Rohm BD45342 Counter timer built-in cmos voltage detector ic package ssop5 is similar to sot-23-5 (jedec) Datasheet

Datasheet
Voltage Detector IC Series
Counter Timer Built-in
CMOS Voltage Detector IC
BD45xxx series BD46xxx series
●Key Specifications
„ Detection voltage:
●General Description
ROHM’s BD45xxx and BD46xxx series are highly
accurate, low current consumption Voltage Detector ICs.
Because the counter timer delay circuit is built into
these series, an external capacitor for the delay time
setting is unnecessary. The lineup was established with
low output types (Nch open drain and CMOS output)
and detection voltages range from 2.3V to 4.8V in
increments of 0.1V, so that the series may be selected
according the application at hand.
●Features
„ Counter Timer Built-in
„ No delay time setting external capacitor required
„ Ultra-low current consumption
„ Two output types (Nch open drain and CMOS output)
„ Package SSOP5 is similar to SOT-23-5 (JEDEC)
2.3V to 4.8V (Typ.)
0.1V steps
„ High accuracy detection voltage:
±1.0%
„ Ultra-low current consumption:
0.85µA (Typ.)
„ Operating temperature range:
-40°C to +105°C
„ Three internal, fixed delay time:
50ms
100ms
200ms
●Package
SSOP5
2.90mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that
require a reset.
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
BD45xxx
RST
Micro
controller
BD46xxx
RST
CL
Micro
controller
CL
(Noise-filtering
Capacitor)
(Noise-filtering
Capacitor)
GND
GND
(Open Drain Output Type)
BD45xxx series
(CMOS Output Type)
BD46xxx series
●Pin Descriptions
●Connection Diagram
SSOP5
VDD
VOUT
TOP VIEW
Lot. No
Marking
ER
SUB GND
PIN No.
Symbol
Function
1
ER
2
SUB
Substrate *
3
GND
GND
4
VOUT
Reset Output
5
VDD
Power Supply Voltage
Manual Reset
*Connect the substrate to GND.
○Product structure:Silicon monolithic integrated circuit
.www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed for protection against radioactive rays
1/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Ordering Information
B
D
x
Part
Number
x
x
Output Type
45 : Open Drain
46 : CMOS
x
x
Reset Voltage Value
23 : 2.3V
0.1V step
48 : 4.8V
x
-
Counter Timer
Package
Delay Time Settings G : SSOP5
5 : 50ms
1 : 100ms
2 : 200ms
T
R
Packaging and
forming specification
TR : Embossed tape
and reel
SSOP5
5
4
1
2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
0.05±0.05
1.1±0.05
S
+0.05
0.42 −0.04
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Lineup
Table 1. Open Drain Output Type
Counter Timer Delay Time Settings
50ms
Detection
Voltage Marking
T0
4.8V
T1
4.7V
T2
4.6V
T3
4.5V
T4
4.4V
T5
4.3V
T6
4.2V
T7
4.1V
T8
4.0V
T9
3.9V
TA
3.8V
TB
3.7V
TC
3.6V
TD
3.5V
TE
3.4V
TF
3.3V
TG
3.2V
TH
3.1V
TJ
3.0V
TK
2.9V
TL
2.8V
TM
2.7V
TN
2.6V
TP
2.5V
TQ
2.4V
TR
2.3V
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Part
Number
BD45485
BD45475
BD45465
BD45455
BD45445
BD45435
BD45425
BD45415
BD45405
BD45395
BD45385
BD45375
BD45365
BD45355
BD45345
BD45335
BD45325
BD45315
BD45305
BD45295
BD45285
BD45275
BD45265
BD45255
BD45245
BD45235
100ms
Marking
TS
TT
TU
TV
TW
TX
TY
TZ
U0
U1
U2
U3
U4
U5
U6
U7
U8
U9
UA
UB
UC
UD
UE
UF
UG
UH
2/13
Part
Number
BD45481
BD45471
BD45461
BD45451
BD45441
BD45431
BD45421
BD45411
BD45401
BD45391
BD45381
BD45371
BD45361
BD45351
BD45341
BD45331
BD45321
BD45311
BD45301
BD45291
BD45281
BD45271
BD45261
BD45251
BD45241
BD45231
200ms
Marking
UJ
UK
UL
UM
UN
UP
UQ
UR
US
UT
UU
UV
UW
UX
UY
UZ
V0
V1
V2
V3
V4
V5
V6
V7
V8
V9
Part
Number
BD45482
BD45472
BD45462
BD45452
BD45442
BD45432
BD45422
BD45412
BD45402
BD45392
BD45382
BD45372
BD45362
BD45352
BD45342
BD45332
BD45322
BD45312
BD45302
BD45292
