TI BQ500210RGZR Qi compliant wireless power transmitter manager Datasheet

bq500210
SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011
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Qi Compliant Wireless Power Transmitter Manager
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FEATURES
APPLICATIONS
•
•
1
•
•
•
•
•
•
Intelligent Control of the Power Transfer
between Base Station and Mobile Device
Conforms to the Wireless Power Consortium
(WPC) Wireless Power Transfer 1.0.2
Specification
Digital Demodulation Significantly Simplifies
Solution Over bq500110
Improved Parasitic Metal Object Detection
(PMOD) Promotes Safety During Wireless
Power Transfer
Enhanced Charge Status Indicator
Operating Modes Status Indicators
– Standby
– Power Transfer (visual and audio)
– Charge Complete
– Fault
Over Temperature Protection
•
•
WPC 1.0.2 Compliant Wireless Chargers for:
– Mobile and Smart Phones
– MP3 Players
– Global Positioning Devices
– Digital Cameras
Other Wireless Power Transmitters in:
– Cars and Other Vehicles
– Hermetically Sealed Devices, Tools, and
Appliances
– Furniture Built-In Wireless Chargers
– Toy Power Supplies and Chargers
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
DESCRIPTION
The bq500210 is a second generation Wireless Power dedicated digital controller that integrates the logic
functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging
base station. The bq500210 is an intelligent device that periodically pings the surrounding environment for
available devices to be powered, monitors all communication from the device being wirelessly powered, and
adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500210 also
manages the fault conditions associated with the power transfer and controls the operating modes status
indicator. The bq500210 supports improved Parasitic Metal Object Detection (PMOD). The controller in real time
analyzes the efficiency of the established power transfer using Rectified Power Packets and protects itself and
the power receiver from excessive power loss and heat associated with parasitic metal objects placed in the
power transfer path.
The bq500210 is available in an area saving 48-pin, 7mm x 7mm QFN package and operates over a temperature
range from –40°C to 110°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
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Power
Power
Stage
AC-DC
Rectification
Voltage
Conditioning
Load
Communication
bq500210
Controller
bq51013
Transmitter
2
Receiver
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
OPERATING
TEMPERATURE
RANGE, TA
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
TOP SIDE
MARKING
bq500210RGZR
48 pin
Reel of 2500
QFN
bq500210
bq500210RGZT
48 pin
Reel of 250
QFN
bq500210
-40°C to 110°C
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
MAX
Voltage applied at V33D to DGND
–0.3
3.8
V
Voltage applied at V33A to AGND
–0.3
3.8
V
–0.3
3.8
V
–40
150
°C
Voltage applied to any pin
(2)
Storage temperature,TSTG
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
THERMAL INFORMATION
bq500210
THERMAL METRIC
(1)
RGZ
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance (2)
θJC(top)
Junction-to-case(top) thermal resistance
28.4
(3)
13.9
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
θJC(bottom)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
5.3
(5)
Junction-to-case(bottom) thermal resistance
0.2
(6)
(7)
°C/W
5.2
1.4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX
V
Supply voltage during operation, V33D, V33A
3.0
TA
Operating free-air temperature range
–40
TJ
Junction temperature
4
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3.3
UNIT
3.6
V
125
°C
125
°C
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
SUPPLY CURRENT
IV33A
V33A = 3.3 V
8
15
IV33D
V33D = 3.3 V
42
55
V33D = 3.3 V while storing configuration
parameters in flash memory
53
65
3.3
3.6
4
4.6
Supply current
IV33D
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
V
10
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V
V33 slew rate
V33 slew rate between 2.3V and 2.9V,
V33A = V33D
V33Slew
0.25
V/ms
MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B
–0.15
VCM
Common mode voltage each pin
EAP-EAN
Modulation voltage digital resolution
REA
Input Impedance
Ground reference
0.5
IOFFSET
Input offset current
1 kΩ source impedance
–5
1.631
V
1
1.5
mV
3
MΩ
5
µA
ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR
VADDR_OPEN
Voltage indicating open pin
LED_MODE, PMOD_THR open
VADDR_SHORT
Voltage indicating pin shorted to GND
LED_MODE, PMOD_THR shorted to ground
VADC_RANGE
Measurement range for voltage monitoring
Inputs: V_IN, I_IN, TEMP_IN, I_COIL
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
2.37
V
0.36
V
0
2.5
V
-2.5
2.5
mV
100
nA
8
MΩ
10
pF
DGND1
+ 0.25
V
DIGITAL INPUTS/OUTPUTS
(1)
VOL
Low-level output voltage
IOL = 6 mA
, V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA
VIH
High-level input voltage
V33D = 3V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
mA
IOL(MAX)
Output low sink current
4
mA
(2)
, V33D = 3 V
V33D
- 0.6V
2.1
V
3.6
V
1.4
V
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
FSW
Switching Frequency
tdetect
Time to detect presence of device requesting
power
tretention
Retention of configuration parameters
TJ = 25°C
100
Years
Write_Cycles
Number of nonvolatile erase/write cycles
TJ = 25°C
20
K cycles
(1)
(2)
2.3
2.4
V
µs
2
110
205
kHz
0.6
sec
The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.
