DAC8830 DAC8831 IVC 102 OP A1 32 DA ® C8 831 SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 16-Bit, Ultra-Low Power, Voltage-Output Digital-to-Analog Converters FEATURES • • • • • • • • • • • DESCRIPTION 16-Bit Resolution 2.7 V to 5.5 V Single-Supply Operation Very Low Power: 15 µW for 3 V Power High Accuracy, INL: 1 LSB Low Glitch: 10 nV-s Low Noise: 10 nV/√Hz Fast Settling: 1.0 µS Fast SPI™ Interface, up to 50 MHz Reset to Zero-Code Schmitt-Trigger Inputs for Direct Optocoupler Interface Industry-Standard Pin Configuration The DAC8830 and DAC8831 are single, 16-bit, serial-input, voltage-output digital-to-analog converters (DACs) operating from a single 3 V to 5 V power supply. These converters provide excellent linearity (1 LSB INL), low glitch, low noise, and fast settling (1.0 µS to 1/2 LSB of full-scale output) over the specified temperature range of –40°C to +85°C. The output is unbuffered, which reduces the power consumption and the error introduced by the buffer. These parts feature a standard high-speed (clock up to 50 MHz), 3 V or 5 V SPI serial interface to communicate with the DSP or microprocessors. The DAC8830 output is 0 V to VREF. However, the DAC8831 provides bipolar output (±VREF) when working with an external buffer. The DAC8830 and DAC8831 are both reset to zero-code after power up. For optimum performance, a set of Kelvin connections to external reference and analog ground input are provided on the DAC8831. APPLICATIONS • • • • • Portable Equipment Automatic Test Equipment Industrial Process Control Data Acquisition Systems Optical Networking The DAC8830 is available in an SO-8 package, and the DAC8831 in an SO-14 package. Both have industry standard pinouts (see Table 3, the cross-reference table in the Application Information section for details). The DAC8831 is also available in a QFN-14 package. DAC8830 Functional Block Diagram DAC8831 Functional Block Diagram VDD VDD VREF−S VREF−F RINV SCLK Serial Interface CS VOUT AGND Input Register DAC Latch CS SCLK SDI SDI RFB INV DAC8830 DGND RFB LDAC Serial Interface and Control Logic DAC VREF DAC VOUT +V − + VO −V OPA277 OPA704 AGNDS OPA727 AGNDF Input Register DAC Latch DAC8831 DGND Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI, QSPI are trademarks of Motorola, Inc. Microwire is a trademark of National Semiconductor Corp. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2006, Texas Instruments Incorporated DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT MINIMUM RELATIVE ACCURACY (LSB) DIFFERENTIAL NONLINEARITY (LSB) POWERON RESET VALUE SPECIFIED TEMPERATURE RANGE PACKAGE MARKING PACKAGELEAD PACKAGE DESIGNATOR DAC8830ID ±4 ±1 Zero-Code –40°C to +85°C 8830I SO-8 D ±2 ±1 Zero-Code ±1 ±1 Zero-Code ±4 ±1 Zero-Code ±2 ±1 Zero-Code ±1 ±1 Zero-Code ±4 ±1 Zero-Code ±2 ±1 Zero-Code ±1 ±1 Zero-Code DAC8830IBD DAC8830ICD DAC8831ID DAC8831IBD DAC8831ICD DAC8831IRGY DAC8831IBRGY DAC8831ICRGY (1) –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 8830I 8830I 8831I 8831I 8831I 8831I 8831I 8831I SO-8 SO-8 SO-14 SO-14 SO-14 QFN-14 QFN-14 QFN-14 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC8830ID Tubes, 75 DAC8830IDR Tape and Reel, 2500 DAC8830IBD Tubes, 75 DAC8830IBDR Tape and Reel, 2500 D DAC8830ICD Tubes, 75 DAC8830ICDR Tape and Reel, 2500 D DAC8831ID Tube, 50 DAC8831IDR Tape and Reel, 2500 D DAC8831IBD Tube, 50 DAC8831IBDR Tape and Reel, 2500 D DAC8831ICD Tube, 50 DAC8831ICDR Tape and Reel, 2500 D DAC8831IRGYT Tape and Reel, 250 DAC8831IRGYR Tape and Reel, 1000 RGY DAC8831IBRGYT Tape and Reel, 250 DAC8831IBRGYR Tape and Reel, 1000 RGY DAC8831ICRGYT Tape and Reel, 250 DAC8831ICRGYR Tape and Reel, 1000 RGY For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) DAC8830, DAC8831 UNIT –0.3 to +7 V Digital input voltage to DGND –0.3 to +VDD + 0.3 V VOUT to AGND –0.3 to +VDD + 0.3 V VDD to AGND AGND, AGNDF, AGNDS to DGND –0.3 to +0.3 V Operating temperature range –40 to +85 °C Storage temperature