bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com Qi Compliant Wireless Power Transmitter Manager Check for Samples: bq500210 FEATURES APPLICATIONS • • 1 • • • • • • Intelligent Control of the Power Transfer between Base Station and Mobile Device Conforms to the Wireless Power Consortium (WPC) Wireless Power Transfer 1.0.2 Specification Digital Demodulation Significantly Simplifies Solution Over bq500110 Improved Parasitic Metal Object Detection (PMOD) Promotes Safety During Wireless Power Transfer Enhanced Charge Status Indicator Operating Modes Status Indicators – Standby – Power Transfer (visual and audio) – Charge Complete – Fault Over Temperature Protection • • WPC 1.0.2 Compliant Wireless Chargers for: – Mobile and Smart Phones – MP3 Players – Global Positioning Devices – Digital Cameras Other Wireless Power Transmitters in: – Cars and Other Vehicles – Hermetically Sealed Devices, Tools, and Appliances – Furniture Built-In Wireless Chargers – Toy Power Supplies and Chargers See www.ti.com/wirelesspower for More Information on TI's Wireless Charging Solutions DESCRIPTION The bq500210 is a second generation Wireless Power dedicated digital controller that integrates the logic functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging base station. The bq500210 is an intelligent device that periodically pings the surrounding environment for available devices to be powered, monitors all communication from the device being wirelessly powered, and adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500210 also manages the fault conditions associated with the power transfer and controls the operating modes status indicator. The bq500210 supports improved Parasitic Metal Object Detection (PMOD). The controller in real time analyzes the efficiency of the established power transfer using Rectified Power Packets and protects itself and the power receiver from excessive power loss and heat associated with parasitic metal objects placed in the power transfer path. The bq500210 is available in an area saving 48-pin, 7mm x 7mm QFN package and operates over a temperature range from –40°C to 110°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com Power Power Stage AC-DC Rectification Voltage Conditioning Load Communication bq500210 Controller bq51013 Transmitter 2 Receiver Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) OPERATING TEMPERATURE RANGE, TA ORDERABLE PART NUMBER PIN COUNT SUPPLY PACKAGE TOP SIDE MARKING bq500210RGZR 48 pin Reel of 2500 QFN bq500210 bq500210RGZT 48 pin Reel of 250 QFN bq500210 -40°C to 110°C (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Voltage applied at V33D to DGND –0.3 3.8 V Voltage applied at V33A to AGND –0.3 3.8 V –0.3 3.8 V –40 150 °C Voltage applied to any pin (2) Storage temperature,TSTG (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to GND. THERMAL INFORMATION bq500210 THERMAL METRIC (1) RGZ UNITS 48 PINS θJA Junction-to-ambient thermal resistance (2) θJC(top) Junction-to-case(top) thermal resistance 28.4 (3) 13.9 (4) θJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter θJC(bottom) (1) (2) (3) (4) (5) (6) (7) 5.3 (5) Junction-to-case(bottom) thermal resistance 0.2 (6) (7) °C/W 5.2 1.4 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 3 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX V Supply voltage during operation, V33D, V33A 3.0 TA Operating free-air temperature range –40 TJ Junction temperature 4 Submit Documentation Feedback 3.3 UNIT 3.6 V 125 °C 125 °C Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN NOM MAX UNIT SUPPLY CURRENT IV33A V33A = 3.3 V 8 15 IV33D V33D = 3.3 