Microchip dsPIC33FJ64GP306A 16-bit digital signal controllers (up to 256 kb flash and 30 kb sram) with advanced analog Datasheet

dsPIC33FJXXXGPX06A/X08A/X10A
16-bit Digital Signal Controllers (up to 256 KB Flash and
30 KB SRAM) with Advanced Analog
Operating Conditions
Timers/Output Compare/Input Capture
• 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
• 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
• Up to nine 16-bit timers/counters. Can pair up to
make four 32-bit timers.
• Eight Output Compare modules configurable as
timers/counters
• Eight Input Capture modules
Core: 16-bit dsPIC33F CPU
•
•
•
•
Code-efficient (C and Assembly) architecture
Two 40-bit wide accumulators
Single-cycle (MAC/MPY) with dual data fetch
Single-cycle mixed-sign MUL plus hardware
divide
Communication Interfaces
• Two UART modules (10 Mbps)
- With support for LIN 2.0 protocols and IrDA®
• Two 4-wire SPI modules (15 Mbps)
• Up to two I2C™ modules (up to 1 Mbaud) with
SMBus support
• Up to two Enhanced CAN (ECAN) modules
(1 Mbaud) with 2.0B support
• Data Converter Interface (DCI) module with I2S
codec support
Clock Management
•
•
•
•
•
±2% internal oscillator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timer (WDT)
Fast wake-up and start-up
Input/Output
Power Management
• Sink/Source up to 10 mA (pin specific) for standard VOH/VOL, up to 16 mA (pin specific) for
non-standard VOH1
• 5V-tolerant pins
• Selectable open drain, pull-ups, and pull-downs
• Up to 5 mA overvoltage clamp current
• External interrupts on all I/O pins
• Low-power management modes (Sleep, Idle,
Doze)
• Integrated Power-on Reset and Brown-out Reset
• 2.1 mA/MHz dynamic current (typical)
• 50 μA IPD current (typical)
Advanced Analog Features
• Two ADC modules:
- Configurable as 10-bit, 1.1 Msps with four
S&H or 12-bit, 500 ksps with one S&H
- 18 analog inputs on 64-pin devices and up to
32 analog inputs on 100-pin devices
• Flexible and independent ADC trigger sources
Qualification and Class B Support
• AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)
• AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)
• Class B Safety Library, IEC 60730
Debugger Development Support
•
•
•
•
In-circuit and in-application programming
Two program and two complex data breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Trace and run-time watch
Packages
Type
QFN
Pin Count
64
Contact Lead/Pitch
0.50
I/O Pins
53
Dimensions
9x9x0.9
Note: All dimensions are in millimeters (mm) unless specified.
 2009-2012 Microchip Technology Inc.
TQFP
TQFP
TQFP
64
0.50
53
10x10x1
80
0.50
69
12x12x1
100
0.40
85
14x14x1
DS70593D-page 1
dsPIC33FJXXXGPX06A/X08A/X10A
The device names, pin counts, memory sizes and
peripheral availability of each family are listed below,
followed by their pinout diagrams.
dsPIC33F PRODUCT FAMILIES
The dsPIC33F General Purpose Family of devices
are ideal for a wide variety of 16-bit MCU embedded
applications. The controllers with codec interfaces are
well-suited for speech and audio processing
applications.
Device
Pins
Program
Flash
Memory
(Kbyte)
RAM
(Kbyte)(1)
16-bit Timer
Input Capture
Output Compare
Std. PWM
Codec
Interface
ADC
UART
SPI
I2C™
Enhanced
CAN™
I/O Pins (Max)(2)
Packages
dsPIC33F General Purpose Family Controllers
dsPIC33FJ64GP206A
64
64
8
9
8
8
1
1 ADC, 18
ch
2
2
1
0
53
PT, MR
dsPIC33FJ64GP306A
64
64
16
9
8
8
1
1 ADC, 18
ch
2
2
2
0
53
PT, MR
dsPIC33FJ64GP310A
100
64
16
9
8
8
1
1 ADC, 32
ch
2
2
2
0
85
PF, PT
dsPIC33FJ64GP706A
64
64
16
9
8
8
1
2 ADC, 18
ch
2
2
2
2
53
PT, MR
dsPIC33FJ64GP708A
80
64
16
9
8
8
1
2 ADC, 24
ch
2
2
2
2
69
PT
dsPIC33FJ64GP710A
100
64
16
9
8
8
1
2 ADC, 32
ch
2
2
2
2
85
PF, PT
dsPIC33FJ128GP206A
64
128
8
9
8
8
1
1 ADC, 18
ch
2
2
1
0
53
PT, MR
dsPIC33FJ128GP306A
64
128
16
9
8
8
1
1 ADC, 18
ch
2
2
2
0
53
PT, MR
dsPIC33FJ128GP310A
100
128
16
9
8
8
1
1 ADC, 32
ch
2
2
2
0
85
PF, PT
dsPIC33FJ128GP706A
64
128
16
9
8
8
1
2 ADC, 18
ch
2
2
2
2
53
PT, MR
dsPIC33FJ128GP708A
80
128
16
9
8
8
1
2 ADC, 24
ch
2
2
2
2
69
PT
dsPIC33FJ128GP710A
100
128
16
9
8
8
1
2 ADC, 32
ch
2
2
2
2
85
PF, PT
dsPIC33FJ256GP506A
64
256
16
9
8
8
1
1 ADC, 18
ch
2
2
2
1
53
PT, MR
dsPIC33FJ256GP510A
100
256
16
9
8
8
1
1 ADC, 32
ch
2
2
2
1
85
PF, PT
dsPIC33FJ256GP710A
100
256
30
9
8
8
1
2 ADC, 32
ch
2
2
2
2
85
PF, PT
Note 1:
2:
RAM size is inclusive of 2 Kbytes DMA RAM.
Maximum I/O pin count includes pins shared by the peripheral functions.
DS70593D-page 2
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams
64-Pin QFN(1)
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
RF1
RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP206A
dsPIC33FJ128GP206A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected
to VSS externally.
 2009-2012 Microchip Technology Inc.
DS70593D-page 3
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin QFN(1)
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
RF1
RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP306A
dsPIC33FJ128GP306A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected
to VSS externally.
DS70593D-page 4
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin QFN(1)
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ256GP506A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected
to VSS externally.
 2009-2012 Microchip Technology Inc.
DS70593D-page 5
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin QFN(1)
CSDO/RG13
CSDI/RG12
CSCK/RG14
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP706A
dsPIC33FJ128GP706A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Note 1: The metal plane at the bottom of the device is not connected to any pins and should be connected
to VSS externally.
DS70593D-page 6
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin TQFP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
RF1
RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP206A
dsPIC33FJ128GP206A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
 2009-2012 Microchip Technology Inc.
DS70593D-page 7
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin TQFP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
RF1
RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP306A
dsPIC33FJ128GP306A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
DS70593D-page 8
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
64-Pin TQFP
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
RG0
RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ256GP506A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
 2009-2012 Microchip Technology Inc.
DS70593D-page 9
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
= Pins are up to 5V tolerant
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
CSDO/RG13
CSDI/RG12
CSCK/RG14
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC33FJ64GP706A
dsPIC33FJ128GP706A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/T4CK/CN1/RC13
OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/U1CTS/INT2/RD9
IC1/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
SCL1/RG2
SDA1/RG3
U1RTS/SCK1/INT0/RF6
U1RX/SDI1/RF2
U1TX/SDO1/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/SDA2/CN17/RF4
U2TX/SCL2/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COFS/RG15
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/IC8/CN7/RB5
AN4/IC7/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/VREF-/CN3/RB1
PGED3/AN0/VREF+/CN2/RB0
DS70593D-page 10
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
80-Pin TQFP
62
61
IC5/RD12
OC4/RD3
OC3/RD2
OC2/RD1
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
OC7/CN15/RD6
AN22/CN22/RA6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
CSCK/RG14
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
CSDO/RG13
CSDI/RG12
80
79
AN23/CN23/RA7
= Pins are up to 5V tolerant
1
60
PGEC2/SOSCO/T1CK/CN0/RC14
2
59
PGED2/SOSCI/CN1/RC13
OC1/RD0
AN18/T4CK/T9CK/RC3
3
4
58
57
IC4/RD11
AN19/T5CK/T8CK/RC4
5
56
IC3/RD10
SCK2/CN8/RG6
6
55
IC2/RD9
SDI2/CN9/RG7
7
54
IC1/RD8
53
SDA2/INT4/RA3
52
SCL2/INT3/RA2
SS2/CN11/RG9
8
9
10
51
VSS
VSS
11
50
VDD
12
49
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
TMS/AN20/INT1/RA12
13
48
TDO/AN21/INT2/RA13
14
47
VDD
SCL1/RG2
AN5/CN7/RB5
15
16
46
SDA1/RG3
AN4/CN6/RB4
45
SCK1/INT0/RF6
AN3/CN5/RB3
17
44
SDI1/RF7
AN2/SS1/CN4/RB2
18
43
SDO1/RF8
19
42
U1RX/RF2
20
41
U1TX/RF3
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
VREF-/RA9
AVDD
AVSS
U2CTS/AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
U2RTS/AN14/RB14
AN15/OCFB/CN12/RB15
IC7/U1CTS/CN20/RD14
IC8/U1RTS/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
PGED3/AN0/CN2/RB0
VREF+/RA10
PGEC3/AN1/CN3/RB1
dsPIC33FJ64GP708A
dsPIC33FJ128GP708A
22
MCLR
21
SDO2/CN10/RG8
PGEC1/AN6/OCFA/RB6
AN17/T3CK/T6CK/RC2
PGED1/AN7/RB7
COFS/RG15
AN16/T2CK/T7CK/RC1
 2009-2012 Microchip Technology Inc.
DS70593D-page 11
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
100-Pin TQFP
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
AN28/RE4
AN27/RE3
AN26/RE2
CSDO/RG13
CSDI/RG12
CSCK/RG14
AN25/RE1
AN24/RE0
AN23/CN23/RA7
AN22/CN22/RA6
RG0
RG1
RF1
RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
IC5/RD12
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
COFS/RG15
VDD
AN29/RE5
AN30/RE6
AN31/RE7
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
AN18/T4CK/T9CK/RC3
AN19/T5CK/T8CK/RC4
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
TMS/RA0
AN20/INT1/RA12
AN21/INT2/RA13
AN5/CN7/RB5
AN4/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/CN3/RB1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
VSS
73
72
PGED2/SOSCI/CN1/RC13
71
70
69
68
67
66
dsPIC33FJ64GP310A
dsPIC33FJ128GP310A
PGEC2/SOSCO/T1CK/CN0/RC14
OC1/RD0
IC4/RD11
IC3/RD10
IC2/RD9
IC1/RD8
INT4/RA15
INT3/RA14
65
64
63
VSS
62
61
VDD
60
59
58
57
56
55
54
53
52
51
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
TDO/RA5
TDI/RA4
SDA2/RA3
SCL2/RA2
SCL1/RG2
SDA1/RG3
SCK1/INT0/RF6
SDI1/RF7
SDO1/RF8
U1RX/RF2
U1TX/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
VREF-/RA9
VREF+/RA10
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
TCK/RA1
U2RTS/RF13
U2CTS/RF12
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
VSS
VDD
IC7/U1CTS/CN20/RD14
IC8/U1RTS/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PGED3/AN0/CN2/RB0
1
DS70593D-page 12
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
100-Pin TQFP
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
AN28/RE4
AN27/RE3
AN26/RE2
CSDO/RG13
CSDI/RG12
CSCK/RG14
AN25/RE1
AN24/RE0
AN23/CN23/RA7
AN22/CN22/RA6
RG0
RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
IC5/RD12
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
COFS/RG15
VDD
AN29/RE5
AN30/RE6
AN31/RE7
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
AN18/T4CK/T9CK/RC3
AN19/T5CK/T8CK/RC4
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
TMS/RA0
AN20/INT1/RA12
AN21/INT2/RA13
AN5/CN7/RB5
AN4/CN6/RB4
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/CN3/RB1
74
73
72
71
70
69
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
68
67
66
65
64
dsPIC33FJ256GP510A
63
62
61
60
59
58
57
56
55
54
53
52
51
VSS
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/CN1/RC13
OC1/RD0
IC4/RD11
IC3/RD10
IC2/RD9
IC1/RD8
INT4/RA15
INT3/RA14
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
TDO/RA5
TDI/RA4
SDA2/RA3
SCL2/RA2
SCL1/RG2
SDA1/RG3
SCK1/INT0/RF6
SDI1/RF7
SDO1/RF8
U1RX/RF2
U1TX/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
VREF-/RA9
VREF+/RA10
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
TCK/RA1
U2RTS/RF13
U2CTS/RF12
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
VSS
VDD
IC7/U1CTS/CN20/RD14
IC8/U1RTS/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PGED3/AN0/CN2/RB0
75
1
2
3
4
5
6
7
8
9
 2009-2012 Microchip Technology Inc.
DS70593D-page 13
dsPIC33FJXXXGPX06A/X08A/X10A
Pin Diagrams (Continued)
100-Pin TQFP
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
AN28/RE4
AN27/RE3
AN26/RE2
CSDO/RG13
CSDI/RG12
CSCK/RG14
AN25/RE1
AN24/RE0
AN23/CN23/RA7
AN22/CN22/RA6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VCAP
OC8/CN16/RD7
OC7/CN15/RD6
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
IC5/RD12
OC4/RD3
OC3/RD2
OC2/RD1
= Pins are up to 5V tolerant
COFS/RG15
VDD
AN29/RE5
AN30/RE6
AN31/RE7
AN16/T2CK/T7CK/RC1
AN17/T3CK/T6CK/RC2
AN18/T4CK/T9CK/RC3
AN19/T5CK/T8CK/RC4
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
TMS/RA0
AN20/INT1/RA12
AN21/INT2/RA13
AN5/CN7/RB5
AN4/CN6/RB4
75
VSS
2
3
4
5
6
7
8
9
10
11
12
74
73
PGEC2/SOSCO/T1CK/CN0/RC14
PGED2/SOSCI/CN1/RC13
72
OC1/RD0
71
IC4/RD11
IC3/RD10
IC2/RD9
13
14
15
16
17
18
19
20
21
22
23
24
25
70
69
68
67
66
dsPIC33FJ64GP710A
dsPIC33FJ128GP710A
dsPIC33FJ256GP710A
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
IC1/RD8
INT4/RA15
INT3/RA14
VSS
OSC2/CLKO/RC15
OSC1/CLKIN/RC12
VDD
TDO/RA5
TDI/RA4
SDA2/RA3
SCL2/RA2
SCL1/RG2
SDA1/RG3
SCK1/INT0/RF6
SDI1/RF7
SDO1/RF8
U1RX/RF2
U1TX/RF3
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
VREF-/RA9
VREF+/RA10
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
TCK/RA1
U2RTS/RF13
U2CTS/RF12
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
VSS
VDD
IC7/U1CTS/CN20/RD14
IC8/U1RTS/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
AN3/CN5/RB3
AN2/SS1/CN4/RB2
PGEC3/AN1/CN3/RB1
PGED3/AN0/CN2/RB0
1
DS70593D-page 14
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Table of Contents
dsPIC33F Product Families ................................................................................................................................................................... 2
1.0 Device Overview ........................................................................................................................................................................ 19
2.0 Guidelines for Getting Started with 16-Bit Digital Signal Controllers.......................................................................................... 23
3.0 CPU............................................................................................................................................................................................ 27
4.0 Memory Organization ................................................................................................................................................................. 39
5.0 Flash Program Memory.............................................................................................................................................................. 77
6.0 Reset ......................................................................................................................................................................................... 83
7.0 Interrupt Controller ..................................................................................................................................................................... 89
8.0 Direct Memory Access (DMA) .................................................................................................................................................. 135
9.0 Oscillator Configuration ............................................................................................................................................................ 145
10.0 Power-Saving Features............................................................................................................................................................ 155
11.0 I/O Ports ................................................................................................................................................................................... 163
12.0 Timer1 ...................................................................................................................................................................................... 167
13.0 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ............................................................................................................................ 169
14.0 Input Capture............................................................................................................................................................................ 175
15.0 Output Compare....................................................................................................................................................................... 177
16.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 181
17.0 Inter-Integrated Circuit™ (I2C™).............................................................................................................................................. 187
18.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 195
19.0 Enhanced CAN (ECAN™) Module........................................................................................................................................... 201
20.0 Data Converter Interface (DCI) Module.................................................................................................................................... 229
21.0 10-Bit/12-Bit Analog-to-Digital Converter (ADC) ...................................................................................................................... 237
22.0 Special Features ...................................................................................................................................................................... 251
23.0 Instruction Set Summary .......................................................................................................................................................... 259
24.0 Development Support............................................................................................................................................................... 267
25.0 Electrical Characteristics .......................................................................................................................................................... 271
26.0 High Temperature Electrical Characteristics ............................................................................................................................ 321
27.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 331
28.0 Packaging Information.............................................................................................................................................................. 335
Appendix A: Migrating from dsPIC33FJXXXGPX06/X08/X10 Devices to dsPIC33FJXXXGPX06A/X08A/X10A Devices ................ 347
Appendix B: Revision History............................................................................................................................................................. 348
Index ................................................................................................................................................................................................. 353
The Microchip Web Site ..................................................................................................................................................................... 357
Customer Change Notification Service .............................................................................................................................................. 357
Customer Support .............................................................................................................................................................................. 357
Reader Response .............................................................................................................................................................................. 358
Product Identification System ............................................................................................................................................................ 359
 2009-2012 Microchip Technology Inc.
DS70593D-page 15
dsPIC33FJXXXGPX06A/X08A/X10A
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of
silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
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DS70593D-page 16
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33F/PIC24H Family
Reference Manual”. These documents should be
considered as the general reference for the operation
of a particular module or device feature.
Note:
To access the documents listed below,
browse to the documentation section of
the dsPIC33FJ256GP710A product page
on
the
Microchip
web
site
(www.microchip.com) or select a family
reference manual section from the
following list.
In addition to parameters, features, and
other documentation, the resulting page
provides links to the related family
reference manual sections.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Section 1. “Introduction” (DS70197)
Section 2. “CPU” (DS70204)
Section 3. “Data Memory” (DS70202)
Section 4. “Program Memory” (DS70203)
Section 5. “Flash Programming” (DS70191)
Section 6. “Interrupts” (DS70184)
Section 7. “Oscillator” (DS70186)
Section 8. “Reset” (DS70192)
Section 9. “Watchdog Timer and Power-Saving Modes” (DS70196)
Section 10. “I/O Ports” (DS70193)
Section 11. “Timers” (DS70205)
Section 12. “Input Capture” (DS70198)
Section 13. “Output Compare” (DS70209)
Section 16. “Analog-to-Digital Converter (ADC)” (DS70183)
Section 17. “UART” (DS70188)
Section 18. “Serial Peripheral Interface (SPI)” (DS70206)
Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195)
Section 20. “Data Converter Interface (DCI)” (DS70288)
Section 21. “Enhanced Controller Area Network (ECAN™)” (DS70185)
Section 22. “Direct Memory Access (DMA)” (DS70182)
Section 23. “CodeGuard™ Security” (DS70199)
Section 24. “Programming and Diagnostics” (DS70207)
Section 25. “Device Configuration” (DS70194)
 2009-2012 Microchip Technology Inc.
DS70593D-page 17
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 18
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
1.0
Note:
DEVICE OVERVIEW
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
latest family reference sections of the
“dsPIC33F/PIC24H Family Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
This document contains device specific information for
the following devices:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
dsPIC33FJ64GP206A
dsPIC33FJ64GP306A
dsPIC33FJ64GP310A
dsPIC33FJ64GP706A
dsPIC33FJ64GP708A
dsPIC33FJ64GP710A
dsPIC33FJ128GP206A
dsPIC33FJ128GP306A
dsPIC33FJ128GP310A
dsPIC33FJ128GP706A
dsPIC33FJ128GP708A
dsPIC33FJ128GP710A
dsPIC33FJ256GP506A
dsPIC33FJ256GP510A
dsPIC33FJ256GP710A
The dsPIC33FJXXXGPX06A/X08A/X10A General
Purpose Family of device includes devices with a wide
range of pin counts (64, 80 and 100), different program
memory sizes (64 Kbytes, 128 Kbytes and 256 Kbytes)
and different RAM sizes (8 Kbytes, 16 Kbytes and
30 Kbytes).
 2009-2012 Microchip Technology Inc.
This feature makes the family suitable for a wide variety
of high-performance digital signal control applications.
The device is pin compatible with the PIC24H family of
devices, and also share a very high degree of
compatibility with the dsPIC30F family devices. This
allows for easy migration between device families as may
be necessitated by the specific functionality,
computational resource and system cost requirements of
the application.
The dsPIC33FJXXXGPX06A/X08A/X10A device family employs a powerful 16-bit architecture that seamlessly integrates the control features of a
Microcontroller (MCU) with the computational capabilities of a Digital Signal Processor (DSP). The resulting
functionality is ideal for applications that rely on
high-speed, repetitive computations, as well as control.
The DSP engine, dual 40-bit accumulators, hardware
support for division operations, barrel shifter, 17 x 17
multiplier, a large array of 16-bit working registers and
a wide variety of data addressing modes, together
provide
the
dsPIC33FJXXXGPX06A/X08A/X10A
Central Processing Unit (CPU) with extensive
mathematical processing capability. Flexible and
deterministic interrupt handling, coupled with a
powerful array of peripherals, renders the
dsPIC33FJXXXGPX06A/X08A/X10A devices suitable
for control applications. Further, Direct Memory Access
(DMA) enables overhead-free transfer of data between
several peripherals and a dedicated DMA RAM.
Reliable, field programmable Flash program memory
ensures scalability of applications that use
dsPIC33FJXXXGPX06A/X08A/X10A devices.
Figure 1-1 illustrates a general block diagram of the
various core and peripheral modules in the
dsPIC33FJXXXGPX06A/X08A/X10A family of devices.
Table 1-1 provides the functions of the various pins
illustrated in the pinout diagrams.
DS70593D-page 19
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 1-1:
dsPIC33FJXXXGPX06A/X08A/X10A GENERAL BLOCK DIAGRAM
PSV and Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
16
8
PORTA
16
16
16
Data Latch
Data Latch
X RAM
Y RAM
Address
Latch
Address
Latch
DMA
RAM
23
23
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
PORTB
DMA
23
16
16
Controller
16
PORTC
Address Generator Units
Address Latch
Program Memory
EA MUX
Data Latch
PORTD
ROM Latch
24
Instruction
Decode and
Control
Instruction Reg
Literal Data
16
16
PORTE
16
Control Signals
to Various Blocks
DSP Engine
OSC2/CLKO
OSC1/CLKI
Timing
Generation
FRC/LPRC
Oscillators
Precision
Band Gap
Reference
Voltage
Regulator
Power-up
Timer
Oscillator
Start-up Timer
Divide Support
Power-on
Reset
PORTF
16 x 16
W Register Array
16
Watchdog
Timer
Brown-out
Reset
PORTG
16-bit ALU
16
VCAP
Note:
VDD, VSS
MCLR
Timers
1-9
OC/
PWM1-8
DCI
ADC1,2
ECAN1,2
IC1-8
CN1-23
SPI1,2
I2C1,2
UART1,2
Not all pins or features are implemented on all device pinout configurations. See the “Pin Diagrams” section for the
specific pins and features present on each device.
DS70593D-page 20
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 1-1:
PINOUT I/O DESCRIPTIONS
Pin
Type
Buffer
Type
AN0-AN31
I
Analog
AVDD
P
P
Positive supply for analog modules. This pin must be connected at all times.
AVSS
P
P
Ground reference for analog modules.
CLKI
CLKO
I
O
CN0-CN23
I
ST
Input change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
COFS
CSCK
CSDI
CSDO
I/O
I/O
I
O
ST
ST
ST
—
Data Converter Interface frame synchronization pin.
Data Converter Interface serial clock input/output pin.
Data Converter Interface serial data input pin.
Data Converter Interface serial data output pin.
C1RX
C1TX
C2RX
C2TX
I
O
I
O
ST
—
ST
—
ECAN1 bus receive pin.
ECAN1 bus transmit pin.
ECAN2 bus receive pin.
ECAN2 bus transmit pin.
PGED1
PGEC1
PGED2
PGEC2
PGED3
PGEC3
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
Data I/O pin for programming/debugging communication channel 1.
Clock input pin for programming/debugging communication channel 1.
Data I/O pin for programming/debugging communication channel 2.
Clock input pin for programming/debugging communication channel 2.
Data I/O pin for programming/debugging communication channel 3.
Clock input pin for programming/debugging communication channel 3.
Pin Name
Description
Analog input channels.
ST/CMOS External clock source input. Always associated with OSC1 pin function.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes. Always associated
with OSC2 pin function.
IC1-IC8
I
ST
Capture inputs 1 through 8.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
MCLR
I/P
ST
Master Clear (Reset) input. This pin is an active-low Reset to the device.
OCFA
OCFB
OC1-OC8
I
I
O
ST
ST
—
Compare Fault A input (for Compare Channels 1, 2, 3 and 4).
Compare Fault B input (for Compare Channels 5, 6, 7 and 8).
Compare outputs 1 through 8.
OSC1
I
OSC2
I/O
RA0-RA7
RA9-RA10
RA12-RA15
I/O
I/O
I/O
ST
ST
ST
PORTA is a bidirectional I/O port.
RB0-RB15
I/O
ST
PORTB is a bidirectional I/O port.
RC1-RC4
RC12-RC15
I/O
I/O
ST
ST
PORTC is a bidirectional I/O port.
ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode;
CMOS otherwise.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
RD0-RD15
I/O
ST
PORTD is a bidirectional I/O port.
RE0-RE7
I/O
ST
PORTE is a bidirectional I/O port.
RF0-RF8
RF12-RF13
I/O
I/O
ST
ST
PORTF is a bidirectional I/O port.
Legend: CMOS = CMOS compatible input or output;
ST = Schmitt Trigger input with CMOS levels;
 2009-2012 Microchip Technology Inc.
Analog = Analog input;
O = Output;
P = Power
I = Input
DS70593D-page 21
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 1-1:
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
RG0-RG3
RG6-RG9
RG12-RG15
I/O
I/O
I/O
ST
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I/O
I/O
I
O
I/O
ST
ST
—
ST
ST
ST
—
ST
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for SPI2.
SPI2 data in.
SPI2 data out.
SPI2 slave synchronization or frame pulse I/O.
SCL1
SDA1
SCL2
SDA2
I/O
I/O
I/O
I/O
ST
ST
ST
ST
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Synchronous serial clock input/output for I2C2.
Synchronous serial data input/output for I2C2.
SOSCI
SOSCO
I
O
TMS
TCK
TDI
TDO
I
I
I
O
ST
ST
ST
—
JTAG Test mode select pin.
JTAG test clock input pin.
JTAG test data input pin.
JTAG test data output pin.
T1CK
T2CK
T3CK
T4CK
T5CK
T6CK
T7CK
T8CK
T9CK
I
I
I
I
I
I
I
I
I
ST
ST
ST
ST
ST
ST
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer3 external clock input.
Timer4 external clock input.
Timer5 external clock input.
Timer6 external clock input.
Timer7 external clock input.
Timer8 external clock input.
Timer9 external clock input.
U1CTS
U1RTS
U1RX
U1TX
U2CTS
U2RTS
U2RX
U2TX
I
O
I
O
I
O
I
O
ST
—
ST
—
ST
—
ST
—
UART1 clear to send.
UART1 ready to send.
UART1 receive.
UART1 transmit.
UART2 clear to send.
UART2 ready to send.
UART2 receive.
UART2 transmit.
VDD
P
—
Positive supply for peripheral logic and I/O pins.
VCAP
P
—
CPU logic flter capacitor connection.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog voltage reference (high) input.
VREF-
I
Analog
Analog voltage reference (low) input.
Pin Name
Description
ST/CMOS 32.768 kHz low-power oscillator crystal input; CMOS otherwise.
—
32.768 kHz low-power oscillator crystal output.
Legend: CMOS = CMOS compatible input or output;
ST = Schmitt Trigger input with CMOS levels;
DS70593D-page 22
Analog = Analog input;
O = Output;
P = Power
I = Input
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. It is not intended
to be a comprehensive reference source.
To complement the information in this
data sheet, refer to the “dsPIC33F/
PIC24H Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F/PIC24H Family Reference
Manual sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJXXXGPX06A/
X08A/X10A family of 16-bit Digital Signal Controllers
(DSCs) requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All VDD and VSS pins
(see Section 2.2 “Decoupling Capacitors”)
• All AVDD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
• VCAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (VCAP)”)
• MCLR pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Additionally, the following pins may be required:
• VREF+/VREF- pins used when external voltage
reference for ADC module is implemented
Note:
The AVDD and AVSS pins must be
connected independent of the ADC
voltage reference source.
 2009-2012 Microchip Technology Inc.
DS70593D-page 23
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 2-1:
RECOMMENDED
MINIMUM CONNECTION
0.1 µF
Ceramic
10 µF
Tantalum
R
R1
VSS
VDD
2.4
VCAP
VDD
• Device Reset
• Device programming and debugging
C
dsPIC33F
VSS
VDD
VSS
VDD
AVSS
VDD
AVDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
L1(1)
Note
1:
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between VDD and
AVDD to improve ADC noise rejection. The inductor
impedance should be less than 1 and the inductor
capacity greater than 10 mA.
Where:
F CNV
f = ------------2
1
f = ---------------------- 2 LC 
Master Clear (MCLR) Pin
The MCLR pin provides for two specific device
functions:
MCLR
0.1 µF
Ceramic
The placement of this capacitor should be close to the
VCAP. It is recommended that the trace length not
exceed one-quarter inch (6 mm). Refer to Section 22.2
“On-Chip Voltage Regulator” for details.
(i.e., ADC conversion rate/2)
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
EXAMPLE OF MCLR PIN
CONNECTIONS
VDD
2
1
L =  ----------------------
  2f C 
R(1)
R1(2)
2.2.1
TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that connects the power supply source to the device, and the
maximum current drawn by the device in the application. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
CPU Logic Filter Capacitor
Connection (VCAP)
JP
MCLR
dsPIC33F
C
Note 1:
R  10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin VIH and VIL specifications are met.
2:
R1  470 will limit any current flowing into
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
A low-ESR (< 5 Ohms) capacitor is required on the
VCAP pin, which is used to stabilize the voltage
regulator output voltage. The VCAP pin must not be
connected to VDD, and must have a capacitor between
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to Section 25.0
“Electrical
Characteristics”
for
additional
information.
DS70593D-page 24
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
2.5
ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the “dsPIC33F/
PIC24H Flash Programming Specification” (DS70152)
for information on capacitive loading limits and pin input
voltage high (VIH) and input low (VIL) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB® ICD 3 or MPLAB REAL ICE™.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “Using MPLAB® ICD 3 In-Circuit Debugger”
(poster) DS51765
• “MPLAB® ICD 3 Design Advisory” DS51764
• “MPLAB® REAL ICE™ In-Circuit Emulator User’s
Guide” DS51616
• “Using MPLAB® REAL ICE™” (poster) DS51749
 2009-2012 Microchip Technology Inc.
2.6
External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 9.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Main Oscillator
13
Guard Ring
14
15
Guard Trace
Secondary
Oscillator
16
17
18
19
20
DS70593D-page 25
dsPIC33FJXXXGPX06A/X08A/X10A
2.7
Oscillator Value Conditions on
Device Start-up
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to  8 MHz for start-up with PLL enabled to comply with
device PLL start-up conditions. This means that if the
external oscillator frequency is outside this range, the
application must start-up in the FRC mode first. The
default PLL settings after a POR with an oscillator
frequency outside this range will violate the device
operating speed.
Once the device powers up, the application firmware
can initialize the PLL SFRs, CLKDIV and PLLDBF to a
suitable value, and then perform a clock switch to the
Oscillator + PLL clock source. Note that clock switching
must be enabled in the device Configuration word.
2.8
Configuration of Analog and
Digital Pins During ICSP
Operations
If MPLAB ICD 3 or REAL ICE is selected as a debugger, it automatically initializes all of the A/D input pins
(ANx) as “digital” pins, by setting all bits in the ADPCFG
and ADPCFG2 registers.
The bits in the registers that correspond to the A/D pins
that are initialized by ICD 3 or REAL ICE, must not be
cleared by the user application firmware; otherwise,
communication errors will result between the debugger
and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
ADPCFG and ADPCFG2 registers during initialization
of the ADC module.
When ICD 3 or REAL ICE is used as a programmer, the
user application firmware must correctly configure the
ADPCFG and ADPCFG2 registers. Automatic
initialization of these registers is only done during
debugger operation. Failure to correctly configure the
register(s) will result in all A/D pins being recognized as
analog input pins, resulting in the port value being read
as a logic ‘0’, which may affect user application
functionality.
2.9
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic-low state.
Alternatively, connect a 1k to 10k resistor between VSS
and the unused pins.
DS70593D-page 26
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
3.0
CPU
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
2. “CPU” (DS70204) in the “dsPIC33F/
PIC24H Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The dsPIC33FJXXXGPX06A/X08A/X10A CPU module
has a 16-bit (data) modified Harvard architecture with an
enhanced instruction set, including significant support for
DSP. The CPU has a 24-bit instruction word with a variable
length opcode field. The Program Counter (PC) is 23 bits
wide and addresses up to 4M x 24 bits of user program
memory space. The actual amount of program memory
implemented varies by device. A single-cycle instruction
prefetch mechanism is used to help maintain throughput
and provides predictable execution. All instructions execute
in a single cycle, with the exception of instructions that
change the program flow, the double word move (MOV.D)
instruction and the table instructions. Overhead-free program loop constructs are supported using the DO and
REPEAT instructions, both of which are interruptible at any
point.
The dsPIC33FJXXXGPX06A/X08A/X10A devices have
sixteen, 16-bit working registers in the programmer’s
model. Each of the working registers can serve as a data,
address or address offset register. The 16th working register (W15) operates as a software Stack Pointer (SP) for
interrupts and calls.
The dsPIC33FJXXXGPX06A/X08A/X10A instruction set
has two classes of instructions: MCU and DSP. These two
instruction classes are seamlessly integrated into a single
CPU. The instruction set includes many addressing modes
and is designed for optimum C compiler efficiency. For most
instructions, the dsPIC33FJXXXGPX06A/X08A/X10A is
capable of executing a data (or program data) memory
read, a working register (data) read, a data memory write
and a program (instruction) memory read per instruction
cycle. As a result, three parameter instructions can be supported, allowing A + B = C operations to be executed in a
single cycle.
A block diagram of the CPU is shown in Figure 3-1. The
programmer’s model for the dsPIC33FJXXXGPX06A/
X08A/X10A is shown in Figure 3-2.
3.1
Data Addressing Overview
The data space can be addressed as 32K words or
64 Kbytes and is split into two blocks, referred to as X and
Y data memory. Each memory block has its own indepen 2009-2012 Microchip Technology Inc.
dent Address Generation Unit (AGU). The MCU class of
instructions operates solely through the X memory AGU,
which accesses the entire memory map as one linear data
space. Certain DSP instructions operate through the X and
Y AGUs to support dual operand reads, which splits the
data address space into two parts. The X and Y data space
boundary is device-specific.
Overhead-free circular buffers (Modulo Addressing mode)
are supported in both X and Y address spaces. The Modulo
Addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular
addressing can be used with any of the MCU class of
instructions. The X AGU also supports Bit-Reversed
Addressing to greatly simplify input or output data
reordering for radix-2 FFT algorithms.
The upper 32 Kbytes of the data space memory map can
optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space
Visibility Page (PSVPAG) register. The program to data
space mapping feature lets any instruction access program
space as if it were data space. The data space also includes
2 Kbytes of DMA RAM, which is primarily used for DMA
data transfers, but may be used as general purpose RAM.
3.2
DSP Engine Overview
The DSP engine features a high-speed, 17-bit by 17-bit
multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel
shifter is capable of shifting a 40-bit value, up to 16 bits
right or left, in a single cycle. The DSP instructions operate
seamlessly with all other instructions and have been
designed for optimal real-time performance. The MAC
instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers and accumulating and optionally
saturating the result in the same cycle. This instruction
functionality requires that the RAM memory data space be
split for these instructions and linear for all others. Data
space partitioning is achieved in a transparent and flexible
manner through dedicating certain working registers to
each address space.
3.3
Special MCU Features
The dsPIC33FJXXXGPX06A/X08A/X10A features a
17-bit by 17-bit, single-cycle multiplier that is shared by
both the MCU ALU and DSP engine. The multiplier can
perform signed, unsigned and mixed-sign multiplication.
Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit multiplication not only allows you to perform mixed-sign multiplication, it also achieves accurate results for special
operations, such as (-1.0) x (-1.0).
The dsPIC33FJXXXGPX06A/X08A/X10A supports 16/16
and 32/16 divide operations, both fractional and integer.
All divide instructions are iterative operations. They must
be executed within a REPEAT loop, resulting in a total execution time of 19 instruction cycles. The divide operation
can be interrupted during any of those 19 cycles without
loss of data.
A 40-bit barrel shifter is used to perform up to a 16-bit, left
or right shift in a single cycle. The barrel shifter can be used
by both MCU and DSP instructions.
DS70593D-page 27
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 3-1:
dsPIC33FJXXXGPX06A/X08A/X10A CPU CORE BLOCK DIAGRAM
PSV and Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
8
16
23
23
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
16
16
16
Data Latch
Data Latch
X RAM
Y RAM
Address
Latch
Address
Latch
23
16
DMA
RAM
16
DMA
Controller
Address Generator Units
Address Latch
16
Program Memory
EA MUX
Data Latch
ROM Latch
24
Control Signals
to Various Blocks
Instruction Reg
Literal Data
Instruction
Decode and
Control
16
16
16
DSP Engine
Divide Support
16 x 16
W Register Array
16
16-bit ALU
16
To Peripheral Modules
DS70593D-page 28
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 3-2:
dsPIC33FJXXXGPX06A/X08A/X10A PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
Stack Pointer Limit Register
SPLIM
AD39
DSP
Accumulators
AD15
AD31
AD0
AccA
AccB
PC22
PC0
Program Counter
0
0
7
TBLPAG
Data Table Page Address
7
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
 2009-2012 Microchip Technology Inc.
DC
IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS Register
SRL
DS70593D-page 29
dsPIC33FJXXXGPX06A/X08A/X10A
3.4
CPU Control Registers
CPU control registers include:
• SR: CPU Status Register
• CORCON: Core Control Register
REGISTER 3-1:
R-0
OA
SR: CPU STATUS REGISTER
R-0
R/C-0
R/C-0
R-0
R/C-0
R -0
R/W-0
OB
(1)
SB(1)
OAB
SAB
DA
DC
SA
bit 15
bit 8
R/W-0(2)
R/W-0(3)
R/W-0(3)
IPL<2:0>(2)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
RA
N
OV
Z
C
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
U = Unimplemented bit, read as ‘0’
S = Set only bit
W = Writable bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
OA: Accumulator A Overflow Status bit
1 = Accumulator A overflowed
0 = Accumulator A has not overflowed
bit 14
OB: Accumulator B Overflow Status bit
1 = Accumulator B overflowed
0 = Accumulator B has not overflowed
bit 13
SA: Accumulator A Saturation ‘Sticky’ Status bit(1)
1 = Accumulator A is saturated or has been saturated at some time
0 = Accumulator A is not saturated
bit 12
SB: Accumulator B Saturation ‘Sticky’ Status bit(1)
1 = Accumulator B is saturated or has been saturated at some time
0 = Accumulator B is not saturated
bit 11
OAB: OA || OB Combined Accumulator Overflow Status bit
1 = Accumulators A or B have overflowed
0 = Neither Accumulators A or B have overflowed
bit 10
SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit
1 = Accumulators A or B are saturated or have been saturated at some time in the past
0 = Neither Accumulator A or B are saturated
bit 9
DA: DO Loop Active bit
1 = DO loop in progress
0 = DO loop not in progress
Note:
Note 1:
2:
3:
This bit may be read or cleared (not set). Clearing this bit will clear SA and SB.
This bit may be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>).
DS70593D-page 30
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 3-1:
SR: CPU STATUS REGISTER
bit 8
DC: MCU ALU Half Carry/Borrow bit
1 = A carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data)
of the result occurred
0 = No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized
data) of the result occurred
bit 7-5
IPL<2:0>: CPU Interrupt Priority Level Status bits(2)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4
RA: REPEAT Loop Active bit
1 = REPEAT loop in progress
0 = REPEAT loop not in progress
bit 3
N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2
OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the magnitude which
causes the sign bit to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 1
Z: MCU ALU Zero bit
1 = An operation which affects the Z bit has set it at some time in the past
0 = The most recent operation which affects the Z bit has cleared it (i.e., a non-zero result)
bit 0
C: MCU ALU Carry/Borrow bit
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
2:
3:
This bit may be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>).
 2009-2012 Microchip Technology Inc.
DS70593D-page 31
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 3-2:
CORCON: CORE CONTROL REGISTER
U-0
—
bit 15
U-0
—
R/W-0
SATA
bit 7
R/W-0
SATB
bit 11
bit 10-8
R/W-0
US
R/W-0
EDT(1)
R-0
R-0
DL<2:0>
R-0
bit 8
Legend:
R = Readable bit
0’ = Bit is cleared
bit 15-13
bit 12
U-0
—
R/W-1
SATDW
R/W-0
ACCSAT
C = Clear only bit
W = Writable bit
‘x = Bit is unknown
R/C-0
IPL3(2)
R/W-0
PSV
R/W-0
RND
R/W-0
IF
bit 0
-n = Value at POR
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
Unimplemented: Read as ‘0’
US: DSP Multiply Unsigned/Signed Control bit
1 = DSP engine multiplies are unsigned
0 = DSP engine multiplies are signed
EDT: Early DO Loop Termination Control bit(1)
1 = Terminate executing DO loop at end of current loop iteration
0 = No effect
DL<2:0>: DO Loop Nesting Level Status bits
111 = 7 DO loops active
•
•
•
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1:
2:
001 = 1 DO loop active
000 = 0 DO loops active
SATA: AccA Saturation Enable bit
1 = Accumulator A saturation enabled
0 = Accumulator A saturation disabled
SATB: AccB Saturation Enable bit
1 = Accumulator B saturation enabled
0 = Accumulator B saturation disabled
SATDW: Data Space Write from DSP Engine Saturation Enable bit
1 = Data space write saturation enabled
0 = Data space write saturation disabled
ACCSAT: Accumulator Saturation Mode Select bit
1 = 9.31 saturation (super saturation)
0 = 1.31 saturation (normal saturation)
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
PSV: Program Space Visibility in Data Space Enable bit
1 = Program space visible in data space
0 = Program space not visible in data space
RND: Rounding Mode Select bit
1 = Biased (conventional) rounding enabled
0 = Unbiased (convergent) rounding enabled
IF: Integer or Fractional Multiplier Mode Select bit
1 = Integer mode enabled for DSP multiply ops
0 = Fractional mode enabled for DSP multiply ops
This bit will always read as ‘0’.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.
DS70593D-page 32
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
3.5
Arithmetic Logic Unit (ALU)
3.6
DSP Engine
The dsPIC33FJXXXGPX06A/X08A/X10A ALU is 16
bits wide and is capable of addition, subtraction, bit
shifts and logic operations. Unless otherwise
mentioned, arithmetic operations are 2’s complement
in nature. Depending on the operation, the ALU may
affect the values of the Carry (C), Zero (Z), Negative
(N), Overflow (OV) and Digit Carry (DC) Status bits in
the SR register. The C and DC Status bits operate as
Borrow and Digit Borrow bits, respectively, for
subtraction operations.
The DSP engine consists of a high-speed,
17-bit x 17-bit multiplier, a barrel shifter and a 40-bit
adder/subtracter (with two target accumulators, round
and saturation logic).
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
Data for the ALU operation can come from the W
register array, or data memory, depending on the
addressing mode of the instruction. Likewise, output
data from the ALU can be written to the W register array
or a data memory location.
The DSP engine also has the capability to perform
inherent accumulator-to-accumulator operations which
require no additional data. These instructions are ADD,
SUB and NEG.
Refer to the “16-bit MCU and DSC Programmer’s Reference Manual” (DS70157) for information on the SR
bits affected by each instruction.
The
dsPIC33FJXXXGPX06A/X08A/X10A
CPU
incorporates hardware support for both multiplication
and division. This includes a dedicated hardware
multiplier and support hardware for 16-bit-divisor
division.
3.5.1
MULTIPLIER
Using the high-speed 17-bit x 17-bit multiplier of the DSP
engine, the ALU supports unsigned, signed or mixed-sign
operation in several MCU multiplication modes:
•
•
•
•
•
•
•
16-bit x 16-bit signed
16-bit x 16-bit unsigned
16-bit signed x 5-bit (literal) unsigned
16-bit unsigned x 16-bit unsigned
16-bit unsigned x 5-bit (literal) unsigned
16-bit unsigned x 16-bit signed
8-bit unsigned x 8-bit unsigned
3.5.2
DIVIDER
The divide block supports 32-bit/16-bit and 16-bit/16-bit
signed and unsigned integer divide operations with the
following data sizes:
•
•
•
•
32-bit signed/16-bit signed divide
32-bit unsigned/16-bit unsigned divide
16-bit signed/16-bit signed divide
16-bit unsigned/16-bit unsigned divide
The dsPIC33FJXXXGPX06A/X08A/X10A is a single-cycle, instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction
flow is not possible. However, some MCU ALU and DSP
engine resources may be used concurrently by the same
instruction (e.g., ED, EDAC).
The DSP engine has various options selected through
various bits in the CPU Core Control register
(CORCON), as listed below:
•
•
•
•
•
•
Fractional or integer DSP multiply (IF)
Signed or unsigned DSP multiply (US)
Conventional or convergent rounding (RND)
Automatic saturation on/off for AccA (SATA)
Automatic saturation on/off for AccB (SATB)
Automatic saturation on/off for writes to data
memory (SATDW)
• Accumulator Saturation mode selection
(ACCSAT)
Table 3-1 provides a summary of DSP instructions. A
block diagram of the DSP engine is shown in
Figure 3-3.
TABLE 3-1:
Instruction
CLR
ED
EDAC
MAC
MAC
MOVSAC
MPY
MPY
MPY.N
MSC
DSP INSTRUCTIONS
SUMMARY
Algebraic
Operation
ACC Write
Back
A=0
A = (x – y)2
A = A + (x – y)2
A = A + (x • y)
A = A + x2
No change in A
A=x• y
A = x2
A=–x•y
A=A–x•y
Yes
No
No
Yes
No
Yes
No
No
No
Yes
The quotient for all divide instructions ends up in W0
and the remainder in W1. 16-bit signed and unsigned
DIV instructions can specify any W register for both the
16-bit divisor (Wn) and any W register (aligned) pair
(W(m + 1):Wm) for the 32-bit dividend. The divide
algorithm takes one cycle per bit of divisor, so both
32-bit/16-bit and 16-bit/16-bit instructions take the
same number of cycles to execute.
 2009-2012 Microchip Technology Inc.
DS70593D-page 33
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 3-3:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
Zero Backfill
16
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
DS70593D-page 34
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
3.6.1
MULTIPLIER
The 17-bit x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17-bit x 17-bit
multiplier/scaler is a 33-bit value which is
sign-extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the Most Significant bit (MSb) is defined as a
sign bit. Generally speaking, the range of an N-bit two’s
complement integer is -2N-1 to 2N-1 - 1. For a 16-bit
integer, the data range is -32768 (0x8000) to 32767
(0x7FFF) including 0. For a 32-bit integer, the data
range
is
-2,147,483,648
(0x8000 0000)
to
2,147,483,647 (0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a two’s
complement fraction, where the MSb is defined as a
sign bit and the radix point is implied to lie just after the
sign bit (QX format). The range of an N-bit two’s
complement fraction with this implied radix point is -1.0
to (1 - 21-N). For a 16-bit fraction, the Q15 data range is
-1.0 (0x8000) to 0.999969482 (0x7FFF) including 0
and has a precision of 3.01518x10-5. In Fractional
mode, the 16 x 16 multiply operation generates a 1.31
product which has a precision of 4.65661 x 10-10.
The same multiplier is used to support the MCU
multiply instructions which include integer 16-bit
signed, unsigned and mixed sign multiplies.
The MUL instruction may be directed to use byte or
word sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
3.6.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit adder/
subtracter with automatic sign extension logic. It can
select one of two accumulators (A or B) as its
pre-accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or loaded can be optionally scaled
via the barrel shifter prior to accumulation.
 2009-2012 Microchip Technology Inc.
3.6.2.1
Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side, and either true, or complement
data into the other input. In the case of addition, the
Carry/Borrow input is active-high and the other input is
true data (not complemented), whereas in the case of
subtraction, the Carry/Borrow input is active-low and
the other input is complemented. The adder/subtracter
generates Overflow Status bits, SA/SB and OA/OB,
which are latched and reflected in the STATUS
register:
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described above and the SAT<A:B> (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow; they are:
• OA: AccA overflowed into guard bits
• OB: AccB overflowed into guard bits
• SA: AccA saturated (bit 31 overflow and saturation)
or
AccA overflowed into guard bits and saturated (bit
39 overflow and saturation)
• SB: AccB saturated (bit 31 overflow and saturation)
or
AccB overflowed into guard bits and saturated (bit
39 overflow and saturation)
• OAB: Logical OR of OA and OB
• SAB: Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the
corresponding Overflow Trap Flag Enable bits (OVATE,
OVBTE) in the INTCON1 register (refer to Section 7.0
“Interrupt Controller”) are set. This allows the user to
take immediate action, for example, to correct system
gain.
DS70593D-page 35
dsPIC33FJXXXGPX06A/X08A/X10A
The SA and SB bits are modified each time data
passes through the adder/subtracter, but can only be
cleared by the user. When set, they indicate that the
accumulator has overflowed its maximum range (bit 31
for 32-bit saturation or bit 39 for 40-bit saturation) and
will be saturated (if saturation is enabled). When
saturation is not enabled, SA and SB default to bit 39
overflow and, thus, indicate that a catastrophic
overflow has occurred. If the COVTE bit in the
INTCON1 register is set, SA and SB bits will generate
an arithmetic warning trap when saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS Register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
The device supports three Saturation and Overflow
modes:
• Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF), or maximally negative 9.31
value (0x8000000000), into the target accumulator.
The SA or SB bit is set and remains set until
cleared by the user. This is referred to as ‘super
saturation’ and provides protection against erroneous data or unexpected algorithm problems (e.g.,
gain calculations).
• Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive
1.31 value (0x007FFFFFFF), or maximally negative 1.31 value (0x0080000000), into the target
accumulator. The SA or SB bit is set and remains
set until cleared by the user. When this Saturation
mode is in effect, the guard bits are not used (so
the OA, OB or OAB bits are never set).
• Bit 39 Catastrophic Overflow:
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remains set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying its sign). If the COVTE bit in
the INTCON1 register is set, a catastrophic overflow can initiate a trap exception.
DS70593D-page 36
3.6.2.2
Accumulator ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
• W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a
1.15 fraction.
• [W13]+ = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target
accumulator are written into the address pointed
to by W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
3.6.2.3
Round Logic
The round logic is a combinational block which
performs a conventional (biased) or convergent
(unbiased) round function during an accumulator write
(store). The Round mode is determined by the state of
the RND bit in the CORCON register. It generates a
16-bit, 1.15 data value which is passed to the data
space write saturation logic. If rounding is not indicated
by the instruction, a truncated 1.15 data value is stored
and the least significant word is simply discarded.
Conventional rounding zero-extends bit 15 of the
accumulator and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word
(bits 0 through 15 of the accumulator) is between
0x8000 and 0xFFFF (0x8000 included), ACCxH is
incremented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this
algorithm is that over a succession of random rounding
operations, the value tends to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. In this case, the Least
Significant bit (bit 16 of the accumulator) of ACCxH is
examined. If it is ‘1’, ACCxH is incremented. If it is ‘0’,
ACCxH is not modified. Assuming that bit 16 is
effectively random in nature, this scheme removes any
rounding bias that may accumulate.
The SAC and SAC.R instructions store either a
truncated (SAC), or rounded (SAC.R) version of the
contents of the target accumulator to data memory via
the X bus, subject to data saturation (see
Section 3.6.2.4 “Data Space Write Saturation”). For
the MAC class of instructions, the accumulator
write-back operation will function in the same manner,
addressing combined MCU (X and Y) data space
though the X bus. For this class of instructions, the data
is always subject to rounding.
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
3.6.2.4
Data Space Write Saturation
3.6.3
BARREL SHIFTER
In addition to adder/subtracter saturation, writes to data
space can also be saturated but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15
fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These inputs
are combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly, For input data greater than
0x007FFF, data written to memory is forced to the
maximum positive 1.15 value, 0x7FFF. For input data
less than 0xFF8000, data written to memory is forced
to the maximum negative 1.15 value, 0x8000. The
Most Significant bit of the source (bit 39) is used to
determine the sign of the operand being tested.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between bit positions 16
to 31 for right shifts, and between bit positions 0 to 16
for left shifts.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value shifts the operand right.
A negative value shifts the operand left. A value of ‘0’
does not modify the operand.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
 2009-2012 Microchip Technology Inc.
DS70593D-page 37
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 38
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.0
MEMORY ORGANIZATION
4.1
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 3.
“Data Memory” (DS70202) and Section
4. “Program Memory” (DS70203) in the
“dsPIC33F/PIC24H Family Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
Note:
The dsPIC33FJXXXGPX06A/X08A/X10A architecture
features separate program and data memory spaces
and buses. This architecture also allows the direct
access of program memory from the data space during
code execution.
FIGURE 4-1:
The program address memory space of the
dsPIC33FJXXXGPX06A/X08A/X10A devices is 4M
instructions. The space is addressable by a 24-bit
value derived from either the 23-bit Program Counter
(PC) during program execution, or from table operation
or data space remapping as described in Section 4.6
“Interfacing Program and Data Memory Spaces”.
User access to the program memory space is restricted
to the lower half of the address range (0x000000 to
0x7FFFFF). The exception is the use of TBLRD/TBLWT
operations, which use TBLPAG<7> to permit access to
the Configuration bits and Device ID sections of the
configuration memory space. Memory usage for the
dsPIC33FJXXXGPX06A/X08A/X10A of devices is
shown in Figure 4-1.
PROGRAM MEMORY FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES
dsPIC33FJ64GPXXXA
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
User Memory Space
Program Address Space
User Program
Flash Memory
(22K instructions)
dsPIC33FJ128GPXXXA
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
dsPIC33FJ256GPXXXA
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
User Program
Flash Memory
(44K instructions)
User Program
Flash Memory
(88K instructions)
0x000000
0x000002
0x000004
0x0000FE
0x000100
0x000104
0x0001FE
0x000200
0x00ABFE
0x00AC00
0x0157FE
0x015800
Unimplemented
(Read ‘0’s)
Unimplemented
0x02ABFE
0x02AC00
(Read ‘0’s)
Unimplemented
(Read ‘0’s)
Configuration Memory Space
0x7FFFFE
0x800000
Note:
Reserved
Reserved
Reserved
Device Configuration
Registers
Device Configuration
Registers
Device Configuration
Registers
Reserved
Reserved
Reserved
DEVID (2)
DEVID (2)
DEVID (2)
0xF7FFFE
0xF80000
0xF80017
0xF80010
0xFEFFFE
0xFF0000
0xFFFFFE
Memory areas are not shown to scale.
 2009-2012 Microchip Technology Inc.
DS70593D-page 39
dsPIC33FJXXXGPX06A/X08A/X10A
4.1.1
PROGRAM MEMORY
ORGANIZATION
4.1.2
All
dsPIC33FJXXXGPX06A/X08A/X10A
devices
reserve the addresses between 0x00000 and
0x000200 for hard-coded program execution vectors.
A hardware Reset vector is provided to redirect code
execution from the default value of the PC on device
Reset to the actual start of code. A GOTO instruction is
programmed by the user at 0x000000, with the actual
address for the start of code at 0x000002.
The program memory space is organized in
word-addressable blocks. Although it is treated as
24 bits wide, it is more appropriate to think of each
address of the program memory as a lower and upper
word, with the upper byte of the upper word being
unimplemented. The lower word always has an even
address, while the upper word has an odd address
(Figure 4-2).
dsPIC33FJXXXGPX06A/X08A/X10A devices also
have two interrupt vector tables, located from
0x000004 to 0x0000FF and 0x000100 to 0x0001FF.
These vector tables allow each of the many device
interrupt sources to be handled by separate Interrupt
Service Routines (ISRs). A more detailed discussion of
the interrupt vector tables is provided in Section 7.1
“Interrupt Vector Table”.
Program memory addresses are always word-aligned
on the lower word, and addresses are incremented or
decremented by two during code execution. This
arrangement also provides compatibility with data
memory space addressing and makes it possible to
access data in the program memory space.
FIGURE 4-2:
msw
Address
PROGRAM MEMORY ORGANIZATION
16
8
PC Address
(lsw Address)
0
0x000000
0x000002
0x000004
0x000006
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
DS70593D-page 40
least significant word
most significant word
23
0x000001
0x000003
0x000005
0x000007
INTERRUPT AND TRAP VECTORS
Instruction Width
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.2
Data Address Space
The dsPIC33FJXXXGPX06A/X08A/X10A CPU has a
separate 16-bit wide data memory space. The data
space is accessed using separate Address Generation
Units (AGUs) for read and write operations. Data
memory maps of devices with different RAM sizes are
shown in Figure 4-3 through Figure 4-5.
All Effective Addresses (EAs) in the data memory space
are 16 bits wide and point to bytes within the data space.
This arrangement gives a data space address range of
64 Kbytes or 32K words. The lower half of the data
memory space (that is, when EA<15> = 0) is used for
implemented memory addresses, while the upper half
(EA<15> = 1) is reserved for the Program Space
Visibility area (see Section 4.6.3 “Reading Data from
Program Memory Using Program Space Visibility”).
dsPIC33FJXXXGPX06A/X08A/X10A devices implement a total of up to 30 Kbytes of data memory. Should
an EA point to a location outside of this area, an all-zero
word or byte will be returned.
4.2.1
DATA SPACE WIDTH
The data memory space is organized in byte
addressable, 16-bit wide blocks. Data is aligned in data
memory and registers as 16-bit words, but all data
space EAs resolve to bytes. The Least Significant
Bytes (LSBs) of each word have even addresses, while
the Most Significant Bytes (MSBs) have odd
addresses.
4.2.2
DATA MEMORY ORGANIZATION
AND ALIGNMENT
To maintain backward compatibility with PIC® MCU
devices and improve data space memory usage
efficiency, the dsPIC33FJXXXGPX06A/X08A/X10A
instruction set supports both word and byte operations.
