ADDtek A705SFT-250 200ma ~ 300ma advanced current regulator Datasheet

A705
200mA ~ 300mA
ADVANCED CURRENT REGULATOR
www.addmtek.com
DESCRIPTION
FEATURES
The A705 is a low dropout current regulator rated
for 210mA, 230mA, 250mA, 270mA, and 290mA
constant sink current. The low quiescent current and low
dropout voltage are achieved by advanced Bi-CMOS
process.
„
„
„
„
„
„
„
„
„
Only bypass capacitor is required.
210/230/250/270/290mA constant sink current.
Output short / open circuit protection.
Low dropout voltage.
Low quiescent current.
Supply voltage range 2.7V ~ 12V.
2KV HBM ESD protection.
Advanced Bi-CMOS process.
SOT-89 and TO-252 package available.
TYPICAL APPLICATION CIRCUIT
APPLICATIONS
V LED+
„
Power LED Driver
„
LED Cap-Lamp
C BP
PACKAGE PIN OUT
VDD
VDD
V DD
VDD
OUT
GND
A705X
OUT
GND
OUT
C IN
GND
SOT-89
TO-252
(Top View)
ORDER INFORMATION
Output Current
200mA ~ 220mA
220mA ~ 240mA
240mA ~ 260mA
260mA ~ 280mA
280mA ~ 300mA
N
SOT-89
3-pin
A705NFT-210
A705NFT-230
A705NFT-250
A705NFT-270
A705NFT-290
S
TO-252
3-pin
A705SFT-210
A705SFT-230
A705SFT-250
A705SFT-270
A705SFT-290
Note: The letter ”F” is marked for Lead Free process, and letter “T” is marked for Tape & Reel.
Copyright © 2007 ADDtek Corp.
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A705
ABSOLUTE MAXIMUM RATINGS (Note)
-0.3V to 13.2V
-0.3V to 17V
150°C
-40°C to 150°C
260°C
Input Voltage, VDD
Output Voltage, VOUT
Maximum Junction Temperature, TJ
Storage Temperature Range
Lead Temperature (Soldering, 10 seconds)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.
BLOCK DIAGRAM
A705
OUT
Band-gap
Reference
VDD
Control
Circuit
GND
PIN DESCRIPTION
Pin Name
Pin Function
VDD
Power supply.
OUT
Output pins. Connected to load.
GND
Ground.
THERMAL RESISTANCE
Package
θJT (°C /W)
N
SOT-89
35
S
TO-252
7
Copyright © 2007 ADDtek Corp.
Note:
TJ = TC + (PD × θJT)
θJT: Thermal Resistance - Junction to Tab.
TC: Case (Tab) Temperature.
TJ: Junction Temperature.
PD: Power Consumption.
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RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Output Sink Current
Operating Free-air Temperature Range
Symbol
Min
VDD
IOUT
TA
2.7
Typ
-40
Max
Unit
12
260
+85
V
mA
°C
DC ELECTRICAL CHARACTERISTICS
VDD=3.7V, TA=25°C, No Load (Unless otherwise noted)
Parameter
Output Sink Current
Symbol
IOUT
Condition
VOUT=0.2V
Min
Typ
Max
A705P
200
210
220
A705Q
220
230
240
A705R
240
250
260
A705S
260
270
280
A705T
280
290
300
Unit
Apply
Pin
mA
OUT
Load Regulation
VOUT=0.2V to 3V
2
mA/V
Line Regulation
VDD= 3V to 12V,
VOUT=0.2V
2
mA/V
Output Dropout Voltage (Note)
VOUTL
120
mV
Supply Current Consumption
IDD
200
uA
VDD
Note: Output dropout voltage: 90% x IOUT @ VOUT=200mV
Copyright © 2007 ADDtek Corp.