BD45282
BD45272
BD45262
BD45252
BD45242
BD45232
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Lineup - continued
Table 2. CMOS Output Type
Counter Timer Delay Time Settings
50ms
Detection
Voltage Marking
VA
4.8V
VB
4.7V
VC
4.6V
VD
4.5V
VE
4.4V
VF
4.3V
VG
4.2V
VH
4.1V
VJ
4.0V
VK
3.9V
VL
3.8V
VM
3.7V
VN
3.6V
VP
3.5V
VQ
3.4V
VR
3.3V
VS
3.2V
VT
3.1V
VU
3.0V
VV
2.9V
VW
2.8V
VX
2.7V
VY
4.8V
VZ
4.7V
W0
4.6V
W1
4.5V
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Part
Number
BD46485
BD46475
BD46465
BD46455
BD46445
BD46435
BD46425
BD46415
BD46405
BD46395
BD46385
BD46375
BD46365
BD46355
BD46345
BD46335
BD46325
BD46315
BD46305
BD46295
BD46285
BD46275
BD46265
BD46255
BD46245
BD46235
100ms
Marking
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WJ
WK
WL
WM
WN
WP
WQ
WR
WS
WT
3/13
Part
Number
BD46481
BD46471
BD46461
BD46451
BD46441
BD46431
BD46421
BD46411
BD46401
BD46391
BD46381
BD46371
BD46361
BD46351
BD46341
BD46331
BD46321
BD46311
BD46301
BD46291
BD46281
BD46271
BD46261
BD46251
BD46241
BD46231
200ms
Marking
WU
WV
WW
WX
WY
WZ
X0
X1
X2
X3
X4
X5
X6
X7
X8
X9
XA
XB
XC
XD
XE
XF
XG
XH
XJ
XK
Part
Number
BD46482
BD46472
BD46462
BD46452
BD46442
BD46432
BD46422
BD46412
BD46402
BD46392
BD46382
BD46372
BD46362
BD46352
BD46342
BD46332
BD46322
BD46312
BD46302
BD46292
BD46282
BD46272
BD46262
BD46252
BD46242
BD46232
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
z Absolute maximum ratings
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
Output Current
ER pin Voltage
*1 *2
Power Dissipation
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
VOUT
IO
VCT
Pd
Topr
Tstg
Limits
-0.3 to +10
GND-0.3 to +10
GND-0.3 to VDD+0.3
60
GND-0.3 to VDD+0.3
540
-40 to +105
-55 to +125
Unit
V
V
mA
V
mW
°C
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Symbol
Limit
Min.
Typ.
Max.
VDET(T)
VDET(T)
VDET(T)
×0.99
×1.01
2.475
2.5
2.525
2.417
2.580
2.422
2.598
2.970
3.0
3.030
2.901
3.095
2.906
3.117
3.267
3.3
3.333
3.191
3.405
3.196
3.429
4.158
4.2
4.242
4.061
4.334
4.068
4.364
4.752
4.8
4.848
4.641
4.953
4.649
4.988
Condition
*1
VDD=HÆL, RL=470kΩ
Ta=+25°C
VDET=2.5V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=3.0V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Detection Voltage
VDET
Ta=+25°C
VDET=3.3V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=4.2V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Ta=+25°C
VDET=4.8V
Ta=-40°C to 85°C
Ta=85°C to 105°C
Detection Voltage
Temperature coefficient
VDET/
∆T
-40°C to +105°C
Hysteresis Voltage
∆VDET
VDD=LÆHÆL, RL=470kΩ
‘High’ Output
Delay time
BD45XX5, BD46XX5
CL=100pF,
tPLH
-
RL=100kΩ
BD45XX1, BD46XX1
*1, *2, *3
BD45XX2, BD46XX2
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V
*1
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V
Circuit Current
when ON
IDD1
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V
*1
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V
*1
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V
*1
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V
Circuit Current
when OFF
IDD2
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V
*1
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V
*1
±100
±360
VDET(T) VDET(T) VDET(T)
×0.03
×0.05
×0.08
45
50
55
90
100
110
180
200
220
0.70
2.10
0.70
2.85
0.75
2.25
0.75
3.00
0.80
2.40
0.80
3.15
0.75
2.25
0.75
4.28
0.80
2.40
0.80
4.50
0.85
2.55
0.85
4.73
Unit
V
ppm/°C
V
ms
µA
µA
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected between VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET(T)-0.5V)Æ(VDET(T)+0.5V)
*3 tPLH:VDD=Please set the rise up time between VDD=0ÆVDET to more than 100µs.