As a consequence of byte accessibility, all effective
address calculations are internally scaled to step
through word-aligned memory. For example, the core
recognizes that Post-Modified Register Indirect
Addressing mode [Ws++] will result in a value of Ws + 1
for byte operations and Ws + 2 for word operations.
Data byte reads will read the complete word that
contains the byte, using the LSb of any EA to determine
which byte to select. The selected byte is placed onto
the LSb of the data path. That is, data memory and
registers are organized as two parallel byte-wide
entities with shared (word) address decode but
separate write lines. Data byte writes only write to the
corresponding side of the array or register which
matches the byte address.
 2009-2012 Microchip Technology Inc.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. If a
misaligned read or write is attempted, an address error
trap is generated. If the error occurred on a read, the
instruction underway is completed; if it occurred on a
write, the instruction will be executed but the write does
not occur. In either case, a trap is then executed,
allowing the system and/or user to examine the
machine state prior to execution of the address Fault.
All byte loads into any W register are loaded into the
Least Significant Byte. The Most Significant Byte is not
modified.
A sign-extend instruction (SE) is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSb of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
4.2.3
SFR SPACE
The first 2 Kbytes of the Near Data Space, from 0x0000
to 0x07FF, is primarily occupied by Special Function
Registers (SFRs). These are used by the
dsPIC33FJXXXGPX06A/X08A/X10A core and peripheral modules for controlling the operation of the device.
SFRs are distributed among the modules that they
control, and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’. A complete listing of implemented
SFRs, including their addresses, is shown in Table 4-1
through Table 4-34.
Note:
4.2.4
The actual set of peripheral features and
interrupts varies by the device. Please
refer to the corresponding device tables
and pinout diagrams for device-specific
information.
NEAR DATA SPACE
The 8-Kbyte area between 0x0000 and 0x1FFF is
referred to as the Near Data Space. Locations in this
space are directly addressable via a 13-bit absolute
address field within all memory direct instructions.
Additionally, the whole data space is addressable using
MOV instructions, which support Memory Direct
Addressing mode with a 16-bit address field, or by
using Indirect Addressing mode using a working
register as an Address Pointer.
DS70593D-page 41
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 4-3:
DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH 8
KBS RAM
MSB
Address
MSB
2 Kbyte
SFR Space
LSB
Address
16 bits
LSB
0x0000
0x0001
SFR Space
0x07FE
0x0800
0x07FF
0x0801
8 Kbyte
Near
Data
Space
X Data RAM (X)
8 Kbyte
SRAM Space
0x17FF
0x1801
0x1FFF
0x2001
0x27FF
0x2801
0x17FE
0x1800
Y Data RAM (Y)
0x1FFE
0x2000
DMA RAM
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70593D-page 42
0x27FE
0x2800
0xFFFE
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 4-4:
DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH
16 KBS RAM
MSB
Address
16 bits
MSB
2 Kbyte
SFR Space
LSB
0x0000
0x0001
SFR Space
0x07FF
0x0801
0x1FFF
16 Kbyte
SRAM Space
LSB
Address
X Data RAM (X)
0x27FF
0x2801
0x3FFF
0x4001
0x47FF
0x4801
0x07FE
0x0800
8 Kbyte
Near
Data
Space
0x1FFE
0x27FE
0x2800
Y Data RAM (Y)
0x3FFE
0x4000
DMA RAM
0x8001
0x47FE
0x4800
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
 2009-2012 Microchip Technology Inc.
0xFFFE
DS70593D-page 43
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 4-5:
DATA MEMORY MAP FOR dsPIC33FJXXXGPX06A/X08A/X10A DEVICES WITH
30 KBS RAM
MSB
Address
MSB
2 Kbyte
SFR Space
0x0001
LSB
Address
16 bits
LSB
0x0000
SFR Space
0x07FE
0x0800
0x07FF
0x0801
8 Kbyte
Near
Data
Space
X Data RAM (X)
30 Kbyte
SRAM Space
0x47FF
0x4801
0x47FE
0x4800
Y Data RAM (Y)
0x77FF
0x7800
0x7FFF
0x8001
Optionally
Mapped
into Program
Memory
X Data
Unimplemented (X)
0xFFFF
DS70593D-page 44
DMA RAM
0x77FE
0x7800
0x7FFE
0x8000
0xFFFE
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.2.5
X AND Y DATA SPACES
The core has two data spaces, X and Y. These data
spaces can be considered either separate (for some
DSP instructions), or as one unified linear address
range (for MCU instructions). The data spaces are
accessed using two Address Generation Units (AGUs)
and separate data paths. This feature allows certain
instructions to concurrently fetch two words from RAM,
thereby enabling efficient execution of DSP algorithms
such as Finite Impulse Response (FIR) filtering and
Fast Fourier Transform (FFT).
The X data space is used by all instructions and
supports all addressing modes. There are separate
read and write data buses for X data space. The X read
data bus is the read data path for all instructions that
view data space as combined X and Y address space.
It is also the X data prefetch path for the dual operand
DSP instructions (MAC class).
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide
two concurrent data read paths.
4.2.6
DMA RAM
Every dsPIC33FJXXXGPX06A/X08A/X10A device
contains 2 Kbytes of dual ported DMA RAM located at
the end of Y data space. Memory locations is part of Y
data RAM and is in the DMA RAM space are accessible
simultaneously by the CPU and the DMA controller
module. DMA RAM is utilized by the DMA controller to
store data to be transferred to various peripherals using
DMA, as well as data transferred from various
peripherals using DMA. The DMA RAM can be
accessed by the DMA controller without having to steal
cycles from the CPU.
When the CPU and the DMA controller attempt to
concurrently write to the same DMA RAM location, the
hardware ensures that the CPU is given precedence in
accessing the DMA RAM location. Therefore, the DMA
RAM provides a reliable means of transferring DMA
data without ever having to stall the CPU.
Note:
DMA RAM can be used for general
purpose data storage if the DMA function
is not required in an application.
Both the X and Y data spaces support Modulo
Addressing mode for all instructions, subject to
addressing mode restrictions. Bit-Reversed Addressing
mode is only supported for writes to X data space.
All data memory writes, including in DSP instructions,
view data space as combined X and Y address space.
The boundary between the X and Y data spaces is
device-dependent and is not user-programmable.
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes, or 32K words, though the
implemented memory locations vary by device.
 2009-2012 Microchip Technology Inc.
DS70593D-page 45
CPU CORE REGISTERS MAP
All
Resets
 2009-2012 Microchip Technology Inc.
SFR Name
SFR
Addr
WREG0
0000
Working Register 0
xxxx
WREG1
0002
Working Register 1
xxxx
WREG2
WREG3
0004
0006
Working Register 2
Working Register 3
xxxx
xxxx
WREG4
0008
Working Register 4
xxxx
WREG5
000A
Working Register 5
xxxx
WREG6
000C
Working Register 6
xxxx
WREG7
000E
Working Register 7
xxxx
WREG8
0010
Working Register 8
xxxx
WREG9
0012
Working Register 9
xxxx
WREG10
0014
Working Register 10
xxxx
WREG11
WREG12
0016
0018
Working Register 11
Working Register 12
xxxx
xxxx
WREG13
001A
Working Register 13
xxxx
WREG14
001C
Working Register 14
xxxx
WREG15
001E
Working Register 15
0800
SPLIM
0020
Stack Pointer Limit Register
xxxx
ACCAL
0022
Accumulator A Low Word Register
0000
ACCAH
0024
Accumulator A High Word Register
0000
ACCAU
0026
Accumulator A Upper Word Register
0000
ACCBL
0028
Accumulator B Low Word Register
0000
ACCBH
002A
Accumulator B High Word Register
0000
ACCBU
002C
Accumulator B Upper Word Register
0000
PCL
002E
Program Counter Low Word Register
PCH
0030
—
—
—
—
—
—
—
—
Program Counter High Byte Register
0000
TBLPAG
0032
—
—
—
—
—
—
—
—
Table Page Address Pointer Register
0000
PSVPAG
0034
—
—
—
—
—
—
—
—
Program Memory Visibility Page Address Pointer Register
0000
RCOUNT
DCOUNT
0036
0038
DOSTARTL
DOSTARTH
003A
003C
—
—
—
—
—
—
—
DOENDL
DOENDH
003E
0040
—
—
—
—
—
—
—
SR
0042
OA
OB
SA
SB
OAB
SAB
DA
CORCON
0044
—
—
—
US
EDT
MODCON
XMODSRT
0046
0048
XMODEN
YMODEN
—
—
XMODEND
YMODSRT
004A
004C
YMODEND
Legend:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0000
Repeat Loop Counter Register
DCOUNT<15:0>
xxxx
xxxx
DOSTARTL<15:1>
0
—
xxxx
—
—
DOSTARTH<5:0>
—
—
—
DOENDH
DC
IPL2
IPL1
IPL0
RA
N
OV
Z
C
SATA
SATB
SATDW
ACCSAT
IPL3
PSV
RND
IF
0020
XS<15:1>
0
0000
xxxx
XE<15:1>
YS<15:1>
1
0
xxxx
xxxx
1
xxxx
00xx
DOENDL<15:1>
DL<2:0>
0
BWM<3:0>
YWM<3:0>
004E
YE<15:1>
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
xxxx
00xx
XWM<3:0>
0000
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 46
TABLE 4-1:
CPU CORE REGISTERS MAP (CONTINUED)
All
Resets
SFR Name
SFR
Addr
Bit 15
Bit 14
XBREV
DISICNT
0050
0052
BREN
—
—
BSRAM
0750
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_BSR
IR_BSR
RL_BSR
0000
SSRAM
0752
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_SSR
IR_SSR
RL_SSR
0000
Legend:
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XB<14:0>
Disable Interrupts Counter Register
xxxx
xxxx
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
DS70593D-page 47
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-1:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX10A DEVICES
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
CNEN1
0060
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CNEN2
0062
—
—
—
—
—
—
—
—
CN23IE
CN22IE
CN21IE
CN20IE
CN19IE
CN18IE
CNPU1
0068
CN8PUE
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CNPU2
006A
Legend:
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE
—
—
—
—
—
—
—
—
Bit 0
All
Resets
CN1IE
CN0IE
0000
CN17IE
CN16IE
0000
CN0PUE
0000
CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE
0000
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-3:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX08A DEVICES
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
CNEN1
0060
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CNEN2
0062
—
—
—
—
—
—
—
—
—
—
CN21IE
CN20IE
CN19IE
CN18IE
CNPU1
0068
CN8PUE
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CNPU2
006A
—
—
—
Legend:
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE
—
—
—
—
—
—
—
Bit 0
All
Resets
CN1IE
CN0IE
0000
CN17IE
CN16IE
0000
CN0PUE
0000
CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE
0000
Bit 5
Bit 3
Bit 2
Bit 1
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-4:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJXXXGPX06A DEVICES
 2009-2012 Microchip Technology Inc.
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
CNEN1
0060
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
CN7IE
CN6IE
CNEN2
0062
—
—
—
—
—
—
—
—
—
—
CNPU1
0068
CN8PUE
CN7PUE
CN6PUE
CN5PUE
CNPU2
006A
—
—
—
Legend:
Bit 4
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE
—
—
—
—
—
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 5
Bit 0
All
Resets
CN1IE
CN0IE
0000
CN17IE
CN16IE
0000
CN0PUE
0000
CN18PUE CN17PUE CN16PUE
0000
Bit 4
Bit 3
CN5IE
CN4IE
CN3IE
CN2IE
CN21IE
CN20IE
—
CN18IE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN21PUE CN20PUE
—
Bit 2
Bit 1
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 48
TABLE 4-2:
SFR
Name
SFR
Addr
INTERRUPT CONTROLLER REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 0
All
Resets
OSCFAIL
—
0000
INT1EP
INT0EP
0000
OC1IF
IC1IF
INT0IF
0000
—
MI2C1IF
SI2C1IF
0000
0000
Bit 9
Bit 8
Bit 2
Bit 1
OVBTE
COVTE
—
—
—
—
—
INT4EP
INT3EP
INT2EP
T3IF
T2IF
OC2IF
IC2IF
DMA0IF
T1IF
IC8IF
IC7IF
AD2IF
INT1IF
CNIF
INTCON1
0080
NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE
INTCON2
0082
ALTIVT
DISI
—
—
—
IFS0
0084
—
DMA1IF
AD1IF
U1TXIF
U1RXIF
IFS1
0086
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
DMA2IF
IFS2
0088
T6IF
DMA4IF
—
OC8IF
OC7IF
OC6IF
OC5IF
IC6IF
IC5IF
IC4IF
IC3IF
DMA3IF
C1IF
C1RXIF
SPI2IF
SPI2EIF
IFS3
008A
—
—
DMA5IF
DCIIF
DCIEIF
—
—
C2IF
C2RXIF
INT4IF
INT3IF
T9IF
T8IF
MI2C2IF
SI2C2IF
T7IF
0000
IFS4
008C
—
—
—
—
—
—
—
—
C2TXIF
C1TXIF
DMA7IF
DMA6IF
—
U2EIF
U1EIF
—
0000
IEC0
0094
—
DMA1IE
AD1IE
U1TXIE
U1RXIE
T3IE
T2IE
OC2IE
IC2IE
DMA0IE
T1IE
OC1IE
IC1IE
INT0IE
IEC1
0096
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
DMA2IE
IC8IE
IC7IE
AD2IE
INT1IE
CNIE
—
IEC2
0098
T6IE
DMA4IE
—
OC8IE
OC7IE
OC6IE
OC5IE
IC6IE
IC5IE
IC4IE
IC3IE
DMA3IE
C1IE
C1RXIE
SPI2IE
SPI2EIE
IEC3
009A
—
—
DMA5IE
DCIIE
DCIEIE
—
—
C2IE
C2RXIE
INT4IE
INT3IE
T9IE
T8IE
MI2C2IE
SI2C2IE
T7IE
0000
IEC4
009C
—
—
—
—
—
—
—
—
C2TXIE
C1TXIE
DMA7IE
DMA6IE
—
U2EIE
U1EIE
—
0000
—
SPI1IF SPI1EIF
SPI1IE SPI1EIE
SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR
MI2C1IE SI2C1IE
0000
0000
0000
DS70593D-page 49
IPC0
00A4
—
T1IP<2:0>
—
OC1IP<2:0>
—
IC1IP<2:0>
—
INT0IP<2:0>
4444
IPC1
00A6
—
T2IP<2:0>
—
OC2IP<2:0>
—
IC2IP<2:0>
—
DMA0IP<2:0>
4444
IPC2
00A8
—
U1RXIP<2:0>
—
SPI1IP<2:0>
—
SPI1EIP<2:0>
—
T3IP<2:0>
4444
IPC3
00AA
—
—
DMA1IP<2:0>
—
AD1IP<2:0>
—
U1TXIP<2:0>
0444
IPC4
00AC
—
CNIP<2:0>
—
—
MI2C1IP<2:0>
—
SI2C1IP<2:0>
4044
IPC5
00AE
—
IC8IP<2:0>
—
IC7IP<2:0>
—
AD2IP<2:0>
—
INT1IP<2:0>
4444
IPC6
00B0
—
T4IP<2:0>
—
OC4IP<2:0>
—
OC3IP<2:0>
—
DMA2IP<2:0>
4444
IPC7
00B2
—
U2TXIP<2:0>
—
U2RXIP<2:0>
—
INT2IP<2:0>
—
T5IP<2:0>
4444
IPC8
00B4
—
C1IP<2:0>
—
C1RXIP<2:0>
—
SPI2IP<2:0>
—
SPI2EIP<2:0>
4444
IPC9
00B6
—
IC5IP<2:0>
—
IC4IP<2:0>
—
IC3IP<2:0>
—
DMA3IP<2:0>
4444
IPC10
00B8
—
OC7IP<2:0>
—
OC6IP<2:0>
—
OC5IP<2:0>
—
IC6IP<2:0>
4444
IPC11
00BA
—
T6IP<2:0>
—
DMA4IP<2:0>
—
—
OC8IP<2:0>
4404
IPC12
00BC
—
T8IP<2:0>
—
MI2C2IP<2:0>
—
—
T7IP<2:0>
4444
IPC13
00BE
—
C2RXIP<2:0>
—
—
T9IP<2:0>
4444
IPC14
00C0
—
DCIEIP<2:0>
—
—
—
—
—
—
C2IP<2:0>
4004
IPC15
00C2
—
—
—
—
—
—
—
—
—
DMA5IP<2:0>
—
DCIIP<2:0>
IPC16
00C4
—
—
—
—
—
U2EIP<2:0>
—
U1EIP<2:0>
—
IPC17
00C6
—
—
C1TXIP<2:0>
—
DMA7IP<2:0>
—
INTTREG
00E0
—
Legend:
—
—
—
C2TXIP<2:0>
—
—
—
—
—
—
INT4IP<2:0>
ILR<3:0>
—
—
—
SI2C2IP<2:0>
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
INT3IP<2:0>
—
—
—
VECNUM<6:0>
—
—
DMA6IP<2:0>
0044
—
0440
4444
0000
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-5:
SFR
Name
SFR
Addr
TIMER REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TMR2
0106
TON
—
TSIDL
—
—
—
TMR3HLD 0108
—
—
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000
FFFF
TGATE
TCKPS<1:0>
—
TSYNC
TCS
—
0000
Timer2 Register
0000
Timer3 Holding Register (for 32-bit timer operations only)
xxxx
TMR3
010A
Timer3 Register
0000
PR2
010C
Period Register 2
FFFF
PR3
010E
Period Register 3
T2CON
0110
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
T32
—
TCS
—
0000
T3CON
0112
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
—
—
TCS
—
0000
TMR4
0114
TMR5HLD 0116
FFFF
Timer4 Register
0000
Timer5 Holding Register (for 32-bit operations only)
xxxx
TMR5
0118
Timer5 Register
0000
PR4
011A
Period Register 4
FFFF
PR5
011C
Period Register 5
T4CON
011E
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
T32
—
TCS
—
0000
T5CON
0120
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
—
—
TCS
—
0000
TMR6
0122
TMR7HLD 0124
FFFF
Timer6 Register
0000
Timer7 Holding Register (for 32-bit operations only)
xxxx
 2009-2012 Microchip Technology Inc.
TMR7
0126
Timer7 Register
0000
PR6
0128
Period Register 6
FFFF
PR7
012A
Period Register 7
T6CON
012C
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
T32
—
TCS
—
0000
T7CON
012E
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
—
—
TCS
—
0000
TMR8
0130
TMR9HLD 0132
FFFF
Timer8 Register
0000
Timer9 Holding Register (for 32-bit operations only)
xxxx
TMR9
0134
Timer9 Register
0000
PR8
0136
Period Register 8
FFFF
PR9
0138
Period Register 9
T8CON
013A
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
T32
—
TCS
—
0000
T9CON
013C
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
—
—
TCS
—
0000
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
FFFF
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 50
TABLE 4-6:
SFR Name
SFR
Addr
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
IC3BUF
0148
IC3CON
014A
IC4BUF
014C
IC4CON
014E
IC5BUF
0150
IC5CON
0152
IC6BUF
0154
IC6CON
0156
IC7BUF
0158
IC7CON
015A
IC8BUF
015C
IC8CON
015E
Legend:
INPUT CAPTURE REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
Input 1 Capture Register
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
—
ICSIDL
—
—
—
—
—
ICTMR
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
0000
xxxx
Input 8 Capture Register
—
0000
xxxx
Input 7 Capture Register
—
0000
xxxx
Input 6 Capture Register
—
0000
xxxx
Input 5 Capture Register
—
0000
xxxx
Input 4 Capture Register
—
0000
xxxx
Input 3 Capture Register
—
All
Resets
xxxx
Input 2 Capture Register
—
Bit 0
0000
xxxx
0000
DS70593D-page 51
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-7:
SFR Name
OUTPUT COMPARE REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
 2009-2012 Microchip Technology Inc.
OC1RS
0180
Output Compare 1 Secondary Register
OC1R
0182
Output Compare 1 Register
OC1CON
0184
OC2RS
0186
Output Compare 2 Secondary Register
OC2R
0188
Output Compare 2 Register
OC2CON
018A
OC3RS
018C
Output Compare 3 Secondary Register
OC3R
018E
Output Compare 3 Register
OC3CON
0190
OC4RS
0192
Output Compare 4 Secondary Register
OC4R
0194
Output Compare 4 Register
OC4CON
0196
OC5RS
0198
Output Compare 5 Secondary Register
OC5R
019A
Output Compare 5 Register
OC5CON
019C
OC6RS
019E
Output Compare 6 Secondary Register
OC6R
01A0
Output Compare 6 Register
OC6CON
01A2
OC7RS
01A4
Output Compare 7 Secondary Register
OC7R
01A6
Output Compare 7 Register
OC7CON
01A8
OC8RS
01AA
Output Compare 8 Secondary Register
OC8R
01AC
Output Compare 8 Register
OC8CON
01AE
Legend:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
—
—
—
—
—
—
—
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
OCFLT
OCTSEL
OCM<2:0>
0000
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 52
TABLE 4-8:
I2C1 REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
I2C1RCV
0200
—
—
—
—
—
—
—
—
Receive Register
0000
I2C1TRN
0202
—
—
—
—
—
—
—
—
Transmit Register
00FF
I2C1BRG
0204
—
—
—
—
—
—
—
I2C1CON
0206
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
1000
I2C1STAT
0208
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
0000
I2C1ADD
020A
—
—
—
—
—
—
Address Register
0000
I2C1MSK
020C
—
—
—
—
—
—
Address Mask Register
0000
SFR Name
Legend:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Baud Rate Generator Register
All
Resets
0000
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-10:
I2C2 REGISTER MAP
All
Resets
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
I2C2RCV
0210
—
—
—
—
—
—
—
—
Receive Register
0000
I2C2TRN
0212
—
—
—
—
—
—
—
—
Transmit Register
00FF
I2C2BRG
0214
—
—
—
—
—
—
—
I2C2CON
0216
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
1000
I2C2STAT
0218
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
0000
I2C2ADD
021A
—
—
—
—
—
—
Address Register
0000
I2C2MSK
021C
—
—
—
—
—
—
Address Mask Register
0000
SFR Name
Legend:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Baud Rate Generator Register
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
0000
DS70593D-page 53
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-9:
UART1 REGISTER MAP
SFR Name
SFR
Addr
U1MODE
0220
UARTEN
U1STA
0222
UTXISEL1
U1TXREG
0224
—
—
U1RXREG
0226
—
—
U1BRG
0228
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-12:
SFR
Name
SFR
Addr
Bit 15
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
UEN1
UEN0
WAKE
LPBACK
UTXBF
TRMT
Bit 4
Bit 3
ABAUD
URXINV
BRGH
ADDEN
RIDLE
PERR
Bit 2
Bit 1
STSEL
0000
URXDA
0110
Bit 12
—
USIDL
IREN
RTSMD
—
—
UTXBRK
UTXEN
—
—
—
—
—
UART Transmit Register
xxxx
—
—
—
—
—
UART Receive Register
0000
URXISEL<1:0>
Bit 5
All
Resets
Bit 13
UTXINV UTXISEL0
Bit 11
Bit 0
Bit 14
PDSEL<1:0>
FERR
OERR
Baud Rate Generator Prescaler
0000
UART2 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
WAKE
LPBACK
Bit 5
Bit 4
Bit 3
ABAUD
URXINV
BRGH
ADDEN
RIDLE
PERR
Bit 2
Bit 1
All
Resets
STSEL
0000
URXDA
0110
U2MODE
0230
UARTEN
—
USIDL
IREN
RTSMD
—
UEN1
UEN0
U2STA
0232
UTXISEL1
UTXINV
UTXISEL0
—
UTXBRK
UTXEN
UTXBF
TRMT
U2TXREG
0234
—
—
—
—
—
—
—
UART Transmit Register
xxxx
U2RXREG
0236
—
—
—
—
—
—
—
UART Receive Register
0000
U2BRG
0238
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-13:
SFR
Name
URXISEL<1:0>
OERR
0000
SPI1 REGISTER MAP
 2009-2012 Microchip Technology Inc.
Bit 15
Bit 14
Bit 13
SPI1STAT
0240
SPIEN
—
SPISIDL
—
—
—
—
SPI1CON1
0242
—
—
—
DISSCK
DISSDO
MODE16
SMP
SPI1CON2
0244
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
SPI1BUF
0248
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
—
—
CKE
SSEN
—
Bit 5
Bit 4
SPIROV
—
—
CKP
MSTEN
—
—
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
—
SPITBF
SPIRBF
0000
SPRE<2:0>
—
—
PPRE<1:0>
—
FRMDLY
—
SPI1 Transmit and Receive Buffer Register
0000
0000
0000
SPI2 REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
SPI2STAT
0260
SPIEN
—
SPISIDL
—
—
—
—
SPI2CON1
0262
—
—
—
DISSCK
DISSDO
MODE16
SMP
SPI2CON2
0264
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
SPI2BUF
0268
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR Name
FERR
Baud Rate Generator Prescaler
SFR
Addr
TABLE 4-14:
PDSEL<1:0>
Bit 0
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
—
—
CKE
SSEN
SPIROV
—
—
CKP
MSTEN
—
—
—
SPI2 Transmit and Receive Buffer Register
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
—
SPITBF
SPIRBF
0000
SPRE<2:0>
—
—
PPRE<1:0>
—
FRMDLY
—
0000
0000
0000
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 54
TABLE 4-11:
File Name
Addr
ADC1 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
ADON
—
ADSIDL
ADDMABM
—
AD12B
FORM<1:0>
—
—
CSCNA
CHPS<1:0>
—
—
ADC1BUF0
0300
AD1CON1
0320
AD1CON2
0322
AD1CON3
0324
ADRC
—
—
AD1CHS123
0326
—
—
—
AD1CHS0
0328
CH0NB
—
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 3
Bit 2
Bit 1
Bit 0
—
SIMSAM
ASAM
SAMP
DONE
0000
BUFM
ALTS
0000
CH123SA
0000
ADC Data Buffer 0
VCFG<2:0>
xxxx
SSRC<2:0>
BUFS
—
CH123SB
—
—
SMPI<3:0>
SAMC<4:0>
CH0SB<4:0>
—
—
0000
—
CH0NA
—
PCFG29
PCFG28
PCFG27 PCFG26 PCFG25
PCFG24
PCFG23
PCFG22
PCFG21 PCFG20 PCFG19 PCFG18 PCFG17
PCFG16
0000
AD1PCFGL
032C PCFG15 PCFG14
PCFG13
PCFG12
PCFG11 PCFG10
PCFG9
PCFG8
PCFG7
PCFG6
PCFG5
PCFG4
PCFG3
PCFG2
PCFG1
PCFG0
0000
AD1CSSH(1)
032E
CSS31
CSS30
CSS29
CSS28
CSS27
CSS26
CSS25
CSS24
CSS23
CSS22
CSS21
CSS20
CSS19
CSS18
CSS17
CSS16
0000
AD1CSSL
0330
CSS15
CSS14
CSS13
CSS12
CSS11
CSS10
CSS9
CSS8
CSS7
CSS6
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
AD1CON4
0332
—
—
—
—
—
—
—
—
—
—
—
—
—
CH0SA<4:0>
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
SIMSAM
ASAM
SAMP
DONE
0000
BUFM
ALTS
0000
CH123SA
0000
0000
DMABL<2:0>
0000
0000
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Not all ANx inputs are available on all devices. See the device pin diagrams for available ANx inputs.
TABLE 4-16:
File Name
Addr
ADC2BUF0
0340
AD2CON1
0360
ADC2 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
ADON
—
ADSIDL
ADDMABM
—
AD12B
FORM<1:0>
Bit 9
Bit 8
—
—
CSCNA
CHPS<1:0>
Bit 7
ADC Data Buffer 0
AD2CON2
0362
AD2CON3
0364
ADRC
—
—
AD2CHS123
0366
—
—
—
—
AD2CHS0
0368
CH0NB
—
—
—
Reserved
036A
—
—
—
—
AD2PCFGL
036C
PCFG13
PCFG12
Reserved
036E
—
—
—
—
—
AD2CSSL
0370
CSS15
CSS14
CSS13
CSS12
AD2CON4
0372
—
—
—
—
Legend:
—
CH123NA<1:0>
AD1PCFGH(1) 032A PCFG31 PCFG30
Legend:
Note 1:
—
ADCS<7:0>
CH123NB<1:0>
All
Resets
Bit 4
VCFG<2:0>
PCFG15 PCFG14
xxxx
SSRC<2:0>
BUFS
—
SMPI<3:0>
SAMC<4:0>
—
ADCS<7:0>
CH123NB<1:0>
CH123SB
CH0SB<3:0>
—
—
—
—
—
0000
CH123NA<1:0>
CH0NA
—
—
—
—
—
—
—
—
—
—
—
—
—
0000
PCFG9
PCFG8
PCFG7
PCFG6
PCFG5
PCFG4
PCFG3
PCFG2
PCFG1
PCFG0
0000
—
—
—
—
—
—
—
—
—
—
—
0000
CSS11
CSS10
CSS9
CSS8
CSS7
CSS6
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
—
—
—
—
—
—
—
—
—
—
—
PCFG11 PCFG10
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
CH0SA<3:0>
DMABL<2:0>
0000
0000
0000
DS70593D-page 55
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-15:
File Name Addr
DMA REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
DMA0CON 0380
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
—
DMA0REQ 0382
FORCE
—
—
—
—
—
—
—
—
Bit 5
Bit 4
AMODE<1:0>
Bit 3
Bit 2
—
—
Bit 1
Bit 0
MODE<1:0>
IRQSEL<6:0>
All
Resets
0000
0000
DMA0STA
0384
STA<15:0>
0000
DMA0STB
0386
STB<15:0>
0000
DMA0PAD
0388
PAD<15:0>
DMA0CNT
038A
—
—
—
—
—
—
DMA1CON 038C
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA1REQ 038E
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
—
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA1STA
0390
STA<15:0>
0000
DMA1STB
0392
STB<15:0>
0000
DMA1PAD
0394
PAD<15:0>
DMA1CNT
0396
—
—
—
—
—
—
DMA2CON 0398
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA2REQ 039A
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
—
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA2STA
039C
STA<15:0>
0000
DMA2STB
039E
STB<15:0>
0000
DMA2PAD
03A0
PAD<15:0>
DMA2CNT
03A2
—
—
—
—
—
—
DMA3CON 03A4
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA3REQ 03A6
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
—
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA3STA
03A8
STA<15:0>
0000
DMA3STB
03AA
STB<15:0>
0000
DMA3PAD 03AC
PAD<15:0>
 2009-2012 Microchip Technology Inc.
DMA3CNT 03AE
—
—
—
—
—
—
DMA4CON 03B0
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA4REQ 03B2
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
—
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA4STA
03B4
STA<15:0>
0000
DMA4STB
03B6
STB<15:0>
0000
DMA4PAD
03B8
PAD<15:0>
DMA4CNT 03BA
—
—
—
—
—
—
DMA5CON 03BC
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA5REQ 03BE
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
IRQSEL<6:0>
—
MODE<1:0>
0000
0000
DMA5STA
03C0
STA<15:0>
0000
DMA5STB
03C2
STB<15:0>
0000
DMA5PAD
03C4
PAD<15:0>
0000
Legend:
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 56
TABLE 4-17:
File Name Addr
DMA REGISTER MAP (CONTINUED)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
—
DMA5CNT 03C6
—
—
—
—
—
—
DMA6CON 03C8
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
—
—
—
—
—
—
—
—
DMA6REQ 03CA FORCE
Bit 5
Bit 4
Bit 3
Bit 2
—
—
Bit 1
Bit 0
CNT<9:0>
AMODE<1:0>
All
Resets
0000
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA6STA
03CC
STA<15:0>
0000
DMA6STB
03CE
STB<15:0>
0000
DMA6PAD
03D0
PAD<15:0>
DMA6CNT 03D2
—
—
—
—
—
—
DMA7CON 03D4
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
—
DMA7REQ 03D6
FORCE
—
—
—
—
—
—
—
—
0000
CNT<9:0>
—
AMODE<1:0>
0000
—
—
MODE<1:0>
IRQSEL<6:0>
0000
0000
DMA7STA
03D8
STA<15:0>
0000
DMA7STB
03DA
STB<15:0>
0000
DMA7PAD 03DC
PAD<15:0>
DMA7CNT 03DE
—
—
—
—
—
CNT<9:0>
DMACS0
03E0 PWCOL7 PWCOL6 PWCOL5 PWCOL4 PWCOL3 PWCOL2 PWCOL1 PWCOL0
DMACS1
03E2
DSADR
03E4
Legend:
—
—
—
—
0000
—
LSTCH<3:0>
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
XWCOL7
PPST7
DSADR<15:0>
XWCOL6 XWCOL5
PPST6
PPST5
0000
XWCOL4
XWCOL3
XWCOL2
PPST4
PPST3
PPST2
XWCOL1 XWCOL0
PPST1
PPST0
0000
0000
0000
DS70593D-page 57
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-17:
File Name
ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 OR 1 FOR dsPIC33FJXXXGP506A/51A0/706A/708A/710A DEVICES ONLY
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
C1CTRL1
0400
—
—
CSIDL
ABAT
—
C1CTRL2
0402
—
—
—
—
—
—
—
—
—
—
Bit 10
Bit 9
Bit 8
Bit 7
—
—
—
—
—
REQOP<2:0>
—
Bit 6
Bit 5
Bit 4
Bit 3
—
CANCAP
OPMODE<2:0>
—
—
—
—
—
—
—
Bit 2
Bit 1
Bit 0
—
—
WIN
DNCNT<4:0>
All
Resets
0480
0000
C1VEC
0404
C1FCTRL
0406
C1FIFO
0408
—
—
C1INTF
040A
—
—
TXBO
TXBP
RXBP
TXWAR
RXWAR
EWARN
IVRIF
WAKIF
ERRIF
—
FIFOIF
RBOVIF
RBIF
TBIF
0000
C1INTE
040C
—
—
—
—
—
—
—
—
IVRIE
WAKIE
ERRIE
—
FIFOIE
RBOVIE
RBIE
TBIE
0000
C1EC
040E
C1CFG1
0410
—
—
—
—
—
C1CFG2
0412
—
WAKFIL
—
—
—
C1FEN1
0414
FLTEN15
FLTEN14
FLTEN13
FLTEN12
FLTEN11
C1FMSKSEL1
0418
F7MSK<1:0>
F6MSK<1:0>
F5MSK<1:0>
F4MSK<1:0>
F3MSK<1:0>
F2MSK<1:0>
F1MSK<1:0>
F0MSK<1:0>
0000
C1FMSKSEL2
041A
F15MSK<1:0>
F14MSK<1:0>
F13MSK<1:0>
F12MSK<1:0>
F11MSK<1:0>
F10MSK<1:0>
F9MSK<1:0>
F8MSK<1:0>
0000
Legend:
—
—
FBP<5:0>
ICODE<6:0>
0000
FSA<4:0>
0000
FNRB<5:0>
TERRCNT<7:0>
0000
RERRCNT<7:0>
—
—
—
SJW<1:0>
SEG2PH<2:0>
FLTEN10
FLTEN9
SEG2PHTS
SAM
FLTEN7
FLTEN6
FLTEN8
0000
BRP<5:0>
SEG1PH<2:0>
FLTEN5
FLTEN4
FLTEN3
0000
PRSEG<2:0>
0000
FLTEN2 FLTEN1 FLTEN0
FFFF
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-19:
File Name
FILHIT<4:0>
DMABS<2:0>
Addr
ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
0400041E
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
RXFUL5
RXFUL4
RXFUL3
RXFUL2
RXFUL1
See definition when WIN = x
C1RXFUL1
0420 RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10 RXFUL9
RXFUL0
0000
C1RXFUL2
0422 RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16
RXFUL8
RXFUL7
RXFUL6
0000
C1RXOVF1
0428 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF9
0000
C1RXOVF2
042A RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17 RXOVF16
RXOVF8 RXOVF7 RXOVF6
RXOVF5
RXOVF4
RXOVF3
RXOVF2
RXOVF1
RXOVF0
0000
 2009-2012 Microchip Technology Inc.
C1TR01CON 0430
TXEN1
TXABT1
TXLARB1
TXERR1
TXREQ1
RTREN1
TX1PRI<1:0>
TXEN0
TXABAT0 TXLARB0
TXERR0
TXREQ0
RTREN0
TX0PRI<1:0>
0000
C1TR23CON 0432
TXEN3
TXABT3
TXLARB3
TXERR3
TXREQ3
RTREN3
TX3PRI<1:0>
TXEN2
TXABAT2 TXLARB2
TXERR2
TXREQ2
RTREN2
TX2PRI<1:0>
0000
C1TR45CON 0434
TXEN5
TXABT5
TXLARB5
TXERR5
TXREQ5
RTREN5
TX5PRI<1:0>
TXEN4
TXABAT4 TXLARB4
TXERR4
TXREQ4
RTREN4
TX4PRI<1:0>
0000
C1TR67CON 0436
TXEN7
TXABT7
TXLARB7
TXERR7
TXREQ7
RTREN7
TX7PRI<1:0>
TXEN6
TXABAT6 TXLARB6
TXERR6
TXREQ6
RTREN6
TX6PRI<1:0>
C1RXD
C1TXD
Legend:
xxxx
0440
Received Data Word
xxxx
0442
Transmit Data Word
xxxx
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 58
TABLE 4-18:
File Name
ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
0400041E
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
See definition when WIN = x
DS70593D-page 59
C1BUFPNT1
0420
F3BP<3:0>
F2BP<3:0>
F1BP<3:0>
F0BP<3:0>
0000
C1BUFPNT2
0422
F7BP<3:0>
F6BP<3:0>
F5BP<3:0>
F4BP<3:0>
0000
C1BUFPNT3
0424
F11BP<3:0>
F10BP<3:0>
F9BP<3:0>
F8BP<3:0>
0000
C1BUFPNT4
0426
F15BP<3:0>
F14BP<3:0>
F13BP<3:0>
F12BP<3:0>
0000
C1RXM0SID
0430
SID<10:3>
—
EID<17:16>
xxxx
C1RXM0EID
0432
EID<15:8>
C1RXM1SID
0434
SID<10:3>
—
EID<17:16>
C1RXM1EID
0436
EID<15:8>
C1RXM2SID
0438
SID<10:3>
—
EID<17:16>
C1RXM2EID
043A
EID<15:8>
C1RXF0SID
0440
SID<10:3>
—
EID<17:16>
C1RXF0EID
0442
EID<15:8>
C1RXF1SID
0444
SID<10:3>
—
EID<17:16>
C1RXF1EID
0446
EID<15:8>
C1RXF2SID
0448
SID<10:3>
—
EID<17:16>
C1RXF2EID
044A
EID<15:8>
C1RXF3SID
044C
SID<10:3>
—
EID<17:16>
C1RXF3EID
044E
EID<15:8>
C1RXF4SID
0450
SID<10:3>
—
EID<17:16>
C1RXF4EID
0452
EID<15:8>
C1RXF5SID
0454
SID<10:3>
—
EID<17:16>
C1RXF5EID
0456
EID<15:8>
C1RXF6SID
0458
SID<10:3>
—
EID<17:16>
C1RXF6EID
045A
EID<15:8>
C1RXF7SID
045C
SID<10:3>
—
EID<17:16>
C1RXF7EID
045E
EID<15:8>
C1RXF8SID
0460
SID<10:3>
—
EID<17:16>
C1RXF8EID
0462
EID<15:8>
C1RXF9SID
0464
SID<10:3>
—
EID<17:16>
C1RXF9EID
0466
EID<15:8>
C1RXF10SID
0468
SID<10:3>
—
EID<17:16>
C1RXF10EID
046A
EID<15:8>
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SID<2:0>
—
MIDE
EID<7:0>
SID<2:0>
—
MIDE
xxxx
EID<7:0>
SID<2:0>
—
MIDE
xxxx
EID<7:0>
SID<2:0>
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
EID<7:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
xxxx
xxxx
xxxx
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-20:
File Name
ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 FOR dsPIC33FJXXXGP506A/510A/706A/708A/710A DEVICES ONLY
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
C1RXF11SID
046C
SID<10:3>
C1RXF11EID
046E
EID<15:8>
C1RXF12SID
0470
SID<10:3>
C1RXF12EID
0472
EID<15:8>
C1RXF13SID
0474
SID<10:3>
C1RXF13EID
0476
EID<15:8>
C1RXF14SID
0478
SID<10:3>
C1RXF14EID
047A
EID<15:8>
C1RXF15SID
047C
SID<10:3>
C1RXF15EID
047E
EID<15:8>
Legend:
Bit 10
Bit 9
Bit 8
Bit 7
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 6
SID<2:0>
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
EXIDE
—
EID<17:16>
—
EID<17:16>
—
EID<17:16>
—
EID<17:16>
—
EID<17:16>
EID<7:0>
SID<2:0>
—
EXIDE
—
EXIDE
—
EXIDE
—
EXIDE
EID<7:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
xxxx
xxxx
EID<7:0>
SID<2:0>
All
Resets
xxxx
xxxx
xxxx
xxxx
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 60
TABLE 4-20:
File Name
ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 0 OR 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
C2CTRL1
0500
—
—
CSIDL
ABAT
—
C2CTRL2
0502
—
—
—
—
—
C2VEC
0504
—
—
—
C2FCTRL
0506
Bit 10
Bit 9
Bit 8
Bit 7
—
—
REQOP<2:0>
—
—
—
—
TXBP
RXBP
TXWAR
—
—
—
Bit 5
OPMODE<2:0>
FILHIT<4:0>
DMABS<2:0>
Bit 6
—
Bit 4
Bit 3
—
CANCAP
—
—
—
Bit 1
Bit 0
All
Resets
—
—
WIN
0480
DNCNT<4:0>
—
—
Bit 2
0000
ICODE<6:0>
—
—
—
0000
FSA<4:0>
0000
C2FIFO
0508
—
—
C2INTF
050A
—
—
TXBO
C2INTE
050C
—
—
—
C2EC
050E
C2CFG1
0510
—
—
—
—
—
C2CFG2
0512
—
WAKFIL
—
—
—
SEG2PH<2:0>
SEG2PHTS
C2FEN1
0514
FLTEN15
FLTEN14
FLTEN13
FLTEN12
FLTEN11
FLTEN10 FLTEN9 FLTEN8
FLTEN7
C2FMSKSEL1
0518
F7MSK<1:0>
F6MSK<1:0>
F5MSK<1:0>
F4MSK<1:0>
F3MSK<1:0>
F2MSK<1:0>
F1MSK<1:0>
F0MSK<1:0>
0000
C2FMSKSEL2
051A
F15MSK<1:0>
F14MSK<1:0>
F13MSK<1:0>
F12MSK<1:0>
F11MSK<1:0>
F10MSK<1:0>
F9MSK<1:0>
F8MSK<1:0>
0000
Legend:
RXWAR EWARN
—
—
—
—
IVRIF
WAKIF
ERRIF
FNRB<5:0>
IVRIE
WAKIE
ERRIE
TERRCNT<7:0>
0000
—
FIFOIF
RBOVIF
RBIF
TBIF
—
FIFOIE
RBOVIE
RBIE
TBIE
RERRCNT<7:0>
—
—
—
SJW<1:0>
SEG1PH<2:0>
0000
PRSEG<2:0>
FLTEN6 FLTEN5 FLTEN4 FLTEN3
0000
0000
BRP<5:0>
SAM
0000
FLTEN2 FLTEN1
0000
FLTEN0
FFFF
— = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-22:
File Name
FBP<5:0>
Addr
ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 0 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
0500051E
Bit 9
Bit 8
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
RXFUL6
RXFUL5
RXFUL4
RXFUL3
RXFUL2
RXFUL1
Bit 7
See definition when WIN = x
C2RXFUL1
0520 RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10
RXFUL0
0000
C2RXFUL2
0522 RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16
RXFUL9
RXFUL8
RXFUL7
0000
C2RXOVF1
0528 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF09 RXOVF08 RXOVF7
0000
C2RXOVF2
052A RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17 RXOVF16 0000
RXOVF6
RXOVF5
RXOVF4
RXOVF3
RXOVF2
RXOVF1 RXOVF0
DS70593D-page 61
C2TR01CON 0530
TXEN1
TX
ABAT1
TX
LARB1
TX
ERR1
TX
REQ1
RTREN1
TX1PRI<1:0>
TXEN0
TX
ABAT0
TX
LARB0
TX
ERR0
TX
REQ0
RTREN0
TX0PRI<1:0>
0000
C2TR23CON 0532
TXEN3
TX
ABAT3
TX
LARB3
TX
ERR3
TX
REQ3
RTREN3
TX3PRI<1:0>
TXEN2
TX
ABAT2
TX
LARB2
TX
ERR2
TX
REQ2
RTREN2
TX2PRI<1:0>
0000
C2TR45CON 0534
TXEN5
TX
ABAT5
TX
LARB5
TX
ERR5
TX
REQ5
RTREN5
TX5PRI<1:0>
TXEN4
TX
ABAT4
TX
LARB4
TX
ERR4
TX
REQ4
RTREN4
TX4PRI<1:0>
0000
C2TR67CON 0536
TXEN7
TX
ABAT7
TX
LARB7
TX
ERR7
TX
REQ7
RTREN7
TX7PRI<1:0>
TXEN6
TX
ABAT6
TX
LARB6
TX
ERR6
TX
REQ6
RTREN6
TX6PRI<1:0>
xxxx
C2RXD
0540
Recieved Data Word
xxxx
C2TXD
0542
Transmit Data Word
xxxx
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-21:
File Name
Addr
ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
0500
051E
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
See definition when WIN = x
 2009-2012 Microchip Technology Inc.
C2BUFPNT1
0520
F3BP<3:0>
F2BP<3:0>
F1BP<3:0>
F0BP<3:0>
0000
C2BUFPNT2
0522
F7BP<3:0>
F6BP<3:0>
F5BP<3:0>
F4BP<3:0>
0000
C2BUFPNT3
0524
F11BP<3:0>
F10BP<3:0>
F9BP<3:0>
F8BP<3:0>
0000
C2BUFPNT4
0526
F15BP<3:0>
F14BP<3:0>
F13BP<3:0>
F12BP<3:0>
0000
C2RXM0SID
0530
SID<10:3>
—
EID<17:16>
xxxx
C2RXM0EID
0532
EID<15:8>
C2RXM1SID
0534
SID<10:3>
—
EID<17:16>
xxxx
C2RXM1EID
0536
EID<15:8>
C2RXM2SID
0538
SID<10:3>
—
EID<17:16>
xxxx
C2RXM2EID
053A
EID<15:8>
C2RXF0SID
0540
SID<10:3>
—
EID<17:16>
xxxx
C2RXF0EID
0542
EID<15:8>
C2RXF1SID
0544
SID<10:3>
—
EID<17:16>
xxxx
C2RXF1EID
0546
EID<15:8>
C2RXF2SID
0548
SID<10:3>
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
C2RXF2EID
054A
EID<15:8>
C2RXF3SID
054C
SID<10:3>
C2RXF3EID
054E
EID<15:8>
C2RXF4SID
0550
SID<10:3>
C2RXF4EID
0552
EID<15:8>
C2RXF5SID
0554
SID<10:3>
C2RXF5EID
0556
EID<15:8>
C2RXF6SID
0558
SID<10:3>
C2RXF6EID
055A
EID<15:8>
C2RXF7SID
055C
SID<10:3>
C2RXF7EID
055E
EID<15:8>
C2RXF8SID
0560
SID<10:3>
C2RXF8EID
0562
EID<15:8>
C2RXF9SID
0564
SID<10:3>
C2RXF9EID
0566
EID<15:8>
C2RXF10SID
0568
SID<10:3>
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
MIDE
EID<7:0>
MIDE
xxxx
EID<7:0>
MIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 62
TABLE 4-23:
File Name
Addr
ECAN2 REGISTER MAP WHEN C2CTRL1.WIN = 1 FOR dsPIC33FJXXXGP706A/708A/710A DEVICES ONLY (CONTINUED)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
C2RXF10EID
056A
EID<15:8>
C2RXF11SID
056C
SID<10:3>
C2RXF11EID
056E
EID<15:8>
C2RXF12SID
0570
SID<10:3>
C2RXF12EID
0572
EID<15:8>
C2RXF13SID
0574
SID<10:3>
C2RXF13EID
0576
EID<15:8>
C2RXF14SID
0578
SID<10:3>
C2RXF14EID
057A
EID<15:8>
C2RXF15SID
057C
SID<10:3>
057E
EID<15:8>
C2RXF15EID
Legend:
Bit 10
Bit 9
Bit 8
Bit 7
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
EID<7:0>
SID<2:0>
—
SID<2:0>
—
SID<2:0>
—
EXIDE
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
—
EID<17:16>
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
EXIDE
xxxx
EID<7:0>
SID<2:0>
—
EXIDE
xxxx
EID<7:0>
SID<2:0>
—
EXIDE
EID<7:0>
All
Resets
xxxx
xxxx
DS70593D-page 63
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-23:
SFR
Name
DCI REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
DCICON1
0280
DCIEN
—
DCISIDL
—
DLOOP
CSCKD
CSCKE
COFSD
UNFM
CSDOM
DJST
—
—
—
DCICON2
0282
—
—
—
—
BLEN1
BLEN0
—
COFSG<3:0>
—
Bit 1
Bit 0
Reset State
COFSM1
COFSM0
WS<3:0>
0000 0000 0000 0000
0000 0000 0000 0000
DCICON3
0284
—
—
—
—
DCISTAT
0286
—
—
—
—
SLOT3
SLOT2
SLOT1
SLOT0
—
—
—
—
ROV
RFUL
TUNF
TMPTY
TSCON
0288
TSE15
TSE14
TSE13
TSE12
TSE11
TSE10
TSE9
TSE8
TSE7
TSE6
TSE5
TSE4
TSE3
TSE2
TSE1
TSE0
0000 0000 0000 0000
RSCON
028C
RSE15
RSE14
RSE13
RSE12
RSE11
RSE10
RSE9
RSE8
RSE7
RSE6
RSE5
RSE4
RSE3
RSE2
RSE1
RSE0
0000 0000 0000 0000
RXBUF0
0290
Receive Buffer #0 Data Register
0000 0000 0000 0000
RXBUF1
0292
Receive Buffer #1 Data Register
0000 0000 0000 0000
RXBUF2
0294
Receive Buffer #2 Data Register
0000 0000 0000 0000
RXBUF3
0296
Receive Buffer #3 Data Register
0000 0000 0000 0000
TXBUF0
0298
Transmit Buffer #0 Data Register
0000 0000 0000 0000
TXBUF1
029A
Transmit Buffer #1 Data Register
0000 0000 0000 0000
TXBUF2
029C
Transmit Buffer #2 Data Register
0000 0000 0000 0000
TXBUF3
029E
Transmit Buffer #3 Data Register
0000 0000 0000 0000
Legend:
Note 1:
— = unimplemented, read as ‘0’.
Refer to the “dsPIC33F/PIC24H Family Reference Manual” for descriptions of register bit fields.
TABLE 4-25:
File Name
BCG<11:0>
0000 0000 0000 0000
PORTA REGISTER MAP(1)
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISA9
—
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
F6FF
RA9
—
RA7
RA6
RA5
RA4
RA3
RA2
RA1
RA0
xxxx
LATA10
LATA9
—
LATA7
LATA6
LATA5
LATA4
LATA3
LATA2
LATA1
LATA0
xxxx
—
—
—
—
—
ODCA5
ODCA4
ODCA3
ODCA2
ODCA1
ODCA0
0000
 2009-2012 Microchip Technology Inc.
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
TRISA
02C0
TRISA15
TRISA14
TRISA13
TRISA12
—
TRISA10
PORTA
02C2
RA15
RA14
RA13
RA12
—
RA10
LATA
02C4
LATA15
LATA14
LATA13
LATA12
—
ODCA(2)
06C0
ODCA15
ODCA14
—
—
—
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
TABLE 4-26:
0000 0000 0000 0000
PORTB REGISTER MAP(1)
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISB
02C6
TRISB15
TRISB14
TRISB13
TRISB12
TRISB11
TRISB10
TRISB9
TRISB8
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
FFFF
PORTB
02C8
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx
LATB
02CA
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
xxxx
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
File Name
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 64
TABLE 4-24:
PORTC REGISTER MAP(1)
Bit 14
Bit 13
Bit 12
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
—
—
—
—
—
—
TRISC4
TRISC3
TRISC2
TRISC1
—
F01E
—
—
—
—
—
—
—
RC4
RC3
RC2
RC1
—
xxxx
—
—
—
—
—
—
—
LATC4
LATC3
LATC2
LATC1
—
xxxx
Addr
TRISC
02CC
PORTC
02CE
RC15
RC14
RC13
RC12
LATC
02D0
LATC15
LATC14
LATC13
LATC12
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
TABLE 4-28:
Bit 15
Bit 11
File Name
TRISC15 TRISC14 TRISC13 TRISC12
PORTD REGISTER MAP(1)
File Name
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISD
02D2
TRISD15
TRISD14
TRISD13
TRISD12
TRISD11
TRISD10
TRISD9
TRISD8
TRISD7
TRISD6
TRISD5
TRISD4
TRISD3
TRISD2
TRISD1
TRISD0
FFFF
PORTD
02D4
RD15
RD14
RD13
RD12
RD11
RD10
RD9
RD8
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
xxxx
LATD
02D6
LATD15
LATD14
LATD13
LATD12
LATD11
LATD10
LATD9
LATD8
LATD7
LATD6
LATD5
LATD4
LATD3
LATD2
LATD1
LATD0
xxxx
ODCD
06D2
ODCD15
ODCD14
ODCD13
ODCD12
ODCD11
ODCD10
ODCD9
ODCD8
ODCD7
ODCD6
ODCD5
ODCD4
ODCD3
ODCD2
ODCD1
ODCD0
0000
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
TABLE 4-29:
PORTE REGISTER MAP(1)
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISE
02D8
—
—
—
—
—
—
—
—
TRISE7
TRISE6
TRISE5
TRISE4
TRISE3
TRISE2
TRISE1
TRISE0
00FF
PORTE
02DA
—
—
—
—
—
—
—
—
RE7
RE6
RE5
RE4
RE3
RE2
RE1
RE0
xxxx
LATE
02DC
—
—
—
—
—
—
—
—
LATE7
LATE6
LATE5
LATE4
LATE3
LATE2
LATE1
LATE0
xxxx
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
File Name
TABLE 4-30:
PORTF REGISTER MAP(1)
DS70593D-page 65
File Name
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All Resets
TRISF
02DE
—
—
TRISF13
TRISF12
—
—
—
TRISF8
TRISF7
TRISF6
TRISF5
TRISF4
TRISF3
TRISF2
TRISF1
TRISF0
31FF
PORTF
02E0
—
—
RF13
RF12
—
—
—
RF8
RF7
RF6
RF5
RF4
RF3
RF2
RF1
RF0
xxxx
LATF
02E2
—
—
LATF13
LATF12
—
—
—
LATF8
LATF7
LATF6
LATF5
LATF4
LATF3
LATF2
LATF1
LATF0
xxxx
ODCF
06DE
—
—
ODCF13
ODCF12
—
—
—
ODCF8
ODCF7
ODCF6
ODCF5
ODCF4
ODCF3
ODCF2
ODCF1
ODCF0
0000
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
TABLE 4-27:
PORTG REGISTER MAP(1)
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISG
02E4
TRISG15
TRISG14
TRISG13
TRISG12
—
—
TRISG9
TRISG8
TRISG7
TRISG6
—
—
TRISG3
TRISG2
TRISG1
TRISG0
F3CF
PORTG
02E6
RG15
RG14
RG13
RG12
—
—
RG9
RG8
RG7
RG6
—
—
RG3
RG2
RG1
RG0
xxxx
LATG
02E8
LATG15
LATG14
LATG13
LATG12
—
—
LATG9
LATG8
LATG7
LATG6
—
—
LATG3
LATG2
LATG1
LATG0
xxxx
ODCG
06E4
ODCG15
ODCG14
ODCG13
ODCG12
—
—
ODCG9
ODCG8
ODCG7
ODCG6
—
—
ODCG3
ODCG2
ODCG1
ODCG0
0000
Legend:
Note 1:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal for PinHigh devices.
The actual set of I/O port pins varies from one device to another. Please refer to the corresponding pinout diagrams.
File Name
TABLE 4-32:
SYSTEM CONTROL REGISTER MAP
File Name
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
RCON
0740
TRAPR
IOPUWR
—
—
—
—
—
VREGS
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
BOR
POR
xxxx(1)
OSCCON
0742
—
CLKLOCK
—
LOCK
—
CF
—
LPOSCEN
OSWEN
0300(2)
COSC<2:0>
—
CLKDIV
0744
ROI
PLLFBD
0746
—
—
—
—
—
—
—
OSCTUN
0748
—
—
—
—
—
—
—
Legend:
Note 1:
2:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
RCON register Reset values dependent on type of Reset.
OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset.
TABLE 4-33:
DOZE<2:0>
NOSC<2:0>
DOZEN
FRCDIV<2:0>
PLLPOST<1:0>
—
PLLPRE<4:0>
—
—
TUN<5:0>
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
NVMCON
0760
WR
WREN
WRERR
—
—
—
—
—
—
ERASE
—
—
0766
—
—
—
—
—
—
—
—
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000(1)
NVMOP<3:0>
NVMKEY<7:0>
0000
 2009-2012 Microchip Technology Inc.
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.
TABLE 4-34:
File Name
0000
NVM REGISTER MAP
Addr
Legend:
Note 1:
0030
—
File Name
NVMKEY
3040
PLLDIV<8:0>
Addr
PMD REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000
PMD1
0770
T5MD
T4MD
T3MD
T2MD
T1MD
—
—
DCIMD
I2C1MD
U2MD
U1MD
SPI2MD
SPI1MD
C2MD
C1MD
AD1MD
PMD2
0772
IC8MD
IC7MD
IC6MD
IC5MD
IC4MD
IC3MD
IC2MD
IC1MD
OC8MD
OC7MD
OC6MD
OC5MD
OC4MD
OC3MD
OC2MD
OC1MD
0000
PMD3
0774
T9MD
T8MD
T7MD
T6MD
—
—
—
—
—
—
—
—
—
—
I2C2MD
AD2MD
0000
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 66
TABLE 4-31:
In addition to its use as a working register, the W15 register in the
dsPIC33FJXXXGPX06A/X08A/X10A devices is also used as a software Stack
Pointer. The Stack Pointer always points to the first available free word and
grows from lower to higher addresses. It pre-decrements for stack pops and
post-increments for stack pushes, as shown in Figure 4-6. For a PC push during
any CALL instruction, the MSb of the PC is zero-extended before the push,
ensuring that the MSb is always clear.
Note:
A PC push during exception processing
concatenates the SRL register to the MSb
of the PC prior to the push.