V 42 55 V33D = 3.3 V while storing configuration parameters in flash memory 53 65 3.3 3.6 4 4.6 Supply current IV33D mA INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS V33 3.3-V linear regulator V33FB 3.3-V linear regulator feedback IV33FB Series pass base drive Beta Series NPN pass device Emitter of NPN transistor 3.25 VIN = 12 V; current into V33FB pin V 10 mA 40 EXTERNALLY SUPPLIED 3.3 V POWER V33D Digital 3.3-V power TA = 25°C 3 3.6 V V33A Analog 3.3-V power TA = 25°C 3 3.6 V V33 slew rate V33 slew rate between 2.3V and 2.9V, V33A = V33D V33Slew 0.25 V/ms MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B –0.15 VCM Common mode voltage each pin EAP-EAN Modulation voltage digital resolution REA Input Impedance Ground reference 0.5 IOFFSET Input offset current 1 kΩ source impedance –5 1.631 V 1 1.5 mV 3 MΩ 5 µA ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR VADDR_OPEN Voltage indicating open pin LED_MODE, PMOD_THR open VADDR_SHORT Voltage indicating pin shorted to GND LED_MODE, PMOD_THR shorted to ground VADC_RANGE Measurement range for voltage monitoring Inputs: V_IN, I_IN, TEMP_IN, I_COIL INL ADC integral nonlinearity Ilkg Input leakage current 3V applied to pin RIN Input impedance Ground reference CIN Input capacitance 2.37 V 0.36 V 0 2.5 V -2.5 2.5 mV 100 nA 8 MΩ 10 pF DGND1 + 0.25 V DIGITAL INPUTS/OUTPUTS (1) VOL Low-level output voltage IOL = 6 mA , V33D = 3 V VOH High-level output voltage IOH = -6 mA VIH High-level input voltage V33D = 3V VIL Low-level input voltage V33D = 3.5 V IOH(MAX) Output high source current 4 mA IOL(MAX) Output low sink current 4 mA (2) , V33D = 3 V V33D - 0.6V 2.1 V 3.6 V 1.4 V SYSTEM PERFORMANCE VRESET Voltage where device comes out of reset V33D Pin tRESET Pulse width needed for reset RESET pin FSW Switching Frequency tdetect Time to detect presence of device requesting power tretention Retention of configuration parameters TJ = 25°C 100 Years Write_Cycles Number of nonvolatile erase/write cycles TJ = 25°C 20 K cycles (1) (2) 2.3 2.4 V µs 2 110 205 kHz 0.6 sec The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified. The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 5 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com DEVICE INFORMATION Functional Block Diagram bq500210 COMM_A+ COMM_ACOMM_B+ COMM_B- LED Control / Low Power Supervisor Interface MSP430 CNTL LED DRIVE Digital Demodulation PWM PWM-A PWM-B (EN) mController Buzzer Control 12-bit ADC TEMP_INT Low Power Control Debug/Programming V_IN I_OUT TEMP_EXT JTAG BUZ_AC BUZ_DC TRST TMS TDI TDO TCK I2C (PMBUS) PMB_DATA PMB_CLK SLEEP RESET 6 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com REFIN AGND V_IN AIN7 LED_M ODE PMOD_THR I_IN V33FB COMM_B- COMM_B+ COMM_A- COMM_A+ 48 47 46 45 44 43 42 41 40 39 38 37 48-PIN QFN PACKAGE (TOP VIEW) AIN5 1 36 AGND T_SENSE 2 35 BPCAP AIN3 3 34 V33A AIN8 4 33 V33D RESET 5 32 DGND SLEEP 6 31 JTAG _TRSTN 30 JTAG _TMS bq500210 24 BUZ_AC BUZ_DC MSP_MOSI/LPWR_EN 23 25 22 12 DRV_CFG DPWM _A DOUT_TX MSP_TDO/PROG 21 26 20 11 PM B_CTRL PMB _DATA PMB_ALRT JTAG _TCK 19 27 18 10 M SP_TCK/ CLK PMB _CLK 17 JTAG _TDO DOUT_4B 28 16 9 DOUT_4A MSP_TEST 15 JTAG _TDI DOUT_2B 29 14 8 M SP_SYNC MSP_MISO/LED_B 13 7 DPMB_B MSP_RST/LED_A PIN FUNCTIONS PIN NO. NAME I/O DESCRIPTION 1 AIN5 I Connect this pin to GND 2 T_SENSE I Thermal Sensor Input 3 AIN3 I Connect this pin to GND 4 AIN8 I Connect this pin to GND 5 RESET I Device reset 6 SLEEP O Low-power mode start logic output 7 MSP_RST/LED_A I MSP – Reset, LED-A 8 MSP_MISO/LED_B I MSP – TMS, SPI-MISO, LED-B 9 MSP_TEST I MSP – Test 10 PMB_CLK I/O PMBus Clock 11 PMB_DATA I/O PMBus Data 12 DPWM_A O PWM Output A 13 DPMB_B O PWM Output B 14 MSP_SYNC O MSP SPI_SYNC 15 DOUT_2B O Optional Logic Output 2B. Leave this pin floating. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 7 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com PIN FUNCTIONS (continued) PIN NO. 8 NAME I/O DESCRIPTION 16 DOUT_4A O Optional Logic Output 4A. Leave this pin floating. 17 DOUT_4B O Optional Logic Output 4B. Leave this pin floating. 18 MSP_TCK/CLK I/O Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic. 19 PMB_ALERT O PMBus Interface 20 PMB_CTRL I PMBus Interface 21 DOUT_TX I Leave this pin floating 22 DRV_CFG I Pull this input to V33D 23 BUZ_AC O AC Buzzer Output 24 BUZ_DC O DC Buzzer Output 25 MSP_MOSI/LPWR_EN I/O MSP-TDI, SPI-MOSI, Low Power Enable 26 MSP_TDO/PROG I/O MSP-TDO, Programmed Indicator 27 JTAG_TCK I/O JTAG Interface 28 JTAG_TDO I/O JTAG Interface 29 JTAG_TDI I/O JTAG Interface 30 JATG_TMS I/O JTAG Interface 31 JTAG_TRSTN I/O JTAG Interface 32 DGND — Digital GND 33 V33D — Digital Core 3.3V Supply 34 V33A — Analog 3.3V Supply 35 BPCAP — Bypass Capacitor Connect Pin 36 AGND — Analog GND 37 COMM_A+ I Digital demodulation noninverting input A 38 COMM_A- I Digital demodulation inverting input A 39 COMM_B+ I Digital demodulation noninverting input B 40 COMM_B- I Digital demodulation inverting input B 41 V33FB I 3.3V Linear-Regulator Feedback Input. Leave this pin floating. 42 I_IN I Transmitter Input Current 43 PMOD_THR I Input to Program Metal Object Detection Threshold 44 LED_MODE I Input to Select LED Mode 45 AIN7 I Reserved Analog Input. Connect this pin to GND. 46 V_IN I Transmitter Input Voltage 47 AGND — 48 REFIN I Analog GND External Reference Voltage Input. Connect this Input to AGND. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS SPACER EFFICIENCY vs RECEIVER LOAD CURRENT PMOD THRESHOLD vs OUTPUT POWER 80 1.4 RPMOD = 64.9 kW 1.2 75 RPMOD = 75 kW RPMOD = 56.2 kW Rectifier Loading - W 1 Efficiency - % 70 65 60 55 50 100 0.8 0.6 0.4 0.2 300 500 700 900 RL - Load Current - mA 1100 RPMOD = 48.7 kW RPMOD = 0 kW RPMOD = 42.2 kW 0 0 Figure 1. 1 2 3 4 PO - Output Power - W 5 6 Figure 2. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 9 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com FUNCTIONAL OVERVIEW The typical Wireless Power Transfer System consists of primary and secondary coils that are positioned against each other in a way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite shields as part of their structures to even further maximize field coupling. The primary coil is excited with the switching waveform of the transmitter power driver that gets its power from an AC-DC wall adapter. The secondary coil is connected to the rectifier that can either directly interface the battery or can have an electronic charger or post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the system. The system being in resonance facilitates better energy transfer compared to inductive transfer. Power transfer in the resonant system can also be easily controlled with the variable frequency control approach. To limit operating frequency variation the bq500210 uses both frequency and PWM methods to control power transfer. When the operating frequency approaches a 205kHz limit and the receiver still commands lower power, the bq500210 will reduce the PWM cycle in discrete steps to maintain the output in regulation. The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control the modulation circuit to pass coded information from the secondary side to the primary side. The coded information is organized into information packets that