CY28346 Clock Synthesizer with Differential CPU Outputs Features • 5/6 copies of 3V66 clocks • SMBus support with read-back capabilities • Compliant with Intel® CK 408 Mobile Clock Synthesizer specifications • Spread Spectrum electromagnetic interference (EMI) reduction • 3.3V power supply • Dial-a-Frequency™ features • Three differential CPU clocks • Dial-a-dB™ features • Ten copies of PCI clocks Table 1. Frequency Table • 56-pin TSSOP and SSOP packages [1] S2 S1 S0 CPU (0:2) 3V66 66BUFF(0:2)/ 3V66(0:4) 66IN/3V66–5 PCI_FPCI REF USB/ DOT 1 0 0 66M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M 1 0 1 100M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M 1 1 0 200M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M 1 1 1 133M 66M 66IN 66-MHZ clock input 66IN/2 14.318M 48M 0 0 0 66M 66M 66M 66M 33 M 14.318M 48M 0 0 1 100M 66M 66M 66M 33 M 14.318M 48M 0 1 0 200M 66M 66M 66M 33 M 14.318M 48M 0 1 1 133M 66M 66M 66M 33 M 14.318M 48M M 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z M 0 1 TCLK/2 TCLK/4 TCLK/4 TCLK/4 TCLK/8 TCLK TCLK/2 Block Diagram Pin Configuration XIN XOUT REF CPUT(0:2) CPUC(0:2) PLL1 CPU_STP# IREF VSSIREF 3V66_0 S(0:2) VTT_PG# /2 PCI_STP# PCI(0:6) PCI_F(0:2) PLL2 48M USB 48M DOT PD# SDATA SCLK WD Logic I2C Logic 66B[0:2]/3V66[2:4] VDDA Power Up Logic 66IN/3V66-5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CY28346 3V66_1/VCH MULT0 VDD XIN XOUT VSS PCIF0 PCIF1 PCIF2 VDD VSS PCI0 PCI1 PCI2 PCI3 VDD VSS PCI4 PCI5 PCI6 VDD VSS 66B0/3V66_2 66B1/3V66_3 66B2/3V66_4 66IN/3V66_5 PD# VDDA VSSA VTT_PG# 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 REF S1 S0 CPU_STP# CPUT0 CPUC0 VDD CPUT1 CPUC1 VSS VDD CPUT2 CPUC2 MULT0 IREF VSSIREF S2 48MUSB 48MDOT VDD VSS 3V66_1/VCH PCI_STP# 3V66_0 VDD VSS SCLK SDATA Note: 1. TCLK is a test clock driven on the XTAL_IN input during test mode. M = driven to a level between 1.0V and 1.8V. If the S2 pin is at a M level during power-up, a 0 state will be latched into the device’s internal state register. ........................ Document #: 38-07331 Rev. *C Page 1 of 19 400 West Cesar Chavez, Austin, TX 78701 1+(512) 416-8500 1+(512) 416-9669 www.silabs.com CY28346 Pin Description Pin 2 3 Name XIN XOUT PWR VDD I/O I O 52, 51, 49, 48, 45, 44 10, 11, 12, 13, 16, 17, 18 5, 6, 7 CPUT(0:2), CPUC(0:2) PCI(0:6) VDD O Description Oscillator Buffer Input. Connect to a crystal or to an external clock. Oscillator Buffer Output. Connect to a crystal. Do not connect when an external clock is applied at XIN. Differential Host Output Clock Pairs. See Table 1 for frequency/functionality. VDDP O PCI Clock Outputs. Are synchronous to 66IN or 3V66 clock. See Table 1. PCIF (0:2) VDD O 56 42 REF IREF VDD VDD O I 28 VTT_PG# VDD I 39 38 33 35 48MUSB 48MDOT 3V66_0 3V66_1/VCH VDD48 VDD48 VDD VDD O O O O 25 PD# VDD I PU 43 MULT0 33MHz PCI Clocks. 2 copies of 66IN or 3V66 clocks that may be free running (not stopped when PCI_STP# is asserted LOW) or may be stoppable depending on the programming of SMBus register Byte3,Bits (3:5). Buffered Output Copy of the Device’s XIN Clock. Current Reference Programming Input for CPU Buffers. A resistor is connected between this pin and VSSIREF. Qualifying Input that Latches S(0:2) and MULT0. When this input is at a logic LOW, the S(0:2) and MULT0 are latched. Fixed 48 MHz USB Clock Outputs. Fixed 48 MHZ DOT Clock Outputs. 3.3V 66 MHz Fixed-frequency Clock. 3.3V Clock Selectable with SMBus Byte0,Bit5, When Byte5,Bit5. When Byte 0,Bit 5 is at a logic 1, then this pin is a 48M output clock. When Byte0,Bit5 is a logic 0, this is a 66M output clock (default). Power-down Mode Pin. A logic LOW level causes the device to enter a power-down state. All internal logic is turned off except for the SMBus logic. All output buffers are stopped. Programming Input Selection for CPU Clock Current Multiplier. 