The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.
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DEVICE INFORMATION
Functional Block Diagram
bq500210
COMM_A+
COMM_ACOMM_B+
COMM_B-
LED Control /
Low Power
Supervisor
Interface
MSP430 CNTL
LED DRIVE
Digital
Demodulation
PWM
PWM-A
PWM-B (EN)
mController
Buzzer
Control
12-bit
ADC
TEMP_INT
Low Power
Control
Debug/Programming
V_IN
I_OUT
TEMP_EXT
JTAG
BUZ_AC
BUZ_DC
TRST
TMS
TDI
TDO
TCK
I2C
(PMBUS)
PMB_DATA
PMB_CLK
SLEEP RESET
6
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REFIN
AGND
V_IN
AIN7
LED_M ODE
PMOD_THR
I_IN
V33FB
COMM_B-
COMM_B+
COMM_A-
COMM_A+
48
47
46
45
44
43
42
41
40
39
38
37
48-PIN QFN PACKAGE
(TOP VIEW)
AIN5
1
36
AGND
T_SENSE
2
35
BPCAP
AIN3
3
34
V33A
AIN8
4
33
V33D
RESET
5
32
DGND
SLEEP
6
31
JTAG _TRSTN
30
JTAG _TMS
bq500210
24
BUZ_AC
BUZ_DC
MSP_MOSI/LPWR_EN
23
25
22
12
DRV_CFG
DPWM _A
DOUT_TX
MSP_TDO/PROG
21
26
20
11
PM B_CTRL
PMB _DATA
PMB_ALRT
JTAG _TCK
19
27
18
10
M SP_TCK/ CLK
PMB _CLK
17
JTAG _TDO
DOUT_4B
28
16
9
DOUT_4A
MSP_TEST
15
JTAG _TDI
DOUT_2B
29
14
8
M SP_SYNC
MSP_MISO/LED_B
13
7
DPMB_B
MSP_RST/LED_A
PIN FUNCTIONS
PIN
NO.
NAME
I/O
DESCRIPTION
1
AIN5
I
Connect this pin to GND
2
T_SENSE
I
Thermal Sensor Input
3
AIN3
I
Connect this pin to GND
4
AIN8
I
Connect this pin to GND
5
RESET
I
Device reset
6
SLEEP
O
Low-power mode start logic output
7
MSP_RST/LED_A
I
MSP – Reset, LED-A
8
MSP_MISO/LED_B
I
MSP – TMS, SPI-MISO, LED-B
9
MSP_TEST
I
MSP – Test
10
PMB_CLK
I/O
PMBus Clock
11
PMB_DATA
I/O
PMBus Data
12
DPWM_A
O
PWM Output A
13
DPMB_B
O
PWM Output B
14
MSP_SYNC
O
MSP SPI_SYNC
15
DOUT_2B
O
Optional Logic Output 2B. Leave this pin floating.
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PIN FUNCTIONS (continued)
PIN
NO.
