AIC1731 300mA, Low Dropout Linear Regulator with Shutdown FEATURES DESCRIPTION Active Low Shutdown Control. Very Low Quiescent Current. Very Low Dropout Voltage of 470mV at 300mA Output Current (3.0V Output Version) 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V Output Voltage. Short Circuit and Thermal Protection. ±2% Output Tolerance. Miniature Package: SOT-23-5 AIC1731 is a 300mA low noise, low dropout linear regulator, and is housed in small SOT-23-5 package. The device is in the “ON” state when the SHDN pin is set to logic high level. An internal P-MOSFET pass transistor is used to achieve 470mV low dropout voltage at 300mA load current. It offers high precision output voltage of ±2%. The quality of low quiescent APPLICATIONS current and low dropout voltage makes this PDA DSC Notebook Pagers Personal Communication Equipment Cordless Telephones Portable Instrumentation Portable Consumer Equipment Battery Powered Systems device ideal for battery power applications. The internal reverse bias protection eliminates the requirement for a reverse voltage protection diode. The high ripple rejection and low noise of AIC1731 provide enhanced performance for critical applications. The noise bypass pin can be connected an external capacitor to reduce the output noise level. TYPICAL APPLICATION CIRCUIT VIN VIN CIN VOUT + + 1µF GND COUT 1µF BP SHDN V SHDN VOUT CBP AIC1731 0.1µF Low Noise Low Dropout Linear Regulator Analog Integrations Corporation Si-Soft Research Center DS-1731P-03 092304 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1731 ORDERING INFORMATION AIC1731-XXXXXX PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL BG: BAG PACKAGE TYPE V: SOT-23-5 C: COMMERCIAL P: LEAD FREE COMMERCIAL SOT-23-5 (CV)(PV) TOP VIEW 1: VIN 2: GND 3: SHDN 4: BP 5: VOUT 5 1 4 2 3 OUTPUT VOLTAGE 15: 1.5V 18: 1.8V 25: 2.5V 28: 2.8V 30: 3.0V 33: 3.3V (Of a unit of 0.1V within the voltage range from 1.5V to 3.3V, additional voltage versions for this product line may be available on demand with prior consultation with AIC.) Example: AIC1731-18CVTR 1.8V Version, in SOT-23-5 Package & Tape & Reel Packing Type AIC1731-18PVTR 1.8V Version, in SOT-23-5 Lead Free Package & Tape & Reel Packing Type • SOT-23-5 Marking Part No. AIC1731-15CV AIC1731-18CV AIC1731-25CV AIC1731-28CV AIC1731-30CV AIC1731-33CV Marking ED15 ED18 ED25 ED28 ED30 ED33 Part No. AIC1731-15PV AIC1731-18PV AIC1731-25PV AIC1731-28PV AIC1731-30PV AIC1731-33PV Marking ED15P ED18P ED25P ED28P ED30P ED33P 2 AIC1731 ABSOLUTE MAXIMUM RATINGS Supply Voltage .................………………………………..…………………....................12V Shutdown Terminal Voltage ..………………………………………………………..............12V Noise Bypass Terminal Voltage .…………………………….………………………..............5V Operating Temperature Range .………………………………………………….....-40ºC~85ºC Maximum Junction Temperature Storage Temperature Range 125°C ................…………………………………….........-65ºC~150ºC Lead Temperature (Soldering, 10 sec) 260°C Thermal Resistance (Junction to Case) SOT-23-5 …....………..………..………..130°C /W Thermal Resistance Junction to Ambient SOT-23-5 …....……..…………..