NJSEMI BUZ71 Power field effect transistor Datasheet

, One,
TELEPHONE: (973) 376-2922
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
(212)227-6005
FAX: (973) 376-8960
BUZ71
BUZ71A
Power Field Effect Transistor
N-Channel Enhancement-Mode
Silicon Gate
TMOS POWER FETs
12 AMPERES
•DSIon) 0.12 OHMS
60 VOLTS
TO-220AB
MAXIMUM RATINGS
Rating
Symbol
BUZ71
VDSS
VDGR
Drain-Source Voltage
Drain-Gate Voltage (RQS - 20 Mil
VGS
ID
Gale-Source Voltaga
Drain Currant — Continuous
- Pulsed
'DM
PD
Total Power Dissipation @ TC - 25°C
Darata above 25°C
Oparating and Storage-Temperature Range
BUZ71A
Vdc
50
Vdc
±20
Vde
12
48
Adc
40
0.32
Watts
VWC
-55 to 150
TJ' Tstg
Unit
SO
°C
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case
>
— Junction loAmbienl
3.12
62.5
°C/W
R&JA
TL
275
«c
"we
Maximum Lead Temp, for Soldering Purpoaea,
1/8" from case for 5 seconds
ELECTRICAL CHARACTERISTICS <TC - 25°C unless otherwise noted)
LOFF CHARACTERISTICS
Charactariatle
Draln-Sourca Breakdown Voltaga (VQS - 0, ID » 1 mA)
Zero Gate Voltaga Drain Current
(VDS " so voitj, VQS - w
(VDS = so voits. vGS = o, TJ = i25-ci
Gala-Body Leakage Current, Forward (VQSF - 20 Vdc, VDS " 0)
Gala-Body leakage Current, Reverse (VQSR - 20 Vdc, VQS = 0)
Symbol
VIBRIDSS
IDSS
IGSSF
IGSSR
50
—
—
-
Typ
Max
—
_
—
Unit
Vdc
/lAdc
250
1000
10
100
nAdc
10
100
nAdc
NJ Semi-Conductors reserves the right to change test conditions, parameter limits and package dimensions without
notice. Information furnished by NJ Semi-Conductors is believed to be both accurate and reliable at the time of going
to press. However, NJ Semi-Conductors assumes no responsibility for any errors or omissions discovered in its use.
NJ Semi-Conductors encourages customers to verify that datasheets are current before placing orders.
Quality Semi-Conductors
Charaetarlctk
Symbol
Min
TVP
Max
Unit
VGS(th)
2.1
3.1
4
Vdc
-
0.08
0.10
0.10
0.12
-
0.48
0.60
-
3
5.5
—
mhos
—
650
pF
-
450
-
280
14
"
nC
ns
ON CHARACTERISTICS*
Gate Threshold Voltage
(VDS = VQS. ID - 10 mA>
Static Drain-Source On-Resistance
(VGS - 1° Vdc. ID = 6 Adc)
Drain-Source On-Voltage (VQS = 10 V)
«D - 6 Adc)
(ID - 6 Adc)
SFS
DYNAMIC CHARACTERISTICS
_
Input Capacitance
Cis,
(VDS • 25 v, VGS * o,
_
coss
f - 1 MHz)
Reverse Transfer Capacitance
Total Gate Charge
Vdc
VDS(on)
BUZ71
BUZ71A
Forward Transconductance
(VDS - 25V, ID = 6 A)
Output Capacitance
Ohm
'DSIonl
BUZ71
BUZ71A
Crs,
(VDS • 40 v. VGS = K> vdc,
ID = 12 A)
-
Qg
See Figures 6 and 12
SWITCHING CHARACTERISTICS*
Turn-On Delay Time
Rise Time
Turn-Off Daisy Time
(VDD - 30 V, ID = 3 A,
Rgun " 5° ohms)
Sea Figures 11 and 12
'd(on)
—
—
30
tr
_
-
85
-
90
-
110
—
—
2.2
Vdc
-
120
—
ns
—
110
—
ns
-
3.5
4.5
-
—
7.5
—
'd(off)
Fall Time
tf
-
VSD
ton
Irr
SOURCE DRAIN DIODE CHARACTERISTICS*
Forward On-Voltage
Forward Turn-On Time
«S - 24 A,
VQS - 0)
Havana Recovery Time
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the contact screw on tab to center of die)
(Measured from the drain lead 0.25" from package to cantar of die)
Ld
Internal Source Inductance
(Measured fram the source lead 0.25* from package to source bond pad)
L,
•Pul*t Test: Pulu Width < 300 til. Duty Cycle * 2%.
TO-220AB
NOTES:
1. DMENSIONMG «ND TOLERANCMG m ANSI
V14.SM, 1SE.
2. CONTBOU1HC DIMENSION: INCH.
1 miZDEFMSAZONEWHEKALLBODYAND
HAD BMGUUWmES ARE ALLOWED.
STYUS:
HNVGATE
2. DRAIN
1SOUFW
4. HUM
nH
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