55, 54 29 S(0,1) SDATA I I 30 40 SCLK S2 I VDD 34 PCI_STP# VDD 53 CPU_STP# VDD 24 66IN/3V66_5 VDD 21, 22, 23 66B(0:2)/ 3V66(2:4) VDD VDD 1, 8, 14, 19, 32, 37, 46, 50 4, 9, 15, 20, 27, 31, 36, 47 41 26 VSS Frequency Select Inputs. See Table 1. Serial Data Input. Conforms to the SMBus specification of a Slave Receive/Transmit device. It is an input when receiving data. It is an open drain output when acknowledging or transmitting data. I Serial Clock Input. Conforms to the SMBus specification. I Frequency Select Input. See Table 1. This is a Tri-level input which is driven T HIGH, LOW or driven to a intermediate level. I PCI Clock Disable Input. When asserted LOW, PCI (0:6) clocks are synchroPU nously disabled in a LOW state. This pin does not effect PCIF (0:2) clocks’ outputs if they are programmed to be PCIF clocks via the device’s SMBus interface. I CPU Clock Disable Input. When asserted LOW, CPUT (0:2) clocks are PU synchronously disabled in a HIGH state and CPUC(0:2) clocks are synchronously disabled in a LOW state. I/O Input Connection for 66CLK(0:2) Output Clock Buffers if S2 = 1, or output clock for fixed 66-MHz clock if S2 = 0. See Table 1. O 3.3V Clock Outputs. These clocks are buffered copies of the 66IN clock or fixed at 66 MHz. See Table 1. PWR 3.3V Power Supply. PWR Common Ground. VSSIREF VDDA I PU I I – PWR Current Reference Programming Input for CPU Buffers. A resistor is connected between this pin and IREF. This pin should also be returned to device VSS. PWR Analog Power Input. Used for phase-locked loops (PLLs) and internal analog circuits. It is also specifically used to detect and determine when power is at an acceptable level to enable the device to operate. ........................Document #: 38-07331 Rev. *C Page 2 of 19 CY28346 Two-Wire SMBus Control Interface Serial Control Registers The two-wire control interface implements a Read/Write slave only interface according to SMBus specification. Following the acknowledge of the Address Byte, two additional bytes must be sent: The device will accept data written to the D2 address and data may read back from address D3. It will not respond to any other addresses, and previously set control registers are retained as long as power in maintained on the device. 1. “Command code” byte 2. “Byte count” byte. Although the data (bits) in the command is considered “don’t care,” it must be sent and will be acknowledged. After the Command Code and the Byte Count have been acknowledged, the sequence (Byte 0, Byte 1, and Byte 2) described below will be valid and acknowledged. Byte 0: CPU Clock Register[2,3] Bit @Pup 7 0 Pin# Spread Spectrum Enable. 0 = Spread Off, 1 = Spread On This is a Read and Write control bit. 6 0 CPU Clock Power-down Mode Select. 0 = Drive CPUT(0:2) to 4 or 6 IREF and drive CPUC(0:2) LOW when PD# is asserted LOW. 1 = Tri-state all CPU outputs. This is only applicable when PD# is LOW. It is not applicable to CPU_STP#. 5 0 4 Pin 53 44,45,48,49,5 CPU_STP#. Reflects the current value of the external CPU_STP# (pin 53) This bit is 1,52 Read-only. 3 Pin 34 10,11,12,13,16 Reflects the current value of the internal PCI_STP# function when read. Internally PCI_STP# ,17,18 is a logical AND function of the internal SMBus register bit and the external PCI_STP# pin. 35 Description 3V66_1/VCH Frequency Select, 0 = 66M selected, 1 = 48M selected This is a Read and Write control bit. 2 Pin 40 Frequency Select Bit 2. Reflects the value of SEL2 (pin 40). This bit is Read-only. 1 Pin 55 Frequency Select Bit 1. Reflects the value of SEL1 (pin 55). This bit is Read-only. 0 Pin 54 Frequency Select Bit 0. Reflects the value of SEL0 (pin 54). This bit is Read-only. Byte 1: CPU Clock Register Bit @Pup Pin# Description 7 Pin 43 43 MULT0 (Pin 43) Value. This bit is Read-only. 6 0 53 CPUT/C(0:2) Output Functionality Control When CPU_STP# is Asserted. 0 = Drive CPUT(0:2) to 4 or 6 IREF and drive CPUC(0:2) LOW when CPU_STP# asserted LOW. 1 = three-state all CPU outputs. This bit will override Byte0,Bit6 such that even if it is 0, when PD# goes LOW the CPU outputs will be three-stated. 5 0 44,45 CPU2 Functionality Control When CPU_STP# is Asserted LOW. 1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit. 4 0 48,49 CPU1 Functionality Control When CPU_STP# is Asserted LOW. 1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit. 3 0 51,52 CPUT0 Functionality Control When CPU_STP# is Asserted LOW. 1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW. This is a Read and Write control bit. 2 1 44,45 CPUT/C2 Output Control. 1 = enabled, 0 = disable HIGH and CPUC2 disables LOW. This is a Read and Write control bit. 1 1 48,49 CPUT/C1 Output Control. 1 = enabled, 0 = disable HIGH and CPUC1 disables LOW. This is a Read and Write control bit. 0 1 51,52 CPUT/C0 Output Control. 1 = enabled, 0 = disable HIGH and CPUC0 disables LOW. This is a Read and Write control bit. Notes: 2. PU = internal pull-up. PD = internal pull-down. T = tri-level logic input with valid logic voltages of LOW = < 0.8V, T = 1.0 – 1.8V and HIGH = > 2.0V. 3. The “Pin#” column lists the relevant pin number where applicable. The “@Pup” column gives the default state at power-up. ........................Document #: 38-07331 Rev. *C Page 3 of 19 CY28346 Byte 2: PCI Clock Control Register (all bits are Read and Write functional) Bit @Pup Pin# Description 7 0 53 REF Output Control. 