Attention: Please connect the GND when you don’t use ‘ER’
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
4/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued
Parameter
Operating Voltage Range
VOPL
‘High’ Output Voltage (Pch)
VOH
‘Low’Output Voltage (Nch)
VOL
Leak Current when OFF
ER Pin ‘H’ Voltage
ER Pin ‘L’ Voltage
ER Pin Input Current
Condition
Symbol
Ileak
VEH
VEL
IEL
VOL≤0.4V, RL=470kΩ, Ta=25 to 105°C
VOL≤0.4V, RL=470kΩ, Ta=-40 to 25°C
VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V)
VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V)
VDD=1.2V, ISINK = 0.45 mA
VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V)
*1
VDD=VDS=10V
*1
*1
Min.
0.95
1.20
VDD-0.5
VDD-0.5
2.0
-
Limit
Typ.
1
Max.
0.3
0.3
0.1
0.8
10
Unit
V
V
V
µA
V
V
µA
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)
RL :Pull-up resistor to be connected between VOUT and power supply.
CL :Capacitor to be connected between VOUT and GND.
*1 Guarantee is Ta=25°C.
Attention: Please connect the GND when you don’t use ‘ER’
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Block Diagrams
VDD
Oscillation
VOUT
Circuit Counter
Timer
Vref
GND
ER
Fig.1 BD45xxx Series
VDD
Oscillation
Circuit Counter
Timer
Vref
GND
VOUT
ER
Fig.2 BD46xxx Series
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
6/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
CIRCUIT CURRENT : IDD [μA]
2.0
【BD45281】
【BD45281G】
【BD46281】
1.5
1.0
0.5
0.0
1
2
3
4
5
6
7
8
9 10
【BD45281】
【 BD45281G】
【BD46281】
15
VD D =2.4V
10
5
VD D =1.2V
0
0.0
0.5
1.0
1.5
2.0
2.5
VDD SUPPLY VOLTAGE :VDD [V]
DRAIN-SOURCE VOLTAGE : VD S[V]
Fig.3 Circuit Current
Fig.4 “Low” Output Current
7
20
【 BD46281G】
【BD46281】
15
VD D =6.0V
10
VD D =4.8V
OUTPUT VOLTAGE: VOUT [V]
"HIGH" OUTPUT CURRENT : IOH [mA]
0
20
5
0
【BD45281】
【BD45421G】
6
【BD46281】
5
4
3
Ta=25℃
2
1
Ta=25℃
0
0
1
2
3
4
5
6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE : VD S[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
7/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Typical Performance Curves – continued
20
BD45421G 】
【
【BD45421】
【BD45281】
【BD46281G】
ER BIAS CURRENT : IER[μA]
OUTPUT VOLTAGE: VOUT [V]
20
【BD46281】
15
10
5
【BD46421】
15
10
5
0
0
0
1
2
3
4
5
6
7
8
0
9 10
1
2
Fig.7 ER Terminal Threshold Voltage
CIRCUIT CURRENT WHEN ON : IDD1 [μA]
DETECTION VOLTAGE: VDET[V]
BD 45421G 】
【
【BD45421】
【BD46421】
Low to hig h(V D ET + ΔV D ET )
4.6
4.2
3.8
H ig h to low(V D ET )
3.4
3.0 ~
-40
0
40
5
6
7
8
9
1.6
1.4
BD 45421G 】
【
【BD45421】
1.2
【BD46421】
1.0
0.8
0.6
0.4
0.2
0.0
- 40
80
- 20
0
20
40
60
80
T EM PER AT U R E : T a[℃ ]
T EM PER AT U R E : T a[℃ ]
Fig.9 Detection Voltage
Release Voltage
Fig.10 Circuit Current when ON
(VDET-0.2V)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
10
Fig.8 ER Terminal Input Current
5.8
5.0
4
ER VOLTAGE : VER [V]
ER VOLTAGE : VER[V]
5.4
3
8/13
100
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20
1.5
MINIMUM OPERATING VOLTAGE: VOPL[V]
CIRCUIT CURRENT WHEN OFF : I DD2 [μA]
●Typical Performance Curves – continued
【BD45421】
【BD45421G】
【BD46421】
【BD45421】
【BD46421】
1.0
0 .5
0 .0
0
20
40
60
80
- 40
100
0
20
40
60
80
100
TEM PERA TURE : Ta[ ℃ ]
TEMPERATURE : Ta[℃]
Fig.11 Circuit Current when OFF
Fig.12 Operating Limit Voltage
50
250
BD
4528□】G 】
【】【
【BD45282
BD46282
200
DELAY
TIME:: ttPLH
PHL[µs]
"LOW"“LOW”
DELAY
TIME
[μsec]
: tPLH
“HIGH”
DELAY TIME
: tPLH
[ms][msec]
"HIGH"
DELAY
TIME
- 20
BD 45282G
150
【BD45281】【BD46281
】
BD 45281G
100
50
BD 45285G
【BD45285】【BD46285
】
45281G tPH L 】
【 BD
【BD45281】
40
【BD46281】
30
20
10
0
0
-60 -40 -20
0
20
40
60
-60 -40 -20
80 100 120
0
20
40
60
80 100 120
TEM PER ATU R E : Ta[℃ ]
TEM PER ATU R E : Ta[℃ ]
Fig.13 Output Delay Time
“Low”Æ”High”
Fig.14 Output Delay Time
“High”Æ”Low”
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
9/13
TSZ02201-0R7R0G300010-1-2
18.Dec.2012 Rev.005
Datasheet
BD45xxx series BD46xxx series
●Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45xxx series uses an open drain output
type, it is necessary to connect either a pull-up resistor to VDD or another power supply if needed [The output “High” voltage
(VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
R1
R1
Q2
Vref
Vref
Reset
VOUT
Oscillation
R2
Oscillation
Circuit Counter
Timer