have Preamble bytes, Header bytes, message bytes and Checksum bytes. Per the WPC specification, information packets can be related to Identification, Configuration, Control Error, Rectified Power, Charge Status, and End of Power Transfer information. For detailed information on the WPC specification, visit the Wireless Power Consortium website at http://www.wirelesspowerconsortium.com/. There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from the secondary side to the primary side. With the resistive modulation approach shown in Figure 3, the communication resistor periodically loads the rectifier output changing system Q factor, and as a result the value of the voltage on the primary side coil. With the capacitive modulation approach shown in Figure 4, a pair of communication capacitors are periodically connected to the receiver coil network. These extra capacitance application changes slightly the resonance frequency of the system and its response on the current operating frequency, which in turn leads to coil voltage variation on the primary side. With both modulation techniques primary side coil waveform variations are detected with a Digital Demodulation algorithm in the bq500210 to restore the content of the information packets and adjust controls to the transmitter. Rectifier Receiver Coil Receiver Capacitor Amax Modulation Resitor Operating state at logic “0” A(0) Operating state at logic “1” A(1) Comm Fsw a) F, kHz b) Figure 3. Resistive Modulation Circuit 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com Rectifier Receiver Coil Receiver Capacitor Modulation Capacitors Amax Comm A(0) Operating state at logic “ 0” A(1) Operating state at logic “ 1” Fsw F, kHz Fo(1) < Fo(0) a) b) Figure 4. Capacitive Modulation Circuit The bq500210 is a second generation wireless power dedicated transmitter controller that simplifies integration of wireless power technology into consumer electronics, such as digital cameras, smart phones, MP3 players, and global positioning systems, along with infrastructure applications such as furniture and cars. The bq500210 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object detection, over temperature protection of the transmitter top surface, and indication of the transmitter operating states. The bq500210 digital demodulation inputs receive scaled down voltages from the transmitter resonant components. The digital demodulation algorithm is a combination of several digital signal processing techniques that decodes information packets sent by the power receiving device and provides necessary changes to power drive signals facilitating closed loop regulation. The controller analog inputs monitor input DC voltage, input current, and the thermal protection input. These analog inputs support monitoring and protective functions of the controller. The bq500210 controls two LEDs to indicate transmitter operating and fault states. Having the LEDs connected directly to the controller simplifies the transmitter electrical schematic and provides a cost effective solution. Option Select Pins Two pins (43, 44) in the bq500210 are allocated to program the PMOD mode and the LED mode of the device. At power-up, a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured in order to identify the value of the attached programming resistor. The values of the operating parameters set by these pins are determined using Option Select Bins. For LED_MODE, the selected bin determines the LED behavior based on LED Modes; for the PMOD_THR, the selected bin sets a threshold used for parasitic metal object detection (see Metal Object Detection (PMOD) section). Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 11 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com V33 LED_MODE PMOD_THR bq500210 10 mA IBIAS Resistors to set options To 12 -bit ADC Figure 5. Option Programming Table 1. Option Select Bins BIN NUMBER RESISTANCE (kΩ) LED OPTION PMOD THRESHOLD (mW) (1) 0 GND 0 500 1 42.2 1 600 2 48.7 2 700 3 56.2 3 800 4 64.9 4 900 5 75.0 5 1000 6 86.6 6 1100 7 100 7 1200 8 115 8 1300 9 133 9 1400 10 154 10 1500 11 178 11 1600 12 205 12 1700 13 open 13 OFF (1) Threshold numbers are approximate. See Figure 2. LED Modes The bq500210 can directly control two LED outputs (pins 7 and 8). They are driven based on one of the selectable modes. The resistor connected between pin 44 and GND selects one of the desired LED indication schemes presented in Table 2. 12 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com Table 2. LED Modes LED Control Option LED Selection Resistor 0 <36.5 kΩ 1 2 3 4 5 6 7 8 9 10 11 12 13 42.2 kΩ 48.7 kΩ 56.2 kΩ 64.9 kΩ 75 kΩ 86.6 kΩ 100 kΩ 115 kΩ 133 kΩ 154 kΩ 178 kΩ 205 kΩ >237 kΩ Operational States Description LED Standby Power Transfer Charge Complete Fault PMOD Warning LED1, Green – – – – – LED2, Red – – – – – LED1, Green OFF BLINK SLOW ON OFF OFF LED2, Red OFF OFF OFF ON BLINK FAST LED1, Green OFF BLINK SLOW ON OFF OFF LED2, Red OFF OFF OFF OFF BLINK FAST LED1, Green OFF BLINK SLOW ON ON OFF LED2, Red OFF OFF OFF ON BLINK FAST LED1, Green OFF BLINK SLOW ON OFF OFF LED2, Red OFF OFF OFF ON BLINK FAST LED1, Green OFF BLINK SLOW ON OFF OFF LED2, Red OFF OFF OFF ON BLINK FAST LED1, Green ON BLINK SLOW ON OFF OFF LED2, Red ON OFF OFF ON BLINK FAST LED1, Green ON BLINK SLOW ON OFF OFF LED2, Red ON OFF OFF ON BLINK FAST LED1, Green ON BLINK SLOW ON OFF OFF LED2, Red ON OFF OFF ON BLINK FAST LED1, Green ON BLINK SLOW ON OFF OFF LED2, Red ON OFF OFF ON BLINK FAST LED1, Green ON BLINK SLOW ON OFF OFF LED2, Red ON OFF OFF ON BLINK FAST LED1, Green – – – – – LED2, Red – – – – – LED1, Green – – – – – LED2, Red – – – – – LED1, Green – – – – – LED2, Red – – – – – Reserved for test Generic+ CS100 + CS90 + CS6min Generic Generic + CS100 Generic + CS100 + CS90 Generic+ CS100 + CS6min Suggested Suggested + CS100 Suggested + CS100 + CS90 Suggested+ CS100 + CS6min Suggested+ CS100 + CS90 + CS6min Reserved Reserved Reserved Support CS–100 Support CS–90 Support CS–6Min – – – YES YES YES NO NO NO YES NO NO YES YES NO YES NO YES NO NO NO YES NO NO YES YES NO YES NO YES YES NO NO – – – – – – – – – Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 13 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com Thermal Protection The bq500210 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the most thermally challenged area, which usually is the center of the transmitting coil, and connected between the dedicated pin 2 and GND. The threshold on pin 2 is set to 1.00V. The NTC resistor and the resistor from pin 2 to VCC create a temperature sensitive divider. The user has full flexibility choosing the NTC resistor and the value of the resistor from pin 2 to VCC to set the desired temperature when the system shuts down. RTEMP_IN = 2.3 x RNTC(TMAX) (1) The system will attempt to restore normal operation after approximately five minutes of being in the suspended mode due to tripping the over-temperature threshold, or if the receiver is removed. The bq500210 has a built-in thermal sensor that prevents the die temperature from exceeding 135°C. This sensor has ~10°C hysteresis. Audible Notification on Power Transfer Begin The bq500210 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 24 outputs a