BAR1.../BAR61... Silicon PIN Diode • RF switch, RF attenuator for frequencies above 10 MHz • Low distortion faktor • Long-term stability of electrical characteristics • Pb-free (RoHS compliant) package • Qualified according AEC Q101 BAR14-1 BAR15-1 ! BAR16-1 ! BAR61 " ! ! , , , , , Type BAR14-1 BAR15-1 BAR16-1 BAR61 , , Package SOT23 SOT23 SOT23 SOT143 , , ! Configuration series common cathode common anode PI element LS(nH) 1.8 1.8 1.8 2 Marking L7s L8s L9s 61s Maximum Ratings at T A = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 100 V Forward current IF 140 mA Total power dissipation Ptot 250 mW Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 TS ≤ 65°C Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 340 K/W 1For calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAR1.../BAR61... Electrical Characteristics at T A = 25°C, unless otherwise specified Parameter Symbol Values min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 50 V - - 100 VR = 100 V - - 1000 - 1.05 1.25 Forward voltage VF V IF = 100 mA AC Characteristics Diode capacitance pF CT VR = 0 V, f = 100 MHz - 0.2 0.5 VR = 50 V, f = 1 MHz - 0.25 0.5 - 50 100 Zero bias conductance gP µS VR = 0 V, f = 100 MHz Forward resistance Ω rf IF = 0.01 mA, f = 100 MHz - 2600 4200 IF = 0.1 mA, f = 100 MHz 300 470 - IF = 1 mA, f = 100 MHz 35 55 85 IF = 10 mA, f = 100 MHz 5.5 8 12 τ rr 700 1000 - ns WI - 146 - µm Charge carrier life time IF = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω I-region width 2 2007-04-19 BAR1.../BAR61... Diode capacitance CT = ƒ (VR ) Forward resistance rf = ƒ (IF) f = Parameter f = 100MHz 1.0 CT BAR 14-1...16-1 EHD07067 10 4 rf pF BAR 14-1...16-1 EHD07066 Ω 10 3 10 2 0.5 f = 1 MHz 10 1 f = 100 MHz 0.0 0 10 20 30 40 V 10 0 10 -2 50 10 0 10 -1 10 1 mA 10 2 ΙF VR Forward current IF = ƒ (VF) Forward current IF = ƒ (TS ) TA = 25°C BAR14-1, BAR15-1, BAR16-1 10 2 EHD07065 160 mA mA 10 1 10 0 120 TA = -40 ˚C 25 ˚C 85 ˚C 150 ˚C IF ΙF BAR 14-1...16-1 100 80 60 10 -1 40 20 10 -2 0.0 0.5 1.0 V 0 0 1.5 15 30 45 60 75 90 105 120 °C 150 TS VF 3 2007-04-19 BAR1.../BAR61... Application circuit for attenuation networks with diode BAR61 50 k Ω 1 nF +12 V V Reg. 1 nF 1 nF 12 k Ω BC 238 1 kΩ 1 nF BAR 61 1 nF 1 kΩ 1 nF Output Input 1 nF 1 nF 5.6 k Ω 4.7 k Ω 1.8 k Ω 2.2 k Ω EHM07026 4 2007-04-19 Package SOT143 BAR1.../BAR61... 2 0.1 MAX. 10˚ MAX. 1 1 ±0.1 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 A 5 0...8˚ 0.2 M A 0.25 M B 1.7 0.08...0.1 1.3 ±0.1 3 2.4 ±0.15 4 B 10˚ MAX. 2.9 ±0.1 1.9 0.15 MIN. Package Outline Foot Print 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 Marking Layout (Example) RF s 56 Manufacturer Pin 1 2005, June Date code (YM) BFP181 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.6 8 4 Pin 1 3.15 1.15 5 2007-04-19 Package SOT23 BAR1.../BAR61... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 ±0.1 1 2.4 ±0.15 3 0.1 MAX. 10˚ MAX. B 1 ±0.1 10˚ MAX. 2.9 ±0.1 0.15 MIN. Package Outline A 5 0...8˚ 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 6 2007-04-19 BAR1.../BAR61... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2007-04-19