FIGURE 4-6:
0x0000
Stack Grows Towards
Higher Address
SOFTWARE STACK
15
CALL STACK FRAME
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets
an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is
the case for the Stack Pointer, SPLIM<0> is forced to ‘0’ because all stack operations must be word-aligned. Whenever an EA is generated using W15 as a
source or destination pointer, the resulting address is compared with the value
in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are
equal and a push operation is performed, a stack error trap will not occur. The
stack error trap will occur on a subsequent push operation. Thus, for example,
if it is desirable to cause a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the value 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is generated when the
Stack Pointer address is found to be less than 0x0800. This prevents the stack
from interfering with the Special Function Register (SFR) space.
A write to the SPLIM register should not be immediately followed by an indirect
read operation using W15.
4.2.8
DATA RAM PROTECTION FEATURE
DS70593D-page 67
The dsPIC33F product family supports Data RAM protection features which
enable segments of RAM to be protected when used in conjunction with Boot
and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is
accessible only from the Boot Segment Flash code when enabled. SSRAM
(Secure RAM segment for RAM) is accessible only from the Secure Segment
Flash code when enabled. See Table 4-1 for an overview of the BSRAM and
SSRAM SFRs.
4.3
Instruction Addressing Modes
The addressing modes in Table 4-35 form the basis of the addressing modes
optimized to support the specific features of individual instructions. The
addressing modes provided in the MAC class of instructions are somewhat different from those in the other instruction types.
4.3.1
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field (f) to directly address
data present in the first 8192 bytes of data memory (Near Data Space). Most
file register instructions employ a working register, W0, which is denoted as
WREG in these instructions. The destination is typically either the same file reg-
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
4.2.7
dsPIC33FJXXXGPX06A/X08A/X10A
ister or WREG (with the exception of the MUL instruction), which writes the result to a register or register
pair. The MOV instruction allows additional flexibility and
can access the entire data space.
4.3.2
MCU INSTRUCTIONS
The 3-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where:
Operand 1 is always a working register (i.e., the
addressing mode can only be register direct) which is
referred to as Wb.
TABLE 4-35:
Operand 2 can be a W register, fetched from data
memory, or a 5-bit literal. The result location can be
either a W register or a data memory location. The
following addressing modes are supported by MCU
instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
Not all instructions support all the
addressing
modes
given
above.
Individual instructions may support
different subsets of these addressing
modes.
Note:
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
File Register Direct
Description
The address of the file register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the EA.
Register Indirect Post-Modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset
4.3.3
The sum of Wn and a literal forms the EA.
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
Addressing modes supported by most MCU
instructions, move and accumulator instructions also
support Register Indirect with Register Offset
Addressing mode, also referred to as Register Indexed
mode.
Note:
For the MOV instructions, the Addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (Register Offset)
field is shared between both source and
destination (but typically only used by
one).
In summary, the following Addressing modes are
supported by move and accumulator instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
DS70593D-page 68
• Register Indirect with Literal Offset
• 8-bit Literal
• 16-bit Literal
Note:
4.3.4
Not all instructions support all the
Addressing
modes
given
above.
Individual instructions may support
different subsets of these Addressing
modes.
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred
to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The 2-source operand prefetch registers must be
members of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 are always directed to the X RAGU
and W10 and W11 will always be directed to the Y
AGU. The effective addresses generated (before and
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
Note:
Register Indirect with Register Offset
Addressing mode is only available for W9
(in X space) and W11 (in Y space).
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.3.5
4.4.1
START AND END ADDRESS
The Modulo Addressing scheme requires that a starting
and ending address be specified and loaded into the
16-bit Modulo Buffer Address registers: XMODSRT,
XMODEND, YMODSRT and YMODEND (see
Table 4-1).
Note:
Y space Modulo Addressing EA
calculations assume word sized data (LSb
of every EA is always clear).
OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit signed
literals to specify the branch destination directly, whereas
the DISI instruction uses a 14-bit unsigned literal field. In
some instructions, such as ADD Acc, the source of an
operand or result is implied by the opcode itself. Certain
operations, such as NOP, do not have any operands.
4.4
Modulo Addressing
Modulo Addressing mode is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or program
space (since the data pointer mechanism is essentially
the same for both). One circular buffer can be supported
in each of the X (which also provides the pointers into
program space) and Y data spaces. Modulo Addressing
can operate on any W register pointer. However, it is not
advisable to use W14 or W15 for Modulo Addressing
since these two registers are used as the Stack Frame
Pointer and Stack Pointer, respectively.
In general, any particular circular buffer can only be
configured to operate in one direction as there are
certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing
buffers), based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a bidirectional mode (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
 2009-2012 Microchip Technology Inc.
DS70593D-page 69
dsPIC33FJXXXGPX06A/X08A/X10A
The length of a circular buffer is not directly specified. It
is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
4.4.2
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags as well
as a W register field to specify the W Address registers.
The XWM and YWM fields select which registers will
FIGURE 4-7:
operate with Modulo Addressing. If XWM = 15, X RAGU
and X WAGU Modulo Addressing is disabled. Similarly, if
YWM = 15, Y AGU Modulo Addressing is disabled.
The X Address Space Pointer W register (XWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 4-1). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x1100
MOV
MOV
MOV
MOV
MOV
MOV
#0x1100, W0
W0, XMODSRT
#0x1163, W0
W0, MODEND
#0x8001, W0
W0, MODCON
MOV
#0x0000, W0
;W0 holds buffer fill value
MOV
#0x1110, W1
;point W1 to buffer
DO
AGAIN, #0x31
MOV
W0, [W1++]
AGAIN: INC W0, W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 50 buffer locations
;fill the next location
;increment the fill value
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
DS70593D-page 70
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.4.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. It is important to realize that the address
boundaries check for addresses less than, or greater
than, the upper (for incrementing buffers) and lower (for
decrementing buffers) boundary addresses (not just
equal to). Address changes may, therefore, jump
beyond boundaries and still be adjusted correctly.
Note:
4.5
The modulo corrected effective address is
written back to the register only when
Pre-Modify or Post-Modify Addressing
mode is used to compute the effective
address. When an address offset (e.g.,
[W7+W2]) is used, Modulo Address
correction is performed but the contents of
the register remain unchanged.
Bit-Reversed Addressing
Bit-Reversed Addressing mode is intended to simplify
data re-ordering for radix-2 FFT algorithms. It is
supported by the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
4.5.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing mode is enabled when:
1.
2.
3.
BWM bits (W register selection) in the
MODCON register are any value other than ‘15’
(the stack cannot be accessed using
Bit-Reversed Addressing).
The BREN bit is set in the XBREV register.
The addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
 2009-2012 Microchip Technology Inc.
If the length of a bit-reversed buffer is M = 2N bytes,
the last ‘N’ bits of the data buffer start address must
be zeros.
XB<14:0> is the Bit-Reversed Address modifier, or
‘pivot point’, which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
All bit-reversed EA calculations assume
word sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing is only
executed for Register Indirect with Pre-Increment or
Post-Increment Addressing and word sized data writes.
It will not function for any other addressing mode or for
byte sized data and normal addresses are generated
instead. When Bit-Reversed Addressing is active, the
W Address Pointer is always added to the address
modifier (XB) and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as
word sized data is a requirement, the LSb of the EA is
ignored (and always clear).
Note:
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempts to do so, Bit-Reversed Addressing will assume priority when active for the
X WAGU and X WAGU Modulo Addressing
will be disabled. However, Modulo
Addressing will continue to function in the X
RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN bit (XBREV<15>), a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the bit-reversed pointer.
DS70593D-page 71
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 4-8:
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2
b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-Word Bit-Reversed Buffer
TABLE 4-36:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
A3
A2
A1
A0
Bit-Reversed Address
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
DS70593D-page 72
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.6
4.6.1
Interfacing Program and Data
Memory Spaces
Since the address ranges for the data and program
spaces are 16 and 24 bits, respectively, a method is
needed to create a 23-bit or 24-bit program address
from 16-bit data registers. The solution depends on the
interface method to be used.
The dsPIC33FJXXXGPX06A/X08A/X10A architecture
uses a 24-bit wide program space and a 16-bit wide
data space. The architecture is also a modified Harvard
scheme, meaning that data can also be present in the
program space. To use this data successfully, it must
be accessed in a way that preserves the alignment of
information in both spaces.
For table operations, the 8-bit Table Page register
(TBLPAG) is used to define a 32K word region within
the program space. This is concatenated with a 16-bit
EA to arrive at a full 24-bit program space address. In
this format, the Most Significant bit of TBLPAG is used
to determine if the operation occurs in the user memory
(TBLPAG<7> = 0) or the configuration memory
(TBLPAG<7> = 1).
Aside
from
normal
execution,
the
dsPIC33FJXXXGPX06A/X08A/X10A architecture provides two methods by which program space can be
accessed during operation:
• Using table instructions to access individual bytes
or words anywhere in the program space
• Remapping a portion of the program space into
the data space (Program Space Visibility)
For remapping operations, the 8-bit Program Space
Visibility register (PSVPAG) is used to define a
16K word page in the program space. When the Most
Significant bit of the EA is ‘1’, PSVPAG is concatenated
with the lower 15 bits of the EA to form a 23-bit program
space address. Unlike table operations, this limits
remapping operations strictly to the user memory area.
Table instructions allow an application to read or write
to small areas of the program memory. This capability
makes the method ideal for accessing data tables that
need to be updated from time to time. It also allows
access to all bytes of the program word. The
remapping method allows an application to access a
large block of data on a read-only basis, which is ideal
for look ups from a large table of static data. It can only
access the least significant word of the program word.
TABLE 4-37:
Table 4-37 and Figure 4-9 show how the program EA is
created for table operations and remapping accesses
from the data EA. Here, P<23:0> refers to a program
space word, whereas D<15:0> refers to a data space
word.
PROGRAM SPACE ADDRESS CONSTRUCTION
Access
Space
Access Type
Instruction Access
(Code Execution)
User
TBLRD/TBLWT
(Byte/Word Read/Write)
User
Program Space Address
<23>
Program Space Visibility
(Block Remap/Read)
<22:16>
<15>
0xx
xxxx
xxxx
TBLPAG<7:0>
0xxx xxxx
User
<14:1>
PC<22:1>
0
Configuration
Note 1:
ADDRESSING PROGRAM SPACE
<0>
0
xxxx
xxxx xxx0
Data EA<15:0>
xxxx xxxx xxxx xxxx
TBLPAG<7:0>
Data EA<15:0>
1xxx xxxx
xxxx xxxx xxxx xxxx
0
PSVPAG<7:0>
0
xxxx xxxx
Data EA<14:0>(1)
xxx xxxx xxxx xxxx
Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of
the address is PSVPAG<0>.
 2009-2012 Microchip Technology Inc.
DS70593D-page 73
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 4-9:
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Program Counter(1)
Program Counter
0
0
23 bits
EA
Table Operations(2)
1/0
1/0
TBLPAG
8 bits
16 bits
24 bits
Select
Program Space Visibility(1)
(Remapping)
0
EA
1
0
PSVPAG
8 bits
15 bits
23 bits
User/Configuration
Space Select
Byte Select
Note 1: The LSb of program space addresses is always fixed as ‘0’ in order to maintain word
alignment of data in the program and data spaces.
2: Table operations are not required to be word-aligned. Table read operations are permitted
in the configuration memory space.
DS70593D-page 74
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
4.6.2
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the program space without going
through data space. The TBLRDH and TBLWTH
instructions are the only method to read or write the
upper 8 bits of a program space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the least significant
data word and TBLRDH and TBLWTH access the space
which contains the upper data byte.
Two table instructions are provided to move byte or
word sized (16-bit) data to and from program space.
Both function as either byte or word operations.
• TBLRDL (Table Read Low): In Word mode, it
maps the lower word of the program space
location (P<15:0>) to a data address (D<15:0>).
• TBLRDH (Table Read High): In Word mode, it
maps the entire upper word of a program address
(P<23:16>) to a data address. Note that D<15:8>,
the ‘phantom byte’, will always be ‘0’.
In Byte mode, it maps the upper or lower byte of
the program word to D<7:0> of the data address,
as above. Note that the data will always be ‘0’
when the upper ‘phantom’ byte is selected (Byte
Select = 1).
In a similar fashion, two table instructions, TBLWTH
and TBLWTL, are used to write individual bytes or
words to a program space address. The details of
their operation are explained in Section 5.0 “Flash
Program Memory”.
For all table operations, the area of program memory
space to be accessed is determined by the Table Page
register (TBLPAG). TBLPAG covers the entire program
memory space of the device, including user and
configuration spaces. When TBLPAG<7> = 0, the table
page is located in the user memory space. When
TBLPAG<7> = 1, the page is located in configuration
space.
In Byte mode, either the upper or lower byte of the
lower program word is mapped to the lower byte of
a data address. The upper byte is selected when
Byte Select is ‘1’; the lower byte is selected when
it is ‘0’.
FIGURE 4-10:
ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
Program Space
TBLPAG
02
23
15
0
0x000000
23
16
8
0
00000000
0x020000
0x030000
00000000
00000000
00000000
‘Phantom’ Byte
TBLRDH.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
TBLRDL.W
0x800000
 2009-2012 Microchip Technology Inc.
The address for the table operation is determined by the data EA
within the page defined by the TBLPAG register.
Only read operations are shown; write operations are also valid in
the user memory area.
DS70593D-page 75
dsPIC33FJXXXGPX06A/X08A/X10A
4.6.3
READING DATA FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word page of the program space.
This option provides transparent access of stored
constant data from the data space without the need to
use special instructions (i.e., TBLRDL/H).
Program space access through the data space occurs
if the Most Significant bit of the data space EA is ‘1’ and
program space visibility is enabled by setting the PSV
bit in the Core Control register (CORCON<2>). The
location of the program memory space to be mapped
into the data space is determined by the Program
Space Visibility Page register (PSVPAG). This 8-bit
register defines any one of 256 possible pages of
16K words in program space. In effect, PSVPAG
functions as the upper 8 bits of the program memory
address, with the 15 bits of the EA functioning as the
lower bits. Note that by incrementing the PC by 2 for
each program memory word, the lower 15 bits of data
space addresses directly map to the lower 15 bits in the
corresponding program space addresses.
Data reads to this area add an additional cycle to the
instruction being executed, since two program memory
fetches are required.
Although each data space address, 8000h and higher,
maps directly into a corresponding program memory
address (see Figure 4-11), only the lower 16 bits of the
FIGURE 4-11:
24-bit program word are used to contain the data. The
upper 8 bits of any program space location used as
data should be programmed with ‘1111 1111’ or
‘0000 0000’ to force a NOP. This prevents possible
issues should the area of code ever be accidentally
executed.
PSV access is temporarily disabled during
table reads/writes.
Note:
For operations that use PSV and are executed outside
a REPEAT loop, the MOV and MOV.D instructions
require one instruction cycle in addition to the specified
execution time. All other instructions require two
instruction cycles in addition to the specified execution
time.
For operations that use PSV, which are executed inside
a REPEAT loop, there will be some instances that
require two instruction cycles in addition to the
specified execution time of the instruction:
• Execution in the first iteration
• Execution in the last iteration
• Execution prior to exiting the loop due to an
interrupt
• Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow the
instruction accessing data, using PSV, to execute in a
single cycle.
PROGRAM SPACE VISIBILITY OPERATION
When CORCON<2> = 1 and EA<15> = 1:
Program Space
PSVPAG
02
23
15
Data Space
0
0x000000
0x0000
Data EA<14:0>
0x010000
0x018000
The data in the page
designated by
PSVPAG is mapped
into the upper half of
the data memory
space...
0x8000
PSV Area
0x800000
DS70593D-page 76
...while the lower 15 bits
of the EA specify an
exact address within
0xFFFF the PSV area. This
corresponds exactly to
the same lower 15 bits
of the actual program
space address.
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
5.0
Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then
program the digital signal controller just before shipping
the product. This also allows the most recent firmware
or a custom firmware to be programmed.
FLASH PROGRAM MEMORY
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
5. “Flash Programming” (DS70191) in
the
“dsPIC33F/PIC24H
Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions. With RTSP, the user
can write program memory data either in blocks or
‘rows’ of 64 instructions (192 bytes) at a time or a single
program memory word, and erase program memory in
blocks or ‘pages’ of 512 instructions (1536 bytes) at a
time.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
5.1
The dsPIC33FJXXXGPX06A/X08A/X10A devices contain internal Flash program memory for storing and
executing application code. The memory is readable,
writable and erasable during normal operation over the
entire VDD range.
Flash memory can be programmed in two ways:
Regardless of the method used, all programming of
Flash memory is done with the table read and table
write instructions. These allow direct read and write
access to the program memory space from the data
memory while the device is in normal operating mode.
The 24-bit target address in the program memory is
formed using bits<7:0> of the TBLPAG register and the
Effective Address (EA) from a W register specified in
the table instruction, as shown in Figure 5-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
• In-Circuit Serial Programming™ (ICSP™)
programming capability
• Run-Time Self-Programming (RTSP)
ICSP allows a dsPIC33FJXXXGPX06A/X08A/X10A
device to be serially programmed while in the end
application circuit. This is simply done with two lines for
programming clock and programming data (one of the
alternate programming pin pairs: PGECx/PGEDx), and
three other lines for power (VDD), ground (VSS) and
FIGURE 5-1:
Table Instructions and Flash
Programming
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can also access program memory in Word
or Byte mode.
ADDRESSING FOR TABLE REGISTERS
24 bits
Using
Program Counter
Program Counter
0
0
Working Reg EA
Using
Table Instruction
1/0
TBLPAG Reg
8 bits
User/Configuration
Space Select
 2009-2012 Microchip Technology Inc.
16 bits
24-bit EA
Byte
Select
DS70593D-page 77
dsPIC33FJXXXGPX06A/X08A/X10A
5.2
RTSP Operation
The dsPIC33FJXXXGPX06A/X08A/X10A Flash program memory array is organized into rows of 64
instructions or 192 bytes. RTSP allows the user to
erase a page of memory, which consists of eight rows
(512 instructions) at a time, and to program one row or
one word at a time. Table 25-12 illustrates typical erase
and programming times. The 8-row erase pages and
single row write rows are edge-aligned, from the beginning of program memory, on boundaries of 1536 bytes
and 192 bytes, respectively.
The program memory implements holding buffers that
can contain 64 instructions of programming data. Prior
to the actual programming operation, the write data
must be loaded into the buffers in sequential order. The
instruction words loaded must always be from a group
of 64 boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the buffers. Programming is performed by
setting the control bits in the NVMCON register. A total
of 64 TBLWTL and TBLWTH instructions are required
to load the instructions.
All of the table write operations are single-word writes
(two instruction cycles) because only the buffers are
written. A programming cycle is required for
programming each row.
5.3
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. The processor stalls (waits) until the
programming operation is finished.
The programming time depends on the FRC accuracy
(see Table 25-19) and the value of the FRC Oscillator
Tuning register (see Register 9-4). Use the following
formula to calculate the minimum and maximum values
for the Row Write Time, Page Erase Time and Word
Write Cycle Time parameters (see Table 25-12).
EQUATION 5-1:
For example, if the device is operating at +125°C, the
FRC accuracy will be ±5%. If the TUN<5:0> bits (see
Register 9-4) are set to ‘b111111, the minimum row
write time is equal to Equation 5-2.
EQUATION 5-2:
MINIMUM ROW WRITE
TIME
11064 Cycles
T RW = ---------------------------------------------------------------------------------------------- = 1.435ms
7.37 MHz   1 + 0.05    1 – 0.00375 
The maximum row write time is equal to Equation 5-3.
EQUATION 5-3:
MAXIMUM ROW WRITE
TIME
11064 Cycles
T RW = ---------------------------------------------------------------------------------------------- = 1.586ms
7.37 MHz   1 – 0.05    1 – 0.00375 
Setting the WR bit (NVMCON<15>) starts the
operation, and the WR bit is automatically cleared
when the operation is finished.
5.4
Control Registers
The two SFRs that are used to read and write the
program Flash memory are:
• NVMCON: Flash Memory Control Register
• NVMKEY: Non-Volatile Memory Key Register
The NVMCON register (Register 5-1) controls which
blocks are to be erased, which memory type is to be
programmed and the start of the programming cycle.
NVMKEY (Register 5-2) is a write-only register that is
used for write protection. To start a programming or
erase sequence, the user must consecutively write 0x55
and 0xAA to the NVMKEY register. Refer to Section 5.3
“Programming Operations” for further details.
PROGRAMMING TIME
T
-------------------------------------------------------------------------------------------------------------------------7.37 MHz   FRC Accuracy %   FRC Tuning %
DS70593D-page 78
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 5-1:
NVMCON: FLASH MEMORY CONTROL REGISTER
R/SO-0(1)
R/W-0(1)
R/W-0(1)
U-0
U-0
U-0
U-0
U-0
WR
WREN
WRERR
—
—
—
—
—
bit 15
bit 8
R/W-0(1)
U-0
—
U-0
ERASE
—
R/W-0(1)
U-0
R/W-0(1)
R/W-0(1)
R/W-0(1)
NVMOP<3:0>(2)
—
bit 7
bit 0
Legend:
SO = Settable only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
WR: Write Control bit
1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is
cleared by hardware once operation is complete
0 = Program or erase operation is complete and inactive
bit 14
WREN: Write Enable bit
1 = Enable Flash program/erase operations
0 = Inhibit Flash program/erase operations
bit 13
WRERR: Write Sequence Error Flag bit
1 = An improper program or erase sequence attempt or termination has occurred (bit is set
automatically on any set attempt of the WR bit)
0 = The program or erase operation completed normally
bit 12-7
Unimplemented: Read as ‘0’
bit 6
ERASE: Erase/Program Enable bit
1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command
0 = Perform the program operation specified by NVMOP<3:0> on the next WR command
bit 5-4
Unimplemented: Read as ‘0’
bit 3-0
NVMOP<3:0>: NVM Operation Select bits(2)
If ERASE = 1:
1111 = Memory bulk erase operation
1110 = Reserved
1101 = Erase General Segment
1100 = Erase Secure Segment
1011 = Reserved
0011 = No operation
0010 = Memory page erase operation
0001 = No operation
0000 = Erase a single Configuration register byte
If ERASE = 0:
1111 = No operation
1110 = Reserved
1101 = No operation
1100 = No operation
1011 = Reserved
0011 = Memory word program operation
0010 = No operation
0001 = Memory row program operation
0000 = Program a single Configuration register byte
Note 1:
2:
These bits can only be reset on POR.
All other combinations of NVMOP<3:0> are unimplemented.
 2009-2012 Microchip Technology Inc.
DS70593D-page 79
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 5-2:
NVMKEY: NON-VOLATILE MEMORY KEY REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
W-0
W-0
W-0
W-0
W-0
W-0
W-0
W-0
NVMKEY<7:0>
bit 7
bit 0
Legend:
SO = Settable only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7-0
NVMKEY<7:0>: Key Register (Write Only) bits
DS70593D-page 80
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
5.4.1
PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
4.
5.
The user can program one row of program Flash
memory at a time. To do this, it is necessary to erase
the 8-row erase page that contains the desired row.
The general process is:
1.
2.
3.
Read eight rows of program memory
(512 instructions) and store in data RAM.
Update the program data in RAM with the
desired new data.
Erase the block (see Example 5-1):
a) Set the NVMOP bits (NVMCON<3:0>) to
‘0010’ to configure for block erase. Set the
ERASE bit (NVMCON<6>) and the WREN
bit (NVMCON<14>).
b) Write the starting address of the page to be
erased into the TBLPAG and W registers.
c) Write 0x55 to NVMKEY.
d) Write 0xAA to NVMKEY.
e) Set the WR bit (NVMCON<15>). The erase
cycle begins and the CPU stalls for the
duration of the erase cycle. When the erase is
done, the WR bit is cleared automatically.
EXAMPLE 5-1:
For protection against accidental operations, the write
initiate sequence for NVMKEY must be used to allow
any erase or program operation to proceed. After the
programming command has been executed, the user
must wait for the programming time until programming
is complete. The two instructions following the start of
the programming sequence should be NOPs, as shown
in Example 5-3.
ERASING A PROGRAM MEMORY PAGE
; Set up NVMCON for block erase operation
MOV
#0x4042, W0
MOV
W0, NVMCON
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR), W0
MOV
W0, TBLPAG
MOV
#tbloffset(PROG_ADDR), W0
TBLWTL W0, [W0]
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
6.
Write the first 64 instructions from data RAM into
the program memory buffers (see Example 5-2).
Write the program block to Flash memory:
a) Set the NVMOP bits to ‘0001’ to configure
for row programming. Clear the ERASE bit
and set the WREN bit.
b) Write 0x55 to NVMKEY.
c) Write 0xAA to NVMKEY.
d) Set the WR bit. The programming cycle
begins and the CPU stalls for the duration of
the write cycle. When the write to Flash
memory is done, the WR bit is cleared
automatically.
Repeat steps 4 and 5, using the next available
64 instructions from the block in data RAM by
incrementing the value in TBLPAG, until all
512 instructions are written back to Flash memory.
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
 2009-2012 Microchip Technology Inc.
;
; Initialize NVMCON
;
;
;
;
;
;
;
;
;
;
;
;
Initialize PM Page Boundary SFR
Initialize in-page EA[15:0] pointer
Set base address of erase block
Block all interrupts with priority <7
for next 5 instructions
Write the 55 key
Write the AA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
DS70593D-page 81
dsPIC33FJXXXGPX06A/X08A/X10A
EXAMPLE 5-2:
LOADING THE WRITE BUFFERS
; Set up NVMCON for row programming operations
MOV
#0x4001, W0
;
MOV
W0, NVMCON
; Initialize NVMCON
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000, W0
;
MOV
W0, TBLPAG
; Initialize PM Page Boundary SFR
MOV
#0x6000, W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0, W2
;
MOV
#HIGH_BYTE_0, W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
; 1st_program_word
MOV
#LOW_WORD_1, W2
;
MOV
#HIGH_BYTE_1, W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
; 2nd_program_word
MOV
#LOW_WORD_2, W2
;
MOV
#HIGH_BYTE_2, W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
•
•
•
; 63rd_program_word
MOV
#LOW_WORD_31, W2
;
MOV
#HIGH_BYTE_31, W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
EXAMPLE 5-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
DS70593D-page 82
; Block all interrupts with priority <7
; for next 5 instructions
;
;
;
;
;
;
Write the 55 key
Write the AA key
Start the erase sequence
Insert two NOPs after the
erase command is asserted
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
6.0
A simplified block diagram of the Reset module is
shown in Figure 6-1.
RESET
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
8. “Reset” (DS70192) in the “dsPIC33F/
PIC24H Family Reference Manual”,
which is available from the Microchip web
site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
•
•
•
•
•
•
•
POR: Power-on Reset
BOR: Brown-out Reset
MCLR: Master Clear Pin Reset
SWR: RESET Instruction
WDT: Watchdog Timer Reset
TRAPR: Trap Conflict Reset
IOPUWR: Illegal Opcode and Uninitialized W
Register Reset
FIGURE 6-1:
Any active source of Reset will make the SYSRST
signal active. Many registers associated with the CPU
and peripherals are forced to a known Reset state.
Most registers are unaffected by a Reset; their status is
unknown on POR and unchanged by all other Resets.
Note:
Refer to the specific peripheral or CPU
section of this manual for register Reset
states.
All types of device Reset will set a corresponding status
bit in the RCON register to indicate the type of Reset
(see Register 6-1). A POR will clear all bits, except for
the POR bit (RCON<0>), that are set. The user can set
or clear any bit at any time during code execution. The
RCON bits only serve as status bits. Setting a particular
Reset status bit in software does not cause a device
Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in other sections
of this manual.
Note:
The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset will be meaningful.
RESET SYSTEM BLOCK DIAGRAM
RESET Instruction
Glitch Filter
MCLR
WDT
Module
Sleep or Idle
VDD
BOR
Internal
Regulator
SYSRST
VDD Rise
Detect
POR
Trap Conflict
Illegal Opcode
Uninitialized W Register
 2009-2012 Microchip Technology Inc.
DS70593D-page 83
dsPIC33FJXXXGPX06A/X08A/X10A
RCON: RESET CONTROL REGISTER(1)
REGISTER 6-1:
R/W-0
R/W-0
U-0
U-0
U-0
U-0
U-0
R/W-0
TRAPR
IOPUWR
—
—
—
—
—
VREGS(3)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-1
R/W-1
EXTR
SWR
SWDTEN(2)
WDTO
SLEEP
IDLE
BOR
POR
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14
IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit
1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an
Address Pointer caused a Reset
0 = An illegal opcode or uninitialized W Reset has not occurred
bit 13-9
Unimplemented: Read as ‘0’
bit 8
VREGS: Voltage Regulator Standby During Sleep bit(3)
1 = Voltage Regulator is active during Sleep mode
0 = Voltage Regulator goes into standby mode during Sleep
bit 7
EXTR: External Reset (MCLR) Pin bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6
SWR: Software Reset (Instruction) Flag bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5
SWDTEN: Software Enable/Disable of WDT bit(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4
WDTO: Watchdog Timer Time-out Flag bit
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
bit 3
SLEEP: Wake-up from Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
bit 2
IDLE: Wake-up from Idle Flag bit
1 = Device was in Idle mode
0 = Device was not in Idle mode
bit 1
BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred
0 = A Brown-out Reset has not occurred
Note 1:
2:
3:
All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
For dsPIC33FJ256GPX06A/X08A/X10A devices, this bit is unimplemented and reads back programmed
value.
DS70593D-page 84
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 6-1:
bit 0
RCON: RESET CONTROL REGISTER(1) (CONTINUED)
POR: Power-on Reset Flag bit
1 = A Power-on Reset has occurred
0 = A Power-on Reset has not occurred
Note 1:
2:
3:
All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
For dsPIC33FJ256GPX06A/X08A/X10A devices, this bit is unimplemented and reads back programmed
value.
 2009-2012 Microchip Technology Inc.
DS70593D-page 85
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 6-1:
RESET FLAG BIT OPERATION
Flag Bit
Setting Event
Clearing Event
TRAPR (RCON<15>)
Trap conflict event
POR, BOR
IOPUWR (RCON<14>)
Illegal opcode or uninitialized
W register access
POR, BOR
EXTR (RCON<7>)
MCLR Reset
POR
SWR (RCON<6>)
RESET instruction
POR, BOR
WDTO (RCON<4>)
WDT time-out
PWRSAV instruction, POR, BOR
SLEEP (RCON<3>)
PWRSAV #SLEEP instruction
POR, BOR
IDLE (RCON<2>)
PWRSAV #IDLE instruction
POR, BOR
BOR (RCON<1>)
BOR, POR
—
POR (RCON<0>)
POR
—
Note:
6.1
All Reset flag bits may be set or cleared by the user software.
Clock Source Selection at Reset
If clock switching is enabled, the system clock source at
device Reset is chosen, as shown in Table 6-2. If clock
switching is disabled, the system clock source is always
selected according to the oscillator Configuration bits.
Refer to Section 9.0 “Oscillator Configuration” for
further details.
TABLE 6-2:
OSCILLATOR SELECTION VS
TYPE OF RESET (CLOCK
SWITCHING ENABLED)
Reset Type
POR
BOR
MCLR
WDTR
Clock Source Determinant
Oscillator Configuration bits
(FNOSC<2:0>)
6.2
Device Reset Times
The Reset times for various types of device Reset are
summarized in Table 6-3. The system Reset signal,
SYSRST, is released after the POR and PWRT delay
times expire.
The time at which the device actually begins to execute
code also depends on the system oscillator delays,
which include the Oscillator Start-up Timer (OST) and
the PLL lock time. The OST and PLL lock times occur
in parallel with the applicable SYSRST delay times.
The FSCM delay determines the time at which the
FSCM begins to monitor the system clock source after
the SYSRST signal is released.
COSC Control bits
(OSCCON<14:12>)
SWR
DS70593D-page 86
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 6-3:
Reset Type
RESET DELAY TIMES FOR VARIOUS DEVICE RESETS
Clock Source
SYSRST Delay
System Clock
Delay
FSCM
Delay
See Notes
POR
EC, FRC, LPRC
ECPLL, FRCPLL
XT, HS, SOSC
XTPLL, HSPLL
TPOR + TSTARTUP + TRST
TPOR + TSTARTUP + TRST
TPOR + TSTARTUP + TRST
TPOR + TSTARTUP + TRST
—
TLOCK
TOST
TOST + TLOCK
—
TFSCM
TFSCM
TFSCM
1, 2, 3
1, 2, 3, 5, 6
1, 2, 3, 4, 6
1, 2, 3, 4, 5, 6
BOR
EC, FRC, LPRC
ECPLL, FRCPLL
XT, HS, SOSC
XTPLL, HSPLL
TSTARTUP + TRST
TSTARTUP + TRST
TSTARTUP + TRST
TSTARTUP + TRST
—
TLOCK
TOST
TOST + TLOCK
—
TFSCM
TFSCM
TFSCM
3
3, 5, 6
3, 4, 6
3, 4, 5, 6
MCLR
Any Clock
TRST
—
—
3
—
—
3
WDT
Any Clock
TRST
Software
Any Clock
TRST
—
—
3
—
—
3
Illegal Opcode
Any Clock
TRST
—
—
3
Uninitialized W
Any Clock
TRST
—
—
3
Trap Conflict
Any Clock
TRST
Note 1: TPOR = Power-on Reset delay (10 s nominal).
2: TSTARTUP = Conditional POR delay of 20 s nominal (if on-chip regulator is enabled) or 64 ms nominal
Power-up Timer delay (if regulator is disabled). TSTARTUP is also applied to all returns from powered-down
states, including waking from Sleep mode, only if the regulator is enabled.
3: TRST = Internal state Reset time (20 s nominal).
4: TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the
oscillator clock to the system.
5: TLOCK = PLL lock time (20 s nominal).
6: TFSCM = Fail-Safe Clock Monitor delay (100 s nominal).
6.2.1
POR AND LONG OSCILLATOR
START-UP TIMES
The oscillator start-up circuitry and its associated delay
timers are not linked to the device Reset delays that
occur at power-up. Some crystal circuits (especially
low-frequency crystals) have a relatively long start-up
time. Therefore, one or more of the following conditions
is possible after SYSRST is released:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
crystal oscillator is used).
• The PLL has not achieved a lock (if PLL is used).
The device will not begin to execute code until a valid
clock source has been released to the system.
Therefore, the oscillator and PLL start-up delays must
be considered when the Reset delay time must be
known.
6.2.2
FAIL-SAFE CLOCK MONITOR
(FSCM) AND DEVICE RESETS
If the FSCM is enabled, it begins to monitor the system
clock source when SYSRST is released. If a valid clock
source is not available at this time, the device
automatically switches to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
Trap Service Routine.
 2009-2012 Microchip Technology Inc.
6.2.2.1
FSCM Delay for Crystal and PLL
Clock Sources
When the system clock source is provided by a crystal
oscillator and/or the PLL, a small delay, TFSCM, is automatically inserted after the POR and PWRT delay
times. The FSCM does not begin to monitor the system
clock source until this delay expires. The FSCM delay
time is nominally 500 s and provides additional time
for the oscillator and/or PLL to stabilize. In most cases,
the FSCM delay prevents an oscillator failure trap at a
device Reset when the PWRT is disabled.
6.3
Special Function Register Reset
States
Most of the Special Function Registers (SFRs) associated with the CPU and peripherals are reset to a
particular value at a device Reset. The SFRs are
grouped by their peripheral or CPU function and their
Reset values are specified in each section of this manual.
The Reset value for each SFR does not depend on the
type of Reset, with the exception of two registers. The
Reset value for the Reset Control register, RCON,
depends on the type of device Reset. The Reset value
for the Oscillator Control register, OSCCON, depends
on the type of Reset and the programmed values of the
oscillator Configuration bits in the FOSC Configuration
register.
DS70593D-page 87
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 88
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
7.0
INTERRUPT CONTROLLER
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to
Section 6. “Interrupts” (DS70184) in
the
“dsPIC33F/PIC24H
Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The dsPIC33FJXXXGPX06A/X08A/X10A interrupt
controller reduces the numerous peripheral interrupt
request signals to a single interrupt request signal to
the dsPIC33FJXXXGPX06A/X08A/X10A CPU. It has
the following features:
• Up to eight processor exceptions and software
traps
• Seven user-selectable priority levels
• Interrupt Vector Table (IVT) with up to 118 vectors
• A unique vector for each interrupt or exception
source
• Fixed priority within a specified user priority level
• Alternate Interrupt Vector Table (AIVT) for debug
support
• Fixed interrupt entry and return latencies
7.1
7.1.1
ALTERNATE VECTOR TABLE
The Alternate Interrupt Vector Table (AIVT) is located
after the IVT, as shown in Figure 7-1. Access to the
AIVT is provided by the ALTIVT control bit
(INTCON2<15>). If the ALTIVT bit is set, all interrupt
and exception processes use the alternate vectors
instead of the default vectors. The alternate vectors are
organized in the same manner as the default vectors.
The AIVT supports debugging by providing a means to
switch between an application and a support
environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time. If the AIVT is not
needed, the AIVT should be programmed with the
same addresses used in the IVT.
7.2
Reset Sequence
A device Reset is not a true exception because the
interrupt controller is not involved in the Reset process.
The
dsPIC33FJXXXGPX06A/X08A/X10A
device
clears its registers in response to a Reset, which forces
the PC to zero. The digital signal controller then begins
program execution at location 0x000000. The user
programs a GOTO instruction at the Reset address
which redirects program execution to the appropriate
start-up routine.
Note:
Any unimplemented or unused vector
locations in the IVT and AIVT should be
programmed with the address of a default
interrupt handler routine that contains a
RESET instruction.
Interrupt Vector Table
The Interrupt Vector Table is shown in Figure 7-1. The
IVT resides in program memory, starting at location
000004h. The IVT contains 126 vectors consisting of
eight non-maskable trap vectors plus up to 118 sources
of interrupt. In general, each interrupt source has its
own vector. Each interrupt vector contains a 24-bit wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
Interrupt vectors are prioritized in terms of their natural
priority; this priority is linked to their position in the
vector table. All other things being equal, lower
addresses have a higher natural priority. For example,
the interrupt associated with vector 0 will take priority
over interrupts at any other vector address.
dsPIC33FJXXXGPX06A/X08A/X10A devices implement up to 67 unique interrupts and five non-maskable
traps. These are summarized in Table 7-1 and
Table 7-2.
 2009-2012 Microchip Technology Inc.
DS70593D-page 89
dsPIC33FJXXXGPX06A/X08A/X10A
Decreasing Natural Order Priority
FIGURE 7-1:
Note 1:
DS70593D-page 90
dsPIC33FJXXXGPX06A/X08A/X10A INTERRUPT VECTOR TABLE
Reset – GOTO Instruction
Reset – GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
DMA Error Trap Vector
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
DMA Error Trap Vector
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Start of Code
0x000000
0x000002
0x000004
0x000014
0x00007C
0x00007E
0x000080
Interrupt Vector Table (IVT)(1)
0x0000FC
0x0000FE
0x000100
0x000102
0x000114
Alternate Interrupt Vector Table (AIVT)(1)
0x00017C
0x00017E
0x000180
0x0001FE
0x000200
See Table 7-1 for the list of implemented interrupt vectors.
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 7-1:
INTERRUPT VECTORS
Vector
Number
Interrupt
Request (IRQ)
Number
IVT Address
AIVT Address
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
0x000014
0x000016
0x000018
0x00001A
0x00001C
0x00001E
0x000020
0x000022
0x000024
0x000026
0x000028
0x00002A
0x00002C
0x00002E
0x000030
0x000032
0x000034
0x000036
0x000038
0x00003A
0x00003C
0x00003E
0x000040
0x000042
0x000044
0x000046
0x000048
0x00004A
0x00004C
0x00004E
0x000050
0x000052
0x000054
0x000056
0x000058
0x00005A
0x00005C
0x00005E
0x000060
0x000062
0x000064
0x000066
0x000068
0x00006A
0x00006C
0x00006E
0x000114
0x000116
0x000118
0x00011A
0x00011C
0x00011E
0x000120
0x000122
0x000124
0x000126
0x000128
0x00012A
0x00012C
0x00012E
0x000130
0x000132
0x000134
0x000136
0x000138
0x00013A
0x00013C
0x00013E
0x000140
0x000142
0x000144
0x000146
0x000148
0x00014A
0x00014C
0x00014E
0x000150
0x000152
0x000154
0x000156
0x000158
0x00015A
0x00015C
0x00015E
0x000160
0x000162
0x000164
0x000166
0x000168
0x00016A
0x00016C
0x00016E
 2009-2012 Microchip Technology Inc.
Interrupt Source
INT0 – External Interrupt 0
IC1 – Input Capture 1
OC1 – Output Compare 1
T1 – Timer1
DMA0 – DMA Channel 0
IC2 – Input Capture 2
OC2 – Output Compare 2
T2 – Timer2
T3 – Timer3
SPI1E – SPI1 Error
SPI1 – SPI1 Transfer Done
U1RX – UART1 Receiver
U1TX – UART1 Transmitter
ADC1 – ADC 1
DMA1 – DMA Channel 1
Reserved
SI2C1 – I2C1 Slave Events
MI2C1 – I2C1 Master Events
Reserved
Change Notification Interrupt
INT1 – External Interrupt 1
ADC2 – ADC 2
IC7 – Input Capture 7
IC8 – Input Capture 8
DMA2 – DMA Channel 2
OC3 – Output Compare 3
OC4 – Output Compare 4
T4 – Timer4
T5 – Timer5
INT2 – External Interrupt 2
U2RX – UART2 Receiver
U2TX – UART2 Transmitter
SPI2E – SPI2 Error
SPI1 – SPI1 Transfer Done
C1RX – ECAN1 Receive Data Ready
C1 – ECAN1 Event
DMA3 – DMA Channel 3
IC3 – Input Capture 3
IC4 – Input Capture 4
IC5 – Input Capture 5
IC6 – Input Capture 6
OC5 – Output Compare 5
OC6 – Output Compare 6
OC7 – Output Compare 7
OC8 – Output Compare 8
Reserved
DS70593D-page 91
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 7-1:
INTERRUPT VECTORS (CONTINUED)
Vector
Number
Interrupt
Request (IRQ)
Number
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80-125
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72-117
TABLE 7-2:
IVT Address
AIVT Address
0x000070
0x000170
0x000072
0x000172
0x000074
0x000174
0x000076
0x000176
0x000078
0x000178
0x00007A
0x00017A
0x00007C
0x00017C
0x00007E
0x00017E
0x000080
0x000180
0x000082
0x000182
0x000084
0x000184
0x000086
0x000186
0x000088
0x000188
0x00008A
0x00018A
0x00008C
0x00018C
0x00008E
0x00018E
0x000090
0x000190
0x000092
0x000192
0x000094
0x000194
0x000096
0x000196
0x000098
0x000198
0x00009A
0x00019A
0x00009C
0x00019C
0x00009E
0x00019E
0x0000A0
0x0001A0
0x0000A2
0x0001A2
0x0000A4-0x0000FE 0x0001A4-0x0001FE
Interrupt Source
DMA4 – DMA Channel 4
T6 – Timer6
T7 – Timer7
SI2C2 – I2C2 Slave Events
MI2C2 – I2C2 Master Events
T8 – Timer8
T9 – Timer9
INT3 – External Interrupt 3
INT4 – External Interrupt 4
C2RX – ECAN2 Receive Data Ready
C2 – ECAN2 Event
Reserved
Reserved
DCIE – DCI Error
DCID – DCI Transfer Done
DMA5 – DMA Channel 5
Reserved
Reserved
Reserved
U1E – UART1 Error
U2E – UART2 Error
Reserved
DMA6 – DMA Channel 6
DMA7 – DMA Channel 7
C1TX – ECAN1 Transmit Data Request
C2TX – ECAN2 Transmit Data Request
Reserved
TRAP VECTORS
Vector Number
IVT Address
AIVT Address
Trap Source
0
0x000004
0x000104
Reserved
1
0x000006
0x000106
Oscillator Failure
2
0x000008
0x000108
Address Error
3
0x00000A
0x00010A
Stack Error
4
0x00000C
0x00010C
Math Error
5
0x00000E
0x00010E
DMA Error Trap
6
0x000010
0x000110
Reserved
7
0x000012
0x000112
Reserved
DS70593D-page 92
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
7.3
Interrupt Control and Status
Registers
dsPIC33FJXXXGPX06A/X08A/X10A devices implement a total of 30 registers for the interrupt controller:
•
•
•
•
•
•
INTCON1
INTCON2
IFS0 through IFS4
IEC0 through IEC4
IPC0 through IPC17
INTTREG
Global interrupt control functions are controlled from
INTCON1 and INTCON2. INTCON1 contains the
Interrupt Nesting Disable (NSTDIS) bit as well as the
control and status flags for the processor trap sources.
The INTCON2 register controls the external interrupt
request signal behavior and the use of the Alternate
Interrupt Vector Table.
The IFS registers maintain all of the interrupt request
flags. Each source of interrupt has a Status bit, which is
set by the respective peripherals or external signal and
is cleared via software.
The IEC registers maintain all of the interrupt enable
bits. These control bits are used to individually enable
interrupts from the peripherals or external signals.
The IPC registers are used to set the interrupt priority
level for each source of interrupt. Each user interrupt
source can be assigned to one of eight priority levels.
The INTTREG register contains the associated
interrupt vector number and the new CPU interrupt
priority level, which are latched into vector number
(VECNUM<6:0>) and Interrupt level bits (ILR<3:0>) in
the INTTREG register. The new interrupt priority level
is the priority of the pending interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the same sequence that they are
listed in Table 7-1. For example, the INT0 (External
Interrupt 0) is shown as having vector number 8 and a
natural order priority of 0. Thus, the INT0IF bit is found
in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP
bits in the first position of IPC0 (IPC0<2:0>).
Although they are not specifically part of the interrupt
control hardware, two of the CPU Control registers
contain bits that control interrupt functionality. The CPU
STATUS register, SR, contains the IPL<2:0> bits
(SR<7:5>). These bits indicate the current CPU
interrupt priority level. The user can change the current
CPU priority level by writing to the IPL bits.
The CORCON register contains the IPL3 bit which,
together with IPL<2:0>, also indicates the current CPU
priority level. IPL3 is a read-only bit so that trap events
cannot be masked by the user software.
All Interrupt registers are described in Register 7-1
through Register 7-32.
 2009-2012 Microchip Technology Inc.
DS70593D-page 93
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-1:
SR: CPU STATUS REGISTER(1)
R-0
R-0
R/C-0
R/C-0
R-0
R/C-0
R -0
R/W-0
OA
OB
SA
SB
OAB
SAB
DA
DC
bit 15
bit 8
R/W-0(3)
IPL2
R/W-0(3)
(2)
IPL1
(2)
R/W-0(3)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
IPL0(2)
RA
N
OV
Z
C
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
U = Unimplemented bit, read as ‘0’
S = Set only bit
W = Writable bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
IPL<2:0>: CPU Interrupt Priority Level Status bits(2)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 7-5
Note 1:
2:
3:
For complete register details, see Register 3-1.
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.
REGISTER 7-2:
CORCON: CORE CONTROL REGISTER(1)
U-0
—
bit 15
U-0
—
R/W-0
SATA
bit 7
R/W-0
SATB
Note 1:
2:
R/W-0
US
R/W-0
EDT
R-0
R-0
DL<2:0>
R-0
bit 8
Legend:
R = Readable bit
0’ = Bit is cleared
bit 3
U-0
—
R/W-1
SATDW
R/W-0
ACCSAT
C = Clear only bit
W = Writable bit
‘x = Bit is unknown
R/C-0
IPL3(2)
R/W-0
PSV
R/W-0
RND
R/W-0
IF
bit 0
-n = Value at POR
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
For complete register details, see Register 3-2.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
DS70593D-page 94
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-3:
INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
NSTDIS
OVAERR
OVBERR
COVAERR
COVBERR
OVATE
OVBTE
COVTE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
SFTACERR
DIV0ERR
DMACERR
MATHERR
ADDRERR
STKERR
OSCFAIL
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14
OVAERR: Accumulator A Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13
OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12
COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11
COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10
OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap disabled
bit 9
OVBTE: Accumulator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap disabled
bit 8
COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B enabled
0 = Trap disabled
bit 7
SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was not caused by an invalid accumulator shift
bit 6
DIV0ERR: Arithmetic Error Status bit
1 = Math error trap was caused by a divide by zero
0 = Math error trap was not caused by a divide by zero
bit 5
DMACERR: DMA Controller Error Status bit
1 = DMA controller error trap has occurred
0 = DMA controller error trap has not occurred
bit 4
MATHERR: Arithmetic Error Status bit
1 = Math error trap has occurred
0 = Math error trap has not occurred
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 95
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-3:
INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
bit 3
ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
bit 2
STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1
OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0
Unimplemented: Read as ‘0’
DS70593D-page 96
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-4:
INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0
R-0
U-0
U-0
U-0
U-0
U-0
U-0
ALTIVT
DISI
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
INT4EP
INT3EP
INT2EP
INT1EP
INT0EP
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ALTIVT: Enable Alternate Interrupt Vector Table bit
1 = Use alternate vector table
0 = Use standard (default) vector table
bit 14
DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-5
Unimplemented: Read as ‘0’
bit 4
INT4EP: External Interrupt 4 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 3
INT3EP: External Interrupt 3 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 2
INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1
INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0
INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 97
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
DMA1IF
AD1IF
U1TXIF
U1RXIF
SPI1IF
SPI1EIF
T3IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
T2IF
OC2IF
IC2IF
DMA01IF
T1IF
OC1IF
IC1IF
INT0IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14
DMA1IF: DMA Channel 1 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13
AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10
SPI1IF: SPI1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9
SPI1EIF: SPI1 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8
T3IF: Timer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
T2IF: Timer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
IC2IF: Input Capture Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
DMA01IF: DMA Channel 0 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
T1IF: Timer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70593D-page 98
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)
bit 2
OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
 2009-2012 Microchip Technology Inc.
DS70593D-page 99
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-6:
IFS1: INTERRUPT FLAG STATUS REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
DMA21IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
IC8IF
IC7IF
AD2IF
INT1IF
CNIF
—
MI2C1IF
SI2C1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
U2TXIF: UART2 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14
U2RXIF: UART2 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13
INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
T5IF: Timer5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
T4IF: Timer4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10
OC4IF: Output Compare Channel 4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9
OC3IF: Output Compare Channel 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8
DMA21IF: DMA Channel 2 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
IC8IF: Input Capture Channel 8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
IC7IF: Input Capture Channel 7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
AD2IF: ADC2 Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70593D-page 100
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-6:
IFS1: INTERRUPT FLAG STATUS REGISTER 1 (CONTINUED)
bit 3
CNIF: Input Change Notification Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
Unimplemented: Read as ‘0’
bit 1
MI2C1IF: I2C1 Master Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
 2009-2012 Microchip Technology Inc.
DS70593D-page 101
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-7:
IFS2: INTERRUPT FLAG STATUS REGISTER 2
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
T6IF
DMA4IF
—
OC8IF
OC7IF
OC6IF
OC5IF
IC6IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
IC5IF
IC4IF
IC3IF
DMA3IF
C1IF
C1RXIF
SPI2IF
SPI2EIF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
T6IF: Timer6 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 14
DMA4IF: DMA Channel 4 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 13
Unimplemented: Read as ‘0’
bit 12
OC8IF: Output Compare Channel 8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
OC7IF: Output Compare Channel 7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10
OC6IF: Output Compare Channel 6 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9
OC5IF: Output Compare Channel 5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8
IC6IF: Input Capture Channel 6 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
IC5IF: Input Capture Channel 5 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
IC4IF: Input Capture Channel 4 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
IC3IF: Input Capture Channel 3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
DMA3IF: DMA Channel 3 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
C1IF: ECAN1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70593D-page 102
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-7:
IFS2: INTERRUPT FLAG STATUS REGISTER 2 (CONTINUED)
bit 2
C1RXIF: ECAN1 Receive Data Ready Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
SPI2IF: SPI2 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
SPI2EIF: SPI2 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
 2009-2012 Microchip Technology Inc.
DS70593D-page 103
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-8:
IFS3: INTERRUPT FLAG STATUS REGISTER 3
U-0
U-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
—
—
DMA5IF
DCIIF
DCIEIF
—
—
C2IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
C2RXIF
INT4IF
INT3IF
T9IF
T8IF
MI2C2IF
SI2C2IF
T7IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
DMA5IF: DMA Channel 5 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
DCIIF: DCI Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
DCIEIF: DCI Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10-9
Unimplemented: Read as ‘0’
bit 8
C2IF: ECAN2 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
C2RXIF: ECAN2 Receive Data Ready Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
INT4IF: External Interrupt 4 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
INT3IF: External Interrupt 3 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
T9IF: Timer9 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
T8IF: Timer8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
MI2C2IF: I2C2 Master Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
SI2C2IF: I2C2 Slave Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
T7IF: Timer7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70593D-page 104
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-9:
IFS4: INTERRUPT FLAG STATUS REGISTER 4
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
C2TXIF
C1TXIF
DMA7IF
DMA6IF
—
U2EIF
U1EIF
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-8
Unimplemented: Read as ‘0’
bit 7
C2TXIF: ECAN2 Transmit Data Request Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
C1TXIF: ECAN1 Transmit Data Request Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
DMA7IF: DMA Channel 7 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
DMA6IF: DMA Channel 6 Data Transfer Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
Unimplemented: Read as ‘0’
bit 2
U2EIF: UART2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 1
U1EIF: UART1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
Unimplemented: Read as ‘0’
 2009-2012 Microchip Technology Inc.
DS70593D-page 105
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-10:
IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
DMA1IE
AD1IE
U1TXIE
U1RXIE
SPI1IE
SPI1EIE
T3IE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
T2IE
OC2IE
IC2IE
DMA0IE
T1IE
OC1IE
IC1IE
INT0IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14
DMA1IE: DMA Channel 1 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13
AD1IE: ADC1 Conversion Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12
U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11
U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10
SPI1IE: SPI1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9
SPI1EIE: SPI1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8
T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7
T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
IC2IE: Input Capture Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
DMA0IE: DMA Channel 0 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3
T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70593D-page 106
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-10:
IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED)
bit 2
OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1
IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 107
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-11:
IEC1: INTERRUPT ENABLE CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
DMA2IE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
IC8IE
IC7IE
AD2IE
INT1IE
CNIE
—
MI2C1IE
SI2C1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
U2TXIE: UART2 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 14
U2RXIE: UART2 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13
INT2IE: External Interrupt 2 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12
T5IE: Timer5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11
T4IE: Timer4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10
OC4IE: Output Compare Channel 4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9
OC3IE: Output Compare Channel 3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8
DMA2IE: DMA Channel 2 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7
IC8IE: Input Capture Channel 8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
IC7IE: Input Capture Channel 7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
AD2IE: ADC2 Conversion Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
INT1IE: External Interrupt 1 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70593D-page 108
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-11:
IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 (CONTINUED)
bit 3
CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2
Unimplemented: Read as ‘0’
bit 1
MI2C1IE: I2C1 Master Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
SI2C1IE: I2C1 Slave Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 109
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-12:
IEC2: INTERRUPT ENABLE CONTROL REGISTER 2
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
T6IE
DMA4IE
—
OC8IE
OC7IE
OC6IE
OC5IE
IC6IE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
IC5IE
IC4IE
IC3IE
DMA3IE
C1IE
C1RXIE
SPI2IE
SPI2EIE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
T6IE: Timer6 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 14
DMA4IE: DMA Channel 4 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 13
Unimplemented: Read as ‘0’
bit 12
OC8IE: Output Compare Channel 8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11
OC7IE: Output Compare Channel 7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10
OC6IE: Output Compare Channel 6 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9
OC5IE: Output Compare Channel 5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8
IC6IE: Input Capture Channel 6 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7
IC5IE: Input Capture Channel 5 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
IC4IE: Input Capture Channel 4 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
IC3IE: Input Capture Channel 3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
DMA3IE: DMA Channel 3 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3
C1IE: ECAN1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70593D-page 110
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-12:
IEC2: INTERRUPT ENABLE CONTROL REGISTER 2 (CONTINUED)
bit 2
C1RXIE: ECAN1 Receive Data Ready Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1
SPI2IE: SPI2 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
SPI2EIE: SPI2 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 111
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-13:
IEC3: INTERRUPT ENABLE CONTROL REGISTER 3
U-0
U-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
—
—
DMA5IE
DCIIE
DCIEIE
—
—
C2IE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
C2RXIE
INT4IE
INT3IE
T9IE
T8IE
MI2C2IE
SI2C2IE
T7IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
DMA5IE: DMA Channel 5 Data Transfer Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12
DCIIE: DCI Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11
DCIEIE: DCI Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10-9
Unimplemented: Read as ‘0’
bit 8
C2IE: ECAN2 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7
C2RXIE: ECAN2 Receive Data Ready Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
INT4IE: External Interrupt 4 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
INT3IE: External Interrupt 3 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
T9IE: Timer9 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3
T8IE: Timer8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2
MI2C2IE: I2C2 Master Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1
SI2C2IE: I2C2 Slave Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
T7IE: Timer7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70593D-page 112
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-14:
IEC4: INTERRUPT ENABLE CONTROL REGISTER 4
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
C2TXIE
C1TXIE
DMA7IE
DMA6IE
—
U2EIE
U1EIE
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7
C2TXIE: ECAN2 Transmit Data Request Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
C1TXIE: ECAN1 Transmit Data Request Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
DMA7IE: DMA Channel 7 Data Transfer Complete Enable Status bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
DMA6IE: DMA Channel 6 Data Transfer Complete Enable Status bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3
Unimplemented: Read as ‘0’
bit 2
U2EIE: UART2 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1
U1EIE: UART1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
Unimplemented: Read as ‘0’
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 113
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-15:
U-0
IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
R/W-1
—
R/W-0
R/W-0
T1IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC1IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
IC1IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
INT0IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 114
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-16:
U-0
IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
R/W-1
—
R/W-0
R/W-0
T2IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC2IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
IC2IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
DMA0IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
DMA0IP<2:0>: DMA Channel 0 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 115
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-17:
U-0
IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
R/W-1
—
R/W-0
R/W-0
U1RXIP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
SPI1IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
SPI1EIP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
T3IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
SPI1IP<2:0>: SPI1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 116
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-18:
IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-1
R/W-0
R/W-0
DMA1IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
AD1IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
U1TXIP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-8
DMA1IP<2:0>: DMA Channel 1 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 117
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-19:
U-0
IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
R/W-1
—
R/W-0
R/W-0
CNIP<2:0>
U-0
U-0
U-0
U-0
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
MI2C1IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
SI2C1IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
CNIP<2:0>: Change Notification Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11-7
Unimplemented: Read as ‘0’
bit 6-4
MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 118
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-20:
U-0
IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
R/W-1
—
R/W-0
R/W-0
IC8IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
IC7IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
AD2IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
INT1IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
AD2IP<2:0>: ADC2 Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 119
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-21:
U-0
IPC6: INTERRUPT PRIORITY CONTROL REGISTER 6
R/W-1
—
R/W-0
R/W-0
T4IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC4IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
OC3IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
DMA2IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T4IP<2:0>: Timer4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
DMA2IP<2:0>: DMA Channel 2 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 120
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-22:
U-0
IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
R/W-1
—
R/W-0
R/W-0
U2TXIP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
U2RXIP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
INT2IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
T5IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T5IP<2:0>: Timer5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 121
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-23:
U-0
IPC8: INTERRUPT PRIORITY CONTROL REGISTER 8
R/W-1
—
R/W-0
R/W-0
C1IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
C1RXIP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
SPI2IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
SPI2EIP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
C1IP<2:0>: ECAN1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
C1RXIP<2:0>: ECAN1 Receive Data Ready Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SPI2IP<2:0>: SPI2 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
SPI2EIP<2:0>: SPI2 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 122
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-24:
U-0
IPC9: INTERRUPT PRIORITY CONTROL REGISTER 9
R/W-1
—
R/W-0
R/W-0
IC5IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
IC4IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
IC3IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
DMA3IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
DMA3IP<2:0>: DMA Channel 3 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 123
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-25:
U-0
IPC10: INTERRUPT PRIORITY CONTROL REGISTER 10
R/W-1
—
R/W-0
R/W-0
OC7IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC6IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
OC5IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
IC6IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 124
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-26:
U-0
IPC11: INTERRUPT PRIORITY CONTROL REGISTER 11
R/W-1
—
R/W-0
R/W-0
T6IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
DMA4IP<2:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-1
R/W-0
R/W-0
OC8IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T6IP<2:0>: Timer6 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
DMA4IP<2:0>: DMA Channel 4 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-3
Unimplemented: Read as ‘0’
bit 2-0
OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 125
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-27:
U-0
IPC12: INTERRUPT PRIORITY CONTROL REGISTER 12
R/W-1
—
R/W-0
R/W-0
T8IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
MI2C2IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
SI2C2IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
T7IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T8IP<2:0>: Timer8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
MI2C2IP<2:0>: I2C2 Master Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SI2C2IP<2:0>: I2C2 Slave Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T7IP<2:0>: Timer7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 126
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-28:
U-0
IPC13: INTERRUPT PRIORITY CONTROL REGISTER 13
R/W-1
—
R/W-0
R/W-0
C2RXIP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
INT4IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
INT3IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
T9IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
C2RXIP<2:0>: ECAN2 Receive Data Ready Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
INT4IP<2:0>: External Interrupt 4 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
INT3IP<2:0>: External Interrupt 3 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T9IP<2:0>: Timer9 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 127
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-29:
U-0
IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14
R/W-1
—
R/W-0
R/W-0
DCIEIP<2:0>
U-0
U-0
U-0
U-0
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-1
R/W-0
R/W-0
C2IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
DCIEIP<2:0>: DCI Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11-3
Unimplemented: Read as ‘0’
bit 2-0
C2IP<2:0>: ECAN2 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70593D-page 128
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
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REGISTER 7-30:
IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
DMA5IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
DCIIP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
DMA5IP<2:0>: DMA Channel 5 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
DCIIP<2:0>: DCI Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 129
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-31:
IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-1
R/W-0
R/W-0
U2EIP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
U1EIP<2:0>
R/W-0
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-11
Unimplemented: Read as ‘0’
bit 10-8
U2EIP<2:0>: UART2 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
U1EIP<2:0>: UART1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
DS70593D-page 130
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-32:
U-0
IPC17: INTERRUPT PRIORITY CONTROL REGISTER 17
R/W-1
—
R/W-0
R/W-0
C2TXIP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
C1TXIP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
DMA7IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
DMA6IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
C2TXIP<2:0>: ECAN2 Transmit Data Request Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
C1TXIP<2:0>: ECAN1 Transmit Data Request Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
DMA7IP<2:0>: DMA Channel 7 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
DMA6IP<2:0>: DMA Channel 6 Data Transfer Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
 2009-2012 Microchip Technology Inc.