8
NAME
I/O
DESCRIPTION
16
DOUT_4A
O
Optional Logic Output 4A. Leave this pin floating.
17
DOUT_4B
O
Optional Logic Output 4B. Leave this pin floating.
18
MSP_TCK/CLK
I/O
Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic.
19
PMB_ALERT
O
PMBus Interface
20
PMB_CTRL
I
PMBus Interface
21
DOUT_TX
I
Leave this pin floating
22
DRV_CFG
I
Pull this input to V33D
23
BUZ_AC
O
AC Buzzer Output
24
BUZ_DC
O
DC Buzzer Output
25
MSP_MOSI/LPWR_EN
I/O
MSP-TDI, SPI-MOSI, Low Power Enable
26
MSP_TDO/PROG
I/O
MSP-TDO, Programmed Indicator
27
JTAG_TCK
I/O
JTAG Interface
28
JTAG_TDO
I/O
JTAG Interface
29
JTAG_TDI
I/O
JTAG Interface
30
JATG_TMS
I/O
JTAG Interface
31
JTAG_TRSTN
I/O
JTAG Interface
32
DGND
—
Digital GND
33
V33D
—
Digital Core 3.3V Supply
34
V33A
—
Analog 3.3V Supply
35
BPCAP
—
Bypass Capacitor Connect Pin
36
AGND
—
Analog GND
37
COMM_A+
I
Digital demodulation noninverting input A
38
COMM_A-
I
Digital demodulation inverting input A
39
COMM_B+
I
Digital demodulation noninverting input B
40
COMM_B-
I
Digital demodulation inverting input B
41
V33FB
I
3.3V Linear-Regulator Feedback Input. Leave this pin floating.
42
I_IN
I
Transmitter Input Current
43
PMOD_THR
I
Input to Program Metal Object Detection Threshold
44
LED_MODE
I
Input to Select LED Mode
45
AIN7
I
Reserved Analog Input. Connect this pin to GND.
46
V_IN
I
Transmitter Input Voltage
47
AGND
—
48
REFIN
I
Analog GND
External Reference Voltage Input. Connect this Input to AGND.
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TYPICAL CHARACTERISTICS
SPACER
EFFICIENCY
vs
RECEIVER LOAD CURRENT
PMOD THRESHOLD
vs
OUTPUT POWER
80
1.4
RPMOD = 64.9 kW
1.2
75
RPMOD = 75 kW
RPMOD = 56.2 kW
Rectifier Loading - W
1
Efficiency - %
70
65
60
55
50
100
0.8
0.6
0.4
0.2
300
500
700
900
RL - Load Current - mA
1100
RPMOD = 48.7 kW
RPMOD = 0 kW
RPMOD = 42.2 kW
0
0
Figure 1.
1
2
3
4
PO - Output Power - W
5
6
Figure 2.
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FUNCTIONAL OVERVIEW
The typical Wireless Power Transfer System consists of primary and secondary coils that are positioned against
each other in a way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite shields as
part of their structures to even further maximize field coupling. The primary coil is excited with the switching
waveform of the transmitter power driver that gets its power from an AC-DC wall adapter. The secondary coil is
connected to the rectifier that can either directly interface the battery or can have an electronic charger or
post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the
system. The system being in resonance facilitates better energy transfer compared to inductive transfer. Power
transfer in the resonant system can also be easily controlled with the variable frequency control approach. To
limit operating frequency variation the bq500210 uses both frequency and PWM methods to control power
transfer. When the operating frequency approaches a 205kHz limit and the receiver still commands lower power,
the bq500210 will reduce the PWM cycle in discrete steps to maintain the output in regulation.
The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control
the modulation circuit to pass coded information from the secondary side to the primary side. The coded
information is organized into information packets that have Preamble bytes, Header bytes, message bytes and
Checksum bytes. Per the WPC specification, information packets can be related to Identification, Configuration,
Control Error, Rectified Power, Charge Status, and End of Power Transfer information. For detailed information
on
the
WPC
specification,
visit
the
Wireless
Power
Consortium
website
at
http://www.wirelesspowerconsortium.com/.
