BSI Very Low Power/Voltage CMOS SRAM 512K x 16 or 1M x 8 bit switchable FEATURES BS616LV8023 DESCRIPTION • Very low operation voltage : 2.4 ~ 3.6V • Very low power consumption : Vcc = 3.0V C-grade: 20mA (Max.) operating current I-grade : 25mA (Max.) operating current 0.5uA (Typ.) CMOS standby current • High speed access time : -70 70ns (Max.) at Vcc= 3.0V -10 100ns (Max.) at Vcc= 3.0V • Automatic power down when chip is deselected • Three state outputs and TTL compatible • Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE1, CE2 and OE options • I/O Configuration x8/x16 selectable by CIO, LB and UB pin The BS616LV8023 is a high performance, very low power CMOS Static Random Access Memory organized as 524,288 words by 16 bits or 1,048,576 bytes by 8 bits selectable by CIO pin and operates from a wide range of 2.4V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.5uA and maximum access time of 70/100ns in 3.0V operation. Easy memory expansion is provided by an active HIGH chip enable2(CE2), active LOW chip enable1(CE1), active LOW output enable(OE) and three-state output drivers. The BS616LV8023 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616LV8023 is available in 48-pin BGA type. PRODUCT FAMILY PRODUCT FAMILY OPERATING TEMPERATURE Vcc RANGE POWER DISSIPATION STANDBY Operating SPEED (ns) (I CCSB1, Max) (I CC, Max) Vcc=3V Vcc=3V Vcc=3.0V PKG TYPE BS616LV8023BC +0 O C to +70OC 2.4V ~ 3.6V 70 / 100 3uA 20mA BGA-48-0810 BS616LV8023BI -40 O C to +85 O C 2.4V ~ 3.6V 70 / 100 6uA 25mA BGA-48-0810 BLOCK DIAGRAM PIN CONFIGURATIONS A 1 2 3 4 5 6 LB OE A0 A1 A2 CE2 B D8 UB A3 A4 CE1 D0 C D9 D10 A5 A6 D1 D2 D E VSS VCC D11 D12 A17 VSS A7 A16 D3 D4 A15 A14 A13 A12 Address A11 A10 Input A9 A8 A17 A7 A6 Buffer 16(8) D0 . . . . VSS . . . . A13 WE D7 A10 A11 SAE. D13 A14 A15 G D15 CIO . A 12 H A18 A8 A9 Memory Array Decoder 2048 x 4096 Data Input Buffer 16(8) Column I/O Write Driver 16(8) 16(8) Sense Amp 256(512) Data Output Buffer D15 D6 D14 2048 Row 4096 VCC D5 F 22 Column Decoder CE1 CE2 WE OE UB LB CIO 16(18) Control Address Input Buffer A16 A0 A1 A2 A3 A4 A5 A18 (SAE) Vdd Vss 48-Ball CSP top View Brilliance Semiconductor Inc. reserves the right to modify document contents without notice. R0201-BS616LV8023 1 Revision 2.0 April 2002 BSI BS616LV8023 PIN DESCRIPTIONS Name Function A0-A18 Address Input These 19 address inputs select one of the 524,288 x 16-bit words in the RAM. SAE Address Input This address input incorporate with the above 19 address inputs select one of the 1,048,576 x 8-bit bytes in the RAM if the CIO is LOW. Don't use when CIO is HIGH. CIO x8/x16 select input This input selects the organization of the SRAM. 524,288 x 16-bit words configuration is selected if CIO is HIGH. 1,048,576 x 8-bit bytes configuration is selected if CIO is LOW. CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. LB and UB Data Byte Control Input Lower byte and upper byte data input/output control pins. The chip is deselected when both LB and UB pins are HIGH. D0 - D15 Data Input/Output Ports These 16 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Vss Ground R0201-BS616LV8023 2 Revision 2.0 April 2002 BSI BS616LV8023 TRUTH TABLE MODE Fully Standby Output Disable CE1 CE2 H X X L L H OE WE CIO X X X H H X LB UB SAE D0~7 D8~15 VCC Current X X X X X High-Z High-Z ICCSB, ICCSB1 X X X High-Z High-Z ICC L