CYSTEKEC BTD1616AA3 General purpose npn epitaxial planar transistor Datasheet

Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 1/7
CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
BTD1616AA3
BVCEO
IC
RCESAT(max)
60V
1A
300mΩ
Features
• High breakdown voltage, BVCEO≥ 60V
• Large continuous collector current capability
• Low collector saturation voltage
• Pb-free and Halogen-free package
Symbol
Outline
BTD1616AA3
TO-92
B:Base
C:Collector
E:Emitter
E CB
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (pulse)
Base Current
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating Junction and Storage Temperature Range
Symbol
VCBO
VCEO
VEBO
IC
ICP
IB
PD
RθJA
Tj ; Tstg
Limits
120
60
7
1
2 (Note)
0.2
750
167
-55~+150
Unit
V
V
V
A
A
A
mW
°C/W
°C
Note : Pulse test, pulse width≤300μs, duty cycle≤2%
BTD1616AA3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 2/7
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VCE(sat)
*VBE(sat)
*VBE(on)
*hFE 1
*hFE 2
fT
Cob
ton
tstg
tf
Min.
120
60
7
600
200
120
100
-
Typ.
150
0.9
13
40
500
120
Max.
100
100
300
350
1.2
700
400
18
-
Unit
V
V
V
nA
nA
mV
mV
V
mV
MHz
pF
ns
Test Conditions
IC=50μA
IC=1mA
IE=50μA
VCB=120V
VEB=7V
IC=1A, IB=50mA
IC=1A, IB=20mA
IC=1A, IB=50mA
VCE=2V, IC=50mA
VCE=2V, IC=100mA
VCE=2V, IC=1A
VCE=2V, IC=100mA, f=100MHz
VCB=10V, IE=0A,f=1MHz
VCC=30V, IC=1A, IB1=-IB2=33mA,
RL=30Ω
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Ordering Information
Device
BTD1616AA3
BTD1616AA3
BTD1616AA3
Package
TO-92
( Pb-free and Halogen-free package)
TO-92
( Pb-free and Halogen-free package)
Shipping
Marking
2000 pcs / Tape & Box
D1616A
1000 pcs / Bag, 10 Bags/Box
D1616A
CYStek Product Specification
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 3/7
CYStech Electronics Corp.
Characteristic Curves
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
2000
700
Collector Current---IC(mA)
1600
Collector Current---IC(A)
IB=10mA
IB=8mA
1800
IB=6mA
1400
1200
IB=4mA
1000
800
600
IB=2mA
400
IB=2.5mA
600
IB=2mA
500
400
IB=1.5mA
300
IB=1mA
200
IB=500uA
100
200
IB=0
IB=0
0
0
0
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
0
6
Emitter Grounded Output Characteristics
1000
IB=500uA
VCE=5V
IB=400uA
100
80
IB=300uA
60
IB=200uA
Current Gain---HFE
Collector Current---IC(mA)
6
Current Gain vs Collector Current
140
120
1
2
3
4
5
Collector-to-Emitter Voltage---VCE(V)
40
VCE=2V
100
VCE=1V
IB=100uA
20
IB=0
0
10
0
1
2
3
4
5
6
1
Collector-to-Emitter Voltage---VCE(V)
10000
Saturation Voltage vs Collector Current
Saturation Voltage vs Collector Current
10000
10000
VCE(SAT)
Saturation Voltage---(mV)
Saturation Voltage---(mV)
10
100
1000
Collector Current---IC(mA)
1000
IC=100IB
IC=50IB
100
VBE(SAT)@IC=50IB
1000
IC=20IB
10
100
1
BTD1616AA3
10
100
1000
Collector Current---IC(mA)
10000
1
10
100
1000
Collector Current---IC(mA)
10000
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 4/7
Characteristic Curves(Cont.)
On Voltage vs Collector Current
Power Derating Curve
1000
On Voltage---(mV)
Power Dissipation---PD(mW)
800
VCE=2V
100
700
600
500
400
300
200
100
0
1
BTD1616AA3
10
100
1000
Collector Current---IC(mA)
10000
0
50
100
150
Ambient Temperature---TA(℃)
200
CYStek Product Specification
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 5/7
CYStech Electronics Corp.
TO-92 Taping Outline
H2
H2A H2A
H2
D2
A
L
H3
H4 H
L1
H1
D1
F1F2
T2
T
T1
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
BTD1616AA3
P1
P
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
W1
W
D
P2
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 6/7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTD1616AA3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C602A3
Issued Date : 2009.05.14
Revised Date :
Page No. : 7/7
TO-92 Dimension
α2
A
Marking:
B
1
2
3
D1616A
Date Code
α3
C
□□□□
D
H
I
G
α1
E
F
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD1616AA3
CYStek Product Specification
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