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dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 7-33:
INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0
U-0
U-0
U-0
—
—
—
—
R-0
R-0
R-0
R-0
ILR<3:0>
bit 15
bit 8
U-0
R-0
R-0
—
R-0
R-0
R-0
R-0
R-0
VECNUM<6:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
ILR<3:0>: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
•
•
•
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7
Unimplemented: Read as ‘0’
bit 6-0
VECNUM<6:0>: Vector Number of Pending Interrupt bits
0111111 = Interrupt Vector pending is number 135
•
•
•
0000001 = Interrupt Vector pending is number 9
0000000 = Interrupt Vector pending is number 8
DS70593D-page 132
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
7.4
Interrupt Setup Procedures
7.4.1
INITIALIZATION
To configure an interrupt source:
1.
2.
Set the NSTDIS bit (INTCON1<15>) if nested
interrupts are not desired.
Select the user-assigned priority level for the
interrupt source by writing the control bits in the
appropriate IPCx register. The priority level will
depend on the specific application and type of
interrupt source. If multiple priority levels are not
desired, the IPCx register control bits for all
enabled interrupt sources may be programmed
to the same non-zero value.
Note:
3.
4.
At a device Reset, the IPCx registers are
initialized, such that all user interrupt
sources are assigned to priority level 4.
Clear the interrupt flag status bit associated with
the peripheral in the associated IFSx register.
Enable the interrupt source by setting the
interrupt enable control bit associated with the
source in the appropriate IECx register.
7.4.2
7.4.3
TRAP SERVICE ROUTINE
A Trap Service Routine (TSR) is coded like an ISR,
except that the appropriate trap status flag in the
INTCON1 register must be cleared to avoid re-entry
into the TSR.
7.4.4
INTERRUPT DISABLE
All user interrupts can be disabled using the following
procedure:
1.
2.
Push the current SR value onto the software
stack using the PUSH instruction.
Force the CPU to priority level 7 by inclusive
ORing the value OEh with SRL.
To enable user interrupts, the POP instruction may be
used to restore the previous SR value.
Note that only user interrupts with a priority level of 7 or
less can be disabled. Trap sources (level 8-level 15)
cannot be disabled.
The DISI instruction provides a convenient way to
disable interrupts of priority levels 1-6 for a fixed period
of time. Level 7 interrupt sources are not disabled by
the DISI instruction.
INTERRUPT SERVICE ROUTINE
The method that is used to declare an ISR and initialize
the IVT with the correct vector address will depend on
the programming language (i.e., C or assembler) and
the language development toolsuite that is used to
develop the application. In general, the user must clear
the interrupt flag in the appropriate IFSx register for the
source of interrupt that the ISR handles. Otherwise, the
ISR will be re-entered immediately after exiting the
routine. If the ISR is coded in assembly language, it
must be terminated using a RETFIE instruction to
unstack the saved PC value, SRL value and old CPU
priority level.
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DS70593D-page 133
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 134
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
8.0
DIRECT MEMORY ACCESS
(DMA)
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
22. “Direct Memory Access (DMA)”
(DS70182) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Direct Memory Access (DMA) is a very efficient
mechanism of copying data between peripheral SFRs
(e.g., UART Receive register, Input Capture 1 buffer),
and buffers or variables stored in RAM, with minimal
CPU intervention. The DMA controller can
automatically copy entire blocks of data without
requiring the user software to read or write the
peripheral Special Function Registers (SFRs) every
time a peripheral interrupt occurs. The DMA controller
uses a dedicated bus for data transfers and therefore,
does not steal cycles from the code execution flow of
the CPU. To exploit the DMA capability, the
corresponding user buffers or variables must be
located in DMA RAM.
The dsPIC33FJXXXGPX06A/X08A/X10A peripherals
that can utilize DMA are listed in Table 8-1 along with
their associated Interrupt Request (IRQ) numbers.
TABLE 8-1:
PERIPHERALS WITH DMA
SUPPORT
Peripheral
INT0
Input Capture 1
Input Capture 2
Output Compare 1
Output Compare 2
Timer2
Timer3
SPI1
SPI2
UART1 Reception
UART1 Transmission
UART2 Reception
UART2 Transmission
ADC1
ADC2
DCI
ECAN1 Reception
ECAN1 Transmission
ECAN2 Reception
ECAN2 Transmission
IRQ Number
0
1
5
2
6
7
8
10
33
11
12
30
31
13
21
60
34
70
55
71
The DMA controller features eight identical data
transfer channels.
Each channel has its own set of control and status registers. Each DMA channel can be configured to copy
data either from buffers stored in dual port DMA RAM
to peripheral SFRs, or from peripheral SFRs to buffers
in DMA RAM.
The DMA controller supports the following features:
• Word or byte sized data transfers
• Transfers from peripheral to DMA RAM or DMA
RAM to peripheral
• Indirect Addressing of DMA RAM locations with or
without automatic post-increment
• Peripheral Indirect Addressing – In some
peripherals, the DMA RAM read/write addresses
may be partially derived from the peripheral
• One-Shot Block Transfers – Terminating DMA
transfer after one block transfer
• Continuous Block Transfers – Reloading DMA
RAM buffer start address after every block
transfer is complete
• Ping-Pong Mode – Switching between two DMA
RAM start addresses between successive block
transfers, thereby filling two buffers alternately
• Automatic or manual initiation of block transfers
• Each channel can select from 20 possible
sources of data sources or destinations
For each DMA channel, a DMA interrupt request is
generated when a block transfer is complete.
Alternatively, an interrupt can be generated when half
of the block has been filled.
 2009-2012 Microchip Technology Inc.
DS70593D-page 135
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 8-1:
TOP LEVEL SYSTEM ARCHITECTURE USING A DEDICATED TRANSACTION BUS
Peripheral Indirect Address
DMA
Control
DMA Controller
DMA RAM
SRAM
DMA
Ready
Peripheral 3
DMA
Channels
PORT 1 PORT 2
SRAM X-Bus
CPU
DMA
DMA DS Bus
CPU Peripheral DS Bus
CPU
Non-DMA
Ready
Peripheral
CPU
DMA
DMA
Ready
Peripheral 1
CPU
DMA
DMA
Ready
Peripheral 2
Note: CPU and DMA address buses are not shown for clarity.
8.1
DMAC Registers
Each DMAC Channel x (x = 0, 1, 2, 3, 4, 5, 6 or 7)
contains the following registers:
• A 16-bit DMA Channel Control register
(DMAxCON)
• A 16-bit DMA Channel IRQ Select register
(DMAxREQ)
• A 16-bit DMA RAM Primary Start Address Offset
register (DMAxSTA)
• A 16-bit DMA RAM Secondary Start Address
Offset register (DMAxSTB)
• A 16-bit DMA Peripheral Address register
(DMAxPAD)
• A 10-bit DMA Transfer Count register (DMAxCNT)
An additional pair of status registers, DMACS0 and
DMACS1, are common to all DMAC channels.
DS70593D-page 136
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-1:
DMAxCON: DMA CHANNEL x CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
CHEN
SIZE
DIR
HALF
NULLW
—
—
—
bit 15
bit 8
U-0
U-0
—
—
R/W-0
R/W-0
AMODE<1:0>
U-0
U-0
—
—
R/W-0
R/W-0
MODE<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
CHEN: Channel Enable bit
1 = Channel enabled
0 = Channel disabled
bit 14
SIZE: Data Transfer Size bit
1 = Byte
0 = Word
bit 13
DIR: Transfer Direction bit (source/destination bus select)
1 = Read from DMA RAM address, write to peripheral address
0 = Read from peripheral address, write to DMA RAM address
bit 12
HALF: Early Block Transfer Complete Interrupt Select bit
1 = Initiate block transfer complete interrupt when half of the data has been moved
0 = Initiate block transfer complete interrupt when all of the data has been moved
bit 11
NULLW: Null Data Peripheral Write Mode Select bit
1 = Null data write to peripheral in addition to DMA RAM write (DIR bit must also be clear)
0 = Normal operation
bit 10-6
Unimplemented: Read as ‘0’
bit 5-4
AMODE<1:0>: DMA Channel Operating Mode Select bits
11 = Reserved
10 = Peripheral Indirect Addressing mode
01 = Register Indirect without Post-Increment mode
00 = Register Indirect with Post-Increment mode
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
MODE<1:0>: DMA Channel Operating Mode Select bits
11 = One-Shot, Ping-Pong modes enabled (one block transfer from/to each DMA RAM buffer)
10 = Continuous, Ping-Pong modes enabled
01 = One-Shot, Ping-Pong modes disabled
00 = Continuous, Ping-Pong modes disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 137
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-2:
DMAxREQ: DMA CHANNEL x IRQ SELECT REGISTER
R/W-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
FORCE(1)
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
R/W-0
—
IRQSEL6(2)
IRQSEL5(2)
R/W-0
R/W-0
IRQSEL4(2) IRQSEL3(2)
R/W-0
R/W-0
R/W-0
IRQSEL2(2)
IRQSEL1(2)
IRQSEL0(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
FORCE: Force DMA Transfer bit(1)
1 = Force a single DMA transfer (Manual mode)
0 = Automatic DMA transfer initiation by DMA request
bit 14-7
Unimplemented: Read as ‘0’
bit 6-0
IRQSEL<6:0>: DMA Peripheral IRQ Number Select bits(2)
1111111 = DMAIRQ127 selected to be Channel DMAREQ
•
•
•
0000000 = DMAIRQ0 selected to be Channel DMAREQ
Note 1:
2:
x = Bit is unknown
The FORCE bit cannot be cleared by the user. The FORCE bit is cleared by hardware when the forced
DMA transfer is complete.
Please see Table 8-1 for a complete listing of IRQ numbers for all interrupt sources.
DS70593D-page 138
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-3:
R/W-0
DMAxSTA: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER A
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
STA<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
STA<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
STA<15:0>: Primary DMA RAM Start Address bits (source or destination)
REGISTER 8-4:
R/W-0
DMAxSTB: DMA CHANNEL x RAM START ADDRESS OFFSET REGISTER B
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
STB<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
STB<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
STB<15:0>: Secondary DMA RAM Start Address bits (source or destination)
 2009-2012 Microchip Technology Inc.
DS70593D-page 139
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-5:
R/W-0
DMAxPAD: DMA CHANNEL x PERIPHERAL ADDRESS REGISTER(1)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PAD<15:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PAD<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
Note 1:
x = Bit is unknown
PAD<15:0>: Peripheral Address Register bits
If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the
DMA channel and should be avoided.
REGISTER 8-6:
U-0
DMAxCNT: DMA CHANNEL x TRANSFER COUNT REGISTER(1)
U-0
—
—
U-0
—
U-0
U-0
—
—
U-0
R/W-0
R/W-0
CNT<9:8>(2)
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CNT<7:0>
R/W-0
R/W-0
R/W-0
(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
CNT<9:0>: DMA Transfer Count Register bits(2)
Note 1:
2:
x = Bit is unknown
If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the
DMA channel and should be avoided.
Number of DMA transfers = CNT<9:0> + 1.
DS70593D-page 140
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-7:
DMACS0: DMA CONTROLLER STATUS REGISTER 0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
PWCOL7
PWCOL6
PWCOL5
PWCOL4
PWCOL3
PWCOL2
PWCOL1
PWCOL0
bit 15
bit 8
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
XWCOL7
XWCOL6
XWCOL5
XWCOL4
XWCOL3
XWCOL2
XWCOL1
XWCOL0
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
PWCOL7: Channel 7 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 14
PWCOL6: Channel 6 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 13
PWCOL5: Channel 5 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 12
PWCOL4: Channel 4 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 11
PWCOL3: Channel 3 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 10
PWCOL2: Channel 2 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 9
PWCOL1: Channel 1 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 8
PWCOL0: Channel 0 Peripheral Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 7
XWCOL7: Channel 7 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 6
XWCOL6: Channel 6 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 5
XWCOL5: Channel 5 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 4
XWCOL4: Channel 4 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 141
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-7:
DMACS0: DMA CONTROLLER STATUS REGISTER 0 (CONTINUED)
bit 3
XWCOL3: Channel 3 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 2
XWCOL2: Channel 2 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 1
XWCOL1: Channel 1 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
bit 0
XWCOL0: Channel 0 DMA RAM Write Collision Flag bit
1 = Write collision detected
0 = No write collision detected
DS70593D-page 142
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-8:
DMACS1: DMA CONTROLLER STATUS REGISTER 1
U-0
U-0
U-0
U-0
—
—
—
—
R-1
R-1
R-1
R-1
LSTCH<3:0>
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
PPST7
PPST6
PPST5
PPST4
PPST3
PPST2
PPST1
PPST0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
LSTCH<3:0>: Last DMA Channel Active bits
1111 = No DMA transfer has occurred since system Reset
1110-1000 = Reserved
0111 = Last data transfer was by DMA Channel 7
0110 = Last data transfer was by DMA Channel 6
0101 = Last data transfer was by DMA Channel 5
0100 = Last data transfer was by DMA Channel 4
0011 = Last data transfer was by DMA Channel 3
0010 = Last data transfer was by DMA Channel 2
0001 = Last data transfer was by DMA Channel 1
0000 = Last data transfer was by DMA Channel 0
bit 7
PPST7: Channel 7 Ping-Pong Mode Status Flag bit
1 = DMA7STB register selected
0 = DMA7STA register selected
bit 6
PPST6: Channel 6 Ping-Pong Mode Status Flag bit
1 = DMA6STB register selected
0 = DMA6STA register selected
bit 5
PPST5: Channel 5 Ping-Pong Mode Status Flag bit
1 = DMA5STB register selected
0 = DMA5STA register selected
bit 4
PPST4: Channel 4 Ping-Pong Mode Status Flag bit
1 = DMA4STB register selected
0 = DMA4STA register selected
bit 3
PPST3: Channel 3 Ping-Pong Mode Status Flag bit
1 = DMA3STB register selected
0 = DMA3STA register selected
bit 2
PPST2: Channel 2 Ping-Pong Mode Status Flag bit
1 = DMA2STB register selected
0 = DMA2STA register selected
bit 1
PPST1: Channel 1 Ping-Pong Mode Status Flag bit
1 = DMA1STB register selected
0 = DMA1STA register selected
bit 0
PPST0: Channel 0 Ping-Pong Mode Status Flag bit
1 = DMA0STB register selected
0 = DMA0STA register selected
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 143
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 8-9:
R-0
DSADR: MOST RECENT DMA RAM ADDRESS
R-0
R-0
R-0
R-0
R-0
R-0
R-0
DSADR<15:8>
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
DSADR<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
DSADR<15:0>: Most Recent DMA RAM Address Accessed by DMA Controller bits
DS70593D-page 144
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
The dsPIC33FJXXXGPX06A/X08A/X10A
system provides:
OSCILLATOR
CONFIGURATION
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 9-1:
oscillator
• Various external and internal oscillator options as
clock sources
• An on-chip PLL to scale the internal operating
frequency to the required system clock frequency
• The internal FRC oscillator can also be used with
the PLL, thereby allowing full-speed operation
without any external clock generation hardware
• Clock switching between various clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• An Oscillator Control register (OSCCON)
• Nonvolatile Configuration bits for main oscillator
selection
Note 1: This data sheet summarizes the
features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However,
it
is
not
intended
to
be
a
comprehensive reference source. To
complement the information in this data
sheet, refer to Section 7. “Oscillator”
(DS70186) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
A simplified diagram of the oscillator system is shown
in Figure 9-1.
dsPIC33FJXXXGPX06A/X08A/X10A OSCILLATOR SYSTEM DIAGRAM
OSC1
Primary Oscillator
XT, HS, EC
R(2)
S3
S1
OSC2
(1)
PLL
XTPLL, HSPLL,
ECPLL, FRCPLL
DOZE<2:0>
S2
DOZE
9.0
S1/S3
POSCMD<1:0>
FCY
FP(3)
FRCDIV
FRC
Oscillator
FRCDIVN
÷ 16
÷ 2
FOSC
FRCDIV<2:0>
TUN<5:0>
S7
FRCDIV16
S6
FRC
S0
LPRC
LPRC
Oscillator
Secondary Oscillator
SOSC
SOSCO
S5
S4
LPOSCEN
SOSCI
Clock Fail
S7
Clock Switch
Reset
NOSC<2:0> FNOSC<2:0>
WDT, PWRT,
FSCM
Timer 1
Note 1:
2:
3:
See Figure 9-2 for PLL details.
If the Oscillator is used with XT or HS modes, an extended parallel resistor with the value of 1 M must be connected.
The term, FP refers to the clock source for all the peripherals, while FCY refers to the clock source for the CPU.
Throughout this document FP and FCY are used interchangeably, except in the case of Doze mode. FP and FCY will be
different when Doze mode is used in any ratio other than 1:1, which is the default.
 2009-2012 Microchip Technology Inc.
DS70593D-page 145
dsPIC33FJXXXGPX06A/X08A/X10A
9.1
CPU Clocking System
There are seven system clock options provided by the
dsPIC33FJXXXGPX06A/X08A/X10A:
•
•
•
•
•
•
•
FRC Oscillator
FRC Oscillator with PLL
Primary (XT, HS or EC) Oscillator
Primary Oscillator with PLL
Secondary (LP) Oscillator
LPRC Oscillator
FRC Oscillator with postscaler
9.1.1
SYSTEM CLOCK SOURCES
The FRC (Fast RC) internal oscillator runs at a nominal
frequency of 7.37 MHz. The user software can tune the
FRC frequency. User software can optionally specify a
factor (ranging from 1:2 to 1:256) by which the FRC
clock frequency is divided. This factor is selected using
the FRCDIV<2:0> (CLKDIV<10:8>) bits.
Oscillator
Mode
Select
Configuration
bits,
POSCMD<1:0> (FOSC<1:0>), select the oscillator
source that is used at a Power-on Reset. The FRC
primary oscillator is the default (unprogrammed)
selection.
The Configuration bits allow users to choose between
twelve different clock modes, shown in Table 9-1.
The output of the oscillator (or the output of the PLL if
a PLL mode has been selected) FOSC is divided by 2 to
generate the device instruction clock (FCY) and the
peripheral clock time base (FP). FCY defines the
operating speed of the device, and speeds up to 40
MHz are supported by the dsPIC33FJXXXGPX06A/
X08A/X10A architecture.
Instruction execution speed or device operating
frequency, FCY, is given by:
EQUATION 9-1:
The primary oscillator can use one of the following as
its clock source:
• XT (Crystal): Crystals and ceramic resonators in
the range of 3 MHz to 10 MHz. The crystal is connected to the OSC1 and OSC2 pins.
• HS (High-Speed Crystal): Crystals in the range of
10 MHz to 40 MHz. The crystal is connected to
the OSC1 and OSC2 pins.
• EC (External Clock): External clock signal is
directly applied to the OSC1 pin.
The secondary (LP) oscillator is designed for low power
and uses a 32.768 kHz crystal or ceramic resonator.
The LP oscillator uses the SOSCI and SOSCO pins.
The LPRC (Low-Power RC) internal oscillator runs at a
nominal frequency of 32.768 kHz. It is also used as a
reference clock by the Watchdog Timer (WDT) and
Fail-Safe Clock Monitor (FSCM).
The clock signals generated by the FRC and primary
oscillators can be optionally applied to an on-chip
Phase-Locked Loop (PLL) to provide a wide range of
output frequencies for device operation. PLL
configuration is described in Section 9.1.3 “PLL
Configuration”.
The FRC frequency depends on the FRC accuracy
(see Table 25-19) and the value of the FRC Oscillator
Tuning register (see Register 9-4).
9.1.2
SYSTEM CLOCK SELECTION
The oscillator source that is used at a device Power-on
Reset event is selected using Configuration bit settings.
The oscillator Configuration bit settings are located in the
Configuration registers in the program memory. (Refer to
Section 22.1 “Configuration Bits” for further details.)
The Initial Oscillator Selection Configuration bits,
FNOSC<2:0> (FOSCSEL<2:0>), and the Primary
DS70593D-page 146
DEVICE OPERATING
FREQUENCY
F OSC
F CY = ------------2
9.1.3
PLL CONFIGURATION
The primary oscillator and internal FRC oscillator can
optionally use an on-chip PLL to obtain higher speeds
of operation. The PLL provides a significant amount of
flexibility in selecting the device operating speed. A
block diagram of the PLL is shown in Figure 9-2.
The output of the primary oscillator or FRC, denoted as
‘FIN’, is divided down by a prescale factor (N1) of 2, 3,
... or 33 before being provided to the PLL’s Voltage
Controlled Oscillator (VCO). The input to the VCO must
be selected to be in the range of 0.8 MHz to 8 MHz.
Since the minimum prescale factor is 2, this implies that
FIN must be chosen to be in the range of 1.6 MHz to 16
MHz. The prescale factor ‘N1’ is selected using the
PLLPRE<4:0> bits (CLKDIV<4:0>).
The PLL Feedback Divisor, selected using the
PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M’,
by which the input to the VCO is multiplied. This factor
must be selected such that the resulting VCO output
frequency is in the range of 100 MHz to 200 MHz.
The VCO output is further divided by a postscale factor
‘N2’. This factor is selected using the PLLPOST<1:0>
bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and
must be selected such that the PLL output frequency
(FOSC) is in the range of 12.5 MHz to 80 MHz, which
generates device operating speeds of 6.25-40 MIPS.
For a primary oscillator or FRC oscillator, output ‘FIN’,
the PLL output ‘FOSC’ is given by:
EQUATION 9-2:
FOSC CALCULATION
M
F OSC = F IN   -------------------
 N1  N2
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
For example, suppose a 10 MHz crystal is being used,
with “XT with PLL” being the selected oscillator mode.
If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO
input of 10/2 = 5 MHz, which is within the acceptable
range of 0.8-8 MHz. If PLLDIV<8:0> = 0x1E, then
M = 32. This yields a VCO output of 5 x 32 = 160 MHz,
which is within the 100-200 MHz range needed.
EQUATION 9-3:
XT WITH PLL MODE
EXAMPLE
 32
F OSC = 1---  10000000
F CY = ---------------------------------------------- = 40 MIPS

2
22
2
If PLLPOST<1:0> = 0, then N2 = 2. This provides a
Fosc of 160/2 = 80 MHz. The resultant device operating
speed is 80/2 = 40 MIPS.
FIGURE 9-2:
dsPIC33FJXXXGPX06A/X08A/X10A PLL BLOCK DIAGRAM
FVCO
100-200 MHz
Here(1)
0.8-8.0 MHz
Here(1)
Source (Crystal, External Clock
or Internal RC)
PLLPRE
X
VCO
12.5-80 MHz
Here(1)
FOSC
PLLPOST
PLLDIV
N1
Divide by
2-33
M
Divide by
2-513
N2
Divide by
2, 4, 8
Note 1: This frequency range must be satisfied at all times.
TABLE 9-1:
CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
Oscillator Source
POSCMD<1:0>
FNOSC<2:0>
See Note
Fast RC Oscillator with Divide-by-N
(FRCDIVN)
Internal
xx
111
1, 2
Fast RC Oscillator with Divide-by-16
(FRCDIV16)
Internal
xx
110
1
Low-Power RC Oscillator (LPRC)
Internal
xx
101
1
Secondary
xx
100
1
Primary Oscillator (HS) with PLL
(HSPLL)
Primary
10
011
—
Primary Oscillator (XT) with PLL
(XTPLL)
Primary
01
011
—
Primary Oscillator (EC) with PLL
(ECPLL)
Primary
00
011
1
Secondary (Timer1) Oscillator (Sosc)
Primary Oscillator (HS)
Primary
10
010
—
Primary Oscillator (XT)
Primary
01
010
—
Primary Oscillator (EC)
Primary
00
010
1
Fast RC Oscillator with PLL (FRCPLL)
Internal
xx
001
1
Fast RC Oscillator (FRC)
Internal
xx
000
1
Note 1:
2:
OSC2 pin function is determined by the OSCIOFNC Configuration bit.
This is the default oscillator mode for an unprogrammed (erased) device.
 2009-2012 Microchip Technology Inc.
DS70593D-page 147
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 9-1:
U-0
OSCCON: OSCILLATOR CONTROL REGISTER(1,3)
R-0
—
R-0
R-0
COSC<2:0>
U-0
R/W-y
R/W-y
R/W-y
NOSC<2:0>(2)
—
bit 15
bit 8
R/W-0
U-0
R-0
U-0
R/C-0
U-0
R/W-0
R/W-0
CLKLOCK
—
LOCK
—
CF
—
LPOSCEN
OSWEN
bit 7
bit 0
Legend:
y = Value set from Configuration bits on POR
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
C = Clear only bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
COSC<2:0>: Current Oscillator Selection bits (read-only)
111 = Fast RC oscillator (FRC) with Divide-by-N
110 = Fast RC oscillator (FRC) with Divide-by-16
101 = Low-Power RC oscillator (LPRC)
100 = Secondary oscillator (Sosc)
011 = Primary oscillator (XT, HS, EC) with PLL
010 = Primary oscillator (XT, HS, EC)
001 = Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL)
000 = Fast RC oscillator (FRC)
bit 11
Unimplemented: Read as ‘0’
bit 10-8
NOSC<2:0>: New Oscillator Selection bits(2)
111 = Fast RC oscillator (FRC) with Divide-by-N
110 = Fast RC oscillator (FRC) with Divide-by-16
101 = Low-Power RC oscillator (LPRC)
100 = Secondary oscillator (Sosc)
011 = Primary oscillator (XT, HS, EC) with PLL
010 = Primary oscillator (XT, HS, EC)
001 = Fast RC Oscillator (FRC) with Divide-by-N and PLL (FRCDIVN + PLL)
000 = Fast RC oscillator (FRC)
bit 7
CLKLOCK: Clock Lock Enable bit
1 = If (FCKSM0 = 1), then clock and PLL configurations are locked
If (FCKSM0 = 0), then clock and PLL configurations may be modified
0 = Clock and PLL selections are not locked, configurations may be modified
bit 6
Unimplemented: Read as ‘0’
bit 5
LOCK: PLL Lock Status bit (read-only)
1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied
0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled
bit 4
Unimplemented: Read as ‘0’
bit 3
CF: Clock Fail Detect bit (read/clear by application)
1 = FSCM has detected clock failure
0 = FSCM has not detected clock failure
bit 2
Unimplemented: Read as ‘0’
Note 1:
2:
3:
Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the
“dsPIC33F/PIC24H Family Reference Manual” for details.
Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in either direction. In these instances, the application must switch to FRC
mode as a transition clock source between the two PLL modes.
This is register is reset only on a Power-on Reset (POR).
DS70593D-page 148
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 9-1:
OSCCON: OSCILLATOR CONTROL REGISTER(1,3) (CONTINUED)
bit 1
LPOSCEN: Secondary (LP) Oscillator Enable bit
1 = Enable secondary oscillator
0 = Disable secondary oscillator
bit 0
OSWEN: Oscillator Switch Enable bit
1 = Request oscillator switch to selection specified by NOSC<2:0> bits
0 = Oscillator switch is complete
Note 1:
2:
3:
Writes to this register require an unlock sequence. Refer to Section 7. “Oscillator” (DS70186) in the
“dsPIC33F/PIC24H Family Reference Manual” for details.
Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted.
This applies to clock switches in either direction. In these instances, the application must switch to FRC
mode as a transition clock source between the two PLL modes.
This is register is reset only on a Power-on Reset (POR).
 2009-2012 Microchip Technology Inc.
DS70593D-page 149
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 9-2:
R/W-0
CLKDIV: CLOCK DIVISOR REGISTER(2)
R/W-0
ROI
R/W-1
R/W-1
R/W-0
R/W-0
DOZEN(1)
DOZE<2:0>
R/W-0
R/W-0
FRCDIV<2:0>
bit 15
bit 8
R/W-0
R/W-1
PLLPOST<1:0>
U-0
R/W-0
R/W-0
—
R/W-0
R/W-0
R/W-0
PLLPRE<4:0>
bit 7
bit 0
Legend:
y = Value set from Configuration bits on POR
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ROI: Recover on Interrupt bit
1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1
0 = Interrupts have no effect on the DOZEN bit
bit 14-12
DOZE<2:0>: Processor Clock Reduction Select bits
111 = FCY/128
110 = FCY/64
101 = FCY/32
100 = FCY/16
011 = FCY/8 (default)
010 = FCY/4
001 = FCY/2
000 = FCY/1
bit 11
DOZEN: DOZE Mode Enable bit(1)
1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks
0 = Processor clock/peripheral clock ratio forced to 1:1
bit 10-8
FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits
111 = FRC divide by 256
110 = FRC divide by 64
101 = FRC divide by 32
100 = FRC divide by 16
011 = FRC divide by 8
010 = FRC divide by 4
001 = FRC divide by 2
000 = FRC divide by 1 (default)
bit 7-6
PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)
11 = Output/8
10 = Reserved
01 = Output/4 (default)
00 = Output/2
bit 5
Unimplemented: Read as ‘0’
bit 4-0
PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)
11111 = Input/33
•
•
•
00001 = Input/3
00000 = Input/2 (default)
Note 1:
2:
This bit is cleared when the ROI bit is set and an interrupt occurs.
This is register is reset only on a Power-on Reset (POR).
DS70593D-page 150
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 9-3:
PLLFBD: PLL FEEDBACK DIVISOR REGISTER(1)
U-0
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0(1)
—
—
—
—
—
—
—
PLLDIV<8>
bit 15
bit 8
R/W-0
R/W-0
R/W-1
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
PLLDIV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-9
Unimplemented: Read as ‘0’
bit 8-0
PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)
111111111 = 513
•
•
•
000110000 = 50 (default)
•
•
•
000000010 = 4
000000001 = 3
000000000 = 2
Note 1:
This is register is reset only on a Power-on Reset (POR).
 2009-2012 Microchip Technology Inc.
DS70593D-page 151
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 9-4:
OSCTUN: FRC OSCILLATOR TUNING REGISTER(2)
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
—
R/W-0
R/W-0
R/W-0
—
R/W-0
TUN<5:0>
R/W-0
R/W-0
(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5-0
TUN<5:0>: FRC Oscillator Tuning bits(1)
111111 = Center frequency - 0.375% (7.345 MHz)
•
•
•
100001 = Center frequency - 11.625% (6.52 MHz)
100000 = Center frequency - 12% (6.49 MHz)
011111 = Center frequency + 11.625% (8.23 MHz)
011110 = Center frequency + 11.25% (8.20 MHz)
•
•
•
000001 = Center frequency + 0.375% (7.40 MHz)
000000 = Center frequency (7.37 MHz nominal)
Note 1:
2:
x = Bit is unknown
OSCTUN functionality has been provided to help customers compensate for temperature effects on the
FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither
characterized nor tested.
This is register is reset only on a Power-on Reset (POR).
DS70593D-page 152
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
9.2
Clock Switching Operation
Applications are free to switch between any of the four
clock sources (Primary, LP, FRC and LPRC) under
software control at any time. To limit the possible side
effects that could result from this flexibility,
dsPIC33FJXXXGPX06A/X08A/X10A devices have a
safeguard lock built into the switch process.
Note:
9.2.1
Primary Oscillator mode has three different
submodes (XT, HS and EC) which are
determined by the POSCMD<1:0>
Configuration bits. While an application
can switch to and from Primary Oscillator
mode in software, it cannot switch
between the different primary submodes
without reprogramming the device.
2.
If a valid clock switch has been initiated, the status bits, LOCK (OSCCON<5>) and CF
(OSCCON<3>) are cleared.
The new oscillator is turned on by the hardware
if it is not currently running. If a crystal oscillator
must be turned on, the hardware waits until the
Oscillator Start-up Timer (OST) expires. If the
new source is using the PLL, the hardware waits
until a PLL lock is detected (LOCK = 1).
The hardware waits for 10 clock cycles from the
new clock source and then performs the clock
switch.
The hardware clears the OSWEN bit to indicate a
successful clock transition. In addition, the NOSC
bit values are transferred to the COSC status bits.
The old clock source is turned off at this time,
with the exception of LPRC (if WDT or FSCM
are enabled) or LP (if LPOSCEN remains set).
3.
4.
5.
6.
ENABLING CLOCK SWITCHING
To enable clock switching, the FCKSM1 Configuration
bit in the Configuration register must be programmed to
‘0’. (Refer to Section 22.1 “Configuration Bits” for
further details.) If the FCKSM1 Configuration bit is
unprogrammed (‘1’), the clock switching function and
Fail-Safe Clock Monitor function are disabled. This is
the default setting.
Note 1: The processor continues to execute code
throughout the clock switching sequence.
Timing sensitive code should not be
executed during this time.
2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies
to clock switches in either direction. In
these instances, the application must
switch to FRC mode as a transition clock
source between the two PLL modes.
3: Refer to Section 7. “Oscillator”
(DS70186) in the “dsPIC33F/PIC24H
Family Reference Manual” for details.
The NOSC control bits (OSCCON<10:8>) do not
control the clock selection when clock switching is
disabled. However, the COSC bits (OSCCON<14:12>)
reflect the clock source selected by the FNOSC
Configuration bits.
The OSWEN control bit (OSCCON<0>) has no effect
when clock switching is disabled. It is held at ‘0’ at all
times.
9.2.2
OSCILLATOR SWITCHING SEQUENCE
At a minimum, performing a clock switch requires this
basic sequence:
1.
2.
3.
4.
5.
If
desired,
read
the
COSC
bits
(OSCCON<14:12>) to determine the current
oscillator source.
Perform the unlock sequence to allow a write to
the OSCCON register high byte.
Write the appropriate value to the NOSC control
bits (OSCCON<10:8>) for the new oscillator
source.
Perform the unlock sequence to allow a write to
the OSCCON register low byte.
Set the OSWEN bit to initiate the oscillator
switch.
Once the basic sequence is completed, the system
clock hardware responds automatically as follows:
1.
The clock switching hardware compares the
COSC status bits with the new value of the
NOSC control bits. If they are the same, then the
clock switch is a redundant operation. In this
case, the OSWEN bit is cleared automatically
and the clock switch is aborted.
 2009-2012 Microchip Technology Inc.
9.3
Fail-Safe Clock Monitor (FSCM)
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by programming.
If the FSCM function is enabled, the LPRC internal
oscillator runs at all times (except during Sleep mode)
and is not subject to control by the Watchdog Timer.
In the event of an oscillator failure, the FSCM
generates a clock failure trap event and switches the
system clock over to the FRC oscillator. Then the
application program can either attempt to restart the
oscillator or execute a controlled shutdown. The trap
can be treated as a warm Reset by simply loading the
Reset address into the oscillator fail trap vector.
If the PLL multiplier is used to scale the system clock,
the internal FRC is also multiplied by the same factor
on clock failure. Essentially, the device switches to
FRC with PLL on a clock failure.
DS70593D-page 153
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 154
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
10.0
POWER-SAVING FEATURES
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to
Section 9. “Watchdog Timer and
Power-Saving Modes” (DS70196) in
the
“dsPIC33F/PIC24H
Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The dsPIC33FJXXXGPX06A/X08A/X10A devices provide the ability to manage power consumption by selectively managing clocking to the CPU and the
peripherals. In general, a lower clock frequency and a
reduction in the number of circuits being clocked constitutes
lower
consumed
power.
dsPIC33FJXXXGPX06A/X08A/X10A devices can
manage power consumption in four different ways:
•
•
•
•
Clock frequency
Instruction-based Sleep and Idle modes
Software-controlled Doze mode
Selective peripheral control in software
Combinations of these methods can be used to
selectively tailor an application’s power consumption
while still maintaining critical application features, such
as timing-sensitive communications.
10.1
Clock Frequency and Clock
Switching
dsPIC33FJXXXGPX06A/X08A/X10A devices allow a
wide range of clock frequencies to be selected under
application control. If the system clock configuration is
not locked, users can choose low-power or
high-precision oscillators by simply changing the
NOSC bits (OSCCON<10:8>). The process of
changing a system clock during operation, as well as
limitations to the process, are discussed in more detail
in Section 9.0 “Oscillator Configuration”.
EXAMPLE 10-1:
10.2
Instruction-Based Power-Saving
Modes
dsPIC33FJXXXGPX06A/X08A/X10A devices have two
special power-saving modes that are entered through
the execution of a special PWRSAV instruction. Sleep
mode stops clock operation and halts all code
execution. Idle mode halts the CPU and code
execution, but allows peripheral modules to continue
operation. The assembly syntax of the PWRSAV
instruction is shown in Example 10-1.
Note:
SLEEP_MODE and IDLE_MODE are
constants defined in the assembler
include file for the selected device.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to “wake-up”.
10.2.1
SLEEP MODE
Sleep mode has these features:
• The system clock source is shut down. If an
on-chip oscillator is used, it is turned off.
• The device current consumption is reduced to a
minimum, provided that no I/O pin is sourcing
current
• The Fail-Safe Clock Monitor does not operate
during Sleep mode since the system clock source
is disabled
• The LPRC clock continues to run in Sleep mode if
the WDT is enabled
• The WDT, if enabled, is automatically cleared
prior to entering Sleep mode
• Some device features or peripherals may continue
to operate in Sleep mode. This includes items such
as the input change notification on the I/O ports, or
peripherals that use an external clock input. Any
peripheral that requires the system clock source for
its operation is disabled in Sleep mode.
The device will wake-up from Sleep mode on any of
these events:
• Any interrupt source that is individually enabled
• Any form of device Reset
• A WDT time-out
On wake-up from Sleep, the processor restarts with the
same clock source that was active when Sleep mode
was entered.
PWRSAV INSTRUCTION SYNTAX
PWRSAV #SLEEP_MODE
PWRSAV #IDLE_MODE
; Put the device into SLEEP mode
; Put the device into IDLE mode
 2009-2012 Microchip Technology Inc.
DS70593D-page 155
dsPIC33FJXXXGPX06A/X08A/X10A
10.2.2
IDLE MODE
Idle mode has these features:
• The CPU stops executing instructions
• The WDT is automatically cleared
• The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 10.4
“Peripheral Module Disable”).
• If the WDT or FSCM is enabled, the LPRC also
remains active
The device will wake from Idle mode on any of these
events:
• Any interrupt that is individually enabled
• Any device Reset
• A WDT time-out
On wake-up from Idle, the clock is reapplied to the CPU
and instruction execution will begin (2-4 clock cycles
later), starting with the instruction following the PWRSAV
instruction, or the first instruction in the ISR.
10.2.3
INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction is held off until entry into Sleep or
Idle mode has completed. The device then wakes up
from Sleep or Idle mode.
10.3
Doze Mode
Generally, changing clock speed and invoking one of the
power-saving modes are the preferred strategies for
reducing power consumption. There may be
circumstances, however, where this is not practical. For
example, it may be necessary for an application to
maintain uninterrupted synchronous communication,
even while it is doing nothing else. Reducing system
clock speed may introduce communication errors, while
using a power-saving mode may stop communications
completely.
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock
continues to operate from the same source and at the
same speed. Peripheral modules continue to be
clocked at the same speed, while the CPU clock speed
is reduced. Synchronization between the two clock
domains is maintained, allowing the peripherals to
access the SFRs while the CPU executes code at a
slower rate.
DS70593D-page 156
Doze mode is enabled by setting the DOZEN bit (CLKDIV<11>). The ratio between peripheral and core clock
speed is determined by the DOZE<2:0> bits (CLKDIV<14:12>). There are eight possible configurations,
from 1:1 to 1:128, with 1:1 being the default setting.
It is also possible to use Doze mode to selectively
reduce
power
consumption
in
event-driven
applications. This allows clock-sensitive functions,
such as synchronous communications, to continue
without interruption while the CPU idles, waiting for
something to invoke an interrupt routine. Enabling the
automatic return to full-speed CPU operation on
interrupts is enabled by setting the ROI bit (CLKDIV<15>). By default, interrupt events have no effect
on Doze mode operation.
For example, suppose the device is operating at
20 MIPS and the CAN module has been configured for
500 kbps based on this device operating speed. If the
device is now placed in Doze mode with a clock
frequency ratio of 1:4, the CAN module continues to
communicate at the required bit rate of 500 kbps, but
the CPU now starts executing instructions at a
frequency of 5 MIPS.
10.4
Peripheral Module Disable
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled via the appropriate PMD
control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module is only enabled if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC® DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
If a PMD bit is set, the corresponding
module is disabled after a delay of
1 instruction cycle. Similarly, if a PMD bit
is cleared, the corresponding module is
enabled after a delay of 1 instruction cycle
(assuming the module control registers
are already configured to enable module
operation).
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 10-1:
PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
T5MD
T4MD
T3MD
T2MD
T1MD
—
—
DCIMD
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
I2C1MD
U2MD
U1MD
SPI2MD
SPI1MD
C2MD
C1MD
AD1MD(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
T5MD: Timer5 Module Disable bit
1 = Timer5 module is disabled
0 = Timer5 module is enabled
bit 14
T4MD: Timer4 Module Disable bit
1 = Timer4 module is disabled
0 = Timer4 module is enabled
bit 13
T3MD: Timer3 Module Disable bit
1 = Timer3 module is disabled
0 = Timer3 module is enabled
bit 12
T2MD: Timer2 Module Disable bit
1 = Timer2 module is disabled
0 = Timer2 module is enabled
bit 11
T1MD: Timer1 Module Disable bit
1 = Timer1 module is disabled
0 = Timer1 module is enabled
bit 10-9
Unimplemented: Read as ‘0’
bit 8
DCIMD: DCI Module Disable bit
1 = DCI module is disabled
0 = DCI module is enabled
bit 7
I2C1MD: I2C1 Module Disable bit
1 = I2C1 module is disabled
0 = I2C1 module is enabled
bit 6
U2MD: UART2 Module Disable bit
1 = UART2 module is disabled
0 = UART2 module is enabled
bit 5
U1MD: UART1 Module Disable bit
1 = UART1 module is disabled
0 = UART1 module is enabled
bit 4
SPI2MD: SPI2 Module Disable bit
1 = SPI2 module is disabled
0 = SPI2 module is enabled
bit 3
SPI1MD: SPI1 Module Disable bit
1 = SPI1 module is disabled
0 = SPI1 module is enabled
Note 1:
x = Bit is unknown
PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins
multiplexed with ANx will be in Digital mode.
 2009-2012 Microchip Technology Inc.
DS70593D-page 157
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 10-1:
PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 (CONTINUED)
bit 2
C2MD: ECAN2 Module Disable bit
1 = ECAN2 module is disabled
0 = ECAN2 module is enabled
bit 1
C1MD: ECAN2 Module Disable bit
1 = ECAN1 module is disabled
0 = ECAN1 module is enabled
bit 0
AD1MD: ADC1 Module Disable bit(1)
1 = ADC1 module is disabled
0 = ADC1 module is enabled
Note 1:
PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins
multiplexed with ANx will be in Digital mode.
DS70593D-page 158
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 10-2:
PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
IC8MD
IC7MD
IC6MD
IC5MD
IC4MD
IC3MD
IC2MD
IC1MD
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
OC8MD
OC7MD
OC6MD
OC5MD
OC4MD
OC3MD
OC2MD
OC1MD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
IC8MD: Input Capture 8 Module Disable bit
1 = Input Capture 8 module is disabled
0 = Input Capture 8 module is enabled
bit 14
IC7MD: Input Capture 7 Module Disable bit
1 = Input Capture 7 module is disabled
0 = Input Capture 7 module is enabled
bit 13
IC6MD: Input Capture 6 Module Disable bit
1 = Input Capture 6 module is disabled
0 = Input Capture 6 module is enabled
bit 12
IC5MD: Input Capture 5 Module Disable bit
1 = Input Capture 5 module is disabled
0 = Input Capture 5 module is enabled
bit 11
IC4MD: Input Capture 4 Module Disable bit
1 = Input Capture 4 module is disabled
0 = Input Capture 4 module is enabled
bit 10
IC3MD: Input Capture 3 Module Disable bit
1 = Input Capture 3 module is disabled
0 = Input Capture 3 module is enabled
bit 9
IC2MD: Input Capture 2 Module Disable bit
1 = Input Capture 2 module is disabled
0 = Input Capture 2 module is enabled
bit 8
IC1MD: Input Capture 1 Module Disable bit
1 = Input Capture 1 module is disabled
0 = Input Capture 1 module is enabled
bit 7
OC8MD: Output Compare 8 Module Disable bit
1 = Output Compare 8 module is disabled
0 = Output Compare 8 module is enabled
bit 6
OC7MD: Output Compare 4 Module Disable bit
1 = Output Compare 7 module is disabled
0 = Output Compare 7 module is enabled
bit 5
OC6MD: Output Compare 6 Module Disable bit
1 = Output Compare 6 module is disabled
0 = Output Compare 6 module is enabled
bit 4
OC5MD: Output Compare 5 Module Disable bit
1 = Output Compare 5 module is disabled
0 = Output Compare 5 module is enabled
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 159
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 10-2:
PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 (CONTINUED)
bit 3
OC4MD: Output Compare 4 Module Disable bit
1 = Output Compare 4 module is disabled
0 = Output Compare 4 module is enabled
bit 2
OC3MD: Output Compare 3 Module Disable bit
1 = Output Compare 3 module is disabled
0 = Output Compare 3 module is enabled
bit 1
OC2MD: Output Compare 2 Module Disable bit
1 = Output Compare 2 module is disabled
0 = Output Compare 2 module is enabled
bit 0
OC1MD: Output Compare 1 Module Disable bit
1 = Output Compare 1 module is disabled
0 = Output Compare 1 module is enabled
DS70593D-page 160
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 10-3:
PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
T9MD
T8MD
T7MD
T6MD
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
I2C2MD
AD2MD(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
T9MD: Timer9 Module Disable bit
1 = Timer9 module is disabled
0 = Timer9 module is enabled
bit 14
T8MD: Timer8 Module Disable bit
1 = Timer8 module is disabled
0 = Timer8 module is enabled
bit 13
T7MD: Timer7 Module Disable bit
1 = Timer7 module is disabled
0 = Timer7 module is enabled
bit 12
T6MD: Timer6 Module Disable bit
1 = Timer6 module is disabled
0 = Timer6 module is enabled
bit 11-2
Unimplemented: Read as ‘0’
bit 1
I2C2MD: I2C2 Module Disable bit
1 = I2C2 module is disabled
0 = I2C2 module is enabled
bit 0
AD2MD: AD2 Module Disable bit(1)
1 = AD2 module is disabled
0 = AD2 module is enabled
Note 1:
x = Bit is unknown
PCFGx bits have no effect if ADC module is disabled by setting this bit. In this case all port pins
multiplexed with ANx will be in Digital mode.
 2009-2012 Microchip Technology Inc.
DS70593D-page 161
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 162
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
11.0
I/O PORTS
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the
information in this data sheet, refer to
Section 10. “I/O Ports” (DS70193) in
the
“dsPIC33F/PIC24H
Family
Reference Manual”, which is available
from
the
Microchip
web
site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKIN) are shared between the peripherals and
the parallel I/O ports. All I/O input ports feature Schmitt
Trigger inputs for improved noise immunity.
11.1
Parallel I/O (PIO) Ports
A parallel I/O port that shares a pin with a peripheral is,
in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
FIGURE 11-1:
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through”, in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 11-1 illustrates how ports are shared with other peripherals and
the associated I/O pin to which they are connected.
When a peripheral is enabled and actively driving an
associated pin, the use of the pin as a general purpose
output pin is disabled. The I/O pin may be read, but the
output driver for the parallel port bit will be disabled. If
a peripheral is enabled, but the peripheral is not
actively driving a pin, that pin may be driven by a port.
All port pins have three registers directly associated
with their operation as digital I/O. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch. Reads from the port
(PORTx), read the port pins, while writes to the port
pins, write the latch.
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pins will read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs. An
example is the INT4 pin.
BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Peripheral Module
Output Multiplexers
Peripheral Input Data
Peripheral Module Enable
Peripheral Output Enable
Peripheral Output Data
PIO Module
WR TRIS
Output Enable
0
1
Output Data
0
Read TRIS
Data Bus
I/O
1
D
Q
I/O Pin
CK
TRIS Latch
D
WR LAT +
WR PORT
Q
CK
Data Latch
Read LAT
Input Data
Read Port
 2009-2012 Microchip Technology Inc.
DS70593D-page 163
dsPIC33FJXXXGPX06A/X08A/X10A
11.2
Open-Drain Configuration
In addition to the PORT, LAT and TRIS registers for
data control, some port pins can also be individually
configured for either digital or open-drain output. This is
controlled by the Open-Drain Control register, ODCx,
associated with each port. Setting any of the bits
configures the corresponding pin to act as an
open-drain output.
The open-drain feature allows the generation of
outputs higher than VDD (e.g., 5V) on any desired 5V
tolerant pins by using external pull-up resistors. The
maximum open-drain voltage allowed is the same as
the maximum VIH specification.
See the “Pin Diagrams” section for the available pins
and their functionality.
11.3
Configuring Analog Port Pins
The use of the ADxPCFGH, ADxPCFGL and TRIS
registers control the operation of the ADC port pins.
The port pins that are desired as analog inputs must
have their corresponding TRIS bit set (input). If the
TRIS bit is cleared (output), the digital output level (VOH
or VOL) is converted.
Clearing any bit in the ADxPCFGH or ADxPCFGL
register configures the corresponding bit to be an
analog pin. This is also the Reset state of any I/O pin
that has an analog (ANx) function associated with it.
Note:
In devices with two ADC modules, if the
corresponding PCFG bit in either
AD1PCFGH(L) and AD2PCFGH(L) is
cleared, the pin is configured as an analog
input.
11.4
I/O Port Write/Read Timing
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically, this instruction
would be a NOP.
11.5
Input Change Notification
The input change notification function of the I/O ports
allows
the
dsPIC33FJXXXGPX06A/X08A/X10A
devices to generate interrupt requests to the processor
in response to a change-of-state on selected input pins.
This feature is capable of detecting input
change-of-states even in Sleep mode, when the clocks
are disabled. Depending on the device pin count, there
are up to 24 external signals (CN0 through CN23) that
can be selected (enabled) for generating an interrupt
request on a change-of-state.
There are four control registers associated with the CN
module. The CNEN1 and CNEN2 registers contain the
CN interrupt enable (CNxIE) control bits for each of the
CN input pins. Setting any of these bits enables a CN
interrupt for the corresponding pins.
Each CN pin also has a weak pull-up connected to it.
The pull-ups act as a current source that is connected
to the pin and eliminate the need for external resistors
when push button or keypad devices are connected.
The pull-ups are enabled separately using the CNPU1
and CNPU2 registers, which contain the weak pull-up
enable (CNxPUE) bits for each of the CN pins. Setting
any of the control bits enables the weak pull-ups for the
corresponding pins.
Note:
When reading the PORT register, all pins configured as
analog input channels will read as cleared (a low level).
Pull-ups on change notification pins
should always be disabled whenever the
port pin is configured as a digital output.
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
Note:
The voltage on an analog input pin can be
between -0.3V to (VDD + 0.3 V).
EXAMPLE 11-1:
MOV
MOV
NOP
btss
0xFF00, W0
W0, TRISBB
PORTB, #13
DS70593D-page 164
PORT WRITE/READ EXAMPLE
;
;
;
;
Configure PORTB<15:8> as inputs
and PORTB<7:0> as outputs
Delay 1 cycle
Next Instruction
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
11.6
1.
2.
In some cases, certain pins as defined in TABLE
25-9: “DC Characteristics: I/O Pin Input Specifications” under “Injection Current”, have internal
protection diodes to VDD and VSS. The term
“Injection Current” is also referred to as “Clamp
Current”. On designated pins, with sufficient external current limiting precautions by the user, I/O pin
input voltages are allowed to be greater or less
than the data sheet absolute maximum ratings
with nominal VDD with respect to the VSS and VDD
supplies. Note that when the user application forward biases either of the high or low side internal
input clamp diodes, that the resulting current being
injected into the device that is clamped internally
by the VDD and VSS power rails, may affect the
ADC accuracy by four to six counts.
I/O pins that are shared with any analog input pin,
(i.e., ANx), are always analog pins by default after
any reset. Consequently, any pin(s) configured as
an analog input pin, automatically disables the digital input pin buffer. As such, any attempt to read a
digital input pin will always return a ‘0’ regardless
of the digital logic level on the pin if the analog pin
is configured. To use a pin as a digital I/O pin on a
shared ANx pin, the user application needs to configure the analog pin configuration registers in the
ADC module, (i.e., ADxPCFGL, AD1PCFGH), by
setting the appropriate bit that corresponds to that
I/O port pin to a ‘1’. On devices with more than one
ADC, both analog pin configurations for both ADC
modules must be configured as a digital I/O pin for
that pin to function as a digital I/O pin.
Note:
3.
I/O Helpful Tips
Although it is not possible to use a digital
input pin when its analog function is
enabled, it is possible to use the digital I/O
output function, TRISx = 0x0, while the
analog function is also enabled. However,
this is not recommended, particularly if the
analog input is connected to an external
analog voltage source, which would create signal contention between the analog
signal and the output pin driver.
Most I/O pins have multiple functions. Referring to
the device pin diagrams in the data sheet, the priorities of the functions allocated to any pins are
indicated by reading the pin name from
left-to-right. The left most function name takes precedence over any function to its right in the naming
convention. For example: AN16/T2CK/T7CK/RC1.
This indicates that AN16 is the highest priority in
this example and will supersede all other functions
to its right in the list. Those other functions to its
right, even if enabled, would not work as long as
any other function to its left was enabled. This rule
applies to all of the functions listed for a given pin.
 2009-2012 Microchip Technology Inc.
4.
5.
Each CN pin has a configurable internal weak
pull-up resistor. The pull-ups act as a current
source connected to the pin, and eliminates the
need for external resistors in certain applications. The internal pull-up is to ~(VDD-0.8) not
VDD. This is still above the minimum VIH of
CMOS and TTL devices.
When driving LEDs directly, the I/O pin can source
or sink more current than what is specified in the
VOH/IOH and VOL/IOL DC characteristic specification. The respective IOH and IOL current rating only
applies to maintaining the corresponding output at
or above the VOH and at or below the VOL levels.
However, for LEDs unlike digital inputs of an externally connected device, they are not governed by
the same minimum VIH/VIL levels. An I/O pin output can safely sink or source any current less than
that listed in the absolute maximum rating section
of the data sheet. For example:
VOH = 2.4v @ IOH = -8 mA and VDD = 3.3V
The maximum output current sourced by any 8 mA
I/O pin = 12 mA.
LED source current < 12 mA is technically
permitted. Refer to the VOH/IOH graphs in
Section 25.0 “Electrical Characteristics” for
additional information.
11.7
I/O Resources
Many useful resources related to I/O are provided on
the main product page of the Microchip web site for the
devices listed in this data sheet. This product page,
which can be accessed using this link, contains the
latest updates and additional information.