There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from
the secondary side to the primary side. With the resistive modulation approach shown in Figure 3, the
communication resistor periodically loads the rectifier output changing system Q factor, and as a result the value
of the voltage on the primary side coil. With the capacitive modulation approach shown in Figure 4, a pair of
communication capacitors are periodically connected to the receiver coil network. These extra capacitance
application changes slightly the resonance frequency of the system and its response on the current operating
frequency, which in turn leads to coil voltage variation on the primary side.
With both modulation techniques primary side coil waveform variations are detected with a Digital Demodulation
algorithm in the bq500210 to restore the content of the information packets and adjust controls to the transmitter.
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 3. Resistive Modulation Circuit
10
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Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 4. Capacitive Modulation Circuit
The bq500210 is a second generation wireless power dedicated transmitter controller that simplifies integration of
wireless power technology into consumer electronics, such as digital cameras, smart phones, MP3 players, and
global positioning systems, along with infrastructure applications such as furniture and cars.
The bq500210 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter
functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object
detection, over temperature protection of the transmitter top surface, and indication of the transmitter operating
states.
The bq500210 digital demodulation inputs receive scaled down voltages from the transmitter resonant
components. The digital demodulation algorithm is a combination of several digital signal processing techniques
that decodes information packets sent by the power receiving device and provides necessary changes to power
drive signals facilitating closed loop regulation. The controller analog inputs monitor input DC voltage, input
current, and the thermal protection input. These analog inputs support monitoring and protective functions of the
controller.
The bq500210 controls two LEDs to indicate transmitter operating and fault states. Having the LEDs connected
directly to the controller simplifies the transmitter electrical schematic and provides a cost effective solution.
Option Select Pins
Two pins (43, 44) in the bq500210 are allocated to program the PMOD mode and the LED mode of the device.
At power-up, a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured
in order to identify the value of the attached programming resistor. The values of the operating parameters set by
these pins are determined using Option Select Bins. For LED_MODE, the selected bin determines the LED
behavior based on LED Modes; for the PMOD_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Metal Object Detection (PMOD) section).
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V33
LED_MODE
PMOD_THR
bq500210
10 mA
IBIAS
Resistors
to set
options
To 12 -bit ADC
Figure 5. Option Programming
Table 1. Option Select Bins
BIN NUMBER
RESISTANCE
(kΩ)
LED OPTION
PMOD
THRESHOLD
(mW) (1)
0
GND
0
500
1
42.2
1
600
2
48.7
2
700
3
56.2
3
800
4
64.9
4
900
5
75.0
5
1000
6
86.6
6
1100
7
100
7
1200
8
115
8
1300
9
133
9
1400
10
154
10
1500
11
178
11
1600
12
205
12
1700
13
open
13
OFF
(1)
Threshold numbers are approximate. See Figure 2.
LED Modes
The bq500210 can directly control two LED outputs (pins 7 and 8). They are driven based on one of the
selectable modes. The resistor connected between pin 44 and GND selects one of the desired LED indication
schemes presented in Table 2.
