SIM Card EMI Filter Array with ESD Protection CSPEMI400 Features Product Description • The CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. ©2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI400/D CSPEMI400 Electrical Schematic Lead-free devices are specified by using a "+" character for the top side or ientation mark. Rev. 2 | Page 2 of 11 | www.onsemi.com CSPEMI400 PIN DESCRIPTIONS TYPE PIN DESCRIPTION A1 EMI Filter with ESD Protection for RST Signal C1 EMI Filter with ESD Protection for RST Signal A2 EMI Filter with ESD Protection for CLK Signal C2 EMI Filter with ESD Protection for CLK Signal B1 Device Ground B2 Device Ground A3 DAT EMI Filter with ESD Protection C3 DAT EMI Filter with ESD Protection ESD Channel A4 ESD Proection Channel - VCC Supply ESD Channel C4 ESD Proection Channel EMI Filter EMI Filter Device Ground EMI Filter Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish 2 Bumps Package Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 10 CSP CSPEMI400 AG CSPEMI400G AG Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 11 | www.onsemi.com CSPEMI400 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 11 | www.onsemi.com CSPEMI400 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS 1 MIN TYP MAX UNITS R1 Resistance of R1 80 100 120 Ω R2 Resistance of R2 38 47 56 Ω C Capacitance VIN = 2.5VDC, 1MHz, 30mV ac 16 20 24 pF Stand-off Voltage I = 10µA ILEAK Diode Leakage Current VBIAS = 3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA VSTANDOFF VESD 6.0 5.6 -1.5 6.8 -0.8 V 300 nA 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 fC1 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 20pF 77 MHz fC2 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 47Ω, C = 20pF 85 MHz VCL ±25 kV ±10 kV +12 -7 V V Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 11 | www.onsemi.com CSPEMI400 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance Rev. 2 | Page 6 of 11 | www.onsemi.com CSPEMI400 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) Rev. 2 | Page 7 of 11 | www.onsemi.com CSPEMI400 Application Information The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface. Note: One channel of the CSPEMI400 with a zener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly connected to the Ground plane. A small capacitor of about 1µF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. Rev. 2 | Page 8 of 11 | www.onsemi.com CSPEMI400 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 9 of 11 | www.onsemi.com 260°C CSPEMI400 CSP Mechanical Specifications The CSPEMI400 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. Controlling dimension: millimeters PACKAGE DIMENSIONS Package Custom CSP Bumps 10 A1 Millimeters Min Nom Max Min Nom SIDE VIEW C1 Inches Max A1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 B2 B1 B4 B3 Dim BOTTOM VIEW C 0.0110 A 1 2 3 4 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS C2 # per tape and reel 0.091 A2 B D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI400 Chip Scale Package 3500 pieces Rev. 2 | Page 10 of 11 | www.onsemi.com CSPEMI400 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CSPEMI400 1.96 X 1.33 X 0.606 POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W 2.08 X 1.45 X 0.71 8mm REEL DIAMETER QTY PER REEL P0 P1 178mm (7") 3500 4mm 4mm Figure 9. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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