range –65 to +150 °C +150 °C Junction temperature range (TJ max) (TJ max - TA) / θJA W QFN-14 54.9 °C/W SO-8 136.9 °C/W SO-14 66.6 °C/W Power dissipation Thermal impedance, θJA (1) 2 Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 ELECTRICAL CHARACTERISTICS All specifications at TA = TMIN to TMAX, VDD = +3 V or VDD = +5 V, VREF = +2.5 V unless otherwise noted; specifications subject to change without notice. DAC8830, DAC8831 PARAMETER CONDITIONS MIN TYP MAX UNIT STATIC PERFORMANCE Resolution Linearity error 16 bits DAC8830ICD, DAC8831ICD, DAC8831ICRGY ±0.5 ±1 DAC8830IBD, DAC8831IBD, DAC8831IBRGY ±0.5 ±2 DAC8830ID, DAC8831ID, DAC8831IRGY ±0.5 ±4 ±0.5 ±1 ±1 ±5 Differential linearity error All grades TA = +25°C Gain error ±7 TA = –40°C to +85°C ±0.1 Gain drift ±0.25 TA = +25°C Zero code error ±0.05 Zero code drift LSB LSB ppm/°C ±1 ±2 TA = –40°C to +85°C LSB LSB ppm/°C OUTPUT CHARACTERISTICS Voltage output (1) All devices Unipolar operation DAC8831 only Bipolar operation Output impedance To 1/2 LSB of FS, CL = 10 pF Slew rate (2) CL = 10 pF Digital-to-analog glitch 1 LSB change around major carry Digital feedthrough (3) (1) (2) (3) +VREF +VREF 6.25 Settling time Output noise 0 –VREF DAC8830 DAC8831 TA = +25°C Power-supply rejection VDD varies ±10% Bipolar resistor matching RFB / RINV DAC8831 only Bipolar zero error DAC8831 only Bipolar zero drift DAC8831 only Ratio error TA = +25°C V V kΩ 1 µs 25 V/µs 10 nV-s 0.2 nV-s 10 nV/√Hz 18 ±1 ±0.0015 ±0.0076 ±0.25 ±5 ±7 TA = –40°C to +85°C ±0.2 LSB Ω/Ω 1 % LSB ppm/°C The DAC8830 output is unipolar (0 V to +VREF). The DAC8831 output is bipolar (±VREF) when it connects to an external buffer (see the Bipolar Output Operation section for details). Slew Rate is measure from 10% to 90% of transition when the output changes from 0 to full scale. Digital feedthrough is defined as the impulse injected into the analog output from the digital input. It is measured when the DAC output does not change; CS is held high, while SCLK and DIN signals are toggled. Submit Documentation Feedback 3 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 ELECTRICAL CHARACTERISTICS (continued) All specifications at TA = TMIN to TMAX, VDD = +3 V or VDD = +5 V, VREF = +2.5 V unless otherwise noted; specifications subject to change without notice. DAC8830, DAC8831 PARAMETER CONDITIONS MIN TYP MAX UNIT VDD V REFERENCE INPUT Reference input voltage range Reference input impedance (4) 1.25 Unipolar mode Bipolar mode, DAC8831 Reference –3dB bandwidth, BW Code = FFFFh Reference feedthrough Code = 0000h, VREF = 1 VPP at 100 kHz 9 Signal-to-noise ratio, SNR Reference input capacitance kΩ 7.5 1.3 MHz 1 mV 92 dB Code = 0000h 75 Code = FFFFh 120 pF DIGITAL INPUTS VIL Input low voltage VIH Input high voltage VDD = 2.7 V 0.6 VDD = 5 V 0.8 VDD = 2.7 V 2.1 VDD = 5 V 2.4 V V Input current ±1 µA Input capacitance 10 pF Hysteresis voltage 0.4 V POWER SUPPLY VDD IDD Power-supply voltage Power-supply current Power 2.7 5.5 VDD = 3 V 5 20 VDD = 5 V 5 20 VDD = 3 V 15 60 VDD = 5 V 25 100 V µA µW TEMPERATURE RANGE Specified performance (4) 4 –40 Reference input resistance is code-dependent, minimum at 8555h. Submit Documentation Feedback +85 °C DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 PIN CONFIGURATION (NOT TO SCALE) AGNDF 3 12 DGND 5 SCLK AGNDS 4 11 LDAC VREF−S 5 10 SDI VREF−F 6 9 NC CS 7 8 SCLK VDD NC SDI 13 12 11 10 9 14 8 SCLK DAC8831 Thermal Pad(1) RFB 1 7 CS 2 3 4 5 6 VREF−F INV 6 SDI VDD 13 VREF−S 14 2 LDAC 4 1 VOUT AGNDS CS RFB DGND DGND 3 VDD 7 AGNDF VREF 8 INV 2 RGY PACKAGE QFN-14 (TOP VIEW) VOUT 1 D PACKAGE SO-14 (TOP VIEW) DAC8831 VOUT AGND DAC8830 D PACKAGE SO-8 (TOP VIEW) NOTE: (1) Exposed thermal pad in the QFN package must be connected to analog ground. TERMINAL FUNCTIONS TERMINAL NO. DESCRIPTION NAME DAC8830 1 VOUT Analog output of DAC 2 AGND Analog ground 3 VREF Voltage reference input 4 CS Chip select input (active low). Data is not clocked into SDI unless CS