high logic signal for 0.4s that is suitable to activate DC type buzzers with built in tone generators, or other types of sound generators, or custom indication systems. Pin 23 outputs for 0.4 seconds a 4 kHz square wave signal suitable for inexpensive AC type ceramic buzzers. Power-On Reset The bq500210 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup sequence. At the end of the startup sequence, the device begins normal operation. External Reset The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up resistor connected to 3.3V is recommended. Parasitic Metal Object Detection (PMOD) As a safety feature, the bq500210 can be configured to detect the presence of a parasitic metal object placed in the vicinity of the magnetic field. The bq500100 uses the Rectified Power Packet information and the measured transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected, the device will blink the red LED to warn about this undesirable condition. If during a twenty second warning time the parasitic metal object is not removed, the controller will disable power transfer. After being in halt for five minutes, the bq500210 will attempt normal operation. If the object that caused excessive power dissipation is still present, the sequence will be repeated over and over again. If the metal object is removed during this twenty second warning time, then normal operation will be restored promptly. To facilitate the parasitic loss function, the bq500210 monitors the input voltage and the input current supplied to the power drive circuit. The PMOD_THR pin is used to set the threshold at which the PMOD is activated. The highest bin, the pin is left floating, disables the PMOD feature. Note: The WPC Specification V1.0 does not define the requirements and thresholds for the PMOD feature. Hence, metal object detection may perform differently with different products. Therefore, the threshold setting is determined by the user. In most desktop wireless charger applications, a PMOD threshold setting of 0.8W has shown to provide acceptable results in stopping power transfer and preventing small metal objects like coins, pharmaceutical wraps, etc. from becoming dangerously hot when placed in the path of the wireless power transfer. Figure 2 depicts PMOD performance measured on a bq500210 EVM with a bq51013 EVM. The parasitic metal loss is emulated by loading the output of the rectifier in the bq51013 EVM. ADVANCED CHARGE INDICATION SCHEMES The WPC specification provides an End of Power Transfer message (EPT–01) to indicate charge complete. Upon receipt of the charge complete message, the bq500210 will change the LED indication as defined by the LED_MODE pin (normally solid green LED output), and halt power transfer for 5 minutes. In some battery charging applications there is a benefit to continue the charging process in trickle charge mode 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com to top off the battery. There are several information packets in the WPC specification related to the levels of battery charge – Charge Status. The bq500210 uses these commands in association with some of the LED modes described in Table 2 to enable the top-off charging pattern. When CS100 LED mode is enabled, the bq500210 will change the LED indication to reflect charge complete when a Charge Status = 100% message is received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The mobile device can use a CS100 packet to enable trickle charge mode. Note that all options related to CS100 have an effect on the LEDs only; they do not have any impact on actual power transfer which continues