Note:
11.7.1
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en546064
KEY RESOURCES
•
•
•
•
•
•
Section 10. “I/O Ports” (DS70193)
Code Samples
Application Notes
Software Libraries
Webinars
All related dsPIC33F/PIC24H Family Reference
Manuals Sections
• Development Tools
DS70593D-page 165
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 166
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
12.0
Timer1 also supports these features:
TIMER1
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to
Section 11. “Timers” (DS70205) in the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip
web
site
(www.microchip.com).
Figure 12-1 presents a block diagram of the 16-bit
timer module.
To configure Timer1 for operation:
1.
2.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
3.
4.
5.
The Timer1 module is a 16-bit timer, which can serve
as the time counter for the real-time clock, or operate
as a free-running interval timer/counter. Timer1 can
operate in three modes:
6.
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
FIGURE 12-1:
Set the TON bit (= 1) in the T1CON register.
Select the timer prescaler ratio using the
TCKPS<1:0> bits in the T1CON register.
Set the Clock and Gating modes using the TCS
and TGATE bits in the T1CON register.
Set or clear the TSYNC bit in T1CON to select
synchronous or asynchronous operation.
Load the timer period value into the PR1
register.
If interrupts are required, set the interrupt enable
bit, T1IE. Use the priority bits, T1IP<2:0>, to set
the interrupt priority.
16-BIT TIMER1 MODULE BLOCK DIAGRAM
TCKPS<1:0>
2
TON
SOSCO/
T1CK
1x
SOSCEN
SOSCI
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
1
Q
D
0
Q
CK
Set T1IF
Reset
0
TMR1
1
Equal
Comparator
Sync
TSYNC
PR1
 2009-2012 Microchip Technology Inc.
DS70593D-page 167
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 12-1:
T1CON: TIMER1 CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE
R/W-0
R/W-0
TCKPS<1:0>
U-0
R/W-0
R/W-0
U-0
—
TSYNC
TCS
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer1 On bit
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer1 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
Unimplemented: Read as ‘0’
bit 2
TSYNC: Timer1 External Clock Input Synchronization Select bit
When TCS = 1:
1 = Synchronize external clock input
0 = Do not synchronize external clock input
When TCS = 0:
This bit is ignored.
bit 1
TCS: Timer1 Clock Source Select bit
1 = External clock from pin T1CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
DS70593D-page 168
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
13.0
TIMER2/3, TIMER4/5, TIMER6/7
AND TIMER8/9
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However, it is not intended to be a comprehensive
reference
source.
To
complement the information in this data
sheet, refer to Section 11. “Timers”
(DS70205) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Timer2/3, Timer4/5, Timer6/7 and Timer8/9
modules are 32-bit timers, which can also be
configured as four independent 16-bit timers with
selectable operating modes.
Note:
To configure Timer2/3, Timer4/5, Timer6/7 or Timer8/9
for 32-bit operation:
1.
2.
3.
4.
5.
As a 32-bit timer, Timer2/3, Timer4/5, Timer6/7 and
Timer8/9 operate in three modes:
• Two Independent 16-bit Timers (e.g., Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
• Single 32-bit Timer
• Single 32-bit Synchronous Counter
They also support these features:
•
•
•
•
•
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period Register Match
Time Base for Input Capture and Output Compare
Modules (Timer2 and Timer3 only)
• ADC1 Event Trigger (Timer2/3 only)
• ADC2 Event Trigger (Timer4/5 only)
Individually, all eight of the 16-bit timers can function as
synchronous timers or counters. They also offer the
features listed above, except for the event trigger; this
is implemented only with Timer2/3. The operating
modes and enabled features are determined by setting
the appropriate bit(s) in the T2CON, T3CON, T4CON,
T5CON, T6CON, T7CON, T8CON and T9CON
registers. T2CON, T4CON, T6CON and T8CON are
shown in generic form in Register 13-1. T3CON,
T5CON, T7CON and T9CON are shown in
Register 13-2.
For 32-bit timer/counter operation, Timer2, Timer4,
Timer6 or Timer8 is the least significant word; Timer3,
Timer5, Timer7 or Timer9 is the most significant word
of the 32-bit timers.
 2009-2012 Microchip Technology Inc.
For 32-bit operation, T3CON, T5CON,
T7CON and T9CON control bits are
ignored. Only T2CON, T4CON, T6CON
and T8CON control bits are used for setup
and control. Timer2, Timer4, Timer6 and
Timer8 clock and gate inputs are utilized
for the 32-bit timer modules, but an
interrupt is generated with the Timer3,
Timer5, Ttimer7 and Timer9 interrupt
flags.
6.
Set the corresponding T32 control bit.
Select the prescaler ratio for Timer2, Timer4,
Timer6 or Timer8 using the TCKPS<1:0> bits.
Set the Clock and Gating modes using the
corresponding TCS and TGATE bits.
Load the timer period value. PR3, PR5, PR7 or
PR9 contains the most significant word of the
value, while PR2, PR4, PR6 or PR8 contains the
least significant word.
If interrupts are required, set the interrupt enable
bit, T3IE, T5IE, T7IE or T9IE. Use the priority
bits, T3IP<2:0>, T5IP<2:0>, T7IP<2:0> or
T9IP<2:0>, to set the interrupt priority. While
Timer2, Timer4, Timer6 or Timer8 control the
timer, the interrupt appears as a Timer3, Timer5,
Timer7 or Timer9 interrupt.
Set the corresponding TON bit.
The timer value at any point is stored in the register
pair, TMR3:TMR2, TMR5:TMR4, TMR7:TMR6 or
TMR9:TMR8. TMR3, TMR5, TMR7 or TMR9 always
contains the most significant word of the count, while
TMR2, TMR4, TMR6 or TMR8 contains the least
significant word.
To configure any of the timers for individual 16-bit
operation:
1.
2.
3.
4.
5.
6.
Clear the T32 bit corresponding to that timer.
Select the timer prescaler ratio using the
TCKPS<1:0> bits.
Set the Clock and Gating modes using the TCS
and TGATE bits.
Load the timer period value into the PRx
register.
If interrupts are required, set the interrupt enable
bit, TxIE. Use the priority bits, TxIP<2:0>, to set
the interrupt priority.
Set the TON bit.
A block diagram for a 32-bit timer pair (Timer4/5)
example is shown in Figure 13-1 and a timer (Timer4)
operating in 16-bit mode example is shown in
Figure 13-2.
Note:
Only Timer2 and Timer3 can trigger a
DMA data transfer.
DS70593D-page 169
dsPIC33FJXXXGPX06A/X08A/X10A
TIMER2/3 (32-BIT) BLOCK DIAGRAM(1)
FIGURE 13-1:
T2CK
1x
Gate
Sync
01
TCY
00
TCKPS<1:0>
2
TON
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
Q
1
Set T3IF
Q
D
CK
0
PR3
ADC Event Trigger(2)
Equal
PR2
Comparator
MSb
LSb
TMR3
Reset
TMR2
Sync
16
Read TMR2
Write TMR2
16
TMR3HLD
16
16
Data Bus<15:0>
Note 1:
2:
The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective
to the T2CON register.
The ADC event trigger is available only on Timer2/3.
DS70593D-page 170
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 13-2:
TIMER2 (16-BIT) BLOCK DIAGRAM
TON
T2CK
TCKPS<1:0>
2
1x
Gate
Sync
Prescaler
1, 8, 64, 256
01
00
TGATE
TCS
TCY
1
Set T2IF
Q
D
Q
CK
TGATE
0
Reset
Equal
TMR2
Sync
Comparator
PR2
 2009-2012 Microchip Technology Inc.
DS70593D-page 171
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 13-1:
TxCON (T2CON, T4CON, T6CON OR T8CON) CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE
R/W-0
R/W-0
TCKPS<1:0>
R/W-0
U-0
R/W-0
U-0
T32
—
TCS(1)
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timerx On bit
When T32 = 1:
1 = Starts 32-bit Timerx/y
0 = Stops 32-bit Timerx/y
When T32 = 0:
1 = Starts 16-bit Timerx
0 = Stops 16-bit Timerx
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timerx Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0>: Timerx Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
T32: 32-bit Timer Mode Select bit
1 = Timerx and Timery form a single 32-bit timer
0 = Timerx and Timery act as two 16-bit timers
bit 2
Unimplemented: Read as ‘0’
bit 1
TCS: Timerx Clock Source Select bit(1)
1 = External clock from pin TxCK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
The TxCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins.
DS70593D-page 172
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 13-2:
TyCON (T3CON, T5CON, T7CON OR T9CON) CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON(1)
—
TSIDL(2)
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE(1)
R/W-0
R/W-0
TCKPS<1:0>(1)
U-0
U-0
R/W-0
U-0
—
—
TCS(1,3)
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timery On bit(1)
1 = Starts 16-bit Timery
0 = Stops 16-bit Timery
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit(2)
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timery Gated Time Accumulation Enable bit(1)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(1)
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TCS: Timery Clock Source Select bit(1,3)
1 = External clock from pin TyCK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
3:
x = Bit is unknown
When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timery operation; all timer
functions are set through T2CON.
When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (TxCON<3>), the TSIDL bit
must be cleared to operate the 32-bit timer in Idle mode.
The TyCK pin is not available on all timers. Refer to the “Pin Diagrams” section for the available pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 173
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 174
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
14.0
INPUT CAPTURE
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However, it is not intended to be a comprehensive
reference
source.
To
complement the information in this data
sheet, refer to Section 12. “Input
Capture” (DS70198) in the “dsPIC33F/
PIC24H Family Reference Manual”,
which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The input capture module is useful in applications
requiring frequency (period) and pulse measurement.
The dsPIC33FJXXXGPX06A/X08A/X10A devices
support up to eight input capture channels.
• Capture timer value on every edge (rising and falling)
• Prescaler Capture Event modes:
- Capture timer value on every 4th rising
edge of input at ICx pin
- Capture timer value on every 16th rising
edge of input at ICx pin
Each input capture channel can select between one of
two 16-bit timers (Timer2 or Timer3) for the time base.
The selected timer can use either an internal or external clock.
Other operational features include:
• Device wake-up from capture pin during CPU
Sleep and Idle modes
• Interrupt on input capture event
• 4-word FIFO buffer for capture values
- Interrupt optionally generated after 1, 2, 3 or
4 buffer locations are filled
• Input capture can also be used to provide
additional sources of external interrupts
Note:
The input capture module captures the 16-bit value of
the selected Time Base register when an event occurs
at the ICx pin. The events that cause a capture event
are listed below in three categories:
Only IC1 and IC2 can trigger a DMA data
transfer. If DMA data transfers are
required, the FIFO buffer size must be set
to 1 (ICI<1:0> = 00).
• Simple Capture Event modes:
- Capture timer value on every falling edge of
input at ICx pin
- Capture timer value on every rising edge of
input at ICx pin
FIGURE 14-1:
INPUT CAPTURE BLOCK DIAGRAM
From 16-bit Timers
TMRy TMRz
16
16
1
Edge Detection Logic
and
Clock Synchronizer
Prescaler
Counter
(1, 4, 16)
ICx Pin
FIFO
R/W
Logic
ICM<2:0> (ICxCON<2:0>)
Mode Select
ICTMR
(ICxCON<7>)
FIFO
3
0
ICOV, ICBNE (ICxCON<4:3>)
ICxBUF
ICxI<1:0>
ICxCON
Interrupt
Logic
System Bus
Set Flag ICxIF
(in IFSn Register)
Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.
 2009-2012 Microchip Technology Inc.
DS70593D-page 175
dsPIC33FJXXXGPX06A/X08A/X10A
14.1
Input Capture Registers
REGISTER 14-1:
ICxCON: INPUT CAPTURE x CONTROL REGISTER
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
ICSIDL
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
ICTMR(1)
R/W-0
ICI<1:0>
R-0, HC
R-0, HC
ICOV
ICBNE
R/W-0
R/W-0
R/W-0
ICM<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
ICSIDL: Input Capture Module Stop in Idle Control bit
1 = Input capture module will halt in CPU Idle mode
0 = Input capture module will continue to operate in CPU Idle mode
bit 12-8
Unimplemented: Read as ‘0’
bit 7
ICTMR: Input Capture Timer Select bits(1)
1 = TMR2 contents are captured on capture event
0 = TMR3 contents are captured on capture event
bit 6-5
ICI<1:0>: Select Number of Captures per Interrupt bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4
ICOV: Input Capture Overflow Status Flag bit (read-only)
1 = Input capture overflow occurred
0 = No input capture overflow occurred
bit 3
ICBNE: Input Capture Buffer Empty Status bit (read-only)
1 = Input capture buffer is not empty, at least one more capture value can be read
0 = Input capture buffer is empty
bit 2-0
ICM<2:0>: Input Capture Mode Select bits
111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode
(Rising edge detect only, all other control bits are not applicable.)
110 = Unused (module disabled)
101 = Capture mode, every 16th rising edge
100 = Capture mode, every 4th rising edge
011 = Capture mode, every rising edge
010 = Capture mode, every falling edge
001 = Capture mode, every edge (rising and falling)
(ICI<1:0> bits do not control interrupt generation for this mode.)
000 = Input capture module turned off
DS70593D-page 176
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
15.0
The output compare module can select either Timer2 or
Timer3 for its time base. The module compares the
value of the timer with the value of one or two Compare
registers depending on the operating mode selected.
The state of the output pin changes when the timer
value matches the Compare register value. The output
compare module generates either a single output
pulse, or a sequence of output pulses, by changing the
state of the output pin on the compare match events.
The output compare module can also generate
interrupts on compare match events.
OUTPUT COMPARE
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A families of devices. It is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to
Section 13. “Output Compare”
(DS70209) of the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
The output compare module has multiple operating
modes:
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 15-1:
•
•
•
•
•
•
•
Active-Low One-Shot mode
Active-High One-Shot mode
Toggle mode
Delayed One-Shot mode
Continuous Pulse mode
PWM mode without Fault Protection
PWM mode with Fault Protection
OUTPUT COMPARE MODULE BLOCK DIAGRAM
Set Flag bit
OCxIF
OCxRS
Output
Logic
OCxR
S Q
R
3
OCM<2:0>
Mode Select
Comparator
0
16
1
OCTSEL
0
1
Output
Enable
OCx
Output
Enable
Logic
OCFA
16
TMR2 TMR3
 2009-2012 Microchip Technology Inc.
TMR2
Rollover
TMR3
Rollover
DS70593D-page 177
dsPIC33FJXXXGPX06A/X08A/X10A
15.1
application must disable the associated timer when
writing to the Output Compare Control registers to
avoid malfunctions.
Output Compare Modes
Configure the Output Compare modes by setting the
appropriate Output Compare Mode (OCM<2:0>) bits in
the Output Compare Control (OCxCON<2:0>) register.
Table 15-1 lists the different bit settings for the Output
Compare modes. Figure 15-2 illustrates the output
compare operation for various modes. The user
TABLE 15-1:
Note:
See Section 13. “Output Compare”
(DS70209) in the “dsPIC33F/PIC24H
Family Reference Manual” for OCxR and
OCxRS register restrictions.
OUTPUT COMPARE MODES
OCM<2:0>
Mode
OCx Pin Initial State
OCx Interrupt Generation
000
Module Disabled
001
Active-Low One-Shot
010
Active-High One-Shot
011
Toggle
100
Delayed One-Shot
0
OCx falling edge
101
Continuous Pulse
0
OCx falling edge
110
PWM without Fault Protection
‘0’, if OCxR is zero
‘1’, if OCxR is non-zero
No interrupt
111
PWM with Fault Protection
‘0’, if OCxR is zero
‘1’, if OCxR is non-zero
OCFA falling edge for OC1 to OC4
FIGURE 15-2:
Controlled by GPIO register
—
0
OCx rising edge
1
OCx falling edge
Current output is maintained
OCx rising and falling edge
OUTPUT COMPARE OPERATION
Output Compare
Mode Enabled
Timer is Reset on
Period Match
OCxRS
TMRy
OCxR
Active-Low One-Shot
(OCM = 001)
Active-High One-Shot
(OCM = 010)
Toggle
(OCM = 011)
Delayed One-Shot
(OCM = 100)
Continuous Pulse
(OCM = 101)
PWM
(OCM = 110 or 111)
DS70593D-page 178
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 15-1:
OCxCON: OUTPUT COMPARE x CONTROL REGISTER (x = 1, 2)
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
OCSIDL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R-0, HC
R/W-0
—
—
—
OCFLT
OCTSEL
R/W-0
R/W-0
R/W-0
OCM<2:0>
bit 7
bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
OCSIDL: Stop Output Compare in Idle Mode Control bit
1 = Output Compare x halts in CPU Idle mode
0 = Output Compare x continues to operate in CPU Idle mode
bit 12-5
Unimplemented: Read as ‘0’
bit 4
OCFLT: PWM Fault Condition Status bit
1 = PWM Fault condition has occurred (cleared in hardware only)
0 = No PWM Fault condition has occurred (this bit is only used when OCM<2:0> = 111)
bit 3
OCTSEL: Output Compare Timer Select bit
1 = Timer3 is the clock source for Compare x
0 = Timer2 is the clock source for Compare x
bit 2-0
OCM<2:0>: Output Compare Mode Select bits
111 = PWM mode on OCx, Fault pin enabled
110 = PWM mode on OCx, Fault pin disabled
101 = Initialize OCx pin low, generate continuous output pulses on OCx pin
100 = Initialize OCx pin low, generate single output pulse on OCx pin
011 = Compare event toggles OCx pin
010 = Initialize OCx pin high, compare event forces OCx pin low
001 = Initialize OCx pin low, compare event forces OCx pin high
000 = Output compare channel is disabled
 2009-2012 Microchip Technology Inc.
DS70593D-page 179
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 180
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
16.0
SERIAL PERIPHERAL
INTERFACE (SPI)
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
18. “Serial Peripheral Interface (SPI)”
(DS70206) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices may be serial EEPROMs, shift
registers, display drivers, Analog-to-Digital Converters
(ADC), etc. The SPI module is compatible with SPI and
SIOP from Motorola®.
Note:
In this section, the SPI modules are
referred to together as SPIx, or
separately as SPI1 and SPI2. Special
Function Registers will follow a similar
notation. For example, SPIxCON refers to
the control register for the SPI1 or SPI2
module.
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in and
out, and a buffer register, SPIxBUF. A control register,
SPIxCON, configures the module. Additionally, a status
register, SPIxSTAT, indicates various status conditions.
The serial interface consists of 4 pins: SDIx (serial data
input), SDOx (serial data output), SCKx (shift clock input
or output), and SSx (active-low slave select).
In Master mode operation, SCK is a clock output but in
Slave mode, it is a clock input.
FIGURE 16-1:
SPI MODULE BLOCK DIAGRAM
SCKx
SSx
1:1 to 1:8
Secondary
Prescaler
Sync
Control
1:1/4/16/64
Primary
Prescaler
Select
Edge
Control
Clock
SPIxCON1<1:0>
Shift Control
SPIxCON1<4:2>
SDOx
Enable
Master Clock
bit 0
SDIx
FCY
SPIxSR
Transfer
Transfer
SPIxRXB
SPIxTXB
SPIxBUF
Read SPIxBUF
Write SPIxBUF
16
Internal Data Bus
 2009-2012 Microchip Technology Inc.
DS70593D-page 181
dsPIC33FJXXXGPX06A/X08A/X10A
16.1
1.
In Frame mode, if there is a possibility that the
master may not be initialized before the slave:
a) If FRMPOL (SPIxCON2<13>) = 1, use a
pull-down resistor on SSx.
b) If FRMPOL = 0, use a pull-up resistor on
SSx.
Note:
2.
5.
This will insure that during power-up and
initialization the master/slave will not lose
sync due to an errant SCK transition that
would cause the slave to accumulate data
shift errors for both transmit and receive
appearing as corrupted data.
SPI Resources
Many useful resources related to SPI are provided on
the main product page of the Microchip web site for the
devices listed in this data sheet. This product page,
which can be accessed using this link, contains the
latest updates and additional information.
Note:
16.2.1
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en546064
KEY RESOURCES
• Section 18. “Serial Peripheral Interface (SPI)”
(DS70206)
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related dsPIC33F/PIC24H Family Reference
Manuals Sections
• Development Tools
FRMEN (SPIxCON2<15>) = 1 and SSEN
(SPIxCON1<7>) = 1 are exclusive and invalid.
In Frame mode, SCKx is continuous and the
Frame sync pulse is active on the SSx pin,
which indicates the start of a data frame.
Note:
4.
16.2
This insures that the first frame
transmission after initialization is not
shifted or corrupted.
In non-framed 3-wire mode, (i.e., not using SSx
from a master):
a) If CKP (SPIxCON1<6>) = 1, always place a
pull-up resistor on SSx.
b) If CKP = 0, always place a pull-down
resistor on SSx.
Note:
3.
SPI Helpful Tips
Not all third-party devices support Frame
mode timing. Refer to the SPI electrical
characteristics for details.
In Master mode only, set the SMP bit
(SPIxCON1<9>) to a ‘1’ for the fastest SPI data
rate possible. The SMP bit can only be set at the
same time or after the MSTEN bit
(SPIxCON1<5>) is set.
To avoid invalid slave read data to the master,
the user’s master software must guarantee
enough time for slave software to fill its write buffer before the user application initiates a master
write/read cycle. It is always advisable to preload the SPIxBUF transmit register in advance
of the next master transaction cycle. SPIxBUF is
transferred to the SPI shift register and is empty
once the data transmission begins.
DS70593D-page 182
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
16.3
SPI Control Registers
REGISTER 16-1:
SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
SPIEN
—
SPISIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/C-0
U-0
U-0
U-0
U-0
R-0
R-0
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
SPIEN: SPIx Enable bit
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14
Unimplemented: Read as ‘0’
bit 13
SPISIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
SPIROV: Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded. The user software has not read the
previous data in the SPIxBUF register
0 = No overflow has occurred
bit 5-2
Unimplemented: Read as ‘0’
bit 1
SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit not yet started, SPIxTXB is full
0 = Transmit started, SPIxTXB is empty
Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB.
Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR.
bit 0
SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty
Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB.
Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB.
 2009-2012 Microchip Technology Inc.
DS70593D-page 183
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 16-2:
U-0
—
SPIXCON1: SPIx CONTROL REGISTER 1
U-0
—
U-0
—
R/W-0
DISSCK
R/W-0
DISSDO
R/W-0
MODE16
R/W-0
SMP
R/W-0
CKE(1)
bit 15
bit 8
R/W-0
SSEN(3)
R/W-0
CKP
R/W-0
MSTEN
R/W-0
R/W-0
SPRE<2:0>(2)
R/W-0
R/W-0
R/W-0
PPRE<1:0>(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
bit 12
Unimplemented: Read as ‘0’
DISSCK: Disable SCKx pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled, pin functions as I/O
0 = Internal SPI clock is enabled
bit 11
DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by module; pin functions as I/O
0 = SDOx pin is controlled by the module
MODE16: Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 10
bit 9
x = Bit is unknown
bit 8
CKE: SPIx Clock Edge Select bit(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7
SSEN: Slave Select Enable bit (Slave mode)(3)
1 = SSx pin used for Slave mode
0 = SSx pin not used by module. Pin controlled by port function
CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 6
bit 5
MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1:
2:
3:
The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed
SPI modes (FRMEN = 1).
Do not set both Primary and Secondary prescalers to a value of 1:1.
This bit must be cleared when FRMEN = 1.
DS70593D-page 184
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 16-2:
SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
bit 4-2
SPRE<2:0>: Secondary Prescale bits (Master mode)(2)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
•
•
•
000 = Secondary prescale 8:1
bit 1-0
PPRE<1:0>: Primary Prescale bits (Master mode)(2)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
Note 1:
2:
3:
The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed
SPI modes (FRMEN = 1).
Do not set both Primary and Secondary prescalers to a value of 1:1.
This bit must be cleared when FRMEN = 1.
 2009-2012 Microchip Technology Inc.
DS70593D-page 185
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 16-3:
SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
U-0
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
—
—
—
—
—
—
FRMDLY
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
FRMEN: Framed SPIx Support bit
1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)
0 = Framed SPIx support disabled
bit 14
SPIFSD: Frame Sync Pulse Direction Control bit
1 = Frame sync pulse input (slave)
0 = Frame sync pulse output (master)
bit 13
FRMPOL: Frame Sync Pulse Polarity bit
1 = Frame sync pulse is active-high
0 = Frame sync pulse is active-low
bit 12-2
Unimplemented: Read as ‘0’
bit 1
FRMDLY: Frame Sync Pulse Edge Select bit
1 = Frame sync pulse coincides with first bit clock
0 = Frame sync pulse precedes first bit clock
bit 0
Unimplemented: Read as ‘0’
This bit must not be set to ‘1’ by the user application.
DS70593D-page 186
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
17.0
INTER-INTEGRATED
CIRCUIT™ (I2C™)
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
19. “Inter-Integrated Circuit™ (I2C™)”
(DS70195) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
17.1
Operating Modes
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
The I2C module can operate either as a slave or a
master on an I2C bus.
The following types of I2C operation are supported:
•
•
•
I2C slave operation with 7-bit addressing
I2C slave operation with 10-bit addressing
I2C master operation with 7-bit or 10-bit addressing
For details about the communication sequence in each
of these modes, please refer to the “dsPIC33F/PIC24H
Family Reference Manual”.
The Inter-Integrated Circuit (I2C) module provides
complete hardware support for both Slave and
Multi-Master modes of the I2C serial communication
standard, with a 16-bit interface.
The dsPIC33FJXXXGPX06A/X08A/X10A devices
have up to two I2C interface modules, denoted as I2C1
and I2C2. Each I2C module has a 2-pin interface: the
SCLx pin is clock and the SDAx pin is data.
Each I2C module ‘x’ (x = 1 or 2) offers the following key
features:
• I2C interface supporting both master and slave
operation
• I2C Slave mode supports 7-bit and 10-bit
addressing
• I2C Master mode supports 7-bit and 10-bit
addressing
• I2C Port allows bidirectional transfers between
master and slaves
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control)
• I2C supports multi-master operation; detects bus
collision and will arbitrate accordingly
 2009-2012 Microchip Technology Inc.
DS70593D-page 187
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 17-1:
I2C™ BLOCK DIAGRAM (X = 1 OR 2)
Internal
Data Bus
I2CxRCV
SCLx
Read
Shift
Clock
I2CxRSR
LSb
SDAx
Address Match
Match Detect
Write
I2CxMSK
Write
Read
I2CxADD
Read
Start and Stop
Bit Detect
Write
Start and Stop
Bit Generation
Control Logic
I2CxSTAT
Collision
Detect
Read
Write
I2CxCON
Acknowledge
Generation
Read
Clock
Stretching
Write
I2CxTRN
LSb
Read
Shift Clock
Reload
Control
BRG Down Counter
Write
I2CxBRG
Read
TCY/2
DS70593D-page 188
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
17.2
2
C Resources
17.3
Many useful resources related to I2C are provided on
the main product page of the Microchip web site for the
devices listed in this data sheet. This product page,
which can be accessed using this link, contains the
latest updates and additional information.
Note:
17.2.1
I2C Control Registers
I2CxCON and I2CxSTAT are control and status
registers, respectively. The I2CxCON register is
readable and writable. The lower six bits of I2CxSTAT
are read-only. The remaining bits of the I2CSTAT are
read/write.
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en546064
I2CxRSR is the shift register used for shifting data,
whereas I2CxRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CxRCV is the receive buffer. I2CxTRN is the transmit
register to which bytes are written during a transmit
operation.
KEY RESOURCES
The I2CxADD register holds the slave address. A
status bit, ADD10, indicates 10-bit Address mode. The
I2CxBRG acts as the Baud Rate Generator (BRG)
reload value.
2
• Section 11. “Inter-Integrated Circuit™ (I C™)”
(DS70195)
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related dsPIC33F/PIC24H Family Reference
Manuals Sections
• Development Tools
 2009-2012 Microchip Technology Inc.
In receive operations, I2CxRSR and I2CxRCV together
form a double-buffered receiver. When I2CxRSR
receives a complete byte, it is transferred to I2CxRCV
and an interrupt pulse is generated.
DS70593D-page 189
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 17-1:
I2CxCON: I2Cx CONTROL REGISTER
R/W-0
U-0
R/W-0
R/W-1 HC
R/W-0
R/W-0
R/W-0
R/W-0
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0 HC
R/W-0 HC
R/W-0 HC
R/W-0 HC
R/W-0 HC
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
U = Unimplemented bit, read as ‘0’
R = Readable bit
W = Writable bit
HS = Set in hardware
HC = Cleared in hardware
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
I2CEN: I2Cx Enable bit
1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins
0 = Disables the I2Cx module. All I2C pins are controlled by port functions
bit 14
Unimplemented: Read as ‘0’
bit 13
I2CSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters an Idle mode
0 = Continue module operation in Idle mode
bit 12
SCLREL: SCLx Release Control bit (when operating as I2C slave)
1 = Release SCLx clock
0 = Hold SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear
at beginning of slave transmission. Hardware clear at end of slave reception.
If STREN = 0:
Bit is R/S (i.e., software may only write ‘1’ to release clock). Hardware clear at beginning of slave
transmission.
bit 11
IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit
1 = IPMI mode is enabled; all addresses Acknowledged
0 = IPMI mode disabled
bit 10
A10M: 10-bit Slave Address bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9
DISSLW: Disable Slew Rate Control bit
1 = Slew rate control disabled
0 = Slew rate control enabled
bit 8
SMEN: SMBus Input Levels bit
1 = Enable I/O pin thresholds compliant with SMBus specification
0 = Disable SMBus input thresholds
bit 7
GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enable interrupt when a general call address is received in the I2CxRSR
(module is enabled for reception)
0 = General call address disabled
bit 6
STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with SCLREL bit.
1 = Enable software or receive clock stretching
0 = Disable software or receive clock stretching
DS70593D-page 190
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 17-1:
I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)
bit 5
ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive)
Value that will be transmitted when the software initiates an Acknowledge sequence.
1 = Send NACK during Acknowledge
0 = Send ACK during Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit
(when operating as I2C master, applicable during master receive)
1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.
Hardware clear at end of master Acknowledge sequence
0 = Acknowledge sequence not in progress
bit 3
RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte
0 = Receive sequence not in progress
bit 2
PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence
0 = Stop condition not in progress
bit 1
RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of
master Repeated Start sequence
0 = Repeated Start condition not in progress
bit 0
SEN: Start Condition Enable bit (when operating as I2C master)
1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence
0 = Start condition not in progress
 2009-2012 Microchip Technology Inc.
DS70593D-page 191
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 17-2:
I2CxSTAT: I2Cx STATUS REGISTER
R-0 HSC
R-0 HSC
U-0
U-0
U-0
R/C-0 HS
R-0 HSC
R-0 HSC
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
bit 15
bit 8
R/C-0 HS
R/C-0 HS
R-0 HSC
R/C-0 HSC
R/C-0 HSC
R-0 HSC
R-0 HSC
R-0 HSC
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
bit 7
bit 0
Legend:
U = Unimplemented bit, read as ‘0’
C = Clear only bit
R = Readable bit
W = Writable bit
HS = Set in hardware
HSC = Hardware set/cleared
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ACKSTAT: Acknowledge Status bit
(when operating as I2C master, applicable to master transmit operation)
1 = NACK received from slave
0 = ACK received from slave
Hardware set or clear at end of slave Acknowledge.
bit 14
TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.
bit 13-11
Unimplemented: Read as ‘0’
bit 10
BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware set at detection of bus collision.
bit 9
GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware set when address matches general call address. Hardware clear at Stop detection.
bit 8
ADD10: 10-Bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.
bit 7
IWCOL: Write Collision Detect bit
1 = An attempt to write the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).
bit 6
I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte
0 = No overflow
Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5
D_A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was device address
Hardware clear at device address match. Hardware set by reception of slave byte.
bit 4
P: Stop bit
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
DS70593D-page 192
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 17-2:
I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
bit 3
S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 2
R_W: Read/Write Information bit (when operating as I2C slave)
1 = Read - indicates data transfer is output from slave
0 = Write - indicates data transfer is input to slave
Hardware set or clear after reception of I 2C device address byte.
bit 1
RBF: Receive Buffer Full Status bit
1 = Receive complete, I2CxRCV is full
0 = Receive not complete, I2CxRCV is empty
Hardware set when I2CxRCV is written with received byte. Hardware clear when software
reads I2CxRCV.
bit 0
TBF: Transmit Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.
 2009-2012 Microchip Technology Inc.
DS70593D-page 193
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 17-3:
I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
AMSK9
AMSK8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
AMSK7
AMSK6
AMSK5
AMSK4
AMSK3
AMSK2
AMSK1
AMSK0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
AMSKx: Mask for Address Bit x Select bit
1 = Enable masking for bit x of incoming message address; bit match not required in this position
0 = Disable masking for bit x; bit match required in this position
DS70593D-page 194
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
18.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However, it is not intended to be a comprehensive
reference
source.
To
complement the information in this data
sheet, refer to Section 17. “UART”
(DS70188) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC33FJXXXGPX06A/X08A/X10A
device family. The UART is a full-duplex asynchronous
system that can communicate with peripheral devices,
such as personal computers, LIN, RS-232 and RS-485
interfaces. The module also supports a hardware flow
control option with the UxCTS and UxRTS pins and
also includes an IrDA® encoder and decoder.
FIGURE 18-1:
The primary features of the UART module are:
• Full-Duplex, 8 or 9-bit Data Transmission through
the UxTX and UxRX pins
• Even, Odd or No Parity Options (for 8-bit data)
• One or Two Stop bits
• Hardware Flow Control Option with UxCTS and
UxRTS pins
• Fully Integrated Baud Rate Generator with 16-bit
Prescaler
• Baud rates ranging from 10 Mbps to 38 bps at 40
MIPS
• 4-deep First-In-First-Out (FIFO) Transmit Data
Buffer
• 4-Deep FIFO Receive Data Buffer
• Parity, Framing and Buffer Overrun Error Detection
• Support for 9-bit mode with Address Detect
(9th bit = 1)
• Transmit and Receive Interrupts
• A Separate Interrupt for all UART Error Conditions
• Loopback mode for Diagnostic Support
• Support for Sync and Break Characters
• Supports Automatic Baud Rate Detection
• IrDA® Encoder and Decoder Logic
• 16x Baud Clock Output for IrDA® Support
A simplified block diagram of the UART is shown in
Figure 18-1. The UART module consists of the key
important hardware elements:
• Baud Rate Generator
• Asynchronous Transmitter
• Asynchronous Receiver
UART SIMPLIFIED BLOCK DIAGRAM
Baud Rate Generator
IrDA®
Hardware Flow Control
UxRTS/BCLK
UxCTS
UART Receiver
UxRX
UART Transmitter
UxTX
Note 1: Both UART1 and UART2 can trigger a DMA data transfer. If U1TX, U1RX, U2TX or U2RX is selected as
a DMA IRQ source, a DMA transfer occurs when the U1TXIF, U1RXIF, U2TXIF or U2RXIF bit gets set as
a result of a UART1 or UART2 transmission or reception.
2: If DMA transfers are required, the UART TX/RX FIFO buffer must be set to a size of 1 byte/word (i.e.,
UTXISEL<1:0> = 00 and URXISEL<1:0> = 00).
 2009-2012 Microchip Technology Inc.
DS70593D-page 195
dsPIC33FJXXXGPX06A/X08A/X10A
18.1
1.
2.
UART Helpful Tips
In multi-node direct-connect UART networks,
UART
receive
inputs
react
to
the
complementary logic level defined by the
URXINV bit (UxMODE<4>), which defines the
idle state, the default of which is logic high, (i.e.,
URXINV = 0). Because remote devices do not
initialize at the same time, it is likely that one of
the devices, because the RX line is floating, will
trigger a start bit detection and will cause the
first byte received after the device has been initialized to be invalid. To avoid this situation, the
user should use a pull-up or pull-down resistor
on the RX pin depending on the value of the
URXINV bit.
a) If URXINV = 0, use a pull-up resistor on the
RX pin.
b) If URXINV = 1, use a pull-down resistor on
the RX pin.
The first character received on a wake-up from
Sleep mode caused by activity on the UxRX pin
of the UART module will be invalid. In Sleep
mode, peripheral clocks are disabled. By the
time the oscillator system has restarted and
stabilized from Sleep mode, the baud rate bit
sampling clock relative to the incoming UxRX bit
timing is no longer synchronized, resulting in the
first character being invalid. This is to be
expected.
DS70593D-page 196
18.2
UART Resources
Many useful resources related to UART are provided
on the main product page of the Microchip web site for
the devices listed in this data sheet. This product page,
which can be accessed using this link, contains the
latest updates and additional information.
Note:
18.2.1
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en546064
KEY RESOURCES
•
•
•
•
•
•
Section 17. “UART” (DS70188)
Code Samples
Application Notes
Software Libraries
Webinars
All related dsPIC33F/PIC24H Family Reference
Manuals Sections
• Development Tools
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
18.3
UART Control Registers
REGISTER 18-1:
R/W-0
UxMODE: UARTx MODE REGISTER
U-0
(1)
UARTEN
—
R/W-0
USIDL
R/W-0
IREN
(2)
R/W-0
U-0
RTSMD
—
R/W-0
R/W-0
UEN<1:0>
bit 15
bit 8
R/W-0 HC
R/W-0
R/W-0 HC
R/W-0
R/W-0
WAKE
LPBACK
ABAUD
URXINV
BRGH
R/W-0
R/W-0
PDSEL<1:0>
R/W-0
STSEL
bit 7
bit 0
Legend:
HC = Hardware cleared
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
UARTEN: UARTx Enable bit(1)
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>
0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption
minimal
bit 14
Unimplemented: Read as ‘0’
bit 13
USIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12
IREN: IrDA® Encoder and Decoder Enable bit(2)
1 = IrDA® encoder and decoder enabled
0 = IrDA® encoder and decoder disabled
bit 11
RTSMD: Mode Selection for UxRTS Pin bit
1 = UxRTS pin in Simplex mode
0 = UxRTS pin in Flow Control mode
bit 10
Unimplemented: Read as ‘0’
bit 9-8
UEN<1:0>: UARTx Pin Enable bits
11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by
port latches
bit 7
WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared
in hardware on following rising edge
0 = No wake-up enabled
bit 6
LPBACK: UARTx Loopback Mode Select bit
1 = Enable Loopback mode
0 = Loopback mode is disabled
bit 5
ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character - requires reception of a Sync field (55h)
before other data; cleared in hardware upon completion
0 = Baud rate measurement disabled or completed
Note 1:
2:
Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for receive or transmit operation.
This feature is only available for the 16x BRG mode (BRGH = 0).
 2009-2012 Microchip Technology Inc.
DS70593D-page 197
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 18-1:
UxMODE: UARTx MODE REGISTER (CONTINUED)
bit 4
URXINV: Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0’
0 = UxRX Idle state is ‘1’
bit 3
BRGH: High Baud Rate Enable bit
1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)
0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)
bit 2-1
PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0
STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
Note 1:
2:
Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for receive or transmit operation.
This feature is only available for the 16x BRG mode (BRGH = 0).
DS70593D-page 198
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 18-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER
R/W-0
R/W-0
R/W-0
U-0
R/W-0 HC
R/W-0
R-0
R-1
UTXISEL1
UTXINV
UTXISEL0
—
UTXBRK
UTXEN(1)
UTXBF
TRMT
bit 15
bit 8
R/W-0
R/W-0
URXISEL<1:0>
R/W-0
R-1
R-0
R-0
R/C-0
R-0
ADDEN
RIDLE
PERR
FERR
OERR
URXDA
bit 7
bit 0
Legend:
HC = Hardware cleared
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
C = Clear only bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15,13
UTXISEL<1:0>: Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the
transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit
operations are completed
00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is
at least one character open in the transmit buffer)
bit 14
UTXINV: Transmit Polarity Inversion bit
If IREN = 0:
1 = UxTX Idle state is ‘0’
0 = UxTX Idle state is ‘1’
If IREN = 1:
1 = IrDA® encoded UxTX Idle state is ‘1’
0 = IrDA® encoded UxTX Idle state is ‘0’
bit 12
Unimplemented: Read as ‘0’
bit 11
UTXBRK: Transmit Break bit
1 = Send Sync Break on next transmission - Start bit, followed by twelve ‘0’ bits, followed by Stop bit;
cleared by hardware upon completion
0 = Sync Break transmission disabled or completed
bit 10
UTXEN: Transmit Enable bit(1)
1 = Transmit enabled, UxTX pin controlled by UARTx
0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled
by port
bit 9
UTXBF: Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8
TRMT: Transmit Shift Register Empty bit (read-only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit Shift Register is not empty, a transmission is in progress or queued
bit 7-6
URXISEL<1:0>: Receive Interrupt Mode Selection bits
11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)
10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)
0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive
buffer. Receive buffer has one or more characters
Note 1:
Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for transmit operation.
 2009-2012 Microchip Technology Inc.
DS70593D-page 199
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 18-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
bit 5
ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect
0 = Address Detect mode disabled
bit 4
RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3
PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2
FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive
FIFO)
0 = Framing error has not been detected
bit 1
OERR: Receive Buffer Overrun Error Status bit (read/clear only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1  0 transition) will reset
the receiver buffer and the UxRSR to the empty state
bit 0
URXDA: Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
Note 1:
Refer to Section 17. “UART” (DS70188) in the “dsPIC33F/PIC24H Family Reference Manual” for
information on enabling the UART module for transmit operation.
DS70593D-page 200
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
19.0
ENHANCED CAN (ECAN™)
MODULE
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However, it is not intended to be a comprehensive
reference
source.
To
complement the information in this data
sheet, refer to Section 21. “Enhanced
Controller Area Network (ECAN™)”
(DS70185) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
19.1
Overview
The Enhanced Controller Area Network (ECAN) module is a serial interface, useful for communicating with
other CAN modules or microcontroller devices. This
interface/protocol was designed to allow communications
within
noisy
environments.
The
dsPIC33FJXXXGPX06A/X08A/X10A devices contain
up to two ECAN modules.
The CAN module is a communication controller implementing the CAN 2.0 A/B protocol, as defined in the
BOSCH specification. The module will support CAN 1.2,
CAN 2.0A, CAN 2.0B Passive and CAN 2.0B Active
versions of the protocol. The module implementation is
a full CAN system. The CAN specification is not covered
within this data sheet. The reader may refer to the
BOSCH CAN specification for further details.
The module features are as follows:
• Implementation of the CAN protocol, CAN 1.2,
CAN 2.0A and CAN 2.0B
• Standard and extended data frames
• 0-8 bytes data length
• Programmable bit rate up to 1 Mbit/sec
• Automatic response to remote transmission
requests
• Up to eight transmit buffers with application specified prioritization and abort capability (each buffer
may contain up to 8 bytes of data)
• Up to 32 receive buffers (each buffer may contain
up to 8 bytes of data)
• Up to 16 full (standard/extended identifier)
acceptance filters
• Three full acceptance filter masks
• DeviceNet™ addressing support
• Programmable wake-up functionality with
integrated low-pass filter
• Programmable Loopback mode supports self-test
operation
 2009-2012 Microchip Technology Inc.
• Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
• Programmable clock source
• Programmable link to input capture module (IC2
for both CAN1 and CAN2) for time-stamping and
network synchronization
• Low-power Sleep and Idle mode
The CAN bus module consists of a protocol engine and
message buffering/control. The CAN protocol engine
handles all functions for receiving and transmitting
messages on the CAN bus. Messages are transmitted
by first loading the appropriate data registers. Status
and errors can be checked by reading the appropriate
registers. Any message detected on the CAN bus is
checked for errors and then matched against filters to
see if it should be received and stored in one of the
receive registers.
19.2
Frame Types
The CAN module transmits various types of frames
which include data messages, or remote transmission
requests initiated by the user, as other frames that are
automatically generated for control purposes. The
following frame types are supported:
• Standard Data Frame:
A standard data frame is generated by a node when
the node wishes to transmit data. It includes an
11-bit Standard Identifier (SID), but not an 18-bit
Extended Identifier (EID).
• Extended Data Frame:
An extended data frame is similar to a standard data
frame, but also includes an extended identifier.
• Remote Frame:
It is possible for a destination node to request the
data from the source. For this purpose, the
destination node sends a remote frame with an identifier that matches the identifier of the required data
frame. The appropriate data source node will then
send a data frame as a response to this remote
request.
• Error Frame:
An error frame is generated by any node that detects
a bus error. An error frame consists of two fields: an
error flag field and an error delimiter field.
• Overload Frame:
An overload frame can be generated by a node as a
result of two conditions. First, the node detects a
dominant bit during interframe space which is an illegal condition. Second, due to internal conditions, the
node is not yet able to start reception of the next
message. A node may generate a maximum of two
sequential overload frames to delay the start of the
next message.
• Interframe Space:
Interframe space separates a proceeding frame (of
whatever type) from a following data or remote
frame.
DS70593D-page 201
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 19-1:
ECAN™ MODULE BLOCK DIAGRAM
RXF15 Filter
RXF14 Filter
RXF13 Filter
RXF12 Filter
DMA Controller
RXF11 Filter
RXF10 Filter
RXF9 Filter
RXF8 Filter
TRB7 TX/RX Buffer Control Register
RXF7 Filter
TRB6 TX/RX Buffer Control Register
RXF6 Filter
TRB5 TX/RX Buffer Control Register
RXF5 Filter
TRB4 TX/RX Buffer Control Register
RXF4 Filter
TRB3 TX/RX Buffer Control Register
RXF3 Filter
TRB2 TX/RX Buffer Control Register
RXF2 Filter
RXM2 Mask
TRB1 TX/RX Buffer Control Register
RXF1 Filter
RXM1 Mask
TRB0 TX/RX Buffer Control Register
RXF0 Filter
RXM0 Mask
Transmit Byte
Sequencer
Message Assembly
Buffer
CAN Protocol
Engine
Control
Configuration
Logic
CPU
Bus
Interrupts
CiTX(1)
CiRX(1)
Note 1: i = 1 or 2 refers to a particular ECAN™ module (ECAN1 or ECAN2).
DS70593D-page 202
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
19.3
Modes of Operation
The CAN module can operate in one of several operation
modes selected by the user. These modes include:
•
•
•
•
•
•
Initialization Mode
Disable Mode
Normal Operation Mode
Listen Only Mode
Listen All Messages Mode
Loopback Mode
Modes are requested by setting the REQOP<2:0> bits
(CiCTRL1<10:8>). Entry into a mode is Acknowledged
by
monitoring
the
OPMODE<2:0>
bits
(CiCTRL1<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus Idle time, which is
defined as at least 11 consecutive recessive bits.
19.3.1
INITIALIZATION MODE
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the
interrupt flags remain unchanged. The programmer will
have access to Configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through programming errors. All registers which control
the configuration of the module cannot be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers:
•
•
•
•
•
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
19.3.2
DISABLE MODE
In Disable mode, the module will not transmit or
receive. The module has the ability to set the WAKIF bit
due to bus activity, however, any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL1<10:8>) = 001, the
module will enter the Module Disable mode. If the module
is active, the module will wait for 11 recessive bits on the
CAN bus, detect that condition as an Idle bus, then
accept the module disable command. When the
OPMODE<2:0> bits (CiCTRL1<7:5>) = 001, that
indicates whether the module successfully went into
Module Disable mode. The I/O pins will revert to normal
I/O function when the module is in the Module Disable
mode.
 2009-2012 Microchip Technology Inc.
The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
Note:
19.3.3
Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested
immediately after the CAN module has
been placed in that mode of operation, the
module waits for 11 consecutive recessive
bits on the bus before starting
transmission. If the user switches to
Disable mode within this 11-bit period,
then this transmission is aborted and the
corresponding TXABT bit is set and
TXREQ bit is cleared.
NORMAL OPERATION MODE
Normal Operation mode is selected when
REQOP<2:0> = 000. In this mode, the module is
activated and the I/O pins will assume the CAN bus
functions. The module will transmit and receive CAN
bus messages via the CiTX and CiRX pins.
19.3.4
LISTEN ONLY MODE
If the Listen Only mode is activated, the module on the
CAN bus is passive. The transmitter buffers revert to
the port I/O function. The receive pins remain inputs.
For the receiver, no error flags or Acknowledge signals
are sent. The error counters are deactivated in this
state. The Listen Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is
necessary that there are at least two further nodes that
communicate with each other.
19.3.5
LISTEN ALL MESSAGES MODE
The module can be set to ignore all errors and receive
any message. The Listen All Messages mode is
activated by setting REQOP<2:0> = ‘111’. In this
mode, the data which is in the message assembly buffer, until the time an error occurred, is copied in the
receive buffer and can be read via the CPU interface.
19.3.6
LOOPBACK MODE
If the Loopback mode is activated, the module will
connect the internal transmit signal to the internal
receive signal at the module boundary. The transmit
and receive pins revert to their port I/O function.
DS70593D-page 203
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-1:
CiCTRL1: ECAN™ CONTROL REGISTER 1
U-0
U-0
R/W-0
R/W-0
r-0
—
—
CSIDL
ABAT
—
R/W-1
R/W-0
R/W-0
REQOP<2:0>
bit 15
bit 8
R-1
R-0
R-0
OPMODE<2:0>
U-0
R/W-0
U-0
U-0
R/W-0
—
CANCAP
—
—
WIN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
r = Bit is Reserved
bit 15-14
Unimplemented: Read as ‘0’
bit 13
CSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12
ABAT: Abort All Pending Transmissions bit
1 = Signal all transmit buffers to abort transmission
0 = Module will clear this bit when all transmissions are aborted
bit 11
Reserved: Do not use
bit 10-8
REQOP<2:0>: Request Operation Mode bits
111 = Set Listen All Messages mode
110 = Reserved - do not use
101 = Reserved - do not use
100 = Set Configuration mode
011 = Set Listen Only Mode
010 = Set Loopback mode
001 = Set Disable mode
000 = Set Normal Operation mode
bit 7-5
OPMODE<2:0>: Operation Mode bits
111 = Module is in Listen All Messages mode
110 = Reserved
101 = Reserved
100 = Module is in Configuration mode
011 = Module is in Listen Only mode
010 = Module is in Loopback mode
001 = Module is in Disable mode
000 = Module is in Normal Operation mode
bit 4
Unimplemented: Read as ‘0’
bit 3
CANCAP: CAN Message Receive Timer Capture Event Enable bit
1 = Enable input capture based on CAN message receive
0 = Disable CAN capture
bit 2-1
Unimplemented: Read as ‘0’
bit 0
WIN: SFR Map Window Select bit
1 = Use filter window
0 = Use buffer window
DS70593D-page 204
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-2:
CiCTRL2: ECAN™ CONTROL REGISTER 2
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R-0
R-0
R-0
R-0
R-0
DNCNT<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
DNCNT<4:0>: DeviceNet™ Filter Bit Number bits
11111 = Invalid selection
•
•
•
10010 = Invalid selection
10001 = Compare up to data byte 3, bit 6 with EID<17>
•
•
•
00001 = Compare up to data byte 1, bit 7 with EID<0>
00000 = Do not compare data bytes
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 205
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-3:
CiVEC: ECAN™ INTERRUPT CODE REGISTER
U-0
U-0
U-0
—
—
—
R-0
R-0
R-0
R-0
R-0
FILHIT<4:0>
bit 15
bit 8
U-0
R-1
R-0
R-0
—
R-0
R-0
R-0
R-0
ICODE<6:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
FILHIT<4:0>: Filter Hit Number bits
10000-11111 = Reserved
01111 = Filter 15
•
•
•
00001 = Filter 1
00000 = Filter 0
bit 7
Unimplemented: Read as ‘0’
bit 6-0
ICODE<6:0>: Interrupt Flag Code bits
1000101-1111111 = Reserved
1000100 = FIFO almost full interrupt
1000011 = Receiver overflow interrupt
1000010 = Wake-up interrupt
1000001 = Error interrupt
1000000 = No interrupt
0010000-0111111 = Reserved
0001111 = RB15 buffer Interrupt
•
•
•
0001001 = RB9 buffer interrupt
0001000 = RB8 buffer interrupt
0000111 = TRB7 buffer interrupt
0000110 = TRB6 buffer interrupt
0000101 = TRB5 buffer interrupt
0000100 = TRB4 buffer interrupt
0000011 = TRB3 buffer interrupt
0000010 = TRB2 buffer interrupt
0000001 = TRB1 buffer interrupt
0000000 = TRB0 Buffer interrupt
DS70593D-page 206
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-4:
R/W-0
CiFCTRL: ECAN™ FIFO CONTROL REGISTER
R/W-0
R/W-0
DMABS<2:0>
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
FSA<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
DMABS<2:0>: DMA Buffer Size bits
111 = Reserved; do not use
110 = 32 buffers in DMA RAM
101 = 24 buffers in DMA RAM
100 = 16 buffers in DMA RAM
011 = 12 buffers in DMA RAM
010 = 8 buffers in DMA RAM
001 = 6 buffers in DMA RAM
000 = 4 buffers in DMA RAM
bit 12-5
Unimplemented: Read as ‘0’
bit 4-0
FSA<4:0>: FIFO Area Starts with Buffer bits
11111 = RB31 buffer
11110 = RB30 buffer
•
•
•
00001 = TRB1 buffer
00000 = TRB0 buffer
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 207
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-5:
CiFIFO: ECAN™ FIFO STATUS REGISTER
U-0
U-0
—
—
R-0
R-0
R-0
R-0
R-0
R-0
FBP<5:0>
bit 15
bit 8
U-0
U-0
—
—
R-0
R-0
R-0
R-0
R-0
R-0
FNRB<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13-8
FBP<5:0>: FIFO Write Buffer Pointer bits
011111 = RB31 buffer
011110 = RB30 buffer
•
•
•
000001 = TRB1 buffer
000000 = TRB0 buffer
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
FNRB<5:0>: FIFO Next Read Buffer Pointer bits
011111 = RB31 buffer
011110 = RB30 buffer
•
•
•
000001 = TRB1 buffer
000000 = TRB0 buffer
DS70593D-page 208
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-6:
CiINTF: ECAN™ INTERRUPT FLAG REGISTER
U-0
—
bit 15
U-0
—
R-0
TXBO
R-0
TXBP
R-0
RXBP
R-0
TXWAR
R-0
RXWAR
R-0
EWARN
bit 8
R/C-0
IVRIF
bit 7
R/C-0
WAKIF
R/C-0
ERRIF
U-0
—
R/C-0
FIFOIF
R/C-0
RBOVIF
R/C-0
RBIF
R/C-0
TBIF
bit 0
Legend:
R = Readable bit
-n = Value at POR
bit 15-14
bit 13
bit 12
bit 11
bit 10
bit 9
bit 8
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
C = Clear only bit
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
Unimplemented: Read as ‘0’
TXBO: Transmitter in Error State Bus Off bit
1 = Transmitter is in Bus Off state
0 = Transmitter is not in Bus Off state
TXBP: Transmitter in Error State Bus Passive bit
1 = Transmitter is in Bus Passive state
0 = Transmitter is not in Bus Passive state
RXBP: Receiver in Error State Bus Passive bit
1 = Receiver is in Bus Passive state
0 = Receiver is not in Bus Passive state
TXWAR: Transmitter in Error State Warning bit
1 = Transmitter is in Error Warning state
0 = Transmitter is not in Error Warning state
RXWAR: Receiver in Error State Warning bit
1 = Receiver is in Error Warning state
0 = Receiver is not in Error Warning state
EWARN: Transmitter or Receiver in Error State Warning bit
1 = Transmitter or receiver is in Error Warning state
0 = Transmitter or receiver is not in Error Warning state
IVRIF: Invalid Message Received Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
WAKIF: Bus Wake-up Activity Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
ERRIF: Error Interrupt Flag bit (multiple sources in CiINTF<13:8> register)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
Unimplemented: Read as ‘0’
FIFOIF: FIFO Almost Full Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
RBOVIF: RX Buffer Overflow Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
RBIF: RX Buffer Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
TBIF: TX Buffer Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
 2009-2012 Microchip Technology Inc.
DS70593D-page 209
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-7:
CiINTE: ECAN™ INTERRUPT ENABLE REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
IVRIE
WAKIE
ERRIE
—
FIFOIE
RBOVIE
RBIE
TBIE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7
IVRIE: Invalid Message Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
WAKIE: Bus Wake-up Activity Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
ERRIE: Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
Unimplemented: Read as ‘0’
bit 3
FIFOIE: FIFO Almost Full Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2
RBOVIE: RX Buffer Overflow Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 1
RBIE: RX Buffer Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
TBIE: TX Buffer Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70593D-page 210
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-8:
R-0
CiEC: ECAN™ TRANSMIT/RECEIVE ERROR COUNT REGISTER
R-0
R-0
R-0
R-0
R-0
R-0
R-0
TERRCNT<7:0>
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
RERRCNT<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
TERRCNT<7:0>: Transmit Error Count bits
bit 7-0
RERRCNT<7:0>: Receive Error Count bits
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 211
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-9:
CiCFG1: ECAN™ BAUD RATE CONFIGURATION REGISTER 1
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SJW<1:0>
R/W-0
R/W-0
R/W-0
BRP<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7-6
SJW<1:0>: Synchronization Jump Width bits
11 = Length is 4 x TQ
10 = Length is 3 x TQ
01 = Length is 2 x TQ
00 = Length is 1 x TQ
bit 5-0
BRP<5:0>: Baud Rate Prescaler bits
11 1111 = TQ = 2 x 64 x 1/FCAN
•
•
•
00 0010 = TQ = 2 x 3 x 1/FCAN
00 0001 = TQ = 2 x 2 x 1/FCAN
00 0000 = TQ = 2 x 1 x 1/FCAN
DS70593D-page 212
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-10: CiCFG2: ECAN™ BAUD RATE CONFIGURATION REGISTER 2
U-0
R/W-x
U-0
U-0
U-0
—
WAKFIL
—
—
—
R/W-x
R/W-x
R/W-x
SEG2PH<2:0>
bit 15
bit 8
R/W-x
R/W-x
SEG2PHTS
SAM
R/W-x
R/W-x
R/W-x
SEG1PH<2:0>
R/W-x
R/W-x
R/W-x
PRSEG<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14
WAKFIL: Select CAN bus Line Filter for Wake-up bit
1 = Use CAN bus line filter for wake-up
0 = CAN bus line filter is not used for wake-up
bit 13-11
Unimplemented: Read as ‘0’
bit 10-8
SEG2PH<2:0>: Phase Buffer Segment 2 bits
111 = Length is 8 x TQ
000 = Length is 1 x TQ
bit 7
SEG2PHTS: Phase Segment 2 Time Select bit
1 = Freely programmable
0 = Maximum of SEG1PH bits or Information Processing Time (IPT), whichever is greater
bit 6
SAM: Sample of the CAN bus Line bit
1 = Bus line is sampled three times at the sample point
0 = Bus line is sampled once at the sample point
bit 5-3
SEG1PH<2:0>: Phase Buffer Segment 1 bits
111 = Length is 8 x TQ
000 = Length is 1 x TQ
bit 2-0
PRSEG<2:0>: Propagation Time Segment bits
111 = Length is 8 x TQ
000 = Length is 1 x TQ
 2009-2012 Microchip Technology Inc.