is low 5 SCLK Serial clock input 6 SDI Serial data input. Data is latched into input register on the rising edge of SCLK. 7 DGND Digital ground 8 VDD Analog power supply, +3 V to +5 V 1 RFB Feedback resistor. Connect to the output of external operational amplifier in bipolar mode. 2 VOUT Analog output of DAC 3 AGNDF Analog ground (Force) 4 AGNDS Analog ground (Sense) 5 VREF–S Voltage reference input (Sense). Connect to external voltage reference 6 VREF–F Voltage reference input (Force). Connect to external voltage reference 7 CS Chip select input (active low). Data is not clocked into SDI unless CS is low. 8 SCLK Serial clock input. DAC8831 9 NC No internal connection 10 SDI Serial data input. Data is latched into input register on the rising edge of SCLK. 11 LDAC Load DAC control input. Active low. When LDAC is Low, the DAC latch is simultaneously updated with the content of the input register. 12 DGND Digital ground 13 INV Junction point of internal scaling resistors. Connect to external operational amplifier inverting input in bipolar mode. 14 VDD Analog power supply, +3 V to +5 V. Submit Documentation Feedback 5 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 ttd CS DAC Updated tDelay tsck tLead twsck tLag twsck tDSCLK SCLK tsu tho SDI BIT15 (MSB) BIT14 BIT13, . . . ,1 BIT0 −−−Don’t Care Figure 1. DAC8830 Timing Diagram Case1: LDAC tied to LOW t td CS DAC Updated t Delay t sck t Lead t wsck t Lag t wsck t DSCLK SCLK t su t ho SDI BIT 15 (MSB) LDAC BIT 14 BIT 13, . . . ,1 BIT 0 LOW −−−Don’t Care Case2: LDAC Active t td CS t Delay t sck t Lead t wsck t Lag t wsck t DSCLK SCLK t su SDI t ho BIT 15 (MSB) BIT 14 BIT 13, . . . ,1 BIT 0 t DLADC HIGH LDAC DAC Updated −−−Don’t Care Figure 2. DAC8831 Timing Diagram 6 Submit Documentation Feedback t WLDAC DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TIMING CHARACTERISTICS: VDD = +5 V (1) (2) At –40°C to +85°C, unless otherwise noted. PARAMETER MIN MAX UNIT tsck SCLK period 20 ns twsck SCLK high or low time 10 ns tDelay Delay from SCLK high to CS low 10 ns tLead CS enable lead time 10 ns tLag CS enable lag time 10 ns tDSCLK Delay from CS high to SCLK high 10 ns ttd CS high between active period 30 ns tsu Data setup time (input) 10 ns tho Data hold time (input) 0 ns tWLDAC LDAC width 30 ns tDLDAC Delay from CS high to LDAC low 30 ns VDD high to CS low (power-up delay) 10 µs (1) (2) Assured by design. Not production tested. Sample tested during the initial release and after any redesign or process changes that may affect this parameter. TIMING CHARACTERISTICS: VDD = +3 V (1) (2) At –40°C to +85°C, unless otherwise noted. PARAMETER MIN MAX UNIT tsck SCLK period 20 ns twsck SCLK high or low time 10 ns tDelay Delay from SCLK high to CS low 10 ns tLead CS enable lead time 10 ns tLag CS enable lag time 10 ns tDSCLK Delay from CS high to SCLK high 10 ns ttd CS high between active period 30 ns tsu Data setup time (input) 10 ns tho Data hold time (input) 0 ns tWLDAC LDAC width 30 ns tDLDAC Delay from CS high to LDAC low 30 ns VDD high to CS low (power-up delay) 10 µs (1) (2) Assured by design. Not production tested. Sample tested during the initial release and after any redesign or process changes that may affect this parameter. Submit Documentation Feedback 7 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +5 V At TA = +25°C and VREF = +2.5 V, unless otherwise noted. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +25_C VREF = 2.5 V 0.50 0.50 0.25 0.25 0 −0.25 −0.25 −0.50 −0.75 −0.75 −1.00 0 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 4. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 TA = −40_ C VREF = 2.5 V 0.75 0.50 0.25 0.25 DNL (LSB) 0.50 0 −0.25 TA = −40_ C VREF = 2.5 V 0.75 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 5. Figure 6. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +85_C VREF = 2.5 V 0.75 0.25 0.25 DNL (LSB) 0.50 0 −0.25 TA = +85_C VREF = 2.5 V 0.75 0.50 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 0 Figure 7. 