0 = high strength, 1 = low strength. 6 1 18 PCI6 Output Control. 1 = enabled, 0 = forced LOW. 5 1 17 PCI5 Output Control. 1 = enabled, 0 = forced LOW. 4 1 16 PCI4 Output Control. 1 = enabled, 0 = forced LOW. 3 1 13 PCI3 Output Control. 1 = enabled, 0 = forced LOW. 2 1 12 PCI2 Output Control. 1 = enabled, 0 = forced LOW. 1 1 11 PCI1 Output Control. 1 = enabled, 0 = forced LOW. 0 1 10 PCI0 Output Control. 1 = enabled, 0 = forced LOW. Byte 3: PCI_F Clock and 48M Control Register (all bits are Read and Write functional) Bit @Pup Pin# Description 7 1 38 48MDOT Output Control. 1 = enabled, 0 = forced LOW. 6 1 39 48MUSB Output Control. 1 = enabled, 0 = forced LOW. 5 0 7 PCI_STP#, Control of PCI_F2. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW. 4 0 6 PCI_STP#, Control of PCI_F1. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW. 3 0 5 PCI_STP#, Control of PCI_F0. 0 = Free Running, 1 = Stopped when PCI_STP# is LOW. 2 1 7 PCI_F2 Output Control. 1 = running, 0 = forced LOW. 1 1 6 PCI_F1 Output Control. 1 = running, 0 = forced LOW. 0 1 5 PCI_F0 Output Control. 1 = running, 0 = forced LOW. Byte 4: DRCG Control Register (all bits are Read and Write functional) Bit @Pup 7 0 Pin# Description 6 0 5 1 33 3V66_0 Output Enabled. 1 = enabled, 0 = disable. 4 1 35 3V66_1/VCH Output Enable. 1 = enabled, 0 = disabled. 3 1 24 3V66_5 Output Enable. 1 = enabled, 0 = disabled. 2 1 23 66B2/3V66_4 Output Enabled. 1 = enabled, 0 = disabled. 1 1 22 66B1/3V66_3 Output Enabled. 1 = enabled, 0 = disabled. 0 1 21 66B0/3V66_2 Output Enabled. 1 = enabled, 0 = disabled. SS2 Spread Spectrum Control Bit (0 = down spread, 1 = center spread). Reserved. Set = 0. Byte 5: Clock Control Register (all bits are Read and Write functional) Bit @Pup 7 0 Pin# SS1 Spread Spectrum Control Bit. Description 6 1 SS0 Spread Spectrum Control Bit. 5 0 66IN to 66M delay Control MSB. 4 0 66IN to 66M delay Control LSB. 3 0 Reserved. Set = 0. 2 0 48MDOT Edge Rate Control. When set to 1, the edge is slowed by 15%. 1 0 Reserved. Set = 0. 0 0 USB edge rate control. When set to 1, the edge is slowed by 15%. ........................Document #: 38-07331 Rev. *C Page 4 of 19 CY28346 Byte 6: Silicon Signature Register[4] (all bits are Read-only) Bit @Pup 7 0 6 0 5 0 4 1 3 0 2 0 1 1 0 1 Pin# Description Revision = 0001 Vendor Code = 0011 Byte 7: Reserved Register Bit @Pup Pin# Description 7 0 Reserved. Set = 0. 6 0 Reserved. Set = 0. 5 0 Reserved. Set = 0. 4 0 Reserved. Set = 0. 3 0 Reserved. Set = 0. 2 0 Reserved. Set = 0. 1 0 Reserved. Set = 0. 0 0 Reserved. Set = 0. Byte 8: Dial-a-Frequency Control Register N Bit @Pup 7 0 Name 6 0 N6, MSB 5 0 N5 4 0 N4 3 0 N3 2 0 N2 1 0 N3 0 0 N0, LSB Description Reserved. Set = 0. These bits are for programming the PLL’s internal N register. This access allows the user to modify the CPU frequency at very high resolution (accuracy). All other synchronous clocks (clocks that are generated from the same PLL, such as PCI) remain at their existing ratios relative to the CPU clock. Byte 9: Dial-a-Frequency Control Register R Bit @Pup 7 0 Name 6 0 R5, MSB 5 0 R4 4 0 R3 3 0 R2 2 0 R1 1 0 R0 0 0 Description Reserved. Set = 0. DAF_ENB These bits are for programming the PLL’s internal R register. This access allows the user to modify the CPU frequency at very high resolution (accuracy). All other synchronous clocks (clocks that are generated from the same PLL, such as PCI) remain at their existing ratios relative to the CPU clock. R and N register mux selection. 0 = R and N values come from the ROM. 1 = data is loaded from DAF (SMBus) registers. Note: 4. When writing to this register, the device will acknowledge the Write operation, but the data itself will be ignored. ........................Document #: 38-07331 Rev. *C Page 5 of 19 CY28346 Dial-a-Frequency Features SMBus Dial-a-Frequency feature is available in this device via Byte8 and Byte9. P is a large-value PLL constant that depends on the frequency selection achieved through the hardware selectors (S1, S0). P value may be determined from Table 2. Table 2. P Value therefore causing the average energy at any one point in this band to decrease in value. This technique is achieved by modulating the clock away from