DS70593D-page 213
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-11: CiFEN1: ECAN™ ACCEPTANCE FILTER ENABLE REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
FLTEN15
FLTEN14
FLTEN13
FLTEN12
FLTEN11
FLTEN10
FLTEN9
FLTEN8
bit 15
bit 8
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
FLTEN7
FLTEN6
FLTEN5
FLTEN4
FLTEN3
FLTEN2
FLTEN1
FLTEN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
FLTENn: Enable Filter n to Accept Messages bits
1 = Enable Filter n
0 = Disable Filter n
DS70593D-page 214
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-12: CiBUFPNT1: ECAN™ FILTER 0-3 BUFFER POINTER REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F3BP<3:0>
R/W-0
R/W-0
R/W-0
F2BP<3:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F1BP<3:0>
R/W-0
R/W-0
R/W-0
F0BP<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
F3BP<3:0>: RX Buffer Written when Filter 3 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F2BP<3:0>: RX Buffer Written when Filter 2 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 7-4
F1BP<3:0>: RX Buffer Written when Filter 1 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 3-0
F0BP<3:0>: RX Buffer Written when Filter 0 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 215
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-13: CiBUFPNT2: ECAN™ FILTER 4-7 BUFFER POINTER REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F7BP<3:0>
R/W-0
R/W-0
R/W-0
F6BP<3:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F5BP<3:0>
R/W-0
R/W-0
R/W-0
F4BP<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
F7BP<3:0>: RX Buffer Written when Filter 7 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F6BP<3:0>: RX Buffer Written when Filter 6 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 7-4
F5BP<3:0>: RX Buffer Written when Filter 5 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 3-0
F4BP<3:0>: RX Buffer Written when Filter 4 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
DS70593D-page 216
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-14: CiBUFPNT3: ECAN™ FILTER 8-11 BUFFER POINTER REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F11BP<3:0>
R/W-0
R/W-0
R/W-0
F10BP<3:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F9BP<3:0>
R/W-0
R/W-0
R/W-0
F8BP<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
F11BP<3:0>: RX Buffer Written when Filter 11 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F10BP<3:0>: RX Buffer Written when Filter 10 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 7-4
F9BP<3:0>: RX Buffer Written when Filter 9 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 3-0
F8BP<3:0>: RX Buffer Written when Filter 8 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 217
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-15: CiBUFPNT4: ECAN™ FILTER 12-15 BUFFER POINTER REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F15BP<3:0>
R/W-0
R/W-0
R/W-0
F14BP<3:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
F13BP<3:0>
R/W-0
R/W-0
R/W-0
F12BP<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
F15BP<3:0>: RX Buffer Written when Filter 15 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F14BP<3:0>: RX Buffer Written when Filter 14 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 7-4
F13BP<3:0>: RX Buffer Written when Filter 13 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 3-0
F12BP<3:0>: RX Buffer Written when Filter 12 Hits bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
DS70593D-page 218
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-16:
R/W-x
CiRXFnSID: ECAN™ ACCEPTANCE FILTER n STANDARD IDENTIFIER (n = 0, 1, ..., 15)
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
SID<10:3>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
SID<2:0>
U-0
R/W-x
U-0
—
EXIDE
—
R/W-x
R/W-x
EID<17:16>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-5
SID<10:0>: Standard Identifier bits
1 = Message address bit SIDx must be ‘1’ to match filter
0 = Message address bit SIDx must be ‘0’ to match filter
bit 4
Unimplemented: Read as ‘0’
bit 3
EXIDE: Extended Identifier Enable bit
If MIDE = 1 then:
1 = Match only messages with extended identifier addresses
0 = Match only messages with standard identifier addresses
If MIDE = 0 then:
Ignore EXIDE bit.
bit 2
Unimplemented: Read as ‘0’
bit 1-0
EID<17:16>: Extended Identifier bits
1 = Message address bit EIDx must be ‘1’ to match filter
0 = Message address bit EIDx must be ‘0’ to match filter
REGISTER 19-17:
R/W-x
x = Bit is unknown
CiRXFnEID: ECAN™ ACCEPTANCE FILTER n EXTENDED IDENTIFIER (n = 0, 1, ..., 15)
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
EID<15:8>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
EID<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
EID<15:0>: Extended Identifier bits
1 = Message address bit EIDx must be ‘1’ to match filter
0 = Message address bit EIDx must be ‘0’ to match filter
 2009-2012 Microchip Technology Inc.
DS70593D-page 219
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-18: CiFMSKSEL1: ECAN™ FILTER 7-0 MASK SELECTION REGISTER
R/W-0
R/W-0
F7MSK<1:0>
R/W-0
R/W-0
R/W-0
F6MSK<1:0>
R/W-0
R/W-0
F5MSK<1:0>
R/W-0
F4MSK<1:0>
bit 15
bit 8
R/W-0
R/W-0
F3MSK<1:0>
R/W-0
R/W-0
R/W-0
F2MSK<1:0>
R/W-0
R/W-0
F1MSK<1:0>
R/W-0
F0MSK<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
F7MSK<1:0>: Mask Source for Filter 7 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 13-12
F6MSK<1:0>: Mask Source for Filter 6 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 11-10
F5MSK<1:0>: Mask Source for Filter 5 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 9-8
F4MSK<1:0>: Mask Source for Filter 4 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 7-6
F3MSK<1:0>: Mask Source for Filter 3 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 5-4
F2MSK<1:0>: Mask Source for Filter 2 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 3-2
F1MSK<1:0>: Mask Source for Filter 1 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
bit 1-0
F0MSK<1:0>: Mask Source for Filter 0 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
DS70593D-page 220
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-19: CiFMSKSEL2: ECAN™ FILTER 15-8 MASK SELECTION REGISTER
R/W-0
R/W-0
F15MSK<1:0>
bit 15
R/W-0
R/W-0
F14MSK<1:0>
R/W-0
R/W-0
F13MSK<1:0>
R/W-0
R/W-0
F12MSK<1:0>
bit 8
R/W-0
R/W-0
F11MSK<1:0>
bit 7
R/W-0
R/W-0
F10MSK<1:0>
R/W-0
R/W-0
F9MSK<1:0>
R/W-0
R/W-0
F8MSK<1:0>
bit 0
Legend:
R = Readable bit
-n = Value at POR
bit 15-14
bit 13-12
bit 11-10
bit 9-8
bit 7-6
bit 5-4
bit 3-2
bit 1-0
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
F15MSK<1:0>: Mask Source for Filter 15 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F14MSK<1:0>: Mask Source for Filter 14 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F13MSK<1:0>: Mask Source for Filter 13 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F12MSK<1:0>: Mask Source for Filter 12 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F11MSK<1:0>: Mask Source for Filter 11 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F10MSK<1:0>: Mask Source for Filter 10 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F9MSK<1:0>: Mask Source for Filter 9 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
F8MSK<1:0>: Mask Source for Filter 8 bit
11 = Reserved; do not use
10 = Acceptance Mask 2 registers contain mask
01 = Acceptance Mask 1 registers contain mask
00 = Acceptance Mask 0 registers contain mask
 2009-2012 Microchip Technology Inc.
DS70593D-page 221
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-20: CiRXMnSID: ECAN™ ACCEPTANCE FILTER MASK n STANDARD IDENTIFIER
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
SID<10:3>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
SID<2:0>
U-0
R/W-x
U-0
—
MIDE
—
R/W-x
R/W-x
EID<17:16>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
SID<10:0>: Standard Identifier bits
1 = Include bit SIDx in filter comparison
0 = Bit SIDx is don’t care in filter comparison
bit 4
Unimplemented: Read as ‘0’
bit 3
MIDE: Identifier Receive Mode bit
1 = Match only message types (standard or extended address) that correspond to EXIDE bit in filter
0 = Match either standard or extended address message if filters match
(i.e., if (Filter SID) = (Message SID) or if (Filter SID/EID) = (Message SID/EID))
bit 2
Unimplemented: Read as ‘0’
bit 1-0
EID<17:16>: Extended Identifier bits
1 = Include bit EIDx in filter comparison
0 = Bit EIDx is don’t care in filter comparison
REGISTER 19-21: CiRXMnEID: ECAN™ ACCEPTANCE FILTER MASK n EXTENDED IDENTIFIER
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
EID<15:8>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
EID<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
EID<15:0>: Extended Identifier bits
1 = Include bit EIDx in filter comparison
0 = Bit EIDx is don’t care in filter comparison
DS70593D-page 222
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-22: CiRXFUL1: ECAN™ RECEIVE BUFFER FULL REGISTER 1
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXFUL15
RXFUL14
RXFUL13
RXFUL12
RXFUL11
RXFUL10
RXFUL9
RXFUL8
bit 15
bit 8
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXFUL7
RXFUL6
RXFUL5
RXFUL4
RXFUL3
RXFUL2
RXFUL1
RXFUL0
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
RXFUL15:RXFUL0: Receive Buffer n Full bits
1 = Buffer is full (set by module)
0 = Buffer is empty (clear by application software)
REGISTER 19-23: CiRXFUL2: ECAN™ RECEIVE BUFFER FULL REGISTER 2
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXFUL31
RXFUL30
RXFUL29
RXFUL28
RXFUL27
RXFUL26
RXFUL25
RXFUL24
bit 15
bit 8
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXFUL23
RXFUL22
RXFUL21
RXFUL20
RXFUL19
RXFUL18
RXFUL17
RXFUL16
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
RXFUL31:RXFUL16: Receive Buffer n Full bits
1 = Buffer is full (set by module)
0 = Buffer is empty (clear by application software)
 2009-2012 Microchip Technology Inc.
DS70593D-page 223
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-24: CiRXOVF1: ECAN™ RECEIVE BUFFER OVERFLOW REGISTER 1
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXOVF15
RXOVF14
RXOVF13
RXOVF12
RXOVF11
RXOVF10
RXOVF9
RXOVF8
bit 15
bit 8
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXOVF7
RXOVF6
RXOVF5
RXOVF4
RXOVF3
RXOVF2
RXOVF1
RXOVF0
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
RXOVF15:RXOVF0: Receive Buffer n Overflow bits
1 = Module pointed a write to a full buffer (set by module)
0 = Overflow is cleared (clear by application software)
REGISTER 19-25: CiRXOVF2: ECAN™ RECEIVE BUFFER OVERFLOW REGISTER 2
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXOVF31
RXOVF30
RXOVF29
RXOVF28
RXOVF27
RXOVF26
RXOVF25
RXOVF24
bit 15
bit 8
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
R/C-0
RXOVF23
RXOVF22
RXOVF21
RXOVF20
RXOVF19
RXOVF18
RXOVF17
RXOVF16
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
RXOVF31:RXOVF16: Receive Buffer n Overflow bits
1 = Module pointed a write to a full buffer (set by module)
0 = Overflow is cleared (clear by application software)
DS70593D-page 224
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-26:
CiTRmnCON: ECAN™ TX/RX BUFFER m CONTROL REGISTER (m = 0,2,4,6; n = 1,3,5,7)
R/W-0
R-0
R-0
R-0
R/W-0
R/W-0
TXENn
TXABTn
TXLARBn
TXERRn
TXREQn
RTRENn
R/W-0
R/W-0
TXnPRI<1:0>
bit 15
bit 8
R/W-0
R-0
TXENm
R-0
(1)
TXABTm
TXLARBm
R-0
(1)
TXERRm
(1)
R/W-0
R/W-0
TXREQm
RTRENm
R/W-0
R/W-0
TXmPRI<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-8
See Definition for Bits 7-0, Controls Buffer n
bit 7
TXENm: TX/RX Buffer Selection bit
1 = Buffer TRBn is a transmit buffer
0 = Buffer TRBn is a receive buffer
bit 6
TXABTm: Message Aborted bit(1)
1 = Message was aborted
0 = Message completed transmission successfully
bit 5
TXLARBm: Message Lost Arbitration bit(1)
1 = Message lost arbitration while being sent
0 = Message did not lose arbitration while being sent
bit 4
TXERRm: Error Detected During Transmission bit(1)
1 = A bus error occurred while the message was being sent
0 = A bus error did not occur while the message was being sent
bit 3
TXREQm: Message Send Request bit
Setting this bit to ‘1’ requests sending a message. The bit will automatically clear when the message
is successfully sent. Clearing the bit to ‘0’ while set will request a message abort.
bit 2
RTRENm: Auto-Remote Transmit Enable bit
1 = When a remote transmit is received, TXREQ will be set
0 = When a remote transmit is received, TXREQ will be unaffected
bit 1-0
TXmPRI<1:0>: Message Transmission Priority bits
11 = Highest message priority
10 = High intermediate message priority
01 = Low intermediate message priority
00 = Lowest message priority
Note 1:
This bit is cleared when TXREQ is set.
 2009-2012 Microchip Technology Inc.
DS70593D-page 225
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
The buffers, SID, EID, DLC, Data Field and Receive Status registers are located in DMA RAM.
REGISTER 19-27: CiTRBnSID: ECAN™ BUFFER n STANDARD IDENTIFIER (n = 0, 1, ..., 31)
U-0
U-0
U-0
—
—
—
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
SID<10:6>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
SID<5:0>
R/W-x
R/W-x
SRR
IDE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
Unimplemented: Read as ‘0’
bit 12-2
SID<10:0>: Standard Identifier bits
bit 1
SRR: Substitute Remote Request bit
1 = Message will request remote transmission
0 = Normal message
bit 0
IDE: Extended Identifier bit
1 = Message will transmit extended identifier
0 = Message will transmit standard identifier
x = Bit is unknown
REGISTER 19-28: CiTRBnEID: ECAN™ BUFFER n EXTENDED IDENTIFIER (n = 0, 1, ..., 31)
U-0
U-0
U-0
U-0
—
—
—
—
R/W-x
R/W-x
R/W-x
R/W-x
EID<17:14>
bit 15
bit 8
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
EID<13:6>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-0
EID<17:6>: Extended Identifier bits
DS70593D-page 226
x = Bit is unknown
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-29: CiTRBnDLC: ECAN™ BUFFER n DATA LENGTH CONTROL (n = 0, 1, ..., 31)
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
RTR
RB1
EID<5:0>
bit 15
bit 8
U-0
U-0
U-0
R/W-x
—
—
—
RB0
R/W-x
R/W-x
R/W-x
R/W-x
DLC<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-10
EID<5:0>: Extended Identifier bits
bit 9
RTR: Remote Transmission Request bit
1 = Message will request remote transmission
0 = Normal message
bit 8
RB1: Reserved Bit 1
User must set this bit to ‘0’ per CAN protocol.
bit 7-5
Unimplemented: Read as ‘0’
bit 4
RB0: Reserved Bit 0
User must set this bit to ‘0’ per CAN protocol.
bit 3-0
DLC<3:0>: Data Length Code bits
REGISTER 19-30:
R/W-x
x = Bit is unknown
CiTRBnDm: ECAN™ BUFFER n DATA FIELD BYTE m
(n = 0, 1, ..., 31; m = 0, 1, ..., 7)(1)
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
TRBnDm<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
x = Bit is unknown
TRBnDm<7:0>: Data Field Buffer ‘n’ Byte ‘m’ bits
The Most Significant Byte contains byte (m + 1) of the buffer.
 2009-2012 Microchip Technology Inc.
DS70593D-page 227
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 19-31: CiTRBnSTAT: ECAN™ RECEIVE BUFFER n STATUS (n = 0, 1, ..., 31)
U-0
U-0
U-0
—
—
—
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
FILHIT<4:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
FILHIT<4:0>: Filter Hit Code bits (only written by module for receive buffers, unused for transmit buffers)
Encodes number of filter that resulted in writing this buffer.
bit 7-0
Unimplemented: Read as ‘0’
DS70593D-page 228
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
20.0
DATA CONVERTER
INTERFACE (DCI) MODULE
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
20. “Data Converter Interface (DCI)”
(DS70288) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
20.1
Module Introduction
The dsPIC33FJXXXGPX06A/X08A/X10A Data Converter Interface (DCI) module allows simple interfacing
of devices, such as audio coder/decoders (Codecs),
ADC and D/A converters. The following interfaces are
supported:
• Framed Synchronous Serial Transfer (Single or
Multi-Channel)
• Inter-IC Sound (I2S) Interface
• AC-Link Compliant mode
The DCI module provides the following general
features:
• Programmable word size up to 16 bits
• Supports up to 16 time slots, for a maximum
frame size of 256 bits
• Data buffering for up to 4 samples without CPU
overhead
20.2
Module I/O Pins
There are four I/O pins associated with the module.
When enabled, the module controls the data direction
of each of the four pins.
20.2.1
CSCK PIN
The CSCK pin provides the serial clock for the DCI
module. The CSCK pin may be configured as an input
or output using the CSCKD control bit in the DCICON1
SFR. When configured as an output, the serial clock is
provided by the dsPIC33FJXXXGPX06A/X08A/X10A.
When configured as an input, the serial clock must be
provided by an external device.
20.2.2
CSDO PIN
The Serial Data Output (CSDO) pin is configured as an
output only pin when the module is enabled. The
CSDO pin drives the serial bus whenever data is to be
 2009-2012 Microchip Technology Inc.
transmitted. The CSDO pin is tri-stated, or driven to ‘0’,
during CSCK periods when data is not transmitted
depending on the state of the CSDOM control bit. This
allows other devices to place data on the serial bus
during transmission periods not used by the DCI
module.
20.2.3
CSDI PIN
The Serial Data Input (CSDI) pin is configured as an
input only pin when the module is enabled.
20.2.3.1
COFS Pin
The Codec Frame Synchronization (COFS) pin is used
to synchronize data transfers that occur on the CSDO
and CSDI pins. The COFS pin may be configured as an
input or an output. The data direction for the COFS pin
is determined by the COFSD control bit in the
DCICON1 register.
The DCI module accesses the shadow registers while
the CPU is in the process of accessing the memory
mapped buffer registers.
20.2.4
BUFFER DATA ALIGNMENT
Data values are always stored left justified in the
buffers since most Codec data is represented as a
signed 2’s complement fractional number. If the
received word length is less than 16 bits, the unused
Least Significant bits in the Receive Buffer registers are
set to ‘0’ by the module. If the transmitted word length
is less than 16 bits, the unused LSbs in the Transmit
Buffer register are ignored by the module. The word
length setup is described in subsequent sections of this
document.
20.2.5
TRANSMIT/RECEIVE SHIFT
REGISTER
The DCI module has a 16-bit shift register for shifting
serial data in and out of the module. Data is shifted in/
out of the shift register, MSb first, since audio PCM data
is transmitted in signed 2’s complement format.
20.2.6
DCI BUFFER CONTROL
The DCI module contains a buffer control unit for
transferring data between the shadow buffer memory
and the Serial Shift register. The buffer control unit is a
simple 2-bit address counter that points to word locations in the shadow buffer memory. For the receive
memory space (high address portion of DCI buffer
memory), the address counter is concatenated with a
‘0’ in the MSb location to form a 3-bit address. For the
transmit memory space (high portion of DCI buffer
memory), the address counter is concatenated with a
‘1’ in the MSb location.
Note:
The DCI buffer control unit always
accesses the same relative location in the
transmit and receive buffers, so only one
address counter is provided.
DS70593D-page 229
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 20-1:
DCI MODULE BLOCK DIAGRAM
BCG Control bits
SCKD
FOSC/4
Sample Rate
CSCK
Generator
FSD
Word Size Selection bits
Frame Length Selection bits
16-bit Data Bus
DCI Mode Selection bits
Frame
Synchronization
Generator
COFS
Receive Buffer
Registers w/Shadow
DCI Buffer
Control Unit
15
Transmit Buffer
Registers w/Shadow
0
DCI Shift Register
CSDI
CSDO
DS70593D-page 230
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 20-1:
DCICON1: DCI CONTROL REGISTER 1
R/W-0
U-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
DCIEN
—
DCISIDL
—
DLOOP
CSCKD
CSCKE
COFSD
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
UNFM
CSDOM
DJST
—
—
—
R/W-0
R/W-0
COFSM<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
DCIEN: DCI Module Enable bit
1 = Module is enabled
0 = Module is disabled
bit 14
Unimplemented: Read as ‘0’
bit 13
DCISIDL: DCI Stop in Idle Control bit
1 = Module will halt in CPU Idle mode
0 = Module will continue to operate in CPU Idle mode
bit 12
Unimplemented: Read as ‘0’
bit 11
DLOOP: Digital Loopback Mode Control bit
1 = Digital Loopback mode is enabled. CSDI and CSDO pins internally connected
0 = Digital Loopback mode is disabled
bit 10
CSCKD: Sample Clock Direction Control bit
1 = CSCK pin is an input when DCI module is enabled
0 = CSCK pin is an output when DCI module is enabled
bit 9
CSCKE: Sample Clock Edge Control bit
1 = Data changes on serial clock falling edge, sampled on serial clock rising edge
0 = Data changes on serial clock rising edge, sampled on serial clock falling edge
bit 8
COFSD: Frame Synchronization Direction Control bit
1 = COFS pin is an input when DCI module is enabled
0 = COFS pin is an output when DCI module is enabled
bit 7
UNFM: Underflow Mode bit
1 = Transmit last value written to the transmit registers on a transmit underflow
0 = Transmit ‘0’s on a transmit underflow
bit 6
CSDOM: Serial Data Output Mode bit
1 = CSDO pin will be tri-stated during disabled transmit time slots
0 = CSDO pin drives ‘0’s during disabled transmit time slots
bit 5
DJST: DCI Data Justification Control bit
1 = Data transmission/reception is begun during the same serial clock cycle as the frame
synchronization pulse
0 = Data transmission/reception is begun one serial clock cycle after frame synchronization pulse
bit 4-2
Unimplemented: Read as ‘0’
bit 1-0
COFSM<1:0>: Frame Sync Mode bits
11 = 20-bit AC-Link mode
10 = 16-bit AC-Link mode
01 = I2S Frame Sync mode
00 = Multi-Channel Frame Sync mode
 2009-2012 Microchip Technology Inc.
DS70593D-page 231
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 20-2:
DCICON2: DCI CONTROL REGISTER 2
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0
R/W-0
U-0
R/W-0
—
COFSG3
BLEN<1:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
—
COFSG<2:0>
R/W-0
R/W-0
R/W-0
WS<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-12
Unimplemented: Read as ‘0’
bit 11-10
BLEN<1:0>: Buffer Length Control bits
11 = Four data words will be buffered between interrupts
10 = Three data words will be buffered between interrupts
01 = Two data words will be buffered between interrupts
00 = One data word will be buffered between interrupts
bit 9
Unimplemented: Read as ‘0’
bit 8-5
COFSG<3:0>: Frame Sync Generator Control bits
1111 = Data frame has 16 words
•
•
•
0010 = Data frame has 3 words
0001 = Data frame has 2 words
0000 = Data frame has 1 word
bit 4
Unimplemented: Read as ‘0’
bit 3-0
WS<3:0>: DCI Data Word Size bits
1111 = Data word size is 16 bits
•
•
•
0100 = Data word size is 5 bits
0011 = Data word size is 4 bits
0010 = Invalid Selection. Do not use. Unexpected results may occur
0001 = Invalid Selection. Do not use. Unexpected results may occur
0000 = Invalid Selection. Do not use. Unexpected results may occur
DS70593D-page 232
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 20-3:
DCICON3: DCI CONTROL REGISTER 3
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
BCG<11:8>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
BCG<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-0
BCG<11:0>: DCI Bit Clock Generator Control bits
 2009-2012 Microchip Technology Inc.
x = Bit is unknown
DS70593D-page 233
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 20-4:
DCISTAT: DCI STATUS REGISTER
U-0
U-0
U-0
U-0
—
—
—
—
R-0
R-0
R-0
R-0
SLOT<3:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
R-0
R-0
R-0
R-0
—
—
—
—
ROV
RFUL
TUNF
TMPTY
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
SLOT<3:0>: DCI Slot Status bits
1111 = Slot #15 is currently active
•
•
•
0010 = Slot #2 is currently active
0001 = Slot #1 is currently active
0000 = Slot #0 is currently active
bit 7-4
Unimplemented: Read as ‘0’
bit 3
ROV: Receive Overflow Status bit
1 = A receive overflow has occurred for at least one receive register
0 = A receive overflow has not occurred
bit 2
RFUL: Receive Buffer Full Status bit
1 = New data is available in the receive registers
0 = The receive registers have old data
bit 1
TUNF: Transmit Buffer Underflow Status bit
1 = A transmit underflow has occurred for at least one transmit register
0 = A transmit underflow has not occurred
bit 0
TMPTY: Transmit Buffer Empty Status bit
1 = The transmit registers are empty
0 = The transmit registers are not empty
DS70593D-page 234
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 20-5:
RSCON: DCI RECEIVE SLOT CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RSE15
RSE14
RSE13
RSE12
RSE11
RSE10
RSE9
RSE8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RSE7
RSE6
RSE5
RSE4
RSE3
RSE2
RSE1
RSE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
RSE<15:0>: Receive Slot Enable bits
1 = CSDI data is received during the individual time slot n
0 = CSDI data is ignored during the individual time slot n
REGISTER 20-6:
TSCON: DCI TRANSMIT SLOT CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TSE15
TSE14
TSE13
TSE12
TSE11
TSE10
TSE9
TSE8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TSE7
TSE6
TSE5
TSE4
TSE3
TSE2
TSE1
TSE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
TSE<15:0>: Transmit Slot Enable Control bits
1 = Transmit buffer contents are sent during the individual time slot n
0 = CSDO pin is tri-stated or driven to logic ‘0’, during the individual time slot, depending on the state
of the CSDOM bit
 2009-2012 Microchip Technology Inc.
DS70593D-page 235
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 236
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
21.0
10-BIT/12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
Note 1: This data sheet summarizes the features of the dsPIC33FJXXXGPX06A/
X08A/X10A family of devices. However, it is not intended to be a comprehensive
reference
source.
To
complement the information in this data
sheet, refer to Section 16. “Analog-to-Digital
Converter
(ADC)”
(DS70183) in the “dsPIC33F/PIC24H
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
Depending on the particular device pinout, the ADC
can have up to 32 analog input pins, designated AN0
through AN31. In addition, there are two analog input
pins for external voltage reference connections. These
voltage reference inputs may be shared with other
analog input pins. The actual number of analog input
pins and external voltage reference input configuration
will depend on the specific device.
A block diagram of the ADC is shown in Figure 21-1.
21.2
The following configuration steps should be performed.
1.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The dsPIC33FJXXXGPX06A/X08A/X10A devices
have up to 32 ADC input channels. These devices also
have up to 2 ADC modules (ADCx, where ‘x’ = 1 or 2),
each with its own set of Special Function Registers.
The AD12B bit (ADxCON1<10>) allows each of the
ADC modules to be configured by the user as either a
10-bit, 4-sample/hold ADC (default configuration) or a
12-bit, 1-sample/hold ADC.
Note:
21.1
The ADC module needs to be disabled
before modifying the AD12B bit.
Key Features
The 10-bit ADC configuration has the following key
features:
•
•
•
•
•
•
•
•
•
•
Successive Approximation (SAR) conversion
Conversion speeds of up to 1.1 Msps
Up to 32 analog input pins
External voltage reference input pins
Simultaneous sampling of up to four analog input
pins
Automatic Channel Scan mode
Selectable conversion trigger source
Selectable Buffer Fill modes
Four result alignment options (signed/unsigned,
fractional/integer)
Operation during CPU Sleep and Idle modes
The 12-bit ADC configuration supports all the above
features, except:
• In the 12-bit configuration, conversion speeds of
up to 500 ksps are supported
• There is only 1 sample/hold amplifier in the 12-bit
configuration, so simultaneous sampling of
multiple channels is not supported.
 2009-2012 Microchip Technology Inc.
ADC Initialization
2.
Configure the ADC module:
a) Select port pins as analog inputs
(ADxPCFGH<15:0> or ADxPCFGL<15:0>).
b) Select voltage reference source to match
expected range on analog inputs
(ADxCON2<15:13>).
c) Select the analog conversion clock to match
desired data rate with processor clock
(ADxCON3<7:0>).
d) Determine how many S/H channels will be
used (ADxCON2<9:8> and
ADxPCFGH<15:0> or ADxPCFGL<15:0>).
e) Select the appropriate sample/conversion
sequence (ADxCON1<7:5> and
ADxCON3<12:8>).
f) Select how conversion results are presented
in the buffer (ADxCON1<9:8>).
g) Turn on ADC module (ADxCON1<15>).
Configure ADC interrupt (if required):
a) Clear the ADxIF bit.
b) Select ADC interrupt priority.
21.3
ADC and DMA
If more than one conversion result needs to be buffered
before triggering an interrupt, DMA data transfers can
be used. Both ADC1 and ADC2 can trigger a DMA data
transfer. If ADC1 or ADC2 is selected as the DMA IRQ
source, a DMA transfer occurs when the AD1IF or
AD2IF bit gets set as a result of an ADC1 or ADC2
sample conversion sequence.
The SMPI<3:0> bits (ADxCON2<5:2>) are used to
select how often the DMA RAM buffer pointer is
incremented.
The ADDMABM bit (ADxCON1<12>) determines how
the conversion results are filled in the DMA RAM buffer
area being used for ADC. If this bit is set, DMA buffers
are written in the order of conversion. The module will
provide an address to the DMA channel that is the
same as the address used for the non-DMA
stand-alone buffer. If the ADDMABM bit is cleared, then
DMA buffers are written in Scatter/Gather mode. The
module will provide a scatter/gather address to the
DMA channel, based on the index of the analog input
and the size of the DMA buffer.
DS70593D-page 237
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 21-1:
ADCx MODULE BLOCK DIAGRAM
AN0
ANy(3)
S/H0
CHANNEL
SCAN
+
CH0SA<4:0>
CH0
CH0SB<4:0>
-
CSCNA
AN1
VREFL
CH0NA CH0NB
AN0
(1)
AN3
S/H1
VREF+(1) AVDD VREF-
AVSS
+
-
CH123SA CH123SB
CH1(2)
AN6
VCFG<2:0>
AN9
VREFL
VREFH
VREFL
CH123NA CH123NB
SAR ADC
ADC1BUF0
AN1
AN4
S/H2
+
CH123SA CH123SB
CH2(2)
-
AN7
AN10
VREFL
CH123NA CH123NB
AN2
AN5
S/H3
+
CH123SA CH123SB
CH3(2)
-
AN8
AN11
VREFL
CH123NA CH123NB
Alternate
Input Selection
Note
1:
2:
3:
VREF+, VREF- inputs can be multiplexed with other analog inputs.
Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.
For 64-pin devices, y = 17; for 80-pin devices, y = 23; for 100-pin devices, y = 31; for ADC2, y = 15.
DS70593D-page 238
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 21-2:
ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM
ADxCON3<15>
ADC Internal
RC Clock(2)
1
TAD
ADxCON3<5:0>
0
6
TOSC(1)
X2
TCY
ADC Conversion
Clock Multiplier
1, 2, 3, 4, 5,..., 64
Note 1:
2:
Refer to Figure 9-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to
the clock source frequency. TOSC = 1/FOSC.
See the ADC electrical specifications for the exact RC clock value.
 2009-2012 Microchip Technology Inc.
DS70593D-page 239
dsPIC33FJXXXGPX06A/X08A/X10A
21.4
1.
2.
3.
4.
5.
ADC Helpful Tips
The SMPI<3:0> (AD1CON2<5:2>) control bits:
a) Determine when the ADC interrupt flag is
set and an interrupt is generated if enabled.
b) When the CSCNA bit (AD1CON2<10>) is
set to ‘1’, determines when the ADC analog
scan channel list defined in the AD1CSSL/
AD1CSSH registers starts over from the
beginning.
c) On devices without a DMA peripheral,
determines when ADC result buffer pointer
to ADC1BUF0-ADC1BUFF, gets reset back
to the beginning at ADC1BUF0.
On devices without a DMA module, the ADC has
16 result buffers. ADC conversion results are
stored sequentially in ADC1BUF0-ADC1BUFF
regardless of which analog inputs are being
used subject to the SMPI<3:0> bits
(AD1CON2<5:2>) and the condition described
in 1c above. There is no relationship between
the ANx input being measured and which ADC
buffer (ADC1BUF0-ADC1BUFF) that the
conversion results will be placed in.
On devices with a DMA module, the ADC module has only 1 ADC result buffer, (i.e.,
ADC1BUF0), per ADC peripheral and the ADC
conversion result must be read either by the
CPU or DMA controller before the next ADC
conversion is complete to avoid overwriting the
previous value.
The DONE bit (AD1CON1<0>) is only cleared at
the start of each conversion and is set at the
completion of the conversion, but remains set
indefinitely even through the next sample phase
until the next conversion begins. If application
code is monitoring the DONE bit in any kind of
software loop, the user must consider this
behavior because the CPU code execution is
faster than the ADC. As a result, in manual sample mode, particularly where the users code is
setting the SAMP bit (AD1CON1<1>), the
DONE bit should also be cleared by the user
application just before setting the SAMP bit.
On devices with two ADC modules, the
ADCxPCFG registers for both ADC modules
must be set to a logic ‘1’ to configure a target
I/O pin as a digital I/O pin. Failure to do so
means that any alternate digital input function
will always see only a logic ‘0’ as the digital
input buffer is held in Disable mode.
DS70593D-page 240
21.5
ADC Resources
Many useful resources related to ADC are provided on
the main product page of the Microchip web site for the
devices listed in this data sheet. This product page,
which can be accessed using this link, contains the
latest updates and additional information.
Note:
21.5.1
In the event you are not able to access the
product page using the link above, enter
this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en546064
KEY RESOURCES
• Section 16. “Analog-to-Digital Converter
(ADC)” (DS70183)
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All related dsPIC33F/PIC24H Family Reference
Manuals Sections
• Development Tools
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-1:
ADxCON1: ADCx CONTROL REGISTER 1 (where x = 1 or 2)
R/W-0
U-0
R/W-0
R/W-0
U-0
R/W-0
ADON
—
ADSIDL
ADDMABM
—
AD12B
R/W-0
R/W-0
FORM<1:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
SSRC<2:0>
U-0
R/W-0
R/W-0
R/W-0
HC,HS
R/C-0
HC, HS
—
SIMSAM
ASAM
SAMP
DONE
bit 7
bit 0
Legend:
HC = Cleared by hardware
HS = Set by hardware
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
C = Clear only bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ADON: ADC Operating Mode bit
1 = ADC module is operating
0 = ADC is off
bit 14
Unimplemented: Read as ‘0’
bit 13
ADSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12
ADDMABM: DMA Buffer Build Mode bit
1 = DMA buffers are written in the order of conversion. The module will provide an address to the DMA
channel that is the same as the address used for the non-DMA stand-alone buffer
0 = DMA buffers are written in Scatter/Gather mode. The module will provide a scatter/gather address
to the DMA channel, based on the index of the analog input and the size of the DMA buffer
bit 11
Unimplemented: Read as ‘0’
bit 10
AD12B: 10-Bit or 12-Bit Operation Mode bit
1 = 12-bit, 1-channel ADC operation
0 = 10-bit, 4-channel ADC operation
bit 9-8
FORM<1:0>: Data Output Format bits
For 10-bit operation:
11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>)
10 = Fractional (DOUT = dddd dddd dd00 0000)
01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>)
00 = Integer (DOUT = 0000 00dd dddd dddd)
For 12-bit operation:
11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>)
10 = Fractional (DOUT = dddd dddd dddd 0000)
01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>)
00 = Integer (DOUT = 0000 dddd dddd dddd)
bit 7-5
SSRC<2:0>: Sample Clock Source Select bits
111 = Internal counter ends sampling and starts conversion (auto-convert)
110 = Reserved
101 = Reserved
100 = GP timer (Timer5 for ADC1, Timer3 for ADC2) compare ends sampling and starts conversion
011 = Reserved
010 = GP timer (Timer3 for ADC1, Timer5 for ADC2) compare ends sampling and starts conversion
001 = Active transition on INT0 pin ends sampling and starts conversion
000 = Clearing sample bit ends sampling and starts conversion
bit 4
Unimplemented: Read as ‘0’
 2009-2012 Microchip Technology Inc.
DS70593D-page 241
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-1:
ADxCON1: ADCx CONTROL REGISTER 1 (where x = 1 or 2) (CONTINUED)
bit 3
SIMSAM: Simultaneous Sample Select bit (only applicable when CHPS<1:0> = 01 or 1x)
When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’
1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or
Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01)
0 = Samples multiple channels individually in sequence
bit 2
ASAM: ADC Sample Auto-Start bit
1 = Sampling begins immediately after last conversion. SAMP bit is auto-set
0 = Sampling begins when SAMP bit is set
bit 1
SAMP: ADC Sample Enable bit
1 = ADC sample/hold amplifiers are sampling
0 = ADC sample/hold amplifiers are holding
If ASAM = 0, software may write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1.
If SSRC = 000, software may write ‘0’ to end sampling and start conversion. If SSRC 000,
automatically cleared by hardware to end sampling and start conversion.
bit 0
DONE: ADC Conversion Status bit
1 = ADC conversion cycle is completed
0 = ADC conversion not started or in progress
Automatically set by hardware when ADC conversion is complete. Software may write ‘0’ to clear
DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in progress. Automatically cleared by hardware at start of a new conversion.
DS70593D-page 242
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-2:
R/W-0
ADxCON2: ADCx CONTROL REGISTER 2 (where x = 1 or 2)
R/W-0
R/W-0
VCFG<2:0>
U-0
U-0
R/W-0
—
—
CSCNA
R/W-0
R/W-0
CHPS<1:0>
bit 15
bit 8
R-0
U-0
BUFS
—
R/W-0
R/W-0
R/W-0
R/W-0
SMPI<3:0>
R/W-0
R/W-0
BUFM
ALTS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
x = Bit is unknown
VCFG<2:0>: Converter Voltage Reference Configuration bits
000
001
010
011
1xx
VREF+
VREF-
AVDD
External VREF+
AVDD
External VREF+
AVDD
AVSS
AVSS
External VREFExternal VREFAvss
bit 12-11
Unimplemented: Read as ‘0’
bit 10
CSCNA: Scan Input Selections for CH0+ during Sample A bit
1 = Scan inputs
0 = Do not scan inputs
bit 9-8
CHPS<1:0>: Selects Channels Utilized bits
When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’
1x = Converts CH0, CH1, CH2 and CH3
01 = Converts CH0 and CH1
00 = Converts CH0
bit 7
BUFS: Buffer Fill Status bit (only valid when BUFM = 1)
1 = ADC is currently filling second half of buffer, user should access data in first half
0 = ADC is currently filling first half of buffer, user should access data in second half
bit 6
Unimplemented: Read as ‘0’
bit 5-2
SMPI<3:0>: Selects Increment Rate for DMA Addresses bits or number of sample/conversion
operations per interrupt
1111 = Increments the DMA address or generates interrupt after completion of every 16th sample/
conversion operation
1110 = Increments the DMA address or generates interrupt after completion of every 15th sample/
conversion operation
•
•
•
0001 = Increments the DMA address or generates interrupt after completion of every 2nd sample/
conversion operation
0000 = Increments the DMA address or generates interrupt after completion of every sample/conversion operation
bit 1
BUFM: Buffer Fill Mode Select bit
1 = Starts filling first half of buffer on first interrupt and second half of the buffer on next interrupt
0 = Always starts filling buffer from the beginning
bit 0
ALTS: Alternate Input Sample Mode Select bit
1 = Uses channel input selects for Sample A on first sample and Sample B on next sample
0 = Always uses channel input selects for Sample A
 2009-2012 Microchip Technology Inc.
DS70593D-page 243
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-3:
R/W-0
ADxCON3: ADCx CONTROL REGISTER 3
U-0
ADRC
—
U-0
R/W-0
R/W-0
—
R/W-0
SAMC<4:0>
R/W-0
R/W-0
(1)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADCS<7:0>
R/W-0
R/W-0
R/W-0
(2)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ADRC: ADC Conversion Clock Source bit
1 = ADC internal RC clock
0 = Clock derived from system clock
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
SAMC<4:0>: Auto Sample Time bits(1)
11111 = 31 TAD
•
•
•
00001 = 1 TAD
00000 = 0 TAD
bit 7-0
ADCS<7:0>: ADC Conversion Clock Select bits(2)
11111111 = Reserved
•
•
•
01000000 = Reserved
00111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD
•
•
•
00000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD
00000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD
00000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD
Note 1:
2:
x = Bit is unknown
This bit only used if ADxCON1<7:5> (SSRC<2:0>) = 111.
This bit is not used if ADxCON3<15> (ADRC) = 1.
DS70593D-page 244
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-4:
ADxCON4: ADCx CONTROL REGISTER 4
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-0
R/W-0
R/W-0
DMABL<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-3
Unimplemented: Read as ‘0’
bit 2-0
DMABL<2:0>: Selects Number of DMA Buffer Locations per Analog Input bits
111 = Allocates 128 words of buffer to each analog input
110 = Allocates 64 words of buffer to each analog input
101 = Allocates 32 words of buffer to each analog input
100 = Allocates 16 words of buffer to each analog input
011 = Allocates 8 words of buffer to each analog input
010 = Allocates 4 words of buffer to each analog input
001 = Allocates 2 words of buffer to each analog input
000 = Allocates 1 word of buffer to each analog input
 2009-2012 Microchip Technology Inc.
DS70593D-page 245
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-5:
ADxCHS123: ADCx INPUT CHANNEL 1, 2, 3 SELECT REGISTER
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-0
R/W-0
CH123NB<1:0>
R/W-0
CH123SB
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-0
R/W-0
CH123NA<1:0>
R/W-0
CH123SA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-9
CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits
When AD12B = 1, CHxNB is: U-0, Unimplemented, Read as ‘0’
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
0x = CH1, CH2, CH3 negative input is VREF-
bit 8
CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit
When AD12B = 1, CHxSB is: U-0, Unimplemented, Read as ‘0’
1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
bit 7-3
Unimplemented: Read as ‘0’
bit 2-1
CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits
When AD12B = 1, CHxNA is: U-0, Unimplemented, Read as ‘0’
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
0x = CH1, CH2, CH3 negative input is VREF-
bit 0
CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit
When AD12B = 1, CHxSA is: U-0, Unimplemented, Read as ‘0’
1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
DS70593D-page 246
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-6:
ADxCHS0: ADCx INPUT CHANNEL 0 SELECT REGISTER
R/W-0
U-0
U-0
CH0NB
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0SB<4:0>(1)
bit 15
bit 8
R/W-0
U-0
U-0
CH0NA
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0SA<4:0>(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
CH0NB: Channel 0 Negative Input Select for Sample B bit
Same definition as bit 7.
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits(1)
11111 = Channel 0 positive input is AN31
11110 = Channel 0 positive input is AN30
•
•
•
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
bit 7
CH0NA: Channel 0 Negative Input Select for Sample A bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VREF-
bit 6-5
Unimplemented: Read as ‘0’
bit 4-0
CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits(1)
11111 = Channel 0 positive input is AN31
11110 = Channel 0 positive input is AN30
•
•
•
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
Note 1:
x = Bit is unknown
ADC2 can only select AN0 through AN15 as positive input.
 2009-2012 Microchip Technology Inc.
DS70593D-page 247
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-7:
ADxCSSH: ADCx INPUT SCAN SELECT REGISTER HIGH(1,2)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS31
CSS30
CSS29
CSS28
CSS27
CSS26
CSS25
CSS24
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS23
CSS22
CSS21
CSS20
CSS19
CSS18
CSS17
CSS16
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
CSS<31:16>: ADC Input Scan Selection bits
1 = Select ANx for input scan
0 = Skip ANx for input scan
Note 1: On devices without 32 analog inputs, all ADxCSSH bits may be selected by user. However, inputs selected
for scan without a corresponding input on device will convert VREFL.
2: CSSx = ANx, where x = 16 through 31.
REGISTER 21-8:
ADxCSSL: ADCx INPUT SCAN SELECT REGISTER LOW(1,2)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS15
CSS14
CSS13
CSS12
CSS11
CSS10
CSS9
CSS8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS7
CSS6
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
Note 1:
2:
x = Bit is unknown
CSS<15:0>: ADC Input Scan Selection bits
1 = Select ANx for input scan
0 = Skip ANx for input scan
On devices without 16 analog inputs, all ADxCSSL bits may be selected by user. However, inputs selected
for scan without a corresponding input on device will convert VREF-.
CSSx = ANx, where x = 0 through 15.
DS70593D-page 248
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
REGISTER 21-9:
AD1PCFGH: ADC1 PORT CONFIGURATION REGISTER HIGH(1,2,3,4)
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PCFG31
PCFG30
PCFG29
PCFG28
PCFG27
PCFG26
PCFG25
PCFG24
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PCFG23
PCFG22
PCFG21
PCFG20
PCFG19
PCFG18
PCFG17
PCFG16
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-0
x = Bit is unknown
PCFG<31:16>: ADC Port Configuration Control bits
1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS
0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage
Note 1: On devices without 32 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on
ports without a corresponding input on device.
2: ADC2 only supports analog inputs AN0-AN15; therefore, no ADC2 port Configuration register exists.
3: PCFGx = ANx, where x = 16 through 31.
4: PCFGx bits have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In this
case all port pins multiplexed with ANx will be in Digital mode.
REGISTER 21-10: ADxPCFGL: ADCx PORT CONFIGURATION REGISTER LOW(1,2,3,4)
R/W-0
PCFG15
bit 15
R/W-0
PCFG14
R/W-0
PCFG13
R/W-0
PCFG12
R/W-0
PCFG11
R/W-0
PCFG10
R/W-0
PCFG9
R/W-0
PCFG8
bit 8
R/W-0
PCFG7
bit 7
R/W-0
PCFG6
R/W-0
PCFG5
R/W-0
PCFG4
R/W-0
PCFG3
R/W-0
PCFG2
R/W-0
PCFG1
R/W-0
PCFG0
bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-0
PCFG<15:0>: ADC Port Configuration Control bits
1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS
0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage
Note 1:
On devices without 16 analog inputs, all PCFG bits are R/W by user. However, PCFG bits are ignored on
ports without a corresponding input on device.
On devices with two analog-to-digital modules, both AD1PCFGL and AD2PCFGL will affect the
configuration of port pins multiplexed with AN0-AN15.
PCFGx = ANx, where x = 0 through 15.
PCFGx bits have no effect if ADC module is disabled by setting ADxMD bit in the PMDx register. In this
case all port pins multiplexed with ANx will be in Digital mode
2:
3:
4:
 2009-2012 Microchip Technology Inc.
DS70593D-page 249
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 250
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
22.0
SPECIAL FEATURES
22.1
Configuration Bits
dsPIC33FJXXXGPX06A/X08A/X10A devices provide
nonvolatile memory implementation for device
configuration bits. Refer to Section 25. “Device Configuration” (DS70194) of the “dsPIC33F/PIC24H
Family Reference Manual”, for more information on this
implementation.
Note 1: This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section
23.
“CodeGuard™
Security”
(DS70199), Section 24. “Programming
and Diagnostics” (DS70207), and Section 25. “Device Configuration”
(DS70194) in the “dsPIC33F/PIC24H
Family Reference Manual”, which are
available from the Microchip web site
(www.microchip.com).
The Configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’), to select
various device configurations. These bits are mapped
starting at program memory location 0xF80000.
The device Configuration register map is shown in
Table 22-1.
The individual Configuration bit descriptions for the
Configuration registers are shown in Table 22-2.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note that address 0xF80000 is beyond the user program
memory space. In fact, it belongs to the configuration
memory space (0x800000-0xFFFFFF) which can only be
accessed using table reads and table writes.
dsPIC33FJXXXGPX06A/X08A/X10A devices include
the following features intended to maximize application
flexibility and reliability, and minimize cost through elimination of external components:
•
•
•
•
•
•
Flexible Configuration
Watchdog Timer (WDT)
Code Protection and CodeGuard™ Security
JTAG Boundary Scan Interface
In-Circuit Serial Programming™ (ICSP™)
In-Circuit Emulation
TABLE 22-1:
Address
DEVICE CONFIGURATION REGISTER MAP
Name
0xF80000 FBS
0xF80002 FSS
0xF80004 FGS
0xF80006 FOSCSEL
0xF80008 FOSC
0xF8000A FWDT
0xF8000C FPOR
0xF8000E FICD
Bit 7
Bit 6
RBS<1:0>
RSS<1:0>
—
IESO
—
Reserved(2)
FCKSM<1:0>
FWDTEN
WINDIS
Reserved(4)
Reserved(1)
Bit 5
Bit 4
Bit 3
Bit 2
—
—
—
—
—
—
—
—
—
—
GSS1
GSS0 GWRP
FNOSC<2:0>
—
PLLKEN(3)
—
WDTPRE
—
OSCIOFNC POSCMD<1:0>
WDTPOST<3:0>
JTAGEN
—
—
—
—
BSS<2:0>
SSS<2:0>
0xF80010 FUID0
0xF80012 FUID1
User Unit ID Byte 0
User Unit ID Byte 1
0xF80014 FUID2
0xF80016 FUID3
User Unit ID Byte 2
User Unit ID Byte 3
Bit 1
Bit 0
BWRP
SWRP
FPWRT<2:0>
—
ICS<1:0>
Legend: — = unimplemented bit, read as ‘0’.
Note 1: These bits are reserved for use by development tools and must be programmed as ‘1’.
2: When read, this bit returns the current programmed value.
3: This bit is unimplemented on dsPIC33FJ64GPX06A/X08A/X10A and dsPIC33FJ128GPX06A/X08A/X10A
devices and reads as ‘0’.
4: These bits are reserved and always read as ‘1’.
 2009-2012 Microchip Technology Inc.
DS70593D-page 251
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 22-2:
CONFIGURATION BITS DESCRIPTION
RTSP
Effect
Bit Field
Register
BWRP
FBS
Immediate Boot Segment Program Flash Write Protection
1 = Boot segment may be written
0 = Boot segment is write-protected
BSS<2:0>
FBS
Immediate Boot Segment Program Flash Code Protection Size
X11 = No Boot program Flash segment
Description
Boot space is 1K IW less VS
110 = Standard security; boot program Flash segment starts at End of VS,
ends at 0007FEh
010 = High security; boot program Flash segment starts at End of VS, ends
at 0007FEh
Boot space is 4K IW less VS
101 = Standard security; boot program Flash segment starts at End of VS,
ends at 001FFEh
001 = High security; boot program Flash segment starts at End of VS, ends
at 001FFEh
Boot space is 8K IW less VS
100 = Standard security; boot program Flash segment starts at End of VS,
ends at 003FFEh
000 = High security; boot program Flash segment starts at End of VS, ends
at 003FFEh
RBS<1:0>
FBS
Immediate Boot Segment RAM Code Protection
11 = No Boot RAM defined
10 = Boot RAM is 128 Bytes
01 = Boot RAM is 256 Bytes
00 = Boot RAM is 1024 Bytes
SWRP
FSS
Immediate Secure Segment Program Flash Write Protection
1 = Secure segment may be written
0 = Secure segment is write-protected
DS70593D-page 252
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 22-2:
CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field
Register
SSS<2:0>
FSS
RTSP
Effect
Description
Immediate Secure Segment Program Flash Code Protection Size
(FOR 128K and 256K DEVICES)
X11 = No Secure program Flash segment
Secure space is 8K IW less BS
110 = Standard security; secure program Flash segment starts at End of
BS, ends at 0x003FFE
010 = High security; secure program Flash segment starts at End of BS,
ends at 0x003FFE
Secure space is 16K IW less BS
101 = Standard security; secure program Flash segment starts at End of
BS, ends at 0x007FFE
001 = High security; secure program Flash segment starts at End of BS,
ends at 0x007FFE
Secure space is 32K IW less BS
100 = Standard security; secure program Flash segment starts at End of
BS, ends at 0x00FFFE
000 = High security; secure program Flash segment starts at End of BS,
ends at 0x00FFFE
(FOR 64K DEVICES)
X11 = No Secure program Flash segment
Secure space is 4K IW less BS
110 = Standard security; secure program Flash segment starts at End of
BS, ends at 0x001FFE
010 = High security; secure program Flash segment starts at End of BS,
ends at 0x001FFE
Secure space is 8K IW less BS
101 = Standard security; secure program Flash segment starts at End of
BS, ends at 0x003FFE
001 = High security; secure program Flash segment starts at End of BS,
ends at 0x003FFE
Secure space is 16K IW less BS
100 = Standard security; secure program Flash segment starts at End of
BS, ends at 007FFEh
000 = High security; secure program Flash segment starts at End of BS,
ends at 0x007FFE
RSS<1:0>
FSS
Immediate Secure Segment RAM Code Protection
11 = No Secure RAM defined
10 = Secure RAM is 256 Bytes less BS RAM
01 = Secure RAM is 2048 Bytes less BS RAM
00 = Secure RAM is 4096 Bytes less BS RAM
GSS<1:0>
FGS
Immediate General Segment Code-Protect bit
11 = User program memory is not code-protected
10 = Standard security; general program Flash segment starts at End of
SS, ends at EOM
0x = High security; general program Flash segment starts at End of SS,
ends at EOM
 2009-2012 Microchip Technology Inc.
DS70593D-page 253
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 22-2:
CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field
Register
GWRP
FGS
IESO
RTSP
Effect
Description
Immediate General Segment Write-Protect bit
1 = User program memory is not write-protected
0 = User program memory is write-protected
FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit
1 = Start-up device with FRC, then automatically switch to the user-selected
oscillator source when ready
0 = Start-up device with user-selected oscillator source
FNOSC<2:0>
FOSCSEL
FCKSM<1:0>
FOSC
Immediate Clock Switching Mode bits
1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
OSCIOFNC
FOSC
Immediate OSC2 Pin Function bit (except in XT and HS modes)
1 = OSC2 is clock output
0 = OSC2 is general purpose digital I/O pin
POSCMD<1:0>
FOSC
Immediate Primary Oscillator Mode Select bits
11 = Primary oscillator disabled
10 = HS Crystal Oscillator mode
01 = XT Crystal Oscillator mode
00 = EC (External Clock) mode
FWDTEN
FWDT
Immediate Watchdog Timer Enable bit
1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled.
Clearing the SWDTEN bit in the RCON register will have no effect.)
0 = Watchdog Timer enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register)
WINDIS
FWDT
Immediate Watchdog Timer Window Enable bit
1 = Watchdog Timer in Non-Window mode
0 = Watchdog Timer in Window mode
PLLKEN
FWDT
Immediate PLL Lock Enable bit
1 = Clock switch to PLL source will wait until the PLL lock signal is valid.
0 = Clock switch will not wait for the PLL lock signal.
WDTPRE
FWDT
Immediate Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
WDTPOST
FWDT
Immediate Watchdog Timer Postscaler bits
1111 = 1:32,768
1110 = 1:16,384
•
•
•
0001 = 1:2
0000 = 1:1
DS70593D-page 254
If clock
switch is
enabled,
RTSP
effect is
on any
device
Reset;
otherwise,
Immediate
Initial Oscillator Source Selection bits
111 = Internal Fast RC (FRC) oscillator with postscaler
110 = Internal Fast RC (FRC) oscillator with divide-by-16
101 = LPRC oscillator
100 = Secondary (LP) oscillator
011 = Primary (XT, HS, EC) oscillator with PLL
010 = Primary (XT, HS, EC) oscillator
001 = Internal Fast RC (FRC) oscillator with PLL
000 = FRC oscillator
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 22-2:
CONFIGURATION BITS DESCRIPTION (CONTINUED)
RTSP
Effect
Bit Field
Register
FPWRT<2:0>
FPOR
Immediate Power-on Reset Timer Value Select bits
111 = PWRT = 128 ms
110 = PWRT = 64 ms
101 = PWRT = 32 ms
100 = PWRT = 16 ms
011 = PWRT = 8 ms
010 = PWRT = 4 ms
001 = PWRT = 2 ms
000 = PWRT = Disabled
JTAGEN
FICD
Immediate JTAG Enable bits
1 = JTAG enabled
0 = JTAG disabled
ICS<1:0>
FICD
Immediate ICD Communication Channel Select bits
11 = Communicate on PGEC1 and PGED1
10 = Communicate on PGEC2 and PGED2
01 = Communicate on PGEC3 and PGED3
00 = Reserved
 2009-2012 Microchip Technology Inc.
Description
DS70593D-page 255
dsPIC33FJXXXGPX06A/X08A/X10A
22.2
On-Chip Voltage Regulator
All of the dsPIC33FJXXXGPX06A/X08A/X10A devices
power their core digital logic at a nominal 2.5V. This
may create an issue for designs that are required to
operate at a higher typical voltage, such as 3.3V. To
simplify system design, all devices in the
dsPIC33FJXXXGPX06A/X08A/X10A family incorporate an on-chip regulator that allows the device to
run its core logic from VDD.
The regulator provides power to the core from the
other VDD pins. The regulator requires that a
low-ESR (less than 5 ohms) capacitor (such as
tantalum or ceramic) be connected to the VCAP pin
(Figure 22-1). This helps to maintain the stability of
the regulator. The recommended value for the filter
capacitor is provided in Table 25-13 of Section 25.0
“Electrical Characteristics”.
It is important for the low-ESR capacitor to
be placed as close as possible to the VCAP
pin.
Note:
On a POR, it takes approximately 20 s for the on-chip
voltage regulator to generate an output voltage. During
this time, designated as TSTARTUP, code execution is
disabled. TSTARTUP is applied every time the device
resumes operation after any power-down.
FIGURE 22-1:
CONNECTIONS FOR THE
ON-CHIP VOLTAGE
REGULATOR(1,2,3)
22.3
BOR: Brown-out Reset
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit that monitors the
regulated voltage VCAP. The main purpose of the BOR
module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines or voltage sags due to
excessive current draw when a large inductive load is
turned on).
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source, based on
the device Configuration bit values (FNOSC<2:0> and
POSCMD<1:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the PWRT time-out (TPWRT) will be
applied before the internal Reset is released. If
TPWRT = 0 and a crystal oscillator is being used, then
a nominal delay of TFSCM = 100 is applied. The total
delay in this case is TFSCM.
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit continues to
operate while in Sleep or Idle modes and will reset the
device should VDD fall below the BOR threshold
voltage.
3.3V
dsPIC33F
VDD
VCAP
CEFC
10 µF
Note 1:
2:
3:
VSS
These are typical operating voltages. Refer to
Table 25-13 located in Section 25.1 “DC
Characteristics” for the full operating ranges
of VDD and VCAP.
It is important for the low-ESR capacitor to be
placed as close as possible to the VCAP pin.
Typical VCAP pin voltage = 2.5V when VDD 
VDDMIN.