8 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 3. 1.00 INL (LSB) 0 −0.50 −1.00 INL (LSB) TA = +25_ C VREF = 2.5 V 0.75 DNL (LSB) INL (LSB) 0.75 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 8. Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +5 V (continued) At TA = +25°C and VREF = +2.5 V, unless otherwise noted. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +25_ C VREF = 5 V TA = +25_C VREF = 5 V 0.75 0.50 0.50 0.25 0.25 DNL (LSB) INL (LSB) 0.75 0 −0.25 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 9. Figure 10. LINEARITY ERROR vs REFERENCE VOLTAGE LINEARITY ERROR vs SUPPLY VOLTAGE 0.75 0.75 0.50 0.50 0.25 Linearity Error (LSB) Linearity Error (LSB) VREF = 2.5 V DNL 0 INL −0.25 DNL 0.25 0 INL −0.25 −0.50 −0.50 0 1 2 3 4 5 6 2.5 3.0 3.5 Reference Voltage (V) 4.0 4.5 5.0 Figure 11. Figure 12. GAIN ERROR vs TEMPERATURE ZERO-CODE ERROR vs TEMPERATURE 1.25 VREF = 2.5 V Zero−Code Error (LSB) 1.00 0.75 Gain Error (LSB) 6.0 0.50 Bipolar Mode 0.50 0.25 0 Unipolar Mode −0.25 0.25 Bipolar Mode 0 −0.25 −0.50 −0.75 −60 5.5 Supply Voltage (V) Unipolar Mode VREF = 2.5 V −40 −20 0 20 40 60 80 Temperature (_C) 100 120 140 −0.50 −60 Figure 13. −40 −20 0 20 40 60 80 Temperature (_C) 100 120 140 Figure 14. Submit Documentation Feedback 9 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +5 V (continued) At TA = +25°C and VREF = +2.5 V, unless otherwise noted. REFERENCE CURRENT vs CODE (UNIPOLAR MODE) REFERENCE CURRENT vs CODE (BIPOLAR MODE) 300 300 VREF = 2.5 V VREF = 2.5 V 250 Reference Current (µA) Reference Current (µA) 250 200 150 100 200 150 100 50 50 0 0 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 15. Figure 16. SUPPLY CURRENT vs DIGITAL INPUT VOLTAGE SUPPLY CURRENT vs TEMPERATURE 800 5 VREF = 2.5 V 700 4 600 Supply Current (µA) Supply Current (µA) VDD = 5 V 500 400 300 VDD = 3 V 200 VDD = 5 V VLOGIC = 5 V 3 VDD = 3 V VLOGIC = 3 V 2 1 100 0 0 1 2 3 Digital Input Voltage (V) 4 0 −60 −40 5 20 40 60 80 Temperature (_C) 100 120 140 Figure 18. SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs REFERENCE VOLTAGE 5.0 VREF = 2.5 V 4.5 4.5 4.0 Supply Current (µA) 4.0 Supply Current (µA) 0 Figure 17. 5.0 3.5 3.0 2.5 2.0 1.5 3.5 VDD = 5 V 3.0 2.5 2.0 VDD = 3 V 1.5 1.0 1.0 0.5 0.5 0 0 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 Supply Voltage (V) 5.1 5.4 5.7 6.0 0 0.5 Figure 19. 10 −20 1.0 1.5 2.0 2.5 3.0 3.5 Reference Voltage (V) Figure 20. Submit Documentation Feedback 4.0 4.5 5.0 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +5 V (continued) At TA = +25°C and VREF = +2.5 V, unless otherwise noted. MAJOR-CARRY GLITCH (FALLING) MAJOR-CARRY GLITCH (RISING) VREF = 2.5 V 5V/div VREF = 2.5 V 5V/div LDAC LDAC VOUT VOUT 0.1V/div 0.1V/div Time (0.5µs/div) Time (0.5µs/div) Figure 21. Figure 22. DAC SETTLING TIME (FALLING) DAC SETTLING TIME (RISING) VREF = 2.5 V 5V/div VREF = 2.5 V 5V/div LDAC LDAC 1V/div VOUT VOUT 1V/div Time (0.2µs/div) Time (0.2µs/div) Figure 23. Figure 24. DIGITAL FEEDTHROUGH VREF = 2.5 V 5V/div 20mV/div SDI VOUT Time (50ns/div) Figure 25. Submit Documentation Feedback 11 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +3 V At TA = +25°C and VREF = +2.5 V, unless otherwise noted. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +25_C VREF = 1.5 V 0.50 0.50 0.25 0.25 0 −0.25 −0.25 −0.50 −0.75 −0.75 −1.00 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 0 Figure 27. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 TA = −40_C VREF = 1.5 V 0.75 0.50 0.25 0.25 DNL (LSB) 0.50 0 −0.25 TA = −40_C VREF = 1.5 V 0.75 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 28. Figure 29. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +85_C VREF = 1.5 V 0.75 0.25 0.25 DNL (LSB) 0.50 0 −0.25 TA = +85_C VREF = 1.5 V 0.75 0.50 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 0 Figure 30. 12 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 26. 