its resting frequency by a certain percentage (which also determines the amount of EMI reduction). In this device, Spread Spectrum is enabled by setting specific register bits in the SMBus control bytes. Table 3 is a listing of the modes and percentages of Spread Spectrum modulation that this device incorporates. Table 3. Spread Spectrum S(1:0) P 00 32005333 01 48008000 10 96016000 11 64010667 Dial-a-dB Features SMBus Dial-a-dB feature is available in this device via Byte8 and Byte9. Spread Spectrum Clock Generation (SSCG) Spread Spectrum is a modulation technique used to minimizing EMI radiation generated by repetitive digital signals. A clock presents the greatest EMI energy at the center frequency it is generating. Spread Spectrum distributes this energy over a specific and controlled frequency bandwidth T PCB SS2 SS1 SS0 Spread Mode Spread% 0 0 0 Down +0.00, –0.25 0 0 1 Down +0.00, –0.50 0 1 0 Down +0.00, –0.75 0 1 1 Down +0.00, –1.00 1 0 0 Center +0.13, –0.13 1 0 1 Center +0.25, –0.25 1 1 0 Center +0.37, –0.37 1 1 1 Center +0.50, –1.50 Test and Measurement Set-up For Differential CPU Output Signals The following diagram shows lumped test load configurations for the differential Host Clock Outputs. M easurem ent P oint CPUT 2p F M U LT S E L T PCB CPUC M easurem ent P oint 2 pF Figure 1. 1.0V Test Load Termination TPCB VDD Measurement Point CPUT 2pF MULTSEL TPCB Measurement Point CPUC 2pF Figure 2. 0.7V Test Load Termination ........................Document #: 38-07331 Rev. *C Page 6 of 19 CY28346 Output under Test Probe Load Cap 3.3V signals tDC - - 3.3V 2.4V 1.5V 0.4V 0V Tr Tf Figure 3. For Single-ended Output Signals Buffer Characteristics 3. Series resistance in the buffer circuit—Ros (see Figure 4). Current Mode CPU Clock Buffer Characteristics 4. Current accuracy at given configuration into nominal test load for given configuration. The current mode output buffer detail and current reference circuit details are contained in the previous table of this data sheet. The following parameters are used to specify output buffer characteristics: Iout is selectable depending on implementation. The parameters above apply to all configurations. Vout is the voltage at the pin of the device. 1. Output impedance of the current mode buffer circuit—Ro (see Figure 4). 2. Minimum and maximum required voltage operation range of the circuit—Vop (see Figure 4). The various output current configurations are shown in the host swing select functions table. For all configurations, the deviation from the expected output current is ±7% as shown in the current accuracy table. VDD3 (3.3V +/- 5%) Slope ~ 1/R0 Ro Iout Ros 0V 1.2V Iout Vout = 1.2V max Vout Figure 4. Buffer Characteristics ........................Document #: 38-07331 Rev. *C Page 7 of 19 CY28346 Table 4. Host Clock (HCSL) Buffer Characteristics Characteristic Ro Ros Vout Min. 3000 (recommended) Max. N/A N/A 1.2V Table 5. CPU Clock Current Select Function Mult0 Board Target Trace/Term Z Reference R, Iref – Vdd (3*Rr) Output Current Voh @ Z 0 50 Rr = 221 1%, Iref = 5.00mA Ioh = 4*Iref 1.0V @ 50 1 50 Rr = 475 1%, Iref = 2.32mA Ioh = 6*Iref 0.7V @ 50 Table 6. Group Timing Relationship and Tolerances Description Offset Tolerance Conditions 3V66 to PCI 2.5 ns 1.0 ns 3V66 Leads PCI (unbuffered mode) 48MUSB to 48MDOT Skew 0.0 ns 1.0 ns 0 degrees phase shift 66B(0:2) to PCI offset 2.5 ns 1.0 ns 66B Leads PCI (buffered mode) USB and DOT 48M Phase Relationship 66B(0:2) to PCI Buffered Clock Skew The 48MUSB and 48MDOT clocks are in phase. It is understood that the difference in edge rate will introduce some inherent offset. When 3V66_1/VCH clock is configured for VCH (48-MHz) operation it is also in phase with the USB and DOT outputs. See Figure 5. Figure 7 shows the difference (skew) between the 3V33(0:5) outputs when the 66M clocks are connected to 66IN. This offset is described in the Group Timing Relationship and Tolerances section of this data sheet. The measurements were taken at 1.5V. 66IN to 66B(0:2) Buffered Prop Delay 3V66 to PCI Un-Buffered Clock Skew The 66IN to 66B(0:2) output delay is shown in Figure 6. Figure 8 shows the timing relationship between 3V66(0:5) and PCI(0:6) and PCI_F(0:2) when configured to run in the unbuffered mode. The Tpd is the prop delay from the input pin (66IN) to the output pins (66B[0:2]). The outputs’ variation of Tpd is described in the AC parameters section of this data sheet. The measurement taken at 1.5V. 48MUSB 48MDOT Figure 5. 