BAS40/–04/–05/–06 Vishay Telefunken Surface Mount Schottky Barrier Diodes Features D Low Turn–on Voltage D Fast Switching D PN Junction Guard Ring for Transient and ESD Protection Applications 94 8550 Fast switches in thick and thin film circuits Absolute Maximum Ratings Tj = 25_C Parameter Test Conditions Repetitive peak reverse voltage =Working peak reverse voltage =DC Blocking voltage Peak forward surge current tp<1s, on fiberglass substrate Average forward current Forward current on fiberglass substrate Power dissipation on fiberglass substrate Junction and storage temperature range Symbol VRRM =VRWM =VR IFSM IFAV IF Pd Tj=Tstg Value 40 Unit V 600 100 200 200 –55...+150 mA mA mA mW °C Maximum Thermal Resistance Tj = 25_C Parameter Junction ambient Document Number 85506 Rev. 1, 01-Apr-99 Test Conditions on fiberglass substrate Symbol RthJA Value 625 Unit K/W www.vishay.de • FaxBack +1-408-970-5600 1 (4) BAS40/–04/–05/–06 Vishay Telefunken Electrical Characteristics Tj = 25_C Parameter Forward voltage g Reverse current Breakdown voltage Diode capacitance Reverse recovery time Test Conditions IF=1.0mA, tp<300ms IF=40mA, tp<300ms VR=30V, tp<300ms IR=10mA VR=0V, f=1MHz IF=IR=10mA to IR=1mA, RL=100W Symbol VF VF IR V(BR) CD trr Min Typ 0.02 Max 380 1000 0.2 40 4 5 5 Unit mV mV mA V pF ns Dimensions in mm 14384 Case: SOT23, molded plastic Polarity: see diagrams below Mounting position: any Approx. weight: 0.008 grams www.vishay.de • FaxBack +1-408-970-5600 2 (4) Document Number 85506 Rev. 1, 01-Apr-99 BAS40/–04/–05/–06 Vishay Telefunken top view 14385 top view 14387 BAS40–05, common cathode BAS40 top view top view 14388 BAS40–04, connected in series Document Number 85506 Rev. 1, 01-Apr-99 14386 BAS40–06, common anode www.vishay.de • FaxBack +1-408-970-5600 3 (4) BAS40/–04/–05/–06 Vishay Telefunken Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs ). The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA ) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 www.vishay.de • FaxBack +1-408-970-5600 4 (4) Document Number 85506 Rev. 1, 01-Apr-99