1.00 INL (LSB) 0 −0.50 −1.00 INL (LSB) TA = +25_C VREF = 1.5 V 0.75 DNL (LSB) INL (LSB) 0.75 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 31. Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +3 V (continued) At TA = +25°C and VREF = +2.5 V, unless otherwise noted. LINEARITY ERROR vs DIGITAL INPUT CODE DIFFERENTIAL LINEARITY ERROR vs DIGITAL INPUT CODE 1.00 1.00 TA = +25_ C VREF = 3 V TA = +25_C VREF = 3 V 0.75 0.50 0.50 0.25 0.25 DNL (LSB) INL (LSB) 0.75 0 −0.25 0 −0.25 −0.50 −0.50 −0.75 −0.75 −1.00 −1.00 0 0 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 32. Figure 33. LINEARITY ERROR vs REFERENCE VOLTAGE GAIN ERROR vs TEMPERATURE 1.00 0.75 0.75 Bipolar Mode 0.50 Gain Error (LSB) Linearity Error (LSB) 0.50 DNL 0.25 0 −0.25 1.5 2.0 2.5 3.0 Unipolar Mode −0.25 −0.50 VDD = 3 V VREF = 2.5 V −1.00 −60 −0.50 1.0 0 −0.75 INL 0.5 0.25 3.5 Reference Voltage (V) 20 40 60 80 Temperature (_C) 100 Figure 35. ZERO-CODE ERROR vs TEMPERATURE REFERENCE CURRENT vs CODE (UNIPOLAR MODE) VREF = 1.5 V 250 Reference Current (µA) 0.25 0 Unipolar Mode −0.25 Bipolar Mode −0.50 120 140 300 VDD = 3 V VREF = 2.5 V Zero−Code Error (LSB) 0 Figure 34. 0.50 −0.75 −60 −40 −20 200 150 100 50 0 −40 −20 0 20 40 60 80 Temperature (_C) 100 120 140 0 Figure 36. 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 37. Submit Documentation Feedback 13 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 TYPICAL CHARACTERISTICS: VDD = +3 V (continued) At TA = +25°C and VREF = +2.5 V, unless otherwise noted. REFERENCE CURRENT vs CODE (BIPOLAR MODE) DIGITAL FEEDTHROUGH 300 VREF = 2.5 V VREF = 1.5 V Reference Current (µA) 250 5V/div SDI 200 150 20mV/div VOUT 100 50 0 0 Time (50ns/div) 8192 16384 24576 32768 40960 49152 57344 65536 Digital Input Code Figure 38. Figure 39. MAJOR-CARRY GLITCH (FALLING) MAJOR-CARRY GLITCH (RISING) VREF = 2.5 V 5V/div VREF = 2.5 V 5V/div LDAC VOUT LDAC VOUT 0.1V/div 0.1V/div Time (0.5µs/div) Time (0.5µs/div) Figure 40. Figure 41. DAC SETTLING TIME (FALLING) DAC SETTLING TIME (RISING) VREF = 2.5 V VREF = 2.5 V 5V/div LDAC 5V/div 1V/div VOUT VOUT 1V/div Time (0.2µs/div) Time (0.2µs/div) Figure 42. 14 LDAC Figure 43. Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 THEORY OF OPERATION GENERAL DESCRIPTION The DAC8830 and DAC8831 are single, 16-bit, serial-input, voltage-output DACs. They operate from a single supply ranging from 2.7 V to 5 V, and typically consume 5 µA. Data is written to these devices in a 16-bit word format, via an SPI serial interface. To ensure a known power-up state, these parts are designed with a power-on reset function. The DAC8830 and DAC8831 are reset to zero code. In unipolar mode, the DAC8830 and DAC8831 are reset to 0V, and in bipolar mode, the DAC8831 is reset to –VREF. Kelvin sense connections for the reference and analog ground are included on the DAC8831. DIGITAL-TO-ANALOG SECTIONS The DAC architecture for both devices consists of two matched DAC sections and is segmented. A simplified circuit diagram is shown in Figure 44. The four MSBs of the 16-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of 15 matched resistors to either AGND or VREF. The remaining 12 bits of the data word drive switches S0 to S11 of a 12-bit voltage mode R-2R ladder network. R R VOUT 2R 2R S0 2R S1 2R 2R S11 E1 2R E2 2R E15 VREF 12−Bit R−2R Ladder Four MSBs Decoded into 15 Equal Segments Figure 44. DAC Architecture OUTPUT RANGE The output of the DAC is VOUT = (VREF × Code)/65536. Where Code is the decimal data word loaded to the DAC latch. Submit Documentation Feedback 15 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 THEORY OF OPERATION (continued) POWER-ON RESET Both devices have a power-on reset function to ensure the output is at a known state upon power-up. In the DAC8830 and DAC8831, on power-up, the DAC latch and Input Registers contain all 0s until new data is loaded from the input serial shift register. Therefore, after power-up, the output from pin VOUT of the DAC8830 is 0 V. The