Datasheet DC Brush Motor Drivers (7V Max) BD621xxx Series General Description Key Specifications ■ ■ ■ ■ ■ ■ These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a power supply voltage range of 3.0V to 5.5V, with output currents of up to 2A. MOS transistors in the output stage allow PWM speed control. The integrated VREF voltage control function allows direct replacement of discontinued motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design. Packages Built-in one channel configuration VREF Voltage Setting Pin Enables PWM Duty Control Cross-Conduction Prevention Circuit Four Protection Circuits Provided: OCP, OVP, TSD and UVLO 7V(Max) 0.5A / 1.0A / 2.0A 1.0Ω / 1.0Ω / 0.5Ω 20kHz to 100kHz 0μA (Typ) -40°C to +85°C W(Typ) x D(Typ) x H(Max) 5.00mm x 6.20mm x 1.71mm 13.60mm x 7.80mm x 2.11mm 9.395mm x 10.540mm x 2.005mm SOP8 HSOP25 HRP7 Features Operating Supply Voltage: Maximum Output Current: Output ON-Resistance: PWM Input Frequency Range: Standby Current: Operating Temperature Range: Applications VTR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; OA equipments HRP7 (Pd=1.60W) SOP8 (Pd=0.69W) HSOP25 (Pd=1.45W) (Note ) Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Ordering Information B D 6 2 1 Part Number x x x x Package F FP HFP : SOP8 : HSOP25 : HRP7 - xx Packaging and forming specification E2: Embossed tape and reel (SOP8/HSOP25) TR: Embossed tape and reel (HRP7) Lineup Rating voltage (Max) Channels Maximum output current (Max) 0.5A 7V 1ch 1.0A 2.0A ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Package Orderable Part Number HRP7 Reel of 2000 BD6210HFP-TR SOP8 Reel of 2500 BD6210F-E2 HRP7 Reel of 2000 BD6211HFP-TR SOP8 Reel of 2500 BD6211F-E2 HRP7 Reel of 2000 BD6212HFP-TR HSOP25 Reel of 2000 BD6212FP-E2 ○This product has no designed protection against radioactive rays. 1/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Block Diagrams / Pin Configurations / Pin Descriptions BD6210F / BD6211F VREF DUTY 6 FIN 4 RIN 5 Table 1 BD6210F/BD6211F PROTECT 3 VCC 2 VCC CTRL 8 1 7 OUT1 OUT2 GND Figure 1. BD6210F / BD6211F Pin Name Function 1 OUT1 Driver output 2 VCC Power supply 3 VCC Power supply 4 FIN Control input (forward) 5 RIN Control input (reverse) 6 VREF Duty setting pin OUT1 GND 7 OUT2 Driver output VCC OUT2 8 GND Ground VCC VREF FIN (Note) Use all VCC pin by the same voltage. RIN Figure 2. SOP8 (TOP VIEW) Table 2 BD6210HFP/BD6211HFP/BD6212HFP BD6210HFP / BD6211HFP / BD6212HFP VREF DUTY 1 PROTECT 7 FIN VCC 3 CTRL RIN 5 4 FIN 2 6 GND OUT1 OUT2 GND Figure 3. BD6210HFP / BD6211HFP / BD6212HFP Pin Name 1 VREF Duty setting pin Function 2 OUT1 Driver output 3 FIN 4 GND Ground 5 RIN Control input (reverse) 6 OUT2 Driver output 7 VCC Power supply FIN GND Ground Control input (forward) VCC OUT2 RIN GND FIN OUT1 VREF Figure 4. HRP7 (TOP VIEW) BD6212FP Table 3 BD6212FP DUTY VREF 17 Pin Name VCC 1,2 OUT1 Driver output VCC 6 GND Small signal ground Power stage ground PROTECT 21 22 23 Function FIN 20 CTRL 7,8 RNF 12,13 OUT2 Driver output 17 VREF Duty setting pin 19 RIN Control input (reverse) 20 FIN Control input (forward) 21 VCC Power supply 22,23 VCC Power supply FIN GND Ground RIN 19 7 RNF 8 6 FIN 1 2 12 13 GND GND OUT1 OUT2 Figure 5. BD6212FP OUT1 OUT1 NC NC NC GND GND RNF RNF NC NC NC OUT2 OUT2 NC NC VCC VCC VCC FIN GND (Note) All pins not described above are NC pins. Note: Use all VCC pin by the same voltage. RIN NC VREF NC NC NC Figure 6. HSOP25 (TOP VIEW) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Absolute Maximum Ratings (Ta=25°C, All voltages are with respect to ground) Parameter Symbol Rating Unit Supply Voltage VCC 7 V Output Current IOMAX 0.5 (Note 1) / 1.0 (Note 2)/ 2.0 (Note 3) A All Other Input Pins VIN -0.3 to VCC V Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg Power Dissipation Pd Junction Temperature -55 to +150 0.68 (Note 4)/ Tjmax 1.6 (Note 5)/ °C 1.45 (Note 6) W 150 °C (Note 1) BD6210. Do not exceed Pd or ASO. (Note 2) BD6211. Do not exceed Pd or ASO. (Note 3) BD6212. Do not exceed Pd or ASO. (Note 4) SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/°C for Ta above 25°C. (Note 5) HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/°C for Ta above 25°C. (Note 6) HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/°C for Ta above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25°C) Parameter Symbol Rating Unit Supply Voltage VCC 3.0 to 5.5 V VREF Voltage VREF 1.5 to 5.5 V Electrical Characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=5V) Parameter Symbol Supply Current (1ch) ICC Limit Limit Conditions Min Typ Max 0.4 0.7 1.5 mA Forward / Reverse / Brake Stand-by Stand-by Current ISTBY - 0 10 µA Input High Voltage VIH 2.0 - - V Input Low Voltage VIL - - 0.8 V Input Bias Current IIH 30 50 100 µA VIN=5.0V Output ON-Resistance (Note 7) RON 0.5 1.0 1.5 Ω IOUT=0.25A, vertically total Output ON-Resistance (Note 8) RON 0.5 1.0 1.5 Ω IOUT=0.5A, vertically total Output ON-Resistance (Note 9) RON 0.2 0.5 1.0 Ω IOUT=1.0A, vertically total VREF Bias Current IVREF -10 0 +10 µA VREF=VCC Carrier Frequency fPWM 20 25 35 kHz VREF=3.75V Input Frequency Range fMAX 20 - 100 kHz FIN / RIN (Note 7) BD6210 (Note 8) BD6211 (Note 9) BD6212 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Typical Performance Curves (Reference Data) 1.5 1.0 CircuitCurrent Current: Icc[mA] [mA] Supply : ICC 0.8 Internal Logic: H/L [-] _ 85°C 25°C -40°C 0.6 0.4 1.0 -40°C 25°C 85°C 0.5 -40°C 25°C 85°C 0.0 0.2 -0.5 0.0 3 4 5 1 6 1.2 1.6 1.8 2 InputVoltage: Voltage :VIN VIN [V] [V] Input Supply Voltage CC [V] Supply Voltage:: V Vcc [V] Figure 8. Internal Logic vs Input Voltage (Input Threshold Voltage) Figure 7. Supply Current vs Supply Voltage (1ch) 10 100 85°C 25°C -40°C 80 Input Bias Current: IVREF [ µA] Input Bias Current : IVREF [µA] Input Bias Current: IIH [µA] _ Input Bias Current : IIH [µA] 1.4 60 40 20 -40°C 25°C 85°C 5 0 -5 -10 0 0 1 2 3 4 5 0 6 2 3 4 5 Input InputVoltage: Voltage VREF : VREF [V] [V] Input Voltage Voltage:: VIN Input VIN [V] Figure 9. Input Bias Current vs Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1 Figure 10. VREF Input Bias Current vs Input Voltage 4/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Typical Performance Curves (Reference Data) – continued 35 OscillationFrequency Frequency:: fFPWM [kHz] Oscillation PWM [kHz] Switching Duty: D [Ton/T] _ 1.0 0.8 0.6 0.4 -40°C 25°C 85°C 0.2 85°C 25°C -40°C 30 25 20 0.0 0 0.2 0.4 0.6 0.8 3 1 Input Voltage: Voltage :VREF VREF // V CC [V] Input VCC [V] 5 6 Supply Voltage: Voltage :VCC VCC [V] [V] Supply Figure 11. Switching Duty vs Input Voltage (VCC=5V) Figure 12. Oscillation Frequency vs Supply Voltage (VCC – Carrier Frequency) 6.0 9.0 85°C 25°C -40°C Internal [V][V]_ Internalsignal: SignalRelease : Release InternalSignal signal:: Release [V] _ Internal 4 4.0 2.0 -40°C 25°C 85°C 6.0 3.0 0.0 0.0 1.5 2 2.5 3 6 3.5 7 7.5 8 Supply VCC [V] SupplyVoltage Voltage:: VCC [V] Supply SupplyVoltage: Voltage VCC : VCC[V] [V] Figure 14. Internal Signal vs Supply Voltage (Over Voltage Protection) Figure 13. Internal Signal vs Supply Voltage (Under Voltage Lock Out) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6.5 5/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series 1.5 1.0 1.0 Internal Logic: H/L [-] 1.5 0.5 0.0 -0.5 -0.5 125 150 175 1.5 200 2 3 2.5 Junction Temperature: Temperature : Tj Tj [°C] [°C] Junction Current / Iomax: IOMAX : Normalized Load Current Normalized Figure 15. Internal Logic vs Junction Temperature (Thermal Shutdown) Figure 16. Internal Logic