H Dout High-Z H L High-Z Dout L L Dout Dout L H Din X H L X Din L L Din Din Read from SRAM ( WORD mode ) L H L H H Write to SRAM ( WORD mode ) L H X H L Read from SRAM ( BYTE Mode ) X X H L H L X X A-1 Dout High-Z ICC L H X L L X X A-1 Din X ICC OPERATING RANGE ABSOLUTE MAXIMUM RATINGS(1) SYMBOL PARAMETER with RATING UNITS -0.5 to Vcc+0.5 V VTERM Terminal Voltage Respect to GND TBIAS Temperature Under Bias -40 to +125 O C TSTG Storage Temperature -60 to +150 O C PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA AMBIENT TEMPERATURE RANGE Commercial Industrial O O 0 C to +70 C O O -40 C to +85 C Vcc 2.4V ~ 3.6V 2.4V ~ 3.6V CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. R0201-BS616LV8023 ICC L Write to SRAM ( BYTE Mode ) ICC 3 SYMBOL CIN CDQ PARAMETER Input Capacitance Input/Output Capacitance CONDITIONS MAX. UNIT VIN=0V 10 pF VI/O=0V 12 pF 1. This parameter is guaranteed and not tested. Revision 2.0 April 2002 BSI BS616LV8023 DC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC ) PARAMETER NAME VIL VIH PARAMETER MIN. TYP. (1) MAX. TEST CONDITIONS Guaranteed Input Low Voltage(2) Guaranteed Input High Voltage(2) UNITS Vcc=3V -0.5 -- 0.8 V Vcc=3V 2.0 -- Vcc+0.2 V IIL Input Leakage Current Vcc = Max, VIN = 0V to Vcc -- -- 1 uA IOL Output Leakage Current Vcc = Max, CE1 = VIH , or CE2 = ViL, or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA VOL Output Low Voltage Vcc= max, IOL = 2mA Vcc=3V -- -- 0.4 V VOH Output High Voltage Vcc= Min, IOH = -1mA Vcc=3V 2.4 -- -- V ICC Operating Power Supply Current Vcc= max, CE1 = VIL and CE2 = VIH, IDQ = 0mA, F = Fmax(3) Vcc=3V -- -- 20 mA ICCSB Standby Current-TTL Vcc= max, CE1 = VIH or CE2 = VIL, IDQ = 0mA Vcc=3V -- -- 1 mA ICCSB1 Standby Current-CMOS Vcc= max,CE1 Њ Vcc-0.2V, or CE2 Љ 0.2V; VIN Њ Vcc - 0.2V or VIN Љ 0.2V Vcc=3V -- 0.5 3 uA 1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/ tRC . R0201-BS616LV8023 4 Revision 2.0 April 2002 BSI BS616LV8023 DATA RETENTION CHARACTERISTICS ( TA = 0oC to +70oC ) SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. (1) MAX. UNITS VDR Vcc for Data Retention CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V; VIN Њ Vcc - 0.2V or VIN Љ 0.2V 1.5 -- -- V ICCDR Data Retention Current CE1 Њ Vcc - 0.2V or CE2 Љ 0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V -- 0.2 2 uA tCDR Chip Deselect to Data Retention Time 0 -- -- ns -- -- ns See Retention Waveform tR Operation Recovery Time TRC (2) 1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled ) Data Retention Mode Vcc VDR Њ 1.5V Vcc CE1 Vcc tR t CDR CE1 Њ Vcc - 0.2V VIH VIH LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled ) Data Retention Mode Vcc VDR Њ 1.5V Vcc CE2 R0201-BS616LV8023 VIL Vcc tR t CDR CE2 Љ 0.2V 5 VIL Revision 2.0 April 2002 BSI BS616LV8023 AC TEST CONDITIONS Input Pulse Levels KEY TO SWITCHING WAVEFORMS Vcc/0V WAVEFORM INPUTS OUTPUTS Input Rise and Fall Times 5ns MUST BE STEADY MUST BE STEADY Input and Output Timing Reference Level 0.5Vcc MAY CHANGE FROM H TO L Output Load C L=100pF+1TTL WILL BE CHANGE FROM H TO L MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H , DON T CARE: ANY CHANGE PERMITTED CHANGE : STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to +70oC, Vcc=3.0V ) READ CYCLE JEDEC PARAMETER NAME PARAMETER NAME tAVAX tAVQV tE1LQV tE2LQV tBA tGLQV tELQX tBE tGLQX tEHQZ tBDO tGHQZ tAXQX tRC