Foshan BC637 Silicon npn transistor in a to-92 plastic package Datasheet

BC637
Rev.E Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-92 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92 Plastic Package.
特征
/ Features
高电流,低电压。
High current, Low voltage.
用途
/
Applications
用于音频、视频放大器驱动级。
Driver stages of audio or video amplifiers applications.
内部等效电路
引脚排列
12
/ Equivalent Circuit
/ Pinning
3
PIN1:Bas
PIN 2:Collector
放大及印章代码
/ hFE Classifications & Marking
hFE Classifications
Symbol
hFE Range
http://www.fsbrec.com
PIN 3:Emitter
16
100~250
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BC637
Rev.E Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Collector to Base Voltage
VCBO
60
V
Collector to Emitter Voltage
VCEO
60
V
Emitter to Base Voltage
VEBO
5.0
V
Collector Current - Continuous
IC
1.0
A
Peak Collector Current
ICM
1.5
A
Peak Base Current
IBM
200
mA
Total Power Dissipation
Ptot
830
mW
Tj
150
℃
Tstg
-55~150
℃
Junction Temperature
Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
符号
Symbol
测试条件
Test Conditions
最小值 典型值 最大值
Min
Typ
Max
单位
Unit
Collector Cut-Off Current
ICBO
VCB=30V
IE=0
0.1
μA
Emitter Cut-Off Current
IEBO
VEB=5.0V
IC=0
0.1
μA
hFE(1)
VCE=2.0V
IC=150mA
100
hFE(2)
VCE=2.0V
IC=5mA
40
hFE(3)
VCE=2.0V
IC=500mA
25
VCE(sat)
IC=500mA
IB=50mA
0.5
V
VBE
IC=500mA
VCE=2.0V
1.0
V
fT
VCE=5.0V
f=100MHz
IC=50mA
DC Current Gain
Collector to Emitter Saturation
Voltage
Base to Emitter Voltage
Transition Frequency
http://www.fsbrec.com
100
250
MHz
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BC637
Rev.E Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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BC637
Rev.E Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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BC637
Rev.E Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
BC637
16 ****
说明:
BR:  

为公司代码
BC637: 
为产品型号
16:  

为 hFE 分档代码
****:

为生产批号代码,随生产批号变化。
Note:
BR:
Company Code.
BC637:
Product Type.
16:  
****:
http://www.fsbrec.com

hFE Classifications Symbol
Lot No. Code,code change with Lot No.
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BC637
Rev.E Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
散件包装
Units 包装数量
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Dimension
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
包装尺寸
Inner Box 盒
(unit:mm3)
Outer Box 箱
1,000
10
10,000
5
50,000
135×190
237×172×102
560×245×195
1,000
10
10,000
10
100,000
135×190
237×172×102
560×245×375
Units/tape
只/纸带
Tape/Inner Box
纸带/盒
Rows/Inner Box
纸带层/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Inner Box 盒
3,000
1
120
10
30,000
328×230×42
/ AMMO
Package Type
封装形式
使用说明
Time:10±1 sec
/ BULK
TO-92
TO-92
Temp:270±5℃
/ Packaging SPEC.
Package Type
封装形式
编带包装
时间:10±1 sec.
Units 包装数量
Dimension
包装尺寸
(unit:mm3)
Outer Box 箱
小箱 480×346×235,
大箱 547×407×268
/ Notices
http://www.fsbrec.com
6/6
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