output from pin VOUT of the DAC8831 is 0V in unipolar mode and –VREF in bipolar mode. However, the serial register of the DAC8830 and DAC8831 is not cleared on power-up, so its contents are undefined. When loading data initially to the device, 16 bits or more should be loaded to prevent erroneous data appearing on the output. If more than 16 bits are loaded, the last 16 are kept; if less than 16 are loaded, bits will remain from the previous word. If the device must be interfaced with data shorter than 16 bits, the data should be padded with 0s at the LSBs. Serial Interface The digital interface is standard 3-wire connection compatible with SPI, QSPI™, Microwire™, and TI DSP interfaces, which can operate at speeds up to 50M-bits/sec. The data transfer is framed by CS, the chip select signal. The DAC works as a bus slave. The bus master generates the synchronize clock, SCLK, and initiates the transmission. When CS is high, the DAC is not accessed, and the clock SCLK and serial input data SDI are ignored. The bus master accesses the DAC by driving pin CS low. Immediately following the high-to-low transition of CS, the serial input data on pin SDI is shifted out from the bus master synchronously on the falling edge of SCLK, and latched on the rising edge of SCLK into the input shift register, MSB first. The low-to-high transition of CS transfers the contents of the input shift register to the input register. All data registers are 16-bit. It takes 16 clocks of SCLK to transfer one data word to the parts. To complete a whole data word, CS must go high immediately after 16 SCLKs are clocked in. If more than 16 SCLKs are applied during the low state of CS, the last 16 bits are transferred to the input register on the rising edge of CS. However, if CS is not kept low during the entire 16 SCLK cycles, data is corrupted. In this case, reload the DAC with a new 16-bit word. In the DAC8830, the contents of the input register are transferred into the DAC latch immediately when the input register is loaded, and the DAC output is updated at the same time. The DAC8831 has an LDAC pin allowing the DAC latch to be updated asynchronously by bringing LDAC low after CS goes high. In this case, LDAC must be maintained high while CS is low. If LDAC is tied permanently low, the DAC latch is updated immediately after the input register is loaded (caused by the low-to-high transition of CS). 16 Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 APPLICATION INFORMATION Unipolar Output Operation These DACs are capable of driving unbuffered loads of 60 kΩ. Unbuffered operation results in low supply current (typically 5 µA) and a low offset error. The DAC8830 provides a unipolar output swing ranging from 0 V to VREF. The DAC8831 can be configured to output both unipolar and bipolar voltages. Figure 45 and Figure 46 show a typical unipolar output voltage circuit for each device, respectively. The code table for this mode of operation is shown in Table 1. Table 1. Unipolar Code DAC LATCH CONTENTS MSB LSB ANALOG OUTPUT 1111 1111 1111 1111 VREF × (65,535/65,536) 1000 0000 0000 0000 VREF × (32,768/65,536) = 1/2 VREF 0000 0000 0000 0001 VREF × (1/65,536) 0000 0000 0000 0000 0V +5 V +2.5 V 0.1 µF 0.1 µF VDD + OPA277 OPA704 OPA727 VREF DAC VOUT VO = 0 to +VREF AGND Serial Interface CS SCLK 10 µF Input Register DAC Latch SDI DAC8830 DGND Figure 45. Unipolar Output Mode of DAC8830 Submit Documentation Feedback 17 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 +5 V +2.5 V 0.1 µF VDD 0.1 µF + 10 µF OPA277 OPA704 OPA727 VREF−S VREF−F RINV RFB RFB +V CS SCLK SDI Serial Interface and Control Logic LDAC DAC INV VOUT VO = 0 to +VREF −V AGNDF Input Register DAC Latch AGNDS DAC8831 DGND Figure 46. Unipolar Output Mode of DAC8831 Assuming a perfect reference, the worst-case output voltage may be calculated from the following equation: Unipolar Mode Worst-Case Output V OUT_UNI + D 216 ǒVREF ) VGEǓ ) V ZSE ) INL Where: VOUT_UNI = Unipolar mode worst-case output D = Code loaded to DAC VREF = Reference voltage applied to part VGE = Gain error in volts VZSE = Zero scale error in volts INL = Integral nonlinearity in volts 18 Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 Bipolar Output Operation With the aid of an external operational amplifier, the DAC8831 may be configured to provide a bipolar voltage output. A typical circuit of such an operation is shown in Figure 47. The matched bipolar offset resistors RFB and RINV are connected to an external operational amplifier to achieve this bipolar output swing; typically, RFB = RINV = 28 kΩ. +5 V +2.5 V 0.1 µF + 0.1 µF VREF−S VREF−F VDD RINV R FB RFB INV CS SDI Serial Interface and Control Logic LDAC SCLK 10 µF VOUT DAC AGNDF Input Register +V VO = −VREF to +VREF OPA277 −V OPA704 OPA727 AGNDS DAC Latch DAC8831 DGND Figure 47. Bipolar Output Mode of DAC8831 Table 2 shows the transfer function for this output operating mode. The DAC8831 also provides a set of Kelvin connections to the analog ground and external reference inputs. Table 2. Bipolar Code DAC LATCH CONTENTS MSB LSB ANALOG OUTPUT 1111 1111 1111 1111 +VREF × (32,767/32,768) 1000 0000 0000 0001 +VREF × (1/32,768) 1000 0000 0000 0000 0V 0111 1111 1111 1111 –VREF × (1/32,768) 0000 0000 0000 0000 –VREF × (32,768/32,768) = –VREF Assuming a perfect reference, the worst-case output voltage may be calculated from the following equation: Bipolar Mode Worst-Case Output V OUT_BIP + ƪǒVOUT_UNI ) VOSǓ (2 ) RD) * VREF(1 ) RD)ƫ 1 ) ǒ2)RDǓ A Where: VOS = External operational amplifier input offset voltage RD = RFB and RIN resistor matching error A = Operational amplifier open-loop gain Submit Documentation Feedback 19 DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 Output Amplifier Selection For bipolar mode, a precision amplifier should be used, supplied from a dual power supply. This provides the ±VREF output. In a single-supply application, selection of a suitable operational amplifier may be more difficult because the output swing of the amplifier does not usually include the negative rail; in this case, AGND. This output swing can result in some degradation of the specified performance unless the application does not use codes near 0. The selected operational amplifier needs to have low-offset voltage (the DAC LSB is 38 µV with a 2.5 V reference), eliminating the need for output offset trims. Input bias current should also be low because the bias current multiplied by the DAC output impedance (approximately 6.25 kΩ) adds to the zero-code error. Rail-to-rail input and output performance is required. For fast settling, the slew rate of the operational amplifier should not impede the settling time of the DAC. Output impedance of the DAC is constant and code-independent, but in order to minimize gain errors the input impedance of the output amplifier should be as high as possible. The amplifier should also have a 3 dB bandwidth of 1 MHz or greater. The amplifier adds another time constant to the system, thus increasing the settling time of the output. A higher 3 dB amplifier bandwidth results in a shorter effective settling time of the combined DAC and amplifier. Reference and Ground Since the input impedance is code-dependent, the reference pin should be driven from a low impedance source. The DAC8830 and DAC8831 operate with a voltage reference ranging from 1.25 V to VDD. References below 1.25 V result in reduced accuracy. The DAC full-scale output voltage is determined by the reference. Table 1 and Table 2 outline the analog output voltage for particular digital codes. For optimum performance, Kelvin sense connections are provided on the DAC8831. If the application does not require separate force and sense lines, they should be tied together close to the package to minimize voltage drops between the package leads and the internal die. Power Supply and Reference Bypassing For accurate high-resolution performance, it is recommended that the reference and supply pins be bypassed with a 10 µF tantalum capacitor in parallel with a 0.1 µF ceramic capacitor. 