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A705
APPLICATION INFORMATION
The Maximum Power Dissipation on Regulator:
PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ
VOUT(MAX) = the maximum voltage on output pin;
IOUT(NOM) = the nominal output current;
IQ = the quiescent current the regulator consumes at IOUT(MAX);
VIN(MAX) = the maximum input voltage.
Thermal Consideration:
The A705 has internal power and thermal limiting circuitry designed to protect the device under overload
conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load
conditions. The thermal protection circuit of A705 prevents the device from damage due to excessive power dissipation.
When the device temperature rises to approximately 150°C, the regulator will be turned off. When power consumption
is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252 package, at TA=70°C), additional heat sink
is required to control the junction temperature below 120°C.
The junction temperature is:
TJ = PD (θJT +θCS +θSA ) + TA
PD : Dissipated power.
θJT : T
 hermal resistance from the junction to the mounting tab of the package.
 hermal resistance through the interface between the IC and the surface on which it is mounted.
θCS : T
(typically, θCS < 1.0°C /W)
θSA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size
of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through-hole vias.
PCB θSA (°C /W)
2
PCB heat sink size (mm )
Copyright © 2007 ADDtek Corp.
59
500
45
1000
38
1500
4
33
2000
27
3000
24
4000
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A705
PACKAGE
Top Marking for SOT-89
X : Output Current Options
P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA
A705X
YWWVV
Y : Year Code
WW : Week Code
V : Vendor Code
3-Pin Surface Mount SOT-89
INCHES
A
C
D
L
B
K
N
E
M
F
J
G
H
MIN
TYP
MAX
MIN
TYP
MAX
A
0.173
-
0.181
4.39
-
4.59
B
0.090
-
0.102
2.28
-
2.59
C 0.055
-
0.063
1.39
-
1.60
D 0.015
-
0.017
0.38
-
0.43
E
0.084
-
0.090
2.13
-
2.28
F
0.016
-
0.019
0.33
-
0.48
G
0.059 BSC
1.49 BSC
H
0.118 BSC
2.99 BSC
J
0.018
-
0.022
0.45
-
0.55
K
0.155
-
0.167
3.94
-
4.24
L
0.067
-
0.072
1.70
-
1.82
M
0°
N 0.035
Copyright © 2007 ADDtek Corp.
5
MILLIMETERS
-
8°
0°
-
8°
-
0.047
0.89
-
1.19
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A705
Top Marking for TO-252
X : Output Current Options
P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA
A705X
YWWVV
LLLLL.L
Y : Year Code
WW : Week Code
V : Vendor Code
LLLLL.L : Lot Number
3-Pin Surface Mount TO-252
INCHES
MIN
TYP
MAX
MIN
TYP
MAX
0.086
-
0.094
2.18
-
2.39
A1 0.040
-
0.050
1.02
-
1.27
0.024
-
-
0.61
-
-
0.215
5.21
-
5.46
0.018
-
0.023
0.46
-
0.58
c1 0.018
-
0.023
0.46
-
0.58
D 0.210
-
0.220
5.33
-
5.59
E
-
0.265
6.35
-
6.73
A
E
b2
A1
c1
A
L2
SEATING PLAN
b
-
b2 0.205
D
L1
b
e
c
H
L
c
e1
Copyright © 2007 ADDtek Corp.
MILLIMETERS
6
0.250
e
0.090 BSC
2.29 BSC
e1
0.180 BSC
4.58 BSC
H 0.370
-
0.410
9.40
-
10.41
L
0.020
-
-
0.51
-
-
L1 0.025
-
0.040
0.64
-
1.02
L2 0.060
-
0.080
1.52
-
2.03
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IMPORTANT NOTICE
ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service
without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing
orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks
associated with the customer’s applications, the customer should provide adequate design and operating safeguards.
ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of
its products to the specifications applicable at the time of sale.
ADDtek Corp.
9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105
TEL: 2-25700299
FAX: 2-25700196
Copyright © 2007 ADDtek Corp.
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