48MUSB and 48MDOT Phase Relationship 66IN Tpd 66B(0:2) Figure 6. 66IN to 66B(0:2) Output Delay Figure 66B(0:2) 1.53.5ns PCI(0:6) PCIF(0:2) Figure 7. Buffer Mode – 33V66(0:1); 66BUF(0:2) Phase Relationship ........................Document #: 38-07331 Rev. *C Page 8 of 19 CY28346 Special Functions CPU_STP# Clarification PCI_F and IOAPIC Clock Outputs The CPU_STP# signal is an active LOW input used to synchronously stop and start the CPU output clocks while the rest of the clock generator continues to function. The PCIF clock outputs are intended to be used, if required, for systems IOAPIC clock functionality. Any two of the PCI_F clock outputs can be used as IOAPIC 33 Mhz clock outputs. They are 3.3V outputs will be divided down via a simple resistive voltage divider to meet specific system IOAPIC clock voltage requirements. In the event that these clocks are not required, they can be used as general PCI clocks or disabled via the assertion of the PCI_STP# pin. 3V66_1/VCH Clock Output The 3V66_1/VCH pin has a dual functionality that is selectable via SMBus. Configured as DRCG (66M), SMBus Byte0, Bit 5 = “0” The default condition for this pin is to power-up in a 66M operation. In 66M operation this output is SSCG-capable and when spreading is turned on, this clock will be modulated. Configured as VCH (48M), SMBus Byte0, Bit 5 = “1” In this mode, output is configured as a 48-Mhz non-spread spectrum output that is phase-aligned with other 48M outputs (USB and DOT) to within 1 ns pin-to-pin skew. The switching of 3V66_1/VCH into VCH mode occurs at system power-on. When the SMBus Bit 5 of Byte 0 is programmed from a “0” to a “1,” the 3V66_1/VCH output may glitch while transitioning to 48M output mode. 3V66(0:5) CPU_STP# – Assertion When CPU_STP# pin is asserted, all CPUT/C outputs that are set with the SMBus configuration to be stoppable via assertion of CPU_STP# will be stopped after being sampled by two falling CPUT/C clock edges. The final state of the stopped CPU signals is CPUT = HIGH and CPU0C = LOW. There is no change to the output drive current values during the stopped state. The CPUT is driven HIGH with a current value equal to (Mult 0 “select”) × (Iref), and the CPUC signal will not be driven. Due to external pull-down circuitry CPUC will be LOW during this stopped state. CPU_STP# Deassertion The deassertion of the CPU_STP# signal will cause all CPUT/C outputs that were stopped to resume normal operation in a synchronous manner (meaning that no short or stretched clock pulses will be produces when the clock resumes). The maximum latency from the deassertion to active outputs is no more than two CPUC clock cycles. Three-state Control of CPU Clocks Clarification During CPU_STP# and PD# modes, CPU clock outputs may be set to driven or undriven (tri-state) by setting the corresponding SMBus entry in Bit6 of Byte0 and Bit6 of Byte1. Tpci PCI(0:6) PCI_F(0:2) Figure 8. Unbuffered Mode – 3V66(0:5) to PCI (0:6) and PCI_F(0:2) Phase Relationship CPU_STP# CPUT CPUC CPUT CPUC Figure 9. CPU_STP# Assertion Waveform ........................Document #: 38-07331 Rev. *C Page 9 of 19 CY28346 PCI_STP# Assertion The PCI_STP# signal is an active LOW input used for synchronous stopping and starting the PCI outputs while the rest of the clock generator continues to function. The set-up time for capturing PCI_STP# going LOW is 10 ns (tsetup) (see Figure 14.) The PCI_F (0:2) clocks will not be affected by this pin if their control bits in the SMBus register are set to allow them to be free running. CPU_STP# CPUT CPUC CPUT CPUC Figure 10. CPU_STP# Deassertion Waveform Table 7. Cypress Clock Power Management Truth Table B0b6 B1b6 PD# CPU_STP# Stoppable CPUT 0 0 1 1 Running Running Running Running 0 0 1 0 Iref x6 Iref x6 Running Running 0 0 0 1 Iref x2 LOW Iref x2 LOW 0 0 0 0 Iref x2 LOW Iref x2 LOW 0 1 1 1 Running Running Running Running 0 1 1 0 Hi-Z Hi-Z Running Running 0 1 0 1 Hi-Z Hi-Z Hi-Z Hi-Z 0 1 0 0 Hi-Z Hi-Z Hi-Z Hi-Z 1 0 1 1 Running Running Running Running 1 0 1 0 Iref x6 Iref x6 Running Running 1 0 0 1 Hi-Z Hi-Z Hi-Z Hi-Z 1 0 0 0 Hi-Z Hi-Z Hi-Z Hi-Z 1 1 1 1 Running Running Running Running 1 1 1 0 Hi-Z Hi-Z Running Running 1 1 0 1 Hi-Z Hi-Z Hi-Z Hi-Z 1 1 0 0 Hi-Z Hi-Z Hi-Z Hi-Z ......................Document #: 38-07331 Rev. *C Page 10 of 19 Stoppable CPUC Non-Stop CPUT Non-Stop CPUC CY28346 PCI_STP# – Deassertion (transition from logic “0” to logic “1”) The deassertion of the PCI_STP# signal will