R2
Reset
Circuit Counter
Timer
Q1
VOUT
Q1
R3
R3
GND
GND
ER
ER
Fig.15 (BD45xxx Type Internal Block Diagram)
Fig.16 (BD46xxx Type Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
tPHL[µs]
Part Number
tPLH[ms]
BD45275G
50
18
BD46275G
50
18
VDD=2.2VÆ3.2V
VDD=3.2VÆ2.2V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveform
Example: The following shows the relationship between the input voltages VDD, the output voltage VOUT and ER terminal when
the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 12 and 13).
1
When the power supply is turned on, the output is unstable from
after over the operating limit voltage (VOPL) until tPHL. Therefore it is
possible that the reset signal is not outputted when the rise time of
VDD
⑦
VDD is faster than tPHL.
VOPL
2 When V
0V
DD is greater than VOPL but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
VOH
3 If V
tPLH
tPLH
DD exceeds the reset release voltage (VDET + ∆VDET), the
tPLH
VOUT
counter
timer start and VOUT switches from L to H.
tPHL
VOL
4 When more than the high level voltage is supplied to the ER
tPHL
terminal, VOUT comes to “L” after tPLH delay time. Therefore, a time
VEH
when ER terminal is “H” is necessary for 100µsec or more.
ER
5 When the ER terminal switches to Low, the counter timer starts
tPHL
to operate, a delay of tPLH occurs, and VOUT switches from “L” to “H”.
6 If V
DD drops below the detection voltage (VDET) when the power
① ②
③ ④⑤
⑥
supply is powered down or when there is a power supply fluctuation,
Fig.17 Timing Waveform
VOUT switches to L (with a delay of tPHL).
7 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not toggle with power
supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
These time changes by the application and use it, please verify and confirm using practical applications.
VDD
VDET+ΔVDET
VDET
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Datasheet
BD45xxx series BD46xxx series
●Circuit Applications
1) Examples of common power supply detection reset circuits.
VDD1
Application examples of BD45xxx series (Open Drain
output type) and BD46xxx series (CMOS output type)
are shown below.
VDD2
RL
BD45xxx
RST
Micro
controller
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD45xxx) with a load
resistance RL as shown Fig.18.
CL
(Noise-filtering
Capacitor)
GND
Fig.18 Open Drain Output Type
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BD46xxx) device or an open
drain output type (BD45xxx) device with a pull up
resistor between the output and VDD1.
VDD1
BD46xxx
RST
Micro
controller
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
CL
(Noise-filtering
Capacitor)
GND
Fig.19 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BD45xxx
BD45xxx
RST
Micro
controller
GND
Fig. 20
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD45xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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BD45xxx series BD46xxx series
3) Examples of the power supply with resistor dividers.
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current
that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
V1
R2
I1
VDD
BD45xxx
BD46xxx
R1
CIN
VOUT
CL
GND
Fig. 21
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
IDD
In-rush Current
0
VDD
VDET
Fig. 22 Current Consumption vs. Power Supply Voltage
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Datasheet
BD45xxx series BD46xxx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
be approximately
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of
about 1MΩ is assumed between the ER terminal and the GND terminal, 100kΩ connection between the ER terminal
and the VDD terminal would be recommended. If the leakage is assumed between the VOUT terminal and the GND
terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.
11) External parameters
The recommended parameter range for RL is 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
12) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
13) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
14) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
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responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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