NXP BGA2714 Mmic wideband amplifier Datasheet

BGA2714
MMIC wideband amplifier
Rev. 01 — 24 May 2007
Product data sheet
1. Product profile
1.1 General description
Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 plastic SMD package.
Table 1.
Typical performance
Tamb = 25 °C; measured on demo board; typical values.
f
VSUP
ISUP
Gp
NF
PL(1dB)
PL(sat)
IP3O
(MHz)
(V)
(mA)
(dB)
(dB)
(dBm)
(dBm)
(dBm)
250
3.0
4.58
20.7
2.4
−7.8
−2.4
4.3
950
3.0
4.58
20.4
2.2
−7.9
−3.4
2.1
2150
3.0
4.58
20.8
3.0
−9.0
−4.7
0.0
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
n
n
n
n
n
n
n
n
Internally matched to 50 Ω
Wide frequency range (2.7 GHz at 3 dB gain bandwidth)
Flat 21 dB gain (± 1 dB from DC up to 2500 MHz)
Very low current (4.6 mA) at low supply voltage of 3 V
Very good reverse isolation (> 50 dB up to 2 GHz)
Good linearity with low second order and third order products
Low noise (NF = 2.2 dB at 1 GHz)
Unconditionally stable (K > 5)
1.3 Applications
n LNB IF amplifiers
n General purpose low noise wideband amplifier for frequencies between
DC and 2.7 GHz
BGA2714
NXP Semiconductors
MMIC wideband amplifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
VSUP
2, 5
GND2
3
RF_OUT
4
GND1
6
RF_IN
Simplified outline
6
5
Symbol
1
4
6
1
2
3
4
3
2, 5
sym052
3. Ordering information
Table 3.
Ordering information
Type number
BGA2714
Package
Name
Description
Version
-
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking
Type number
Marking code
BGA2714
BA-
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VSUP
supply voltage
RF input AC coupled
ISUP
supply current
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
-
150
°C
Pdrive
drive power
-
−20
dBm
Tsp = 90 °C
BGA2714_1
Product data sheet
Min
Max
Unit
-
4
V
-
10
mA
-
200
mW
−65
+150
°C
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
2 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to Ptot = 200 mW; Tsp = 90 °C
solder point
Conditions
Typ
Unit
300
K/W
7. Characteristics
Table 7.
Characteristics
VSUP = 3 V; ISUP = 4.58 mA; Tamb = 25 °C; measured on demo board; unless otherwise specified.
Symbol Parameter
ISUP
supply current
Gp
power gain
RLin
RLout
ISL
NF
Conditions
input return loss
output return loss
isolation
noise figure
Typ
Max Unit
3.7
4.58
5.7
mA
f = 100 MHz
20
20.8
21
dB
f = 250 MHz
20
20.7
21
dB
f = 950 MHz
20
20.4
21
dB
f = 2150 MHz
20
20.8
22
dB
f = 2500 MHz
19
19.5
21
dB
f = 3000 MHz
16
16.8
18
dB
f = 250 MHz
11
13.9
-
dB
f = 950 MHz
7
8.9
-
dB
f = 2150 MHz
12
15.9
-
dB
f = 250 MHz
10
10.6
-
dB
f = 950 MHz
10
10.8
-
dB
f = 2150 MHz
8
9.8
-
dB
f = 250 MHz
55
58
-
dB
f = 950 MHz
55
59
-
dB
f = 2150 MHz
45
49
-
dB
f = 250 MHz
-
2.4
2.5
dB
f = 950 MHz
-
2.2
2.3
dB
f = 2150 MHz
-
3.0
3.2
dB
B−3dB
−3 dB bandwidth
3 dB below gain
at 1 GHz
-
2.7
-
GHz
K
Rollet stability factor
f = 250 MHz
25
30
-
f = 950 MHz
35
47
-
f = 2150 MHz
7
10
-
f = 250 MHz
−3
−2.4
-
dBm
f = 950 MHz
−4
−3.4
-
dBm
f = 2150 MHz
PL(sat)
PL(1dB)
saturated output power
−6
−4.7
-
dBm
output power at 1 dB gain compression f = 250 MHz
−8.5
−7.8
-
dBm
f = 950 MHz
−8.7
−7.9
-
dBm
f = 2150 MHz
−10
−9
-
dBm
BGA2714_1
Product data sheet
Min
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
3 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
Table 7.
