for a better isolation between CPL_IN(ISO) and RFout 0.55 Solder Mask Opening 0.65 0.50 0.45 1.30 0.60 0.525 1.50 Solder Paste Stencil Aperture 0.55 0.45 0.35 1.10 0.60 0.475 1.10 6 The recommended stencil layout is shown here. Reducing the stencil opening can potentially generate more voids. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads or conductive paddle to adjacent I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use laser cut stencil composed of 0.100mm(4mils) or 0.127mm(5mils) thick stainless steel which is capable of producing the required fine stencil outline. Evaluation Board Schematic Vcc1 Vcc2 1 Vcc1 RF In C5 2.2uF Vcc2 10 C4 680pF C6 680pF RF Out 9 2 RF In Isolation Vbp 3 Vbp Vmode C3 100pF Ven C2 100pF C1 100pF ISO 8 4 Vmode GND 7 5 Ven CPL 6 50ohm Coupler Evaluation Board Description C5 C7 C4 C6 A5205 PYYWW AAAAA C3 7 C7 2.2uF RF Out C2 C1 Tape and Reel Information A5205 PYYWW AAAAA Dimension List Annote Millimeter Annote Millimeter A0 3.40±0.10 P2 2.00±0.05 B0 3.40±0.10 P10 40.00±0.20 K0 1.35±0.10 E 1.75±0.10 D0 1.55±0.05 F 5.50±0.05 D1 1.60±0.10 W 12.00±0.30 P0 4.00±0.10 T 0.30±0.05 P1 8.00±0.10 Tape and Reel Format – 3 mm x 3 mm 8 Reel Drawing BACK VIEW Shading indicates thru slots 18.4 max. 178 +0.4 -0.2 50 min. 25 min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) 12.4 +2.0 -0.0 FRONT VIEW 1.5 min. 13.0 ± 0.2 21.0 ± 0.8 Plastic Reel Format (all dimensions are in millimeters) 9 NOTES: 1. Reel shall be labeled with the following information (as a minimum). a. manufacturers name or symbol b. Avago Technologies part number c. purchase order number d. date code e. quantity of units 2. A certificate of compliance (c of c) shall be issued and accompany each shipment of product. 3. Reel must not be made with or contain ozone depleting materials. 4. All dimensions in millimeters (mm) Handling and Storage ESD (Electrostatic Discharge) Electrostatic discharge occurs naturally in the environment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, destructive damage will result. ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site. MSL (Moisture Sensitivity Level) Plastic encapsulated surface mount package is sensitive to damage induced by absorbed moisture and temperature. Avago Technologies follows JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at various temperatures and relative humidity, and times. After soak, the components are subjected to three consecutive simulated reflows. The out of bag exposure time maximum limits are determined by the classification test describe below which corresponds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. ACPM-5205 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time (MET) for this part is 168 hours. After this time period, the part would need to be removed from the reel, de-taped and then re-baked. MSL classification reflow temperature for the ACPM-5205 is targeted at 260°C +0/-5°C. Figure and table on next page show typical SMT profile for maximum temperature of 260 +0/-5°C. Moisture Classification Level and Floor Life MSL Level Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated 1 Unlimited at =< 30°C/85% RH 2 1 year 2a 4 weeks 3 168 hours 4 72 hours 5 48 hours 5a 24 hours 6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label Note : 1. The MSL Level is marked on the MSL Label on each shipping bag. 10 Reflow Profile Recommendations tp Tp Critical Zone TL to Tp Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Profile Feature Sn-Pb Solder Pb-Free Solder Average ramp-up rate (TL to TP) 3°C/sec max 3°C/sec max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 100°C 150°C 60-120 sec 150°C 200°C 60-120 sec Tsmax to TL – Ramp-up Rate Time maintained above: – Temperature (TL) – Time (TL) 3°C/sec max 183°C 60-150 sec 217°C 60-150 sec Peak temperature (Tp) 240 +0/-5°C 260 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 sec 20-40 sec Ramp-down Rate 6°C/sec max 6°C/sec max Time 25°C to Peak Temperature 6 min max. 8 min max. 11 Storage Condition Baking of Populated Boards Packages described in this document must be stored in sealed moisture barrier, antistatic bags. Shelf life in a sealed moisture barrier bag is 12 months at <40°C and 90% relative humidity (RH) J-STD-033 p.7. Some SMD packages and board materials are not able to withstand long duration bakes at 125°C. Examples of this are some FR-4 materials, which cannot withstand a 24 hr bake at 125°C. Batteries and electrolytic capacitors are also temperature sensitive. With component and board temperature restrictions in mind, choose a bake temperature from Table 4-1 in J-STD 033; then determine the appropriate bake duration based on the component to be removed. For additional considerations see IPC-7711 andIPC-7721. Out-of-Bag Time Duration After unpacking the device must be soldered to the PCB within 168 hours as listed in the J-STD-020B p.11 with factory conditions <30°C and 60% RH. Baking It is not necessary to re-bake the part if both conditions (storage conditions and out-of bag conditions) have