12
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Table 2. LED Modes
LED
Control
Option
LED
Selection
Resistor
0
<36.5 kΩ
1
2
3
4
5
6
7
8
9
10
11
12
13
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
75 kΩ
86.6 kΩ
100 kΩ
115 kΩ
133 kΩ
154 kΩ
178 kΩ
205 kΩ
>237 kΩ
Operational States
Description
LED
Standby
Power
Transfer
Charge
Complete
Fault
PMOD
Warning
LED1, Green
–
–
–
–
–
LED2, Red
–
–
–
–
–
LED1, Green
OFF
BLINK SLOW
ON
OFF
OFF
LED2, Red
OFF
OFF
OFF
ON
BLINK FAST
LED1, Green
OFF
BLINK SLOW
ON
OFF
OFF
LED2, Red
OFF
OFF
OFF
OFF
BLINK FAST
LED1, Green
OFF
BLINK SLOW
ON
ON
OFF
LED2, Red
OFF
OFF
OFF
ON
BLINK FAST
LED1, Green
OFF
BLINK SLOW
ON
OFF
OFF
LED2, Red
OFF
OFF
OFF
ON
BLINK FAST
LED1, Green
OFF
BLINK SLOW
ON
OFF
OFF
LED2, Red
OFF
OFF
OFF
ON
BLINK FAST
LED1, Green
ON
BLINK SLOW
ON
OFF
OFF
LED2, Red
ON
OFF
OFF
ON
BLINK FAST
LED1, Green
ON
BLINK SLOW
ON
OFF
OFF
LED2, Red
ON
OFF
OFF
ON
BLINK FAST
LED1, Green
ON
BLINK SLOW
ON
OFF
OFF
LED2, Red
ON
OFF
OFF
ON
BLINK FAST
LED1, Green
ON
BLINK SLOW
ON
OFF
OFF
LED2, Red
ON
OFF
OFF
ON
BLINK FAST
LED1, Green
ON
BLINK SLOW
ON
OFF
OFF
LED2, Red
ON
OFF
OFF
ON
BLINK FAST
LED1, Green
–
–
–
–
–
LED2, Red
–
–
–
–
–
LED1, Green
–
–
–
–
–
LED2, Red
–
–
–
–
–
LED1, Green
–
–
–
–
–
LED2, Red
–
–
–
–
–
Reserved for test
Generic+ CS100 + CS90 + CS6min
Generic
Generic + CS100
Generic + CS100 + CS90
Generic+ CS100 + CS6min
Suggested
Suggested + CS100
Suggested + CS100 + CS90
Suggested+ CS100 + CS6min
Suggested+ CS100 + CS90 + CS6min
Reserved
Reserved
Reserved
Support
CS–100
Support
CS–90
Support
CS–6Min
–
–
–
YES
YES
YES
NO
NO
NO
YES
NO
NO
YES
YES
NO
YES
NO
YES
NO
NO
NO
YES
NO
NO
YES
YES
NO
YES
NO
YES
YES
NO
NO
–
–
–
–
–
–
–
–
–
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Thermal Protection
The bq500210 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the
most thermally challenged area, which usually is the center of the transmitting coil, and connected between the
dedicated pin 2 and GND. The threshold on pin 2 is set to 1.00V. The NTC resistor and the resistor from pin 2 to
VCC create a temperature sensitive divider. The user has full flexibility choosing the NTC resistor and the value of
the resistor from pin 2 to VCC to set the desired temperature when the system shuts down.
RTEMP_IN = 2.3 x RNTC(TMAX)
(1)
The system will attempt to restore normal operation after approximately five minutes of being in the suspended
mode due to tripping the over-temperature threshold, or if the receiver is removed. The bq500210 has a built-in
thermal sensor that prevents the die temperature from exceeding 135°C. This sensor has ~10°C hysteresis.
Audible Notification on Power Transfer Begin
The bq500210 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 24
outputs a high logic signal for 0.4s that is suitable to activate DC type buzzers with built in tone generators, or
other types of sound generators, or custom indication systems. Pin 23 outputs for 0.4 seconds a 4 kHz square
wave signal suitable for inexpensive AC type ceramic buzzers.
Power-On Reset
The bq500210 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup
sequence. At the end of the startup sequence, the device begins normal operation.
External Reset
The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up
resistor connected to 3.3V is recommended.
Parasitic Metal Object Detection (PMOD)
As a safety feature, the bq500210 can be configured to detect the presence of a parasitic metal object placed in
the vicinity of the magnetic field. The bq500100 uses the Rectified Power Packet information and the measured
transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected,
the device will blink the red LED to warn about this undesirable condition. If during a twenty second warning time
the parasitic metal object is not removed, the controller will disable power transfer. After being in halt for five
minutes, the bq500210 will attempt normal operation. If the object that caused excessive power dissipation is still
present, the sequence will be repeated over and over again. If the metal object is removed during this twenty
second warning time, then normal operation will be restored promptly.