vs Load Current (Over-Current Protection, H side) 1.5 Internal Logic: H/L [-] 85°C 25°C -40°C 0.5 0.0 0.4 85°C 25°C -40°C OutputVoltage: Voltage V : VCC-VOUT CC-VOUT [V] Output [V] Internal Logic: H/L [-] Typical Performance Curves (Reference Data) – continued 1.0 0.5 0.0 85°C 25°C -40°C 0.3 0.2 0.1 0 -0.5 1 1.5 2 2.5 0 0.1 0.2 0.3 0.4 0.5 LoadCurrent Current//Iomax: IOMAX : Normalized Normalized Load Output Current: Current :IOUT IOUT [A] Output [A] Figure 17. Internal Logic vs Load Current (Over-Current Protection, L side) Figure 18. Output High Voltage vs Output Current (BD6210) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Typical Performance Curves (Reference Data) – continued 0.8 85°C 25°C -40°C Output [V] OutputVoltage: Voltage V: VCC-VOUT CC-VOUT [V] Output Voltage: V :CC-VOUT Output Voltage VCC-VOUT [V] [V] 0.8 0.6 0.4 0.2 85°C 25°C -40°C 0.6 0.4 0.2 0 0 0 0.2 0.4 0.6 0.8 0 1 0.4 Output IOUT [A] Output Current Current:: IOUT [A] 1.2 1.6 2 OutputCurrent: Current IOUT : IOUT [A] [A] Output Figure 19. Output High Voltage vs Output Current (BD6211) Figure 20. Output High Voltage vs Output Current (BD6212) 2 2 -40°C 25°C 85°C Output CC-VOUT [V] OutputVoltage:V Voltage : V CC-VOUT [V] Output [V] OutputVoltage:V Voltage : CC-VOUT VCC-VOUT [V] 0.8 1.5 1 0.5 0 -40°C 25°C 85°C 1.5 1 0.5 0 0 0.1 0.2 0.3 0.4 0.5 0 Current :IOUT IOUT [A] Output Current: [A] 0.4 0.6 0.8 1 Output Current IOUT [A] Current:: IOUT [A] Figure 21. Output Voltage vs Output Current (High Side Body Diode, BD6210) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.2 Figure 22. Output Voltage vs Output Current (High Side Body Diode, BD6211) 7/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Typical Performance Curves (Reference Data) – continued 0.4 -40°C 25°C 85°C Output [V] OutputVoltage: Voltage V : VOUT OUT [V] OutputVoltage Voltage:V CC-VOUT Output : VCC -VOUT [V] [V] 2 1.5 1 0.5 0 85°C 25°C -40°C 0.3 0.2 0.1 0 0 0.4 0.8 1.2 1.6 2 0 0.1 Output Current: IIOUT OUT [A] [A] 0.3 0.4 0.5 Output [A] Output Current: Current :IOUT IOUT [A] Figure 24. Output Low Voltage vs Output Current (BD6210) Figure 23. Output Voltage vs Output Current (High Side Body Diode, BD6212) 0.8 0.8 85°C 25°C -40°C 85°C 25°C -40°C Output [V][V] OutputVoltage Voltage:: V VOUT OUT Output VoltageV: OUT VOUT [V] [V] Output Voltage: 0.2 0.6 0.4 0.2 0 0.6 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1 0 0.4 0.8 1.2 1.6 2 Current :IOUT IOUT [A] Output Current: [A] Output Current: Current :IOUT IOUT [A] [A] Figure 25. Output Low Voltage vs Output Current (BD6211) Figure 26. Output Low Voltage vs Output Current (BD6212) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Typical Performance Curves (Reference Data) – continued 2 -40°C 25°C 85°C -40°C 25°C 85°C Output Voltage Voltage:: VOUT [V] Output VOUT [V] Output Voltage: Voltage : VOUT VOUT [V] [V] 2 1.5 1 0.5 1 0.5 0 0 0 0.1 0.2 0.3 0.4 0.5 0 0.2 0.4 0.6 0.8 OutputCurrent: Current IOUT : IOUT [A] Output [A] Output Current: Current :IOUT IOUT [A] Figure 27. Output Voltage vs Output Current (Low Side Body Diode, BD6210) Figure 28. Output Voltage vs Output Current (Low Side Body Diode, BD6211) 2 Output Voltage : VOUT[V][V] Output Voltage: VOUT 1.5 -40°C 25°C 85°C 1.5 1 0.5 0 0 0.4 0.8 1.2 1.6 2 OutputCurrent: Current IOUT : IOUT [A] Output Figure 29. Output Voltage vs Output Current (Low Side Body Diode, BD6212) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 1 Datasheet BD621xxx Series Application Information 1. Description of Functions (1) Operation Modes Table 4 Logic table Mode FIN RIN VREF OUT1 OUT2 Hi-Z (Note) Operation a L L X Hi-Z(Note) b H L VCC H L Forward (OUT1 > OUT2) c L H VCC L H Reverse (OUT1 < OUT2) d H H X L L Brake (stop) e PWM L VCC f L PWM VCC g H PWM VCC h PWM H VCC i H j L L H Option PWM __________ PWM __________ PWM Reverse (PWM control mode A) L Forward (PWM control mode B) PWM __________ H __________ PWM Forward (PWM control mode A) H __________ L Option H __________ Stand-by (idling) Reverse (PWM control mode B) PWM Forward (VREF control) H Reverse (VREF control) (Note)Hi-Z : all output transistors are off. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don’t care Mode (a) Stand-by Mode Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal circuits are turned OFF, including the output power transistors. Motor output goes to high impedance state. When the system is switched to stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the HIGH state for at least 50µs before shutting down all circuits. Mode (b) Forward Mode This operating mode is defined as the forward rotation of the motor when OUT1 pin is HIGH and OUT2 pin is LOW. When the motor is connected between OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. To operate in this mode, connect the VREF pin to the VCC pin. Mode (c) Reverse Mode This operating mode is defined as the reverse rotation of the motor when OUT1 pin is low and OUT2 pin is high. When the motor is connected between OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate in this mode, connect the VREF pin to the VCC pin. Mode (d) Brake Mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brake mode) to save power and reduce consumption. OFF OFF ON OFF OFF OFF M M ON OFF OFF (a) Stand-by Mode ON OFF M (b) Forward Mode ON (c) Reverse Mode OFF M OFF ON ON (d) Brake Mode Figure 30. Four Basic Operations (Output Stage) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Mode (e),(f) PWM Control Mode A The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input signal. The state of the output toggles between "L" and "Hi-Z". The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for PWM frequencies below 20kHz and above 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground. ON ON OFF OFF OFF M M OFF ON Control Input : H OFF Control Input : L Figure 31. PWM Control Mode A Operation (Output Stage) FIN RIN OUT1 OUT2 Figure 32. PWM Control Mode A Operation (Timing Chart) Mode (g),(h) PWM Control Mode B The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side output is switching, corresponding to the input signal. The state of the output toggles between "L" and "H". The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for PWM frequencies below 20kHz and above 100kHz. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground. ON OFF ON M OFF OFF M ON OFF Control Input : H OFF Control Input : L Figure 33. PWM Control Mode B Operation (Output Stage) FIN RIN OUT1 OUT2 Figure 34. PWM Control Mode B Operation (Timing Chart) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Mode (i),(j) VREF Control Mode The built-in VREF duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting function in previous models. The duty cycle is calculated by the following equation. DUTY ≈ VREF [V ] / VCC [V ] For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the duty cycle is about 75 percent. However, please note that the duty cycle might be limited by the range of the VREF pin voltage (Refer to the recommended operating conditions, shown on page 3). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as the PWM control modes. When operating in this mode, do not input a PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground. VCC VREF 0 FIN RIN OUT1 OUT2 Figure 35. VREF Control Operation (Timing Chart) (2) Cross-Conduction Protection Circuit In the full bridge output stage, when the upper and lower transistors are turned ON at the same time during high to low or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition. (3) Output Protection Circuits (a) Under Voltage Lock Out (UVLO) Circuit To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal), or below, the controller forces all driver outputs to high impedance state. When the voltage rises to 2.5V (nominal), or above, the UVLO circuit ends the lockout operation and returns the chip to its normal operation. (b) Over Voltage Protection (OVP) Circuit When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance state. The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. (c) Thermal Shutdown (TSD) Circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C nominal). At this time, the controller forces all driver outputs to high impedance state. Since thermal hysteresis is provided by the TSD circuit, the chip returns to its normal operation when the junction temperature falls below the preset temperature (150°C nominal). Thus, it is a self-resetting circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series (d) Over Current Protection (OCP) Circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance state during the off time (290µs, nominal). The IC returns to its normal operation after the time period has elapsed (self-returning type). Threshold IOUT Iout 0 CTRL Input Internal status ON OFF mon. ON off timer Monitor / Timer Figure 36. Over-Current Protection (Timing Chart) I/O Equivalent Circuits VCC FIN RIN VCC VCC OUT1 OUT2 OUT1 OUT2 GND RNF GND VCC 100k 10k VREF 100k Figure 37. FIN / RIN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 38. VREF Figure 39. OUT1 / OUT2 Figure 40. OUT1 / OUT2 (SOP8/HRP7) (HSOP25) 13/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 41. Example of monolithic IC structure 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 14. Power supply lines2 Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 15. Capacitor Between Output and Ground If a large capacitor is connected between the output pin and ground pin, current from the charged capacitor can flow into the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 10µF between output and ground. 16. Switching Noise When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins and cause IC malfunctions. In this case, insert a pull down resistor (10kΩ is recommended) between each control input pin and ground. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Marking Diagrams SOP8 (TOP VIEW) HSOP25 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK HRP7 (TOP VIEW) Part Number Marking LOT Number 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/20 Part Number Package Part Number Marking BD6210HFP HRP7 BD6210HFP BD6210F SOP8 6210 BD6211HFP HRP7 BD6211HFP BD6211F SOP8 6211 BD6212HFP HRP7 BD6212HFP BD6212FP HSOP25 BD6212FP TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Physical Dimension, Tape and Reel Information Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Physical Dimension, Tape and Reel Information - continued Package Name HSOP25 Max 13.95 (include. BURR) （UNIT：mm） PKG：HSOP25 Drawing: EX139-5001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Physical Dimension, Tape and Reel Information - continued Package Name www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 HRP7 19/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet BD621xxx Series Revision History Date Revision 14.Mar.2012 001 25.Dec.2012 002 09.Sep.2014 003 Changes New Release Improved the statement in all pages. Deleted “Status of this document” in page 11. Applied the ROHM Standard Style. Improved Operational Notes. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/20 TSZ02201-0P2P0B300070-1-2 09.Sep.2014 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD6210F - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD6210F SOP8 2500 2500 Taping inquiry Yes