AOSMD AO4836 Dual n-channel enhancement mode field effect transistor Datasheet

AO4836
Dual N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO4836 uses advanced trench technology to
provide excellent RDS(ON) and low gate charge. The
two MOSFETs make a compact and efficient switch
and synchronous rectifier combination for use in
buck converters. It is ESD protected. AO4836 is Pbfree (meets ROHS & Sony 259 specifications).
AO4836L is a Green Product ordering option.
AO4836 and AO4836L are electrically identical.
VDS (V) = 30V
ID = 7.2A
RDS(ON) < 24mΩ (VGS = 10V)
RDS(ON) < 40mΩ (VGS = 4.5V)
ESD rating: 1500V (HBM)
D2
D1
S2
G2
S1
G1
1
2
3
4
8
7
6
5
D2
D2
D1
D1
G1
S1
SOIC-8
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
TA=25°C
A
Current
ID
TA=70°C
Pulsed Drain Current
G2
B
IDM
TA=25°C
Power Dissipation
TA=70°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
TJ, TSTG
Symbol
Alpha & Omega Semiconductor, Ltd.
Maximum
30
±20
Units
V
V
7.2
6.1
A
30
2
1.44
-55 to 150
PD
t ≤ 10s
Steady-State
Steady-State
S2
RθJA
RθJL
Typ
55
92
37
W
°C
Max
62.5
110
50
Units
°C/W
°C/W
°C/W
AO4836
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID(ON)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Conditions
Min
ID=250µA, VGS=0V
VDS=24V, VGS=0V
30
VDS=0V, VGS=±20V
VDS=VGS ID=250µA
VGS=10V, VDS=5V
VGS=10V, ID=7.2A
1
20
TJ=125°C
Static Drain-Source On-Resistance
gFS
VSD
IS
VGS=4.5V, ID=4A
Forward Transconductance
VDS=5V, ID=7.2A
Diode Forward Voltage
IS=1A
Maximum Body-Diode Continuous Current
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge
Max
2
1
5
10
3
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=15V, ID=7.2A
VGS=10V, VDS=15V, RL=2.1Ω,
RGEN=3Ω
IF=7.2A, dI/dt=100A/µs
IF=7.2A, dI/dt=100A/µs
10
Units
V
TJ=55°C
RDS(ON)
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
Typ
µA
µA
V
A
20
29
30
18
0.77
24
35
40
522
110
75
2.1
630
11
5.3
1.9
4
4.7
4.9
16.2
3.5
15
7
7
10
22
7
nC
nC
nC
nC
ns
ns
ns
ns
15.7
7.9
20
10
ns
nC
1
3
3
mΩ
mΩ
S
V
A
pF
pF
pF
Ω
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA
curve provides a single pulse rating.
F. Rev 0: July 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO4836
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
5V
10V
20
4.5V
25
12
ID(A)
ID (A)
20
VDS=5V
16
4V
15
3.5V
10
5
8
125°C
4
VGS=3V
25°C
0
0
0
1
2
3
4
0
5
0.5
40
Normalized On-Resistance
RDS(ON) (mΩ)
1.5
2
2.5
3
3.5
4
4.5
150
175
1.6
35
VGS=4.5V
30
25
20
15
VGS=10V
1.5
VGS=10V
ID=7.2A
1.4
1.3
VGS=4.5V
ID=6A
1.2
1.1
1
0.9
0.8
10
0
5
10
15
0
20
25
50
75
100
125
Temperature ( °C)
Figure 4: On-Resistance vs. Junction
Temperature
ID (Amps)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
1.0E+01
70
ID=7.2A
60
1.0E+00
50
1.0E-01
IS Amps
RDS(ON) (mΩ)
1
VGS (Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
125°C
40
125°C
1.0E-02
25°C
1.0E-03
30
1.0E-04
25°C
20
1.0E-05
10
0.0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body diode characteristics
1.0
AO4836
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1000
10
800
Capacitance (pF)
VGS (Volts)
8
f=1MHz
VGS=0V
900
VDS=15V
ID=7.2A
6
4
Ciss
700
600
500
400
300
200
2
Coss
100
Crss
0
0
0
2
4
6
8
10
0
12
100
ID (Amps)
20
25
30
30
100µs
10µs
10ms
0.1s
1
15
TJ(Max)=150°C
TA=25°C
Power W
1ms
10
10
40
TJ(Max)=150°C
TA=25°C
RDS(ON)
limited
5
VDS (Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge characteristics
1s
20
10
10s
DC
0
0.001
0.1
0.1
1
10
100
VDS (Volts)
ZθJA Normalized Transient
Thermal Resistance
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
0.01
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
0.1
PD
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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