20 Submit Documentation Feedback DAC8830 DAC8831 www.ti.com SLAS449C – FEBRUARY 2005 – REVISED NOVEMBER 2006 CROSS-REFERENCE The DAC8830 and DAC8831 have an industry-standard pinout configuration (see Table 3). Table 3. Cross-Reference MODEL INL (LSB) DNL (LSB) POWER-ON RESET TO TEMPERATURE RANGE PACKAGE DESCRIPTION PACKAGE OPTION CROSS REFERENCE DAC8830ICD ±1 ±1 Zero-Code –40°C to +85°C 8-Lead Small Outline IC SO-8 AD5541CR, MAX541AESA DAC8830IBD ±2 ±1 Zero-Code –40°C to +85°C 8-Lead Small Outline IC SO-8 AD5541BR, MAX541BESA DAC8830ID ±4 ±1 Zero-Code –40°C to +85°C 8-Lead Small Outline IC SO-8 AD5541AR, MAX541CESA N/A ±1 ±1 Zero-Code –40°C to +85°C 8-Lead Plastic DIP PDIP-8 MAX541AEPA N/A ±2 ±1 Zero-Code –40°C to +85°C 8-Lead Plastic DIP PDIP-8 MAX541BEPA N/A ±4 ±1 Zero-Code –40°C to +85°C 8-Lead Plastic DIP PDIP-8 MAX541CEPA N/A ±1 ±1 Zero-Code 0°C to +70°C 8-Lead Small Outline IC SO-8 AD5541LR N/A ±2 ±1.5 Zero-Code 0°C to +70°C 8-Lead Small Outline IC SO-8 AD5541JR N/A ±1 ±1 Zero-Code 0°C to +70°C 8-Lead Plastic DIP PDIP-8 MAX541AEPA N/A ±2 ±1 Zero-Code 0°C to +70°C 8-Lead Plastic DIP PDIP-8 MAX541BEPA N/A ±4 ±1 Zero-Code 0°C to +70°C 8-Lead Plastic DIP PDIP-8 MAX541CEPA DAC8831ICD ±1 ±1 Zero-Code –40°C to +85°C 14-Lead Small Outline IC SO-14 AD5542CR, MAX542AESD DAC8831IBD ±2 ±1 Zero-Code –40°C to +85°C 14-Lead Small Outline IC SO-14 AD5542BR, MAX542BESD DAC8831ID ±4 ±1 Zero-Code –40°C to +85°C 14-Lead Small Outline IC SO-14 AD5542AR, MAX542CESD DAC8831ICRGY ±1 ±1 Zero-Code –40°C to +85°C 14-Lead QFN QFN-14 N/A DAC8831IBRGY ±2 ±1 Zero-Code –40°C to +85°C 14-Lead QFN QFN-14 N/A DAC8831IRGY ±4 ±1 Zero-Code –40°C to +85°C 14-Lead QFN QFN-14 N/A N/A ±1 ±1 Zero-Code –40°C to +85°C 14-Lead Plastic DIP PDIP-14 MAX542ACPD N/A ±2 ±1 Zero-Code –40°C to +85°C 14-Lead Plastic DIP PDIP-14 MAX542BCPD N/A ±4 ±1 Zero-Code –40°C to +85°C 14-Lead Plastic DIP PDIP-14 MAX542CCPD N/A ±1 ±1 Zero-Code 0°C to +70°C 14-Lead Small Outline IC SO-14 AD5542LR N/A ±2 ±1.5 Zero-Code 0°C to +70°C 14-Lead Small Outline IC SO-14 AD5542JR N/A ±1 ±1 Zero-Code 0°C to +70°C 14-Lead Small Outline IC SO-14 MAX542AEPD N/A ±2 ±1 Zero-Code 0°C to +70°C 14-Lead Small Outline IC SO-14 MAX542BEPD N/A ±4 ±1 Zero-Code 0°C to +70°C 14-Lead Small Outline IC SO-14 MAX542CEPD Submit Documentation Feedback 21 PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC8830IBDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IBDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IBDT ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IBDTG4 ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830ICDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830ICDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830ICDT ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830ICDTG4 ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IDT ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8830IDTG4 ACTIVE SOIC D 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBRGYR ACTIVE QFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBRGYRG4 ACTIVE QFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBRGYT ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IBRGYTG4 ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICRGYR ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 8-Jan-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC8831ICRGYT ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ICRGYTG4 ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IRGYR ACTIVE QFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IRGYRG4 ACTIVE QFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IRGYT ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC8831IRGYTG4 ACTIVE QFN RGY 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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