CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 D D D D D D D D D EN, M, OR SM PACKAGE (TOP VIEW) BiCMOS Technology With Low Quiescent Power Buffered Inputs Inverted Outputs Input/Output Isolation From VCC Controlled Output Edge Rates 64-mA Output Sink Current Output Voltage Swing Limited to 3.7 V SCR Latch-Up-Resistant BiCMOS Process and Circuit Design Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (EN) DIP LEBA OEBA A1 A2 A3 A4 A5 A6 A7 A8 CEAB GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CEBA B1 B2 B3 B4 B5 B6 B7 B8 LEAB OEAB description The CD74FCT543 is an octal register/transceiver with 3-state outputs that uses a small-geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA. This device contains two sets of eight D-type latches with separate input and output controls for each set. For data flow from A to B, for example, the A-to-B enable (CEAB) input must be low to enter data from A1 to A8 or to take data from B1 to B8. When CEAB is low, a low signal on the A-to-B latch enable (LEAB) input makes the A-to-B latches transparent; a subsequent low-to-high transition of the LEAB signal puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB and OEAB both low, the B output buffers are active and reflect the data present at the output of the A latches. Control of data from B to A is similar, but uses the CEBA, LEBA, and OEBA inputs. The CD74FCT543 contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB or LEBA) and output-enable (OEAB or OEBA) inputs are provided for each register to permit independent control in either direction of data flow. The A-to-B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and LEAB is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB puts the A latches in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar but requires using the CEBA, LEBA, and OEBA inputs. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The CD74FCT543 is characterized for operation from 0°C to 70°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 FUNCTION TABLE† INPUTS OEAB A LATCH STATUS OUTPUT B X X X Storing Z X H X – Z L H L X Storing L L L L Transparent B0‡ L L L L H CEAB LEAB H X Transparent H † A-to-B data flow is shown; B-to-A flow control is the same except that it uses CEBA, LEBA, and OEBA. ‡ Output level before the indicated steady-state input conditions were established logic symbol§ 2 1EN3 OEBA 23 CEBA 1 1C5 LEBA 13 OEAB 11 CEAB 14 LEAB A1 A2 A3 A4 A5 A6 A7 A8 G1 2EN4 G2 2C6 3 4 3 1 5D 6D 1 4 21 5 20 6 19 7 18 8 17 9 16 10 15 § This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 22 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B1 B2 B3 B4 B5 B6 B7 B8 CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 logic diagram (positive logic) OEBA CEBA LEBA OEAB CEAB LEAB A1 2 23 1 13 11 14 C1 3 1D 22 B1 C1 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† DC supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V DC input clamp current, IIK (VI < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA DC output clamp current, IOK (VO < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA DC output sink current per output pin, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA DC output source current per output pin, IOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA Continuous current through VCC, ICC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 mA Continuous current through GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 mA Package thermal impedance, θJA (see Note 1): EN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W SM package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 recommended operating conditions (see Note 2) MIN MAX UNIT 4.75 5.25 V VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 IOL ∆t/∆v Low-level output current High-level input voltage 2 High-level output current Input transition rise or fall rate 0 V 0.8 V VCC VCC V –15 mA V 64 mA 10 ns/V TA Operating free-air temperature 0 70 °C NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C MIN MAX MIN UNIT –1.2 V VIK VOH II = –18 mA IOH = –15 mA 4.75 V VOL II IOL = 64 mA VI = VCC or GND 4.75 V 0.55 0.55 V 5.25 V ±0.1 ±1 mA IOZ IOS† VO = VCC or GND VI = VCC or GND, ICC VI = VCC or GND, One input at 3.4 V, Other inputs at VCC or GND ∆ICC‡ Ci Co 4.75 V –1.2 MAX 2.4 ±0.5 5.25 V VO = 0 IO = 0 5.25 V 2.4 V ±10 –60 –60 mA mA 5.25 V 8 80 mA 5.25 V 1.6 1.6 mA 10 10 pF 15 15 pF VI = VCC or GND VO = VCC or GND † Not more than one output should be tested at a time, and the duration of the test should not exceed 100 ms. ‡ This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC. timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) MIN tw Pulse duration LEAB or LEBA low A or B before LEAB or LEBA↑ tsu Setup time A or B before CEAB or CEBA↑ th 4 Hold time 9 Data high 3 Data low 3 Data high 3 Data low 3 A or B after LEAB or LEBA↑ 2 A or B after CEAB or CEBA↑ 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX UNIT ns ns ns CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 switching characteristics over recommended operating conditions (unless otherwise noted) (see Figure 1) PARAMETER tpd d ten tdis FROM (INPUT) TO (OUTPUT) TA = 25°C TYP MIN MAX UNIT A or B B or A 6.4 2.5 8.5 LEBA or LEAB A or B 9.4 2.5 12.5 LEBA or LEAB A or B 9 2 12 ns A or B 6.8 2 9 ns TYP MAX LEBA or LEAB ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C PARAMETER VOL(P) VOH(V) Quiet output, maximum dynamic VOL VIH(D) VIL(D) High-level dynamic input voltage MIN Quiet output, minimum dynamic VOH UNIT 1 V 0.5 V 2 Low-level dynamic input voltage V 0.8 V TYP UNIT operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 49 pF 5 CD74FCT543 BiCMOS OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCBS742 – JULY 2000 PARAMETER MEASUREMENT INFORMATION 7V CL = 50 pF (see Note A) 500 Ω From Output Under Test Test Point From Output Under Test Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 S1 Open 7V Open 7V tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω Open Drain LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 90% 1.5 V 10% 3V 1.5 V 10% 0 V 90% tr tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V 1.5 V Input th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V 1.5 V Input 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V V VOH – 0.3 V OH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr and tf = 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CD74FCT543EN OBSOLETE PDIP NT 24 TBD Call TI Call TI 0 to 70 CD74FCT543M OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 CD74FCT543M96 OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 CD74FCT543SM OBSOLETE SSOP DB 24 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 Samples MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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