To facilitate the parasitic loss function, the bq500210 monitors the input voltage and the input current supplied to
the power drive circuit.
The PMOD_THR pin is used to set the threshold at which the PMOD is activated. The highest bin, the pin is left
floating, disables the PMOD feature.
Note: The WPC Specification V1.0 does not define the requirements and thresholds for the PMOD feature.
Hence, metal object detection may perform differently with different products. Therefore, the threshold setting is
determined by the user. In most desktop wireless charger applications, a PMOD threshold setting of 0.8W has
shown to provide acceptable results in stopping power transfer and preventing small metal objects like coins,
pharmaceutical wraps, etc. from becoming dangerously hot when placed in the path of the wireless power
transfer. Figure 2 depicts PMOD performance measured on a bq500210 EVM with a bq51013 EVM. The
parasitic metal loss is emulated by loading the output of the rectifier in the bq51013 EVM.
ADVANCED CHARGE INDICATION SCHEMES
The WPC specification provides an End of Power Transfer message (EPT–01) to indicate charge complete.
Upon receipt of the charge complete message, the bq500210 will change the LED indication as defined by the
LED_MODE pin (normally solid green LED output), and halt power transfer for 5 minutes.
In some battery charging applications there is a benefit to continue the charging process in trickle charge mode
14
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bq500210
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to top off the battery. There are several information packets in the WPC specification related to the levels of
battery charge – Charge Status. The bq500210 uses these commands in association with some of the LED
modes described in Table 2 to enable the top-off charging pattern. When CS100 LED mode is enabled, the
bq500210 will change the LED indication to reflect charge complete when a Charge Status = 100% message is
received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The
mobile device can use a CS100 packet to enable trickle charge mode.
Note that all options related to CS100 have an effect on the LEDs only; they do not have any impact on actual
power transfer which continues uninterrupted.
Two more optional modes are available which can be used to change the LED mode back to indicate charging
after the CS100 has forced the charge complete output:
• If CS90 is enabled, a Charge Status message indicating less than 90% charge will force the LED output to
indicate charging (typically a slow blinking green LED).
• When CS6MIN is enabled, and if the bq500210 does not detect another CS100 packet for six minutes, it will
assume the receiver charge has dropped significantly and will turn on charging status indication.
APPLICATION INFORMATION
The application diagram for the transmitter with reduced standby power consumption is shown in Figure 6.
Power reduction is achieved by periodically disabling the bq500210 while LED and housekeeping control
functions are continued by U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500210 pin 25), the bq500210 at first power-up
boots the MSP430G2001 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500210 periodically issues SLEEP command, Q12 pulls the RST pin low, therefore reducing its
power consumption. Meanwhile, the MSP430G2001 maintains the LED indication and stores previous charge
state during this bq500210 reset period. This bq500210 reset period is set by the RC time constant network of
R25, C38 (from Figure 6). WPC compliance mandates the power transmitter controller, bq500210, awakes every
0.4s to produce an analog ping and check if a valid device is present. Altering this time constant, therefore, is not
advised.
Note: The user does not need to program the optional MSP430G2001. During first system boot, the bq500210
device will program the MSP430G2001 device automatically.
The standard application diagram for the transmitter is shown in Figure 7.
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bq500210
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C21
0.01uF
50V
VIN
R9
1K0
R33
1R
1
AGND
3
6
I_SENSE
U3
C26
0.1uF
50V
VIN
Buck Regulator
U5
DC Jack
19 Vin
J4
ENA is no-connect!