been satisfied. Baking must be done if at least one of the conditions above have not been satisfied. The baking conditions are 125°C for 12 hours J-STD-033 p.8. CAUTION Tape and reel materials typically cannot be baked at the temperature described above. If out-of-bag exposure time is exceeded, parts must be baked for a longer time at low temperatures, or the parts must be de-reeled, de-taped, re-baked and then put back on tape and reel. (See moisture sensitive warning label on each shipping bag for information of baking). Board Rework Component Removal, Rework and Remount If a component is to be removed from the board, it is recommended that localized heating be used and the maximum body temperatures of any surface mount component on the board not exceed 200°C. This method will minimize moisture related component damage. If any component temperature exceeds 200°C, the board must be baked dry per 4-2 prior to rework and/or component removal. Component temperatures shall be measured at the top center of the package body. Any SMD packages that have not exceeded their floor life can be exposed to a maximum body temperature as high as their specified maximum reflow temperature. Removal for Failure Analysis Not following the above requirements may cause moisture/reflow damage that could hinder or completely prevent the determination of the original failure mechanism. 12 Derating due to Factory Environmental Conditions Factory floor life exposures for SMD packages removed from the dry bags will be a function of the ambient environmental conditions. A safe, yet conservative, handling approach is to expose the SMD packages only up to the maximum time limits for each moisture sensitivity level as shown in next table. This approach, however, does not work if the factory humidity or temperature is greater than the testing conditions of 30°C/60% RH. A solution for addressing this problem is to derate the exposure times based on the knowledge of moisture diffusion in the component package materials ref. JESD22-A120). Recommended equivalent total floor life exposures can be estimated for a range of humidities and temperatures based on the nominal plastic thickness for each device. Table on next page lists equivalent derated floor lives for humidities ranging from 20-90% RH for three temperature, 20°C, 25°C, and 30°C. Table on next page is applicable to SMDs molded with novolac, biphenyl or multifunctional epoxy mold compounds. The following assumptions were used in calculating this table: 1. Activation Energy for diffusion = 0.35eV (smallest known value). 2. For ≤60% RH, use Diffusivity = 0.121exp ( -0.35eV/kT) mm2/s (this used smallest known Diffusivity @ 30°C). 3. For >60% RH, use Diffusivity = 1.320exp ( -0.35eV/kT) mm2/s (this used largest known Diffusivity @ 30°C). Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C, 35°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the component was classified) Maximum Percent Relative Humidity Maximum Percent Relative Humidity Package Type and Body Thickness Body Thickness ≥3.1 mm Including PQFPs >84 pin, PLCCs (square) All MQFPs or All BGAs ≥1 mm Moisture Sensitivity Level Level 2a Level 3 Level 4 Level 5 Level 5a Body 2.1 mm ≤ Thickness <3.1 mm including PLCCs (rectangular) 18-32 pin SOICs (wide body) SOICs ≥20 pins, PQFPs ≤80 pins Level 2a Level 3 Level 4 Level 5 Level 5a Body Thickness <2.1 mm including SOICs <18 pin All TQFPs, TSOPs or All BGAs <1 mm body thickness Level 2a Level 3 Level 4 Level 5 Level 5a 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 3 5 6 8 2 4 5 7 1 2 3 5 ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 5 7 9 11 3 4 5 6 1 2 2 3 ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 7 10 13 18 94 124 167 231 8 10 13 17 3 4 5 7 2 3 5 7 1 1 2 4 ∞ ∞ ∞ ∞ 12 19 25 32 4 5 7 9 2 3 4 5 1 1 2 2 ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 7 13 18 26 2 3 5 6 44 60 78 103 7 9 11 14 3 4 5 7 2 3 4 6 1 1 2 3 ∞ ∞ ∞ ∞ 9 12 15 19 3 4 5 7 2 3 3 5 1 1 2 2 ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 7 9 12 17 3 5 6 8 1 2 3 4 32 41 53 69 6 8 10 13 2 4 5 7 2 2 4 5 1 1 2 3 58 86 148 ∞ 7 9 12 15 3 4 5 6 2 2 3 4 1 1 2 2 ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 4 5 7 9 2 3 4 6 1 1 2 3 26 33 42 57 6 7 9 12 2 3 5 7 1 2 3 5 1 1 2 3 30 39 51 69 6 8 10 13 2 3 4 6 2 2 3 4 1 1 2 2 ∞ ∞ ∞ ∞ 8 11 14 20 3 4 5 7 2 2 3 5 1 1 2 2 16 28 36 47 6 7 9 12 2 3 4 6 1 2 3 4 1 1 2 2 22 28 37 49 5 7 9 12 2 3 4 5 1 2 3 4 1 1 2 2 17 28 ∞ ∞ 5 7 10 13 2 3 4 6 1 2 3 4 1 1 2 2 7 10 14 19 4 5 7 10 2 3 3 5 1 2 2 3 1 1 1 2 3 4 6 8 2 3 5 7 1 2 3 4 1 1 2 3 1 1 1 2 1 1 2 2 1 1 2 2 1 1 2 2 1 1 2 2 1 1 1 2 5 7 10 13 3 4 6 8 1 2 3 4 1 1 2 3 1 1 1 2 2 3 4 5 2 2 3 5 1 2 2 3 1 1 1 3 0.5 0.5 1 2 0.5 1 1 2 0.5 1 1 2 0.5 1 1 2 0.5 1 1 2 0.5 1 1 2 4 6 8 10 3 4 5 7 1 2 3 4 1 1 2 3 1 1 1 2 1 2 3 4 1 2 3 4 1 1 2 3 1 1 1 2 0.5 0.5 1 1 0.5 1 1 1 0.5 1 1 1 0.5 1 1 1 0.5 1 1 1 0.5 0.5 1 1 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-2408EN - August 12, 2010 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C 35°C 30°C 25°C 20°C