………..220°C /W (Assume no ambient airflow, no heatsink) Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. TEST CIRCUIT Refer to TYPICAL APPLICATION CIRCUIT 3 AIC1731 ELECTRICAL CHARACTERISTICS (CIN=1µF, COUT=4.7µF, TJ=25°C, unless otherwise specified) (Note1) PARAMETER TEST CONDITIONS SYMBOL MIN. Quiescent Current IOUT = 0mA, VIN = 3.6~7V IQ Standby Current VIN = 3.6~7V, output OFF ISTBY GND Pin Current IOUT = 0.1~300mA IGND Continuous Output Current VIN = 5V IOUT Output Current Limit VIN = 5V, VOUT = 0V Output Voltage Tolerance VIN = 5V, no load Temperature Coefficient TYP. MAX. UNIT 35 50 µA 0.1 µA 50 µA 300 mA 30 IIL 300 VOUT -2 450 mA 2 % TC 50 150 ppm/ºC Line Regulation VIN = VOUT(TYP) + 1V to 7V ∆VLIR 3 10 mV Load Regulation VIN = VOUT + 1.2V (Vout≥ 2.0V) VIN = VOUT + 1.7V (Vout≤ 1.9V) IOUT = 0.1~300mA ∆VLOR 10 30 mV VDROP 470 570 800 1260 870 970 1200 1660 mV VREF 1.23 ∆n 0.46 RR 55 Dropout Voltage IL=300mA 3.0V≤VOUT≤3.3V 2.5V≤VOUT≤2.9V 2.0V≤VOUT≤2.4V 1.5V≤VOUT≤1.9V Noise Bypass Terminal Voltage Output Noise Ripple Rejection CBP = 0.1µF, f = 1KHz,VIN = 5V f = 1KHz, Ripple = 0.5VP-P, CBP = 0.1µF V µV Hz dB 4 AIC1731 ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT 0.1 µA SHUTDOWN TERMINAL SPECIFICATIONS Shutdown Pin Current I SHDN Shutdown Pin Voltage (ON) Output ON V SHDN (ON) Shutdown Pin Voltage (OFF) Output OFF V SHDN (OFF) CBP=0.1µF, COUT=1µF, Shutdown Exit Delay Time IOUT=30mA 1.6 V 0.6 V ∆t 300 µS TSD 155 ºC THERMAL PROTECTION Thermal Shutdown Temperature Note 1: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). TYPICAL PERFORMANCE CHARACTERISTICS 700 1.5V 50 600 3.3V 40 AIC1731-33 500 VDROP (mV) Quiescent Current (µA) 60 30 20 T=80°C T=50°C 400 300 200 10 T=20°C 100 T=-40°C 0 0 1 2 3 4 5 VIN (V) Fig. 1 Quiescent Current vs. VIN 6 7 0 0 50 100 150 200 250 300 ILOAD (mA) Fig. 2 VDROP vs. ILOAD 5 AIC1731 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 44.0 800 Short Circuit Current (µA) 43.5 Ground Current (µA) 43.0 42.5 3.3V 42.0 1.5V 41.5 41.0 40.5 40.0 VIN=6V TA=25°C 39.5 39.0 0 50 100 150 200 250 600 500 400 3.3V 300 1.5V 200 100 0 300 0 1 2 3 4 5 6 ILOAD (mA) Input Voltage (V) Fig. 3 Ground Current vs. ILOAD Fig. 4 Input Voltage vs. Short Circuit Current 7 46 45 AIC1731-33 Quiescent Current (µA) 44 Ground Current (µA) 700 300mA 43 150mA 42 41 30mA 40 1.5V 44 3.3V 42 40 38 VIN=5V 36 39 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature (°C) Temperature (°C) Fig. 5 Ground Current vs. Temperature Fig. 6 Quiescent Current vs Temperature 3.50 3.45 IOUT=30mA AIC1731-33 CBP=0.1µF Output Voltage (V) 3.40 COUT=1µF 3.35 VOUT 3.30 VSHDN 3.25 3.20 3.15 3.10 VIN=5V -40 -20 0 20 40 60 80 Temperature (°C) Fig. 9 Output Voltage vs. Temperature 100 Fig. 10 Shutdown Exit Time 6 AIC1731 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 640 700 AIC1731-33 620 500 VDROP (mV) T=50°C Current Limit (mA) 600 T=80°C 400 300 200 600 580 VIN=7V 560 VIN=6V 540 520 VIN=5V T=20°C 100 500 T=-40°C 0 0 50 100 150 200 250 300 480 -40 -20 0 20 40 60 COUT=4.7µF COUT=1µF VOUT IOUT=180mA IOUT=180mA IOUT=120mA IOUT=120mA Fig. 13 Load Transient Response Fig. 14 Load Transient Response Vin=VOUT+2V Vin=VOUT+2V