DS402ST DS402ST Rectifier Diode Replaces March 1998 version, DS4183-2.3 DS4183-3.0 January 2000 KEY PARAMETERS VRRM 1400V IF(AV) 505A IFSM 5600A APPLICATIONS ■ Rectification ■ Freewheel Diode ■ DC Motor Control ■ Power Supplies ■ Welding ■ Battery Chargers FEATURES ■ Double Side Cooling ■ High Surge Capability VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V DS402ST14 1400 DS402ST13 1300 DS402ST12 1200 DS402ST11 1100 DS402ST10 1000 DS402ST09 900 Lower voltage grades available. Conditions VRSM = VRRM + 100V Outline type code: T. See Package Details for further information. CURRENT RATINGS Symbol Parameter Conditions Max. Units Double Side Cooled IF(AV) Mean forward current Half wave resistive load, Tcase = 100oC 505 A IF(RMS) RMS value Tcase = 100oC 793 A Continuous (direct) forward current Tcase = 100oC 640 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current Half wave resistive load, Tcase = 100oC 365 A IF(RMS) RMS value Tcase = 100oC 573 A Continuous (direct) forward current Tcase = 100oC 390 A IF 1/7 DS402ST SURGE RATINGS Parameter Symbol IFSM I2t IFSM I2t Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current Conditions Max. Units 10ms half sine; Tcase = 175oC 4.5 kA VR = 50% VRRM - 1/4 sine 101 x 103 A2s 10ms half sine; Tcase = 175oC 5.6 kA VR = 0 155 x 103 A2s I2t for fusing THERMAL AND MECHANICAL DATA Conditions Min. Max. Units dc - 0.08 o Anode dc - 0.16 o Cathode dc - 0.16 o Double side - 0.02 o Single side - 0.04 o On-state (conducting) - 185 o Reverse (blocking) - 175 o Storage temperature range -55 200 o Clamping force 3.5 5.0 kN Min. Max. Units Parameter Symbol Double side cooled Rth(j-c) Thermal resistance - junction to case C/W C/W Single side cooled Rth(c-h) Tvj Tstg - Thermal resistance - case to heatsink Clamping force 4.5kN with mounting compound C/W C/W C/W C Virtual junction temperature C C CHARACTERISTICS Symbol Conditions VFM Forward voltage At 450A peak, Tcase = 25oC - 1.25 V IRRM Peak reverse current At VRRM, Tcase = 175oC - 15 mA VTO Threshold voltage At Tvj = 175˚C - 0.81 V Slope resistance At Tvj = 175˚C - 0.84 mΩ rT 2/7 Parameter DS402ST CURVES 2000 Instantaneous forward current IF - (A) Measured under pulse conditions 1500 Tj = 25˚C Tj = 175˚C 1000 500 0 0.50 1.00 1.50 2.00 Instantaneous forward voltage VF - (V) 2.50 Fig. 1 Maximum (limit) forward characteristics 3/7 DS402ST 1200 dc Half wave 1000 3 phase Mean power dissipation - (W) 800 6 phase 600 400 200 0 0 200 400 600 Mean forward current IF(AV) - (A) FIG 2 DISSIPATION CURVES Fig. 2 Dissipation curves 4/7 800 DS402ST I2t = Î2 x t 2 10 100 8 90 6 80 4 2 70 It 2 60 0 1 10 ms 1 2 3 5 10 20 I2t value - (A2s x 103) Peak half sine forward current - (kA) 12 50 50 Cycles at 50Hz Duration Fig. 3 Surge (non-repetitive) forward current vs time (with 50% VRRM, Tcase = 175˚C) Thermal impedance - (˚C/W) 1.0 Conduction Effective thermal resistance Junction to case ˚C/W Double side Single side d.c. 0.08 0.16 Halfwave 0.09 0.17 3 phase 120˚ 0.12 0.20 6 phase 60˚ - Anode side cooled 0.1 Double side cooled 0.01 0.001 0.001 0.01 0.1 Time - (s) 1 10 Fig. 4 Transient thermal impedance - junction to case - (˚C/W) 5/7 DS402ST PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes Ø3.6 x 2.0 deep (One in each electrode) Cathode Ø42 max 15.0 14.0 Ø19 nom Ø19 nom Anode Ø37.5 max Nominal weight: 50g Clamping force: 4.5kN ±10% Package outine type code: T ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors AN4506 Recommendations for clamping power semiconductors AN4839 Thyristor and diode measurement with a multi-meter AN4853 Use of V , r on-state characteristic AN5001 TO 6/7 T DS402ST POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4183-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7