Characteristics …continued
VSUP = 3 V; ISUP = 4.58 mA; Tamb = 25 °C; measured on demo board; unless otherwise specified.
Symbol Parameter
Conditions
Min
IP3I
f = 250 MHz
−17.4 −16.4 -
dBm
f = 950 MHz
−19.1 −18.3 -
dBm
f = 2150 MHz
−21.8 −20.8 -
dBm
f = 250 MHz
3.3
4.3
-
dBm
f = 950 MHz
1.3
2.1
-
dBm
f = 2150 MHz
−1.0
0
-
dBm
f1H = 250 MHz;
f2H = 500 MHz;
Pdrive = −40 dBm
−62
−64
-
dBm
f1H = 950 MHz;
f2H = 1900 MHz;
Pdrive = −40 dBm
−58
−60
-
dBm
f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = −40 dBm
−36
−38
-
dBc
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = −40 dBm
−31
−33
-
dBc
IP3O
PL(2H)
∆IM2
input third-order intercept point
output third-order intercept point
second harmonic output power
second-order intermodulation distance
Typ
Max Unit
8. Application information
Figure 1 shows a typical application circuit for the BGA2714 MMIC. The device is
internally matched to 50 Ω, and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the
MMIC.
The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to
the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes
as close as possible to the MMIC.
VS
C1
C2
RF input
VS
RF_IN
GND1
RF_OUT C3
RF output
GND2
001aaf761
Fig 1. Typical application circuit
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
4 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
8.1 Application examples
mixer
wideband
amplifier
from RF
circuit
LNA
to IF circuit
or demodulator
oscillator
wideband
amplifier
mixer
to IF circuit
or demodulator
antenna
oscillator
001aaf762
001aaf763
The MMIC is very suitable as IF amplifier in e.g.
LNB’s. The excellent wideband characteristics make
it an easy building block.
As second amplifier after an LNA, the MMIC offers
an easy matching, low noise solution.
Fig 2. Application as IF amplifier
Fig 3. Application as RF amplifier
8.2 Graphs
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
180°
0
0.2
1
0.5
0.2
100 MHz
2
5
10
3 GHz
0°
0
−5
−0.2
−135°
0.4
+5
−2
−0.5
−45°
−1
−90°
1.0
001aaf764
Tamb = 25 °C; ISUP = 4.58 mA; VSUP = 3 V; Pdrive = −40 dBm; Z0 = 50 Ω.
Fig 4. Input reflection coefficient (S11); typical values
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
5 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
1
3 GHz
0.5
2
5
0°
0
−5
−0.2
−135°
10
100 MHz
−2
−0.5
−45°
−1
1.0
−90°
001aaf765
Tamb = 25 °C; ISUP = 4.58 mA; VSUP = 3 V; Pdrive = −40 dBm; Z0 = 50 Ω.
Fig 5. Output reflection coefficient (S22); typical values
001aaf766
30
Gp
(dB)
Gp
(dB)
(1)
(2)
20
001aaf767
30
(1)
20
(3)
(2)
(3)
10
10
0
0
0
1000
2000
3000
0
1000
2000
f (MHz)
Tamb = 25 °C; Pdrive = −40 dBm; Z0 = 50 Ω.
VSUP = 3 V; Pdrive = −40 dBm; Z0 = 50 Ω.
(1) VSUP = 3.3 V; ISUP = 4.96 mA.
(1) Tamb = −40 °C; ISUP = 5.01 mA.
(2) VSUP = 3.0 V; ISUP = 4.58 mA.
(2) Tamb = +25 °C; ISUP = 4.58 mA.
(3) VSUP = 2.7 V; ISUP = 4.16 mA.
(3) Tamb = +85 °C; ISUP = 4.22 mA.
