AP9579GP-HF Halogen-Free Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Low On-resistance D ▼ Simple Drive Requirement -60V RDS(ON) 25mΩ ID ▼ Fast Switching Characteristic ▼ Halogen Free & RoHS Compliant Product BVDSS G -45A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is widely preferred for commercial-industrial power applications and suited for low voltage applications such as DC/DC converters. G TO-220(P) D S Absolute Maximum Ratings Parameter Symbol Rating Units VDS Drain-Source Voltage -60 V VGS Gate-Source Voltage +20 V ID@TC=25℃ Continuous Drain Current, VGS @ 10V -45 A ID@TC=100℃ Continuous Drain Current, VGS @ 10V -28.7 A 1 IDM Pulsed Drain Current -160 A PD@TC=25℃ Total Power Dissipation 89.3 W PD@TA=25℃ Total Power Dissipation 2 W TSTG Storage Temperature Range -55 to 150 o C -55 to 150 o C Operating Junction Temperature Range TJ Thermal Data Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice Value Units 1.4 o C/W 62 o C/W 1 201010111 AP9579GP-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units VGS=0V, ID=-250uA -60 - - V VGS=-10V, ID=-20A - - 25 mΩ VGS=-4.5V, ID=-15A - - 30 mΩ BVDSS Drain-Source Breakdown Voltage RDS(ON) Static Drain-Source On-Resistance2 VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance VDS=-10V, ID=-20A - 36 - S IDSS Drain-Source Leakage Current VDS=-48V, VGS=0V - - -25 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA ID=-20A - 45 72 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=-48V - 7.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 26 - nC VDS=-30V - 12 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-20A - 38 - ns td(off) Turn-off Delay Time RG=3.3Ω - 70 - ns tf Fall Time VGS=-10V - 94 - ns Ciss Input Capacitance VGS=0V - 3600 5760 pF Coss Output Capacitance VDS=-25V - 375 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 270 - pF Min. Typ. IS=-20A, VGS=0V - - -1.3 V Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 Test Conditions Max. Units trr Reverse Recovery Time IS=-20A, VGS=0V, - 43 - ns Qrr Reverse Recovery Charge dI/dt=-100A/µs - 63 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9579GP-HF 100 160 -10V -7.0V -6.0V -5.0V -ID , Drain Current (A) 120 -10V -7.0V -6.0V -5.0V V G = -4.0V o T C =150 C 80 -ID , Drain Current (A) o T C = 25 C V G = -4.0V 80 60 40 40 20 0 0 0 4 8 12 16 0 2 Fig 1. Typical Output Characteristics 6 8 10 12 Fig 2. Typical Output Characteristics 25 2.0 I D = - 20 A V G = -10V I D = -15 A T C =25 o C Normalized RDS(ON) 23 RDS(ON) (mΩ) 4 -V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V) 21 19 1.6 1.2 0.8 17 0.4 2 4 6 8 10 -50 0 50 100 150 T j , Junction Temperature ( o C) -V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.6 20 Normalized -VGS(th) (V) -IS(A) 16 12 T j =150 o C T j =25 o C 8 1.2 0.8 0.4 4 0.0 0 0 0.2 0.4 0.6 0.8 1 1.2 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9579GP-HF f=1.0MHz 10 5000 -VGS , Gate to Source Voltage (V) V DS = - 48 V I D = - 20 A 8 4000 C (pF) C iss 6 3000 4 2000 2 1000 C oss C rss 0 0 0 20 40 60 1 80 5 9 13 17 21 25 29 -V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1000 Normalized Thermal Response (Rthjc) 1 10us 100 Operation in this area limited by RDS(ON) -ID (A) 100us 1ms 10 10ms 100ms DC T c =25 o C Single Pulse Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 1 0.1 1 10 100 1000 0.00001 0.0001 -V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area VDS 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG 90% QG -4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4