C6
10uF
50V
ENA
SS
C25
0.1uF
50V
AGND
C23
0.1uF
50V
+ 4
- 5
R32
Q3
BC847CL
6
C32
0.1uF
50V
C7
4.7uF
10V
C8
0.01uF
50V
AGND
AGND
AGND
AGND
R4
3K16
AGND
Q1
C29
AGND
0.22uF
50V
GND
Q2
CSD17313Q2
R34
0R
GND
C13
47nF
100V
C18
4.7nF
50V
TPS28225D
GND
C27
22uF
25V
CSD17313Q2
LGATE 5
GREEN
D2
LED-0603
C15
47nF
100V
COIL
UGATE 1
2
PWM
BOOT
7 EN/PG U6
PH 8
C9
0.1uF
50V
C16
0.1uF
50V
R13
190K
C37
2700pF
50V
VDD
4 GND
AGND
470R
R3
10R
3
DPWM-1A
R5
R37
76K8
AGND
C2
47uF
6.3V
R1
10K0
1R
AGND
VSEN
D1
MBR0540
R7
20m
2
PH
GND COMP
C28
0.01uF
50V
3V3_ADC
R21
22R
TPS54231
AGND
3V3_VCC
L1
330uH
VIN BOOT
INA199A2
C17
0.1uF
50V
R36
309K
VIN
3V3_VCC
Power Train
3V3_VCC
GND
GND
AGND
R6
200K
3V3_VCC
R14
23K2
R35
10R
R19
10K0
COMM+
D3
BAT54SW
NTC Temp Sensor
J6
3V3_VCC
C24
4.7nF
50V
C43
4.7uF
10V
C5
4.7uF
10V
C1
1.0uF
16V
C3
1.0uF
16V
R31
10R
COMM-
R25
280K
34
5
RESET
U1
4
3
2
1
AIN8
AIN3
T_SENSE
AIN5
BQ500210
I_SENSE
46
45
42
SLEEP
MSP_RST
MSP_MISO
MSP_TEST
6
7
8
9
MSP_CLK
18
21
22
MSP_TCK/CLK
DOUT_TX
DRV_CFG
37
38
39
40
COMM_A+
COMM_ACOMM_B+
COMM_B-
COMM+
47
COMM-
20
19
11
10
DPWM_A
DPWM_B
MSP_SYNC
DOUT_2B
DOUT_4A
DOUT_4B
12
13
14
15
16
17
26
25
24
23
44
43
LED_MODE
PMOD_THR
C11
4.7uF
C10
0.01uF
10V
R16
10K0
R12
10K0
50V
MSP_RST
MSP_MISO
R2
10R
MSP_TEST
DPWM-1A
R17
10K0
MSP_SYNC
U4
MSP_CLK
1
2
3
4
5
6
7
MSP_SYNC
MSP_MOSI
MSP_RDY
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
EPAD
AGND
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
PMB_CTRL
PMB_ALRT
PMB_DATA
PMB_CLK
3V3_VCC
TRST#
TMS
TDI
TDO
TCK
R24
10R
AGND
14
13
12
11
10
9
P1.7
8
VCC
P1.0
P1.1
P1.2
P1.3
GND
XIN
XOUT
TEST
RST
P1.4
P1.5
P1.6
C12
1.0uF
16V
MSP430G2001
MSP_RDY
MSP_MOSI
Low Power Supervisor
49
3V3_VCC
V_IN
AIN7
I_IN
AGND
R11
2K0
C4
4.7nF
50V
AGND
R10
15K4
35
31
30
29
28
27
DGND
VIN
32
AGND
36
R18
10K0
AGND
BPCAP
TRST
TMS
TDI
TDO
TCK
C20
1.0uF
16V
BUZ
33
V33FB
REFIN
V33A
41
48
V33D
AGND
C38
4.7uF
10V
SLEEP
AGND
AGND
AGND
AGND
Q12
BSS138
C14
33pF
50V
R30
10K
3V3_ADC
3V3_VCC
R22
100K
R23
42K2
R20
10K0
AGND
R28
470R
R27
470R
R15
NoPop
R8
10K0
AGND
D5
AGND
AGND
G
AGND
R
AGND
AGND AGND
AGND
Figure 6. Typical Application Diagram for Wireless Power Transmitter with Reduced Standby Power
16
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www.ti.com
C21
0.01uF
50V
VIN
VIN
Buck Regulator
U5
VIN
J4
ENA is no-connect!