DS70593D-page 256
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
22.4
Watchdog Timer (WDT)
For dsPIC33FJXXXGPX06A/X08A/X10A devices, the
WDT is driven by the LPRC oscillator. When the WDT
is enabled, the clock source is also enabled.
The nominal WDT clock source from LPRC is 32 kHz.
This feeds a prescaler and then can be configured for
either 5-bit (divide-by-32) or 7-bit (divide-by-128)
operation. The prescaler is set by the WDTPRE
Configuration bit. With a 32 kHz input, the prescaler
yields a nominal WDT time-out period (TWDT) of 1 ms
in 5-bit mode, or 4 ms in 7-bit mode.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPOST<3:0>
Configuration bits (FWDT<3:0>) which allow the
selection of a total of 16 settings, from 1:1 to 1:32,768.
Using the prescaler and postscaler, time-out periods
ranging from 1 ms to 131 seconds can be achieved.
The WDT, prescaler and postscaler are reset:
• On any device Reset
• On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSC bits) or by hardware
(i.e., Fail-Safe Clock Monitor)
• When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
• When the device exits Sleep or Idle mode to
resume normal operation
• By a CLRWDT instruction during normal execution
FIGURE 22-2:
If the WDT is enabled, it will continue to run during Sleep
or Idle modes. When the WDT time-out occurs, the
device will wake the device and code execution will
continue from where the PWRSAV instruction was
executed. The corresponding SLEEP or IDLE bits
(RCON<3,2>) will need to be cleared in software after the
device wakes up.
The WDT flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect subsequent
WDT events, the flag must be cleared in software.
Note:
The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
The WDT is enabled or disabled by the FWDTEN
Configuration bit in the FWDT Configuration register.
When the FWDTEN Configuration bit is set, the WDT is
always enabled.
The WDT can be optionally controlled in software when
the FWDTEN Configuration bit has been programmed
to ‘0’. The WDT is enabled in software by setting the
SWDTEN control bit (RCON<5>). The SWDTEN
control bit is cleared on any device Reset. The software
WDT option allows the user to enable the WDT for
critical code segments and disable the WDT during
non-critical segments for maximum power savings.
Note:
If the WINDIS bit (FWDT<6>) is cleared,
the CLRWDT instruction should be executed
by the application software only during the
last 1/4 of the WDT period. This CLRWDT
window can be determined by using a timer.
If a CLRWDT instruction is executed before
this window, a WDT Reset occurs.
WDT BLOCK DIAGRAM
All Device Resets
Transition to New Clock Source
Exit Sleep or Idle Mode
PWRSAV Instruction
CLRWDT Instruction
Watchdog Timer
Sleep/Idle
WDTPRE
SWDTEN
FWDTEN
WDTPOST<3:0>
RS
Prescaler
(divide by N1)
LPRC Clock
WDT
Wake-up
1
RS
Postscaler
(divide by N2)
0
WINDIS
WDT
Reset
WDT Window Select
CLRWDT Instruction
 2009-2012 Microchip Technology Inc.
DS70593D-page 257
dsPIC33FJXXXGPX06A/X08A/X10A
22.5
JTAG Interface
22.8
In-Circuit Debugger
dsPIC33FJXXXGPX06A/X08A/X10A devices implement a JTAG interface, which supports boundary scan
device testing, as well as in-circuit programming.
Detailed information on the interface will be provided in
future revisions of the document.
When MPLAB® ICD 3 is selected as a debugger, the
in-circuit debugging functionality is enabled. This
function allows simple debugging functions when used
with MPLAB IDE. Debugging functionality is controlled
through the PGECx (Emulation/Debug Clock) and
PGEDx (Emulation/Debug Data) pin functions.
22.6
Any one out of three pairs of debugging clock/data pins
may be used:
Code Protection and
CodeGuard™ Security
The dsPIC33F product families offer the advanced
implementation of CodeGuard™ Security. CodeGuard™
Security enables multiple parties to securely share
resources (memory, interrupts and peripherals) on a
single chip. This feature helps protect individual
Intellectual Property in collaborative system designs.
When coupled with software encryption libraries,
CodeGuard Security can be used to securely update
Flash even when multiple IP are resident on the single
chip. The code protection features vary depending on
the actual dsPIC33F implemented. The following
sections provide an overview of these features.
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, VDD, VSS and the PGEDx/PGECx pin pair. In
addition, when the feature is enabled, some of the
resources are not available for general use. These
resources include the first 80 bytes of data RAM and
two I/O pins.
The code protection features are controlled by the
Configuration registers: FBS, FSS and FGS.
Note:
22.7
Refer to Section 23. “CodeGuard™
Security” (DS70199) in the “dsPIC33F/
PIC24H Family Reference Manual” for further information on usage, configuration
and operation of CodeGuard™ Security.
In-Circuit Serial Programming
dsPIC33FJXXXGPX06A/X08A/X10A family digital signal controllers can be serially programmed while in the
end application circuit. This is simply done with two
lines for clock and data and three other lines for power,
ground and the programming sequence. This allows
customers to manufacture boards with unprogrammed
devices and then program the digital signal controller
just before shipping the product. This also allows the
most recent firmware or a custom firmware, to be
programmed. Please refer to the “dsPIC33F/PIC24H
Flash
Programming
Specification”
(DS70152)
document for details about ICSP.
Any one out of three pairs of programming clock/data
pins may be used:
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
DS70593D-page 258
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
23.0
Note:
INSTRUCTION SET SUMMARY
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06A/X08A/
X10A family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
latest family reference sections of the
“dsPIC33F/PIC24H Family Reference
Manual”, which are available from the
Microchip web site (www.microchip.com).
The dsPIC33F instruction set is identical to that of the
dsPIC30F.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word, divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 23-1 illustrates the general symbols used in
describing the instructions.
The dsPIC33F instruction set summary in Table 23-2
provides all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand which is typically a
register ‘Wb’ without any address modifier
• The second source operand which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
 2009-2012 Microchip Technology Inc.
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register
(specified by a literal value or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand which is a register ‘Wb’
without any address modifier
• The second source operand which is a literal
value
• The destination of the result (only if not the same
as the first source operand) which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write back destination
The other DSP instructions do not involve any
multiplication and may include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
DS70593D-page 259
dsPIC33FJXXXGPX06A/X08A/X10A
All instructions are a single word, except for certain
double-word instructions, which were made
double-word instructions so that all the required
information is available in these 48 bits. In the second
word, the 8 MSbs are ‘0’s. If this second word is
executed as an instruction (by itself), it will execute as
a NOP.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true, or the
program counter is changed as a result of the
instruction. In these cases, the execution takes two
instruction cycles with the additional instruction cycle(s)
executed as a NOP. Notable exceptions are the BRA
(unconditional/computed branch), indirect CALL/GOTO,
TABLE 23-1:
all table reads and writes and RETURN/RETFIE
instructions, which are single-word instructions but take
two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two
or three cycles if the skip is performed, depending on
whether the instruction being skipped is a single-word or
two-word instruction. Moreover, double-word moves
require two cycles. The double-word instructions
execute in two instruction cycles.
Note:
For more details on the instruction set,
refer to the “16-bit MCU and DSC
Programmer’s
Reference
Manual”
(DS70157).
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
Description
Means literal defined by “text”
(text)
Means “content of text”
[text]
Means “the location addressed by text”
{ }
Optional field or operation
<n:m>
Register bit field
.b
Byte mode selection
.d
Double-Word mode selection
.S
Shadow register select
.w
Word mode selection (default)
Acc
One of two accumulators {A, B}
AWB
Accumulator write back destination address register {W13, [W13]+ = 2}
bit4
4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr
Absolute address, label or expression (resolved by the linker)
f
File register address {0x0000...0x1FFF}
lit1
1-bit unsigned literal {0,1}
lit4
4-bit unsigned literal {0...15}
lit5
5-bit unsigned literal {0...31}
lit8
8-bit unsigned literal {0...255}
lit10
10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14
14-bit unsigned literal {0...16384}
lit16
16-bit unsigned literal {0...65535}
lit23
23-bit unsigned literal {0...8388608}; LSb must be ‘0’
None
Field does not require an entry, may be blank
OA, OB, SA, SB
DSP Status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate
PC
Program Counter
Slit10
10-bit signed literal {-512...511}
Slit16
16-bit signed literal {-32768...32767}
Slit6
6-bit signed literal {-16...16}
Wb
Base W register {W0..W15}
Wd
Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo
Destination W register 
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn
Dividend, Divisor working register pair (direct addressing)
DS70593D-page 260
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Description
Wm*Wm
Multiplicand and Multiplier working register pair for Square instructions 
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn
Multiplicand and Multiplier working register pair for DSP instructions 
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn
One of 16 working registers {W0..W15}
Wnd
One of 16 destination working registers {W0...W15}
Wns
One of 16 source working registers {W0...W15}
WREG
W0 (working register used in file register instructions)
Ws
Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso
Source W register 
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx
X data space prefetch address register for DSP instructions
 {[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2,
[W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2,
[W9 + W12], none}
Wxd
X data space prefetch destination register for DSP instructions {W4...W7}
Wy
Y data space prefetch address register for DSP instructions
 {[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2,
[W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2,
[W11 + W12], none}
Wyd
Y data space prefetch destination register for DSP instructions {W4...W7}
 2009-2012 Microchip Technology Inc.
DS70593D-page 261
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-2:
Base
Instr
#
1
2
3
4
5
6
7
8
9
INSTRUCTION SET OVERVIEW
Assembly
Mnemonic
ADD
ADDC
AND
ASR
BCLR
BRA
BSET
BSW
BTG
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
ADD
Acc
Add Accumulators
1
1
ADD
f
f = f + WREG
1
1
OA,OB,SA,SB
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
OA,OB,SA,SB
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
BTG
f,#bit4
Bit Toggle f
1
1
None
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
DS70593D-page 262
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-2:
Base
Instr
#
10
11
12
13
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
BTSC
BTSS
BTST
BTSTS
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
1
(2 or 3)
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
1
(2 or 3)
None
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
1
(2 or 3)
None
BTST
f,#bit4
Bit Test f
1
1
Z
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
lit23
Call subroutine
2
2
None
14
CALL
CALL
CALL
Wn
Call indirect subroutine
1
2
None
15
CLR
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
Clear Watchdog Timer
1
1
WDTO,Sleep
16
CLRWDT
CLRWDT
17
COM
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
Ws,Wd
Wd = Ws
1
1
N,Z
CP
f
Compare f with WREG
1
1
C,DC,N,OV,Z
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb – Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
Compare Wb with Ws, with Borrow
(Wb - Ws - C)
1
1
C,DC,N,OV,Z
18
19
20
CP
CP0
CPB
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Wn, skip if =
1
1
(2 or 3)
None
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
1
(2 or 3)
None
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
1
(2 or 3)
None
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if 
1
1
(2 or 3)
None
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
C
26
DEC
DEC
f
f=f–1
1
1
C,DC,N,OV,Z
DEC
f,WREG
WREG = f – 1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws – 1
1
1
C,DC,N,OV,Z
DEC2
f
f=f–2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f – 2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws – 2
1
1
C,DC,N,OV,Z
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
27
28
DEC2
DISI
 2009-2012 Microchip Technology Inc.
DS70593D-page 263
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-2:
Base
Instr
#
29
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
DIV
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
DIV.S
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.SD
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C,OV
Signed 16/16-bit Fractional Divide
1
18
N,Z,C,OV
None
30
DIVF
DIVF
31
DO
DO
#lit14,Expr
Do code to PC + Expr, lit14 + 1 times
2
2
DO
Wn,Expr
Do code to PC + Expr, (Wn) + 1 times
2
2
None
Wm,Wn
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
OA,OB,OAB,
SA,SB,SAB
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
OA,OB,OAB,
SA,SB,SAB
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
35
FBCL
FBCL
Ws,Wnd
Find Bit Change from Left (MSb) Side
1
1
C
36
FF1L
FF1L
Ws,Wnd
Find First One from Left (MSb) Side
1
1
C
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
39
40
41
INC
INC2
IOR
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
42
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
43
LNK
LNK
#lit14
Link Frame Pointer
1
1
None
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MOV
f,Wn
Move f to Wn
1
1
None
MOV
f
Move f to f
1
1
None
45
46
47
MAC
MOV
MOVSAC
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
None
MOV.D
Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd
1
2
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
Prefetch and store accumulator
1
1
None
MOVSAC
DS70593D-page 264
Acc,Wx,Wxd,Wy,Wyd,AWB
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-2:
Base
Instr
#
48
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
MPY
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator
1
1
None
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Subtract from Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
51
MUL
MUL.SS
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)
1
1
None
MUL.SU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
None
MUL.US
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
NEG
Acc
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
52
53
54
NEG
NOP
POP
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
NEG
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
NOP
No Operation
1
1
None
NOPR
No Operation
1
1
None
None
POP
f
Pop f from Top-of-Stack (TOS)
1
1
POP
Wdo
Pop from Top-of-Stack (TOS) to Wdo
1
1
None
POP.D
Wnd
Pop from Top-of-Stack (TOS) to
W(nd):W(nd + 1)
1
2
None
Pop Shadow Registers
1
1
All
f
Push f to Top-of-Stack (TOS)
1
1
None
PUSH
Wso
Push Wso to Top-of-Stack (TOS)
1
1
None
PUSH.D
Wns
Push W(ns):W(ns + 1) to Top-of-Stack (TOS)
1
2
None
Push Shadow Registers
1
1
None
Go into Sleep or Idle mode
1
1
WDTO,Sleep
POP.S
55
PUSH
PUSH
PUSH.S
56
PWRSAV
PWRSAV
57
RCALL
RCALL
Expr
Relative Call
1
2
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14 + 1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn) + 1 times
1
1
None
None
58
REPEAT
#lit1
59
RESET
RESET
Software device Reset
1
1
60
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
61
RETLW
RETLW
Return with literal in Wn
1
3 (2)
None
62
RETURN
RETURN
Return from Subroutine
1
3 (2)
None
63
RLC
RLC
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
N,Z
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
64
65
RLNC
RRC
#lit10,Wn
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
 2009-2012 Microchip Technology Inc.
DS70593D-page 265
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 23-2:
Base
Instr
#
66
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
RRNC
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
67
SAC
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign-extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
OA,OB,OAB,
SA,SB,SAB
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
SL
f
f = Left Shift f
1
1
C,N,OV,Z
SL
f,WREG
WREG = Left Shift f
1
1
C,N,OV,Z
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
SUB
Acc
Subtract Accumulators
1
1
OA,OB,OAB,
SA,SB,SAB
SUB
f
f = f – WREG
1
1
C,DC,N,OV,Z
SUB
f,WREG
WREG = f – WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn – lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb – Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb – lit5
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
70
71
72
73
74
75
76
SFTAC
SL
SUB
SUBB
SUBR
SUBBR
SWAP
SUBB
f
f = f – WREG – (C)
1
1
SUBB
f,WREG
WREG = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn – lit10 – (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb – Ws – (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBB
Wb,#lit5,Wd
Wd = Wb – lit5 – (C)
1
1
SUBR
f
f = WREG – f
1
1
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG – f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws – Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 – Wb
1
1
C,DC,N,OV,Z
SUBBR
f
f = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws – Wb – (C)
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBBR
Wb,#lit5,Wd
Wd = lit5 – Wb – (C)
1
1
SWAP.b
Wn
Wn = nibble swap Wn
1
1
None
SWAP
Wn
Wn = byte swap Wn
1
1
None
None
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink Frame Pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-extend Ws
1
1
C,Z,N
83
ZE
DS70593D-page 266
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
24.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
24.1
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
 2009-2012 Microchip Technology Inc.
DS70593D-page 267
dsPIC33FJXXXGPX06A/X08A/X10A
24.2
MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
24.3
HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple
platforms.
24.4
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
24.5
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
24.6
MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
DS70593D-page 268
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
24.7
MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment, making it an excellent, economical software
development tool.
24.8
MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
 2009-2012 Microchip Technology Inc.
24.9
MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
24.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
DS70593D-page 269
dsPIC33FJXXXGPX06A/X08A/X10A
24.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
24.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F,
PIC12F5xx,
PIC16F5xx),
midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a breakpoint, the file registers can be examined and modified.
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
24.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
DS70593D-page 270
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
25.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJXXXGPX06A/X08A/X10A electrical characteristics. Additional
information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJXXXGPX06A/X08A/X10A family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or
any other conditions above the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V(4) .................................................. -0.3V to +5.6V
Voltage on any 5V tolerant pin with respect to Vss when VDD < 3.0V(4) ...................................................... -0.3V to 3.6V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2) ...........................................................................................................................250 mA
Maximum current sourced/sunk by any 2x I/O pin(3) ................................................................................................8 mA
Maximum current sourced/sunk by any 4x I/O pin(3) ..............................................................................................15 mA
Maximum current sourced/sunk by any 8x I/O pin(3) ..............................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2) ...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 25-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx
and PGEDx pins, which are able to sink/source 12 mA.
4: See the “Pin Diagrams” section for 5V tolerant pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 271
dsPIC33FJXXXGPX06A/X08A/X10A
25.1
DC Characteristics
TABLE 25-1:
OPERATING MIPS VS. VOLTAGE
VDD Range
(in Volts)
Characteristic
Max MIPS
Temp Range
(in °C)
dsPIC33FJXXXGPX06A/X08A/X10A
—
VBOR-3.6V(1)
-40°C to +85°C
40
—
VBOR-3.6V(1)
-40°C to +125°C
40
Note 1:
Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 25-11
for the minimum and maximum BOR values.
TABLE 25-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Operating Junction Temperature Range
TJ
-40
—
+150
°C
Operating Ambient Temperature Range
TA
-40
—
+125
°C
dsPIC33FJXXXGPX06A/X08A/X10A
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD -  IOH)
PD
PINT + PI/O
W
PDMAX
(TJ - TA)/JA
W
I/O Pin Power Dissipation:
I/O =  ({VDD - VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
TABLE 25-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
Note 1:
Symbol
Typ
Max
Unit
Notes
JA
JA
JA
JA
JA
40
—
°C/W
1
40
—
°C/W
1
40
—
°C/W
1
40
—
°C/W
1
28
—
°C/W
1
Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS70593D-page 272
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-4:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
Conditions
3.0
—
3.6
V
—
Operating Voltage
DC10
Supply Voltage
VDD
—
(2)
DC12
VDR
RAM Data Retention Voltage
1.8
—
—
V
—
DC16
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
—
VSS
V
—
DC17
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.03
—
—
Note 1:
2:
V/ms 0-3.0V in 0.1s
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
This is the limit to which VDD can be lowered without losing RAM data.
 2009-2012 Microchip Technology Inc.
DS70593D-page 273
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-5:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.(3)
Typical(2)
Max
Units
Conditions
Operating Current (IDD)(1)
DC20d
27
30
mA
-40°C
DC20a
27
30
mA
+25°C
DC20b
27
30
mA
+85°C
DC20c
27
35
mA
+125°C
DC21d
36
40
mA
-40°C
DC21a
37
40
mA
+25°C
DC21b
38
45
mA
+85°C
DC21c
39
45
mA
+125°C
DC22d
43
50
mA
-40°C
DC22a
46
50
mA
+25°C
DC22b
46
55
mA
+85°C
DC22c
47
55
mA
+125°C
DC23d
65
70
mA
-40°C
DC23a
65
70
mA
+25°C
DC23b
65
70
mA
+85°C
DC23c
65
70
mA
+125°C
DC24d
84
90
mA
-40°C
DC24a
84
90
mA
+25°C
DC24b
84
90
mA
+85°C
DC24c
84
90
mA
+125°C
Note 1:
2:
3:
3.3V
10 MIPS
3.3V
16 MIPS
3.3V
20 MIPS
3.3V
30 MIPS
3.3V
40 MIPS
IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDD measurements are as follows:
• Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from
rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits
are set to zero and unimplemented PMDx bits are set to one)
• CPU executing while(1) statement
• JTAG is disabled
Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DS70593D-page 274
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-6:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.(3)
Typical(2)
Max
Units
Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(1)
DC40d
3
25
mA
-40°C
DC40a
3
25
mA
+25°C
DC40b
3
25
mA
+85°C
DC40c
3
25
mA
+125°C
DC41d
4
25
mA
-40°C
DC41a
5
25
mA
+25°C
DC41b
6
25
mA
+85°C
DC41c
6
25
mA
+125°C
DC42d
8
25
mA
-40°C
DC42a
9
25
mA
+25°C
DC42b
10
25
mA
+85°C
DC42c
10
25
mA
+125°C
DC43a
15
25
mA
+25°C
DC43d
15
25
mA
-40°C
DC43b
15
25
mA
+85°C
DC43c
15
25
mA
+125°C
DC44d
16
25
mA
-40°C
DC44a
16
25
mA
+25°C
DC44b
16
25
mA
+85°C
DC44c
16
25
mA
+125°C
Note 1:
2:
3:
3.3V
10 MIPS
3.3V
16 MIPS
3.3V
20 MIPS
3.3V
30 MIPS
3.3V
40 MIPS
Base IIDLE current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits
are set to zero and unimplemented PMDx bits are set to one)
• JTAG is disabled
Data in “Typ” column is at 3.3V, +25ºC unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
 2009-2012 Microchip Technology Inc.
DS70593D-page 275
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-7:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.(3)
Typical(2)
Max
Units
Conditions
Power-Down Current (IPD)(1)
DC60d
50
200
A
-40°C
DC60a
50
200
A
+25°C
DC60b
200
500
A
+85°C
DC60c
600
1000
A
+125°C
DC61d
8
13
A
-40°C
DC61a
10
15
A
+25°C
DC61b
12
20
A
+85°C
DC61c
13
25
A
+125°C
Note 1:
2:
3:
4:
5:
3.3V
Base Power-Down Current(3,4)
3.3V
Watchdog Timer Current: IWDT(3,5)
IPD (Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled, all peripheral modules except the ADC are disabled
(PMDx bits are all ‘1’s). The following ADC settings are enabled for each ADC module (ADCx) prior to
executing the PWRSAV instruction: ADON = 1, VCFG = 1, AD12B = 1 and ADxMD = 0.
• VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep mode)
• RTCC is disabled.
• JTAG is disabled
Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated.
The Watchdog Timer Current is the additional current consumed when the WDT module is enabled. This
current should be added to the base IPD current.
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
DS70593D-page 276
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-8:
DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(2)
Max
Doze Ratio
Units
Conditions
Doze Current (IDOZE)(1)
DC73a
11
35
1:2
mA
DC73f
11
30
1:64
mA
DC73g
11
30
1:128
mA
DC70a
42
50
1:2
mA
DC70f
26
30
1:64
mA
DC70g
25
30
1:128
mA
DC71a
41
50
1:2
mA
DC71f
25
30
1:64
mA
DC71g
24
30
1:128
mA
DC72a
42
50
1:2
mA
DC72f
26
30
1:64
mA
DC72g
25
30
1:128
mA
Note 1:
2:
-40°C
3.3V
40 MIPS
+25°C
3.3V
40 MIPS
+85°C
3.3V
40 MIPS
+125°C
3.3V
40 MIPS
IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all IDOZE measurements are as follows:
• Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square
wave from rail-to-rail with overshoot/undershoot < 250 mV
• CLKO is configured as an I/O input pin in the Configuration word
• All I/O pins are configured as inputs and pulled to VSS
• MCLR = VDD, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits
are set to zero and unimplemented PMDx bits are set to one)
• CPU executing while(1) statement
• JTAG is disabled
Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated.
 2009-2012 Microchip Technology Inc.
DS70593D-page 277
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-9:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VIL
Characteristic
Min
Typ(1)
Max
Units
Conditions
Input Low Voltage
DI10
I/O pins
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
I/O Pins with OSC1 or SOSCI
VSS
—
0.2 VDD
V
DI18
2
I/O Pins with I C
VSS
—
0.3 VDD
V
SMBus disabled
DI19
I/O Pins with I2C
VSS
—
0.8 V
V
SMBus enabled
I/O Pins Not 5V Tolerant(4)
I/O Pins 5V Tolerant(4)
0.7 VDD
0.7 VDD
—
—
VDD
5.5
V
V
DI28
SDAx, SCLx
0.7 VDD
—
5.5
V
SMBus disabled
DI29
SDAx, SCLx
2.1
—
5.5
V
SMBus enabled
50
250
400
A
VDD = 3.3V, VPIN = VSS
VIH
DI20
Input High Voltage
ICNPU
CNx Pull-up Current
IIL
Input Leakage Current(2,3)
DI30
DI50
I/O Pins 5V Tolerant(4)
—
—
±2
A
VSS  VPIN  VDD,
Pin at high-impedance
DI51
I/O Pins Not 5V Tolerant(4)
—
—
±1
A
VSS  VPIN  VDD,
Pin at high-impedance,
-40°C  TA  +85°C
DI51a
I/O Pins Not 5V Tolerant(4)
—
—
±2
A
Shared with external reference
pins, -40°C  TA  +85°C
DI51b
I/O Pins Not 5V Tolerant(4)
—
—
±3.5
A
VSS  VPIN  VDD, Pin at
high-impedance,
-40°C  TA  +125°C
DI51c
I/O Pins Not 5V Tolerant(4)
—
—
±8
A
Analog pins shared with
external reference pins,
-40°C  TA  +125°C
DI55
MCLR
—
—
±2
A
VSS VPIN VDD
DI56
OSC1
—
—
±2
A
VSS VPIN VDD,
XT and HS modes
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
See “Pin Diagrams” for a list of 5V tolerant pins.
VIL source < (VSS – 0.3). Characterized but not tested.
Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not
tested.
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
DS70593D-page 278
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-9:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
IICL
Characteristic
Min
Typ(1)
Max
Units
Conditions
mA
All pins except VDD, VSS, AVDD,
AVSS, MCLR, VCAP, SOSCI,
SOSCO, and RB11
mA
All pins except VDD, VSS, AVDD,
AVSS, MCLR, VCAP, SOSCI,
SOSCO, RB11, and all 5V
tolerant pins(7)
Input Low Injection Current
DI60a
0
IICH
—
(5,8)
-5
Input High Injection Current
DI60b
IICT
DI60c
3:
4:
5:
6:
7:
8:
9:
—
-20(9)
—
+5
Total Input Injection Current
(sum of all I/O and control
pins)
Note 1:
2:
0
(6,7,8)
+20(9)
mA
Absolute instantaneous sum of
all ± input injection currents
from all I/O pins
( | IICL + | IICH | )  IICT
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
See “Pin Diagrams” for a list of 5V tolerant pins.
VIL source < (VSS – 0.3). Characterized but not tested.
Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not
tested.
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
 2009-2012 Microchip Technology Inc.
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dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
DO10
DO20
VOL
VOH
Characteristic
Output Low Voltage
I/O Pins:
2x Sink Driver Pins - All pins not
defined by 4x or 8x driver pins
Output Low Voltage
I/O Pins:
4x Sink Driver Pins - RA2, RA3,
RA9, RA10, RA14, RA15, RB0,
RB1, RB11, RF4, RF5, RG2, RG3
Output Low Voltage
I/O Pins:
8x Sink Driver Pins - OSC2, CLKO,
RC15
Output High Voltage
I/O Pins:
2x Source Driver Pins - All pins not
defined by 4x or 8x driver pins
Output High Voltage
I/O Pins:
4x Source Driver Pins - RA2, RA3,
RA9, RA10, RA14, RA15, RB0,
RB1, RB11, RF4, RF5, RG2, RG3
Output High Voltage
I/O Pins:
8x Source Driver Pins - OSC2,
CLKO, RC15
Output High Voltage
I/O Pins:
2x Source Driver Pins - All pins not
defined by 4x or 8x driver pins
DO20A VOH1
Output High Voltage
4x Source Driver Pins - RA2, RA3,
RA9, RA10, RA14, RA15, RB0,
RB1, RB11, RF4, RF5, RG2, RG3
Output High Voltage
8x Source Driver Pins - OSC2,
CLKO, RC15
Note 1:
Min
Typ
Max
Units
Conditions
—
—
0.4
V
IOL  3 mA, VDD = 3.3V
—
—
0.4
V
IOL  6 mA, VDD = 3.3V
—
—
0.4
V
IOL  10 mA, VDD = 3.3V
2.4
—
—
V
IOL  -3 mA, VDD = 3.3V
2.4
—
—
V
IOL  -6 mA, VDD = 3.3V
2.4
—
—
V
IOL  -10 mA, VDD = 3.3V
1.5
—
—
2.0
—
—
3.0
—
—
1.5
—
—
2.0
—
—
3.0
—
—
1.5
—
—
2.0
—
—
3.0
—
—
V
V
V
IOH  -6 mA, VDD = 3.3V
See Note 1
IOH  -5 mA, VDD = 3.3V
See Note 1
IOH  -2 mA, VDD = 3.3V
See Note 1
IOH  -12 mA, VDD = 3.3V
See Note 1
IOH  -11 mA, VDD = 3.3V
See Note 1
IOH  -3 mA, VDD = 3.3V
See Note 1
IOH  -16 mA, VDD = 3.3V
See Note 1
IOH  -12 mA, VDD = 3.3V
See Note 1
IOH  -4 mA, VDD = 3.3V
See Note 1
Parameters are characterized, but not tested.
DS70593D-page 280
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-11: ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param.
BO10
Note 1:
Characteristic(1)
Symbol
Min(1)
Max(1) Units
Typ
VBOR
BOR Event on VDD transition high-to-low 2.40
—
2.55
Parameters are for design guidance only and are not tested in manufacturing.
V
Conditions
VDD
TABLE 25-12: DC CHARACTERISTICS: PROGRAM MEMORY
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
DC CHARACTERISTICS
Param. Symbol
Characteristic(3)
Min
Typ(1)
Max
Units
E/W
V
VMIN = Minimum operating
voltage
V
VMIN = Minimum operating
voltage
Year Provided no other specifications
are violated
mA
D130
D131
EP
VPR
Program Flash Memory
Cell Endurance
VDD for Read
10,000
VMIN
—
—
—
3.6
D132b
VPEW
VDD for Self-Timed Write
VMIN
—
3.6
D134
TRETD
Characteristic Retention
20
—
—
D135
IDDP
—
10
—
D136a
TRW
Supply Current during
Programming
Row Write Time
1.32
—
1.74
ms
D136b
TRW
Row Write Time
1.28
—
1.79
ms
D137a
TPE
Page Erase Time
20.1
—
26.5
ms
D137b
TPE
Page Erase Time
19.5
—
27.3
ms
D138a
TWW
Word Write Cycle Time
42.3
—
55.9
µs
D138b
TWW
Word Write Cycle Time
41.1
—
57.6
µs
Note 1:
2:
3:
Conditions
TRW = 11064 FRC cycles,
TA = +85°C, See Note 2
TRW = 11064 FRC cycles,
TA = +150°C, See Note 2
TPE = 168517 FRC cycles,
TA = +85°C, See Note 2
TPE = 168517 FRC cycles,
TA = +150°C, See Note 2
TWW = 355 FRC cycles,
TA = +85°C, See Note 2
TWW = 355 FRC cycles,
TA = +150°C, See Note 2
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).
This parameter depends on the FRC accuracy (see Table 25-19) and the value of the FRC Oscillator
Tuning register (see Register 9-4). For complete details on calculating the Minimum and Maximum time
see Section 5.3 “Programming Operations”.
These parameters are assured by design, but are not characterized or tested in manufacturing.
TABLE 25-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Param. Symbol
—
Note 1:
CEFC
Characteristics
External Filter Capacitor
Value(1)
Min
Typ
Max
Units
Comments
4.7
10
—
F
Capacitor must be low
series resistance (< 5 ohms)
Typical VCORE voltage = 2.5V when VDD  VDDMIN.
 2009-2012 Microchip Technology Inc.
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dsPIC33FJXXXGPX06A/X08A/X10A
25.2
AC Characteristics and Timing
Parameters
The information contained in this section defines
dsPIC33FJXXXGPX06A/X08A/X10A AC characteristics and timing parameters.
TABLE 25-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Operating voltage VDD range as described in Table 25-1.
AC CHARACTERISTICS
FIGURE 25-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 - for all pins except OSC2
Load Condition 2 - for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464
CL = 50 pF for all pins except OSC2
15 pF for OSC2 output
VSS
TABLE 25-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
Param
Symbol
No.
Characteristic
Min
Typ
Max
Units
Conditions
15
pF
In XT and HS modes when
external clock is used to drive
OSC1
COSC2
OSC2/SOSC2 pin
—
—
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
EC mode
DO58
CB
SCLx, SDAx
—
—
400
pF
In I2C™ mode
DO50
DS70593D-page 282
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-2:
EXTERNAL CLOCK TIMING
Q1
Q2
Q3
Q4
Q1
Q2
OS30
OS30
Q3
Q4
OSC1
OS20
OS31
OS31
OS25
CLKO
OS41
OS40
TABLE 25-16: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
OS10
Symbol
FIN
Min
Typ(1)
Max
Units
External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC
—
40
MHz
EC
Oscillator Crystal Frequency
3.5
10
—
—
—
—
10
40
33
MHz
MHz
kHz
XT
HS
SOSC
Characteristic
Conditions
OS20
TOSC
TOSC = 1/FOSC
12.5
—
DC
ns
—
OS25
TCY
Instruction Cycle Time(2)
25
—
DC
ns
—
OS30
TosL,
TosH
External Clock in (OSC1)
High or Low Time
0.375 x TOSC
—
0.625 x TOSC
ns
EC
OS31
TosR,
TosF
External Clock in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(3)
—
5.2
—
ns
—
—
5.2
—
ns
14
16
18
mA/V
(3)
OS41
TckF
CLKO Fall Time
OS42
GM
External Oscillator
Transconductance(4)
Note 1:
2:
3:
4:
—
VDD = 3.3V
TA = +25ºC
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
Data for this parameter is Preliminary. This parameter is characterized, but not tested in manufacturing.
 2009-2012 Microchip Technology Inc.
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dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
OS50
FPLLI
PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range(2)
0.8
—
8.0
MHz
OS51
FSYS
On-Chip VCO System
Frequency
100
—
200
MHz
—
OS52
TLOCK
PLL Start-up Time (Lock Time)
0.9
1.5
3.1
ms
—
OS53
DCLK
CLKO Stability (Jitter)
-3.0
0.5
3.0
%
Note 1:
2:
ECPLL, HSPLL, XTPLL
modes
Measured over 100 ms
period
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
These parameters are characterized by similarity but are not tested in manufacturing. This specification is
based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time base
or communication clocks used by peripherals use the formula:
Peripheral Clock Jitter = DCLK / √(FOSC/Peripheral bit rate clock)
Example Only: Fosc = 80 MHz, DCLK = 3%, SPI bit rate clock, (i.e. SCK), is 5 MHz
SPI SCK Jitter = [ DCLK / √(80 MHz/5 MHz)] = [3%/ √16] = [3% / 4] = 0.75%
TABLE 25-18: AC CHARACTERISTICS: INTERNAL FRC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min
Typ
Max
Units
Conditions
Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1)
F20a
FRC
-2
—
+2
%
-40°C  TA +85°C
VDD = 3.0-3.6V
F20b
FRC
-5
—
+5
%
-40°C  TA +125°C
VDD = 3.0-3.6V
Note 1:
Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.
TABLE 25-19: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min
Typ
Max
Units
Conditions
LPRC @ 32.768 kHz(1)
F21a
LPRC
-30
—
+30
%
-40°C  TA +85°C
—
F21b
LPRC
-35
—
+35
%
-40°C  TA +125°C
—
Note 1:
Change of LPRC frequency as VDD changes.
DS70593D-page 284
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-3:
CLKO AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-20: I/O TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
—
10
25
ns
—
DO31
TIOR
DO32
TIOF
Port Output Fall Time
—
10
25
ns
—
DI35
TINP
INTx Pin High or Low Time (input)
20
—
—
ns
—
TRBP
CNx High or Low Time (input)
2
—
—
TCY
—
DI40
Note 1:
Port Output Rise Time
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
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FIGURE 25-4:
VDD
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
MCLR
SY10
Internal
POR
PWRT
Time-out
OSC
Time-out
SY11
SY30
Internal
Reset
Watchdog
Timer
Reset
SY13
SY20
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 25-1 for load conditions.
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TABLE 25-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Param
Symbol
No.
Min
Typ(2)
Max
Units
Characteristic(1)
Conditions
SY10
TMCL
MCLR Pulse-Width (low)
2
—
—
s
-40°C to +85°C
SY11
TPWRT
Power-up Timer Period
—
—
—
—
—
—
—
2
4
8
16
32
64
128
—
—
—
—
—
—
—
ms
-40°C to +85°C
User programmable
SY12
TPOR
Power-on Reset Delay
3
10
30
s
-40°C to +85°C
SY13
TIOZ
I/O High-Impedance from
MCLR Low or Watchdog
Timer Reset
0.68
0.72
1.2
s
—
SY20
TWDT1
Watchdog Timer
Time-out Period
—
—
—
—
See Section 22.4 “Watchdog
Timer (WDT)” and LPRC
specification F21 (Table 25-19)
SY30
TOST
Oscillator Start-up Timer
Period
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor
Delay
—
500
900
s
-40°C to +85°C
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
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FIGURE 25-5:
TIMER1, 2, 3, 4, 5, 6, 7, 8 AND 9 EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
OS60
Tx20
TMRx
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
TA15
Symbol
TTXH
TTXL
TTXP
Characteristic
Min
Typ
Max
Units
Conditions
TxCK High Time Synchronous,
no prescaler
TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous, (TCY + 20)/N
with prescaler
—
—
ns
Asynchronous
—
—
ns
—
—
ns
Must also meet
parameter TA15
TxCK Input
Period
Synchronous,
with prescaler
20
—
—
ns
Asynchronous
20
—
—
ns
N = prescale
value
(1,8,64,256)
Synchronous,
no prescaler
2TCY + 40
—
—
ns
—
Synchronous,
with prescaler
Greater of
40 ns or
(2TCY + 40)/N
—
—
—
Asynchronous
OS60
Ft1
TA20
TCKEXTMRL Delay from External TxCK
Clock Edge to Timer Increment
Note 1:
20
TxCK Low Time Synchronous, (TCY + 20)/N
no prescaler
SOSC1/T1CK Oscillator Input
frequency Range (oscillator
enabled by setting TCS bit
(T1CON<1>))
N = prescale
value
(1, 8, 64, 256)
40
—
—
ns
—
DC
—
50
kHz
—
0.75TCY+40
—
1.75TCY+40
ns
—
Timer1 is a Type A.
DS70593D-page 288
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TABLE 25-23: TIMER2, TIMER4, TIMER6 AND TIMER8 EXTERNAL CLOCK TIMING
REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
TB10
TtxH
TxCK High Synchronous
Time
mode
Greater of
20 or
(TCY + 20)/N
—
—
ns
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
TB11
TtxL
TxCK Low
Time
Greater of:
20 or
(TCY + 20)/N
—
—
ns
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
TB15
TtxP
TxCK Input Synchronous
Period
mode
Greater of:
40 or
(2 TCY + 40)/N
—
—
ns
N = prescale
value
(1, 8, 64, 256)
TB20
TCKEXTMRL Delay from External TxCK
Clock Edge to Timer Increment
0.75 TCY + 40
—
1.75 TCY + 40
ns
Note 1:
Synchronous
mode
—
These parameters are characterized, but are not tested in manufacturing.
TABLE 25-24: TIMER3, TIMER5, TIMER7 AND TIMER9 EXTERNAL CLOCK TIMING
REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High
Time
Synchronous
TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low
Time
Synchronous
TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input
Period
Synchronous,
with prescaler
2TCY + 40
—
—
ns
N = prescale
value
(1, 8, 64, 256)
TC20
TCKEXTMRL Delay from External TxCK
Clock Edge to Timer Increment
0.75 TCY + 40
—
1.75 TCY + 40
ns
Note 1:
—
These parameters are characterized, but are not tested in manufacturing.
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FIGURE 25-6:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICx
IC10
IC11
IC15
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-25: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
IC10
TccL
ICx Input Low Time
IC11
TccH
ICx Input High Time
IC15
TccP
ICx Input Period
Characteristic(1)
No Prescaler
Min
Max
Units
Conditions
0.5 TCY + 20
—
ns
—
With Prescaler
No Prescaler
10
—
ns
0.5 TCY + 20
—
ns
With Prescaler
Note 1:
10
—
ns
(TCY + 40)/N
—
ns
—
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
FIGURE 25-7:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
Min
Typ
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See parameter D032
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See parameter D031
Note 1:
These parameters are characterized but not tested in manufacturing.
DS70593D-page 290
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FIGURE 25-8:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
Active
Tri-state
TABLE 25-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
OC15
TFD
Fault Input to PWM I/O
Change
—
—
TCY+20
ns
—
OC20
TFLT
Fault Input Pulse-Width
TCY+20
—
—
ns
—
Note 1:
These parameters are characterized but not tested in manufacturing.
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TABLE 25-28: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
15 MHz
10 MHz
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex)
CKE
Table 25-29
—
—
—
Table 25-30
—
10 MHz
—
Table 25-31
15 MHz
—
—
CKP
SMP
0,1
0,1
0,1
1
0,1
1
—
0
0,1
1
Table 25-32
1
0
0
11 MHz
—
—
Table 25-33
1
1
0
15 MHz
—
—
Table 25-34
0
1
0
11 MHz
—
—
Table 25-35
0
0
0
FIGURE 25-9:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING
CHARACTERISTICS
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
SP30, SP31
Bit 14 - - - - - -1
LSb
SP30, SP31
Note: Refer to Figure 25-1 for load conditions.
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FIGURE 25-10:
SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING
CHARACTERISTICS
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
LSb
SP30, SP31
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-29: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
SP10
TscP
Maximum SCK Frequency
—
—
15
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
—
6
20
ns
—
SP36
TdiV2scH,
TdiV2scL
SDOx Data Output Setup to
First SCKx Edge
30
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
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FIGURE 25-11:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING
CHARACTERISTICS
SP36
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
SP30, SP31
SP40
SDIx
LSb
MSb In
LSb In
Bit 14 - - - -1
SP41
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-30: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
See parameter DO32
and Note 4
See parameter DO31
and Note 4
See parameter DO32
and Note 4
See parameter DO31
and Note 4
—
SP10
SP20
TscP
TscF
Maximum SCK Frequency
SCKx Output Fall Time
—
—
—
—
10
—
MHz
ns
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
SP35
TscH2doV, SDOx Data Output Valid after
—
6
20
ns
TscL2doV SCKx Edge
TdoV2sc, SDOx Data Output Setup to
30
—
—
ns
—
TdoV2scL First SCKx Edge
TdiV2scH, Setup Time of SDIx Data
30
—
—
ns
—
TdiV2scL Input to SCKx Edge
TscH2diL, Hold Time of SDIx Data Input
30
—
—
ns
—
TscL2diL
to SCKx Edge
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
SP36
SP40
SP41
Note 1:
2:
3:
4:
DS70593D-page 294
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FIGURE 25-12:
SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING
CHARACTERISTICS
SCKx
(CKP = 0)
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
MSb
SDOx
Bit 14 - - - - - -1
SP30, SP31
SDIx
MSb In
LSb
SP30, SP31
LSb In
Bit 14 - - - -1
SP40 SP41
Note: Refer to Figure 25-1 for load conditions.
TABLE 25-31: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING
REQUIREMENTS
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
-40ºC to +125ºC and
see Note 3
See parameter DO32
and Note 4
See parameter DO31
and Note 4
See parameter DO32
and Note 4
See parameter DO31
and Note 4
—
SP10
TscP
Maximum SCK Frequency
—
—
10
MHz
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
SP35
TscH2doV, SDOx Data Output Valid after
—
6
20
ns
TscL2doV SCKx Edge
TdoV2scH, SDOx Data Output Setup to
30
—
—
ns
—
TdoV2scL First SCKx Edge
TdiV2scH, Setup Time of SDIx Data
30
—
—
ns
—
TdiV2scL Input to SCKx Edge
TscH2diL, Hold Time of SDIx Data Input
30
—
—
ns
—
TscL2diL
to SCKx Edge
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
SP36
SP40
SP41
Note 1:
2:
3:
4:
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FIGURE 25-13:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
MSb
SDOx
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
SDI
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 296
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TABLE 25-32: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
REQUIREMENTS
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
SP70
SP72
TscP
TscF
Maximum SCK Input Frequency
SCKx Input Fall Time
—
—
—
—
15
—
MHz
ns
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
SP35
TscH2doV,
TscL2doV
TdoV2scH,
TdoV2scL
TdiV2scH,
TdiV2scL
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
—
6
20
ns
See parameter DO32
and Note 4
See parameter DO31
and Note 4
See parameter DO32
and Note 4
See parameter DO31
and Note 4
—
30
—
—
ns
—
30
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
—
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
—
—
50
ns
—
SSx Edge
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must
not violate this specificiation.
Assumes 50 pF load on all SPIx pins.
SP36
SP40
Note 1:
2:
3:
4:
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FIGURE 25-14:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
SP52
MSb
SDOx
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
SDI
MSb In
Bit 14 - - - -1
SP51
LSb In
SP41
SP40
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 298
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TABLE 25-33: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING
REQUIREMENTS
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
SP70
TscP
Maximum SCK Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
—
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
—
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
—
Note 1:
2:
3:
4:
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not
violate this specificiation.
Assumes 50 pF load on all SPIx pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 299
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-15:
SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING
CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 300
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING
REQUIREMENTS
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
SP70
TscP
Maximum SCK Input Frequency
—
—
15
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
—
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
—
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must
not violate this specificiation.
Assumes 50 pF load on all SPIx pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 301
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-16:
SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
Bit 14 - - - - - -1
LSb
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 302
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING
REQUIREMENTS
Standard Operating Conditions: 2.4V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
See Note 3
SP70
TscP
Maximum SCK Input Frequency
—
—
11
MHz
SP72
TscF
SCKx Input Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP73
TscR
SCKx Input Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See parameter DO32
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See parameter DO31
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
—
SP36
TdoV2scH, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSx  to SCKx  or SCKx Input
120
—
—
ns
—
SP51
TssH2doZ
SSx  to SDOx Output
High-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
See Note 4
Note 1:
2:
3:
4:
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not
violate this specificiation.
Assumes 50 pF load on all SPIx pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 303
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-17:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCLx
IM31
IM34
IM30
IM33
SDAx
Stop
Condition
Start
Condition
Note: Refer to Figure 25-1 for load conditions.
FIGURE 25-18:
I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCLx
IM11
IM26
IM10
IM25
IM33
SDAx
In
IM40
IM40
IM45
SDAx
Out
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 304
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
Min(1)
Max
Units
Conditions
TLO:SCL Clock Low Time 100 kHz mode
TCY/2 (BRG + 1)
—
s
—
400 kHz mode
1 MHz mode(2)
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
—
—
Clock High Time 100 kHz mode
400 kHz mode
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
—
—
1 MHz mode(2)
SDAx and SCLx 100 kHz mode
Fall Time
400 kHz mode
TCY/2 (BRG + 1)
—
—
300
s
ns
1 MHz mode(2)
20 + 0.1 CB
—
300
100
ns
ns
SDAx and SCLx 100 kHz mode
Rise Time
400 kHz mode
—
20 + 0.1 CB
1000
300
ns
ns
1 MHz mode(2)
100 kHz mode
—
250
300
—
ns
ns
400 kHz mode
1 MHz mode(2)
100
40
—
—
ns
ns
THD:DAT Data Input
Hold Time
100 kHz mode
400 kHz mode
0
0
—
0.9
s
s
TSU:STA
1 MHz mode(2)
100 kHz mode
0.2
TCY/2 (BRG + 1)
—
—
s
s
400 kHz mode
1 MHz mode(2)
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
100 kHz mode
400 kHz mode
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
1 MHz mode(2)
100 kHz mode
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
400 kHz mode
1 MHz mode(2)
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
s
s
THD:STO Stop Condition
Hold Time
100 kHz mode
400 kHz mode
TCY/2 (BRG + 1)
TCY/2 (BRG + 1)
—
—
ns
ns
TAA:SCL
1 MHz mode(2)
100 kHz mode
TCY/2 (BRG + 1)
—
—
3500
ns
ns
—
400 kHz mode
1 MHz mode(2)
—
—
1000
400
ns
ns
—
—
THI:SCL
IM11
IM20
TF:SCL
TR:SCL
IM21
IM25
Characteristic
TSU:DAT Data Input
Setup Time
IM26
IM30
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
IM31
IM33
TSU:STO Stop Condition
Setup Time
IM34
IM40
Note 1:
2:
3:
Output Valid
From Clock
—
CB is specified to be
from 10 to 400 pF
CB is specified to be
from 10 to 400 pF
—
—
Only relevant for
Repeated Start
condition
After this period the
first clock pulse is
generated
—
—
BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™
(I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”.
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
Typical value for this parameter is 130 ns.
 2009-2012 Microchip Technology Inc.
DS70593D-page 305
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM45
IM50
Min(1)
Max
Units
Conditions
100 kHz mode
400 kHz mode
4.7
1.3
—
—
s
s
1 MHz mode(2)
Bus Capacitive Loading
0.5
—
—
400
s
pF
Time the bus must be
free before a new
transmission can start
Characteristic
TBF:SDA Bus Free Time
CB
—
Pulse Gobbler Delay
65
390
ns
See Note 3
IM51
TPGD
Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™
(I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”.
2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3: Typical value for this parameter is 130 ns.
FIGURE 25-19:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCLx
IS34
IS31
IS30
IS33
SDAx
Stop
Condition
Start
Condition
FIGURE 25-20:
I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCLx
IS30
IS26
IS31
IS25
IS33
SDAx
In
IS40
IS40
IS45
SDAx
Out
DS70593D-page 306
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-37: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS10
IS11
IS20
IS21
IS25
IS26
IS30
IS31
IS33
IS34
IS40
IS45
IS50
Note
Symbol
Characteristic
TLO:SCL Clock Low Time
THI:SCL
Clock High Time
Min
Max
Units
100 kHz mode
4.7
—
s
400 kHz mode
1.3
—
s
1 MHz mode(1)
100 kHz mode
0.5
4.0
—
—
s
s
400 kHz mode
0.6
—
s
0.5
—
s
1 MHz mode(1)
TF:SCL
SDAx and SCLx 100 kHz mode
—
300
ns
Fall Time
300
ns
400 kHz mode 20 + 0.1 CB
1 MHz mode(1)
—
100
ns
TR:SCL SDAx and SCLx 100 kHz mode
—
1000
ns
Rise Time
300
ns
400 kHz mode 20 + 0.1 CB
1 MHz mode(1)
—
300
ns
TSU:DAT Data Input
100 kHz mode
250
—
ns
Setup Time
400 kHz mode
100
—
ns
(1)
1 MHz mode
100
—
ns
THD:DAT Data Input
100 kHz mode
0
—
s
Hold Time
400 kHz mode
0
0.9
s
1 MHz mode(1)
0
0.3
s
TSU:STA Start Condition
100 kHz mode
4.7
—
s
Setup Time
400 kHz mode
0.6
—
s
0.25
—
s
1 MHz mode(1)
THD:STA Start Condition
100 kHz mode
4.0
—
s
Hold Time
400 kHz mode
0.6
—
s
0.25
—
s
1 MHz mode(1)
TSU:STO Stop Condition
100 kHz mode
4.7
—
s
Setup Time
400 kHz mode
0.6
—
s
(1)
1 MHz mode
0.6
—
s
THD:STO Stop Condition
100 kHz mode
4000
—
ns
Hold Time
400 kHz mode
600
—
ns
1 MHz mode(1)
250
ns
TAA:SCL Output Valid
100 kHz mode
0
3500
ns
From Clock
400 kHz mode
0
1000
ns
1 MHz mode(1)
0
350
ns
TBF:SDA Bus Free Time
100 kHz mode
4.7
—
s
400 kHz mode
1.3
—
s
0.5
—
s
1 MHz mode(1)
CB
Bus Capacitive Loading
—
400
pF
1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
 2009-2012 Microchip Technology Inc.
Conditions
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
—
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
—
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
—
—
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
—
—
—
Time the bus must be free
before a new transmission
can start
—
DS70593D-page 307
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-21:
DCI MODULE (MULTI-CHANNEL, I2S MODES) TIMING CHARACTERISTICS
CSCK
(SCKE = 0)
CS11
CS10
CS21
CS20
CS20
CS21
CSCK
(SCKE = 1)
COFS
CS55 CS56
CS35
CS51
CSDO
70
CS50
High-Z
LSb
MSb
CS30
CSDI
MSb In
High-Z
CS31
LSb In
CS40 CS41
Note: Refer to Figure 25-1 for load conditions.
DS70593D-page 308
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-38: DCI MODULE (MULTI-CHANNEL, I2S MODES) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
CS10
Symbol
TCSCKL
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
TCY/2 + 20
—
—
ns
—
30
—
—
ns
—
TCY/2 + 20
—
—
ns
—
CSCK Output High Time(3)
(CSCK pin is an output)
30
—
—
ns
—
CSCK Input Low Time
(CSCK pin is an input)
CSCK Output Low Time(3)
(CSCK pin is an output)
CS11
TCSCKH
CSCK Input High Time
(CSCK pin is an input)
CS20
TCSCKF
CSCK Output Fall Time(4)
(CSCK pin is an output)
—
10
25
ns
—
CS21
TCSCKR
CSCK Output Rise Time(4)
(CSCK pin is an output)
—
10
25
ns
—
CS30
TCSDOF
CSDO Data Output Fall Time(4)
—
10
25
ns
—
Time(4)
CS31
TCSDOR
CSDO Data Output Rise
—
10
25
ns
—
CS35
TDV
Clock Edge to CSDO Data Valid
—
—
10
ns
—
CS36
TDIV
Clock Edge to CSDO Tri-Stated
10
—
20
ns
—
CS40
TCSDI
Setup Time of CSDI Data Input
to
CSCK Edge (CSCK pin is input
or output)
20
—
—
ns
—
CS41
THCSDI
Hold Time of CSDI Data Input to
CSCK Edge (CSCK pin is input
or output)
20
—
—
ns
—
CS50
TCOFSF
COFS Fall Time
(COFS pin is output)
—
10
25
ns
Note 1
CS51
TCOFSR
COFS Rise Time
(COFS pin is output)
—
10
25
ns
Note 1
CS55
TSCOFS
Setup Time of COFS Data Input
to CSCK Edge (COFS pin is
input)
20
—
—
ns
—
CS56
THCOFS
Hold Time of COFS Data Input to
CSCK Edge (COFS pin is input)
20
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all DCI pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 309
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-22:
DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS
BIT_CLK
(CSCK)
CS61
CS60
CS62
CS21
CS20
CS71
CS70
CS72
SYNC
(COFS)
CS75
CS76
CS80
SDOx
(CSDO)
MSb
LSb
LSb
CS76
CS75
MSb In
SDIx
(CSDI)
CS65 CS66
TABLE 25-39: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
CS60
CS61
CS62
CS65
CS66
CS70
CS71
CS72
CS75
CS76
CS77
CS78
CS80
Note
Symbol
Characteristic(1,2)
Min
Typ(3)
Max
Units
Conditions
BIT_CLK Low Time
36
40.7
45
ns
—
BIT_CLK High Time
36
40.7
45
ns
—
BIT_CLK Period
—
81.4
—
ns
Bit clock is input
Input Setup Time to
—
—
10
ns
—
Falling Edge of BIT_CLK
Input Hold Time from
—
—
10
ns
—
THACL
Falling Edge of BIT_CLK
TSYNCLO SYNC Data Output Low Time
—
19.5
—
s
Note 1
TSYNCHI SYNC Data Output High Time
—
1.3
—
s
Note 1
TSYNC
SYNC Data Output Period
—
20.8
—
s
Note 1
TRACL
Rise Time, SYNC, SDATA_OUT
—
10
25
ns
CLOAD = 50 pF, VDD = 5V
Fall Time, SYNC, SDATA_OUT
—
10
25
ns
CLOAD = 50 pF, VDD = 5V
TFACL
TRACL
Rise Time, SYNC, SDATA_OUT
—
—
30
ns
CLOAD = 50 pF, VDD = 3V
TFACL
Fall Time, SYNC, SDATA_OUT
—
—
30
ns
CLOAD = 50 pF, VDD = 3V
—
—
15
ns
—
TOVDACL Output Valid Delay from Rising
Edge of BIT_CLK
1: These parameters are characterized but not tested in manufacturing.
2: These values assume BIT_CLK frequency is 12.288 MHz.
3: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
TBCLKL
TBCLKH
TBCLK
TSACL
DS70593D-page 310
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-23:
CiTx Pin
(output)
CAN MODULE I/O TIMING CHARACTERISTICS
New Value
Old Value
CA10 CA11
CiRx Pin
(input)
CA20
TABLE 25-40: ECAN™ MODULE I/O TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
CA10
TioF
Port Output Fall Time
—
—
—
ns
See parameter D032
CA11
TioR
Port Output Rise Time
—
—
—
ns
See parameter D031
CA20
Tcwf
Pulse Width to Trigger
CAN Wake-up Filter
120
—
—
ns
—
Note 1:
These parameters are characterized but not tested in manufacturing.
 2009-2012 Microchip Technology Inc.
DS70593D-page 311
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-41: ADC MODULE SPECIFICATIONS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
Greater of
VDD - 0.3
or 3.0
—
Lesser of
VDD + 0.3
or 3.6
V
—
AD02
AVSS
Module VSS Supply
VSS - 0.3
—
VSS + 0.3
V
—
AD05
VREFH
Reference Voltage High AVSS + 2.5
Reference Inputs
AD05a
AD06
VREFL
Reference Voltage Low
AD06a
—
AVDD
V
3.0
—
3.6
V
AVSS
—
AVDD - 2.5
V
0
—
0
V
VREFH = AVDD
VREFL = AVSS = 0
VREFH = AVDD
VREFL = AVSS = 0
AD07
VREF
Absolute Reference
Voltage
2.5
—
3.6
V
VREF = VREFH - VREFL
AD08
IREF
Current Drain
—
—
1
A
ADC off
AD08a
IAD
Operating Current
—
—
7.0
2.7
9.0
3.2
mA
mA
10-bit ADC mode, See Note 1
12-bit ADC mode, See Note 1
AD12
VINH
Input Voltage Range
VINH
VINL
—
VREFH
V
This voltage reflects Sample
and Hold Channels 0, 1, 2,
and 3 (CH0-CH3), positive
input.
AD13
VINL
Input Voltage Range
VINL
VREFL
—
AVSS + 1V
V
This voltage reflects Sample
and Hold Channels 0, 1, 2,
and 3 (CH0-CH3), negative
input.
AD17
RIN
Recommended Impedance of Analog Voltage
Source
—
—
200
200


10-bit
12-bit
Analog Input
Note 1:
These parameters are not characterized or tested in manufacturing.