tAA tACS1 tACS2 tBA(1) tOE tCLZ tBE tOLZ tCHZ tBDO tOHZ tOH DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time (CE1) (CE2) Chip Select Access Time Data Byte Control Access Time (LB,UB) Output Enable to Output Valid Chip Select to Output Low Z (CE2,CE1) Data Byte Control to Output Low Z (LB,UB) Output Enable to Output in Low Z Chip Deselect to Output in High Z (CE2,CE1) Data Byte Control to Output High Z (LB,UB) Output Disable to Output in High Z Output Disable to Output Address Change BS616LV8023-70 BS616LV8023-10 MIN. TYP. MAX. MIN. TYP. MAX. 100 70 100 100 100 50 50 70 70 70 35 35 10 10 10 0 0 0 10 35 35 30 15 15 15 0 0 0 15 40 40 35 UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns NOTE : 1. tBA is 35ns/50ns (@speed=70ns/100ns) with address toggle . tBA is 70ns/100ns (@speed=70ns/100ns) without address toggle . R0201-BS616LV8023 6 Revision 2.0 April 2002 BSI BS616LV8023 SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC ADDRESS t AA t OH t OH D OUT READ CYCLE2 (1,3,4) CE2 t ACS2 t ACS1 CE1 t t CHZ CLZ D OUT READ CYCLE3 (1,4) t RC ADDRESS t AA OE t CE2 CE1 t t t ACS2 t OLZ t OE t ACS1 CLZ OH OHZ (1) t CHZ t BDO LB,UB t BE t BA D OUT NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE1 transition low and CE2 transition high. 4. OE = VIL . R0201-BS616LV8023 7 Revision 2.0 April 2002 BSI BS616LV8023 AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to +70oC, Vcc=3.0V) WRITE CYCLE JEDEC PARAMETER NAME PARAMETER NAME tAVAX tE1LWH tAVWL tAVWH tWLWH tWHAX tBW tWLQZ tDVWH tWHDX tGHQZ tWHQX tWC tCW tAS tAW tWP tWR tBW (1) tWHZ tDW tDH tOHZ tOW BS616LV8023-10 BS616LV8023-70 DESCRIPTION MIN. Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width (CE2, CE1, WE) Write Recovery Time Data Byte Control to End of Write (LB,UB) Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active TYP. 70 70 0 70 35 0 30 0 30 0 0 5 MIN. MAX. 100 100 0 100 50 0 40 0 40 0 0 10 30 30 TYP. UNIT MAX. 40 40 ns ns ns ns ns ns ns ns ns ns ns ns NOTE : 1. tBW is 30ns/40ns (@speed=70ns/100ns) with address toggle. ; tBW is 70ns/100ns (@speed=70ns/100ns) without address toggle. SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WC ADDRESS (3) t WR OE CE2 (5) (10) t CW (5) CE1 t BW (5) LB,UB t AW WE (3) t WP t AS (2) (4) t OHZ D OUT t DH t DW D IN R0201-BS616LV8023 8 Revision 2.0 April 2002 BSI BS616LV8023 WRITE CYCLE2 (1,6) t WC ADDRESS CE2 (10) t (5) CE1 t BW (5) LB,UB t WE CW AW t WR t WP (3) (2) t t AS DH (4) t WHZ D OUT (7) (8) t DW t DH (8,9) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition or LB,UB low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. TCW is measured from the later of CE2 going high or CE1 going low to the end of write. R0201-BS616LV8023 9 Revision 2.0 April 2002 BSI BS616LV8023 ORDERING INFORMATION BS616LV8023 X X -- Y Y SPEED 70: 70ns 10: 100ns GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE B :BGA - 48 PIN(8x10mm) 1.4 Max. 0.25 ̈́ 0.05 PACKAGE DIMENSIONS NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. SIDE VIEW D 0.1 N D E D1 E1 e D1 48 10.0 8.0 5.25 3.75 0.75 0.35̈́ 0.05 E 0.1 E1 e SOLDER BALL VIEW A 48 mini-BGA (8 x 10mm) R0201-BS616LV8023 10 Revision 2.0 April 2002 BSI BS616LV8023 REVISION HISTORY Revision Description Date 1.0 initial release March 04, 2002 2.0 Modify some AC parameters April,12,2002 R0201-BS616LV8023 11 Note Revision 2.0 April 2002