Fig 6. Insertion power gain as function of frequency;
typical values
Fig 7. Insertion power gain as function of frequency;
typical values
BGA2714_1
Product data sheet
3000
f (MHz)
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
6 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
001aaf768
0
001aaf769
102
ISL
(dB)
K
−20
10
−40
1
−60
10−1
−80
0
1000
2000
3000
0
1000
2000
3000
f (MHz)
Tamb = 25 °C; ISUP = 4.58 mA; VSUP = 3 V;
Pdrive = −40 dBm; Z0 = 50 Ω.
Tamb = 25 °C; ISUP = 4.58 mA; VSUP = 3 V;
Z0 = 50 Ω.
Fig 8. Isolation as function of frequency; typical
values
Fig 9. Rollet stability factor as function of frequency;
typical values
001aaf770
5
4000
f (MHz)
001aaf771
5
NF
(dB)
NF
(dB)
4
4
3
3
(1)
(1)
(2)
(2)
(3)
2
2
(3)
1
1
0
1000
2000
3000
0
1000
2000
f (MHz)
Tamb = 25 °C; Z0 = 50 Ω.
VSUP = 3 V; Z0 = 50 Ω.
(1) VSUP = 3.3 V; ISUP = 4.96 mA.
(1) Tamb = −40 °C; ISUP = 5.01 mA.
(2) VSUP = 3.0 V; ISUP = 4.58 mA.
(2) Tamb = +25 °C; ISUP = 4.58 mA.
(3) VSUP = 2.7 V; ISUP = 4.16 mA.
(3) Tamb = +85 °C; ISUP = 4.22 mA.
Fig 10. Noise figure as function of frequency
Fig 11. Noise figure as function of frequency
BGA2714_1
Product data sheet
3000
f (MHz)
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
7 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
001aaf772
0
PL
(dBm)
−10
PL
(dBm)
(1)
(2)
(3)
(1)
(2)
(3)
−10
−20
−30
−45
001aaf773
0
−20
−35
−25
−15
−30
−45
−35
−25
Pi (dBm)
Tamb = 25 °C; f = 250 MHz; Z0 = 50 Ω.
Tamb = 25 °C; f = 950 MHz; Z0 = 50 Ω.
(1) VSUP = 3.3 V.
(1) VSUP = 3.3 V.
(2) VSUP = 3.0 V.
(2) VSUP = 3.0 V.
(3) VSUP = 2.7 V.
(3) VSUP = 2.7 V.
Fig 12. Output power as function of input power at
250 MHz; typical values
001aaf774
0
PL
(dBm)
Fig 13. Output power as function of input power at
950 MHz; typical values
001aaf775
0
(1)
(2)
(3)
PL,
IMD3
(dBm)
(1)
(2)
(3)
−10
−15
Pi (dBm)
−30
PL
(1)
(2)
(3)
−20
−60
−30
−45
−90
−50
IMD3
−35
−25
−15
Pi (dBm)
−40
−30
−20
Pi (dBm)
Tamb = 25 °C; f = 2150 MHz; Z0 = 50 Ω.
Tamb = 25 °C; f1 = 250 MHz; f2 = 251 MHz;
Z0 = 50 Ω.
(1) VSUP = 3.3 V.
(2) VSUP = 3.0 V.
(1) VSUP = 3.3 V.
(3) VSUP = 2.7 V.
(2) VSUP = 3.0 V.
(3) VSUP = 2.7 V.
Fig 14. Output power as function of input power at
2150 MHz; typical values
Fig 15. Output power and third order intermodulation
as functions of input power around 250 MHz;
typical values
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
8 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
001aaf776
0
(1)
(2)
(3)
PL,
IMD3
(dBm)
(1)
(2)
(3)
PL,
IMD3
(dBm)
PL
−30
001aaf777
0
PL
−30
(1)
(2)
(3)
(1)
(2)
(3)
−60
−60
IMD3
IMD3
−90
−50
−40
−30
−90
−50
−20
−40
−30
Pi (dBm)
−20
Pi (dBm)
Tamb = 25 °C; f1 = 950 MHz; f2 = 951 MHz;
Z0 = 50 Ω.
Tamb = 25 °C; f1 = 2150 MHz; f2 = 2151 MHz;
Z0 = 50 Ω.
(1) VSUP = 3.3 V.
(1) VSUP = 3.3 V.
(2) VSUP = 3.0 V.