DS70593D-page 312
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-42: ADC MODULE SPECIFICATIONS (12-BIT MODE)(2)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
ADC Accuracy (12-bit Mode) - Measurements with external VREF+/VREFAD20a Nr
Resolution
12 data bits
AD21a INL
Integral Nonlinearity
AD22a DNL
bits
-2
—
+2
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23a GERR
Gain Error
—
3.4
10
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24a EOFF
Offset Error
—
0.9
5
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25a —
Monotonicity(1)
—
—
—
—
Guaranteed
ADC Accuracy (12-bit Mode) - Measurements with internal VREF+/VREFAD20a Nr
Resolution
AD21a INL
Integral Nonlinearity
12 data bits
AD22a DNL
bits
-2
—
+2
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23a GERR
Gain Error
—
10.5
20
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24a EOFF
Offset Error
—
3.8
10
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25a —
Monotonicity(1)
—
—
—
—
AD30a THD
Total Harmonic Distortion
AD31a SINAD
Signal to Noise and
Distortion
AD32a SFDR
Guaranteed
Dynamic Performance (12-bit Mode)
—
—
-75
dB
—
68.5
69.5
—
dB
—
Spurious Free Dynamic
Range
80
—
—
dB
—
AD33a FNYQ
Input Signal Band-Width
—
—
250
kHz
—
AD34a ENOB
Effective Number of Bits
11.09
11.3
—
bits
—
Note 1:
2:
The ADC conversion result never decreases with an increase in the input voltage, and has no missing
codes.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
 2009-2012 Microchip Technology Inc.
DS70593D-page 313
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-43: ADC MODULE SPECIFICATIONS (10-BIT MODE)(2)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
ADC Accuracy (10-bit Mode) - Measurements with external VREF+/VREFAD20b Nr
Resolution
10 data bits
bits
AD21b INL
Integral Nonlinearity
-1.5
—
+1.5
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD22b DNL
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23b GERR
Gain Error
—
3
6
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24b EOFF
Offset Error
—
2
5
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25b —
Monotonicity(1)
—
—
—
—
Guaranteed
ADC Accuracy (10-bit Mode) - Measurements with internal VREF+/VREFAD20b Nr
Resolution
AD21b INL
Integral Nonlinearity
10 data bits
AD22b DNL
bits
-1
—
+1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23b GERR
Gain Error
—
7
15
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24b EOFF
Offset Error
—
3
7
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25b —
Monotonicity(1)
—
—
—
—
AD30b THD
Total Harmonic Distortion
—
—
-64
dB
—
AD31b SINAD
Signal to Noise and
Distortion
57
58.5
—
dB
—
AD32b SFDR
Spurious Free Dynamic
Range
72
—
—
dB
—
AD33b FNYQ
Input Signal Bandwidth
—
—
550
kHz
—
AD34b ENOB
Effective Number of Bits
9.16
9.4
—
bits
—
Guaranteed
Dynamic Performance (10-bit Mode)
Note 1:
2:
The ADC conversion result never decreases with an increase in the input voltage, and has no missing
codes.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
DS70593D-page 314
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-24:
ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS
(ASAM = 0, SSRC<2:0> = 000)
AD50
ADCLK
Instruction
Execution
Set SAMP
Clear SAMP
SAMP
ch0_dischrg
ch0_samp
eoc
AD61
AD60
TSAMP
AD55
CONV
ADxIF
Buffer(0)
1
2
3 4
5
6
1 – Software sets ADxCON. SAMP to start sampling.
7
8
9
5 – Convert bit 11.
2 – Sampling starts after discharge period. TSAMP is described
in Section 16. “Analog-to-Digital Converter (ADC) with DMA”
(DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”.
3 – Software clears ADxCON. SAMP to start conversion.
6 – Convert bit 10.
4 – Sampling ends, conversion sequence starts.
9 – One TAD for end of conversion.
 2009-2012 Microchip Technology Inc.
7 – Convert bit 1.
8 – Convert bit 0.
DS70593D-page 315
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-44: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
AD50a TAD
AD51a tRC
AD55a tCONV
AD56a FCNV
AD57a tSAMP
AD60a tPCS
AD61a tPSS
Characteristic
Min.
Typ(1)
Max.
Clock Parameters
ADC Clock Period
117.6
—
—
ADC Internal RC Oscillator
—
250
—
Period
Conversion Rate
Conversion Time
—
14 TAD
Throughput Rate
—
—
500
Sample Time
3 TAD
—
—
Timing Parameters
Conversion Start from Sample
2.0 TAD
—
3.0 TAD
Trigger(2)
Units
Conditions
ns
ns
—
—
ns
ksps
—
—
—
—
—
Auto-Convert Trigger
(SSRC<2:0> = 111) not
selected
—
Sample Start from Setting
2.0 TAD
—
3.0 TAD
—
Sample (SAMP) bit(2)
Conversion Completion to
—
0.5 TAD
—
—
—
AD62a tCSS
Sample Start (ASAM = 1)(2)
Time to Stabilize Analog Stage
—
—
20
s
—
AD63a tDPU
from ADC Off to ADC On(2,3)
Note 1: These parameters are characterized but not tested in manufacturing.
2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
3: tDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1).
During this time, the ADC result is indeterminate.
DS70593D-page 316
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-25:
ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS
(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)
AD50
ADCLK
Instruction
Execution Set SAMP
Clear SAMP
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
AD61
AD60
AD55
TSAMP
AD55
CONV
ADxIF
Buffer(0)
Buffer(1)
1
2
3
4
5
6
7
8
5
6
7
8
1 – Software sets ADxCON. SAMP to start sampling.
2 – Sampling starts after discharge period. TSAMP is described in Section 16. “Analog-to-Digital Converter (ADC)”
(DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”.
3 – Software clears ADxCON. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 9.
6 – Convert bit 8.
7 – Convert bit 0.
8 – One TAD for end of conversion.
 2009-2012 Microchip Technology Inc.
DS70593D-page 317
dsPIC33FJXXXGPX06A/X08A/X10A
FIGURE 25-26:
ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)
AD50
ADCLK
Instruction
Execution
Set ADON
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
TSAMP
AD55
TSAMP
AD55
TCONV
CONV
ADxIF
Buffer(0)
Buffer(1)
1
2
3
4
5
6
1 – Software sets ADxCON. ADON to start AD operation.
7
3
4
5
6
8
3
4
5 – Convert bit 0.
2 – Sampling starts after discharge period.
6 – One TAD for end of conversion.
TSAMP is described in Section 16. “Analog-to-Digital Converter
(ADC)” (DS70183) in the “dsPIC33F/PIC24H Family Reference Manual”. 7 – Begin conversion of next channel.
3 – Convert bit 9.
8 – Sample for time specified by SAMC<4:0>.
4 – Convert bit 8.
DS70593D-page 318
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 25-45: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Typ(1)
Min.
Max.
Units
Conditions
Clock Parameters
AD50b TAD
ADC Clock Period
AD51b TRC
ADC Internal RC Oscillator Period
76
—
—
ns
—
—
250
—
ns
—
Conversion Rate
AD55b TCONV
Conversion Time
—
12 TAD
—
—
—
AD56b FCNV
Throughput Rate
—
—
1.1
Msps
—
AD57b TSAMP
Sample Time
2 TAD
—
—
—
—
Timing Parameters
AD60b TPCS
Conversion Start from Sample
Trigger(2)
2.0 TAD
—
3.0 TAD
—
Auto-Convert Trigger
(SSRC<2:0> = 111) not
selected
AD61b TPSS
Sample Start from Setting
Sample (SAMP) bit(2)
2.0 TAD
—
3.0 TAD
—
—
AD62b TCSS
Conversion Completion to
Sample Start (ASAM = 1)(2)
—
0.5 TAD
—
—
—
AD63b TDPU
Time to Stabilize Analog Stage
from ADC Off to ADC On(2,3)
—
—
20
s
—
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
TDPU is the time required for the ADC module to stabilize when it is turned on (AD1CON1<ADON> = 1).
During this time, the ADC result is indeterminate.
TABLE 25-46: DMA READ/WRITE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for Industrial
-40°C  TA  +125°C for Extended
Param
No.
Characteristic
Min.
Typ
Max.
Units
DM1a
DMA Read/Write Cycle Time
—
—
2 TCY
ns
This characteristic applies to
dsPIC33FJ256GPX06A/X08A/X10A
devices only.
DM1b
DMA Read/Write Cycle Time
—
—
1 TCY
ns
This characteristic applies to all
devices with the exception of the
dsPIC33FJ256GPX06A/X08A/X10A.
 2009-2012 Microchip Technology Inc.
Conditions
DS70593D-page 319
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 320
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
26.0
HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJXXXGPX06A/X08A/X10A electrical characteristics for devices
operating in an ambient temperature range of -40°C to +150°C.
The specifications between -40°C to +150°C are identical to those shown in Section 25.0 “Electrical Characteristics”
for operation between -40°C to +125°C, with the exception of the parameters listed in this section.
Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in
Section 25.0 “Electrical Characteristics” is the Industrial and Extended temperature equivalent of HDC10.
Absolute maximum ratings for the dsPIC33FJXXXGPX06A/X08A/X10A high temperature devices are listed below.
Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of
the device at these or any other conditions above the parameters indicated in the operation listings of this specification
is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias(4) .........................................................................................................-40°C to +150°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant with respect to VSS(5) .................................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(5) ....................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD  3.0V(5) .................................................... -0.3V to 5.6V
Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V
Maximum current out of VSS pin .............................................................................................................................60 mA
Maximum current into VDD pin(2) .............................................................................................................................60 mA
Maximum junction temperature............................................................................................................................. +155°C
Maximum current sourced/sunk by any 2x I/O pin(3) ................................................................................................2 mA
Maximum current sourced/sunk by any 4x I/O pin(3) ................................................................................................4 mA
Maximum current sourced/sunk by any 8x I/O pin(3) ................................................................................................8 mA
Maximum current sunk by all ports combined ........................................................................................................10 mA
Maximum current sourced by all ports combined(2) ................................................................................................10 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 26-2).
3: Unlike devices at 125°C and below, the specifications in this section also apply to the CLKOUT, VREF+,
VREF-, SCLx, SDAx, PGECx, and PGEDx pins.
4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which
the total operating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior
written approval from Microchip Technology Inc.
5: Refer to the “Pin Diagrams” section for 5V tolerant pins.
 2009-2012 Microchip Technology Inc.
DS70593D-page 321
dsPIC33FJXXXGPX06A/X08A/X10A
26.1
High Temperature DC Characteristics
TABLE 26-1:
OPERATING MIPS VS. VOLTAGE
VDD Range
(in Volts)
Characteristic
dsPIC33FJXXXGPX06A/X08A/X10A
-40°C to +150°C
20
(1)
HDC5
Max MIPS
Temperature Range
(in °C)
VBOR to 3.6V
Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 25-11
for the minimum and maximum BOR values.
Note 1:
TABLE 26-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+155
°C
Operating Ambient Temperature Range
TA
-40
—
+150
°C
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD -  IOH)
PD
PINT + PI/O
W
PDMAX
(TJ - TA)/JA
W
I/O Pin Power Dissipation:
I/O =  ({VDD - VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
TABLE 26-3:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Symbol
Characteristic
Min
Typ
Max
Units
3.0
3.3
3.6
V
Conditions
Operating Voltage
HDC10
Supply Voltage
—
VDD
TABLE 26-4:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
-40°C to +150°C
Typical
Max
Units
2000
A
Conditions
Power-Down Current (IPD)
HDC60e
Note 1:
2:
3:
4:
250
+150°C
3.3V
Base Power-Down Current(1,3)
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
The  current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
DS70593D-page 322
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical
Max
Units
5
A
Conditions
Power-Down Current (IPD)
HDC61c
Note 1:
2:
3:
4:
3
Watchdog Timer Current: IWDT(2,4)
DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Doze
Ratio
Units
39
45
1:2
mA
HDC72f
18
25
1:64
mA
HDC72g
18
25
1:128
mA
Note 1:
3.3V
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
The  current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
TABLE 26-5:
HDC72a
+150°C
Conditions
+150°C
3.3V
20 MIPS
Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
 2009-2012 Microchip Technology Inc.
DS70593D-page 323
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-6:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +85°C for High
Temperature
DC CHARACTERISTICS
Param. Symbol
HDO10
HDO20
VOL
VOH
Characteristic
Output Low Voltage
I/O Pins:
2x Sink Driver Pins - All pins not
defined by 4x or 8x driver pins
Output Low Voltage
I/O Pins:
4x Sink Driver Pins - RA2, RA3, RA9,
RA10, RA14, RA15, RB0, RB1, RB11,
RF4, RF5, RG2, RG3
Output Low Voltage
I/O Pins:
8x Sink Driver Pins - OSC2, CLKO,
RC15
Output High Voltage
I/O Pins:
2x Source Driver Pins - All pins not
defined by 4x or 8x driver pins
Output High Voltage
I/O Pins:
4x Source Driver Pins - RA2, RA3,
RA9, RA10, RA14, RA15, RB0, RB1,
RB11, RF4, RF5, RG2, RG3
Output High Voltage
I/O Pins:
8x Source Driver Pins - OSC2, CLKO,
RC15
Output High Voltage
I/O Pins:
2x Source Driver Pins - All pins not
defined by 4x or 8x driver pins
HDO20A VOH1
Output High Voltage
4x Source Driver Pins - RA2, RA3,
RA9, RA10, RA14, RA15, RB0, RB1,
RB11, RF4, RF5, RG2, RG3
Output High Voltage
8x Source Driver Pins - OSC2, CLKO,
RC15
Note 1:
Min.
Typ.
Max.
Units
Conditions
—
—
0.4
V
IOL  1.8 mA, VDD = 3.3V
See Note 1
—
—
0.4
V
IOL  3.6 mA, VDD = 3.3V
See Note 1
—
—
0.4
V
IOL  6 mA, VDD = 3.3V
See Note 1
2.4
—
—
V
IOL  -1.8 mA, VDD = 3.3V
See Note 1
2.4
—
—
V
IOL  -3 mA, VDD = 3.3V
See Note 1
2.4
—
—
V
IOL  -6 mA, VDD = 3.3V
See Note 1
1.5
—
—
2.0
—
—
3.0
—
—
1.5
—
—
2.0
—
—
3.0
—
—
1.5
—
—
2.0
—
—
3.0
—
—
V
V
V
IOH  -1.9 mA, VDD = 3.3V
See Note 1
IOH  -1.85 mA, VDD =
3.3V
See Note 1
IOH  -1.4 mA, VDD = 3.3V
See Note 1
IOH  -3.9 mA, VDD = 3.3V
See Note 1
IOH  -3.7 mA, VDD = 3.3V
See Note 1
IOH  -2 mA, VDD = 3.3V
See Note 1
IOH  -7.5 mA, VDD = 3.3V
See Note 1
IOH  -6.8 mA, VDD = 3.3V
See Note 1
IOH  -3 mA, VDD = 3.3V
See Note 1
Parameters are characterized, but not tested.
DS70593D-page 324
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
26.2
AC Characteristics and Timing
Parameters
The information contained in this section defines
dsPIC33FJXXXGPX06A/X08A/X10A
AC
characteristics and timing parameters for high
temperature devices. However, all AC timing
specifications in this section are the same as those in
Section 25.2 “AC Characteristics and Timing
Parameters”, with the exception of the parameters
listed in this section.
Parameters in this section begin with an H, which
denotes High temperature. For example, parameter
OS53 in Section 25.2 “AC Characteristics and
Timing Parameters” is the Industrial and Extended
temperature equivalent of HOS53.
TABLE 26-7:
TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Operating voltage VDD range as described in Table 26-1.
AC CHARACTERISTICS
FIGURE 26-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464
CL = 50 pF for all pins except OSC2
15 pF for OSC2 output
VSS
TABLE 26-8:
PLL CLOCK TIMING SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic
CLKO Stability (Jitter)(1)
Min
Typ
Max
Units
-5
0.5
5
%
HOS53
DCLK
Note 1:
These parameters are characterized, but are not tested in manufacturing.
 2009-2012 Microchip Technology Inc.
Conditions
Measured over 100 ms
period
DS70593D-page 325
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-9:
INTERNAL LPRC ACCURACY
AC
CHARACTERISTICS
Param
No.
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Characteristic
Min
Typ
Max
Units
-70(2)
—
+70(2)
%
Conditions
LPRC @ 32.768 kHz (1)
HF21
Note 1:
2:
LPRC
Change of LPRC frequency as
Characterized but not tested.
VDD
-40°C  TA  +150°C
changes.
TABLE 26-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
10
25
ns
—
HSP40
TdiV2scH, Setup Time of SDIx Data Input
TdiV2scL to SCKx Edge
28
—
—
ns
—
HSP41
TscH2diL,
TscL2diL
35
—
—
ns
—
Note 1:
These parameters are characterized but not tested in manufacturing.
Hold Time of SDIx Data Input
to SCKx Edge
TABLE 26-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
10
25
ns
—
HSP36
TdoV2sc,
TdoV2scL
35
—
—
ns
—
HSP40
TdiV2scH, Setup Time of SDIx Data Input
TdiV2scL to SCKx Edge
28
—
—
ns
—
HSP41
TscH2diL,
TscL2diL
35
—
—
ns
—
Note 1:
SDOx Data Output Setup to
First SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
These parameters are characterized but not tested in manufacturing.
DS70593D-page 326
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
—
—
35
ns
—
HSP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
25
—
—
ns
—
HSP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input to
SCKx Edge
25
—
—
ns
—
HSP51
TssH2doZ
SSx  to SDOx Output
High-Impedance
15
—
55
ns
Note 1:
2:
See Note 2
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TABLE 26-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC
CHARACTERISTICS
Param
No.
Symbol
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Characteristic(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
—
35
ns
—
HSP40
TdiV2scH, Setup Time of SDIx Data Input
TdiV2scL to SCKx Edge
25
—
—
ns
—
HSP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
25
—
—
ns
—
HSP51
TssH2doZ
SSx  to SDOX Output
High-Impedance
15
—
55
ns
HSP60
TssL2doV
SDOx Data Output Valid after
SSx Edge
—
—
55
ns
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
 2009-2012 Microchip Technology Inc.
See Note 2
—
DS70593D-page 327
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-14: ADC MODULE SPECIFICATIONS
AC
CHARACTERISTICS
Param
No.
Symbol
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C  TA  +150°C for High Temperature
Characteristic
Min
Typ
Max
Units
600
50
A
A
Conditions
Reference Inputs
HAD08
Note 1:
2:
Current Drain
IREF
—
—
250
—
ADC operating, See Note 1
ADC off, See Note 1
These parameters are not characterized or tested in manufacturing.
These parameters are characterized, but are not tested in manufacturing.
TABLE 26-15: ADC MODULE SPECIFICATIONS (12-BIT MODE)(3)
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(1)
AD23a
GERR
Gain Error
—
5
10
LSb
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.6V
AD24a
EOFF
Offset Error
—
2
5
LSb
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.6V
ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-(1)
AD23a
GERR
Gain Error
AD24a
EOFF
Offset Error
2
10
20
LSb
VINL = AVSS = 0V, AVDD = 3.6V
2
5
10
LSb
VINL = AVSS = 0V, AVDD = 3.6V
Dynamic Performance (12-bit Mode)(2)
HAD33a
FNYQ
Note 1:
2:
3:
These parameters are characterized, but are tested at 20 ksps only.
These parameters are characterized by similarity, but are not tested in manufacturing.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
Input Signal Bandwidth
—
—
200
kHz
—
TABLE 26-16: ADC MODULE SPECIFICATIONS (10-BIT MODE)(3)
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-(1)
AD23b
GERR
Gain Error
—
3
6
LSb
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.6V
AD24b
EOFF
Offset Error
—
2
5
LSb
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3.6V
ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-(1)
AD23b
GERR
Gain Error
AD24b
EOFF
Offset Error
—
7
15
LSb
VINL = AVSS = 0V, AVDD = 3.6V
—
3
7
LSb
VINL = AVSS = 0V, AVDD = 3.6V
Dynamic Performance (10-bit Mode)(2)
HAD33b
FNYQ
Note 1:
2:
3:
These parameters are characterized, but are tested at 20 ksps only.
These parameters are characterized by similarity, but are not tested in manufacturing.
Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts.
DS70593D-page 328
Input Signal Bandwidth
—
—
400
kHz
—
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE 26-17: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
—
—
ns
—
—
400
Ksps
—
Clock Parameters
HAD50
TAD
ADC Clock Period(1)
HAD56
FCNV
Throughput Rate(1)
147
Conversion Rate
Note 1:
—
These parameters are characterized but not tested in manufacturing.
TABLE 26-18: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
AC
CHARACTERISTICS Operating temperature -40°C  TA  +150°C for High Temperature
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
—
ns
—
800
Ksps
—
Clock Parameters
HAD50
TAD
ADC Clock Period(1)
HAD56
FCNV
Throughput Rate(1)
Note 1:
These parameters are characterized but not tested in manufacturing.
104
—
Conversion Rate
 2009-2012 Microchip Technology Inc.
—
—
DS70593D-page 329
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 330
 2009-2012 Microchip Technology Inc.
DC AND AC DEVICE CHARACTERISTICS GRAPHS
Note:
The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for design guidance purposes
only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating
range (e.g., outside specified power supply range) and therefore, outside the warranted range.
FIGURE 27-1:
VOH – 2x DRIVER PINS
-0.040
-0.016
-0.035
3.6V
IOH (A)
-0.012
-0.010
3V
-0.008
-0.006
3.3V
-0.025
3V
-0.020
-0.015
-0.004
-0.010
-0.002
-0.005
0.000
0.00
3.6V
-0.030
3.3V
IOH (A)
-0.014
VOH – 8x DRIVER PINS
FIGURE 27-3:
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0.000
0.00
4.00
1.00
2.00
VOH (V)
FIGURE 27-2:
VOH – 4x DRIVER PINS
FIGURE 27-4:
3.6V
-0.070
IOH (A)
IOH (A)
3V
-0.015
-0.010
DS70593D-page 331
3.00
4.00
VOH – 16x DRIVER PINS
3.6V
-0.060
3.3V
-0.020
3.3V
-0.050
3V
-0.040
-0.030
-0.020
-0.005
0.000
0.00
4.00
-0.080
-0.030
-0.025
3.00
VOH (V)
-0.010
0.50
1.00
1.50
2.00
VOH (V)
2.50
3.00
3.50
4.00
0.000
0.00
1.00
2.00
VOH (V)
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
27.0
VOL – 2x DRIVER PINS
FIGURE 27-7:
0.060
0.020
0.018
3.6V
0.016
3.6V
0.050
3.3V
3.3V
0.014
0.040
3V
0.012
IOL (A)
IOL (A)
VOL – 8x DRIVER PINS
0.010
0.008
3V
0.030
0.020
0.006
0.004
0.010
0.002
0.000
0.00
1.00
2.00
3.00
0.000
0.00
4.00
1.00
FIGURE 27-6:
VOL – 4x DRIVER PINS
FIGURE 27-8:
3.00
4.00
VOL – 16x DRIVER PINS
0.120
0.040
0.035
3.6V
0.030
3.6V
0.100
3.3V
0.025
3.3V
0.080
3V
IOL (A)
 2009-2012 Microchip Technology Inc.
IOL (A)
2.00
VOL (V)
VOL (V)
0.020
0.015
3V
0.060
0.040
0.010
0.020
0.005
0.000
0.00
1.00
2.00
VOL (V)
3.00
4.00
0.000
0.00
1.00
2.00
VOL (V)
3.00
4.00
dsPIC33FJXXXGPX06A/X08A/X10A
DS70593D-page 332
FIGURE 27-5:
TYPICAL FRC FREQUENCY @ VDD = 3.3V
FIGURE 27-10:
7450
50
7400
45
7350
40
Frequency (kHz)
Frequency (kHz)
TYPICAL LPRC FREQUENCY @ VDD = 3.3V
7300
7250
7200
35
30
25
7150
20
7100
-40 -30 -20 -10
0
10
20 30 40 50 60 70
Temperature Celsius
80
90 100 110 120
40 30 20 10
0
10
20
30
40
50
60
TemperatureCelsius
70
80
90 100 110 120
DS70593D-page 333
dsPIC33FJXXXGPX06A/X08A/X10A
 2009-2012 Microchip Technology Inc.
FIGURE 27-9:
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 334
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
28.0
PACKAGING INFORMATION
28.1
Package Marking Information
64-Lead QFN (9x9x0.9mm)
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
e3
*
Note:
Example
dsPIC33FJ
256GP706A
-I/PT e3
0510017
80-Lead TQFP (12x12x1 mm)
Legend: XX...X
Y
YY
WW
NNN
33FJ64GP
206A-I/MR e3
0610017
64-Lead TQFP (10x10x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
Example
dsPIC33FJ128
GP708A-I/PT e3
0510017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2009-2012 Microchip Technology Inc.
DS70593D-page 335
dsPIC33FJXXXGPX06A/X08A/X10A
28.1
Package Marking Information (Continued)
100-Lead TQFP (12x12x1 mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
dsPIC33FJ256
GP710A-I/PT e3
0510017
100-Lead TQFP (14x14x1mm)
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS70593D-page 336
Example
Example
dsPIC33FJ256
GP710A-I/PF e3
0510017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
28.2
Note:
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2009-2012 Microchip Technology Inc.
DS70593D-page 337
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70593D-page 338
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
123
NOTE 2
α
A
φ
c
A2
β
A1
L
L1
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
NOM
MAX
64
Lead Pitch
e
Overall Height
A
–
0.50 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-085B
 2009-2012 Microchip Technology Inc.
DS70593D-page 339
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70593D-page 340
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
12 3
α
NOTE 2
A
c
β
φ
A2
A1
L1
L
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
NOM
MAX
80
Lead Pitch
e
Overall Height
A
–
0.50 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
14.00 BSC
Overall Length
D
14.00 BSC
Molded Package Width
E1
12.00 BSC
Molded Package Length
D1
12.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-092B
 2009-2012 Microchip Technology Inc.
DS70593D-page 341
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70593D-page 342
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E
E1
N
b
NOTE 1
1 23
NOTE 2
α
c
A
φ
L
β
A1
Units
Dimension Limits
Number of Leads
A2
L1
MILLIMETERS
MIN
N
NOM
MAX
100
Lead Pitch
e
Overall Height
A
–
0.40 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
14.00 BSC
Overall Length
D
14.00 BSC
Molded Package Width
E1
12.00 BSC
Molded Package Length
D1
12.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.13
0.18
0.23
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-100B
 2009-2012 Microchip Technology Inc.
DS70593D-page 343
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70593D-page 344
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E1
E
b
N
α
NOTE 1
1 23
A
NOTE 2
φ
c
β
A2
A1
L
L1
Units
Dimension Limits
Number of Leads
MILLIMETERS
MIN
N
NOM
MAX
100
Lead Pitch
e
Overall Height
A
–
0.50 BSC
–
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.20
1.00 REF
Foot Angle
φ
Overall Width
E
16.00 BSC
Overall Length
D
16.00 BSC
Molded Package Width
E1
14.00 BSC
Molded Package Length
D1
14.00 BSC
0°
3.5°
7°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-110B
 2009-2012 Microchip Technology Inc.
DS70593D-page 345
dsPIC33FJXXXGPX06A/X08A/X10A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS70593D-page 346
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
APPENDIX A:
MIGRATING FROM dsPIC33FJXXXGPX06/X08/X10 DEVICES TO
dsPIC33FJXXXGPX06A/X08A/X10A DEVICES
dsPIC33FJXXXGPX06A/X08A/X10A devices were
designed to enhance the dsPIC33FJXXXGPX06/X08/
X10 families of devices.
In general, the dsPIC33FJXXXGPX06A/X08A/X10A
devices
are
backward-compatible
with
dsPIC33FJXXXGPX06/X08/X10 devices; however,
manufacturing
differences
may
cause
dsPIC33FJXXXGPX06A/X08A/X10A
devices
to
behave differently from dsPIC33FJXXXGPX06/X08/
X10 devices. Therefore, complete system test and
characterization
is
recommended
if
dsPIC33FJXXXGPX06A/X08A/X10A devices are used
to replace dsPIC33FJXXXGPX06/X08/X10 devices.
The following enhancements were introduced:
• Extended temperature support of up to +125ºC
• Enhanced Flash module with higher endurance
and retention
• New PLL Lock Enable configuration bit
• Added Timer5 trigger for ADC1 and Timer3 trigger
for ADC2
 2009-2012 Microchip Technology Inc.
DS70593D-page 347
dsPIC33FJXXXGPX06A/X08A/X10A
APPENDIX B:
REVISION HISTORY
Revision B (October 2009)
The revision includes the following global update:
Revision A (April 2009)
This is the initial released version of the document.
• Added Note 2 to the shaded table that appears at
the beginning of each chapter. This new note
provides information regarding the availability of
registers and their associated bits
This revision also includes minor typographical and
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
TABLE B-1:
MAJOR SECTION UPDATES
Section Name
Update Description
“High-Performance, 16-Bit Digital Signal
Controllers”
Added information on high temperature operation (see “Operating
Range”).
Section 10.0 “Power-Saving Features”
Updated the last paragraph to clarify the number of cycles that occur
prior to the start of instruction execution (see Section 10.2.2 “Idle
Mode”).
Section 11.0 “I/O Ports”
Changed the reference to digital-only pins to 5V tolerant pins in the
second paragraph of Section 11.2 “Open-Drain Configuration”.
Section 18.0 “Universal Asynchronous
Receiver Transmitter (UART)”
Updated the two baud rate range features to: 10 Mbps to 38 bps at
40 MIPS.
Section 21.0 “10-Bit/12-Bit
Analog-to-Digital Converter (ADC)”
Updated the ADCx block diagram (see Figure 21-1).
Section 22.0 “Special Features”
Updated the second paragraph and removed the fourth paragraph in
Section 22.1 “Configuration Bits”.
Updated the Device Configuration Register Map (see Table 22-1).
Added the FPWRT<2:0> bit field for the FWDT register to the
Configurative Bits Description table (see Table 22-1).
Section 25.0 “Electrical Characteristics”
Updated the Absolute Maximum Ratings for high temperature and
added Note 4.
Updated Power-Down Current parameters DC60d, DC60a, DC60b,
and DC60d (see Table 25-7).
Added I2Cx Bus Data Timing Requirements (Master Mode)
parameter IM51 (see Table 25-36).
Updated the SPIx Module Slave Mode (CKE = 1) Timing
Characteristics (see Figure 25-12).
Updated the Internal LPRC Accuracy parameters (see Table 25-19).
Updated the ADC Module Specifications (12-bit Mode) parameters
AD23a and AD24a (see Table 25-42).
Updated the ADC Module Specifications (10-bit Mode) parameters
AD23b and AD24b (see Table 25-43).
Section 26.0 “High Temperature Electrical
Characteristics”
Added new chapter with high temperature specifications.
“Product Identification System”
Added the “H” definition for high temperature.
DS70593D-page 348
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Revision C (March 2011)
This revision includes typographical and formatting
changes throughout the data sheet text. In addition, all
instances of VDDCORE have been removed.
All other major changes are referenced by their
respective section in the following table.
TABLE B-2:
MAJOR SECTION UPDATES
Section Name
Section 2.0 “Guidelines for Getting Started
with 16-Bit Digital Signal Controllers”
Update Description
Updated the title of Section 2.3 “CPU Logic Filter Capacitor
Connection (VCAP)”.
The frequency limitation for device PLL start-up conditions was
updated in Section 2.7 “Oscillator Value Conditions on Device
Start-up”.
The second paragraph in Section 2.9 “Unused I/Os” was updated.
Section 4.0 “Memory Organization”
The All Resets values for the following SFRs in the Timer Register
Map were changed (see Table 4-6):
• TMR1
• TMR2
• TMR3
• TMR4
• TMR5
• TMR6
• TMR7
• TMR8
• TMR9
Section 9.0 “Oscillator Configuration”
Added Note 3 to the OSCCON: Oscillator Control Register (see
Register 9-1).
Added Note 2 to the CLKDIV: Clock Divisor Register (see
Register 9-2).
Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see
Register 9-3).
Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see
Register 9-4).
Section 21.0 “10-Bit/12-Bit
Analog-to-Digital Converter (ADC)”
Updated the VREFL references in the ADC1 module block diagram
(see Figure 21-1).
Section 22.0 “Special Features”
Added a new paragraph and removed the third paragraph in
Section 22.1 “Configuration Bits”.
Added the column “RTSP Effects” to the Configuration Bits
Descriptions (see Table 22-2).
 2009-2012 Microchip Technology Inc.
DS70593D-page 349
dsPIC33FJXXXGPX06A/X08A/X10A
TABLE B-2:
MAJOR SECTION UPDATES (CONTINUED)
Section Name
Section 25.0 “Electrical Characteristics”
Update Description
Removed Note 4 from the DC Temperature and Voltage
Specifications (see Table 25-4).
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see Table 25-9).
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see Table 25-18).
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see Table 25-20).
Updated the ADC Module Specification minimum values for
parameters AD05 and AD07, and updated the maximum value for
parameter AD06 (see Table 25-41).
Added Note 1 to the ADC Module Specifications (12-bit Mode) (see
Table 25-42).
Added Note 1 to the ADC Module Specifications (10-bit Mode) (see
Table 25-43).
Added DMA Read/Write Timing Requirements (see Table 25-46).
Section 26.0 “High Temperature Electrical
Characteristics”
Updated all ambient temperature end range values to +150ºC
throughout the chapter.
Updated the storage temperature end range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated the maximum values for High Temperature Devices in the
Thermal Operating Conditions (see Table 26-2).
Added Note 3 and updated the ADC Module Specifications (12-bit
Mode), removing all parameters with the exception of HAD33a (see
Table 26-16).
Added Note 3 and updated the ADC Module Specifications (10-bit
Mode), removing all parameters with the exception of HAD33b (see
Table 26-17).
DS70593D-page 350
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
Revision D (June 2012)
This revision includes typographical and formatting
changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
TABLE B-3:
MAJOR SECTION UPDATES
Section Name
Update Description
Section 2.0 “Guidelines for Getting Started Updated the Recommended Minimum Connection (see Figure 2-1).
with 16-Bit Digital Signal Controllers”
Section 9.0 “Oscillator Configuration”
Updated the COSC<2:0> and NOSC<2:0> bit value definitions for
‘001’ (see Register 9-1).
Section 21.0 “10-Bit/12-Bit
Analog-to-Digital Converter (ADC)”
Updated the Analog-to-Digital Conversion Clock Period Block
Diagram (see Figure 21-2).
Section 22.0 “Special Features”
Added Note 3 to the On-chip Voltage Regulator Connections (see
Figure 22-1).
Section 25.0 “Electrical Characteristics”
Updated “Absolute Maximum Ratings”.
Updated Operating MIPS vs. Voltage (see Table 25-1).
Removed parameter DC18 from the DC Temperature and Voltage
Specifications (see Table 25-4).
Updated the notes in the following tables:
•
•
•
•
Table 25-5
Table 25-6
Table 25-7
Table 25-8
Updated the I/O Pin Output Specifications (see Table 25-10).
Updated the Conditions for parameter BO10 (see Table 25-11).
Updated the Conditions for parameters D136b, D137b, and D138b
(TA = 150ºC) (see Table 25-12).
Section 26.0 “High Temperature Electrical
Characteristics”
Updated “Absolute Maximum Ratings”.
Updated the I/O Pin Output Specifications (see Table 26-6).
Removed Table 25-7: DC Characteristics: Program Memory.
 2009-2012 Microchip Technology Inc.
DS70593D-page 351
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 352
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
INDEX
A
A/D Converter ................................................................... 237
DMA .......................................................................... 237
Initialization ............................................................... 237
Key Features............................................................. 237
AC Characteristics .................................................... 282, 325
ADC Module.............................................................. 328
ADC Module (10-bit Mode) ....................................... 328
ADC Module (12-bit Mode) ....................................... 328
Internal RC Accuracy ................................................ 284
Load Conditions ................................................ 282, 325
ADC Module
ADC11 Register Map .................................................. 55
ADC2 Register Map .................................................... 55
Alternate Interrupt Vector Table (AIVT) .............................. 89
Arithmetic Logic Unit (ALU)................................................. 33
Assembler
MPASM Assembler................................................... 268
B
Barrel Shifter ....................................................................... 37
Bit-Reversed Addressing .................................................... 70
Example ...................................................................... 71
Implementation ........................................................... 70
Sequence Table (16-Entry)......................................... 71
Block Diagrams
16-bit Timer1 Module ................................................ 167
A/D Module ............................................................... 238
Connections for On-Chip Voltage Regulator............. 256
DCI Module ............................................................... 230
Device Clock ..................................................... 145, 147
DSP Engine ................................................................ 34
dsPIC33F .................................................................... 20
dsPIC33F CPU Core................................................... 28
ECAN Module ........................................................... 202
Input Capture ............................................................ 175
Output Compare ....................................................... 177
PLL............................................................................ 147
Reset System.............................................................. 83
Shared Port Structure ............................................... 163
SPI ............................................................................ 181
Timer2 (16-bit) .......................................................... 171
Timer2/3 (32-bit) ....................................................... 170
UART ........................................................................ 195
Watchdog Timer (WDT) ............................................ 257
C
C Compilers
MPLAB C18 .............................................................. 268
Clock Switching................................................................. 153
Enabling .................................................................... 153
Sequence.................................................................. 153
Code Examples
Erasing a Program Memory Page............................... 81
Initiating a Programming Sequence............................ 82
Loading Write Buffers ................................................. 82
Port Write/Read ........................................................ 164
PWRSAV Instruction Syntax..................................... 155
Code Protection ........................................................ 251, 258
Configuration Bits.............................................................. 251
Description (Table).................................................... 252
Configuration Register Map .............................................. 251
Configuring Analog Port Pins ............................................ 164
 2009-2012 Microchip Technology Inc.
CPU
Control Register.......................................................... 30
CPU Clocking System ...................................................... 146
Options ..................................................................... 146
Selection................................................................... 146
Customer Change Notification Service............................. 357
Customer Notification Service .......................................... 357
Customer Support............................................................. 357
D
Data Accumulators and Adder/Subtractor .......................... 35
Data Space Write Saturation ...................................... 37
Overflow and Saturation ............................................. 35
Round Logic ............................................................... 36
Write Back .................................................................. 36
Data Address Space........................................................... 41
Alignment.................................................................... 41
Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A
Devices with 16 KB RAM.................................... 43
Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A
Devices with 30 KB RAM.................................... 44
Memory Map for dsPIC33FJXXXGPX06A/X08A/X10A
Devices with 8 KB RAM...................................... 42
Near Data Space ........................................................ 41
Software Stack ........................................................... 67
Width .......................................................................... 41
Data Converter Interface (DCI) Module ............................ 229
DC and AC Characteristics
Graphs and Tables ................................................... 331
DC Characteristics............................................................ 272
Doze Current (IDOZE)................................................ 323
High Temperature..................................................... 322
I/O Pin Input Specifications ...................................... 278
I/O Pin Output Specifications............................ 280, 324
Idle Current (IIDLE) .................................................... 275
Operating Current (IDD) ............................................ 274
Operating MIPS vs. Voltage ..................................... 322
Power-Down Current (IPD)........................................ 276
Power-down Current (IPD) ........................................ 322
Program Memory...................................................... 281
Temperature and Voltage......................................... 322
Temperature and Voltage Specifications.................. 273
Thermal Operating Conditions.................................. 322
DCI
Buffer Control ........................................................... 229
Buffer Data Alignment .............................................. 229
Introduction............................................................... 229
Transmit/Receive Shift Register ............................... 229
DCI I/O Pins...................................................................... 229
COFS........................................................................ 229
CSCK........................................................................ 229
CSDI ......................................................................... 229
CSDO ....................................................................... 229
DCI Module
Register Map .............................................................. 64
Development Support ....................................................... 267
DMA Module
DMA Register Map ..................................................... 56
DMAC Registers ............................................................... 136
DMAxCNT ................................................................ 136
DMAxCON................................................................ 136
DS70593D-page 353
dsPIC33FJXXXGPX06A/X08A/X10A
DMAxPAD ................................................................. 136
DMAxREQ ................................................................ 136
DMAxSTA ................................................................. 136
DMAxSTB ................................................................. 136
DSP Engine......................................................................... 33
Multiplier...................................................................... 35
E
ECAN Module
CiFMSKSEL2 register ............................................... 221
ECAN1 Register Map (C1CTRL1.WIN = 0 or 1) ......... 58
ECAN1 Register Map (C1CTRL1.WIN = 0) ................ 58
ECAN1 Register Map (C1CTRL1.WIN = 1) ................ 59
ECAN2 Register Map (C2CTRL1.WIN = 0 or 1) ......... 61
ECAN2 Register Map (C2CTRL1.WIN = 0) .......... 61, 62
Frame Types ............................................................. 201
Modes of Operation .................................................. 203
Overview ................................................................... 201
ECAN Registers
Filter 15-8 Mask Selection Register
(CiFMSKSEL2) ................................................. 221
Electrical Characteristics................................................... 271
AC ..................................................................... 282, 325
Enhanced CAN Module..................................................... 201
Equations
Device Operating Frequency .................................... 146
Errata .................................................................................. 16
F
Flash Program Memory....................................................... 77
Control Registers ........................................................ 78
Operations .................................................................. 78
Programming Algorithm .............................................. 81
RTSP Operation.......................................................... 78
Table Instructions........................................................ 77
Flexible Configuration ....................................................... 251
FSCM
Delay for Crystal and PLL Clock Sources ................... 87
Device Resets ............................................................. 87
H
High Temperature Electrical Characteristics..................... 321
I
I/O Ports ............................................................................ 163
Parallel I/O (PIO)....................................................... 163
Write/Read Timing .................................................... 164
I2C
Operating Modes ...................................................... 187
Registers ................................................................... 187
I2C Module
I2C1 Register Map ...................................................... 53
I2C2 Register Map ...................................................... 53
In-Circuit Debugger ........................................................... 258
In-Circuit Emulation........................................................... 251
In-Circuit Serial Programming (ICSP) ....................... 251, 258
Input Capture
Registers ................................................................... 176
Input Change Notification Module ..................................... 164
Instruction Addressing Modes............................................. 67
File Register Instructions ............................................ 67
Fundamental Modes Supported.................................. 68
MAC Instructions......................................................... 68
MCU Instructions ........................................................ 67
Move and Accumulator Instructions ............................ 68
Other Instructions........................................................ 68
DS70593D-page 354
Instruction Set
Overview................................................................... 262
Summary .................................................................. 259
Instruction-Based Power-Saving Modes........................... 155
Idle ............................................................................ 156
Sleep ........................................................................ 155
Internal RC Oscillator
Use with WDT........................................................... 257
Internet Address ............................................................... 357
Interrupt Control and Status Registers ............................... 93
IECx ............................................................................ 93
IFSx ............................................................................ 93
INTCON1 .................................................................... 93
INTCON2 .................................................................... 93
IPCx ............................................................................ 93
Interrupt Setup Procedures............................................... 133
Initialization ............................................................... 133
Interrupt Disable ....................................................... 133
Interrupt Service Routine .......................................... 133
Trap Service Routine ................................................ 133
Interrupt Vector Table (IVT) ................................................ 89
Interrupts Coincident with Power Save Instructions ......... 156
J
JTAG Boundary Scan Interface ........................................ 251
M
Memory Organization ......................................................... 39
Microchip Internet Web Site.............................................. 357
Modes of Operation
Disable...................................................................... 203
Initialization ............................................................... 203
Listen All Messages.................................................. 203
Listen Only................................................................ 203
Loopback .................................................................. 203
Normal Operation ..................................................... 203
Modulo Addressing ............................................................. 68
Applicability................................................................. 70
Operation Example ..................................................... 69
Start and End Address ............................................... 69
W Address Register Selection .................................... 69
MPLAB ASM30 Assembler, Linker, Librarian ................... 268
MPLAB Integrated Development
Environment Software .............................................. 267
MPLAB PM3 Device Programmer .................................... 270
MPLAB REAL ICE In-Circuit Emulator System ................ 269
MPLINK Object Linker/MPLIB Object Librarian ................ 268
N
NVM Module
Register Map .............................................................. 66
O
Open-Drain Configuration................................................. 164
Output Compare ............................................................... 177
P
Packaging ......................................................................... 335
Details....................................................................... 339
Marking ............................................................. 335, 336
Peripheral Module Disable (PMD) .................................... 156
Pinout I/O Descriptions (table)............................................ 21
PMD Module
Register Map .............................................................. 66
POR and Long Oscillator Start-up Times ........................... 87
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
PORTA
Register Map............................................................... 64
PORTB
Register Map............................................................... 64
PORTC
Register Map............................................................... 65
PORTD
Register Map............................................................... 65
PORTE
Register Map............................................................... 65
PORTF
Register Map............................................................... 65
PORTG
Register Map............................................................... 66
Power-Saving Features .................................................... 155
Clock Frequency and Switching................................ 155
Program Address Space ..................................................... 39
Construction................................................................ 72
Data Access from Program Memory
Using Program Space Visibility........................... 75
Data Access from Program Memory
Using Table Instructions ..................................... 74
Data Access from, Address Generation...................... 73
Memory Map ............................................................... 39
Table Read Instructions
TBLRDH ............................................................. 74
TBLRDL .............................................................. 74
Visibility Operation ...................................................... 75
Program Memory
Interrupt Vector ........................................................... 40
Organization................................................................ 40
Reset Vector ............................................................... 40
R
Reader Response ............................................................. 358
Registers
ADxCHS0 (ADCx Input Channel 0 Select................. 247
ADxCHS123 (ADCx Input Channel 1, 2, 3 Select) ... 246
ADxCON1 (ADCx Control 1)..................................... 241
ADxCON2 (ADCx Control 2)..................................... 243
ADxCON3 (ADCx Control 3)..................................... 244
ADxCON4 (ADCx Control 4)..................................... 245
ADxCSSH (ADCx Input Scan Select High)............... 248
ADxCSSL (ADCx Input Scan Select Low) ................ 248
ADxPCFGH (ADCx Port Configuration High) ........... 249
ADxPCFGL (ADCx Port Configuration Low)............. 249
CiBUFPNT1 (ECAN Filter 0-3 Buffer Pointer)........... 215
CiBUFPNT2 (ECAN Filter 4-7 Buffer Pointer)........... 216
CiBUFPNT3 (ECAN Filter 8-11 Buffer Pointer)......... 217
CiBUFPNT4 (ECAN Filter 12-15 Buffer Pointer)....... 218
CiCFG1 (ECAN Baud Rate Configuration 1) ............ 212
CiCFG2 (ECAN Baud Rate Configuration 2) ............ 213
CiCTRL1 (ECAN Control 1) ...................................... 204
CiCTRL2 (ECAN Control 2) ...................................... 205
CiEC (ECAN Transmit/Receive Error Count)............ 211
CiFCTRL (ECAN FIFO Control)................................ 207
CiFEN1 (ECAN Acceptance Filter Enable) ............... 214
CiFIFO (ECAN FIFO Status)..................................... 208
CiFMSKSEL1 (ECAN Filter 7-0 Mask
Selection) .................................................. 220, 221
CiINTE (ECAN Interrupt Enable) .............................. 210
CiINTF (ECAN Interrupt Flag)................................... 209
CiRXFnEID (ECAN Acceptance Filter n
Extended Identifier)........................................... 219
CiRXFnSID (ECAN Acceptance Filter n
Standard Identifier) ........................................... 219
 2009-2012 Microchip Technology Inc.
CiRXFUL1 (ECAN Receive Buffer Full 1)................. 223
CiRXFUL2 (ECAN Receive Buffer Full 2)................. 223
CiRXMnEID (ECAN Acceptance Filter Mask n
Extended Identifier) .......................................... 222
CiRXMnSID (ECAN Acceptance Filter Mask n
Standard Identifier) ........................................... 222
CiRXOVF1 (ECAN Receive Buffer Overflow 1)........ 224
CiRXOVF2 (ECAN Receive Buffer Overflow 2)........ 224
CiTRBnDLC (ECAN Buffer n Data
Length Control)................................................. 227
CiTRBnDm (ECAN Buffer n Data Field Byte m) ....... 227
CiTRBnEID (ECAN Buffer n Extended Identifier) ..... 226
CiTRBnSID (ECAN Buffer n Standard Identifier)...... 226
CiTRBnSTAT (ECAN Receive Buffer n Status)........ 228
CiTRmnCON (ECAN TX/RX Buffer m Control) ........ 225
CiVEC (ECAN Interrupt Code) ................................. 206
CLKDIV (Clock Divisor) ............................................ 150
CORCON (Core Control) ...................................... 32, 94
DCICON1 (DCI Control 1) ........................................ 231
DCICON2 (DCI Control 2) ........................................ 232
DCICON3 (DCI Control 3) ........................................ 233
DCISTAT (DCI Status) ............................................. 234
DMACS0 (DMA Controller Status 0) ........................ 141
DMACS1 (DMA Controller Status 1) ........................ 143
DMAxCNT (DMA Channel x Transfer Count) ........... 140
DMAxCON (DMA Channel x Control)....................... 137
DMAxPAD (DMA Channel x Peripheral Address) .... 140
DMAxREQ (DMA Channel x IRQ Select) ................. 138
DMAxSTA (DMA Channel x RAM Start
Address A)........................................................ 139
DMAxSTB (DMA Channel x RAM Start
Address B)........................................................ 139
DSADR (Most Recent DMA RAM Address) ............. 144
I2CxCON (I2Cx Control)........................................... 190
I2CxMSK (I2Cx Slave Mode Address Mask)............ 194
I2CxSTAT (I2Cx Status) ........................................... 192
ICxCON (Input Capture x Control)............................ 176
IEC0 (Interrupt Enable Control 0) ............................. 106
IEC1 (Interrupt Enable Control 1) ............................. 108
IEC2 (Interrupt Enable Control 2) ............................. 110
IEC3 (Interrupt Enable Control 3) ............................. 112
IEC4 (Interrupt Enable Control 4) ............................. 113
IFS0 (Interrupt Flag Status 0) ..................................... 98
IFS1 (Interrupt Flag Status 1) ................................... 100
IFS2 (Interrupt Flag Status 2) ................................... 102
IFS3 (Interrupt Flag Status 3) ................................... 104
IFS4 (Interrupt Flag Status 4) ................................... 105
INTCON1 (Interrupt Control 1) ................................... 95
INTCON2 (Interrupt Control 2) ................................... 97
INTTREG Interrupt Control and Status Register ...... 132
IPC0 (Interrupt Priority Control 0) ............................. 114
IPC1 (Interrupt Priority Control 1) ............................. 115
IPC10 (Interrupt Priority Control 10) ......................... 124
IPC11 (Interrupt Priority Control 11) ......................... 125
IPC12 (Interrupt Priority Control 12) ......................... 126
IPC13 (Interrupt Priority Control 13) ......................... 127
IPC14 (Interrupt Priority Control 14) ......................... 128
IPC15 (Interrupt Priority Control 15) ......................... 129
IPC16 (Interrupt Priority Control 16) ......................... 130
IPC17 (Interrupt Priority Control 17) ......................... 131
IPC2 (Interrupt Priority Control 2) ............................. 116
IPC3 (Interrupt Priority Control 3) ............................. 117
IPC4 (Interrupt Priority Control 4) ............................. 118
IPC5 (Interrupt Priority Control 5) ............................. 119
IPC6 (Interrupt Priority Control 6) ............................. 120
DS70593D-page 355
dsPIC33FJXXXGPX06A/X08A/X10A
IPC7 (Interrupt Priority Control 7) ............................. 121
IPC8 (Interrupt Priority Control 8) ............................. 122
IPC9 (Interrupt Priority Control 9) ............................. 123
NVMCOM (Flash Memory Control) ....................... 79, 80
OCxCON (Output Compare x Control) ..................... 179
OSCCON (Oscillator Control) ................................... 148
OSCTUN (FRC Oscillator Tuning) ............................ 152
PLLFBD (PLL Feedback Divisor) .............................. 151
PMD1 (Peripheral Module Disable Control
Register 1) ........................................................ 157
PMD1 (Peripheral Module Disable
Control Register 1)............................................ 157
PMD2 (Peripheral Module Disable Control
Register 2) ........................................................ 159
PMD3 (Peripheral Module Disable Control
Register 3) ........................................................ 161
PMD3 (Peripheral Module Disable
Control Register 3)............................................ 161
RCON (Reset Control) ................................................ 84
RSCON (DCI Receive Slot Control).......................... 235
SPIxCON1 (SPIx Control 1) ...................................... 184
SPIxCON2 (SPIx Control 2) ...................................... 186
SPIxSTAT (SPIx Status and Control) ....................... 183
SR (CPU Status) ......................................................... 94
T1CON (Timer1 Control)........................................... 168
TSCON (DCI Transmit Slot Control) ......................... 235
TxCON (T2CON, T4CON, T6CON or
T8CON Control) ................................................ 172
TyCON (T3CON, T5CON, T7CON or
T9CON Control) ................................................ 173
UxMODE (UARTx Mode) .......................................... 197
UxSTA (UARTx Status and Control) ......................... 199
Reset
Clock Source Selection ............................................... 86
Special Function Register Reset States ..................... 87
Times .......................................................................... 86
Reset Sequence.................................................................. 89
Resets ................................................................................. 83
S
Serial Peripheral Interface (SPI) ....................................... 181
Software Simulator (MPLAB SIM)..................................... 269
Software Stack Pointer, Frame Pointer
CALLL Stack Frame.................................................... 67
Special Features of the CPU............................................. 251
SPI Module
SPI1 Register Map ...................................................... 54
SPI2 Register Map ...................................................... 54
Symbols Used in Opcode Descriptions............................. 260
System Control
Register Map............................................................... 66
T
Temperature and Voltage Specifications
AC ..................................................................... 282, 325
Timer1 ............................................................................... 167
Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ..................... 169
Timing Characteristics
CLKO and I/O ........................................................... 285
Timing Diagrams
10-bit A/D Conversion (CHPS<1:0> = 01, SIMSAM = 0,
ASAM = 0, SSRC<2:0> = 000) ......................... 317
10-bit A/D Conversion (CHPS<1:0> = 01, SIMSAM = 0,
ASAM = 1, SSRC<2:0> = 111,
SAMC<4:0> = 00001) ....................................... 319
DS70593D-page 356
12-bit A/D Conversion (ASAM = 0, SSRC = 000)..... 315
CAN I/O .................................................................... 311
DCI AC-Link Mode.................................................... 310
DCI Multi -Channel, I2S Modes................................. 308
External Clock........................................................... 283
I2Cx Bus Data (Master Mode) .................................. 304
I2Cx Bus Data (Slave Mode) .................................... 306
I2Cx Bus Start/Stop Bits (Master Mode)................... 304
I2Cx Bus Start/Stop Bits (Slave Mode)..................... 306
Input Capture (CAPx) ............................................... 290
OC/PWM................................................................... 291
Output Compare (OCx)............................................. 290
Reset, Watchdog Timer, Oscillator Start-up Timer
and Power-up Timer ......................................... 286
Timer1, 2, 3, 4, 5, 6, 7, 8, 9 External Clock .............. 288
Timing Requirements
ADC Conversion (10-bit mode)................................. 329
ADC Conversion (12-bit Mode)................................. 329
CLKO and I/O ........................................................... 285
DCI AC-Link Mode............................................ 310, 312
DCI Multi-Channel, I2S Modes.......................... 309, 312
External Clock........................................................... 283
Input Capture ............................................................ 290
SPIx Master Mode (CKE = 0) ................................... 326
SPIx Module Master Mode (CKE = 1) ...................... 326
SPIx Module Slave Mode (CKE = 0) ........................ 327
SPIx Module Slave Mode (CKE = 1) ........................ 327
Timing Specifications
10-bit A/D Conversion Requirements ....................... 319
12-bit A/D Conversion Requirements ....................... 316
CAN I/O Requirements ............................................. 311
I2Cx Bus Data Requirements (Master Mode)........... 305
I2Cx Bus Data Requirements (Slave Mode)............. 307
Output Compare Requirements................................ 290
PLL Clock ......................................................... 284, 325
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out
Reset Requirements......................................... 287
Simple OC/PWM Mode Requirements ..................... 291
Timer1 External Clock Requirements ....................... 288
Timer2, Timer4, Timer6 and Timer8 External
Clock Requirements ......................................... 289
Timer3, Timer5, Timer7 and Timer9 External
Clock Requirements ......................................... 289
U
UART Module
UART1 Register Map.................................................. 54
UART2 Register Map.................................................. 54
V
Voltage Regulator (On-Chip) ............................................ 256
W
Watchdog Timer (WDT)............................................ 251, 257
Programming Considerations ................................... 257
WWW Address ................................................................. 357
WWW, On-Line Support ..................................................... 16
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
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resources, user’s guides and hardware support
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representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
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Technical Support
Development Systems Information Line
Customers
should
contact
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customers. A listing of sales offices and locations is
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Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
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Microchip’s customer notification service helps keep
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To register, access the Microchip web site at
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registration instructions.
 2009-2012 Microchip Technology Inc.
DS70593D-page 357
dsPIC33FJXXXGPX06A/X08A/X10A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
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Please list the following information, and use this outline to provide us with your comments about this document.
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Device: dsPIC33FJXXXGPX06A/X08A/X10A
Literature Number: DS70593D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70593D-page 358
 2009-2012 Microchip Technology Inc.
dsPIC33FJXXXGPX06A/X08A/X10A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC 33 FJ 256 GP7 10 A T I / PT - XXX
Examples:
a)
Microchip Trademark
Architecture
dsPIC33FJ256GP710AI/PT:
General-purpose dsPIC33, 64 KB program
memory, 100-pin, Industrial temp.,
TQFP package.
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Revision Level
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Architecture:
33
=
16-bit Digital Signal Controller
Flash Memory Family:
FJ
=
Flash program memory, 3.3V
Product Group:
GP2
GP3
GP5
GP7
=
=
=
=
General purpose family
General purpose family
General purpose family
General purpose family
Pin Count:
06
08
10
=
=
=
64-pin
80-pin
100-pin
Temperature Range:
I
E
H
=
=
=
-40C to+85C(Industrial)
-40C to+125C(Extended)
-40C to+150C(High)
Package:
PT
PF
MR
=
=
=
10x10 or 12x12 mm TQFP (Thin Quad Flatpack)
14x14 mm TQFP (Thin Quad Flatpack)
9x9mm QFN (Plastic Quad Flatpack)
Pattern
Three-digit QTP, SQTP, Code or Special Requirements
(blank otherwise)
ES
= Engineering Sample
 2009-2012 Microchip Technology Inc.
DS70593D-page 359
dsPIC33FJXXXGPX06A/X08A/X10A
NOTES:
DS70593D-page 360
 2009-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-344-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2009-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70593D-page 361
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DS70593D-page 362
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11/29/11
 2009-2012 Microchip Technology Inc.