DC Jack
19 Vin
C6
10uF
50V
C26
BOOT
ENA
0.1uF
50V
309K
D1
MBR0540
R37
76K8
AGNDAGND
C2C7
47uF
6.3V
R1
10K0
AGNDAGNDAGNDAGNDAGND
C32
0.1uF
50V
C8
0.01uF
50V
4.7uF
10V
C37
2700pF
50V
R5
6
3
AGND
4
-
5
C23
0.1uF
50V
R7
20m
2
R32
1R
78
R3
10R
PWM
BOOT
2
C15C27
47nF
100V
COIL
UGATE 1
VDD
Q1
50V
U6
EN/PGPH
C9
0.1uF
50V
C16
0.1uF
50V
R13
190K
GND
Q2
3V3_VCC
Power Train
GNDGND
R19
10K0
J6
R6
200K
3V3_ADC
3V3_VCC
C43
4.7uF
10V
C5
4.7uF
10V
C1
1.0uF
16V
C3
1.0uF
16V
GND
GND
NTC Temp Sensor
C24
4.7nF
50V
C13
47nF
100V
CSD17308Q3
R34
0R
3V3_VCC
C18
4.7nF
50V
TPS28225D
3V3_VCC
AGND
R14
23K2
R35
10R
COMM+
AGND
R11
2K0
C4
4.7nF
50V
5
RESET
U1
4
3
2
1
AD_8
AD_3
T_SENSE
AD_5
46
45
42
VIN
R10
15K4
V33D
C38
4.7uF
10V
V33FB
ADC_REF
I_SENSE
6
7
8
9
3V3_VCC
34
V33A
AGND
41
48
33
R25
280K
AGND
V_IN
AD_7
I_SENSE
SLEEP
MSP_RST
MSP_MISO
MSP_TEST
22uF
25V
CSD17308Q3
0.22uF
C29
45 GNDLGATE
GREEN
D2
LED-0603
AGND
+
AGND
470R
R4
3K16
INA199A2
Q3
BC847CL
DPWM-1A
C28
0.01uF
50V
3
U3
R36
PH
GND COMP
1
6
AGND
C17
0.1uF
50V
SSVSEN
C25
0.1uF
50V
R33
1R
I_SENSE
R21
22R
TPS54231
AGND
R9
1K0
3V3_VCC3V3_ADC
L1
330uH
VIN
3V3_VCC
AGND
BPCAP
TRST
TMS
TDI
TDO
TCK
35
31
30
29
28
27
PMB_CTRL
PMB_ALERT
PMB_DATA
PMB_CLK
20
19
11
10
DPWM_1A
DPWM_1B
MSP_SYNC
DOUT_2B
DOUT_4A
DOUT_4B
12
13
14
15
16
17
MSP_RDY
MSP_MOSI
BUZ_DC
BUZ_AC
26
25
24
23
LED_MODE
PMOD_THR
44
43
C20
1.0uF
16V
D3
BAT54SW
R31
10R
C14
33pF
50V
R30
10K
COMM-
AGND
AGND
AGND
R2
10R
DPWM-1A
R17
10K0
R28
EPAD
BUZ
R22
100K
R27
470R
AGND
49
DGND
AGND2
COMM_A+
COMM_ACOMM_B+
COMM_B-
47
MSP_CLK
DOUT_TX
BRD_MODE
37
38
39
40
36
COMM-
18
21
22
32
COMM+
AGND1
AGND
470R
R23
42K2
R20
10K0
AGND
D5
G
AGND AGND
AGND
AGND
R
AGND
AGND
Figure 7. Typical Application Diagram for Wireless Power Transmitter
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bq500210
SLUSAL8A – JUNE 2011 – REVISED AUGUST 2011
www.ti.com
REVISION HISTORY
Changes from Original (June 2011) to Revision A
Page
•
Changed APPLICATION INFORMATION description ........................................................................................................ 15
•
Changed Figure 6 ............................................................................................................................................................... 16
18
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ500210RGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
BQ500210RGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Oct-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500210RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
BQ500210RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Oct-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500210RGZR
VQFN
RGZ
48
2500
346.0
346.0
33.0
BQ500210RGZT
VQFN
RGZ
48
250
190.5
212.7
31.8
Pack Materials-Page 2
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specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
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