(2) VSUP = 3.0 V.
(3) VSUP = 2.7 V.
(3) VSUP = 2.7 V.
Fig 16. Output power and third order intermodulation
as functions of input power around 950 MHz;
typical values
Fig 17. Output power and third order intermodulation
as functions of input power around 2150 MHz;
typical values
001aaf778
0
∆IM2
(dBc)
−10
−20
−30
(1)
(2)
−40
−45
−40
−35
−30
−25
Pi (dBm)
Tamb = 25 °C; ISUP = 4.58 mA; VSUP = 3 V; Z0 = 50 Ω.
(1) f1 = 950 MHz; f2 = 951 MHz.
(2) f1 = 250 MHz; f2 = 251 MHz.
Fig 18. Second-order intermodulation distance as function of input power; typical values
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
9 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
8.3 Scattering parameters
Table 8.
Scattering parameters
ISUP = 4.58 mA; VSUP = 3 V; Pdrive = −40 dBm; Z0 = 50 Ω; Tamb = 25 °C; measured on demo board.
f (MHz)
S11
S21
S12
S22
K
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
100
0.155
33.5
10.88
−10.9
0.00364
−155.2
0.313
−14.2
11.2
200
0.170
26.5
10.84
−20.2
0.00183
−21.9
0.294
−19.2
22.3
400
0.280
−2.2
10.69
−43.8
0.00077
−25.5
0.396
−36.4
50.7
600
0.346
−30.4
10.54
−64.1
0.00057
122.0
0.293
−54.9
66.9
800
0.365
−62.7
10.46
−85.9
0.00111
115.1
0.291
−74.4
11.2
1000
0.360
−91.4
10.42
−106.3
0.00129
80.2
0.289
−94.8
29.7
1200
0.335
−124.9
10.72
−127.4
0.00091
−54.8
0.315
−119.5
40.7
1400
0.305
−156.3
10.90
−148.7
0.00118
−55.9
0.304
−140.2
31.9
1600
0.255
167.0
10.94
−172.9
0.00090
157.0
0.310
−167.3
43.0
1800
0.246
139.2
11.22
166.3
0.00155
7.1
0.343
172.3
23.9
2000
0.197
83.5
10.95
140.2
0.00276
133.2
0.335
129.3
14.1
2200
0.153
54.8
10.71
115.3
0.00453
63.4
0.327
101.6
9.0
2400
0.121
1.7
9.87
87.3
0.00700
31.8
0.310
66.2
6.5
2600
0.081
−24.9
9.09
63.3
0.00933
51.9
0.293
45.0
5.4
2800
0.066
−93.6
7.74
36.6
0.01119
24.8
0.266
5.8
5.4
3000
0.019
144.4
6.77
20.5
0.01228
14.1
0.203
−6.6
5.8
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
10 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
9. Test information
30 mm
IC1
30
mm
C2
C1
IN
OUT
IN
L1
OUT
C3
V+
V+
001aaf779
True size = 30 mm × 30 mm.
Fig 19. PCB layout and demo board with components
Table 9.
List of components used for the typical application
Component
Description
Value
Dimensions
C1, C2
multilayer ceramic chip capacitor
100 pF
0603
C3
multilayer ceramic chip capacitor
22 nF
0603
IC1
BGA2714 MMIC
L1
not used
BGA2714_1
Product data sheet
SOT363
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
11 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
10. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT363
JEDEC
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 20. Package outline SOT363
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
12 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
11. Abbreviations
Table 10.
Abbreviations
Acronym
Description
DC
Direct Current
IF
Intermediate Frequency
LNA
Low-Noise Amplifier
LNB
Low-Noise Block converter
PCB
Printed-Circuit Board
RF
Radio Frequency
12. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA2714_1
20070524
Product data sheet
-
-
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
13 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
BGA2714_1
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 01 — 24 May 2007
14 of 15
BGA2714
NXP Semiconductors
MMIC wideband amplifier
15. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
8.1
8.2
8.3
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Application examples . . . . . . . . . . . . . . . . . . . . 5
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Scattering parameters . . . . . . . . . . . . . . . . . . 10
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 May 2007
Document identifier: BGA2714_1