cause all PCI(0:6) and stoppable PCI_F(0:2) clocks to resume running in a synchronous manner within two PCI clock periods after PCI_STP# transitions to a HIGH level. asynchronous function for powering up the system. When PD# is LOW, all clocks are driven to a LOW value and held there and the VCO and PLLs are also powered down. All clocks are shut down in a synchronous manner so has not to cause glitches while transitioning to the LOW “stopped” state. PD# – Assertion Note. The PCI STOP function is controlled by two inputs. One is the device PCI_STP# pin number 34 and the other is SMBus Byte 0,Bit 3. These two inputs to the function are logically AND’ed. If either the external pin or the internal SMBus register bit is set LOW, the stoppable PCI clocks will be stopped in a logic LOW state. Reading SMBus Byte 0,Bit 3 will return a 0 value if either of these control bits are set LOW (which indicates that the devices stoppable PCI clocks are not running). When PD# is sampled LOW by two consecutive rising edges of the CPUC clock, then on the next HIGH-to-LOW transition of PCIF, the PCIF clock is stopped LOW. On the next HIGH-to-LOW transition of 66Buff, the 66Buff clock is stopped LOW. From this time, each clock will stop LOW on its next HIGH-to-LOW transition, except the CPUT clock. The CPU clocks are held with the CPUT clock pin driven HIGH with a value of 2 × Iref, and CPUC undriven. After the last clock has stopped, the rest of the generator will be shut down. PD# (Power-down) Clarification PD# – Deassertion The PD# (power-down) pin is used to shut off all clocks prior to shutting off power to the device. PD# is an asynchronous active LOW input. This signal is synchronized internally to the device powering down the clock synthesizer. PD# is an The power-up latency between PD# rising to a valid logic ‘1’ level and the starting of all clocks is less than 3.0 ms. t setup PCI_STP# PCI_F(0:2) 33M PCI(0:6) 33M Figure 11. PCI_STP# Assertion Waveform t setup PCI_STP# PCI_F(0:2) PCI(0:6) Figure 12. PCI_STP# Deassertion Waveform ...................... Document #: 38-07331 Rev. *C Page 11 of 19 CY28346 66Buff[0..2] PCIF PW RDW N# CPU 133MHz CPU# 133MHz 3V66 66In USB 48MHz REF 14.318MHz Figure 13. Power-down Assertion Timing Waveforms Figure—Buffered Mode PWRDWN# CPUT(0:2) 133MHz CPUC(0:2) 133MHz PCI 33MHz 3V66 USB 48MHz REF 14.318MHz Figure 14. Power-down Assertion Timing Waveforms—Unbuffered Mode ......................Document #: 38-07331 Rev. *C Page 12 of 19 CY28346 <1.8mS 30uS min 400uS max 66Buff1 / GMCH 66Buff[0,2] PCIF / APIC 33MHz PCI 33MHz PW RDW N# CPU 133MHz CPU# 133MHz 3V66 66In USB 48MHz REF 14.318MHz Figure 15. Power-down Deassertion Timing Waveforms—Buffered Mode Table 8. PD# Functionality PD# DRCG 66CLK (0:2) PCI_F/PCI PCI 1 66M 66Input 66Input/2 66Input/2 48M 0 LOW LOW LOW LOW LOW ......................Document #: 38-07331 Rev. *C Page 13 of 19 USB/DOT CY28346 Absolute Maximum Ratings[5] Storage Temperature: ................................ –65C to + 150C Operating Temperature:.................................... 0C to +85C Input Voltage Relative to VSS:.............................. VSS – 0.3V Maximum Power Supply:................................................ 3.5V Input Voltage Relative to VDDQ or AVDD: ............. VDD + 0.3V Current Accuracy[6] Parameter Iout Conditions VDD = nominal (3.30V) Configuration M0 = 0 or 1 and Rr (see Table 1) Iout VDD = 3.30 ± 5% All combinations of M0 or 1 and Rr (see Table 1) Load Nominal test load for given configuration Nominal test load for given configuration Min. Max. –7% + 7% Inom Inom –12% + 12% Inom Inom DC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) Parameter Description Conditions IDD3.3V Dynamic Supply Current IPD3.3V Power-down Supply Current CIN COUT LPIN Pin Inductance CXTAL Crystal Pin Capacitance Min. All frequencies at maximum values Typ. [7] Max. Unit 280 mA Note 8 mA Input Pin Capacitance 5 pF Output Pin Capacitance 6 pF PD# asserted Measured from the XIN or XOUT pin to ground 30 36 7 nH 42 pF AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) 66 MHz Parameter 133 MHz 200 MHz Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes XIN Duty Cycle 47.5 52.5 47.5 52.5 47.5 52.5 47.5 52.5 % 9, 10, 11 TPERIOD XIN period 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 9, 12, 13, 10 Crystal TDC Description 100 MHz VHIGH XIN HIGH Voltage 0.7VDD VDD 0.7VDD VDD 0.7VDD VDD 0.7VDD VDD V VLOW XIN LOW Voltage 0 0.3VDD 0 0.3VDD 0 0.3VDD 0 0.3VDD V TR / TF XIN Rise and Fall Times 10.0 10.0 10.0 10.0 ns 14 TCCJ XIN Cycle to Cycle Jitter 500 500 500 500 ps 12, 15, 10 CPU at 0.7V Timing TDC CPUT and CPUC Duty Cycle TPERIOD CPUT and CPUC Period TSKEW Any CPU to CPU Clock Skew 45 55 45 55 45 55 45 55 % 15, 16, 19 14.85 15.3 9.85 10.2 7.35 7.65 4.85 5.1 ns 15, 16, 19 100 ps 12, 15, 16 100 100 100 Notes: 5. Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. 6. Inom refers to the expected current based on the configuration of the device. 7. All outputs loaded as per maximum capacitive load table. 8. Absolute value = ((Programmed CPU Iref) × (2)) + 10 mA. 9. This parameter is measured as an average over 1 s duration, with a crystal center frequency of 14.31818 MHz. 10. When Xin is driven from an external clock source. 11. This is required for the duty cycle on the REF clock out to be as specified. The device will operate reliably with input duty cycles up to 30/70 but the REF clock duty cycle will not be within data sheet specifications. 12. All outputs loaded as perTable 9 below. 13. Probes are placed on the pins and measurements are acquired at 1.5V for 3.3V signals (see test and measurement set-up section of this data sheet). 14. Measured between 0.2VDD and 0.7VDD. 15. This measurement is applicable with Spread ON or Spread OFF. 16. Measured at crossing point (Vx) or where subtraction of CLK–CLK# crosses 0V Measured from VOL = 0.175V to VOH = 0.525V. 17. Measured from VOL = 0.175V to VOH = 0.525V. 18. Determined as a fraction of 2*(Trise–Tfall)/ (Trise+Tfall). 19. Test load is Rta = 33.2, Rd = 49.9. ......................Document #: 38-07331 Rev. *C Page 14 of 19 CY28346 AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued) 66 MHz Parameter Description TCCJ CPU Cycle to Cycle Jitter TR/TF CPUT and CPUC Rise and Fall Times Min. Max. 100 MHz Min. 150 175 700 Max. 133 MHz Min. 150 175 700 Max. 200 MHz Min. 150 175 700 175 Max. Unit Notes 150 ps 15, 16, 19 700 ps 15, 17, 20 Rise/Fall Matching 20% 20% 20% 20% 17, 18, 19 DeltaTR Rise Time Variation 125 125 125 125 ps 17, 19 DeltaTF Fall Time Variation 125 125 125 125 ps 17, 19 VCROSS Crossing Point Voltage at 0.7V Swing CPU at 1.0V Timing CPUT and CPUC Duty TDC Cycle 280 430 280 430 280 430 280 430 mV 15, 19 45 55 45 55 45 55 45 55 % 15, 16 14.85 15.3 9.85 10.2 7.35 7.65 4.85 5.1 nS 15, 16 TPERIOD CPUT and CPUC Period TSKEW Any CPU to Any CPU Clock Skew 100 100 100 100 pS 12, 15, 16 TCCJ CPU Cycle to Cycle Jitter 150 150 150 150 pS 12, 16 Differential TR/TF CPUT and CPUC Rise and Fall Times 467 ps 15, 20 SE– DeltaSlew Absolute Single- ended Rise/Fall Waveform Symmetry 325 ps 21, 22 VCROSS Cross Point at 1.0V swing 510 760 510 760 510 760 510 760 mV 22 3V66 TDC 3V66 Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13 15.3 15.0 15.3 15.0 15.3 15.0 15.3 175 467 175 325 467 325 TPERIOD 3V66 Period 15.0 THIGH 3V66 HIGH Time 4.95 TLOW 3V66 LOW Time 4.55 TR/TF 3V66 Rise and Fall Times 0.5 TSKEW Unbuffered 3V66 to 3V66 Clock Skew 500 500 TSKEW Buffered 3V66 to 3V66 Clock Skew 250 TCCJ DRCG Cycle to Cycle Jitter 250 4.95 0.5 467 175 325 4.95 4.55 2.0 175 4.95 4.55 9, 12, 13 23 ns 24 2.0 ns 25 500 500 ps 12, 13 250 250 250 ps 12, 13 250 250 250 ps 12, 13 2.0 0.5 4.55 ns ns 2.0 0.5 Notes: 20. Measurement taken from differential waveform, from –0.35V to +0.35V. 21. Measurements taken from common mode waveforms, measure rise/fall time from 0.41 to 0.86V. Rise/fall time matching is defined as “the instantaneous difference between maximum CLK rise (fall) and minimum CLK# fall (rise) time or minimum CLK rise (fall) and maximum CLK# fall (rise) time.” This parameter is designed form waveform symmetry. 22. Measured in absolute voltage, i.e., single-ended measurement. 23. THIGH is measured at 2.4V for non-host outputs. 24. TLOW is measured at 0.4V for all outputs. 25. Probes are placed on the pins, and measurements are acquired between 0.4V and 2.4V for 3.3V signals (see test and measurement set-up section of this data sheet). ......................Document #: 38-07331 Rev. *C Page 15 of 19 CY28346 AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued) 66 MHz Parameter 66B TDC Description Min. Max. 100 MHz Min. Max. 133 MHz Min. Max. 200 MHz Min. Max. Unit Notes 66B(0:2) Duty Cycle 45 55 45 55 45 55 45 55 % 12, 13 TR/TF 66B(0:2) Rise and Fall Times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 ns 12, 25 TSKEW Any 66B to Any 66B Skew 175 ps 12, 13 TPD 66IN to 66B(0:2) Propagation Delay 4.5 ns 12, 13 TCCJ 66B(0:2) Cycle to Cycle Jitter 100 ps 12, 13, 26 55 % 12, 13 PCI TDC 175 2.5 4.5 175 2.5 100 2.5 100 100 TPERIOD PCI_F(0:2) PCI (0:6) Period 30.0 30.0 30.0 30 nS 9, 12, 13 THIGH PCI_F(0:2) PCI (0:6) HIGH Time 12.0 12.0 12.0 12.0 nS 23 TLOW PCI_F(0:2) PCI (0:6) LOW Time 12.0 12.0 12.0 12.0 nS 24 TR/TF PCI_F(0:2) PCI (0:6) Rise and Fall Times 0.5 2.0 nS 25 TSKEW Any PCI Clock to Any PCI Clock Skew 500 500 500 500 pS 12, 13 TCCJ PCI_F(0:2) PCI (0:6) Cycle to Cycle Jitter 250 250 250 250 ps 12, 13 55 % 12, 13 48MUSB Duty Cycle TPERIOD 48MUSB Period TR/TF 48MUSB Rise and Fall Times TCCJ 48MUSB Cycle to Cycle Jitter 48MDOT TDC 48MDOT Duty Cycle TPERIOD 48MDOT Period TR/TF 48MDOT Rise and Fall Times TCCJ 48MDOT Cycle to Cycle Jitter REF TDC REF Duty Cycle TPERIOD REF Period TR/TF REF Rise and Fall Times TCCJ REF Cycle to Cycle Jitter 45 55 0.5 45 55 2.5 45 2.0 45 4.5 PCI_F(0:2) PCI (0:6) Duty Cycle 48MUSB TDC 55 4.5 175 2.0 55 45 0.5 45 55 2.0 55 45 0.5 45 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 1.0 2.0 1.0 350 45 55 20.837 0.5 2.0 350 45 55 20.837 1.0 1.0 0.5 350 2.0 350 45 55 20.837 1.0 1.0 0.5 350 45 ns 12, 13 2.10 ns 12, 25 350 ps 9, 12, 13 55 % 12, 13 20.837 1.0 0.5 350 ns 12, 13 1.0 ns 12, 13 350 ps 12, 13 45 55 45 55 45 55 45 55 % 12, 13 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 12, 13 1.0 4.0 1.0 4.0 1.0 4.0 1.0 4.0 ns 12, 25 1000 ps 12, 13 1000 1000 1000 Note: 26. This figure is in addition to any jitter already present when the 66IN pin is being used as an input. Otherwise a 500-ps jitter figure is specified. ......................Document #: 38-07331 Rev. *C Page 16 of 19 CY28346 AC Parameters (VDD = VDDA = 3.3V ±5%, TA = 0°C to +70°C) (continued) 66 MHz Parameter Description 100 MHz 133 MHz 200 MHz Min. Max. Min. Max. Min. Max. Min. Max. Unit Notes TPZL/TPZH Output Enable Delay (All Outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 10 TPZL/TPZH Output disable delay (all outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 10 TSTABLE All Clock Stabilization from Power-up 3 ms 10 TSS Stopclock Set-up Time TSH Stopclock Hold Time TSU Oscillator Start-up Time 3 3 3 10.0 10.0 10.0 10.0 ns 27 0 0 0 0 ns 27 ms 28 X X X X VID (0:3), SEL (0,1) VTT_PWRGD# PWRGD 0.2-0.3mS Delay VDD Clock Gen Clock State Clock Outputs Clock VCO State 0 Wait for VTT_GD# State 1 Sample Sels State 2 State 3 Off On (Note A) On Off Figure 16. VTT_PWRGD# Timing Diagram29[29] Table 9. Maximum Lumped Capacitive Output Loads Clock Max. Load Units PCI Clocks 30 pF 3V66 (0,1) 30 pF 66B(0:2) 30 pF 48MUSB Clock 20 pF 48MDOT 10 pF REF Clock 50 pF Notes: 27. CPU_STP# and PCI _STP# set-up time with respect to any PCI_F clock to guarantee that the effected clock will stop or start at the next PCI_F clock’s rising edge 28. When crystal meets minimum 40 device series resistance specification. 29. Device is not affected, VTT_PWRGD# is ignored. ......................Document #: 38-07331 Rev. *C Page 17 of 19 VT S1 TP W = L RG ow D# CY28346 Delay 0.25mS S2 Sample Inputs (pins 54,55) Enable Outputs VDDA = 2.0V S0 S3 Power Off Normal Operation VDD3.3 = Off Figure 17. Clock Generator Power-up/Run State Diagram Ordering Information Part Number CY28346OC CY28346OCT CY28346ZC CY28346ZCT Lead-free CY28346OXC CY28346OXCT CY28346ZXC CY28346ZXCT Package Type 56-pin SSOP – Tube 56-pin SSOP – Tape and Reel 56-pin TSSOP – Tube 56-pin TSSOP – Tape and Reel Product Flow Commercial, 0 to 70C Commercial, 0 to 70C Commercial, 0 to 70C Commercial, 0 to 70C 56-pin SSOP – Tube 56-pin SSOP – Tape and Reel 56-pin TSSOP – Tube 56-pin TSSOP – Tape and Reel Commercial, 0 to 70C Commercial, 0 to 70C Commercial, 0 to 70C Commercial, 0 to 70C ......................Document #: 38-07331 Rev. *C Page 18 of 19 CY28346 Package Drawing and Dimensions 56-lead Shrunk Small Outline Package O56 *C 56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56 0.249[0.009] 28 1 DIMENSIONS IN MM[INCHES] MIN. MAX. REFERENCE JEDEC MO-153 7.950[0.313] 8.255[0.325] PACKAGE WEIGHT 0.42gms 5.994[0.236] 6.198[0.244] PART # Z5624 STANDARD PKG. ZZ5624 LEAD FREE PKG. 29 56 13.894[0.547] 14.097[0.555] 1.100[0.043] MAX. GAUGE PLANE 0.25[0.010] 0.20[0.008] 0.851[0.033] 0.950[0.037] 0.500[0.020] BSC 0.170[0.006] 0.279[0.011] 0.051[0.002] 0.152[0.006] 0°-8° 0.508[0.020] 0.762[0.030] 0.100[0.003] 0.200[0.008] SEATING PLANE The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages. ......................Document #: 38-07331 Rev. *C Page 19 of 19