uninterrupted. Two more optional modes are available which can be used to change the LED mode back to indicate charging after the CS100 has forced the charge complete output: • If CS90 is enabled, a Charge Status message indicating less than 90% charge will force the LED output to indicate charging (typically a slow blinking green LED). • When CS6MIN is enabled, and if the bq500210 does not detect another CS100 packet for six minutes, it will assume the receiver charge has dropped significantly and will turn on charging status indication. APPLICATION INFORMATION The application diagram for the transmitter with reduced standby power consumption is shown in Figure 6. Power reduction is achieved by periodically disabling the bq500210 while LED and housekeeping control functions are continued by U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is present in the circuit (which is set by a pull-up resistor on bq500210 pin 25), the bq500210 at first power-up boots the MSP430G2001 with the necessary firmware and the two chips operate in tandem. During standby operation, the bq500210 periodically issues SLEEP command, Q12 pulls the RST pin low, therefore reducing its power consumption. Meanwhile, the MSP430G2001 maintains the LED indication and stores previous charge state during this bq500210 reset period. This bq500210 reset period is set by the RC time constant network of R25, C38 (from Figure 6). WPC compliance mandates the power transmitter controller, bq500210, awakes every 0.4s to produce an analog ping and check if a valid device is present. Altering this time constant, therefore, is not advised. Note: The user does not need to program the optional MSP430G2001. During first system boot, the bq500210 device will program the MSP430G2001 device automatically. The standard application diagram for the transmitter is shown in Figure 7. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 15 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com C21 0.01uF 50V VIN R9 1K0 R33 1R 1 AGND 3 6 I_SENSE U3 C26 0.1uF 50V VIN Buck Regulator U5 DC Jack 19 Vin J4 ENA is no-connect! C6 10uF 50V ENA SS C25 0.1uF 50V AGND C23 0.1uF 50V + 4 - 5 R32 Q3 BC847CL 6 C32 0.1uF 50V C7 4.7uF 10V C8 0.01uF 50V AGND AGND AGND AGND R4 3K16 AGND Q1 C29 AGND 0.22uF 50V GND Q2 CSD17313Q2 R34 0R GND C13 47nF 100V C18 4.7nF 50V TPS28225D GND C27 22uF 25V CSD17313Q2 LGATE 5 GREEN D2 LED-0603 C15 47nF 100V COIL UGATE 1 2 PWM BOOT 7 EN/PG U6 PH 8 C9 0.1uF 50V C16 0.1uF 50V R13 190K C37 2700pF 50V VDD 4 GND AGND 470R R3 10R 3 DPWM-1A R5 R37 76K8 AGND C2 47uF 6.3V R1 10K0 1R AGND VSEN D1 MBR0540 R7 20m 2 PH GND COMP C28 0.01uF 50V 3V3_ADC R21 22R TPS54231 AGND 3V3_VCC L1 330uH VIN BOOT INA199A2 C17 0.1uF 50V R36 309K VIN 3V3_VCC Power Train 3V3_VCC GND GND AGND R6 200K 3V3_VCC R14 23K2 R35 10R R19 10K0 COMM+ D3 BAT54SW NTC Temp Sensor J6 3V3_VCC C24 4.7nF 50V C43 4.7uF 10V C5 4.7uF 10V C1 1.0uF 16V C3 1.0uF 16V R31 10R COMM- R25 280K 34 5 RESET U1 4 3 2 1 AIN8 AIN3 T_SENSE AIN5 BQ500210 I_SENSE 46 45 42 SLEEP MSP_RST MSP_MISO MSP_TEST 6 7 8 9 MSP_CLK 18 21 22 MSP_TCK/CLK DOUT_TX DRV_CFG 37 38 39 40 COMM_A+ COMM_ACOMM_B+ COMM_B- COMM+ 47 COMM- 20 19 11 10 DPWM_A DPWM_B MSP_SYNC DOUT_2B DOUT_4A DOUT_4B 12 13 14 15 16 17 26 25 24 23 44 43 LED_MODE PMOD_THR C11 4.7uF C10 0.01uF 10V R16 10K0 R12 10K0 50V MSP_RST MSP_MISO R2 10R MSP_TEST DPWM-1A R17 10K0 MSP_SYNC U4 MSP_CLK 1 2 3 4 5 6 7 MSP_SYNC MSP_MOSI MSP_RDY MSP_TDO/PROG MSP_MOSI/LPWR_EN BUZ_DC BUZ_AC EPAD AGND SLEEP MSP_RST/LED_A MSP_MISO/LED_B MSP_TEST PMB_CTRL PMB_ALRT PMB_DATA PMB_CLK 3V3_VCC TRST# TMS TDI TDO TCK R24 10R AGND 14 13 12 11 10 9 P1.7 