Vin=VOUT+1V Vin=VOUT+1 VOUT=3.3V 100 CBP=0.1µF CBP=0.1µF VOUT 80 Temperature (°C) Fig. 12 Current Limit vs. Temperature ILOAD (mA) Fig. 11 VDROP vs. ILOAD CIN=1µF, COUT=1µF VOUT=3.3V CIN=1µF, COUT=4.7µF CBP=0.1µF CBP=0.1µF Iout=50mA Iout=50mA Fig. 15 Line Transient Response Fig. 16 Line Transient Response 7 AIC1731 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) VIN=Vout+2V VIN=Vout+2V Vin=Vout+1V VIN=Vout+1V VOUT=1.5V VOUT=1.5V CIN=1µF, COUT=1µF CIN=1µF, COUT=4.7µF CBP=0.1µF CBP=0.1µF Iout=50mA Iout=50mA Fig. 17 Line Transient Response Fig. 18 Line Transient Response BLOCK DIAGRAM VIN Current Limiting BP VREF 1.23V SHDN Power Shutdown - Error Amp. + VOUT Thermal Limiting GND PIN DESCRIPTIONS PIN 1 : VIN - Power supply input pin. Bypass with a 1µF capacitor to GND PIN 2 : GND - Ground pin. PIN 3 : SHDN - Active-Low shutdown input pin. PIN 4 : BP - Noise bypass pin. An external bypass capacitor connected to BP pin reduces noises at the output. PIN 5 : VOUT - Output pin. Sources up to 300 mA. 8 AIC1731 DETAILED DESCRIPTIONS OF TECHNICAL TERMS DROPOUT VOLTAGE (VDROP) The dropout voltage is defined as the difference between the input voltage and output voltage at which the output voltage drops 100mV. Below this value, the output voltage will fall as the input voltage reduces. It depends on the load current and junction temperature. LINE REGULATION Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage changes from VIN = VOUT + 1V to VIN = 7V and IOUT = 1mA. LOAD REGULATION Load regulation is the ability of the regulator to maintain a constant output voltage as the load current changes. A pulsed measurement with an input voltage set to VIN = VOUT + VDROP can minimize temperature effects. The load regulation is specified by the output current ranging from 0.1mA to 300mA. CURRENT LIMIT (IIL) AIC1731 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. THERMAL PROTECTION Thermal sensor protects device when the junction temperature exceeds TJ= +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. After the IC’s junction temperature cools by 15ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ= 150ºC, or damage may occur to the device. APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1µF with a 1uF aluminum electrolytic output capacitor is recommended. To avoid oscillation, ceramic capacitor is rejected. NOISE BYPASS CAPACITOR 0.1µF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. POWER DISSIPATION The maximum power dissipation of AIC1731 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: PMAX = (TJ − TA) (RθJB + RθBA) 9 AIC1731 mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature Where TJ-TA is the temperature difference between the die junction and the surrounding air, RθJB is the thermal resistance of the package, and RθBA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB PHYSICAL DIMENSIONS SOT-23-5 (unit: mm) D 0.25 E E1 c L θ L1 e e1 A2 A A1 b SYMBOL MIN MAX A 0.95 1.45 A1 0.05 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 e 0.95 BSC e1 1.90 BSC L 0.30 L1 θ 0.60 0.60 REF 0° 8° Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 10