8 VCC P1.0 P1.1 P1.2 P1.3 GND XIN XOUT TEST RST P1.4 P1.5 P1.6 C12 1.0uF 16V MSP430G2001 MSP_RDY MSP_MOSI Low Power Supervisor 49 3V3_VCC V_IN AIN7 I_IN AGND R11 2K0 C4 4.7nF 50V AGND R10 15K4 35 31 30 29 28 27 DGND VIN 32 AGND 36 R18 10K0 AGND BPCAP TRST TMS TDI TDO TCK C20 1.0uF 16V BUZ 33 V33FB REFIN V33A 41 48 V33D AGND C38 4.7uF 10V SLEEP AGND AGND AGND AGND Q12 BSS138 C14 33pF 50V R30 10K 3V3_ADC 3V3_VCC R22 100K R23 42K2 R20 10K0 AGND R28 470R R27 470R R15 NoPop R8 10K0 AGND D5 AGND AGND G AGND R AGND AGND AGND AGND Figure 6. Typical Application Diagram for Wireless Power Transmitter with Reduced Standby Power 16 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com C21 0.01uF 50V VIN VIN Buck Regulator U5 VIN J4 ENA is no-connect! DC Jack 19 Vin C6 10uF 50V C26 BOOT ENA 0.1uF 50V 309K D1 MBR0540 R37 76K8 AGNDAGND C2C7 47uF 6.3V R1 10K0 AGNDAGNDAGNDAGNDAGND C32 0.1uF 50V C8 0.01uF 50V 4.7uF 10V C37 2700pF 50V R5 6 3 AGND 4 - 5 C23 0.1uF 50V R7 20m 2 R32 1R 78 R3 10R PWM BOOT 2 C15C27 47nF 100V COIL UGATE 1 VDD Q1 50V U6 EN/PGPH C9 0.1uF 50V C16 0.1uF 50V R13 190K GND Q2 3V3_VCC Power Train GNDGND R19 10K0 J6 R6 200K 3V3_ADC 3V3_VCC C43 4.7uF 10V C5 4.7uF 10V C1 1.0uF 16V C3 1.0uF 16V GND GND NTC Temp Sensor C24 4.7nF 50V C13 47nF 100V CSD17308Q3 R34 0R 3V3_VCC C18 4.7nF 50V TPS28225D 3V3_VCC AGND R14 23K2 R35 10R COMM+ AGND R11 2K0 C4 4.7nF 50V 5 RESET U1 4 3 2 1 AD_8 AD_3 T_SENSE AD_5 46 45 42 VIN R10 15K4 V33D C38 4.7uF 10V V33FB ADC_REF I_SENSE 6 7 8 9 3V3_VCC 34 V33A AGND 41 48 33 R25 280K AGND V_IN AD_7 I_SENSE SLEEP MSP_RST MSP_MISO MSP_TEST 22uF 25V CSD17308Q3 0.22uF C29 45 GNDLGATE GREEN D2 LED-0603 AGND + AGND 470R R4 3K16 INA199A2 Q3 BC847CL DPWM-1A C28 0.01uF 50V 3 U3 R36 PH GND COMP 1 6 AGND C17 0.1uF 50V SSVSEN C25 0.1uF 50V R33 1R I_SENSE R21 22R TPS54231 AGND R9 1K0 3V3_VCC3V3_ADC L1 330uH VIN 3V3_VCC AGND BPCAP TRST TMS TDI TDO TCK 35 31 30 29 28 27 PMB_CTRL PMB_ALERT PMB_DATA PMB_CLK 20 19 11 10 DPWM_1A DPWM_1B MSP_SYNC DOUT_2B DOUT_4A DOUT_4B 12 13 14 15 16 17 MSP_RDY MSP_MOSI BUZ_DC BUZ_AC 26 25 24 23 LED_MODE PMOD_THR 44 43 C20 1.0uF 16V D3 BAT54SW R31 10R C14 33pF 50V R30 10K COMM- AGND AGND AGND R2 10R DPWM-1A R17 10K0 R28 EPAD BUZ R22 100K R27 470R AGND 49 DGND AGND2 COMM_A+ COMM_ACOMM_B+ COMM_B- 47 MSP_CLK DOUT_TX BRD_MODE 37 38 39 40 36 COMM- 18 21 22 32 COMM+ AGND1 AGND 470R R23 42K2 R20 10K0 AGND D5 G AGND AGND AGND AGND R AGND AGND Figure 7. Typical Application Diagram for Wireless Power Transmitter Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 17 bq500210 SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011 www.ti.com REVISION HISTORY Changes from Original (June 2011) to Revision A Page • Changed APPLICATION INFORMATION description ........................................................................................................ 15 • Changed Figure 6 ............................................................................................................................................................... 16 18 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq500210 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ500210RGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR BQ500210RGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Oct-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ500210RGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 BQ500210RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Oct-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ500210RGZR VQFN RGZ 48 2500 346.0 346.0 33.0 BQ500210RGZT VQFN RGZ 48 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated